Including Acidic Agent Patents (Class 134/3)
  • Patent number: 10843994
    Abstract: The invention provides a process for recovering oxalic acid used in ferrous metal pickling procedures, thereby reducing the total cost and environmental load of the pickling treatments.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: November 24, 2020
    Assignee: TAL OR ECOLOGY LTD.
    Inventors: Reuben David Schapiro, Vladimir Boiko, Lev Shapiro
  • Patent number: 10837122
    Abstract: Embodiments of the present invention generally relate to methods for removing contaminants and native oxides from substrate surfaces. The methods generally include removing contaminants disposed on the substrate surface using a plasma process, and then cleaning the substrate surface by use of a remote plasma assisted dry etch process.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: November 17, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Christopher S. Olsen, Theresa K. Guarini, Jeffrey Tobin, Lara Hawrylchak, Peter Stone, Chi Wei Lo, Saurabh Chopra
  • Patent number: 10816665
    Abstract: The invention provides a measuring system, which comprises a plurality of measuring units and a leveling unit common to the plurality of measuring units, the leveling unit has a recessed fitting portion on an upper surface, and the plurality of measuring units each has a projecting fitting portion which is engageable and disengageable with respect to the recessed fitting portion, wherein the plurality of measuring units are constituted to be attachable and detachable with respect to the leveling unit, and in a state where each of the measuring units is mounted on the leveling unit, a same object to be measured is measured respectively, an offset amount between each of the measuring units is measured, and based on the offset amount, a measurement value measured in each of the measuring units is corrected and coordinate-converted.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: October 27, 2020
    Assignee: TOPCON Corporation
    Inventors: Ken-ichiro Yoshino, Fumio Ohtomo
  • Patent number: 10809620
    Abstract: Various embodiments of systems and methods for drain line monitoring are disclosed herein. More specifically, a liquid dispense unit for a coating/developing processing system is provided herein for applying one or more liquid solutions to a substrate disposed within the liquid dispense unit. In the disclosed embodiments, a pH sensor and/or a line particle counter (LPC) is coupled to a drain line of the liquid dispense unit to monitor various parameters of the liquid waste, which is ejected from the substrate and disposed of through the drain line. In some embodiments, measurements obtained from the pH sensor may be used to optimize a develop process by detecting an endpoint of the develop process, avoiding pH shock and/or detecting excursions in the develop process. In some embodiments, measurements obtained from the LPC may additionally or alternatively be used to optimize the develop process.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: October 20, 2020
    Assignee: Tokyo Electron Limited
    Inventors: Michael Carcasi, Mark Somervell, Joshua Hooge
  • Patent number: 10790134
    Abstract: A substrate processing method includes a substrate holding step of holding a substrate by means of a substrate holder which holds the substrate horizontally with an interval upward from an upper surface of a base, a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate held by the substrate holder, a cleaning liquid supplying step of supplying a cleaning liquid so as to wash away the first processing liquid attached to the upper surface of the base, to the upper surface of the base such that the cleaning liquid on the base does not contact a lower surface of the substrate held by the substrate holder, and a removing step of removing the cleaning liquid from the upper surface of the base.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: September 29, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Taiki Hinode, Takashi Ota
  • Patent number: 10790169
    Abstract: A discharge port 31 is arranged inside a chamber 9. A circulation flow passage 50 circulates a processing liquid, while maintaining the processing liquid at a predetermined temperature. A discharge flow passage 32 is branched from a circulation flow passage 50 to guide the processing liquid to the discharge port 31. A return flow passage 33 is connected to the discharge flow passage 32 inside the chamber 9 and allows the processing liquid running through the discharge flowpassage 32 to flow back to the circulation flow passage 50.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: September 29, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Naoyuki Osada, Koji Hashimoto
  • Patent number: 10745812
