Including Steam, Gaseous Agent Or Temperature Feature Patents (Class 134/30)
  • Patent number: 10920263
    Abstract: The invention relates to methods, compositions and kits for determining the cleanness of a surface. Described herein is a kit for determining the cleanness of a surface comprising an enzymatic solution comprising catalase; and a developer solution comprising hydrogen peroxide. Described also is a method for determining the cleanness of a surface comprising: applying on a zone of a surface to be cleaned an enzymatic solution comprising catalase and letting it dry; after cleaning said surface, applying on said zone a developer solution comprising hydrogen peroxide; and detecting a catalytic reaction between remaining catalase and hydrogen peroxide, wherein presence of a catalytic reaction is indicative of a surface not properly cleaned. Also provided are specific enzymatic solutions and developer solutions for the kits and methods.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: February 16, 2021
    Assignee: Sani-Marc Inc.
    Inventors: Dominic Desrosiers, Patrick Marchand
  • Patent number: 10829091
    Abstract: A system includes a processor and a memory. The memory stores instructions executable by the processor to detect an occlusion on a surface in a vehicle sensor optical path based on a segmentation of sensor image data, and to select a cleaning plan for the surface based on the detected occlusion, map data, and vehicle route data.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: November 10, 2020
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: David Michael Herman, Sunil Patil, Venkatesh Krishnan
  • Patent number: 10792711
    Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: October 6, 2020
    Assignee: Tokyo Electron Limited
    Inventors: Meitoku Aibara, Yuki Yoshida, Hisashi Kawano, Masami Yamashita, Itaru Kanno, Kenji Mochida, Motoyuki Shima
  • Patent number: 10784126
    Abstract: A substrate processing method includes a substrate holding step of holding a substrate horizontally, a hydrophobic agent supplying step of supplying to an upper surface of the substrate a hydrophobic agent which is a liquid for hydrophobizing the upper surface of the substrate, a low surface-tension liquid supplying step of supplying the low surface-tension liquid to the upper surface of the substrate in order to replace the hydrophobic agent on the substrate by a low surface-tension liquid lower in surface tension than water, and a humidity adjusting step of adjusting humidity of the atmosphere in contact with a liquid film on the substrate such that the humidity of the atmosphere in contact with a liquid film on the substrate in the hydrophobic agent supplying step reaches a first humidity and the humidity of the atmosphere in contact with a liquid film on the substrate in the low surface-tension liquid supplying step reaches a second humidity which is humidity lower than the first humidity.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: September 22, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Taiki Hinode, Sadamu Fujii
  • Patent number: 10755950
    Abstract: In a substrate processing apparatus, a cup part is moved in an up-down direction to cause a cup exhaust port to selectively overlap a first chamber exhaust port or a second chamber exhaust port. In the state in which the cup exhaust port overlaps the first chamber exhaust port, gas in the cup part is discharged through the cup exhaust port and the first chamber exhaust port by a first exhaust mechanism. In the state in which the cup exhaust port overlaps the second chamber exhaust port, the gas in the cup part is discharged through the cup exhaust port and the second chamber exhaust port by a second exhaust mechanism. In this way, an exhaust mechanism for exhausting gas from the cup part can be easily switched between the first exhaust mechanism and the second exhaust mechanism.
