Abstract: The present invention provides a method for removing a coating layer of SOG or photoresist from a wafer flat side on a wafer by first injecting a flow of a cleaning solution at the bottom surface of the wafer at a location adjacent to the edge of the wafer, and then rotating the wafer at a rotational speed sufficiently high so as to cause the cleaning solution being pulled from the bottom side to the top side of the wafer by flowing around the edge to remove the coating layer covering the unintended area on the top surface of the wafer.

Abstract: A produce washing apparatus and method, which permits the washing of produce from both above and below in the field. The produce washing apparatus takes produce along a conveyor belt, from a loading section, to a washing section on which is located a washing unit, upward along an ascending section, and from there the produce travels along a dumping section and into a receptacle. The washing unit features spray nozzles located above and below the washing section, so as to direct spray from above and below the produce so as to more effectively wash it. The apparatus is preferably trailer mounted, so as to permit ready positioning in the field.

Abstract: A wet stripping apparatus for removing unwanted film layers, such as a thick photoresist layer from a wafer surface after a solder bumping process and a method for using the apparatus are disclosed. The apparatus includes a tank body, a wafer holder, and a means for reciprocally moving the wafer holder in an up-and-down motion with at least one wafer mounted in the holder immersed in a stripper solution to a frequency of not higher than 100 cycle/min. The stripper solution utilized, which is suitably kept at a temperature of at least 50° C., contains dimethyl sulfoxide, tetramethyl-ammonium-hydroxide and water. After the stripping process, the wafer is rinsed in a quick dump rinse step and then spin dried for conducting subsequent fabrication processes on the wafer.

Abstract: The motion wheel washer automatically washes the front wheels of a vehicle while the wheel is in motion. In one embodiment, the position of the front wheels and the vehicle speed is sensed. When the wheels are turned to the right or left at low speed, a nozzle residing inside the lip of the fender, in front of the wheel, directs a spray of a washing fluid against the outer surface of the wheel. When the wheels are turned the opposite direction, a spray is directed against the outer surface of the opposite wheel. In a second embodiment, a telescoping arm residing within the wheel well above the wheel, deploys to position a nozzle to spray the washing fluid against either wheel.

Abstract: Method for the cleaning and washing in situ of the soft type ice creams pressurized machines including the steps of: emptying of the ice cream contained in the machine freezing cylinder; removal of the liquid ice-cream mix container from the liquid ice-cream mix feeding circuit, and insertion into said circuit of a container containing water with a restrained lather light detergent dissolved in; starting up of the cleaning step, including a succession of water and detergent introductions into the freezing cylinder with steps of shaking and following openings of the ice cream extraction tap for the draining of the washing liquid; introduction of pressurized air into the cylinder for a few seconds in order to greatly reduce the amount of remaining water in the plant; repetition of the described cleaning operations for two or three more times; replacement of the container containing water and detergent with a container containing water and sanitizer; repetition of the described operations with water and sanitize

Abstract: The invention concerns a method and a device for treating a substrate of an integrated circuit or the like during production. The invention is characterised in that it consists in spraying, from the bottom upwards, a treatment liquid (24) on the surface to be treated (20I), facing downwards, of said substrate (20) and transducers (8) apply ultrasonic waves to said substrate (20) via said spayed treatment liquid (24).

Abstract: A pretreatment chamber 120 is disposed within a vacuum transfer chamber 102 of a processing apparatus 100. The pretreatment chamber 120 is equipped with an orienting mechanism 128 and a UV lamp 124. The orienting mechanism 128 orients a wafer W through rotation of a table 130, on which the wafer W is placed, and by use of an optical sensor 134. Synchronously with the orientation, the UV lamp 124 emits UV through a UV transmission window 126 fitted to a ceiling portion of the pretreatment chamber 120, to thereby irradiate the surface of the wafer W with UV. Thus adhering to the wafer W is removed. A processing gas supplied into the pretreatment chamber 120 is also irradiated with UV. Active atoms generated from the processing gas also contribute to removal of carbon. Since the pretreatment chamber 120 is formed within the vacuum transfer chamber 102, the footprint of the processing apparatus can be reduced.

