For Metallic, Siliceous, Or Calcareous Basework, Including Chemical Bleaching, Oxidation Or Reduction Patents (Class 134/2)
  • Patent number: 11850635
    Abstract: A substrate processing apparatus includes a support unit; a first nozzle for discharging a first rinse solution to a first area of the substrate; and a second nozzle for discharging a second rinse solution to a second area of the substrate, wherein the first nozzle discharges the first rinse solution to a first area during a first period so that the first area and the second area of the substrate are wetted by the first rinse solution, and some area of the substrate is not wetted by the first rinse solution, wherein the first nozzle discharges the first rinse solution to the first area and the second nozzle discharges the second rinse solution to the second area in a second period directly connected to the first period so that an entire upper surface of the substrate is wetted by the first rinse solution and the second rinse solution.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: December 26, 2023
    Assignee: Semes Co., Ltd.
    Inventors: Dong Hee Son, Ki Young Kwak
  • Patent number: 11795102
    Abstract: A coated glass article and of a system and method for forming a coated glass article are provided. The process includes applying a first coating precursor material to the first surface of the glass article and supporting the glass article via a gas bearing. The process includes heating the glass article and the coating precursor material to above a glass transition temperature of the glass article while the glass article is supported by the gas bearing such that during heating, a property of the first coating precursor material changes forming a coating layer on the first surface of the glass article from the first precursor material. The high temperature and/or non-contact coating formation may form a coating layer with one or more new physical properties, such as a deep diffusion layer within the glass, and may form highly consistent coatings on multiple sides of the glass.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: October 24, 2023
    Assignee: Corning Incorporated
    Inventors: Theresa Chang, Ming-Huang Huang, Linda Gaskill, Peter Joseph Lezzi, Kevin Lee Wasson
  • Patent number: 11781225
    Abstract: Methods for reducing scale deposition are provided. An exemplary method for reducing scale in an oilfield facility includes contacting a metallic surface with a production fluid including a film-forming surfactant selected from imidazolines, imidazolidines, amidoamines, isoxazolidines, fatty amines, ?,?-unsaturated aldehydes, salts thereof, and combinations thereof, the production fluid including the film-forming surfactant in a concentration of at least about 200 ppm.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: October 10, 2023
    Assignee: Saudi Arabian Oil Company
    Inventors: Tao Chen, Qiwei Wang
  • Patent number: 11746036
    Abstract: A method of recycling glass fiber-reinforced polymer composite materials that can provide improved quality recycled glass fiber is described. More particularly, the method comprises pyrolysis of glass fiber-reinforced polymer composite scrap and/or end-of-life material and the subsequent immersion of the pyrolyzed glass fibers in a molten salt bath, e.g., comprising molten potassium nitrate. Immersion in the molten salt bath can eliminate char from the pyrolyzed fibers, as well as removing residual inorganic materials. In addition, immersion in the molten salt bath can strengthen the glass fiber, which can result in the recovery or avoidance of tensile strength losses normally incurred through traditional char removal processes.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: September 5, 2023
    Assignee: University of Tennessee Research Foundation
    Inventor: Ryan S. Ginder
  • Patent number: 11740454
    Abstract: In one inventive concept, a method for etching an optic includes obtaining a microemulsion, where the microemulsion includes a continuous oil phase, a surfactant system comprising at least one surfactant, and water, submerging at least a portion of the optic in the microemulsion, and agitating by ultrasonication the microemulsion for etching the optic submerged therein.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: August 29, 2023
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Salmaan H. Baxamusa, John Adams, Paul Ehrmann, Ted Laurence, Marlon G. Menor, Kathleen I. Schaffers
  • Patent number: 11694914
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: July 4, 2023
    Assignee: Elemental Scientific, Inc.
