Abstract: An automated semiconductor processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress semiconductor wafers. Process chambers are located in the process bay. A process robot moves between the indexer bay and process bay to carry semi-conductor wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Semiconductor wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract: The present invention is directed to a method, system, and apparatus for applying megasonic energy to the surface of a workpiece for the removal of contaminants. A nozzle dispenses a stream of deionized water or other cleaning fluid at a radial position on the surface. A stepping motor moves the arm over the surface, in a step-wise manner, allowing megasonic energy to be applied in a uniform manner. The workpiece is rotated at low speeds to provide a more uniform application. Chemical solutions may optionally be added to dissolve contaminants or change the Zeta potential of the contaminants to make particles easier to detach and suspend. A high-RPM dry spin cycle further removes cleaning fluid and suspended contaminants, preventing them from reattaching. The present invention is compatible with numerous types of workpieces including 12″ semiconductor wafers.

Abstract: A method and an apparatus for detecting contaminating species such as metal particles on a wafer edge from a semiconductor fabrication process are disclosed. In the method, a wafer is suspended and rotated in a container with a volume of solvent at a bottom portion of the container such that only an edge portion of the wafer is exposed to the solvent. After the wafer is turned in the solvent such that the entire edge portion of the wafer has been exposed to the solvent, the solvent may be removed for analyzing in an electronic instrument for detecting the species of contaminating particles. The apparatus further includes a wafer mounting device for supporting the wafer which can be adjusted in height to suit wafers of different diameters.

Abstract: A method and apparatus for transferring a wet object, such as a contact lens comprising a probe having a passage for at least one vacuum source, and a tip at one end of the probe for receiving the wet object, the tip comprising at least one aperature, the aperature being in communication with the passage; and the passage having at least one relief hole to provide for gas flow into the passage when the wet object is present over the aperature on said tip. A cleaning apparatus and method for a transfer apparatus for a wet object, comprising means for directing at least one source of fluid at said transfer apparatus at a location on said transfer apparatus above the expected location of a wet object on the transfer apparatus. A transfer apparatus for a wet object comprising a probe, means for receiving on said probe said wet object from a first station, and means for aligning said transfer apparatus with said first station to prevent damage to said wet object.

Abstract: A method for removing silicone sealant from glass-ceramic surfaces is provided. The method includes heating the sealant to a temperature greater than 325 degrees Celsius so that it thermally degrades and then, mechanically removing the sealant from the glass-ceramic surface. A method of salvaging a glass-ceramic cooking surface from a cooktop including silicone sealant between a cooktop frame and the glass-ceramic cooking surface is also provided. If a defect is detected in the cooktop during manufacturing or distribution, the entire cooktop is heated to a predetermined temperature to allow the silicone sealant to be easily removed without using a knife or other potentially damaging devices. Once the silicone sealant is removed, the glass-ceramic cooking surface may be reused to produce another cooktop assembly.

Abstract: A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multiple ports opening into the concave portion. The concave portion being capable of receiving an edge of a substrate and the ports including at least one process liquid injection port, at least one vacuum port and at least one surface tension control port.

Abstract: The invention relates to a method for cleaning a vehicle with a vehicle washing facility which comprises at least one first cleaning tool which is vertically aligned and can be moved past the vehicle in a longitudinal and in a transverse direction thereof and at least one second cleaning tool which is horizontally aligned, can be moved in a longitudinal direction of the vehicle and can be adjusted in a vertical direction in accordance with the contour of the vehicle. In order to develop the method further in such a manner that extra long vehicles can also be cleaned, it is suggested in accordance with the invention that a checking device checks whether the length of the vehicle exceeds a predetermined maximum value and that the rear of the vehicle and/or the front of the vehicle be cleaned only with the first or only with the second cleaning tool when the length of the vehicle exceeds the maximum value.

Abstract: An apparatus and method are disclosed that can process a substrate such as a wafer while keeping high cleanliness. The apparatus comprises a center port 100, which is stationarily arranged in the center and on the surface of which at least one blow-off outlet is provided for blowing off fluid, and a rotating housing portion 200 which is capable of rotating about the center port 100. The rotating housing portion 200 comprises a top plate 210 comprising a main surface S2 that opposes a wafer W, and a lower housing being connected to the top plate 210 and rotatably driven by a rotation-driving member. When the surface S1 comprising blow-off outlets 151a and 153a of the center port 100 is offset from the main surface S2 of the top plate 210 and fluid is blown off from the blow-off outlet 151a, the substrate W is contactlessly held above the main surface S2 of the top plate 210 and the surface S1 of the center port 100.