    Abstract: Methods, systems and apparatuses are disclosed for treating aluminum desmutting solutions by reacting, mixing and filtering an aluminum desmutting solution flow from an aluminum desmutting solution tank and controlling the amount of copper ions in an aluminum desmutting solution tank by directing a portion of the desmutting solution from a desmutting solution tank to a treatment line, reacting a portion of the desmutting solution in the treatment line and recirculating a filtered aluminum desmutting solution to the aluminum desmutting solution tank during active desmutting operation of the aluminum desmutting solution tank.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: August 18, 2020
    Assignee: The Boeing Company
    Inventors: David L. Crump, Lance E. Succo, David Huebner, Mark R. Woodruff
  • Patent number: 10704151
    Abstract: A pickling apparatus includes a plurality of pickling tanks in which a scale of a steel plate is removed while the steel plate is advanced and sequentially dipped; an intermediate spraying unit, disposed between a pickling tank at the front end and a pickling tank at the rear end, for spraying a pickling solution onto the steel plate; and a pickling solution supply means configured to provide a pickling solution of a concentration used in the pickling tank at the rear end to the intermediate spraying unit, wherein a wringer roll disposed between the plurality of pickling tanks is removed.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: July 7, 2020
    Assignee: POSCO
    Inventor: Hyoung-Kuk Park
  • Patent number: 10622495
    Abstract: This disclosure relates to a Room Temperature Wet Chemical Growth (RTWCG) method and process of SiOX thin film coatings which can be grown on various substrates. The invention further relates to RTWCG method and process suited to grow thin films on the Si substrates used in the manufacture of silicon-based electronic and photonic (optoelectronic) device applications. The invention further relates to processes used to produce SiOX thin film layers for use as passivation layers, low reflectance layers, or high reflectance single layer coatings (SLARC) and selective emitters (SE).
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: April 14, 2020
    Assignee: SPECMAT, Inc.
    Inventors: Horia M. Faur, Maria Faur
  • Patent number: 10613442
    Abstract: The present invention is a charge complexing chemical composition that protects metal during polymer removal. The polymer coatings include crosslinked systems by chemical-amplification and photoacid generated (PAG) means as in epoxies. The system includes a solvent, a charge complexing additive, and an acid that creates a protective complex for sensitive metals during the dissolving and rinsing practice needed for processing microelectronic parts. The composition can be utilized with a method for removing partial and fully cured crosslinked coatings that originate from chemical amplification or PAG-epoxy photoimageable coatings.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: April 7, 2020
    Assignee: Merck Patent GmbH
    Inventor: John Cleaon Moore
  • Patent number: 10604850
    Abstract: A method of treating in a subterranean formation including placing a corrosion inhibitor composition into a subterranean formation, where the formation includes an acidic environment having a pH of about 5 or below, where the composition includes: an organic solvent comprising an alcohol with a flash point of at least about 75° C.; a nitrogen containing compound; an aqueous acid solution comprising HCl; and contacting a metal surface with the corrosion inhibitor composition. A corrosion inhibitor composition includes an organic solvent comprising an alcohol with a flash point of at least about 75° C.; a nitrogen containing compound; and an aqueous acid solution comprising HCl.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: March 31, 2020
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Enrique Antonio Reyes, Alyssa Lynn Lablanc, Aaron M. Beuterbaugh
  • Patent number: 10549458
    Abstract: A manufacturing method of a mold includes the steps of: providing an aluminum base in the shape of a hollow cylinder which is made of a Al—Mg—Si based aluminum alloy, the aluminum base being mechanically mirror-finished; performing a frosting treatment on a surface of the aluminum base with an aqueous solution which contains a salt of hydrogen fluoride and ammonium; thereafter, forming an inorganic material layer on the surface of the aluminum base and forming an aluminum film on the inorganic material layer, thereby forming a mold base; and alternately repeating anodization and etching on a surface of the aluminum film of the mold base, thereby forming an inverted moth-eye structure which has a plurality of micro recessed portions.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: February 4, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Takahiro Nakahara, Miho Yamada, Kiyoshi Minoura
  • Patent number: 10549386