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau A. Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Patent number: 11666878
    Abstract: An autoclave system comprises an autoclave vessel 210, for performing a leaching operation on sacrificial ceramic cores (not shown) and a storage vessel 220 for containing caustic leaching fluid 230. Interposed in a fluid flow path between the vessel 210 and the tank 220 is a heat exchange unit 240, comprising a body 250 containing a thermal exchange medium, in the form of water 260, and first and second thermal exchange conduits represented at 270 and 280. A thermal exchange medium inlet pipe 290a and a thermal exchange medium outlet pipe 290b are provided to the body so that the medium 260 can be replenished, preferably substantially continuously, to optimize thermal transfer efficiency.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: June 6, 2023
    Assignee: The Leeds and Bradford Boiler Company Limited
    Inventors: Howard Pickard, Kyle Pickles
  • Patent number: 11619447
    Abstract: In the disclosed solution sand to be cleaned is thermally cleaned by rotating the sand being cleaned in a large oven (1) by rotating the oven (1). Before cleaning, the sand may be pre-processed by crushing any lumps and cleaning the sand fraction by magnetic separation. Preprocessed sand to be cleaned and heat energy are fed (5) into the rotating oven. The oven (1) is set slightly inclined so that a second end of the oven (1) is lower than a first end. The inclination and rotating speed of the oven (1) as well as the feed amount of sand are adjusted, whereby the advancing speed of the sand may be adjusted, as well as the ratio of the sand being cleaned to the volume of the oven (1) kept as desired. The temperature of the oven (1) is monitored at the coldest area of the oven, which is substantially at the second end of the oven. The temperature of the oven (1) is adjusted by adjusting the amount of heat energy fed in.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: April 4, 2023
    Assignee: Finn Recycling Oy
    Inventors: Toni Wesin, Timo Kronqvist
  • Patent number: 11621175
    Abstract: A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an electric grid is utilized to remove the particles off the surface of the wafer.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: April 4, 2023
    Assignee: PulseForge Inc.
    Inventors: David Alex Rose, Kurt A. Schroder
  • Patent number: 11551935
    Abstract: A substrate processing method includes: holding a substrate having a processing target surface and an opposite surface which is opposite to the processing target surface; preheating a center portion of the opposite surface of the substrate; after the preheating, ejecting a sulfuric acid hydrogen peroxide mixture (SPM) to a peripheral edge portion of the processing target surface of the substrate; and after the ejecting, moving an ejection position of the SPM from the peripheral edge portion of the processing target surface to a center portion of the substrate.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: January 10, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Takashi Nakazawa, Kazuyoshi Shinohara
  • Patent number: 11518912
    Abstract: Smoothness of glass is improved. A polishing slurry (A) contains amorphous carbon and water, and a total amount of the amorphous carbon and the water is equal to or more than 90% of the whole polishing slurry in terms of mass ratio.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: December 6, 2022
    Assignee: AGC INC.
    Inventor: Tomohiro Shibuya
  • Patent number: 11478810
    Abstract: In a nozzle deposit removing device and a method of nozzle deposit removal, compressed air is supplied to an air supply hole of a negative pressure generating unit from an air supply source, and compressed air is released to outside via an other end of a release hole from the air supply hole, thereby generating a flow of negative pressure directed from a tapered section of a nozzle insertion member toward the release hole via a through-hole. Next, a tip section of the nozzle is inserted into the tapered section of the nozzle insertion member, thereby forming a gap between the tapered section communicating with the through-hole and the tip section of the nozzle.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: October 25, 2022
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Koji Oda
  • Patent number: 11476112
    Abstract: Described herein is a technique capable of acquiring, monitoring and recording the progress of the reaction between a substrate and a reactive gas contained in a process gas in a process chamber during the processing of the substrate. According to the technique, there is provided a substrate processing apparatus including: a process chamber accommodating a substrate; a process gas supply system configured to supply a process gas into the process chamber via a process gas supply pipe; an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; a first gas concentration sensor configured to detect a first concentration of a reactive gas contained in the process gas in the process gas supply pipe; and a second gas concentration sensor configured to detect a second concentration of the reactive gas contained in an exhaust gas in the exhaust pipe.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: October 18, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Akinori Tanaka, Hideto Tateno, Sadayoshi Horii