Abstract: A method and an apparatus that uses a surfactant to clean a hydrophobic wafer is provided. In a first aspect, the method may clean and dry a wafer without applying pure DI water to the wafer. In a second aspect, the method may clean a wafer by applying pure DI water to the wafer only for a short duration of time such that the DI water application ceases prior to or as soon as a surfactant solution is rinsed from the wafer thereafter the wafer is dried. In a further aspect a hydrophobic wafer is maintained wetted with surfactant as it is transferred between cleaning apparatuses and is rinsed via diluted surfactant or via a brief DI water spray and is thereafter dried.

Abstract: A method for removing a ruthenium-containing metal includes the step of applying a remover to a semiconductor substrate. The remover includes a cerium (IV) nitrate salt and nitric acid.

Abstract: A method for use in two-components electrostatic image developers is disclosed, in which secure separation of a carrier coating resinous materials from a core magnetic material is achieved without affecting the properties of the core materials through process steps benign to the environment in super- or sub-critical water compositions under the conditions of a temperature of 300° C. or more and a pressure of 20 MPa. The core magnetic material is subsequently recycled for forming carrier. This method may also be useful for processing waste including magnetic materials with silicone resin coating.

Abstract: Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe.

Abstract: The cleaning pads (102, 104) that are used to clean work pieces (200), such as semiconductor wafers, are cyclically compressed against one another and rinsed with a rinsing fluid. By cyclically compressing the cleaning pads (102, 104) together and rinsing them, the debris that the cleaning pads remove from the work pieces (200) and that becomes embedded in, and adhered to, the cleaning pads (102, 104) is subsequently removed therefrom.

Abstract: The present invention provides new and improved methods and apparatus for removing contamination from surfaces of substrates. Existing techniques include plasma ashing, glow discharge or UV/ozone processes. The present invention includes cleaning the substrate surfaces by transporting the substrates to be cleaned through a first zone where the substrates are heated preferably in a nitrogen atmosphere and then to a second zone where the substrates are surrounded by an atmosphere of ozone. The organic contamination is thereby vaporized into vapor products including CO, CO2 and H2O.

Abstract: A method of washing vehicles in which a vehicle is washed by an automatic vehicle washing apparatus. The washing apparatus includes a prewashing and washing device, which are arranged to move in relation to the vehicle to be washed in the longitudinal direction of the vehicle. Prewash agent is fed to the surface of the vehicle to be washed with the pseudo-pressure of the prewash exceeding 8 bar.

Abstract: A method for treating an object is provided. The method comprises supporting the object above a level of a process liquid and applying megasonic energy to said process liquid to form a vapor from the liquid. The vapor reacts with a surface of the object to process the object. The level of the process liquid is generally maintained below the bottom of the object while processing the object with the vapor. An alternative embodiment of the method employs an acoustically generated vapor and ultraviolet (UV) light for processing objects. The UV light passes through the vapor to treat the object. The vapor and UV light react with a surface of the object to process the object. In a particular example of this embodiment, the vapor includes ozone, which reacts with the UV light to form an oxide at the surface of a semiconductor wafer. UV may also be used in conjunction with ammonia (NH3) to facilitate substrate cleaning.

Abstract: A method of cleaning a metal oxide thin film on a silicon wafer, includes dipping the wafer in an organic solvent; drying the wafer in a nitrogen atmosphere; and stripping any photoresist from the wafer in an oxygen atmosphere under partial vacuum at a temperature of about 200° C. The wafer may also be cleaned by dipping in a polar organic solvent and subjecting the wafer to ultrasound while immersed in the solvent.

Abstract: An integrated circuit assembly cleaning apparatus and method allow a cleaning solution to completely fill spaces within an integrated circuit assembly. Such spaces include, for example, the thin space between the die and substrate of a flip-chip integrated circuit. The cleaning solution fills the space while the air initially occupying the space escapes. These actions are accomplished by first tilting the integrated circuit assembly from horizontal. The integrated circuit assembly is then immersed in the bath at a controllable rate to allow the cleaning solution to completely fill the space while the air in the space escapes.