Abstract: A method for cleaning a wafer with a drip nozzle being configured for use in a drip manifold that is oriented over a brush of a wafer cleaning system is provided. The drip nozzle has a first end and a second end with a passage defined there between where the passage includes a wall that extends longitudinally between the first end and the second end. An orifice is defined within the passage and located at the first end of the drip nozzle. The method includes inputting a fluid into the drip nozzle at an acute angle relative to a longitudinal extension of the wall and reflecting the fluid stream off an internal wall of the drip nozzle at least twice in a direction that is toward the second end. The method further includes outputting at least one substantially uniform drop from the second end of the passage.

Abstract: An immersion processing system is provided for cleaning wafers with an increased efficiency of chemical use. Such a system advantageously uses less cleaning enhancement substance that may be provided as gas, vapor or liquid directly to a meniscus or wafer/liquid/gas bath interface so as to effectively modify surface tensions at the meniscus with minimized chemical usage. Such a delivery system design may be applied for single wafer processing or for processing multiple wafers together within a single liquid bath vessel. For single wafer processing, in particular, cleaning enhancement substance can be delivered along one or both major sides of the wafer, preferably at the meniscus that is formed as the wafer and liquid are relatively moved, while a processing vessel usable for such single wafer processing may itself be designed with a minimized size to accommodate a single wafer.

Abstract: A produce washing apparatus and method, which permits the washing of produce from both above and below in the field. The produce washing apparatus takes produce along a conveyor belt, from a loading section, to a washing section on which is located a washing unit, upward along an ascending section, and from there the produce travels along a dumping section and into a receptacle. The washing unit features spray nozzles located above and below the washing section, so as to direct spray from above and below the produce so as to more effectively wash it. The apparatus is preferably trailer mounted, so as to permit ready positioning in the field.

Abstract: A method and apparatus for removing a first liquid from a surface of a substrate is provided. A second liquid is supplied to at least part of a surface of a substrate having a rotary movement. The rotary movement has a center of rotation and an edge of rotation. The second liquid is directed from the center of rotation to the edge of rotation using a nozzle. A dry zone is created on the substrate as the position of the spray moves from the center of rotation to the edge of rotation. As a result, the first liquid and the second liquid are removed from the surface of the substrate.

Abstract: A method of removing surface-deposited contaminants, comprising bringing an ozone-containing treating solution into contact with the surface of a treating target on which contaminants have deposited. The ozone-containing treating solution comprises an organic solvent having a partition coefficient to ozone in a gas, of 0.6 or more, and ozone having been dissolved in the solvent. Contaminants having deposited on the surfaces of various articles including substrates for electronic devices, such as semiconductor substrates and substrates for liquid crystal display devices can be removed by room-temperature and short-time treatment in a high safety and a good efficiency.

Abstract: A vehicle washing apparatus and method utilizes an arch shaped support structure spanning the width of a washing area in which the vehicle is positioned. The arch shaped support structure comprises a rigid frame assembly with a pair of vertical support columns that move on a track along the sides of the vehicle. Attached to the support structure is a spray bar assembly and drive system. The spray bar assembly of preferred embodiments of the present invention has a first end and second end and is attached to the arch support structure at said ends by way of a first connecting member and a second connecting member respectively which are preferably configured as roller assemblies which engage guide. Also attached to the ends of the spray bar assembly are cables, lines, chains or the like connecting to a pair of counterweights that counter the weight of the spray bar assembly and facilitate easy movement of same within the support structure.

Abstract: A method for cleaning a semiconductor structure using vapor phase condensation with a thermally vaporized cleaning agent, a hydrocarbon vaporized by pressure variation, or a combination of the two. In the thermally vaporized cleaning agent process, a semiconductor structure is lowered into a vapor blanket in a thermal gradient cleaning chamber at atmospheric pressure formed by heating a liquid cleaning agent below the vapor blanket and cooling the liquid cleaning agent above the vapor blanket causing it to condense and return to the bottom of the thermal gradient cleaning chamber. The semiconductor structure is then raised above the vapor blanket and the cleaning agent condenses on all of the surfaces of the semiconductor structure removing contaminants and is returned to the bottom of the chamber by gravity.

