Including Acidic Agent Patents (Class 134/3)
  • Patent number: 11155481
    Abstract: Described herein are the methods of using a cationic alkyl polyglycoside in a fouling control composition to reduce microbial and/biofilm growth in a water system. The described methods or compositions are found to be effective than those methods or compositions including commonly used single quaternary compounds for reducing microbial or biofilm growth in water systems.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: October 26, 2021
    Assignee: ECOLAB USA INC.
    Inventors: Ashish Dhawan, Kun Xiong, Carter M. Silvernail
  • Patent number: 11155480
    Abstract: Described herein are the methods of using a cationic alkyl polyglycoside in a corrosion control composition to reduce corrosion for metal surfaces in a water system. The described methods or compositions are found to be effective than those methods or compositions including commonly used corrosion inhibitors for water systems.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: October 26, 2021
    Assignee: Ecolab USA Inc.
    Inventors: Jeremy Moloney, Ashish Dhawan, Carter M. Silvernail
  • Patent number: 11136674
    Abstract: A material removal method comprises receiving a component that includes a component body and a coating on the component body, the component body comprising metallic first material, and the coating comprising a second material that is different from the first material, wherein the component is a component of an item of rotational equipment. The method also includes receiving a solution comprising nitric acid and hydrogen peroxide and subjecting at least a portion of the coating to the solution in supercritical condition in order to remove at least some of the second material from the component, wherein a chemistry of the solution is selected such that the solution is substantially non-reactive with the first material.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 5, 2021
    Assignee: Raytheon Technologies Corporation
    Inventors: Zhongfen Ding, William J. Brindley
  • Patent number: 11124741
    Abstract: The present invention generally relates to a removal composition and process, particularly useful for cleaning ceria particles and CMP contaminants from microelectronic devices having said particles and CMP contaminants thereon, in particular microelectronic devices having PETEOS, Silicon Nitride, and Poly-Si substrates. In one aspect, the invention provides treatment of the microelectronic substrate having ceria particles thereon utilizing complexing agents free of Sulfur and Phosphorous atoms.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: September 21, 2021
    Assignee: ENTEGRIS, INC.
    Inventors: Atanu K. Das, Michael White, Daniela White
  • Patent number: 11124740
    Abstract: A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The composition achieves highly efficacious removal of the ceria particles and CMP by-product contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, or tungsten-containing materials.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: September 21, 2021
    Assignee: ENTEGRIS, INC.
    Inventors: Atanu K. Das, Michael White, Daniela White
  • Patent number: 11089784
    Abstract: A composition for destroying microorganisms is used for destroying microflora (bacteria, protozoan fungi, etc.) in a sessile state (hereinafter, a biofilm). The composition can find its application in medicine, industry, agriculture and various technical fields for destroying biological films comprised of complex bacterial communities in an extracellular polymeric substance (an exopolymeric matrix), which form on different types of surfaces: biological, industrial, etc. The composition is pre-prepared by dissolving an oxidant and a buffer compound in a solvent. Once the composition has been prepared, it is applied to a biofilm on the surface of an object.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: August 17, 2021
    Assignee: Ideps GmbH
    Inventors: Serhei Vladymyrovych Bevz, Aleksandr Vasylevych Koval
  • Patent number: 11091725
    Abstract: The present invention generally relates to methods of cleaning residual pesticide from an agricultural vessel, and to kits and compositions useful for the practice of such methods.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: August 17, 2021
    Assignee: Monsanto Technology LLC
    Inventors: Amanda C. Herr, David A. Morgenstern, James W. Taylor
  • Patent number: 11066749
    Abstract: A method of treating in a subterranean formation including placing a corrosion inhibitor composition into a subterranean formation, where the formation includes an acidic environment having a pH of about 5 or below, where the composition includes: an organic solvent comprising an alcohol with a flash point of at least about 75° C.; a nitrogen containing compound; an aqueous acid solution comprising HCl; and contacting a metal surface with the corrosion inhibitor composition. A corrosion inhibitor composition includes an organic solvent comprising an alcohol with a flash point of at least about 75° C.; a nitrogen containing compound; and an aqueous acid solution comprising HCl.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: July 20, 2021
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Enrique Antonio Reyes, Alyssa Lynn Lablanc, Aaron M. Beuterbaugh
  • Patent number: 11066627