    Abstract: A method of forming openings in a polymer layer includes positioning a layer of a material over a cavity such that a portion of the first material lies over a cavity, ablating the portion of the material at a first shape, and ablating the portion of the material at a second shape, wherein the second shape lies within the first shape. A method of forming openings in a polymer layer includes positioning a layer of a first material over a second material having a cavity such that a portion of the first material lies over the cavity, ablating the portion of the first material over the cavity at a first shape, and ablating the portion of the second material over the cavity at a second shape, wherein the second shape lies within the first shape.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: February 4, 2020
    Assignee: XEROX CORPORATION
    Inventors: Ruander Cardenas, John R. Andrews
  • Patent number: 10522341
    Abstract: Described is a post-CMP cleaning solution and methods useful to remove residue from a CMP substrate or to prevent formation of residue on a surface of a CMP substrate.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: December 31, 2019
    Assignee: Cabot Microelectronics Corporation
    Inventors: Helin Huang, Ji Cui
  • Patent number: 10494696
    Abstract: A method for recovering tin and/or tin alloy from a substrate comprising providing a substrate having tin and/or tin alloy thereon; contacting the tin and/or tin alloy with a stripping solution comprising an inorganic acid and a persulfate compound; recovering tin salt and/or tin alloy salt precipitated from the stripping solution; and recovering tin and/or tin alloy from the tin salt and/or tin alloy salt, respectively.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: December 3, 2019
    Assignee: Alpha Assembly Solution Inc.
    Inventors: Narahari Pujari, Siuli Sarkar, Bawa Singh, Daniel Goswami
  • Patent number: 10403517
    Abstract: A supply flow passage branches into a plurality of upstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis of a substrate. Hydrogen peroxide water, that is one of components of a chemical liquid (SPM), is supplied to the upstream flow passage from a component liquid flow passage. A mixing ratio changing unit including a plurality of first flow control valves and a plurality of second flow control valves independently changes mixing ratios of sulfuric acid and hydrogen peroxide water included in the chemical liquid to be discharged from the plurality of discharge ports for each of the upstream flow passages.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: September 3, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Kenji Kobayashi, Jun Sawashima, Yuta Nishimura, Akihiro Nakashima, Motoyuki Shimai, Akito Hatano
  • Patent number: 10262766
    Abstract: The present disclosure generally relates to a new process for generating germanium-68 from an irradiated target body. The process includes irradiation of the target body followed by various extraction techniques to generate the germanium-68.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: April 16, 2019
    Assignee: MALLINCKRODT NUCLEAR MEDICINE LLC
    Inventors: William C. Uhland, David Wayne Pipes, Melissa Dianne Perrigo
  • Patent number: 10156012
    Abstract: There is provided a cleaning method improving cleaning efficiency in a process container after an oxygen-containing film forming process is having performed, including: (a) supplying at least a hydrogen fluoride gas into the process container; and (b) supplying an alcohol into the process container in a state where supply of the hydrogen fluoride gas into the process container is stopped, wherein (a) and (b) are continuously performed without providing an intermittent period therebetween.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: December 18, 2018
    Assignees: KOKUSAI ELECTRIC CORPORATION, CENTRAL GLASS CO., LTD.
    Inventors: Kenji Kameda, Masaya Nagato, Akiou Kikuchi, Yuta Takeda, Kunihiro Yamauchi
  • Patent number: 10156021
    Abstract: A method of producing a surface-treated steel sheet is provided. The surface-treated steel sheet includes a layer that contains a metal oxide. The method is characterized by including: dipping a steel sheet for 0.1 to 10 seconds in a treatment liquid that contains at least fluoride ions and has a pH of 2 to 5; and electrically treating by flowing a direct current between the steel sheet and an electrode in a treatment liquid to form a layer that contains a metal oxide on a surface of the steel sheet. According to the present invention, there can be provided a method of producing a surface-treated steel sheet which can enhance the interfacial adhesion with an organic resin layer when the organic resin layer is formed on the metal oxide layer.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: December 18, 2018
    Assignee: TOYO KOHAN CO., LTD.