  • Patent number: 11427916
    Abstract: A surface treatment apparatus includes a treatment vessel including a treatment space in which a metal component is disposed, a spray nozzle that supplies mist of a non-chromate conversion treatment liquid to the treatment space, and a circulation device that collects the non-chromate conversion treatment liquid from the treatment space and supplies the non-chromate conversion treatment liquid to the spray nozzle.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: August 30, 2022
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Hiroaki Mikawa, Hiromitsu Nagayasu, Shigehiro Sugiyama, Takumi Sato, Kohei Kawasaki, Yusuke Takagi
  • Patent number: 11384437
    Abstract: A phosphoric acid-free etchant composition and a method of forming a wiring, the composition including about 40 wt % to about 60 wt % of an organic acid compound; about 6 wt % to about 12 wt % of a glycol compound; about 1 wt % to about 10 wt % of nitric acid, sulfuric acid, or hydrochloric acid; about 1 wt % to about 10 wt % of a nitrate salt compound; and water, all wt % being based on a total weight of the phosphoric acid-free etchant composition.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: July 12, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jong Hee Park, Jin Seock Kim, Bong Won Lee, Sang-woo Kim, Il-Ryong Park, Bong-Yeon Won, Dae-woo Lee
  • Patent number: 11349010
    Abstract: A method of manufacturing a Schottky barrier diode includes: forming a first well region over a substrate; forming a first dielectric layer over the first well region; patterning the first dielectric layer by reducing a first thickness of the first dielectric layer; removing the first dielectric layer to expose a surface of the first well region; and forming a conductive layer over the first well region to obtain a Schottky barrier interface. A Schottky barrier diode manufactured based on the above method is also provided.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: May 31, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Meng-Han Lin, Te-An Chen
  • Patent number: 11335567
    Abstract: There is provided an etching method, including: loading a substrate having a metallic film formed on the substrate into a processing container; and subsequently, oxidizing and etching the metallic film by setting an internal pressure of the processing container to a pressure higher than 2.40×104 Pa and supplying an oxidizing gas for oxidizing the metallic film and an etching gas comprising ?-diketone into the processing container.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: May 17, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Naoki Shindo, Ryo Kuwajima, Satoshi Toda
  • Patent number: 11282714
    Abstract: The etching method of the present invention includes the step of supplying a first mixed gas containing a ?-diketone-containing etching gas and a nitrogen oxide gas to a target having, on a surface, both a first metal film containing cobalt, iron, or manganese and a second metal film containing copper, thereby selectively etching the first metal film over the second metal film, or the step of supplying a second mixed gas containing a ?-diketone-containing etching gas and oxygen gas to the target, thereby selectively etching the second metal film over the first metal film.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: March 22, 2022
    Assignees: CENTRAL GLASS COMPANY, LIMITED, TOKYO ELECTRON LIMITED
    Inventors: Akifumi Yao, Kunihiro Yamauchi, Tatsuo Miyazaki, Jun Lin, Susumu Yamauchi, Kazuaki Nishimura
  • Patent number: 11247249
    Abstract: A method for removing oxide materials from a crack of a metallic workpiece comprises: infiltrating an alkali solution into the crack in a pressurized atmosphere or an ultrasonic environment; applying an energy to the crack to react the oxide materials with the alkali solution and form a resultant material; and rinsing the resultant material with an acid solution to remove the resultant material from the crack. The method is easier to penetrate into the inside of the cracks, in particular suitable for cleaning narrow and deep cracks.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: February 15, 2022
    Assignee: General Electric Company
    Inventors: Yibo Gao, Hong Zhou, Liming Zhang, Yong Liu, Yingna Wu, Jianping Wu
  • Patent number: 11230773
    Abstract: Molten salt electrolytes are described for use in electrochemical synthesis of hydrocarbons from carboxylic acids. The molten salt electrolyte can be used to synthesize a wide variety of hydrocarbons with and without functional groups that have a broad range of applications. The molten salt can be used to synthesize saturated hydrocarbons, diols, alkylated aromatic compounds, as well as other types of hydrocarbons. The molten salt electrolyte increases the selectivity, yield, the energy efficiency and Coulombic efficiency of the electrochemical conversion of carboxylic acids to hydrocarbons while reducing the cell potential required to perform the oxidation.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: January 25, 2022
    Assignee: ENLIGHTEN INNOVATIONS INC.