    Abstract: According to the present invention, there is provided a cleaning agent composition for a semiconductor device substrate including at least one of wiring and an electrode in which the wiring and the electrode contain cobalt or a cobalt alloy, the cleaning agent composition including a component (A): at least one compound selected from the group consisting of specific compounds; and a component (B): water.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: July 20, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Tomohiro Kusano, Ken Harada, Yasuhiro Kawase
  • Patent number: 11054749
    Abstract: An organic photoresist stripping composition and method of using the composition with silicon wafers having an insulating layer and metallization on the wafers, having an aryl sulfonic acid or alkylaryl sulfonic acid or mixtures thereof; 1,3-dihydroxybenzene (resorcinol) or sorbitol or mixtures thereof; one or more hydrocarbon solvents having a flash point of greater than about 65° C., and optionally less than about 0.5% by weight water based on the total weight of the composition. The composition may also be used for the removal of other materials from other substrates.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: July 6, 2021
    Assignee: Versum Materials US, LLC
    Inventors: Richard D. Peters, Michael Phenis, Travis Acra
  • Patent number: 11028322
    Abstract: A composition for washing a pickled steel plate and a method for washing a pickled steel plate using the same are provided. The composition for washing a pickled steel plate includes a phosphoric acid ester compound, an amine-based compound, sodium carbonate, ammonium acetate, ethylene diamine tetraacetic acid (EDTA) and a remainder of water, and the method for washing a pickled steel plate is performed using the same.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: June 8, 2021
    Assignee: POSCO
    Inventors: Rho-Bum Park, Yon-Kyun Song, Ji-Hoon Park, Hoon Yun, Seok-Chan Choe, Kyoung-Pil Ko
  • Patent number: 11004702
    Abstract: A nozzle is stored in a nozzle storage hole of a waiting pod. In this state, a cleaning liquid is discharged to an outer peripheral surface of the nozzle from a plurality of discharge ports. Thus, a coating liquid and its solidified matter adhering to the nozzle are dissolved and removed from the nozzle. Subsequently, a metal removal liquid is discharged from a plurality of discharge ports to the outer peripheral surface of the nozzle. Thus, a metallic component remaining on the nozzle is dissolved and removed from the nozzle. Further, pure water is discharged to the outer peripheral surface of the nozzle from the plurality of discharge ports, and the metal removal liquid adhering to the nozzle is cleaned away.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: May 11, 2021
    Inventors: Yuji Tanaka, Masaya Asai, Masahiko Harumoto, Koji Kaneyama
  • Patent number: 10991601
    Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate while rotating the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig while rotating the jig supported on the support plate. In the substrate treating step, the substrate is clamped to the support plate by a first vacuum pressure applied to the substrate. The vessel cleaning step includes a first clamping step of clamping the jig to the support plate by applying a second vacuum pressure to the jig. The first vacuum pressure and the second vacuum pressure are different from each other.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: April 27, 2021
    Assignee: SEMES CO., LTD.
    Inventors: Hwangsoo Park, Jun Ho You, Doo Young Oh, Jaehun Jeong
  • Patent number: 10961487
    Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pinlei Edmund Chu, Chun-Wei Hsu, Ling-Fu Nieh, Chi-Jen Liu, Liang-Guang Chen, Yi-Sheng Lin
  • Patent number: 10937661
    Abstract: A method for removing silicon oxide from a wafer and an integrated circuit manufacturing process are provided. The method includes: introducing a dehydrated hydrogen fluoride gas and a dehydrated alcohol gas into a process chamber; mixing the dehydrated hydrogen fluoride gas with the dehydrated alcohol gas to generate gaseous etchants; allowing reactions between the etchants and the wafer in the process chamber under a high pressure maintained in the process chamber to improve an etching selectivity; and pumping out reaction products from the process chamber.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: March 2, 2021
    Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
    Inventor: Zhenguo Ma
  • Patent number: 10927289
    Abstract: Provide are methods and systems for inhibiting corrosion of a metal surface. An example method comprises providing a treatment fluid comprising an aqueous carrier fluid and a polyhydroxyetheramine corrosion inhibitor; contacting the metal surface with the treatment fluid; and contacting the metal surface with a mineral acid. Another example method comprises providing a treatment fluid comprising an aqueous carrier fluid, a non-polyhydroxyetheramine corrosion inhibitor, and a polyhydroxyetheramine corrosion inhibitor intensifier; contacting the metal surface with the treatment fluid; and contacting the metal surface with an organic acid. An example system comprises a treatment fluid comprising a polyhydroxyetheramine, an acid, and an aqueous carrier fluid; mixing equipment capable of containing the treatment fluid; pumping equipment capable of pumping the treatment fluid into a wellbore; and the metal surface.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: February 23, 2021
    Assignee: HALLIBURTON ENERGY SERVICES, INC.