    Inventors: Kunihiro Yoshimura, Naomi Taguchi, Satoko Fukutomi
  • Patent number: 10153153
    Abstract: An etching fault is suppressed by use of an etching gas containing iodine heptafluoride. Provided is an attached substance removing method of removing an attached substance containing an iodine oxide attached to a component included in a chamber or a surface of a pipe connected with the chamber by use of a cleaning gas containing a fluorine-containing gas. Also provided is a dry etching method, including the steps of supplying an etching gas containing an iodine-containing gas into a chamber to perform etching on a surface of a substrate; and after the etching is performed on the surface of the substrate, removing an attached substance containing an iodine oxide attached to a component included in the chamber or a surface of a pipe connected with the chamber by use of a cleaning gas containing a fluorine-containing gas.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: December 11, 2018
    Assignee: CENTRAL GLASS COMPANY, LIMITED
    Inventors: Akiou Kikuchi, Masanori Watari, Kenji Kameda, Shin Hiyama, Yasutoshi Tsubota
  • Patent number: 10121647
    Abstract: An etching fault is suppressed by use of an etching gas containing iodine heptafluoride. Provided is an attached substance removing method of removing an attached substance containing an iodine oxide attached to a component included in a chamber or a surface of a pipe connected with the chamber by use of a cleaning gas containing a fluorine-containing gas. Also provided is a dry etching method, including the steps of supplying an etching gas containing an iodine-containing gas into a chamber to perform etching on a surface of a substrate; and after the etching is performed on the surface of the substrate, removing an attached substance containing an iodine oxide attached to a component included in the chamber or a surface of a pipe connected with the chamber by use of a cleaning gas containing a fluorine-containing gas.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: November 6, 2018
    Assignee: CENTRAL GLASS COMPANY, LIMITED
    Inventors: Akiou Kikuchi, Masanori Watari, Kenji Kameda, Shin Hiyama, Yasutoshi Tsubota
  • Patent number: 10094025
    Abstract: A mechanical component for an internal combustion engine includes a mechanical component body made of one of aluminum and aluminum alloy and used for the internal combustion engine, a nickel plating layer formed to cover a surface of a predetermined portion of the mechanical component body, and a reforming layer formed between the surface of the predetermined portion of the mechanical component body and the nickel plating layer.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: October 9, 2018
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Hajime Minaki, Hiroaki Sasayama, Akihiro Okamoto, Takuya Niimi
  • Patent number: 10030216
    Abstract: Systems and methods for formulating and utilizing chemical gel formulations, particularly with respect to cooling tower fill cleaning operations.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: July 24, 2018
    Assignee: Crossford International, LLC
    Inventors: Timothy J. Kane, Joseph J. Franzino, Pete Gentile, Mark Rothenhausen, Ray Field
  • Patent number: 10034387
    Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: July 24, 2018
    Assignee: Entegris, Inc.
    Inventors: André Brosseau, Svitlana Grigorenko, Ping Jiang, Michael B. Korzenski
  • Patent number: 10012455
    Abstract: A system for descaling heat exchanger surfaces using a varying concentration of either an acidic or alkaline solution, selecting an optimum pH value for descaling a heat exchanger according to the level of cleaning the heat exchanger requires, monitoring pH value of descaling solution during circulation through a heat exchanger, and adding chemical solution to achieve coincidence of optimum and monitored pH values during descaling operation.