    Inventors: James Mosby, Sai Bhavaraju
  • Patent number: 11175587
    Abstract: Stripping solutions that may replace an etching resist ashing process are provided. The stripping solutions are useful for fabricating circuits and/or forming electrodes and/or packaging/bumping applications on semiconductor devices for semiconductor integrated circuits with good photoresist removal efficiency and with low silicon oxide etch rate and low metal etch rates. Methods for their use are similarly provided. The preferred stripping agents contain polar aprotic solvent, water, hydroxylamine, corrosion inhibitor, quaternary ammonium hydroxide and optional surfactant. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: November 16, 2021
    Assignee: VERSUM MATERIALS US, LLC
    Inventors: Jhih Kuei Ge, Yi-Chia Lee, Wen Dar Liu, Chi-Hsien Kuo
  • Patent number: 11142726
    Abstract: The present invention relates to a liquid composition soluble in water or other polar substance and its use for vehicle cleansing and care, in particular for all the treatments provided in the washing steps of vehicles. The composition comprises at least one active enzymatic component.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: October 12, 2021
    Assignee: FRA-BER S.R.L.
    Inventors: Franco Berton, Gabriele Berton
  • Patent number: 11145514
    Abstract: Provided are a removal liquid for removing an oxide of a Group III-V element, an oxidation prevention liquid for preventing the oxidation of an oxide of a Group III-V element or a treatment liquid for treating an oxide of a Group III-V element, each liquid including an acid and a mercapto compound; and a method using each of the same liquids. Further provided are a treatment liquid for treating a semiconductor substrate, including an acid and a mercapto compound, and a method for producing a semiconductor substrate product using the same.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: October 12, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Satomi Takahashi, Seongmu Bak, Atsushi Mizutani, Tadashi Inaba
  • Patent number: 11117292
    Abstract: Embodiments of the present disclosure include a rotational molding device. The rotational molding device comprises a frame, a vessel coupled to the frame and configured to be heated or cooled, and a mold coupled to the frame and configured to rotate about a first axis by a first rotation mechanism and configured to rotate about a second axis by a second rotation mechanism. The vessel includes a particle bed comprising a plurality of fluidized particles, the mold is configured to form a molded part, and the mold includes a cavity corresponding to a shape of the molded part.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: September 14, 2021
    Inventor: Dustin Eplee
  • Patent number: 11090881
    Abstract: A method of molding a component includes the steps of providing a plurality of fibers, applying the fibers with a low temperature sizing to form a plurality of sized fibers, forming a preform from the plurality of sized fibers, placing the preform in a mold, and de-sizing the preform by heating the mold to an initial temperature that is sufficient to break down the low temperature sizing to a gaseous phase. A molding apparatus is also disclosed.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: August 17, 2021
    Assignee: RAYTHEON TECHNOLOGIES CORPORATION
    Inventors: John D. Riehl, Charles R. Watson
  • Patent number: 11091843
    Abstract: Provided is an acid-pickling additive for a surface oxide scale of a stainless steel material, a preparation method thereof and an acid-pickling method. The acid-pickling additive consists of 1 to 10 parts by weight of an alcohol amine compound, 0.1 to 5 parts by weight of a metal complex ligand, 0 to 10 parts by weight of a nitrogen-containing organic cyclic compound, 0 to 3 parts by weight of an alcohol compound, 0 to 3 parts by weight of a plant extract, and 1 to 2 parts by weight of water. This acid-pickling additive can solve the problems of high energy consumption, environmental pollution, and high cost in the existing method for removing an oxide scale of a stainless steel.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: August 17, 2021
    Assignee: ADD New Technology Development (Shanxi) Co., LTD.