    Type: Grant
    Filed: January 7, 2016
    Date of Patent: August 25, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventor: Hitoshi Nakai
  • Patent number: 10727042
    Abstract: A liquid processing method can remove pure water existing within a pattern of a substrate and replace the pure water with a solvent rapidly. The liquid processing method of supplying the pure water onto the substrate, which is horizontally held and has the pattern formed on a surface thereof, and drying the substrate includes a pure water supplying process of supplying the pure water onto the surface of the substrate; a heated solvent supplying process of supplying, after the pure water supplying process, the solvent in a liquid state, which is heated to a temperature equal to or higher than a boiling point of water, onto the surface of the substrate on which the pure water exists; and a removing process of drying the substrate by removing the solvent form the surface of the substrate.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: July 28, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Mitsunori Nakamori, Yosuke Kawabuchi, Takuro Masuzumi, Koji Yamashita, Shozou Maeda
  • Patent number: 10720320
    Abstract: A substrate processing method including a center portion discharging step of discharging a low-surface-tension liquid from a first low-surface-tension liquid nozzle disposed above a substrate toward the center portion of an upper surface, an inert gas supplying step of supplying inert gas to above the substrate in parallel with the center portion discharging step in order to form a gas flow flowing along the upper surface, and a peripheral edge portion discharging and supplying step of discharging the low-surface-tension liquid from a second low-surface-tension liquid nozzle disposed above the substrate toward a peripheral edge portion of the upper surface in parallel with the center portion discharging step and the inert gas supplying step.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: July 21, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Tetsuya Emoto, Atsuro Eitoku, Tomomi Iwata, Akihiko Taki
  • Patent number: 10703342
    Abstract: A system includes a computer programmed to actuate a first nozzle to emit air continuously at a camera, and actuate a second nozzle to simultaneously emit air intermittently at a precipitation sensor. The system may include a camera, a precipitation sensor coupled to the camera, the first nozzle aimed at the camera, the second nozzle aimed at the precipitation sensor, and the computer in communication with the first and second nozzles.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: July 7, 2020
    Assignee: Ford Global Technologies, LLC
    Inventor: David Schmidt
  • Patent number: 10672628
    Abstract: An apparatus for drying of wet substrates in a post CMP cleaning apparatus is provided. The apparatus provides a waterfall or shallow reservoir of rinsing solution, such as DIW, through which a substrate may be lifted. A solvent vapor may be provided at the rinsing solution interface on the substrate, such as in a Marangoni process. In certain embodiments, the volume of solution through which the substrate is lifted is reduced, which may provide for reduced or eliminated particle reattachment to the substrate.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: June 2, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Brian J. Brown
  • Patent number: 10651060
    Abstract: A substrate treating method dries a substrate on a surface of which a predetermined pattern is formed. The substrate treating method includes: a washing step of washing the substrate by immersing the substrate into a washing liquid after the washing liquid is stored into the treating tank in a sealed chamber; a decompression step of decompressing an inside of the chamber; a lifting step of lifting the substrate from the washing liquid stored in the treating tank; a liquid discharge step of discharging the washing liquid from the treating tank; and a hydrophobing step of replacing an atmosphere in the chamber with a hydrophobic agent and performing a hydrophobing treatment on the surface of the substrate.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: May 12, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Yuji Yamaguchi, Masahiro Kimura
  • Patent number: 10651029
    Abstract: The controller is programmed to cause a low-surface-tension liquid supply unit to supply a liquid film of a low-surface-tension liquid to a front surface of a substrate so as to form a liquid film of the low-surface-tension liquid. The controller is programmed to control the substrate rotating unit and the inert gas supply unit so that an inert gas is supplied toward the rotational center position while rotating the substrate, thereby forming an opening spreading from the rotational center position to be formed in the liquid film, and enlarging the opening in a direction away from the rotational center position, and to control the landing-position changing unit to change the landing position of the low-surface-tension liquid to at least two positions except the rotational center position in accordance with enlargement of the opening so that the landing position is placed outside the peripheral edge of the opening.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: May 12, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Hiroaki Takahashi, Kazunori Fujikawa, Tomonori Kojimaru, Tomomasa Ishida, Ayumi Higuchi, Naozumi Fujiwara, Kana Komori, Shota Iwahata
  • Patent number: 10622470
    Abstract: A process of forming a semiconductor device primarily made of nitride semiconductor materials is disclosed. The process includes steps of: (a) growing a semiconductor stack including a channel layer and a barrier layer sequentially on a substrate, where the channel layer is made of gallium nitride (GaN); (b) patterning a mask on the barrier layer; (c) etching a portion of the barrier layer and a portion of the channel layer with the mask to form a recess in the semiconductor stack; and (d) growing a contact layer selectively within the recess with nitrogen (N2) used as a carrier gas at a maximum temperature of 1000° C.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: April 14, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Isao Makabe
  • Patent number: 10549322
    Abstract: A second liquid film of the second processing liquid covers an upper surface of the first liquid film of the first processing liquid, on the upper surface of the substrate. In the substrate processing apparatus, extraneous matters on the upper surface of the substrate are removed from the upper surface of the substrate and moved toward the inside of the second liquid film by the first processing liquid which is vaporized between the second liquid film and the substrate by performing heating of the first liquid film at a temperature not lower than the boiling point of the first processing liquid and lower than the boiling point of the second processing liquid. It is thereby possible to suitably remove the extraneous matters from the substrate while suppressing any damage on the upper surface of the substrate.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: February 4, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventor: Masayuki Otsuji
