Abstract: A vehicle washing device that concentrates a spray of high pressure water on the wheels of the vehicle for an extended period of time is disclosed. A vehicle washing device is located on either side of the vehicle so as to direct a spray of high pressure water therefrom toward the vehicle as it passes thereby. An actuating mechanism is provided for each of the vehicle washing devices permitting the washing device to rotate about its vertical axis so as to direct the water spray therefrom for an extended period of time toward each of the vehicle wheels. In this manner, the “dwell” time of the high pressure water spray from each vehicle washing device is increased on the front wheels and on the rear wheels of the vehicle, thus allowing the wheels to be cleaned without manually scrubbing same.

Abstract: An apparatus for conveying a workpiece as used to convey the workpiece such as a semiconductor wafer, a glass substrate or liquid crystal panel, between processing apparatuses when the workpiece is processed in the plurality of processing apparatuses. The amount of liquid on a surface of a workpiece is adjusted to a predetermined amount, and the workpiece, which retains the predetermined amount of liquid, is conveyed between processes. The adjusting includes both supplying a sufficient amount of liquid onto the surface of the workpiece, which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

Abstract: A cleaning system and method utilizing sonic whistle and other agitation methods to enhance the soil removal and mass transport capacity of the liquid carbon dioxide at low process temperatures. Agitation devices disposed in or couple to a cleaning chamber, and cause the liquid carbon dioxide to ultrasonically emulsify and disperse non-miscible liquids or insoluble solids, such as remove low solubility oils and greases. Cleaning is accomplished at temperatures between −68° F. and 32° F., and the temperature of the liquid carbon dioxide is typically below 32° F.

Abstract: The present invention is related to a method of removing particles and a liquid from a surface of a substrate using at least one rotating cleaning pad. The approach, according to the present invention, is a technique wherein a sharp liquid-vapor boundary is created on the surface of the substrate adjacent to the last wetted rotating cleaning pad of a plurality of rotating cleaning pads and particularly between this last wetted rotating cleaning pad and a first edge of the substrate.

Abstract: A cleaning unit for cleaning a substrate is disclosed, that comprises a holding mechanism for rotatably and horizontally holding the substrate, a first traveling means for holding both sides of a cleaning mechanism having at least one cleaning member and for moving the cleaning mechanism in such a manner that the first traveling means is kept in parallel with the substrate held by the holding mechanism, and a second traveling means for holding both sides of a processing solution supplying mechanism having supplying mechanisms for supplying different types of processing solution and for moving the cleaning mechanism in such a manner that the second traveling means is kept in parallel with the substrate held by the holding mechanism. Thus, the strength of the cleaning unit according to the present invention is higher than the strength of a conventional cleaning unit that holds an arm on one side thereof.

Abstract: A cleaning and drying apparatus includes a cleaning bath 22 for collecting cleaning liquid and also discharging the liquid, a drying chamber 23 arranged above the cleaning bath 22 and a wafer boat 24 for conveying semiconductor wafers W between the cleaning bath 22 and the drying chamber 23. Dry gas nozzles 37 for ejecting dry gas are provided in the drying chamber 23. A shutter 36 is arranged between the cleaning bath 22 and the drying chamber 23, for insulating the cleaning bath 22 from the drying chamber 23. A central processing unit 60 controls respective operations of the dry gas nozzles 37 and a driving unit 52 for the shutter 36. With the arrangement, after the wafers W have been cleaned in the cleaning bath 22, the cleaning liquid is discharged through a bottom of the bath 22, while the dry gas is supplied from the dry gas nozzles 37 to contact with surfaces of the wafers W and the cleaning liquid in a first drying process.

Abstract: A heated high pressure air and/or a high pressure water are spouted through nozzles. Therefore, the coated layer is removed without crushing the bumper unlike in the conventional method, and therefore, a plurality of process steps can be skipped. Thus the bulk of the apparatus can be reduced, the operating cost can be lowered, and the environment can be protected. The method for removing a coated layer includes the step of installing a bumper to be subjected to a removal of the coated layer. Then the coated layer is removed from the bumper by spouting water and/or a pre-heated air to the bumper. Then the bumper is carried to a predetermined psition after removing the coated layer, and then the bumper is detached. The apparatus includes an installing/detaching means for installing/detaching the bumper to be subjected to a removal of the coated layer.

