Abstract: A system and methods are provided for removing core elements of cast components. In one embodiment, a method includes controlling a first high temperature autoclave cycle for a cast component in a vessel with a first solution concentration to remove at least a first portion of core elements, wherein the first solution concentration, temperature and pressure in the vessel are controlled to expose one or more casting pins in the cast component. The method may also include controlling a second high temperature autoclave cycle for the cast component in the vessel with second solution concentration, wherein the second solution concentration, temperature and pressure in the vessel during the second high temperature autoclave cycle are controlled to loosen one or more of the casting pins from the cast component, and controlling one or more low temperature autoclave cycles to remove core and casting pins from the cast component.

Abstract: There is provided a method for manufacturing a galvanized steel sheet that has low sliding resistance in press forming and good degreasing property even under severe alkaline degreasing treatment conditions due to low temperature and short process line length. An oxide layer formed on the surface of a galvanized steel sheet is subjected to neutralization treatment using an alkaline aqueous solution containing 0.01 g/L or more of P ions and 0.01 g/L or more of colloid dispersed particles, wherein the alkaline aqueous solution preferably contains at least one phosphorus compound selected from phosphates, pyrophosphates, and triphosphates and at least one type of colloid dispersed particles selected from Ti, silica, Pt, Pd, Zr, Ag, Cu, Au, and Mg.

Abstract: A conducting package structure includes a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected to the substrate and a patterned second surface opposite to the first surface.

Abstract: The present disclosure relates generally to the field of electroplating and electroless plating. More specifically, the present disclosure relates to plating solutions and plating removal/stripping solutions for stripping zinc/nickel alloy plating from substrates.

Abstract: A method for passivating substrate surfaces by removing surface contaminants. The method can remove impurities and components from the surface of a substrate to prevent corrosion and undesirable chemical activity. The method further provides an optimized surface for the application of protective barrier coatings. The method provides significant cost savings due to increased life of substrate, reduced maintenance, and superior barrier coating performance.

Abstract: The present invention relates to regulation of the p H of a liquefaction process. Presented is a method for treatment of a biomass feedstock wherein the biomass feedstock is subjected to liquefaction, at a p H of at most 4, by treatment with hot compressed liquid water (HCW) at subcritical and/or supercritical conditions to improve the conversion efficiency. The present invention is also directed to quenching of a liquefaction process according to above, preventing, minimizing or eliminating clogging and/or fouling of sticky biomass components in process equipment during processing as according to above, and to the use of additives in a biomass liquefaction process.

Abstract: A method of servicing a wellbore in a subterranean formation comprising preparing a wellbore servicing fluid comprising an amino polyether multicarboxylic acid chelating agent and/or an amino polyether multicarboxylic acid chelating agent precursor, and an aqueous base fluid, and contacting the wellbore servicing fluid with scale deposits on a surface in the wellbore and/or subterranean formation. A method of servicing a wellbore in a subterranean formation comprising preparing a wellbore servicing fluid comprising an amino polyether multicarboxylic chelating agent precursor and an aqueous base fluid, and contacting the wellbore servicing fluid with scale deposits on a surface in the wellbore and/or subterranean formation. A scale-removing wellbore servicing fluid comprising an amino polyether multicarboxylic acid chelating agent and/or an amino polyether multicarboxylic acid chelating agent precursor, and an aqueous base fluid.

Abstract: Contaminant is prevented from migrating from a gripping hand and contaminating a substrate case after cleaning the substrate case. The apparatus cleans, in a state with no substrate, a substrate case C which holds a substrate, provided with a booth 10 which forms a clean space, provided with cleaning tanks 40, 50 which hold and clean the parts of the substrate case C in a separated status in the booth 10, provided with a conveyance mechanism 60 which grips part of the substrate case C by a gripping hand 70 and conveys them to and from the cleaning tanks 40, 50, making the gripping hand 70 stand by at a standby position Q in the booth 10 during cleaning of the substrate case C, and provided with a cleaning means 80 for cleaning the gripping hand 70 during cleaning of the parts. The cleaning means 80 is provided with a spray nozzle 81 which sprays a gas toward the gripping hand 70 and an exhaust fan 82 which exhausts the gas from the inside of the booth 10.