  • Patent number: 10157754
    Abstract: A liquid knife cleaning device is provided, and it includes a splash shield; a liquid knife, which is located under the splash shield; an oblique baffle, which is located between the splash shield and the liquid knife, and a lower side of which is fixedly bonded to the top of a blade of the liquid knife. The oblique baffle can act to isolate the liquid knife and the substrate on the delivery roll from a majority of water vapor, and droplets dripping on the oblique baffle can flow down along a slope of the oblique baffle, and will not drip on the substrate that has not been rinsed by the liquid knife. Effects of droplets on the uniformity of the substrate can be greatly reduced by the present technique, thereby enhancing the product quality.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: December 18, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Dengtao Li, Jaeyun Jung, Shikai Wang, Dongseob Kim, Yadong Xu, Xuanqi Liang, Huadong Wang
  • Patent number: 9768011
    Abstract: The inventive substrate treatment method includes: an organic solvent supplying step of supplying an organic solvent having a smaller surface tension than a rinse liquid to the upper surface of a substrate so that rinse liquid adhering to the upper surface of the substrate is replaced with the organic solvent; a higher temperature maintaining step of maintaining the upper surface of the substrate at a predetermined temperature higher than the boiling point of the organic solvent to thereby form a gas film of the organic solvent on the entire upper surface of the substrate including the gap of the minute pattern and to form a liquid film of the organic solvent on the gas film, the higher temperature maintaining step being performed after the organic solvent supplying step is started; and an organic solvent removing step of removing the organic solvent liquid film from the upper surface of the substrate.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: September 19, 2017
    Assignee: SCREEN HOLDINGS CO., LTD.
    Inventor: Manabu Okutani
  • Patent number: 9753371
    Abstract: An edge bead removal apparatus is provided. The edge bead removal apparatus includes a clamping unit configured to clamp a cylindrical reticle and cause the cylindrical reticle to incline with a pre-determined angle and to rotate around a central axis. The edge bead removal apparatus also includes an edge bead removal solvent nozzle configured to spray an edge bead removal solvent to remove edge beads on both edges of the cylindrical reticle.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: September 5, 2017
    Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
    Inventors: Yang Liu, Qiang Wu
  • Patent number: 9728428
    Abstract: An apparatus for drying of wet substrates in a post CMP cleaning apparatus is provided. The apparatus provides a waterfall or shallow reservoir of rinsing solution, such as DIW, through which a substrate may be lifted. A solvent vapor may be provided at the rinsing solution interface on the substrate, such as in a Marangoni process. In certain embodiments, the volume of solution through which the substrate is lifted is reduced, which may provide for reduced or eliminated particle reattachment to the substrate.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: August 8, 2017
    Assignee: Applied Materials, Inc.
    Inventor: Brian J. Brown
  • Patent number: 9662685
    Abstract: The present disclosure provides a substrate processing apparatus including: a processing chamber configured to process a substrate; a fluid supply source configured to supply a substrate processing fluid used in processing for the substrate in a predetermined pressure; a constant pressure supplying path configured to supply the substrate processing fluid from the fluid supply source to the processing chamber in a predetermined pressure without boosting the pressure of the substrate processing liquid; a boosted pressure supplying path configured to boost the pressure of the substrate processing fluid from the fluid supply source into a predetermined pressure by a booster mechanism and supply the pressure boosted substrate processing fluid to the processing chamber; and a control unit configured to switch over the constant pressure supplying path and the boosted pressure supplying path.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: May 30, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Gentaro Goshi, Kazuyuki Mitsuoka, Gen You, Hiroki Ohno, Takehiko Orii, Takayuki Toshima
  • Patent number: 9396912
    Abstract: In one embodiment, a method for cleaning a showerhead electrode my include sealing a showerhead electrode within a cleaning assembly such that a first cleaning volume is formed on a first side of the showerhead electrode and a second cleaning volume is formed on a second side of the showerhead electrode. An acidic solution can be loaded into the first cleaning volume on the first side of the showerhead electrode. The first cleaning volume on the first side of the showerhead electrode can be pressurized such that at least a portion of the acidic solution flows through one or more of the plurality of gas passages of the showerhead electrode. An amount of purified water can be propelled through the second cleaning volume on the second side of the showerhead electrode, and into contact with the second side of the showerhead electrode.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: July 19, 2016
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Armen Avoyan, Cliff La Croix, Hong Shih, John Daugherty
  • Patent number: 9256131
    Abstract: A developing method including a developing step in which, while a wafer horizontally held by a spin chuck is being rotated, the wafer is developed by supplying a developer onto a surface of the wafer, wherein provided before the developing step is a pre-wetting step in which, simultaneously with the developer being supplied from a first nozzle that is located on a position near a central part of the surface of the rotating wafer, a deionized water as a second liquid is supplied from a second nozzle that is located on a position nearer to an outer peripheral part of the wafer than the first nozzle, to thereby spread out the developer in the rotating direction of the wafer by a wall that is formed by the deionized water flowing to the outer peripheral side of the wafer with the rotation of the wafer.
