Abstract: A process and apparatus for cleaning a transport belt of a machine for the production or processing a web. The apparatus includes at least one nozzle device composed of a rotatable nozzle head having at least one cleaning nozzle, a transport device including a crosspiece extending substantially crosswise to a transport belt travel direction, in which the at least one nozzle device is coupled to the transport device and adapted for displacement along the crosspiece. A traversing speed of the nozzle device is very low and falls within a range of between approximately 1 mm/min and 10 mm/min. Alternatively, the at least one nozzle is positionable in a plurality of cleaning positions that are successively arranged crosswise to the transport belt, and the at least one nozzle is held stationary in each respective cleaning position for a predefined time period.

Abstract: The present invention provides a method for evenly immersing a wafer in a solution held in a solution chamber, which comprises the following steps: (1) placing at least one disk-shaped wafer inside a wafer holder which is used for vertically holding at least one wafer, (2) immersing the wafer holder into the solution vertically so that each wafer in the wafer holder can be vertically immersed into and react with the solution, (3) vertically rotating the wafer holder in the solution so as to invert each wafer in the wafer holder upside down, and (4) removing the wafer holder from the solution vertically after immersing the wafer in the solution for a predetermined period of time.

Abstract: An apparatus for processing a substrate in which the substrate is successively processed with different kinds of process solution. A spin chuck supports the substrate. A driving source rotates the spin chuck A nozzle member supplies a first process solution prepared by mixing sulfuric acid and a hydrogen peroxide solution at a predetermined mixing ratio to the substrate. A switching mechanism selects the sulfuric acid, the hydrogen peroxide solution and the second process solution supplied to the nozzle member A concentration adjusting mechanism adjusts the ratio of sulfuric acid to the hydrogen peroxide solution, which collectively form the first process solution, supplied to the nozzle member. A control device controls the supply of sulfuric acid, the hydrogen peroxide solution and the second process solution, which is switched by the switching mechanism.

Abstract: An object of the invention is to provide a method and an apparatus for recycling plastics which is improved with respect to operation efficiency, operation environment, lowering degradation of plastics, recycling cost and environment load including saving energy. The recycling is made as follows: coarse-crushing used-up plastic products, separating plastic materials from other foreign matters by air blow separation, fine-crushing the separated plastics, washing the fine-crushed plastics by the process using a circulation flow including a spiral flow in which interaction between crushed plastics helps themselves clean without washing agents, dewatering the washed plastics, drying them, removing metallic matters by using metal detector, then feeding them directly without pelletizing to an injection molding machine of which nozzle part is equipped with filter and flow-switching mechanism for cleaning the filter by backwash reverse filtration.

Abstract: A processing system for cleaning, washing, drying, and sorting cherry pits. Once the pits are removed from the cherries, they are washed, scrubbed, and cleaned. Any excess water is removed from them and the pits are then thoroughly dried. Any partial or broken pits are removed, as well as any metal impurities. The cleaned and dried whole cherry pits can then be inserted into bags or containers and included in a therapeutic product, such as a cushion, U-shaped neck device, or a huggable stuffed animal character.

Abstract: An integrated cleaner with scrubber for cleaning and scrubbing semiconductor substrates that includes a housing that contains both a cleaning module and a scrubbing module. The cleaning module is capable of performing a wet-cleaning process on a batch of the semiconductor substrates. The cleaning module comprises a cleaning tank in which a batch of semiconductor substrates are cleaned. A megasonic device can be attached to the cleaning tank to enhance cleaning. The scrubbing module includes a plurality of scrubbers each of which scrubs a semiconductor substrate. The integrated cleaner with scrubber also comprises a robot for moving the semiconductor substrates between the cleaning and scrubbing modules.

Abstract: A method for making plates from photopolymer sheets which have previously been exposed to ultraviolet radiation, to convert the sheets into printing plates for flexographic, letterpress or dry-offset printing, includes brushing the exposed faces of the sheets with a brush assembly having a row of flat brushes with generally rectangular brushing surfaces. The brushes each undergo a movement of horizontal rotation and the brush assembly also undergoes at least one movement of reciprocating horizontal translation. Each brush is offset by 180° in its horizontal rotation with respect to the immediately adjacent brush, or to the two immediately adjacent brushes in the row. Also disclosed is an apparatus for performing the method.