    Inventor: Wenjuan Li
  • Patent number: 11085010
    Abstract: A method of cleaning a cooling water system is disclosed. The method may include contacting a cooling tower fill with a composition that may include a surfactant and an additive selected from an oxidizing agent, an acid, and any combination thereof when the cooling water system is off-line. The method may include contacting a deposit in the cooling tower fill with the composition. The oxidizing agent may be hydrogen peroxide, sodium hypochlorite, chlorine dioxide, ozone, sodium hypobromite, sodium or potassium permanganate, or any combination thereof. The surfactant may include a C8-C10 alkyl polyglycoside and a C10-C18 alkyl polyglycoside.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: August 10, 2021
    Assignee: ECOLAB USA INC.
    Inventors: Lanhua Hu, Amit Gupta
  • Patent number: 11056343
    Abstract: Embodiments of the disclosed technology include patterning a graphene sheet for biosensor and electronic applications using lithographic patterning techniques. More specifically, the present disclosure is directed towards the method of patterning a graphene sheet with a hard mask metal layer. The hard mask metal layer may include an inert metal, which may protect the graphene sheet from being contaminated or damaged during the patterning process.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: July 6, 2021
    Assignee: Cardea Bio, Inc.
    Inventors: Deng Pan, Brett Goldsmith
  • Patent number: 11035044
    Abstract: Described herein is an etching solution suitable for both tungsten-containing metals and GST metals, which comprises: water; at least one phenolic derivative compound having at least two hydroxyl groups; at least one strong base selected from the group consisting of (i) a quaternary base; (ii) an organic amine; and (iii) a metal hydroxide; optionally an ammonium salt of an organic acid; and optionally a water-miscible solvent, wherein the pH of the etching solution is 10 or greater, and wherein the etching solution is substantially free of a peroxide oxidizer and a metal ion-containing oxidizer.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: June 15, 2021
    Assignee: Versum Materials US, LLC
    Inventors: Wen Dar Liu, Laisheng Sun, Yi-Chia Lee, Tianniu Chen, Gang Chris Han-Adebekun
  • Patent number: 11008706
    Abstract: [Problem] To provide a canvas cleaning device that can prevent re-adhesion of stains as much as possible and also efficiently clean the canvas. [Solution] The canvas cleaning device 100 is provided with a base part 11 capable of sliding along a rail part 1 that extends in a width direction of a canvas K1, a cone part 13 having a cylinder shape, which is attached to the base part 11, and extends straightly, a high pressure water spraying device 13a installed inside the cone part 13, an arm part 15 that is extended and installed on the downstream side from the base part 11 and a nozzle device 16 attached to the tip of the arm part 15, and in this structure, high pressure water is sprayed onto the canvas K1 from the high pressure water spraying device 13a inside the cone part 13.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: May 18, 2021
    Assignee: MAINTECH CO., LTD.
    Inventors: Hiroshi Sekiya, Tomohiko Nagatsuka, Kazuyuki Yusa
  • Patent number: 10988711
    Abstract: An aqueous cleaning composition, which may be suitable for use in cleaning hard surfaces, is described. The aqueous cleaning composition includes an ionic liquid solvent, an amino alcohol, and a substantial amount of water. The cleaning compositions may also include a disinfecting quaternary surfactant, a nonionic surfactant, such as an ethoxylated alcohol and/or alkyl polyglycoside, and/or a chelating agent, such as an aminopolycarboxylate chelating agent.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: April 27, 2021
    Assignee: S. C. Johnson & Son, Inc.