    Inventors: Enrique Antonio Reyes, Antonio Recio, III
  • Patent number: 10899952
    Abstract: An automotive engine coolant composition includes: a non-silicone surfactant; an anti-foaming agent containing a mineral oil and silica; and a base, in which the base includes at least one alcohol selected from the group consisting of a monohydric alcohol, a dihydric alcohol, a trihydric alcohol, and a glycol monoalkyl ether and/or water, a kinematic viscosity is 8.5 mm2/s or more at 25° C. and 2.0 mm2/s or less at 100° C., and with respect to 100 parts by mass of the coolant composition, a content of the mineral oil is 0.01 to 0.4 parts by mass and a content of the silica is 0.003 to 0.1 parts by mass.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: January 26, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yasuaki Kodama, Tomoyuki Nakano, Takato Sakurai, Kazuhito Yaeda, Yoichiro Yoshii, Yosuke Kishino, Masayuki Nagasawa, Shogo Kamenoue
  • Patent number: 10889767
    Abstract: An improved isomerization process in which the inlet temperature to the isomerization reaction zone is less than 105° C. is described. A separate reactor is provided for the decomposition of the organic chloride. The product of the decomposition of the organic chloride is sent to an isomerization reactor along with a hydrocarbon feed containing paraffins. The use of the organic chloride decomposition reactor allows the operating temperatures for the isomerization reaction zone to be reduced.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: January 12, 2021
    Assignee: UOP LLC
    Inventors: Jocelyn Daguio, Ralph C. Norton, David J. Shecterle, Patrick J. Bullen, Steven L. Krupa
  • Patent number: 10876188
    Abstract: A method of manufacturing an aluminum alloy ingot using scrap aluminum alloy in the 2xxx or 7xxx series, and a fabrication method after rolling, extrusion and/or forging of an aeronautical structure comprising the steps in the above method, and then at least one rolling, extrusion and/or forging step of the aluminum alloy ingot in the series of scrap used.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: December 29, 2020
    Assignee: CONSTELLIUM ISSOIRE
    Inventors: Alireza Arbab, Laurent Boissonnet, Jules Diawara, Pascal Hervieu, Anne Pichat
  • Patent number: 10867812
    Abstract: A system includes a chamber, an inlet valve, and a control device. The chamber is configured to perform a semiconductor process. The inlet valve is coupled to the chamber and a facility water source. The control device is coupled to the inlet valve, and configured to at least partially close the inlet valve when the chamber is idle.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventor: Su-Horng Lin
  • Patent number: 10843994
    Abstract: The invention provides a process for recovering oxalic acid used in ferrous metal pickling procedures, thereby reducing the total cost and environmental load of the pickling treatments.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: November 24, 2020
    Assignee: TAL OR ECOLOGY LTD.