Abstract: An extractor tool for extracting invasive fluid from a floor covering defining a floor surface. The extractor tool comprises a frame assembly, an extraction head, and a drive roller. The frame assembly defines a support surface. The extraction head is mounted to the frame assembly and defines an extraction opening that engages the floor surface. The drive roller assembly is mounted to the frame assembly and also engages the floor surface. A user stands on the support surface between the extraction head and the drive roller assembly such that the user's weight is transferred to the floor surface through the extraction head and the driver roller assembly. The user operates the driver roller assembly to propel the extractor tool along the floor surface.

Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A sonic energy source, such as a megasonic transducer, provides sonic energy into a liquid in the bowl. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into the liquid. Sonic energy is provided to the workpiece through the liquid, optionally while the head spins the workpiece. The liquid may include de-ionized water and an etchant.

Abstract: A method of cleaning a coating apparatus for coating articles with chocolate masses and the like with hot water includes the steps of: filling water into a tub of the coating apparatus, wherein the coating apparatus includes a driven grating conveyer belt for receiving the articles to be coated including an upper portion and a lower portion, and wherein the coating apparatus includes at least one aggregate being arranged in the upper region of the tub; pumping water out of the tub with at least one pump; and directing the substantially unpressurized water onto the grating conveyer belt and onto the at least one aggregate to be cleaned, the water having a temperature being higher than the melting temperature of the mass, the water flowing over the grating conveyer belt and the at least one aggregate and back into the tub in a substantially unpressurized manner.

Abstract: An inventive edge cleaning device is provided for cleaning the edge a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc's edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include deionized water, NH4OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.

Abstract: Disclosed is a process of recycling and reusing an aqueous degreasing solution for further use as a component of a coolant solution which is itself recycled and reused in metal cutting machines. Also disclosed is a method of degreasing parts, and a degreasing apparatus which is controlled such that an appropriate amount of the aqueous degreasing solution is introduced into the coolant solution. Finally, disclosed herein is a method and system for preparing a coolant in which an aqueous degreasing solution is further utilized as a feeder solution for a coolant solution, with the resulting solution being able to be separated into its component parts and reused in the cutting and cleaning of metals to form metal parts.

Abstract: Disclosed is a process of recycling and reusing an aqueous degreasing solution for further use as a component of a coolant solution which is itself recycled and reused in metal cutting machines. Also disclosed is a method of degreasing parts, and a degreasing apparatus which is controlled such that an appropriate amount of the aqueous degreasing solution is introduced into the coolant solution. Finally, disclosed herein is a method and system for preparing a coolant in which an aqueous degreasing solution is further utilized as a feeder solution for a coolant solution, with the resulting solution being able to be separated into its component parts and reused in the cutting and cleaning of metals to form metal parts.

Abstract: A cleaning system that utilizes an organic cleaning solvent and pressurized fluid solvent is disclosed. The system has no conventional evaporative hot air drying cycle. Instead, the system utilizes the solubility of the organic solvent in pressurized fluid solvent as well as the physical properties of pressurized fluid solvent. After an organic solvent cleaning cycle, the solvent is extracted from the textiles at high speed in a rotating drum in the same way conventional solvents are extracted from textiles in conventional evaporative hot air dry cleaning machines. Instead of proceeding to a conventional drying cycle, the extracted textiles are then immersed in pressurized fluid solvent to extract the residual organic solvent from the textiles. This is possible because the organic solvent is soluble in pressurized fluid solvent. After the textiles are immersed in pressurized fluid solvent, pressurized fluid solvent is pumped from the drum.

Abstract: A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleaning liquid. The cleaning liquid is caused to contact the surface to be cleaned. Acoustic energy is applied to the liquid during such contact. Optionally, the surface to be cleaned can be oxidized, e.g., by ozonated water, prior to cleaning.

Abstract: A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleaning liquid. The cleaning liquid is caused to contact the surface to be cleaned. Acoustic energy is applied to the liquid during such contact. Optionally, the surface to be cleaned can be oxidized, e.g., by ozonated water, prior to cleaning.