Abstract: A method of cleaning and a system and method of determining the effectiveness of a cleaning process for an HVAC system including a heat exchanger having a coil matrix. The coil matrix includes a plurality of rows of heat exchanging coils in which each adjacent row of coils is offset. The plurality of rows define channels extending through the coil matrix between an upstream side and a downstream side. The heat exchanger cleaning method includes applying a cleaning solution and a wet steam mixture directed into the channels. The effectiveness of the cleaning method is determine by a system and method which measures various operating parameters at the inlet side and outlet side of the heat exchanger both before and after the cleaning process. The system and method calculate a SEER rating using the total amount of heat removed by the HVAC system and the total power usage of the HVAC system.

Abstract: In a fabrication method of a silicon carbide semiconductor element including a drift layer playing a role of retaining a high withstand voltage on a front side of a semiconductor substrate of silicon carbide and including an ohmic electrode on a backside, dicing is added to form at least one dicing line in an element active region on a surface of the semiconductor substrate on a side opposite of the drift layer before forming the ohmic electrode on the backside of the semiconductor substrate. Thus, a silicon carbide semiconductor element and fabrication method thereof is provided such that even if the semiconductor substrate is made thinner to reduce the on-resistance, the strength of the substrate can be maintained and cracking of the wafer during wafer processing can be reduced.

Abstract: A composition comprising a base, nonylphenol, at least one quaternary ammonium compound, and glycol ether EB is provided in a method for solubilizing calcium carbonate in an aqueous suspension or dispersion of calcium carbonate.

Abstract: A method of detecting and measuring the presence of ammonium fluoride in a buffered oxide etchant (“BOE”) composition is provided.

Abstract: A method and low pH compositions for removing bulk and/or hardened photoresist material from microelectronic devices have been developed. The low pH compositions include sulfuric acid and at least one phosphorus-containing acid. The low pH compositions effectively remove the hardened photoresist material while not damaging the underlying silicon-containing layer(s) or the metal gate materials.

Abstract: Provided are compositions and methods for making a variety of products. The methods involve mixing sucker ring teeth (SRT) protein and a plasticizer or a solvent to obtain a mixture of the SRT protein and the plasticizer. When the SRT is mixed with a plasticizer it is heated to between 32° C. and 195° C. to obtain an SRT protein melt. The melt is used to form a wide variety of products. When the SRT is mixed with a solvent, such as an organic solvent or an aqueous solvent, a solution of the SRT protein is formed, and is subsequently used to forming a product from the solution, wherein the product contains SRT protein.

Abstract: Described herein is a method for removing coke deposits in radiant tubes of an olefin cracking furnace and removing accumulated spalled coke from one or more outlet elbows of the olefin cracking furnace without performing a cold shutdown of the furnace.

Abstract: Blockages of turbomachine cooling circuit cooling holes resulting from coating processes can be removed by introducing a cleaning agent into the cooling circuit. The cooling circuit can be connected to a cleaning agent supply under pressure, adding force on the blockage to chemical action by the cleaning agent. The cleaning agent is chemically reactive with the coating material and substantially chemically non-reactive with the underlying material of the cooling circuit and other parts of the turbomachine. A neutralization agent can also be introduced to reduce toxicity and/or action of the cleaning agent. A turbomachine cooling hole cleaning method includes introducing a cleaning agent into a cooling circuit of a turbomachine part, pressurizing the cleaning agent in the cooling circuit until a first defined condition is met, and introducing a neutralization agent to the turbomachine part while the cleaning agent is applied to the cooling circuit.

Abstract: Systems and methods for safe on-line pigging decoking of a coker furnace tubes and which also permits on-line spalling operations.