Abstract: An apparatus for cleaning golf clubs having an enclosure with a lower reservoir for holding water and an upper spray chamber in communication with said lower reservoir. The spray chamber houses a cleaning path for cleaning golf clubs. The cleaning path is defined by a plurality of opposingly spaced bristle brushes with a plurality of high pressure spray nozzles strategically located between the bristle brushes. A low volume/high pressure pump is utilized for providing highly pressurized fluid to the spray nozzles. Golf clubs are inserted along the cleaning path of the apparatus wherein all portions of the golf club are cleaned through the use of the bristle brushes and the high pressure spraying of fluid.

Abstract: Process and apparatus for recovering clean fiberglass and urea formaldehyde from urea formaldehyde treated waste fiberglass, which involves the use of a continuous batch tunnel machine comprising end to end modules in each of which a perforated basket is rotatable and of such construction as to transfer goods within each basket to subsequent baskets and out the end of the basket at the exit of the machine. The waste fiberglass is introduced into the basket at the entrance to the machine to pass the fiberglass out the end of the machine, during which it passes through acid and wash loops in which the recovery takes place.

Abstract: In an apparatus containing rotating filter media that removes solids from a fluid stream, the invention provides devices and methods for improved cleaning of the filter media. Solids trapped on the filter media are removed by the application of a pressurized fluid spray system. The spray system has nozzles distributed across a spray arm. The nozzles create a generally elliptical spray fan pattern in contact with the filter media. The nozzles are spaced and angularly oriented on the spray arm so that adjacent spray fan contact areas overlap. This distribution and orientation equalizes the distribution of the washing flow and hydraulic energy over the filter area, thereby maintaining the filter material in a more uniformly clean and effective filtering condition.

Abstract: Methods and apparatus are provided for precisely and repeatably positioning spray bar. In accordance with a first aspect, an apparatus is provided that includes (1) a spray bar having an alignment mark and one or more openings, the spray bar configured to output a fluid spray from the one or more openings; (2) a mounting device having an alignment mark, the mounting device configured to support the spray bar; and (3) a substrate support configured to support a substrate. The alignment mark of the spray bar and the alignment mark of the mounting device may be aligned so as to position a fluid spray output by the spray bar toward a substrate supported by the substrate support. Numerous other methods and apparatus also are provided.

Abstract: For the treatment of surfaces of substrates of organic or inorganic materials, reactive fragments—especially radicals or ions—are produced by ultraviolet radiation; the ultraviolet radiation is performed by at least one ultraviolet radiator disposed at a given distance, with a gas-filled, elongated discharge chamber whose walls are formed by a dielectric, which is provided on the side facing away from the discharge chamber with at least one electrode; during the irradiation a translational and/or rotatory relative movement is performed between the substrate and the ultraviolet radiator at a comparatively slight distance between radiator and substrate surface, in order to achieve, in a simple manner, an intense and uniform illumination of the surface being irradiated.

Abstract: An industrial parts cleaning system including immersion and spraying which provides epicyclic parts movement (a plurality of revolutions per rotation, wherein the revolution is supersposed the rotation), rotating spray which synchronously follows the parts rotation, and a purge system for evacuating from the common plumbing the respective wash or rinse solution of a current cycle before commencement of the next cycle.

Abstract: A method of cleaning an imaged printing form having a silicone-based non-printing layer, which includes exerting a defined contact pressure by a cleaning arrangement on a printing-form surface to be cleaned, and moving at least one of the printing form and the cleaning arrangement relative to the other, further includes applying cleaning fluid to the printing-form surface to be cleaned, the cleaning fluid, besides water, containing a cleaning concentrate as a component, the cleaning concentrate having 1 to 30 percent by weight of an anionic surfactant and 1 to 30 percent by weight of a nonionic surfactant; and a cleaning fluid for cleaning a printing form.