    Inventors: Reuben David Schapiro, Vladimir Boiko, Lev Shapiro
  • Patent number: 10837122
    Abstract: Embodiments of the present invention generally relate to methods for removing contaminants and native oxides from substrate surfaces. The methods generally include removing contaminants disposed on the substrate surface using a plasma process, and then cleaning the substrate surface by use of a remote plasma assisted dry etch process.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: November 17, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Christopher S. Olsen, Theresa K. Guarini, Jeffrey Tobin, Lara Hawrylchak, Peter Stone, Chi Wei Lo, Saurabh Chopra
  • Patent number: 10816665
    Abstract: The invention provides a measuring system, which comprises a plurality of measuring units and a leveling unit common to the plurality of measuring units, the leveling unit has a recessed fitting portion on an upper surface, and the plurality of measuring units each has a projecting fitting portion which is engageable and disengageable with respect to the recessed fitting portion, wherein the plurality of measuring units are constituted to be attachable and detachable with respect to the leveling unit, and in a state where each of the measuring units is mounted on the leveling unit, a same object to be measured is measured respectively, an offset amount between each of the measuring units is measured, and based on the offset amount, a measurement value measured in each of the measuring units is corrected and coordinate-converted.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: October 27, 2020
    Assignee: TOPCON Corporation
    Inventors: Ken-ichiro Yoshino, Fumio Ohtomo
  • Patent number: 10809620
    Abstract: Various embodiments of systems and methods for drain line monitoring are disclosed herein. More specifically, a liquid dispense unit for a coating/developing processing system is provided herein for applying one or more liquid solutions to a substrate disposed within the liquid dispense unit. In the disclosed embodiments, a pH sensor and/or a line particle counter (LPC) is coupled to a drain line of the liquid dispense unit to monitor various parameters of the liquid waste, which is ejected from the substrate and disposed of through the drain line. In some embodiments, measurements obtained from the pH sensor may be used to optimize a develop process by detecting an endpoint of the develop process, avoiding pH shock and/or detecting excursions in the develop process. In some embodiments, measurements obtained from the LPC may additionally or alternatively be used to optimize the develop process.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: October 20, 2020
    Assignee: Tokyo Electron Limited
    Inventors: Michael Carcasi, Mark Somervell, Joshua Hooge
  • Patent number: 10790134
    Abstract: A substrate processing method includes a substrate holding step of holding a substrate by means of a substrate holder which holds the substrate horizontally with an interval upward from an upper surface of a base, a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate held by the substrate holder, a cleaning liquid supplying step of supplying a cleaning liquid so as to wash away the first processing liquid attached to the upper surface of the base, to the upper surface of the base such that the cleaning liquid on the base does not contact a lower surface of the substrate held by the substrate holder, and a removing step of removing the cleaning liquid from the upper surface of the base.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: September 29, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Taiki Hinode, Takashi Ota
  • Patent number: 10790169
    Abstract: A discharge port 31 is arranged inside a chamber 9. A circulation flow passage 50 circulates a processing liquid, while maintaining the processing liquid at a predetermined temperature. A discharge flow passage 32 is branched from a circulation flow passage 50 to guide the processing liquid to the discharge port 31. A return flow passage 33 is connected to the discharge flow passage 32 inside the chamber 9 and allows the processing liquid running through the discharge flowpassage 32 to flow back to the circulation flow passage 50.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: September 29, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Naoyuki Osada, Koji Hashimoto
  • Patent number: 10745812
    Abstract: Methods, systems and apparatuses are disclosed for treating aluminum desmutting solutions by reacting, mixing and filtering an aluminum desmutting solution flow from an aluminum desmutting solution tank and controlling the amount of copper ions in an aluminum desmutting solution tank by directing a portion of the desmutting solution from a desmutting solution tank to a treatment line, reacting a portion of the desmutting solution in the treatment line and recirculating a filtered aluminum desmutting solution to the aluminum desmutting solution tank during active desmutting operation of the aluminum desmutting solution tank.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: August 18, 2020
    Assignee: The Boeing Company
    Inventors: David L. Crump, Lance E. Succo, David Huebner, Mark R. Woodruff
  • Patent number: 10704151
    Abstract: A pickling apparatus includes a plurality of pickling tanks in which a scale of a steel plate is removed while the steel plate is advanced and sequentially dipped; an intermediate spraying unit, disposed between a pickling tank at the front end and a pickling tank at the rear end, for spraying a pickling solution onto the steel plate; and a pickling solution supply means configured to provide a pickling solution of a concentration used in the pickling tank at the rear end to the intermediate spraying unit, wherein a wringer roll disposed between the plurality of pickling tanks is removed.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: July 7, 2020
    Assignee: POSCO
    Inventor: Hyoung-Kuk Park
  • Patent number: 10622495
    Abstract: This disclosure relates to a Room Temperature Wet Chemical Growth (RTWCG) method and process of SiOX thin film coatings which can be grown on various substrates. The invention further relates to RTWCG method and process suited to grow thin films on the Si substrates used in the manufacture of silicon-based electronic and photonic (optoelectronic) device applications. The invention further relates to processes used to produce SiOX thin film layers for use as passivation layers, low reflectance layers, or high reflectance single layer coatings (SLARC) and selective emitters (SE).