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: February 9, 2016
    Assignee: Tokyo Electron Limited
    Inventors: Hirofumi Takeguchi, Taro Yamamoto, Kousuke Yoshihara
  • Patent number: 9244363
    Abstract: An immersion lithography apparatus includes (i) an optical assembly including an optical element, and configured to project a beam onto a substrate through an immersion liquid; (ii) a containment member that surrounds a path of the beam; and (iii) a stage on which the substrate is held, the substrate on the stage being moved below and spaced from a bottom surface of the containment member. The containment member includes: (1) a nozzle outlet via which water as the immersion liquid is released, (2) a recovery channel via which the immersion liquid is recovered from a gap between the containment member and the substrate and/or the stage, and (3) a fluid channel via which water is released to the gap between the containment member and the substrate and/or the stage, the fluid channel being provided radially inward of the recovery channel.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: January 26, 2016
    Assignee: NIKON CORPORATION
    Inventors: W. Thomas Novak, Andrew J. Hazelton, Michael Sogard
  • Patent number: 9222194
    Abstract: An electroplating/etch apparatus including a fluid jet and a dryer present over the tank containing the electrolyte for the electroplating/etch process. The fluid jet and the dryer remove excess liquids, such as electrolyte, from the component being plated or etched, e.g., working electrode. The working electrode is present on a holder that traverses from a first position within the tank during a plating or etch operation to a second position that is outside the containing the plating electrolyte. The fluid jet rinses the working electrode when the holder is in the second position, and the forced air dryer blows any remaining fluid from the fluid jet and the electrolyte from the working electrode into the tank.
    Type: Grant
    Filed: August 19, 2010
    Date of Patent: December 29, 2015
    Assignee: International Business Machines Corporation
    Inventors: Charles L. Arvin, Raschid J. Bezama, Hariklia Deligianni
  • Publication number: 20150144154
    Abstract: Embodiments of the disclosure generally relate to methods of removing etch by-products from the plasma processing chamber using carbon monoxide or carbon dioxide. In one embodiment, a method for dry cleaning a processing chamber includes exposing a chamber component disposed within the processing chamber in absence of a substrate disposed therein to a first cleaning gas mixture comprising carbon monoxide or carbon dioxide, wherein a portion of the chamber component has a film layer or residues deposited thereon, and the film layer or residues comprises a refractory metal and/or a metal silicide.
    Type: Application
    Filed: October 24, 2014
    Publication date: May 28, 2015
    Inventors: Kee Young CHO, Sang Wook KIM, Joo Won HAN, Han Soo CHO
  • Patent number: 9028621
    Abstract: A substrate rotates, and a liquid nozzle of a gas/liquid supply nozzle moves to a position above the center of the rotating substrate. In this state, a rinse liquid is discharged from the liquid nozzle onto the rotating substrate. The gas/liquid supply nozzle moves toward a position outside the substrate. A gas nozzle reaches the position above the center of the rotating substrate, so that the gas/liquid supply nozzle temporarily stops. With the gas/liquid supply nozzle stopping, an inert gas is discharged onto the center of the rotating substrate for a given period of time. After that, the gas/liquid supply nozzle again moves toward the position outside the substrate.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: May 12, 2015
    Assignee: SCREEN Semiconductor Solutions Co., Ltd.
    Inventors: Tadashi Miyagi, Masahiko Harumoto, Sadayasu Suyama
  • Publication number: 20150122291
    Abstract: The present disclosure relates to a wafer cleaning module for post CMP processes that reduces defects (e.g., watermarks, deposited particles) on a substrate, and an associated method. In some embodiments, the wafer cleaning module has a cleaning tank that may receive a semiconductor substrate within a cleaning medium. A pusher is may vertically move the semiconductor substrate from a starting position within the cleaning tank to an ending position. A position sensor may determine a position of the semiconductor substrate relative to a meniscus of the cleaning medium. Based upon the determined position, a control unit is may adjust a location of the starting position to a predetermined distance below the meniscus.