Abstract: Disclosed is an apparatus for washing a substrate, comprising a spin chuck holding and rotating a substrate, a process solution supply mechanism having a solution discharge port through which a process solution is supplied onto the substrate rotated by the spin chuck so as to form a film of the process solution, an ultrasonic oscillator for applying an ultrasonic vibration to the film of the process solution, a relative moving mechanism for relatively moving the ultrasonic oscillator and the spin chuck so as to adjust the relative positions of the ultrasonic oscillator and the substrate, and controller for controlling each of the spin chuck, process solution supply mechanism, ultrasonic oscillator and relative moving mechanism so as to permit the ultrasonic oscillator, which extends to cover substantially a radius of the substrate, to be in contact with the film of the process solution but not to be in contact with the substrate and so as to make optimum the relationship among a gap G between the ultrasonic o

Abstract: There is proposed an apparatus and method for cleaning a semiconductor substrate, which make it possible to minimize the adhesion of mist in a cleaning tank at the occasion of cleaning a semiconductor substrate, to realize a high removal effect of residual polishing particles, and to enable to obtain a clean surface. In view of preventing a mist generated by the jet of high pressure water from re-adhering to the substrate during the cleaning of a semiconductor substrate, a cover member is disposed at a mist-generating region so as to prevent the splash of the mist. Additionally, a cavity is caused to generate by contacting a high pressure water with a still water, and high-frequency generated by the generation of the cavity is utilized for removing the residual polishing particles. Alternatively, the ejection of high pressure water against the surface of the substrate is performed in a liquid phase such as ultrapure water, thereby preventing the generation of mist.

Abstract: A method and a system for transporting and cleaning slaughter equipment especially knives (3), gloves and aprons at slaughterhouses, the system comprising knife holding members for receiving and releasably holding one or more knives (3), glove holding members for receiving and releasably holding the gloves, apron holding members for receiving and releasably holding the aprons and a cleaning installation for cleaning the knives and/or gloves and/or aprons and/or the holding members. The holding members may be transported on trolleys, and the knife holding members may comprise a basked (4), wherein the knives are positioned so that the blunt knives have a different orientation than the other knives. The basket (4) may be positioned on the trolley on projections (26′) through the handgrips (13).

Abstract: Solid products to which dirt adheres are cleaned by introducing them into a container filled with water, mechanically transporting the products through the container to form in the container a suspension of sludge in the water, the sludge comprising dirt which has been removed from the products, the sludge having a specific mass that approaches the specific mass of water. A stream of finely divided air bubbles is fed through the sludge suspension in the container thereby to lower the specific mass of the water and to cause sludge to move by gravity toward a lower section of the container. Sludge-enriched water is removed from that lower section of the container. The products are mechanically transported by a conveyor into and through and out of the container after dirt has been removed therefrom.

Abstract: A method for cleaning a semiconductor structure using vapor phase condensation with a thermally vaporized cleaning agent, a hydrocarbon vaporized by pressure variation, or a combination of the two. In the thermally vaporized cleaning agent process, a semiconductor structure is lowered into a vapor blanket in a thermal gradient cleaning chamber at atmospheric pressure formed by heating a liquid cleaning agent below the vapor blanket and cooling the liquid cleaning agent above the vapor blanket causing it to condense and return to the bottom of the thermal gradient cleaning chamber. The semiconductor structure is then raised above the vapor blanket and the cleaning agent condenses on all of the surfaces of the semiconductor structure removing contaminants and is returned to the bottom of the chamber by gravity.

Abstract: /The present invention provides in one embodiment a method of manufacturing an integrated circuit including cleaning a semiconductor wafer using a cleaning apparatus, wherein the cleaning apparatus includes a roller brush frame and roller brushes cooperatively supported within the roller brush frame and aligned to form a cleaning gradient that is configured to remove particles of different sizes from an object to be cleaned.

Abstract: A wafer cleaning apparatus includes a rinsing container in which wafers to be cleaned are positioned and four sets of nozzles arranged in the rinsing container to be symmetric with respect to each other. The nozzles generate water jets toward the wafers for performing a wafer cleaning process. In a first phase of the wafer cleaning process, the first nozzle set and the fourth nozzle set are turned on to generate water jets in diagonally opposite directions with respect to the wafers for a given period. In a second phase, the second nozzle set and the third nozzle set are turned on to generate water jets in diagonally opposite directions with respect to the wafers for a given period. In a third phase, the third nozzle set and the fourth nozzle set are turned on to cause an up-rising water flow from a bottom of the container to a top open side thereof for expelling contaminants dissolved or suspended in the water out of the container.