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: April 14, 2020
    Assignee: SPECMAT, Inc.
    Inventors: Horia M. Faur, Maria Faur
  • Patent number: 10613442
    Abstract: The present invention is a charge complexing chemical composition that protects metal during polymer removal. The polymer coatings include crosslinked systems by chemical-amplification and photoacid generated (PAG) means as in epoxies. The system includes a solvent, a charge complexing additive, and an acid that creates a protective complex for sensitive metals during the dissolving and rinsing practice needed for processing microelectronic parts. The composition can be utilized with a method for removing partial and fully cured crosslinked coatings that originate from chemical amplification or PAG-epoxy photoimageable coatings.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: April 7, 2020
    Assignee: Merck Patent GmbH
    Inventor: John Cleaon Moore
  • Patent number: 10604850
    Abstract: A method of treating in a subterranean formation including placing a corrosion inhibitor composition into a subterranean formation, where the formation includes an acidic environment having a pH of about 5 or below, where the composition includes: an organic solvent comprising an alcohol with a flash point of at least about 75° C.; a nitrogen containing compound; an aqueous acid solution comprising HCl; and contacting a metal surface with the corrosion inhibitor composition. A corrosion inhibitor composition includes an organic solvent comprising an alcohol with a flash point of at least about 75° C.; a nitrogen containing compound; and an aqueous acid solution comprising HCl.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: March 31, 2020
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Enrique Antonio Reyes, Alyssa Lynn Lablanc, Aaron M. Beuterbaugh
  • Patent number: 10549458
    Abstract: A manufacturing method of a mold includes the steps of: providing an aluminum base in the shape of a hollow cylinder which is made of a Al—Mg—Si based aluminum alloy, the aluminum base being mechanically mirror-finished; performing a frosting treatment on a surface of the aluminum base with an aqueous solution which contains a salt of hydrogen fluoride and ammonium; thereafter, forming an inorganic material layer on the surface of the aluminum base and forming an aluminum film on the inorganic material layer, thereby forming a mold base; and alternately repeating anodization and etching on a surface of the aluminum film of the mold base, thereby forming an inverted moth-eye structure which has a plurality of micro recessed portions.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: February 4, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Takahiro Nakahara, Miho Yamada, Kiyoshi Minoura
  • Patent number: 10549386
    Abstract: A method of forming openings in a polymer layer includes positioning a layer of a material over a cavity such that a portion of the first material lies over a cavity, ablating the portion of the material at a first shape, and ablating the portion of the material at a second shape, wherein the second shape lies within the first shape. A method of forming openings in a polymer layer includes positioning a layer of a first material over a second material having a cavity such that a portion of the first material lies over the cavity, ablating the portion of the first material over the cavity at a first shape, and ablating the portion of the second material over the cavity at a second shape, wherein the second shape lies within the first shape.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: February 4, 2020
    Assignee: XEROX CORPORATION
    Inventors: Ruander Cardenas, John R. Andrews
  • Patent number: 10522341
    Abstract: Described is a post-CMP cleaning solution and methods useful to remove residue from a CMP substrate or to prevent formation of residue on a surface of a CMP substrate.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: December 31, 2019
    Assignee: Cabot Microelectronics Corporation
    Inventors: Helin Huang, Ji Cui
  • Patent number: 10494696
    Abstract: A method for recovering tin and/or tin alloy from a substrate comprising providing a substrate having tin and/or tin alloy thereon; contacting the tin and/or tin alloy with a stripping solution comprising an inorganic acid and a persulfate compound; recovering tin salt and/or tin alloy salt precipitated from the stripping solution; and recovering tin and/or tin alloy from the tin salt and/or tin alloy salt, respectively.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: December 3, 2019
    Assignee: Alpha Assembly Solution Inc.