    Type: Grant
    Filed: January 2, 2015
    Date of Patent: July 3, 2018
    Inventors: Joseph J. Franzino, George M Cruz
  • Patent number: 10015876
    Abstract: The object of the present invention is to provide a printed circuit board that improves the heat radiating effect as the entire printed circuit board and a manufacturing method for such a printed circuit board.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: July 3, 2018
    Assignee: TANAZAWA HAKKOSHA CO., LTD.
    Inventors: Keiichiro Yamamoto, Kazuhiro Sasamoto
  • Patent number: 10007184
    Abstract: Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: June 26, 2018
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Li Cui, Charlotte A. Cutler, Suzanne M. Coley, Owendi Ongayi, Christopher P. Sullivan, Paul J. LaBeaume, Shintaro Yamada, Mingqi Li, James F. Cameron
  • Patent number: 9937602
    Abstract: In a substrate processing method according to an embodiment, a surface of an object to be polished disposed on a substrate is polished on a polishing pad supplied with slurry. After the polishing process using the slurry, the surface of the object to be polished on the polishing pad is polished, while supplying water on the polishing pad where a residue including the slurry or a sludge of the polishing pad adhered. After the polishing process using the water, the surface of the object to be polished is cleaned on the polishing pad by supplying rinse liquid on the polishing pad.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: April 10, 2018
    Assignee: Toshiba Memory Corporation
    Inventors: Yosuke Otsuka, Masako Kodera, Yukiteru Matsui
  • Patent number: 9889631
    Abstract: The present disclosure relates generally to strip process for removing a coating from a substrate comprising the steps of: providing a base alloy and a MCrAlY coating deposited over the base alloy substrate; and removing the MCrAlY coating by bringing the MCrAlY coating in contact with an acid solution comprising nitric acid, phosphoric acid and ammonium bifluoride in an aqueous solution, and maintaining the acid solution contact for sufficient time and at sufficient temperature to permit the coating to be stripped from the base alloy substrate.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: February 13, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Eric W. Stratton, Michael J. Minor
  • Patent number: 9893016
    Abstract: A multilayer wiring board includes a main wiring board including insulation layers, first via conductors formed in the insulation layers, and a first conductive layer including first mounting pads such that the first mounting pads are positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board, and a wiring structure body mounted on the main wiring board such that the wiring structure body is positioned in an outermost insulation layer of the insulation layers, the wiring structure body including a second conductive layer which includes second mounting pads such that the second mounting pads are positioned to connect to the first electronic component and the second electronic component mounted on the main wiring board. The first via conductors are formed such that the first via conductors have diameters which increase in a same direction.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: February 13, 2018
    Assignee: IBIDEN CO., LTD.
    Inventors: Hajime Sakamoto, Yoshinori Shizuno, Shigeru Yamada, Takashi Kariya
  • Patent number: 9882031
    Abstract: A semiconductor structure includes a substrate and a fin. The fin extends from the substrate and is formed with a hole therethrough. The hole is defined by a confronting pair of wall parts. One of the wall parts is more arcuate than the other of the wall parts. A method for fabricating the semiconductor structure is also disclosed.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: January 30, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chia-Cheng Tai, Chun-Liang Tai
  • Patent number: 9875916
    Abstract: Provided is a method and system for stripping an ion implanted resist or performing a post-ash clean using a single substrate tool. Cleaning objectives and cleaning operating variables are selected for optimization. The first step immerses the substrate in a first treatment chemical, while concurrently irradiating the substrate with UV light, the process completed in a first process time, a first flow rate, and a first rotation speed of the substrate. The second step dispenses onto the substrate a second treatment chemical at a second temperature and a second composition, the second treatment chemical dispensed at a dispense temperature, and completed in a second process time and a second rotation speed. The two or more selected cleaning operating variables comprise UV wavelength, UV power, first concentration, first rotation speed, first flow rate, second process time, second rotation speed, percentage of residue removal, and dispense temperature.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: January 23, 2018
    Assignee: Tokyo Electron Limited
    Inventor: Ian J Brown
  • Patent number: 9809716