    Inventors: Art Daniels Sutton, Jr., Lisa Flugge-Berendes, Michael S. Haas
  • Patent number: 10983447
    Abstract: The present disclosure provides an exhaust system for discharging from semiconductor manufacturing equipment a hazardous gas. The exhaust system includes: a main exhaust pipe having a top surface and a bottom surface; a first branch pipe including an upstream end coupled to a source of a gas mixture containing the hazardous gas and a downstream end connected to the main exhaust pipe through the top surface; a second branch pipe including a downstream end connected to the main exhaust pipe through the bottom surface; and a detector configured to detect presence of the hazardous gas in the second branch pipe.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: April 20, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Fu Lin, Shih-Chang Shih, Chia-Chen Chen
  • Patent number: 10954472
    Abstract: Disclosed herein are hard surface cleaning compositions comprising, for example, a pH modifying agent in an amount sufficient to provide an alkaline pH; and a foaming system comprising: a nonionic ethoxylated/propoxylated surfactant; and a nonionic ethoxylated surfactant; wherein the concentration of the nonionic ethoxylated surfactant is greater than the concentration of the nonionic ethoxylated/propoxylated surfactant; and wherein the foaming system provides a structured network comprising a matrix having interstitial spaces. Methods of making and using these compositions are also described.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: March 23, 2021
    Assignee: Colgate-Palmolive Company
    Inventors: Carlos Munoz Carrillo, Cesar Rodriguez Cedillo, Edna Ambundo
  • Patent number: 10957554
    Abstract: Disclosed is a dry etching method for etching a metal film on a substrate with the use of an etching gas, wherein the etching gas contains a ?-diketone and first and second additive gases; wherein the metal film contains a metal element capable of forming a complex with the ?-diketone; wherein the first additive gas is at least one kind of gas selected from the group consisting of NO, NO2, O2 and O3; wherein the second additive gas is at least one kind of gas selected from the group consisting of H2O and H2O2; wherein the amount of the ?-diketone contained is 10 vol % to 90 vol % relative to the etching gas; and wherein the amount of the second additive gas contained is 0.1 vol % to 15 vol % relative to the etching gas. The etching rate of the metal film is increased by this etching method.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: March 23, 2021
    Assignee: Central Glass Company, Limited
    Inventors: Kunihiro Yamauchi, Takashi Masuda, Akifumi Yao
  • Patent number: 10953407
    Abstract: Generally described, the methods disclosed herein for recycling fiber composite source objects, such as wind turbine blades, include converting a whole wind turbine blade to an output material state that is useful for manufacturing other products, such as those used in construction of buildings, packaging, raw materials, and pellets, among other products. The recycling process is performed while tracking the progress and location of each wind turbine blade such that the direct source of the output material may be determined. In some embodiments, the method includes sectioning the wind turbine blades, crushing the wind turbine blade sections, tracking the progress of each blade through the process, and loading output materials into a suitable transportation vessel.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: March 23, 2021
    Assignee: GFSI GROUP LLC
    Inventors: Don Lilly, Ronald Albrecht
  • Patent number: 10930512
    Abstract: A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines, includes the steps of holding the workpiece on a holding table, and thereafter, cutting the workpiece along the projected dicing lines with an annular cutting blade, thereby separating the layered bodies. The cutting blade has a groove defined in a face side or a reverse side of an outer peripheral portion thereof that cuts into the workpiece in the step of cutting the workpiece. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: February 23, 2021
    Assignee: DISCO CORPORATION
    Inventor: Kenji Takenouchi
  • Patent number: 10913893
    Abstract: Embodiments of compositions of a wet etchant and additive thereto for selectively etching silicon nitride to silicon oxide are disclosed. In an example, a composition of an additive to a phosphoric acid etchant includes an inhibitor and a dispersant. The inhibitor is absorbable on a surface of silicon oxide and capable of inhibiting etching of the surface of silicon oxide by the phosphoric acid etchant. The dispersant is capable of reacting with a by-product of a reaction between the phosphoric acid etchant and at least one of silicon oxide and silicon nitride and reducing a viscosity of the phosphoric acid etchant.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: February 9, 2021
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Rong Xu, Wenbin Sun, Jie Su
  • Patent number: 10916473
    Abstract: A method includes forming a first dielectric layer over a wafer, etching the first dielectric layer to form an opening, filling a tungsten-containing material into the opening, and performing a Chemical Mechanical Polish (CMP) on the wafer. After the CMP, a cleaning is performed on the wafer using a weak base solution.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: February 9, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hao Chung, Chang-Sheng Lin, Kuo-Feng Huang, Li-Chieh Wu, Chun-Chieh Lin
  • Patent number: 10874883
    Abstract: A method for preparing a product for treating the skin and mucous membranes comprises the steps of making available a suitable quantity of trichloroacetic acid, making available a suitable quantity of hydrogen peroxide, making a first mixture of the trichloroacetic acid and the hydrogen peroxide, making available a determinate quantity of the basic compound able to achieve a buffer effect of the trichloroacetic acid comprised in the first mixture, and adding the basic compound.