    Type: Application
    Filed: November 5, 2013
    Publication date: May 7, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Ting Yen, Kao-Feng Liao, Ying-Ho Chen
  • Patent number: 9017485
    Abstract: An ice dispensing system includes an ice hopper structure including a plurality of walls having inner surfaces that define an inner volume storing ice therein. The ice hopper may include a drain. A cleaning structure is coupled to the ice hopper structure. The cleaning structure includes a pump linked to a spray mechanism positioned within the inner volume of the ice hopper structure. The spray mechanism disperses a liquid on an inner surface of the ice hopper structure during a cleaning cycle of the ice dispensing mechanism.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: April 28, 2015
    Assignee: Cornelius, Inc.
    Inventors: Vittal Murthy, Jayateertha Malagi, Servesh Adderi Raganath, Matthew Kampert, Chris Zemko
  • Patent number: 9005366
    Abstract: The present invention discloses a cleaning process, utilizing a gas flow to an interior of a hollow object in a fluid ambient. After capping the object to seal off the interior volume, gas is introduced to the object interior. The pressure is built up within the object interior, loosening the seal. The gas pressure is released, and the seal returns. The vibration caused by the cycling of gas pressure can be used to perform cleaning of particles adhering to the object. The cleaning process can be used in a combinatorial processing system, enabling in-situ cleaning of process reactor assemblies.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: April 14, 2015
    Assignee: Intermolecular, Inc.
    Inventor: Edwin Adhiprakasha
  • Patent number: 8999072
    Abstract: Disclosed are methods and apparatus for cleaning heat exchangers and similar vessels by introducing chemical cleaning solutions and/or solvents while maintaining a target temperature range by direct steam injection into the cleaning solution. The steam may be injected directly into the heat exchanger or into a temporary side stream loop for recirculating the cleaning solution or admixed with fluids being injected to the heat exchanger. The disclosed methods are suitable for removing metallic oxides from a heat exchanger under chemically reducing conditions or metallic species such as copper under chemically oxidizing conditions. In order to further enhance the heat transfer efficiency of heating cleaning solvents by direct steam injection, mixing on the secondary side of the heat exchanger can be enhanced by gas sparging or by transferring liquid between heat exchangers when more than one heat exchanger is being cleaned at the same time.
    Type: Grant
    Filed: December 3, 2009
    Date of Patent: April 7, 2015
    Assignee: Westinghouse Electric Company LLC
    Inventors: Robert D. Varrin, Jr., Michael J. Little
  • Publication number: 20150090694
    Abstract: A substrate processing apparatus and method includes, a plate that has a size equal to or larger than a principal face of the substrate, and has a horizontal and flat liquid holding face opposing the principal face of the substrate from below. A processing liquid supply unit supplies a processing liquid to the liquid holding face. A control unit controls the processing liquid supply unit and a movement unit to supply the processing liquid to the liquid holding face to form a processing liquid film, a contact step of bringing the principal face of the substrate and the liquid holding face close to each other to bring the principal face of the substrate into contact with the processing liquid film, and a liquid contact maintenance step of maintaining the processing liquid in contact with the principal face of the substrate.
    Type: Application
    Filed: September 7, 2012
    Publication date: April 2, 2015
    Inventors: Koji Hashimoto, Masahiro Miyagi, Mitsukazu Takahashi
  • Publication number: 20150090293
    Abstract: A method of washing a bulk container is provided. The method includes receiving the bulk container on a support surface and rotating the support surface and at least one washer arm relative to one another. The method further includes spraying a fluid from at least one nozzle disposed on the at least one washer arm. Rotating the support surface and the at least one washer arm relative to one another exposes a plurality of portions of an outer surface of the bulk container to the spray.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Inventor: Lonny Shawn Lewis
  • Patent number: 8980013
    Abstract: A substrate cleaning method that includes: a step in which, while a substrate holder is being continuously rotated, a to-be-discharged position of the cleaning liquid on the substrate is changed to an eccentric position deviated from the central part of the substrate, and a gas is discharged from a gas nozzle to the central part of the substrate so as to form a dried area of the cleaning liquid under a condition in which a shortest distance between an edge of a cleaning liquid flow output from the cleaning-liquid nozzle and an edge of a gas flow output from the gas nozzle is set between 9 mm and 15 mm.