Abstract: A cleaning system that utilizes an organic cleaning solvent and pressurized fluid solvent is disclosed. The system has no conventional evaporative hot air drying cycle. Instead, the system utilizes the solubility of the organic solvent in pressurized fluid solvent as well as the physical properties of pressurized fluid solvent. After an organic solvent cleaning cycle, the solvent is extracted from the textiles at high speed in a rotating drum in the same way conventional solvents are extracted from textiles in conventional evaporative hot air dry cleaning machines. Instead of proceeding to a conventional drying cycle, the extracted textiles are then immersed in pressurized fluid solvent to extract the residual organic solvent from the textiles. This is possible because the organic solvent is soluble in pressurized fluid solvent. After the textiles are immersed in pressurized fluid solvent, pressurized fluid solvent is pumped from the drum.

Abstract: A cleaning apparatus and a cleaning method for cleaning an object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: A wet spray cleaning process for removing thick organic layers including hardened photoresist from the surface of silicon wafers yields low residual particle counts for photoresist thicknesses up to 3 microns, and maintains low residual particle density for oxide-covered wafer regions. The cleaning process uses multiple cycles of SPM/DI/APM/DI, without an intervening drying step therebetween.

Abstract: Method and apparatus for cleaning a moving surface, for example a roller, wire or conveyor belt. The surface is cleaned by a doctor blade having several separate blades which move in a direction transverse to the surface to be cleaned so that the blades can be serviced and repaired during operation of the moving surface.

Abstract: A method and an apparatus for removing a liquid, i.e. a wet processing liquid, from at least one surface of at least one substrate is disclosed. A liquid is supplied on a surface of substrate. Simultaneously or thereafter the liquid or the substrate is locally heated to thereby reduce the surface tension of said liquid. By doing so, at least locally a sharply defined liquid-ambient boundary is created. According to one aspect of the invention, the substrate is subjected to a rotary movement at a speed to guide said liquid-ambient boundary over the surface of the substrate thereby removing said liquid from said surface.

Abstract: Guide rollers in a web-fed rotary printing press are cleaned by a web of material that is provided with signal information, such as a bar code or a punch code. The retrievable signal information is used by one or more signal reading devices that are used to apply cleaning agent to the web and to create a speed differential between the guide roller and the material web.

Abstract: In a method for treating substrates, the substrates are lowered for treatment into a treatment fluid contained in a treatment device. The substrates are then lifted by a first receiving device at least partially out of the treatment fluid and transferred to a second receiving device for completely lifting the substrates out of the treatment fluid. The second receiving device is completely dry at the time of transfer. The drops forming at the lowest point of the substrates are drained during lifting by a drop draining element. The device for performing the method has a lifting device with a first and second receiving device and a drop draining device for draining the drops forming at the lowest point of the substrates during lifting of the substrates from the treatment fluid.

Abstract: A substrate is processed with a first process solution prepared by mixing sulfuric acid with a hydrogen peroxide solution, followed by processing the substrate with a second process solution. After the substrate is processed with the first process solution, the supply of sulfuric acid is stopped, with the hydrogen peroxide alone being supplied to the substrate. Then, the supply of the hydrogen peroxide solution is stopped, and the substrate is rinsed with a second process solution. The particular processing makes it possible to prevent the second process solution from reacting with sulfuric acid.

Abstract: A new configuration of a basic concatenatable integrated modular multiple chamber vacuum processing system for wafer manufacturing vacuum processes is disclosed. The basic system includes at least one multiple ported transfer vacuum chamber, an R-&thgr; transfer means contained within each chamber, a multiplicity of ports adaptable for appending a variety of vacuum process chambers as well as forming entrance/exit ports with at least one dual port pass through chamber attached to one entrance/exit port. Each pass through chamber contains a wafer alignment and/or orientation means for aligning or orienting the wafer as necessary in any of the appended process chambers. The configuration minimizes alignment or orientation errors due to inherent instability of the concatenated transfer means operations.

Abstract: In a method for cleaning a surface of a substrate an amount of a solution is applied on a surface of the substrate. After the solution is applied on the surface, crystallization of the solution is initiated to form a liquid-crystal mixture. Once the liquid-crystal mixture is formed, relative motion between the liquid-crystal mixture and the substrate is created to dislodge contaminants adhered to the substrate. In one alternative method, the solution is applied on a pad. In another alternative method, the substrate is place in a bath of the solution. A wafer cleaning module also is described.