Abstract: For cleaning a wafer by a cleaning apparatus, a cleaning liquid is contained in a cleaning bath. Leaving two brushes open, the wafer is inserted to the cleaning bath, placed on oscillation and rotation rollers and retained by the rollers. The brushes are closed and the wafer is held by the brushes. Next, the two brushes are rotated while the wafer is oscillated and rotated by the rollers and so on. Furthermore, ultrasonic vibrations are applied to the cleaning liquid in the cleaning bath by an ultrasonic generator. Scrub cleaning with the two brushes and ultrasonic cleaning by ultrasonic vibrations are thereby performed on the wafer.

Abstract: The invention relates to a transfer label including a backing layer and a transfer layer which is releasably attached to the backing layer. The transfer layer includes an ink layer and on each side of the ink layer a top and bottom containment layer. The top and bottom containment layer contact one another outside the perimeter of the ink layer to form a closed envelop around the ink layer. The transfer label according to the present invention can be applied to a container such as a crate and can be easily removed therefrom in a washing process without the ink dissolving in the wash liquid.

Abstract: An apparatus having a processing chamber for processing a semiconductor wafer under evacuated conditions that is capable of transfer of the wafer from the processing chamber under conditions that are substantially equal to the pressure of an adjacent environment. In a preferred embodiment, the processing chamber is pressurized and vented with a source of high purity dry gas that is diffused into the chamber through a diffuser to pressurize the processing chamber after processing of the wafer is completed. A chamber equalization port between the processing chamber and the adjacent environment is opened to maintain the pressure within the chamber at or slightly above the pressure of the adjacent environment, and the chamber valve is then opened. The wafer can then be removed from the processing chamber, and a new wafer can be inserted. The chamber is then sealed by closing the chamber valve and the equalization port, and the atmosphere within the processing chamber is evacuated to a desired level.

Abstract: A process and apparatus for pickling the surface of stainless steel strip feeds the stainless steel strip through a plurality of pickling tanks containing a hydrochloric acid pickling acid. The pickling acid bath is maintained at a temperature of at least about 40° C. An oxidizing agent is added to the acid solution in an amount to maintain at least about one third and preferably at least about half of the soluble iron in the form of ferric chloride based on the total amount of iron in the acid solution.

Abstract: A method of removing particles adhering to a surface of a semiconductor wafer including the steps of: providing a container having a drain valve; positioning the semiconductor wafer in the container; directing a jet stream consisting of water against the surface of the semiconductor wafer; removing particles adhering to the surface of the semiconductor wafer by scrubbing the surface of the semiconductor wafer with a brush while the jet stream of water is directed against the surface of the semiconductor wafer; closing the drain valve while the jet stream of water is directed against the semiconductor wafer, wherein the water accumulates in the container to thereby completely immerse the brush and the semiconductor wafer in the water in the container; and maintaining the brush and the semiconductor wafer completely immersed in the water from the jet stream for a predetermined period of time.

Abstract: A method of removal of polymers of the type including bromine, chlorine, silicon, and carbon, present on a semiconductor wafer partly covered with resist, including of rotating the wafer in its plane around its axis, in an enclosure under a controlled atmosphere, at ambient temperature, including the steps of rotating the wafer at a speed included between 500 and 2000 CPM in an enclosure filled with nitrogen; sprinkling the wafer with water, substantially at the center of the wafer; introducing hydrofluoric acid during a determined cleaning time, while maintaining the sprinkling; and rinsing the wafer by continuing the sprinkling to remove any trace of hydrofluoric acid from the wafer, at the end of the cleaning time.

Abstract: The treatment, for example the cleaning of holes or recesses in workpieces, is problematic when the holes or recesses have an opening width of below 0.5 mm, and especially when the latter do not penetrate the workpiece (blind bores). In known methods, gas bubbles adhering to the side-walls of holes of this type cannot be removed or liquids situated within the holes cannot be effectively exchanged. With the method according to the invention an effective exchange of the liquid contained in the holes and situated outwith the holes is made possible. For this purpose the liquid treatment means is sprayed as a jet into the holes, said jet having a diameter which is smaller than that of the holes. Furthermore, a device is described for carrying out this method which is characterised by a nozzle with one or several nozzle discharge openings with a diameter below 0.

Abstract: A process for descaling, derusting, dissolving, and removing machining lubricants coated on steel and other iron alloy objects, the process comprising the steps of: (a) providing an alkaline cleaning solution consisting of: water; about 2.5% to 25% by weight of a water-soluble alkali; about 2% to 8% by weight of sodium gluconate; about 5% to 20% by weight of sodium xylene sulfonate; and about 2% to 20% by weight of a water-soluble surfactant consisting of C9-C11 alcohol ethoxylates and 6 ppm of ethylene oxides; and (b) contacting the soiled object with the alkaline cleaning solution at a temperature of about 60° F. to 200° F. for about 3 to 30 minutes, wherein the object is descaled, derusted, and the machining lubricant is dissolved and removed.