    Type: Grant
    Filed: December 12, 2006
    Date of Patent: December 29, 2020
    Inventor: Rossana Castellana
  • Patent number: 10867801
    Abstract: According to one embodiment, an etching apparatus for etching a semiconductor with an aid of a noble metal catalyst, includes a reaction vessel configured to accommodate a semiconductor substrate provided with a catalyst layer including a noble metal, and a feeder configured to feed, to the reaction vessel, an oxidizer, hydrogen fluoride, an organic additive, and carbon dioxide in a supercritical or subcritical state.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: December 15, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventor: Kazuhito Higuchi
  • Patent number: 10844332
    Abstract: An alkaline wet solution for protecting features on a patterned substrate and a substrate processing method using the alkaline wet solution are described. The method includes providing a patterned substrate containing a low-k material, a metal oxide feature, and an etch residue, performing a treatment process that exposes the patterned substrate to an alkaline wet solution that forms a protective coating on the metal oxide feature, the alkaline wet solution containing a mixture of 1) water, 2) ammonium hydroxide, a quaternary organic ammonium hydroxide, or a quaternary organic phosphonium hydroxide, and 3) dissolved silica, and performing a wet cleaning process that removes the etch residue but not the metal oxide feature that is protected by the protective coating. The patterned substrate can further include a metallization layer and the alkaline wet solution can further contain 4) an inhibitor that protects the metallization layer from etching by the alkaline wet solution.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: November 24, 2020
    Assignee: Tokyo Electron Limited
    Inventors: Takayuki Toshima, Hiroshi Marumoto, Yoshinori Nishiwaki, Trace Hurd
  • Patent number: 10832917
    Abstract: A method is presented for post chemical mechanical polishing (PCMP) clean for cleaning a chemically-mechanically polished semiconductor wafer. The method includes planarizing the semiconductor wafer, subjecting the semiconductor wafer to a de-oxygenated mixture of DI water and PCMP solution, and applying a de-oxygenated environment during the cleaning. The solution can be de-oxygenated by nitrogen degas or by introducing a reducing agent. The environment can be de-oxygenated by purging with an inert gas, such as nitrogen.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: November 10, 2020
    Assignee: International Business Machines Corporation
    Inventors: Donald F. Canaperi, Pavan S. Chinthamanipeta, Raghuveer R. Patlolla, Cornelius B. Peethala
  • Patent number: 10833251
    Abstract: A composition for cleaning a magnetic pattern, a method of manufacturing a magnetic memory device, a method of forming a magnetic pattern, and a magnetic memory device, the composition including a glycol ether-based organic solvent; a decomposing agent that includes an aliphatic amine; and at least one of a chelating agent, or a cleaning accelerator that includes an organic alkaline compound, wherein the composition is devoid of water.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: November 10, 2020
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMYOUNG PURE CHEMICALS CO., LTD.