Abstract: A wash tank has a conveyor belt traversing through a sterilizing wash bath. Fruit is loaded into the wash tank by way of an inclined ramp having a swinging barrier at the end thereof. The conveyor belt has rows of chevron shaped fingers extending generally transversely therefrom. The fingers extend through slots in the ramp to push the fruit through the swinging barrier and into a cage. The conveyor belt and fingers pass through the cage, which cage has a top and sides. The conveyor fingers push the fruit through the cage and the wash bath. The fruit, which tends to float, is kept wholly submerged in the wash bath by the cage. This ensures that the entire skin of the fruit is washed and sterilized. A grate along the sides of the conveyor captures large debris. Hold down plates guide the upper portion of the conveyor belt from a descending portion to a horizontal portion and then to an ascending portion relative to the water bath. There is also a second conveyor located at the outfeed end of the wash tank.

Abstract: A method for drying a substrate after the substrate is rinsed in a rinsing bath in which a rinsing liquid is contained. The substrate is vertically held selectively by first and second holders. The second holder is located between and below the first holders. Each of the first and second holders includes grooves with which the substrate is engageable. When the level of the rinsing liquid downwardly passes past the grooves of the first holders, the substrate is held solely by the second holder. Then, when the level of the rinsing liquid downwardly passes past the grooves of the second holder, the substrate is held solely by the first holder.

Abstract: A cleaning system for cleaning carriers or containers used to carry semiconductor wafers has a door cleaner adjacent to a centrifugal box cleaner. Box holder assemblies are attached to a rotor within the box cleaner. Upper and lower hooks on the box holder assemblies hold boxes as the rotor spins. The door cleaner has a base which holds doors in a vertical and upright position. An elevator lowers the base into an ultrasonic cleaning tank. The tank lid seals the tank during use. Ultrasonic cleaning fluid is filtered and cycled into and out of the tank. Boxes and their doors, such as front opening unified pods (FOUP) are both efficiently cleaned and handled.

Abstract: A method for cleaning an object to be processed in which the atmosphere in a drying chamber is replaced by an inert gas prior to placing an object to be cleaned from an external environment into the chamber. The object is then transported by an elongated retaining member from the drying chamber through a lower opening in the chamber into a processing bath disposed below the chamber. The object is then cleaned in the processing bath. The object is then transported from the processing bath to the drying chamber where it is dried by filling the atmosphere of the drying chamber with organic solvent. The cleaning process in the cleaning bath is carried out while the bath is screened by a nitrogen-gas curtain. The method also includes opening a lid of the chamber prior to insertion of the object into the chamber and closing the lid after insertion of the object, as well as the opening and closing of the lower opening in the chamber.

Abstract: A method for efficiently cleaning a cleaning subject, especially a method for cleaning an electrophotographic photosensitive member enables a uniform and high quality image to be obtained without leaving image defects and irregular images. The method includes a cleaning step during which the circulation flow rate during dipping of the cleaning subject in a cleaning solution is different from the circulation flow rate when the cleaning subject is pulled up, and where the cleaning solution is showered on the surface of the cleaning subject when it is pulled up. The cleaning method may be used in a method for manufacturing an electrophotographic photosensitive member for depositing a functional film by a plasma CVD method on a substrate.

Abstract: A clean, recirculating and processing method which prevents surface contamination of an object, such as a semiconductor, semi-conductor wafer, glass for LCD or magnetic disk is provided which includes covering the front and rear surfaces of an object to be processed with front and rear shielding plates and allows the object to rotate relative to the front and rear shielding plates. The fluid is supplied between the front surface of the object and the front shielding plate allowing the front surface to be processed. The remaining fluid is collected and recirculated between the rear surface of the object and the rear shielding plate allowing the rear surface of the object to be processed. An apparatus for accomplishing the method is also disclosed.

Abstract: Rolls of a strip line are cleaned by directing jets of a cleaning liquid thereagainst from nozzles which are mounted so that their distances from the roll to be cleaned can be set or controlled.