Abstract: A method of removing a ceramic thermal barrier coating system (18). Laser energy (20) is applied to the thermal barrier coating system in the presence of a flux material (22) in order to form a melt (26). Upon removal of the energy, the melt solidifies to from a layer of slag (28) which is more loosely adhered to the underlying metallic substrate (12) than the original thermal barrier coating system. The slag is then broken and released from the substrate with a mechanical process such as grit blasting (30). Sufficient energy may be applied to melt an entire depth of the coating system along with a thin layer (34) of the substrate, thereby forming a refreshed surface (36) on the substrate upon resolidification.

Abstract: Provided are a washing device and a washing method that can remove burnt body fluid adhered to a medical instrument. The washing device can remove the burned component which adhered to a tip end portion of a surgical instrument by applying a physical force caused by the pressure of cleaning agent-dissolved water ejected from a cleaning nozzle member in addition to a chemical force caused by a cleaning agent contained in the cleaning agent-dissolved water.

Abstract: A contoured sterilizing element is configured to conform to the outer and inner surfaces of a working end-site of a medical device such as a catheter hub, luer connector, luer component, needleless access site, and/or access port. The sterilizing element is made from absorbent material and can be pre-moistened or impregnated with an anti-pathogenic agent. The sterilizing element can be contained within a housing that is easily gripped and opened in one hand by the user. The sterilizing element is configured to wipe debris from and to sterilize and/or dry a working end-site of medical device, using a wiping, twisting, dabbing, push/pull, and/or screwing motion around all of the surface aspects of the device to be sterilized.

Abstract: In certain embodiments the metal liftoff tool comprises an immersion tank for receiving a wafer cassette with wafers therein, the immersion tank including an inner weir, a lifting and lowering mechanism capable of raising and lowering the wafer cassette while submerged in fluid in the immersion tank, low pressure high velocity primary spray jets for stripping the metal, the primary spray jets positioned at opposing sides of the immersion tank parallel to the wafer surfaces planes, and secondary spray jets for pressure equalization force, positioned at the bottom of the immersion tank. A wafer lift insert is positioned at the bottom of the immersion tank to receive and periodically lift the wafers within the cassette.

Abstract: A method of forming a dense oxide coating on an aluminum component of semiconductor processing equipment comprises cold spraying a layer of pure aluminum on a surface of the aluminum component to a predetermined thickness. A dense oxide coating is then formed on the layer of pure aluminum using a plasma electrolytic oxidation process, wherein the plasma electrolytic oxidation process causes the layer of pure aluminum to undergo microplasmic discharges, thus forming the dense oxide coating on the layer of pure aluminum on the surface of the aluminum component.

Abstract: Blockages of turbomachine cooling circuit cooling holes resulting from coating processes can be removed by introducing a cleaning agent into the cooling circuit. The cooling circuit can be connected to a cleaning agent supply under pressure, adding force on the blockage to chemical action by the cleaning agent. The cleaning agent is chemically reactive with the coating material and substantially chemically non-reactive with the underlying material of the cooling circuit and other parts of the turbomachine. A neutralization agent can also be introduced to reduce toxicity and/or action of the cleaning agent.

Abstract: The present invention provides a metal stripping additive, composition containing the same, and method for stripping metal by using the composition. The metal stripping additive comprises a phosphate, a carbonate, and a component selected from at least one of citric acid or a derivative thereof, oxalate or a derivative thereof, malate or a derivative thereof. The metal stripping additive is used with nitric acid as the metal stripping composition of the present invention. The present method has advantages of being capable of stripping various metals, low corrosion, low toxicity, and being applicable under ambient temperature.

Abstract: The present invention provides an ultraviolet light based cleansing method and cleansing device. The method includes: (1) irradiating a substrate to be cleansed with ultraviolet light and controlling output energy of the ultraviolet light in order to control photon energy received by TFT component patterns formed on the substrate to be cleansed within an irradiation time period to be less than electron excitation energy that breaks down TFT component patterns; (2) cleansing the substrate to be cleansed with an alkaline solution; (3) cleansing the substrate to be cleansed with water/gas dual-fluid; (4) cleansing the substrate to be cleansed with deionized water; (5) drying the substrate to be cleansed with an air knife; and (6) subjecting the substrate to be cleansed to dehydration and drying to complete the cleansing operation, thereby improving product yield rate and cleanness.