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: March 17, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Kousuke Yoshihara, Yuichi Yoshida, Taro Yamamoto
  • Publication number: 20150068558
    Abstract: A system and a method for cleaning a printing cylinder or other printing equipment such as printing plates, ink pans or floors of printing units, the method comprising applying a detergent to the surface to be cleaned, after a period to allow action of the detergent, removing the detergent by rinsing, using a vapor and high velocity air stream, i.e. atomized water fog; or steam; or a combination of steam and air, which allows dislodging particles encrusted within cells of the surface of the piece of equipment to be cleaned.
    Type: Application
    Filed: March 13, 2013
    Publication date: March 12, 2015
    Applicant: Pad Peripheral Advanced Design, Inc.
    Inventors: Daniel Poissant, Anton Chernyshov, Martin Gingras, Eric Thibault
  • Patent number: 8974632
    Abstract: A method and device for processing wafer-shaped articles comprises a closed process chamber. A rotary chuck is located within the process chamber, and is adapted to hold a wafer shaped article thereon. An interior fluid distribution ring is positioned above the rotary chuck, and comprises an annular surface inclined downwardly from a radially inner edge to a radially outer edge thereof. At least one fluid distribution nozzle extends into the closed process chamber and is positioned so as to discharge fluid onto the annular surface of the fluid distribution ring.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: March 10, 2015
    Assignee: Lam Research AG
    Inventors: Ulrich Tschinderle, Andreas Gleissner, Michael Brugger
  • Patent number: 8974602
    Abstract: The present invention discloses a method of reducing contamination in a CVD chamber. The method comprises cleaning the CVD chamber with first cleaning gases containing NF3; removing the particles in the CVD chamber with second cleaning gases containing N2; further removing the particles in the CVD chamber with third cleaning gases containing O2; and seasoning an amorphous carbon layer with mixed gases containing C2H2 and an inert gas.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: March 10, 2015
    Assignee: Shanghia Huali Microelectronics Corporation
    Inventors: Yadan Zhu, Jun Zhou
  • Patent number: 8961701
    Abstract: Drying a microelectronic topography. At least some of the illustrative embodiments are methods that include placing a microelectronic topography inside a process chamber, providing a non-aqueous liquid to the process chamber until at least 90% of the volume of the process chamber contains the non-aqueous liquid, pressurizing the process chamber by way of a fluid different than the non-aqueous liquid, ceasing activity with respect to the process chamber until the non-aqueous liquid and fluid form a mixture that is substantially homogenous, venting the process chamber while simultaneously providing the fluid to the process chamber, and venting the process chamber in a manner which prevents formation of liquid in the process chamber.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: February 24, 2015
    Assignee: Lam Research Corporation
    Inventors: Mark I. Wagner, James P. DeYoung
  • Patent number: 8961694
    Abstract: The invention relates to a plasma generator (1) for cleaning an object. The plasma generator (1) comprises a plasma chamber (2) and a support structure (6) arranged in the plasma chamber for supporting the object (7) to be cleaned. Further, the plasma generator comprises an electromagnetic shield (5a, 5b, 5c) counteracting a flow of charged plasma particles flowing from a plasma generating region towards the object, and a plasma source (8). In addition, the plasma generator comprises an additional plasma source (9,10) to form a composition of plasma sources that are arranged to generate in the plasma generating region plasmas, respectively, that mutually interact during operation of the plasma generator so as to force plasma particles to flow in a diffusely closed flow path.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: February 24, 2015
    Assignee: Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
    Inventors: Fokko Pieter Wieringa, Norbertus Benedictus Koster, Roland van Vliet, Hubert Adriaan van Mierlo
  • Publication number: 20150047677
    Abstract: A substrate processing apparatus includes a heater having an infrared lamp and a housing for heating an upper surface of a substrate held by a substrate holding mechanism with the heater in opposed relation to the upper surface. A heater cleaning method includes locating the heater at a position above a lower nozzle in opposed relation to a first spout of the lower nozzle, the lower nozzle being in opposed relation to a lower surface of the substrate held by the substrate holding mechanism, and a lower cleaning liquid spouting step of supplying a cleaning liquid to the lower nozzle to spout the cleaning liquid upward from the first spout with no substrate being held by the substrate holding mechanism to thereby supply the cleaning liquid to an outer surface of the housing of the heater located at the heater cleaning position.