Abstract: A pre-clean deluge system for cleaning automobile white bodies including a cleaning solution filtration and distribution system. The filtration system includes a series of filters specially adapted to remove metal particles from the cleaning solution. The distribution system includes deluge cannons that are position so as to deliver cleaning solution to the interior of the white body in a location during the white body travel so that the particles flushed therefrom are introduced into a small tank prior to a main tank in which the white body is subsequently immersed. The distribution system also provides regulated flow of cleaning solution to the deluge cannons, as well as a bypass to facilitate cycling of cleaning solution for end-of-shift filtration purposes.

Abstract: In a method for rinsing and drying a semiconductor workpiece in a micro-environment, the workpiece is placed into a rinser/dryer housing. The rinser/dryer housing is rotated by a rotor motor. The rinser/dryer housing defines a substantially closed rinser/dryer chamber. Rinsing and drying fluids are distributed across at least one face of the semiconductor workpiece by the action of centrifugal force generated during rotation of the housing. A fluid supply system is connected to sequentially supply a rinsing fluid followed by a drying fluid to the chamber as the housing is rotated.

Abstract: A process and device for treating sheet objects, especially fragile sheet objects, by rotation through a liquid bath. The objects are disposed in radial slots in a rotating disk, retained therein by a flexible element moving synchronously with the disk, and by a retaining element mounted adjacent the disk and spaced therefrom along its axis of rotation.

Abstract: A washing and rinsing station intended for treatment of work pieces fastened onto a pallet. The station comprises a pallet table which is arranged to receive and deliver the pallet and to lock it at its place, wherein the pallet table is connected to a rotation axle for turning the work piece by inclining it away from the change position and to the treatment position. At least one pallet table is further connected on said rotation axle in a manner that said pallet tables swivel around the rotation axle at the same time and in the same direction along a circular route, when one pallet table is turned from the change position to the treatment position for washing, cleaning and drainage, wherein another pallet table is arranged at the same time to turn from the treatment position to the change position for a pallet change.

Abstract: A substrate processing apparatus (1) for processing wafers (W) has a first processing chamber (2) capable of containing the wafers (W) and a second processing chamber (4) capable of containing the wafers (W). The second processing chamber (4) is formed below and near the first processing chamber (2) and is capable of communicating with the first processing chamber (2). A wafer guide (6) carries the wafers (W) vertically between the first and second processing chambers (2, 4). A shutter (7) is opened to allow the first and second processing chambers (2, 4) to communicate with each other and is closed to isolate the same from each other. A steam supply system (8) including steam supply port, an ozone gas supply system (9) including ozone gas supply port and an IPA supply system (10) including IPA supply port are combined with the first processing chamber (2).

Abstract: Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe.

Abstract: A method and apparatus for reducing the risk of environmental contamination from mercury spillage during carry over between processing tanks during the gold ball bond removal process by providing a self-contained, compact, environmentally safe system for use with toxic chemicals and liquids. The present invention provides a self-contained, integrally molded enclosure upper and lower chambers separated by a partition. The partition has a plurality of stations integrally formed therein, each of which is capable of containing a chemical liquid. The method comprises dipping a slide containing the semiconductor chip first into a toxic liquid, then into a first decontamination station and finally into a second decontamination station.

Abstract: The present invention is related to a method of removing particles and a liquid from a surface of a substrate using at least one rotating cleaning pad. The approach, according to the present invention, is a technique wherein a sharp liquid-vapor boundary is created on the surface of the substrate adjacent to the last wetted rotating cleaning pad of a plurality of rotating cleaning pads and particularly between this last wetted rotating cleaning pad and a first edge of the substrate.

Abstract: An apparatus and method for drying one or more workpieces. The apparatus and method include the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chemically reactive additive. The chemically reactive additive creates a surface tension gradient that physically and chemically alters the properties of the film of the rinse liquid so that the liquid and any contaminants contained therein are removed from the wafer surface.