Abstract: Methods are provided which include a method of cleaning, sanitizing, or disinfecting, wherein the method comprises: contacting a soiled substrate with a cleaning, sanitizing, or disinfecting composition, such that at least a portion of the soil is removed from the substrate; wherein the cleaning, sanitizing, or disinfecting composition consists essentially of one or more food grade agents or a salt thereof; and wherein the method is effluent neutral.

Abstract: Methods for controlled isotropic etching of layers of silicon oxide and germanium oxide with atomic scale fidelity are provided. The methods make use of a reaction of anhydrous HF with an activated surface of an oxide, with an emphasis on removal of water generated in the reaction. In certain embodiments the oxide surface is first modified by adsorbing an OH-containing species (e.g., an alcohol) or by forming OH bonds using a hydrogen-containing plasma. The activated oxide is then etched by a separately introduced anhydrous HF, while the water generated in the reaction is removed from the surface of the substrate as the reaction proceeds, or at any time during or after the reaction. These methods may be used in interconnect pre-clean applications, gate dielectric processing, manufacturing of memory devices, or any other applications where accurate removal of one or multiple atomic layers of material is desired.

Abstract: A rinsing liquid (DIW) is discharged from a rinsing liquid discharge port formed in a blocking member to perform rinsing processing to a substrate surface while a nitrogen gas is supplied into a clearance space, and a liquid mixture (IPA+DIW) is discharged from a liquid mixture discharge port formed in the blocking member to replace the rinsing liquid adhering to the substrate surface with the liquid mixture while the nitrogen gas is supplied into the clearance space. Thus, an increase of the dissolved oxygen concentration of the liquid mixture can be suppressed upon replacing the rinsing liquid adhering to the substrate surface with the liquid mixture, which makes it possible to securely prevent from forming an oxide film or generating watermarks on the substrate surface.

Abstract: The present invention provides a soil cleaning method. The soil cleaning method is characterized in that after a pre-treatment step of mixing a dehydrating agent in soil to reduce a water content of the soil to 10 mass % or less is performed, a magnetic separation step of feeding the soil whose water content is reduced to 10 mass % or less in the pre-treatment step, to a dry magnetic separator to separate and remove a contaminant in coarse soil as magnetically attracted matter is performed. By bringing the soil into a dry state to separate the soil into magnetically attracted matter and magnetically unattracted matter and collecting the heavily contaminated magnetically attracted matter, it is possible to facilitate separating fine soil from contaminated soil, which makes it possible to easily reduce the content of the contaminant in the coarse soil.

Abstract: A method of cleaning and a system and method of determining the effectiveness of a cleaning process for an HVAC system including a heat exchanger having a coil matrix. The coil matrix includes a plurality of rows of heat exchanging coils in which each adjacent row of coils is offset. The plurality of rows define channels extending through the coil matrix between an upstream side and a downstream side. The heat exchanger cleaning method includes applying a cleaning solution and a wet steam mixture directed into the channels. The effectiveness of the cleaning method is determine by a system and method which measures various operating parameters at the inlet side and outlet side of the heat exchanger both before and after the cleaning process. The system and method calculate a SEER rating using the total amount of heat removed by the HVAC system and the total power usage of the HVAC system.

Abstract: Parts of a substrate case can be separated and cleaned inside a tank body while making the cleaning solution evenly reach it. A substrate case C which is provided with a base Mb and shell Ms and holds a substrate inside is cleaned in a state with no substrate.