Abstract: The present invention has as an object thereof to provide a cleaning method which realizes, in the cleaning process, (1) a reduction in the number of processes, (2) a simplification of the cleaning apparatus, and (3) a reduction in the amount of chemicals and pure water employed, and which has highly superior cleaning effects and does not damage the substrate body, as well as to provide a rinsing method which aids in the hydrogen termination of silicon atoms.

Abstract: A method and apparatus for drying a disk-shaped substrate. The substrate is typically a substrate used for the manufacture of magnetic disks, and has a centrally located opening. The substrate is lowered into a liquid bath by a first holder, which also becomes immersed in the bath. The first holder lifts the substrate until the substrate extends partially out of contact with the liquid. A second, dry holder grabs a dry portion of the substrate that extends out of the bath, and continues to lift the substrate out of contact with the liquid.

Abstract: A method for automating the process of impaction of particles, recovering samples from a plurality of impaction cups, and washing the cups for a new cycle. The process includes steps of agitating the solvent used for dissolving samples, removing samples and transferring the samples to vials used in an analyzing instrument.

Abstract: A method and apparatus for the treatment of surfaces of substrates of organic or inorganic materials, reactive fragments such as radicals or ions are produced by ultraviolet radiation from at least one ultraviolet radiator disposed at a given distance. The radiator has a gas-filled, elongated discharge chamber whose walls are formed by a dielectric, and the ultraviolet radiator is provided on the side facing away from the discharge chamber with at least one electrode. During irradiation, a translational and/or rotatory relative movement is performed between the substrate and the ultraviolet radiator at a comparatively slight distance between radiator and substrate surface, in order to achieve, in a simple manner, an intense and uniform illumination of the surface being irradiated. The treatment is directed especially to silicon substrates or glass substrates.

Abstract: The present invention provides a method for treating a substrate, or a plurality of substrates, so that the treatment thereof is enhanced. In particular, the method includes the steps of causing a heated liquid to contact the substrate(s) and causing a processing liquid to contact the substrate(s). Although the processing liquid comprises a heat sensitive agent, the effectiveness of the processing liquid is not substantially diminished by the application of heat due to the fact that the heat is applied by the application of a separate heated liquid rather than by heating the processing liquid itself. Thus, the application of heat can be utilized to enhance the treatment rate of a substrate surface without a corresponding reduction in effectiveness of the processing liquid.

Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. Sonic energy is introduced into the liquid and acts on the workpiece to improve processing. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.

Abstract: There are provided a wafer cleaning device which prevents the contamination of wafers and which can effectively clean the wafers and a tray for use in the wafer cleaning device.

Abstract: Stainless steel is pickled by a chemical and/or electrochemical pickling process using an acid liquid, containing substantially no nitric acid. The process uses a spent electrolyte solution from an electrochemical, neutral salt pickling tank, such as a sodium sulfate pickling tank. The spent electrolyte solution is added to an acid solution to form a pickling acid capable of pickling stainless steel, oxidizing Fe2+ to Fe3+ and reducing Cr6+ to Cr3+.

Abstract: In a method of processing or drying a semiconductor wafer, the wafer is withdrawn from a fluid bath at an inclined angle, and at a selected withdrawal speed. A solvent vapor is provided at the surface of the bath, to create a surface tension gradient and promote drying, or removal of the fluid from the wafer surface. After the wafer is entirely withdrawn from the rinsing liquid, the wafer is rotated briefly, to remove any remaining fluid via centrifugal force, without the fluid drying on the wafer. The wafer is held onto a rotor assembly which rotates the wafer within an enclosed chamber, and which is also pivoted within the chamber, to position the wafer at the incline angle.

Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

Abstract: An apparatus for spraying a liquid on the surface of assemblies that are moving through wash and rinse stations.

Abstract: In a method of washing contaminated particulate matter, a screw conveyor is disposed in a cleaning tank for rotation around a substantially vertical axis so that the lower part of the screw conveyor is positioned under the surface of the cleaning water and the upper part of the screw conveyor is positioned above the surface of the cleaning water. Under the surface of the water, the grains of the particulate matter are contacted with each other with sludge being interposed therebetween to remove at least a part of contamination substances from the surface of the grains of the particulate matter and to wash off the substances into the water.