Abstract: Equipment arriving from an aircraft in transport carts is sorted in an air catering kitchen by transport carts with trays and tray equipment being sorted on one side of a conveyor belt whereas transport carts containing drawers and serving equipment are sorted at the opposite side of the conveyor belt, following which the equipment is taken to an industrial dishwasher. Trays and tray equipment are sorted by discharging the contents of the tray onto a conveyor belt following which the individual tray items are arranged in baskets. Transport carts containing drawers with serving equipment are sorted at the opposite side of the conveyor belt, the drawers being arranged on rollers mounted in the side walls of a box. Following washing of the equipment in the dishwasher, the serving equipment arrives at an area with cleaned transport carts where the equipment is again arranged in the transport carts following packaging in drawers.

Abstract: An apparatus and a method for locking a wire basket or a pod carrier basket in a support base for cleaning in an ultrasonic cleaning bath are provided. In the apparatus, a support base is constructed of an open bottom panel and four vertical posts emanating upwardly from four corners of the bottom panel adapted for moving upwardly and downwardly in the cleaning bath. At last two locking means each mounted on a diagonally opposing vertical post are provided and each equipped with a hook or catch for locking onto one of the two horizontal handle bars provided on a wire basket that is positioned in the support base. The present invention novel locking means for locking a wire basket in a support base allows a wire basket that has lightened load to be positioned in the support base without causing bodily injury to a machine operator, and allows the wire basket to be securely locked in the support base during an ultrasonic cleaning procedure without the basket floating problem.

Abstract: A method of cleaning an embossing roll used in an embossing process. The method includes steps of passing a paper web between a pair of embossing rolls and preventing or cleaning deposits from the surface of at least one embossing roll. Pressurized air is forced through an air nozzle having an elongated narrow outlet that directs the pressurized air as an air knife against the patterned surface of the embossing roll after the patterned surface rotates out of contact with the web. The air knife extends an embossing width of the embossing roll. A lubricant or solvent may be mixed with the pressurized air.

Abstract: A process and apparatus for drying semiconductor wafers, includes the controlled-rate extraction of a wafer immersed in rinsing liquid, irradiation of the wafer using high intensity lights or filaments along the wafer-liquid interface, and delivery of gas streams against the wafer along the wafer-liquid interface using a gas delivery system. Heating is controlled to create a temperature gradient without evaporating rinsing fluid adhering to surfaces of the wafer. Heating by the radiation sources creates a temperature gradient in the wafer in the irradiated region that simultaneously generates a surface tension gradient in the water adhering to the wafer. The gas delivery system removes the bulk of the water adhering to the wafer surface, and also suppresses the height of the rinsing liquid adhering to the wafer, providing faster extraction of dry and highly clean wafers from the rinsing liquid. A solvent vapor is optionally injected at the wafer-liquid interface, to reduce adhesion of the liquid to the vapor.

Abstract: The present invention relates to a method of cleaning and drying a semiconductor structure in a modified conventional gas etch/rinse or dryer vessel. In a first embodiment of the present invention, a semiconductor structure is placed into a first treatment vessel and chemically treated. Following the chemical treatment, the semiconductor structure is transferred directly to a second treatment vessel where it is rinsed with DI water and then dried. The second treatment vessel is flooded with both DI water and a gas that is inert to the ambient, such as nitrogen, to form a DI water bath upon which an inert atmosphere is maintained during rinsing. Next, an inert gas carrier laden with IPA vapor is fed into the second treatment vessel. After sufficient time, a layer of IPA has formed upon the surface of the DI water bath to form an IPA-DI water interface.

Abstract: An image forming material formed on a paper sheet and containing a color former, a developer and a decolorizer, is decolored by heating of the image forming material, contacting the image forming material with a solvent optionally containing a decolorizer, and removing a residual solvent from the paper sheet.

Abstract: A method and apparatus for handling substrates in a fluid container are provided. Even large substrates receive a particularly reliable support by means of at least one support strip that can be placed upon the upper edge portion of the substrates, and in particular in such a way that the support strip does not come into contact with treatment fluid in the tank.

Abstract: Before forming resin layers and metal thin film layers on a rotating supporting base, a belt-shaped object is run over the supporting base to remove foreign particles adhering to the supporting base. After a resin layer and a metal thin film layer are formed on the belt-shaped object and their formation conditions are optimized, the belt-shaped object is removed, and subsequently a layered product is formed on the supporting base. Thus, foreign objects adhering to the supporting base can be removed, and resin layers and metal thin film layers can be formed as desired.