Abstract: Contaminant which sticks to an outer pod which is exposed to the outside air is prevented from contaminating an inner pod and the two can be cleaned so the cleaning precision can be improved. A substrate case C which is provided with an inner pod N which holds a substrate at the inside and an outer pod M which holds the inner pod N at the inside is cleaned in a state with no substrate. A booth 10 which forms a clean space is provided. Inside the booth 1, a first cleaning tank 40 which cleans the parts of the outer base Mb and outer shell Ms of the outer pod M in a separated state and a second cleaning tank 50 which holds and cleans the parts of the inner base Nb and inner shell Ns of the inner pod N in a separated state are provided. A conveyance mechanism is provided with conveys these parts to the corresponding first cleaning tank 40 and second cleaning tank 50.

Abstract: Movement from a carrying table to a support table can be prevented from becoming complicated and made simpler and positioning on the support table can be easily performed.

Abstract: A method of manufacturing a display device that includes: performing a surface treatment on at least one of two opposing surfaces of a carrier substrate and a mother substrate; bonding the carrier substrate and the mother substrate; performing a thin film formation process on the mother substrate; and separating the carrier substrate and the mother substrate. The thin film formation process includes a heat treatment operation, the surface treatment includes using an inorganic acid or an organic acid, and the surface treatment controls a content of —OH, —OH2+, and —O? groups of the at least one treated surface.

Abstract: In an apparatus and method for treating a wafer-shaped article, a spin chuck is provided for holding a wafer-shaped article in a predetermined orientation wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A heating assembly comprising at least one infrared heater is mounted above the upper surface of the spin chuck and below a wafer-shaped article when mounted on the spin chuck. The heating assembly is stationary in relation to rotation of the spin chuck.

Abstract: A cutting method for cutting by a cutting blade a workpiece which includes metal at least in a predetermined cutting position. The cutting method includes a cutting step of cutting by the cutting blade the predetermined cutting position of the workpiece while supplying a cutting fluid, containing an organic acid and an oxidizing agent, to a processing point at which the cutting blade cuts into the workpiece.

Abstract: A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of amine and ammonium-containing compounds, e.g., quaternary ammonium bases. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.

Abstract: Provided herein is a method of reducing a microbial infection of a heparinized surface wherein heparin precipitation is reduced as compared to a control. In some embodiments a composition comprising ethanol and isopropanol is applied to the surface. In other embodiments, two or more ethanol compositions are applied and removed sequentially from the surface prior to contacting the surface with a biological fluid, tissue or vessel, wherein the composition in each successive administration comprises an increased amount of ethanol. Also provided is a method of reducing a microbial infection of a surface comprising applying a mucilage extract from an Opuntia ficus indica species to the surface.

Abstract: There is provided a substrate processing apparatus configured to process a substrate in a processing space by supplying a gas into the processing space through a shower head as a gas dispersion mechanism, including: a gas supply pipe connected to the shower head; a gas exhaust pipe connected to the shower head; and a cleaning gas supply system connected to the gas supply pipe and the gas exhaust pipe and configured to supply a cleaning gas into the shower head from both of the gas supply pipe and the gas exhaust pipe.

Abstract: A method for manufacturing a fuel contacting component that facilitates reducing coke formation on at least one surface of the fuel contacting component is disclosed herein. The method includes applying a slurry composition including a powder including aluminum to the component surface, wherein the fuel contacting component is formed by an additive manufacturing process. The slurry composition is heat treated to diffuse the aluminum into the component surface. The heat treatment comprises forming a diffusion aluminide coating on the component surface, wherein the diffusion coating comprises a diffusion sublayer formed on the component surface and an additive sublayer formed on the diffusion sublayer. The method further comprises removing the additive sublayer of the diffusion aluminide coating with at least one aqueous solution such that the diffusion sublayer and the component surface are substantially unaffected, wherein the diffusion layer facilitates preventing coke formation on component surface.

Abstract: [Purpose] To provide a cleaning liquid composition that has excellent removability for metallic impurities and particulates, does not cause corrosion of Cu, and can clean a semiconductor substrate having copper wiring in a production process for an electronic device such as a semiconductor device. [Solution means] A cleaning liquid composition for cleaning a semiconductor substrate having copper wiring, the cleaning liquid composition containing one or more types of basic compound containing no metal, and one or more types of phosphonic acid-based chelating agent, and having a hydrogen ion concentration (pH) of 8 to 10.