    Abstract: Inadvertent or unavoidable contact of an acid with an acid-reactive substance may preclude the acid's use in another location where its reactivity is more desired. Excessive reactivity of acids toward acid-reactive substances may lead to undesired effects such as surface erosion, matrix deconsolidation, scaling, and the like. Methods for protecting an acid-reactive surface from excessive reaction may comprise: depositing a protective coating comprising an N-(phosphonoalkyl)iminodiacetic acid or any salt thereof onto an acid-reactive surface; and contacting a mineral acid or an organic acid with the protective coating without substantially reacting the acid-reactive surface.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: November 7, 2017
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Aaron Michael Beuterbaugh, Enrique Antonio Reyes, Alyssa Lynn LaBlanc
  • Patent number: 9812334
    Abstract: A corrosion method of a passivation layer (320) of a silicon wafer (300) includes: pouring hydrofluoric acid solution (100) into a container (200) with an open top; putting the silicon wafer (300) to the opening of the container (200) and one side of the silicon wafer (300) with the passivation layer (320) is opposite to the hydrofluoric acid solution (100); the hydrogen fluoride gas generated from the volatilization of the hydrofluoric acid solution (100) corrodes the passivation layer (320) of the silicon wafer (300), the corrosion time is larger or equal to (thickness of the passivation layer/corrosion rate). By means of the corrosion of the passivation layer of silicon wafer by the fluoride gas generated from the volatilization of the hydrofluoric acid solution, the fluoride gas can fully touch the passivation layer; therefore the passivation layer can be completely corroded, and the corrosion precision is high.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: November 7, 2017
    Assignee: CSMC Technologies Fab1 Co., Ltd.
    Inventor: Qiliang Sun
  • Patent number: 9739385
    Abstract: An inlet port provides a fluid entrance to a body. A chamber has an inner surface. An outlet port is in fluid communication with the chamber and provides a fluid exit from the body. The piston is moveable within the chamber between a first set position, in which the inlet port is not in fluid communication with the outlet port, and a second open position, in which the inlet port is in fluid communication with the outlet port through the chamber. A seal guard is slidably disposed within the chamber. The seal guard is moveable between a first seal-guard position and a second seal-guard position in which the seal guard shields the seal. The seal guard is in the first seal-guard position when the piston is in its first set position and in the second seal-guard position when the piston is in its second open position.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: August 22, 2017
    Assignee: Marathon Valve LLC
    Inventor: Daniel Greenfield Lattimer
  • Patent number: 9713823
    Abstract: A continuous galvanizing line having an annealing furnace of an all radiant tube heating type includes a moisture removal device, dew-point meters, outlets through which the atmospheric gas in the furnace is collected and inlets through which the atmospheric gas from which moisture has been removed with the moisture removal device is fed into the furnace, the dew-point meters and the outlets being placed at least at two points which respectively exist on a side wall in the vicinity of the entrance of the annealing furnace and on a side wall in the vicinity of the furnace top or the furnace bottom at a position where a steel sheet has a maximum end-point temperature, the inlets being placed at two points which respectively exist on side walls on the sides opposite to the sides of the two points for the outlets in the height direction of the furnace, making it possible to steadily control the dew-point of the atmospheric gas to be ?45° C. or lower and ?80° C.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: July 25, 2017
    Assignee: JFE STEEL CORPORATION
    Inventor: Nobuyuki Sato
  • Patent number: 9683293
    Abstract: The present disclosure relates generally to the field of conversion coating. More specifically, the present disclosure relates to improved methods for improving efficiency of chromium conversion coat processing lines.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: June 20, 2017
    Assignee: THE BOEING COMPANY
    Inventor: Lawrence M. Lawless
  • Patent number: 9663870
    Abstract: A method for coating a component for use in a semiconductor chamber for plasma etching includes providing a component for use in a semiconductor manufacturing chamber, loading the component into a deposition chamber, cold spray coating a metal powder onto the component to form a coating on the component, and anodizing the coating to form an anodization layer.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: May 30, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Jennifer Y. Sun, Vahid Firouzdor
  • Patent number: 9657258
    Abstract: The present invention generally relates to methods of cleaning residual pesticide from an agricultural vessel, and to kits and compositions useful for the practice of such methods.