    Inventors: Ho-Young Kim, Jin-Hye Bae, Hoon Han, Won-Jun Lee, Chang-Kyu Lee, Geun-Joo Baek, Jung-Ig Jeon
  • Patent number: 10800996
    Abstract: A high foaming liquid alkaline cleaner comprises one or more alkalinity sources; one or more surfactants comprising a hydrotrope, one or more wetting and soil emulsifying surfactants, one or more foam volume generating surfactants, and one or more foam boosting surfactants and one or more sequestrants. Optionally, an organic solvent can be utilized. The high foaming liquid alkaline cleaning composition is generally prepared in a concentrated form and can be diluted as with water. The alkaline cleaner provides effective cleaning properties, with respect to fats, oils, and organic soils.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: October 13, 2020
    Assignee: American Sterilizer Company
    Inventors: Jessica Sue Haney Boester Linder, Ping Xia, Nancy-Hope Elizabeth Kaiser
  • Patent number: 10780030
    Abstract: Disclosed are compositions comprising at least one bicarbonate compound, at least one acid, at least one film forming polymer, and at least one cosmetically acceptable carrier, wherein the weight ratio of the at least one bicarbonate compound to the at least one acid is greater than or equal to about 1:1, and methods of altering the shape of keratin fibers comprising contacting the fibers with the compositions.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: September 22, 2020
    Assignee: L'OREAL
    Inventors: Michell Chen, Gloria Frimpong Allorbi, Anand Mahadeshwar
  • Patent number: 10774290
    Abstract: A detergent composition in the form of an effervescent tablet having high dissolution rate and good stability, which is suitable for producing aqueous solutions of cleaning compositions for cleaning hard surfaces and clothes. The tablet includes an alkylsulfate-type anionic surfactant, an effervescent system, a combination of at least two disintegrating agents, and urea.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: September 15, 2020
    Inventor: Lorena Martí Coma
  • Patent number: 10731114
    Abstract: Solvents useful for removing, among other things, photoresists and poly(amic acid)/polyimide from display/semiconductor substrates or electronic processing equipment, consist essentially of: (A) a first component consisting of a sulfoxide, e.g., DMSO; (B) a second component consisting of a glycol ether, e.g., ethylene glycol monobutyl ether; and (C) a third component consisting of at least one of N-formyl morpholine, N,N-dimethyl propionamide, 3-methoxy-N,N-dimethyl propanamide, triethyl phosphate, N,N-dimethyl acetamide; N,N-diethyl acetamide, N,N-diethyl propionamide, N-methyl acetamide, N-methyl propionamide, N-ethyl acetamide, and N-ethyl propionamide.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: August 4, 2020
    Assignee: Dow Global Technologies LLC
    Inventors: Qi Jiang, Xin Jiang, Hua Ren, Eungkyu Kim, Jianhai Mu, Kaoru Ohba
  • Patent number: 10722926
    Abstract: Disclosed is a supercritical-state cleaning system, comprising a cleaning chamber, a gas booster apparatus, a first heating apparatus, and a carbon dioxide supply apparatus. The cleaning chamber is separately connected to the first heating apparatus and the carbon dioxide supply apparatus. A vacuum pump set is connected to the cleaning chamber. Compared with the prior art, in the Invention, air introduced when a workpiece enters a cleaning chamber is completely removed, so as to prevent mixing of CO2 and air, thereby improving a cleaning effect.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: July 28, 2020
    Assignee: SHANGHAI YIBAI INDUSTRIAL FURNACES CO., LTD.
    Inventors: Fan Yang, Jingfeng Yang
  • Patent number: 10720323
    Abstract: A method for processing a semiconductor wafer in a PECVD deposition chamber with a circular pedestal and a recessed portion formed around the outer top surface of the pedestal. The method may include using a circular wafer carrier ring with a recessed portion.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: July 21, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Jian Song, Ruben Anthony Pesina, Kamal Avala
  • Patent number: 10707069
    Abstract: A method of polishing a semiconductor wafer includes polishing a surface of the semiconductor wafer using a polishing pad while supplying a polishing agent slurry containing abrasives during a first step. The polishing pad is free of abrasives and includes a first surface that contacts the semiconductor wafer, the first surface having a surface structure including elevations. Supply of polishing agent slurry is subsequently ended and, in a second step, the surface of the semiconductor wafer is polished using the polishing pad while supplying a polishing agent solution having a pH value of at least 12 that is free of solids.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: July 7, 2020
    Assignee: SILTRONIC AG
    Inventors: Juergen Schwandner, Michael Kerstan