Abstract: A method for releasing a diaphragm of a micro-electro-mechanical systems (MEMS) device at a stage of semi-finished product. The method includes pre-wetting the MEMS device in a pre-wetting solution to at least pre-wet a sidewall surface of a cavity of the MEMS device. Then, a wetting process after the step of pre-wetting the MEMS device is performed to etch a dielectric material of a dielectric layer for holding the diaphragm, wherein a sensing portion of the diaphragm is released from the dielectric layer.

Abstract: Continuous extraction units are constructed having a plurality of extraction chambers containing extractable material. Without disruption of total fluid flow in the unit: an extraction chamber completely depleted of extract can be evacuated of solvent and replaced with an extraction chamber containing fresh extractable material. The extract is continuously separated from the solvent in an expansion chamber where it is continuously or periodically removed from the unit. All solvent can be retained within the unit. One or more compressors can be used to circulate the fluid through the extraction chambers, the expansion chamber, and a condenser, where the expansion chamber and the condenser can be coupled as a heat exchanger.

Abstract: The present invention relates to a method for chemically treating the surface condition of a silicon substrate for the roughness contrast characterized in that it comprises at least two successive treatment cycles, with each treatment cycle comprising a first step including placing in contact the silicon substrate with a first solution containing water diluted hydrofluoric (HF) acid and then a second step carried out at a temperature of less than 40° C., comprising placing in contact the silicon layer with a second solution containing water (H2O) diluted ammonium hydroxide (NH4OH) and hydrogen peroxide (H2O2), in order to obtain a roughness of less than 0.100 nanometer on a 1 ?m×1 ?m area upon completion of the treatment cycles. The invention will be applied in the field of microelectronics for the production of transistors, of surfaces for photovoltaic panels or for direct molecular bonding.

Abstract: An apparatus for removing a defect according to the embodiment includes an image processing part for observing a surface of a substrate; a layer forming part for forming a layer on the surface of the substrate; and a humidity controlling part for controlling humidity in a chamber in which the substrate is placed. A method for removing a defect according to the embodiment includes detecting the defect on a surface of a substrate; forming an oxide layer by oxidizing the defect; and removing the oxide layer. A method for removing a defect according to another embodiment includes forming an oxide layer on an entire surface of a substrate; and removing the oxide layer to remove the defect.

Abstract: Foundries utilize quartz foundry sand and generate waste foundry sand as a by-product. Frac sand exists with other components within the waste foundry sand. A configuration of machinery processing a flow of quartz waste foundry sand into frac sand includes a screening device separating the flow and providing the frac sand.

Abstract: A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced.

Abstract: The present invention provides a Stirling engine capable of effectively recovering heat from exhaust gas flowing through a flue 42, and capable of connecting a heating portion 10 and a regeneration portion 5 with each other through an operation gas tube without providing a flow passage separating portion 110, and as the removing mode, number of revolutions of the Stirling engine is reduced, an operation of the Stirling engine is stopped, an amount of generated electricity at the Stirling engine is reduced, or the Stirling engine is reversely rotated.

Abstract: A method of removing a residue from a surface, including applying to the surface a composition including (a) a quaternary ammonium hydroxide having a general formula (I): as defined herein, and (b) a dipolar aprotic solvent substantially free of water; and removing at least a substantial portion of the residue from the surface.

Abstract: Sensing technology methods related thereto for determining cut through of bone and a depth of penetration of a working portion of a surgical instrument (e.g., an oscillating saw blade in a cut). A first sensor outputs a first signal representative of a displacement of the cutting edge of the saw blade in the cut. A second sensor outputs a second signal representative of a force applied to the cutting edge of the saw blade. As such, monitoring the first and/or second sensor may allow for the saw to be stopped upon completion of a cut (e.g., when the saw passes completely through a medium to be cut or upon reaching a predetermined depth for the cut).