    Type: Application
    Filed: February 25, 2013
    Publication date: February 19, 2015
    Inventor: Ryo Muramoto
  • Patent number: 8956465
    Abstract: [Problem] To provide a liquid processing method with which, while alleviating a watermark occurring in the surface of a substrate, it is possible to hydrophobize the surface using a hydrophobing gas. [Solution] A substrate (W), retained in substrate retaining parts (21, 22, 23), is rotated and has a liquid compound supplied to the surface thereof, whereby a liquid process is carried out. Next, a rinse liquid is supplied to the surface of the substrate (W) while the substrate (W) is rotated, and the liquid compound is replaced with the rinse liquid. Next, supplying a hydrophobing gas for hydrophobizing the surface of the substrate (W) and supplying the rinse liquid to the surface of the substrate (W) after supplying the hydrophobing gas are repeated alternately, thus hydrophobizing the substrate (W). Next, the rinse liquid is removed by rotating the substrate (W), drying the substrate (W).
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: February 17, 2015
    Assignee: Tokyo Electron Limited
    Inventor: Jun Nonaka
  • Patent number: 8951359
    Abstract: There is provided a liquid processing method for performing a liquid process on a front surface of a substrate by using a processing solution and then performing a rinse process on the front surface of the substrate by using a rinse solution having a temperature lower than a temperature of the processing solution. The liquid processing method includes performing an intermediate process between the liquid process and the rinse process, for adjusting a temperature of the front surface of the substrate to a temperature higher than the temperature of the rinse solution and lower than the temperature of the processing solution.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: February 10, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Takao Inada, Naoyuki Okamura, Hidetsugu Yano, Yosuke Hachiya
  • Publication number: 20150020852
    Abstract: A substrate processing apparatus comprises: an air flow generator which generates a down flow by gas flowing from top to bottom around a substrate W held horizontally; a liquid film former which forms a liquid film by supplying a liquid on an upper surface of the substrate; a cooling gas discharge nozzle which discharges cooling gas of a temperature lower than a freezing point of the liquid to the liquid film and thereby freezes the liquid film; and a remover which removes a frozen film formed by freezing the liquid film from the substrate. The air flow generator reduces a flow velocity of the down flow when the cooling gas is discharged to the liquid film from the cooling gas discharge nozzle than when the liquid is supplied to the substrate from the liquid film former.
    Type: Application
    Filed: July 16, 2014
    Publication date: January 22, 2015
    Inventors: Masahiko KATO, Katsuhiko MIYA, Hiroyuki YASHIKI, Yoshiki IMURO
  • Patent number: 8920577
    Abstract: A method of treating a substrate comprises, in one aspect, placing a substrate having material on a surface thereof in a treatment chamber; directing a stream of a liquid treatment composition to impinge the substrate surface; and directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition. A preferred aspect of this invention is the removal of materials, and preferably photoresist, from a substrate, wherein the treatment composition is a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: December 30, 2014
    Assignee: Tel FSI, Inc.
    Inventors: David DeKraker, Jeffery W. Butterbaugh, Richard E. Williamson
  • Patent number: 8920570
    Abstract: The disclosure relates to the cleaning of rods made of metal, particularly to the method of reclamation of used standard length rods, such as pump rods already used in the mechanical deep-pumping extraction of oil, as well as to the product made with the help of the mentioned method. The method of remanufacturing of standard length rods includes cleaning the rod with non-toxic particles which are able to undergo sublimation to eliminate environmental contamination and to assist in workplace safety.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: December 30, 2014
    Assignee: TRC Services, Inc.
    Inventor: Lonnie Dale White
  • Patent number: 8911559
    Abstract: A method for cleaning an etching chamber is disclosed. The method comprises providing an etching chamber; introducing a first gas comprising an inert gas into the etching chamber for a first period of time; and transporting a first wafer into the etching chamber after the first period of time, wherein the first wafer undergoes an etching process.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: December 16, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu Chao Lin, Ryan Chia-Jen Chen, Yih-Ann Lin, Jr Jung Lin
  • Publication number: 20140352737
    Abstract: A cleaning liquid and a gas are discharged in sequence to a central portion of a substrate while the substrate is being rotated, and after nozzles that discharge them are moved to a peripheral edge side of the substrate, discharge of the cleaning liquid is switched to a second cleaning liquid nozzle set at a position deviated from a movement locus of the first cleaning liquid nozzle. Both of the nozzles are moved toward the peripheral edge side of the substrate while discharging the cleaning liquid and discharging the gas so that a difference between a distance from the discharge position of the second cleaning liquid nozzle to the central portion of the substrate and a distance from the discharge position of the gas nozzle to the central portion of the substrate gradually decreases.