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: May 23, 2017
    Assignee: Monsanto Technology LLC
    Inventors: Amanda C. Herr, David A. Morgenstern, James W. Taylor
  • Patent number: 9658203
    Abstract: A metal collection solution according to an embodiment contains 48 wt % or more of HNO3, 6 wt % or less of HCl, and 5 wt % or less of HF. The metal collection solution can collect noble metals and can scan on a substrate. The metal collection solution can be used to collect the noble metals adhered to a surface of the substrate.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: May 23, 2017
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Jiahong Wu, Yuji Yamada, Ayako Mizuno
  • Patent number: 9645505
    Abstract: An exposure apparatus is capable of accurately performing an exposure process and a measurement process based on a liquid immersion method. The exposure apparatus, which forms a liquid immersion area of a liquid on an image surface side of a projection optical system, and exposes a substrate via the projection optical system and the liquid of the immersion area, includes a measuring device which measures at least one of a property and composition of the liquid for forming the liquid immersion area.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: May 9, 2017
    Assignee: NIKON CORPORATION
    Inventor: Kenichi Shiraishi
  • Patent number: 9612218
    Abstract: This method for determining whether an acidic aqueous solution is usable or not comprises: a first detection step (S21) in which the solution concentration of an acidic aqueous solution resulting from pickling is determined; a second detection step (S23a, S23b) in which the concentration of a specific metal in the acidic aqueous solution resulting from pickling is determined, the metal having been contained in the coating layer; a concentrated-solution addition step (S25b) in which in cases when the solution concentration is equal to or less than a predetermined first threshold, a concentrated acidic aqueous solution is newly added; and a determination step (S24a, S24b) in which in cases when the concentration of the specific metal is equal to or higher than a predetermined second threshold, it is determined that the acidic aqueous solution is unusable.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: April 4, 2017
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Tetsuji Kawakami, Hiroyuki Mitsui, Yoshiyuki Inoue
  • Patent number: 9567554
    Abstract: A cleaning method and a cleaning fluid are provided. The cleaning method includes accessing a plurality of turbine components attached to a turbine assembly, the turbine assembly being a portion of a turbomachine, positioning at least one cleaning vessel over at least one of the turbine components, forming a liquid seal with a sealing bladder, providing a cleaning fluid to the cleaning vessel, and draining the cleaning fluid from the cleaning vessel. The cleaning fluid includes a carrier fluid and a solvent additive for removing fouling material from the turbine component. An alternative cleaning method is also provided.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: February 14, 2017
    Assignee: General Electric Company
    Inventors: Sanji Ekanayake, Surinder Singh Pabla, Murali Krishna Kalaga, Alston Ilford Scipio, Ishmael Dean El
  • Patent number: 9502146
    Abstract: The invention relates to a process for dissolving a chromium, iron, nickel, zinc and radionuclides containing oxide layer, in particular for breaking down oxide layers deposited on inner surfaces of systems and components of a nuclear power plant, by means of an aqueous decontamination solution containing methanesulfonic acid, which flows in a loop, wherein in regular intervals small amounts of permanganic acid are added, and following reaction of the permanganic acid a second loop is added on in bypass and the dissolved cations and anions are removed by ion-exchange resins from the decontamination solution.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: November 22, 2016
    Assignees: NIS INGENIEURGESELLSCHAFT MBH
    Inventors: Horst-Otto Bertholdt, Alexander Landner, Andreas Loeb, Hartmut Runge, Dieter Stanke
  • Patent number: 9481855