    Inventors: Narahari Pujari, Siuli Sarkar, Bawa Singh, Daniel Goswami
  • Patent number: 10403517
    Abstract: A supply flow passage branches into a plurality of upstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis of a substrate. Hydrogen peroxide water, that is one of components of a chemical liquid (SPM), is supplied to the upstream flow passage from a component liquid flow passage. A mixing ratio changing unit including a plurality of first flow control valves and a plurality of second flow control valves independently changes mixing ratios of sulfuric acid and hydrogen peroxide water included in the chemical liquid to be discharged from the plurality of discharge ports for each of the upstream flow passages.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: September 3, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Kenji Kobayashi, Jun Sawashima, Yuta Nishimura, Akihiro Nakashima, Motoyuki Shimai, Akito Hatano
  • Patent number: 10262766
    Abstract: The present disclosure generally relates to a new process for generating germanium-68 from an irradiated target body. The process includes irradiation of the target body followed by various extraction techniques to generate the germanium-68.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: April 16, 2019
    Assignee: MALLINCKRODT NUCLEAR MEDICINE LLC
    Inventors: William C. Uhland, David Wayne Pipes, Melissa Dianne Perrigo
  • Patent number: 10156021
    Abstract: A method of producing a surface-treated steel sheet is provided. The surface-treated steel sheet includes a layer that contains a metal oxide. The method is characterized by including: dipping a steel sheet for 0.1 to 10 seconds in a treatment liquid that contains at least fluoride ions and has a pH of 2 to 5; and electrically treating by flowing a direct current between the steel sheet and an electrode in a treatment liquid to form a layer that contains a metal oxide on a surface of the steel sheet. According to the present invention, there can be provided a method of producing a surface-treated steel sheet which can enhance the interfacial adhesion with an organic resin layer when the organic resin layer is formed on the metal oxide layer.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: December 18, 2018
    Assignee: TOYO KOHAN CO., LTD.
    Inventors: Kunihiro Yoshimura, Naomi Taguchi, Satoko Fukutomi
  • Patent number: 10156012
    Abstract: There is provided a cleaning method improving cleaning efficiency in a process container after an oxygen-containing film forming process is having performed, including: (a) supplying at least a hydrogen fluoride gas into the process container; and (b) supplying an alcohol into the process container in a state where supply of the hydrogen fluoride gas into the process container is stopped, wherein (a) and (b) are continuously performed without providing an intermittent period therebetween.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: December 18, 2018
    Assignees: KOKUSAI ELECTRIC CORPORATION, CENTRAL GLASS CO., LTD.
    Inventors: Kenji Kameda, Masaya Nagato, Akiou Kikuchi, Yuta Takeda, Kunihiro Yamauchi
  • Patent number: 10153153
    Abstract: An etching fault is suppressed by use of an etching gas containing iodine heptafluoride. Provided is an attached substance removing method of removing an attached substance containing an iodine oxide attached to a component included in a chamber or a surface of a pipe connected with the chamber by use of a cleaning gas containing a fluorine-containing gas. Also provided is a dry etching method, including the steps of supplying an etching gas containing an iodine-containing gas into a chamber to perform etching on a surface of a substrate; and after the etching is performed on the surface of the substrate, removing an attached substance containing an iodine oxide attached to a component included in the chamber or a surface of a pipe connected with the chamber by use of a cleaning gas containing a fluorine-containing gas.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: December 11, 2018
    Assignee: CENTRAL GLASS COMPANY, LIMITED
    Inventors: Akiou Kikuchi, Masanori Watari, Kenji Kameda, Shin Hiyama, Yasutoshi Tsubota
  • Patent number: 10121647
    Abstract: An etching fault is suppressed by use of an etching gas containing iodine heptafluoride. Provided is an attached substance removing method of removing an attached substance containing an iodine oxide attached to a component included in a chamber or a surface of a pipe connected with the chamber by use of a cleaning gas containing a fluorine-containing gas. Also provided is a dry etching method, including the steps of supplying an etching gas containing an iodine-containing gas into a chamber to perform etching on a surface of a substrate; and after the etching is performed on the surface of the substrate, removing an attached substance containing an iodine oxide attached to a component included in the chamber or a surface of a pipe connected with the chamber by use of a cleaning gas containing a fluorine-containing gas.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: November 6, 2018
    Assignee: CENTRAL GLASS COMPANY, LIMITED
    Inventors: Akiou Kikuchi, Masanori Watari, Kenji Kameda, Shin Hiyama, Yasutoshi Tsubota
  • Patent number: 10094025
    Abstract: A mechanical component for an internal combustion engine includes a mechanical component body made of one of aluminum and aluminum alloy and used for the internal combustion engine, a nickel plating layer formed to cover a surface of a predetermined portion of the mechanical component body, and a reforming layer formed between the surface of the predetermined portion of the mechanical component body and the nickel plating layer.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: October 9, 2018
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Hajime Minaki, Hiroaki Sasayama, Akihiro Okamoto, Takuya Niimi
  • Patent number: 10034387
    Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: July 24, 2018
    Assignee: Entegris, Inc.