Abstract: In accordance with one embodiment there is provided a method of improving the performance of a substrate cleaner of the type having a megasonic probe with a probe shaft extending generally parallel to a surface of a rotating substrate, and at least one dispenser for applying a cleaning liquid onto the surface of the substrate, wherein the megasonic probe agitates the liquid on the surface. The method comprising dissolving gas in the liquid before the liquid reaches the dispenser. In accordance with another embodiment, an apparatus for cleaning substrates comprises a rotary fixture which is adapted to support a substrate and rotate the substrate about a first axis, a probe having a probe shaft extending generally parallel to a surface of the substrate, and a megasonic transducer in acoustically coupled relation to the probe.

Abstract: A method for reconditioning the surface of a semiconductor substrate to remove an unwanted (i.e. defective) layer of photoresist is disclosed. The method adapts a conventional automated spinner which is used to rotate the substrate at high speed while a stream of a first solvent (e.g. acetone) is used to dissolve the photoresist. A stream of a second solvent (e.g. methanol) is then used to clean the substrate at a lower speed, with the substrate being allowed to dry with continued rotation. The method of the present invention can be used within a photolithography track so that the substrates need never leave the track for reconditioning.

Abstract: An apparatus and a method for removing coating layers from the top of alignment marks on a wafer are described. The apparatus includes a cleaning chamber that is a cavity and a lid member suspended in the cavity, a wafer chuck that is rotatably mounted in the lid member for holding a wafer in an upside down position such that the alignment marks are facing downwardly, and at least two solvent dispensing arms mounted in an outer peripheral area of the lid member that are immediately adjacent to the chuck for dispensing a flow of solvent upwardly toward the active surface of the wafer when the wafer is held in a stationary position, each of the at least two solvent dispensing arms are positioned corresponding to a position of one of the alignment marks.

Abstract: A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleaning liquid. The cleaning liquid is caused to contact the surface to be cleaned. Acoustic energy is applied to the liquid during such contact. Optionally, the surface to be cleaned can be oxidized, e.g., by ozonated water, prior to cleaning.

Abstract: A method and apparatus for drying a disk-shaped substrate. The substrate is typically a substrate used for the manufacture of magnetic disks, and has a centrally located opening. The substrate is lowered into a liquid bath by a first holder, which also becomes immersed in the bath. The first holder lifts the substrate until the substrate extends partially out of contact with the liquid. A second, dry holder grabs a dry portion of the substrate that extends out of the bath, and continues to lift the substrate out of contact with the liquid.

Abstract: A method of cleaning encrusted ballast comprises the steps of screening the encrusted ballast to separate detritus from the ballast, washing the screened ballast with water while removing the separated detritus on a conveyor belt unit, clarifying the washing water to produce a clarified water portion and washing water sludge, and disposing of the washing water sludge by moving it to the detritus on the conveyor belt unit for common removal with the detritus.

Abstract: The present invention is related to a method of removing particles and a liquid from a surface of a substrate using at least one rotating cleaning pad. The approach, according to the present invention, is a technique wherein a sharp liquid-vapor boundary is created on the surface of the substrate adjacent to the last wetted rotating cleaning pad of a plurality of rotating cleaning pads and particularly between this last wetted rotating cleaning pad and a first edge of the substrate.

Abstract: A method for cleaning a substrate with sherbet-like composition, comprising mixing the liquid organic agent and pure water in a mixing vessel to form a mixture, supercooling the mixture uniformly at a predetermined temperature while stirring the mixture, wherein the stirring includes creating vortices in the mixture, growing the vortices and diffusing the grown vortices in the mixture, thus providing sherbet-like cleaning composition and moving the sherbet-like cleaning composition relative to the substrate to be cleaned.