    Abstract: An aqueous cleaning composition and method for post-CMP cleaning of a semiconductor device which contains a copper interconnect wherein the cleaning composition contains (A) N,N,N?-trimethyl-N?-(2-hydroxyethyl)ethylenediamine; and (B) at least one corrosion inhibitor selected from the group consisting essentially of uric acid, xanthine, theophyline, paraxanthine, theobromine, caffeine, guanine, hypoxanthine, adenine, and combinations thereof.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: November 1, 2016
    Assignee: EKC TECHNOLOGY INC
    Inventors: Atsushi Otake, Akira Kuroda
  • Patent number: 9481934
    Abstract: A method of removing a work-affected layer formed on the worked surface of a TiAl-based alloy (base material) by machining work, without exerting any adverse effect on the base material. The method of removing the work-affected layer includes a step of dipping a TiAl-based alloy, having a work-affected layer formed on the surface thereof by machining, in an etchant containing predetermined concentrations of hydrofluoric acid and nitric acid. Within the etchant, the concentration of the hydrofluoric acid is not less than 5 g/L and not more than 56 g/L, and the concentration of the nitric acid is selected from within a range from not less than 50 g/L to not more than 260 g/L in accordance with a combination of the concentration of the hydrofluoric acid within the etchant and the etching treatment temperature.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: November 1, 2016
    Assignee: MITSUBISHI HEAVY INDUSTRIES AERO ENGINES, LTD.
    Inventor: Taisuke Kamioka
  • Patent number: 9476019
    Abstract: A cleaning agent for a microelectronic device provided with metal wiring, which has an excellent ability to remove polishing particle residues derived from a polishing agent and an excellent ability to remove metallic residues on an insulating film, and has excellent anticorrosiveness to the metal wiring. The cleaning agent is used at a step subsequent to chemical mechanical polishing in a manufacturing process of a microelectronic device in which a metal wiring, e.g., copper or tungsten, is formed.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: October 25, 2016
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Mutsumi Nakanishi, Hiroshi Yoshimochi, Yukichi Koji
  • Patent number: 9476018
    Abstract: Methods and systems for cleaning corrosion product of a metallic layer from the surface of a substrate are provided. According to one embodiment, a treatment solution includes a surfactant, a complexing agent, and a pH adjuster. The surfactant is configured to enhance wetting of the substrate surface, and inhibit further corrosion of the capping layer. The complexing agent is configured to bind to metal ions which have desorbed from the substrate surface. The pH adjuster is configured to adjust the pH to a desired level, so as to promote desorption of the corrosion product from the substrate surface.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: October 25, 2016
    Assignee: Lam Research Corporation
    Inventor: Artur Kolics
  • Patent number: 9468950
    Abstract: A selective removal of metal and its anion species that are detrimental to subsequent hydrothermal hydrocatalytic conversion from the biomass feed in a continuous or semi-continuous manner prior to carrying out catalytic hydrogenation/hydrogenolysis/hydrodeoxygenation of the biomass that does not reduce the effectiveness of the hydrothermal hydrocatalytic treatment while minimizing the amount of water used in the process is provided.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: October 18, 2016
    Assignee: Shell Oil Company
    Inventors: Joseph Broun Powell, Robert Edward Trepte, Juben Nemchand Chheda
  • Patent number: RE46221
    Abstract: A probe for engaging a conductive pad is provided. The probe includes a probe contact end for receiving a test current, a probe retention portion below the contact end, a block for holding the probe retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicular below the contact tip. The self-cleaning skate has a square front, a round back and a flat middle section. The conductive pad is of generally convex shape having a granular non-conductive surface of debris and moves to engage the skate, whereby an overdrive motion is applied to the pad causing the skate to move across and scrub non-conductive debris from the pad displacing the debris along the skate and around the skate round back end to a position on the skate that is away from the pad.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: November 29, 2016
    Assignee: MICROPROBE, INC.
    Inventor: January Kister