Abstract: A workpiece or substrate is placed in a support in a reaction chamber. A heated process liquid is sprayed onto the substrate. The thickness of the layer of process liquid formed on the substrate is controlled, e.g., by spinning the substrate. Ozone is introduced into the reaction chamber by injection into the liquid or into the reaction chamber, while the temperature of the substrate is controlled, to chemically process the substrate. The substrate is then rinsed and dried.

Abstract: A substrate washing apparatus, comprising a spin chuck for holding and rotating a substrate W, a brushing section including a scrubbing member which is brought into contact with a washing surface of the substrate held on the spin chuck and revolved on its own axis together with rotation of the spin chuck, a washing liquid supply mechanism for supplying a washing liquid through the brushing section onto the washing surface of the substrate, a pressure control mechanism for controlling a pressing force of the scrubbing member against the washing surface of the substrate, and a moving means for moving the scrubbing member relative to the substrate in a radial direction of the substrate, wherein the scrubbing member includes an abutting portion which is brought into contact with the washing surface of the substrate, and a non-contact peripheral portion positioned about the abutting portion and formed not to contact the washing surface of the substrate when the abutting portion is in contact with the washing surfa

Abstract: In a method for treating substrates, the substrates are lowered for treatment into a treatment fluid contained in a treatment device. The substrates are then lifted by a first receiving device at least partially out of the treatment fluid and transferred to a second receiving device for completely lifting the substrates out of the treatment fluid. The second receiving device is completely dry at the time of transfer. The drops forming at the lowest point of the substrates are drained during lifting by a drop draining element. The device for performing the method has a lifting device with a first and second receiving device and a drop draining device for draining the drops forming at the lowest point of the substrates during lifting of the substrates from the treatment fluid.

Abstract: A method for cleaning thin gauge metal foil strip material using a plurality of wiper (12, 16, 20) and solvent application (14, 18) stages. The solvent used in the solvent application stages is an aliphatic petroleum type which is applied using low pressure to avoid atomization or separation of solvent components. The wipers of a first wiping station are made of a solid bar of polymer impregnated fiber material. The wipers of the second wiping station are spaced apart blades of urethane-based elastomer material.

Abstract: This invention provides a cleaning method of cleaning a laser mark formed on a semiconductor wafer. A semiconductor wafer is rotated in a circumferential direction, and a laser mark is detected indirectly or directly in a non-contact manner. Rotation of the semiconductor wafer is controlled on the basis of detection of the laser mark, and an ultrasonic vibration-applied processing solution is sprayed to the laser mark.

Abstract: A method is provided for cleansing a seal of a device used for sealing an evaporative emission control system of an automotive vehicle. The method starts by determining if a request to close the device has been made. If the request to close the device has been made, the method cycles the device a plurality of times to press and lift the seal off of a seat repeatedly. The method also determines if the seal is closed after the cycling step. If the seal is not closed after the cycling step, the method closes the seal. Preferably, the cycling step includes cycling the device at a pre-selected duty cycle, frequency and cycle count. The duty cycle, frequency, and cycle count correspond to calibration tables prepared for the particular device employed to insure that the seal strikes its seat about three times before sealing.

Abstract: A cleaning and drying apparatus includes a cleaning bath 22 for collecting cleaning liquid and also discharging the liquid, a drying chamber 23 arranged above the cleaning bath 22 and a wafer boat 24 for conveying semiconductor wafers W between the cleaning bath 22 and the drying chamber 23. Dry gas nozzles 37 for ejecting dry gas are provided in the drying chamber 23. A shutter 36 is arranged between the cleaning bath 22 and the drying chamber 23, for insulating the cleaning bath 22 from the drying chamber 23. A central processing unit 60 controls respective operations of the dry gas nozzles 37 and a driving unit 52 for the shutter 36. With the arrangement, after the wafers W have been cleaned in the cleaning bath 22, the cleaning liquid is discharged through a bottom of the bath 22, while the dry gas is supplied from the dry gas nozzles 37 to contact with surfaces of the wafers W and the cleaning liquid in a first drying process.