Abstract: An apparatus and a method for cleaning a torch for a vertical furnace used in semiconductor processing are disclosed. The apparatus is constructed by two main components of a basket-shaped fixture body and a cleaning bath. The fixture body is formed of cylindrical shape with a top ring, a bottom ring and three support rods connecting the two rings together. The top ring is provided with an outwardly extending flange portion for engaging an opening in a cleaning bath for supporting and suspending the fixture body in the bath. The bottom ring is equipped with a pair of symmetrically positioned, inwardly extending arcuate-shaped flange portions adapted for supporting an edge of a bottom surface of the furnace torch in the cleaning bath.

Abstract: A method using irradiation of substrates (12) with ultra violet light to remove a surface contaminant is described. The light can be pulsed or continuous. The treated surfaces are more paintable and bondable.

Abstract: A method of processing a semiconductor workpiece, wherein sonic agitation is applied to the workpiece during a Marangoni drying or surface tension gradient drying step. Sonic agitation is applied to the workpiece as it is withdrawn from an aqueous liquid in a process vessel, or as the aqueous liquid is drained from the process vessel. As a result, the cleaning and drying steps are performed simultaneously as a single comprehensive process, which enhances workpiece cleaning while reducing processing times, chemical volumes, and overall costs.

Abstract: A method of removing organic impurities from a surface of a substrate that is used for feeding or processing web material, wherein a jet of an atmospheric plasma is directed onto the surface of the substrate.

Abstract: A device for pickling or cleaning rolled steel strip which is moved in the form of loops through several pickling and cleaning containers arranged within a treatment line, wherein at least one strip side is subjected tot he action of a pickling or cleaning medium. For this purpose, squirting or spraying units are provided which can be switched on or off and/or are adjustable with regard to their spraying width and/or are operated with controllable squirting or spraying pressure and/or volume flow. Deflection rolls for deflecting the strip are arranged before and after the treatment line for deflecting the strip out of the horizontal strip running plane into an upright vertical strip running plane and vice versa, wherein the deflection rolls are elevated or slanted relative to the horizontal strip running plane.

Abstract: A method of removing cured silicone polymer deposits from electronic components. The components are immersed in a preheated solution of a quaternary ammonium fluoride in a hydrophobic non-hydroxylic aprotic solvent with agitation. The components are then immersed in a preheated solvent consisting essentially of a hydrophobic aprotic solvent with agitation. This is followed by a rinse and spray of the components with a hydrophilic, essentially water soluble solvent, with agitation. The components are then immersed in a water bath and then rinsed with a pressurized spray of water and then dried with a N2 blow dry.

Abstract: This invention relates to liquid dispensing and to a method of rinsing micro-dispensing syringes. In particular, the invention relates to a method of rinsing syringes of the plunger-in-needle type provided in an array.

Abstract: A semiconductor wafer is cleaned while a sponge or brush is pressed against the wafer with a constant forced applied utilizing a bias in a constant force pencil. The wafer is cleaned in the state wherein a collapsing portion of the constant force pencil with respect to the cleaning sponge cloth is set in such a way that the cleaning pressure, which is applied from the cleaning sponge to the wafer, can be constant and is adjustable. A method for cleaning wafers using a constant force pencil is also described.

Abstract: A Ferris wheel-like stripping or cleaning mechanism that can be used in semiconductor fabrication, such as in photoresist or other stripping, or wafer or other cleaning, is disclosed. A stripping mechanism can include a container to hold a chemical, such as a photoresist stripping chemical, a wafer cleaning chemical, or another type of chemical. The mechanism can also include a component to move semiconductor wafers through the chemical in the container in a Ferris wheel-like motion. The component may include wafer holders for the wafers that are swivably mounted about an axis of rotation. As the one or more wafer holders rotate about the axis of rotation through the chemical in the container, the wafer holders remain in a substantially constant vertical and horizontal orientation.

Abstract: A sponge mop is fitted with a wringing device. The wringing device includes a sleeve that slidably surrounds the handle of the mop. A roller is attached to the sleeve and is spaced from the sleeve. A drive member is pivotally attached at one end to the mop head and at the other end to a small slide block that slides on a handle-mounted rail. The slide block bears against a portion of the sleeve housing with adequate pressure so that downward movement of the sleeve moves the slide block and thus the drive member, thus effecting the rotation of the mop head by, ultimately, 90 degrees such that the sponge is positioned with its cleaning face parallel to the axis of the handle. Further downward travel of the sleeve allows the roller on the device to expel water held by the sponge. A scrubber/scraper is attached to the mop head at the end which is remote from the handle when the mop head is generally aligned with the handle.