    Inventors: André Brosseau, Svitlana Grigorenko, Ping Jiang, Michael B. Korzenski
  • Patent number: 10030216
    Abstract: Systems and methods for formulating and utilizing chemical gel formulations, particularly with respect to cooling tower fill cleaning operations.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: July 24, 2018
    Assignee: Crossford International, LLC
    Inventors: Timothy J. Kane, Joseph J. Franzino, Pete Gentile, Mark Rothenhausen, Ray Field
  • Patent number: 10015876
    Abstract: The object of the present invention is to provide a printed circuit board that improves the heat radiating effect as the entire printed circuit board and a manufacturing method for such a printed circuit board.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: July 3, 2018
    Assignee: TANAZAWA HAKKOSHA CO., LTD.
    Inventors: Keiichiro Yamamoto, Kazuhiro Sasamoto
  • Patent number: 10012455
    Abstract: A system for descaling heat exchanger surfaces using a varying concentration of either an acidic or alkaline solution, selecting an optimum pH value for descaling a heat exchanger according to the level of cleaning the heat exchanger requires, monitoring pH value of descaling solution during circulation through a heat exchanger, and adding chemical solution to achieve coincidence of optimum and monitored pH values during descaling operation.
    Type: Grant
    Filed: January 2, 2015
    Date of Patent: July 3, 2018
    Inventors: Joseph J. Franzino, George M Cruz
  • Patent number: 10007184
    Abstract: Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: June 26, 2018
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Li Cui, Charlotte A. Cutler, Suzanne M. Coley, Owendi Ongayi, Christopher P. Sullivan, Paul J. LaBeaume, Shintaro Yamada, Mingqi Li, James F. Cameron
  • Patent number: 9937602
    Abstract: In a substrate processing method according to an embodiment, a surface of an object to be polished disposed on a substrate is polished on a polishing pad supplied with slurry. After the polishing process using the slurry, the surface of the object to be polished on the polishing pad is polished, while supplying water on the polishing pad where a residue including the slurry or a sludge of the polishing pad adhered. After the polishing process using the water, the surface of the object to be polished is cleaned on the polishing pad by supplying rinse liquid on the polishing pad.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: April 10, 2018
    Assignee: Toshiba Memory Corporation
    Inventors: Yosuke Otsuka, Masako Kodera, Yukiteru Matsui
  • Patent number: 9893016
    Abstract: A multilayer wiring board includes a main wiring board including insulation layers, first via conductors formed in the insulation layers, and a first conductive layer including first mounting pads such that the first mounting pads are positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board, and a wiring structure body mounted on the main wiring board such that the wiring structure body is positioned in an outermost insulation layer of the insulation layers, the wiring structure body including a second conductive layer which includes second mounting pads such that the second mounting pads are positioned to connect to the first electronic component and the second electronic component mounted on the main wiring board. The first via conductors are formed such that the first via conductors have diameters which increase in a same direction.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: February 13, 2018
    Assignee: IBIDEN CO., LTD.
    Inventors: Hajime Sakamoto, Yoshinori Shizuno, Shigeru Yamada, Takashi Kariya
  • Patent number: 9889631
    Abstract: The present disclosure relates generally to strip process for removing a coating from a substrate comprising the steps of: providing a base alloy and a MCrAlY coating deposited over the base alloy substrate; and removing the MCrAlY coating by bringing the MCrAlY coating in contact with an acid solution comprising nitric acid, phosphoric acid and ammonium bifluoride in an aqueous solution, and maintaining the acid solution contact for sufficient time and at sufficient temperature to permit the coating to be stripped from the base alloy substrate.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: February 13, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Eric W. Stratton, Michael J. Minor