    Type: Application
    Filed: May 21, 2014
    Publication date: December 4, 2014
    Applicant: Tokyo Electron Limited
    Inventors: Atsushi OOKOUCHI, Kousuke YOSHIHARA, Hiroshi ICHINOMIYA, Hirosi NISIHATA, Ryouichirou NAITOU
  • Patent number: 8900372
    Abstract: The disclosure relates to the cleaning of rods made of metal, particularly to the method of reclamation of used standard length rods, such as pump rods already used in the mechanical deep-pumping extraction of oil, as well as to the product made with the help of the mentioned method. The method of remanufacturing of standard length rods includes cleaning the rod with cryogenic liquids to eliminate environmental contamination and to assist in workplace safety.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: December 2, 2014
    Assignee: TRC Services, Inc.
    Inventor: Lonnie Dale White
  • Publication number: 20140338706
    Abstract: [Problem] To provide a liquid processing method with which, while alleviating a watermark occurring in the surface of a substrate, it is possible to hydrophobize the surface using a hydrophobing gas. [Solution] A substrate (W), retained in substrate retaining parts (21, 22, 23), is rotated and has a liquid compound supplied to the surface thereof, whereby a liquid process is carried out. Next, a rinse liquid is supplied to the surface of the substrate (W) while the substrate (W) is rotated, and the liquid compound is replaced with the rinse liquid. Next, supplying a hydrophobing gas for hydrophobizing the surface of the substrate (W) and supplying the rinse liquid to the surface of the substrate (W) after supplying the hydrophobing gas are repeated alternately, thus hydrophobizing the substrate (W). Next, the rinse liquid is removed by rotating the substrate (W), drying the substrate (W).
    Type: Application
    Filed: January 11, 2013
    Publication date: November 20, 2014
    Applicant: Tokyo Electron Limited
    Inventor: Jun Nonaka
  • Patent number: 8888927
    Abstract: A rinsing method for a water-conducting domestic appliance is provided in which rinsing liquid is heated to a first temperature in a first operating mode in at least one partial program step of a first rinse cycle; a scale formation in the water-conducting domestic appliance is recorded by a scale sensor arranged in a hydraulic system; the scale formation is compared with a nominal value for the scale formation; and, upon exceeding the nominal value, a second rinse cycle is executed in a second operating mode, while the rinsing liquid is heated to a second temperature that is higher than the first temperature.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: November 18, 2014
    Assignee: BSH Bosch und Siemens Hausgeraete GmbH
    Inventors: Helmut Jerg, Michael Georg Rosenbauer
  • Patent number: 8876978
    Abstract: An object is to reduce changes in mechanical properties of a gas turbine blade base material during repair or regeneration of a gas turbine blade. For this purpose, a gas turbine blade after being operated is washed by being immersed into a strong alkaline washing solution, and the gas turbine blade after being washed with the strong alkaline washing solution is washed with water. The gas turbine blade after being washed with water is then washed by being immersed into a weak acid washing solution, and the gas turbine blade after being washed with the weak acid washing solution is subjected to heat treatment. The gas turbine blade after the heat treatment is then immersed into a strong acid washing solution, whereby the coating formed on the surface of the gas turbine blade is removed.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: November 4, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Tetsuji Kawakami, Ikumasa Koshiro, Rumi Haruna, Yoshitaka Uemura
  • Patent number: 8876979
    Abstract: A recyclable article having an external surface with an image printed thereon by droplets of ink is provided. The droplets of ink comprise a composition that includes a hydrophilic component. In embodiments, the hydrophilic component can facilitate the separation or loosening of the image from the external surface of the container when the image is exposed to a liquid-based solution at an elevated temperature. Methods for facilitating recycling of recyclable articles having printed images are also disclosed.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: November 4, 2014
    Assignee: Plastipak Packaging, Inc.
    Inventors: Ronald L. Uptergrove, Brent Mrozinski
  • Patent number: 8871108
    Abstract: A method of removing carbon materials, preferably amorphous carbon, from a substrate includes dispensing a liquid sulfuric acid composition including sulfuric acid and/or its desiccating species and precursors and having a water/sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the carbon material coated substrate. The liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. In preferred embodiments, amorphous carbon is selectively removed as compared to a silicon oxide (e.g., silicon dioxide) and/or silicon nitride.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: October 28, 2014
    Assignee: TEL FSI, Inc.
    Inventor: Jeffrey M. Lauerhaas