Abstract: A process chamber assembly for use with a substrate and a flow of process fluid includes a vessel and a spray member. The vessel defines a chamber. The spray member includes at least one spray port formed therein adapted to distribute the flow of process fluid onto the substrate in the chamber. The spray member is operative to rotate about a rotational axis relative to the vessel responsive to a flow of the process fluid out of the spray member through the at least one spray port.

Abstract: A device for cleansing skin includes a small cup forming a cavity and a spray nozzle connected to a source of cleansing fluid. The cup is easily manipulated to place the edge of the cup on the surface of skin to be cleansed so that the nozzle is aimed at the skin. The cup prevents splattering of the fluid. A drain line may be included in the cup to drain spent washing fluids.

Abstract: In a method of cleaning a deposition process chamber, a remotely generated activated gas is supplied to the process chamber, in which, depending on the type of excitation means used, a specified chamber pressure in combination with a two-step clean process allows one to significantly reduce nitrogen fluoride (NF3) consumption and increase throughput.

Abstract: Semiconductor wafer (11) are uniformly and thoroughly cleaned of particulate and organic contaminants by sweeping the wafer with a hydraulic broom that sprays cleaning solution onto the wafer. The broom contains an aspirating nozzle (3) for connection to a source of pressurized gas, such as nitrogen, and to a source of cleaning fluid, such as acetone, wherein cleaning fluid aspirated by the gas stream is expressed through the nozzle outlet to impact the surface of the wafer, dislodging particulate matter and dissolving organic contaminants. A programmed controller (9) controls movement of the hydraulic broom relative to the wafer to ensure that the entire surface is cleaned and permits a variety of sweeping patterns.

Abstract: A cleaning apparatus for cleaning solder paste off the bottom side of a printed circuit board stencil includes a container of cleaning solution therein and a blade holder that is movable between a wiping position and the container of cleaning solution. A wiping blade is mounted in the blade holder. The blade holder, with the blade mounted thereon, is reciprocated back and forth when in communication with a stencil to be cleaned. The blade is moved from the wiping position in communication with the stencil into the cleaning solution in the container. A pneumatic piston and rotary actuator provides controlled movement of the wiping blade. The wiping blade may be vibrated during wiping to improve removal of solder paste from the stencil and the cleaning solution may be ultrasonically vibrated to improve removal of solder paste from the wiping blade. The wiping blade may also be pulsed into a sponge to remove excess cleaning solution prior to the next cleaning cycle.

Abstract: An electro-kinetic electrostatic air conditioner includes a mechanism to clean the wire-like electrodes in the first electrode array. A length of flexible Mylar type sheet material projects from the base of the second electrode array towards and beyond the first electrode array. The distal end of each sheet includes a slit that engages a corresponding wire-like electrode. As a user moves the second electrode array up or down within the conditioner housing, friction between slit edges and the wire-like electrode cleans the electrode surface. The sheet material may be biasedly pivotably attached to the base of the second electrode array, and may be urged away from and parallel to the wire-like electrodes when the conditioner is in use. Another embodiment includes a bead-like member having a through opening or channel, through which the wire-like electrode passes.

Abstract: A method and system for reducing particulate contamination of a photomask used in lithographic printing. A reticle assembly comprises a pellicle frame and membrane which is adhered to a reticle and encloses an air space over a photomask of the reticle. Particulate matter which can adversely affect a lithographic printing result can be present within the enclosed air space. According to the invention, an interior wall of the pellicle frame is provided with an adhesive surface, and the reticle assembly is subjected to a dislodging motion to dislodge the particulate matter on the photomask surface and cause it to be directed toward the adhesive surface of the interior wall and adhere thereto, removing this particular matter from the focal plane of the lithographic optics.

Abstract: A to-be-cleaned substrate is cleaned by use of an acid liquid agent in a cleaning cup, the remaining acid liquid agent is washed out by use of pure water, then an alkaline liquid agent is emitted to the surface of the to-be-cleaned substrate in the same cleaning cup to remove the acid liquid agent remaining on the to-be-cleaned substrate. A neutralization reaction between the acid and alkali is caused by emitting the alkaline liquid agent to the surface of the to-be-cleaned substrate so as to efficiently remove the acid liquid agent remaining on the surface of the to-be-cleaned substrate.

Abstract: This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece and corresponding reactor are spinning about an axis of rotation that is generally orthogonal to the center of the face of the workpiece being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract: A method of dry cleaning surfaces of a semiconductor wafer includes the steps of placing a processed wafer in a vacuum environment and positioning a pad near each of a front surface and a back surface of the wafer. Cleaning gas is injected into a small clearance formed between each pad and the front and rear surfaces to generate a high-speed gas flow along the surface of the wafer. Particles left at the surfaces of the processed wafer are physically cleaned and removed with the high-speed gas flow. In order to assist this physical cleaning action, it is also possible to apply either a chemical cleaning method or an electrical cleaning method under application of plasma.

Abstract: A produce washing method, which permits the washing of produce from both above and below in the field. Produce is transported along a conveyor belt, from a loading section, to a washing section on which is located a washing unit, upward along an ascending section, and from there the produce travels along a dumping section and into a receptacle. The washing unit features spray nozzles located above and below the washing section, so as to direct spray from above and below the produce so as to more effectively wash it.

Abstract: A glass sheet washing machine with a broken glass removal system includes a support, a liquid container or reservoir, a pump, a liquid applicator, and a liquid permeable member. The support supports a glass sheet being washed. The liquid reservoir is positioned below the support. The pump is coupled to the liquid reservoir. The liquid applicator is coupled to the pump. The liquid applicator applies the liquid from the liquid reservoir to wash the glass sheet. Excess liquid falls into the reservoir. The liquid permeable member is positioned between the support and the liquid reservoir to catch pieces of glass to inhibit the pieces of broken glass from falling into the liquid reservoir and is moved to remove the pieces from the glass washing machine.

Abstract: The wafers W are dipped and rinsed in pure water in the processing bath 60, and then dichloromethane is fed into the processing bath 60, thereby changing the state of the wafer W from being dipped in pure water to being dipped in dichloromethane. Thereafter, the wafers W is raised up to the drying chamber 61, and dichloromethane remained on the surface of each wafer W is evaporated, and the hot N2 gas is discharged onto the wafers W. Thereby, no water marks are produced, and no resist is dissolved, and the substrate can be dried in safety.

Abstract: There is disclosed a scrub cleaning device which can reduce cleaning time and which requires no large-scaled device for transferring a substrate to the next cleaning process.

Abstract: A washing machine and a method for guiding use of the same are disclosed. The method for guiding use of a washing machine having an LCD includes the steps of displaying at least one or more washing strokes on the LCD if a user selects a washing following menu displayed in the LCD by applying a power source, selecting a desired washing stroke from the displayed washing strokes, and displaying a guide message for processing the selected washing stroke. The method provides the user with convenience for use and processes the exact washing stroke.

Abstract: There are provided a band-shaped tray 12 having grasping grooves 12a for grasping opposite side ends of wafers 1, and a cleaning tank 20 to which the wafers 1 inserted in the tray 12 are conveyed by a conveyor robot 2 to be cleaned. The cleaning tank 20 is provided with guides 22 for mounting the tray 12 in the tank, a bottom portion 26 formed substantially in V-shape conforming to the bottom-face shape of the wafer 1, and flow ports 24 via which cleaning fluid is supplied into the tank. An outer side face of the cleaning tank 20 is provided with an overflow tank 30 for containing the cleaning fluid overflowing from the cleaning tank 20, and the overflow tank 30 is provided with a circulation line 32 for circulating the cleaning fluid again into the cleaning tank 20.

Abstract: Provided is an apparatus and method for cleaning and drying a semiconductor wafer. Isopropyl alcohol and deionized water are premixed in a desired ratio before a cleaning solution containing isopropyl alcohol and deionized water is supplied into a treating bath. Accordingly, a chemical compound remaining due to deionized water can be effectively removed and the creation of water marks due to isopropyl alcohol can be effectively prevented. As a result, cleaning and drying effects can be increased and a cleaning solution can be reused.