Abstract: A system and method for cleaning very small spherical shaped semiconductor devices is disclosed. The system includes an enclosure for housing a pair of rollers. The enclosure also includes a fluid inlet for receiving a cleaning agent and a product inlet for receiving the spherical shaped semiconductor device. A motor rotates one or both of the rollers. In operation, the spherical shaped semiconductor device and the cleaning agent are provided into the enclosure. The device passes to the pair of rollers and is cleaned by the cleaning agent and the rotating rollers. Once cleaned, the spherical shaped device and cleaning agent pass into a separator and the device is fully cleaned.

Abstract: A method of cleaning a web of photo film during manufacturing, wherein the web of photo film is transported in its lengthwise direction, and a cleaning tape made of felt is pressed onto an entire area or a side portion of a surface of the photo film or a side edge of the photo film, while the photo film and the cleaning tape are transported in opposite directions.

Abstract: Radioactively contaminated material is cleaned by contacting the material with a decontaminating liquid comprising an aqueous solution of nitric acid containing an NOx generating agent. The NOx generating agent may be a nitrite, for example, sodium nitrite, or a ferrous metal. The material to be cleaned may comprise a plastics material contaminated with uranium or other actinides. Cleaning is effected by placing the material in a rotatable, apertured vessel in which the material is subjected to a leaching cycle by contact with the decontaminating liquid and then a washing cycle in which the material is contacted with a washing liquid.

Abstract: A method and apparatus for conveying workpiece is used for conveying a workpiece such as a semiconductor wafer, glass substrate or liquid crystal panel between processing apparatuses when the workpiece is processed in a plurality of processing apparatuses. The method includes adjusting the amount of liquid on a surface of a workpiece to a predetermined amount, and conveying the workpiece which retains the predetermined amount of liquid between processes. The surface of the workpiece is kept wet by the liquid on the workpiece. The adjusting includes supplying a sufficient amount of liquid onto the surface of the workpiece which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

Abstract: A method of manufacturing fluid tubing such as fuel or brake tubing utilizes fluid tubing which includes a metal tube with a longitudinal axis, a corrosion resistant metal coating over the metal tube, a binder layer over the metal coating and a plastic coating over the binder layer. A water jet cutter is positioned adjacent to the fluid tubing. The fluid tubing and/or the water jet cutter are moved in a feed direction parallel to the longitudinal axis. The fluid tubing and/or the water jet cutter are rotated about the longitudinal axis. A water jet is jetted from the water jet cutter against the fluid tubing substantially tangentially to the metal tube and at an acute angle to the longitudinal axis, whereby the plastic coating and the binder layer are removed from the fluid tubing and the metal coating remains substantially intact on the metal tube.

Abstract: A method for drying workpieces in accordance with our invention includes the step of immersing the workpieces in a liquid, holding the workpieces with a first holding mechanism, slowly draining the liquid from the container until a first portion of the workpieces is exposed and dried, holding the workpieces with a second holding means at the first portion, and draining the remainder of the liquid from the container. Because of this, a drying portion of the workpiece is not held by a wet holding mechanism.

Abstract: A method for ashing a resist pattern covered by a hardened layer caused by an ion implantation process previously conducted including a first step for conducting an ashing process at a first temperature e.g. 129° C. or less at which no popping phenomenon happens, for removing the hardened layer, and a second step for conducting an ashing process at a second temperature e.g. 150° C. at which the ashing rate is high, for entirely removing the remaining resist pattern, and apparatus employable for the method for ashing a resist pattern covered by a hardened layer including a mechanism for moving up and down a semiconductor wafer to regulate the temperature of the semiconductor wafer and including a shutter which intervenes between the semiconductor wafer and a heater.

Abstract: A heated high pressure air and/or a high pressure water are spouted through nozzles. Therefore, the coated layer is removed without crushing the bumper unlike in the conventional method, and therefore, a plurality of process steps can be skipped. Thus the bulk of the apparatus can be reduced, the operating cost can be lowered, and the environment can be protected. The method for removing a coated layer includes the step of installing a bumper to be subjected to a removal of the coated layer. Then the coated layer is removed from the bumper by spouting water and/or a pre-heated air to the bumper. Then the bumper is carried to a predetermined psition after removing the coated layer, and then the bumper is detached. The apparatus includes an installing/detaching means for installing/detaching the bumper to be subjected to a removal of the coated layer.

Abstract: A method of cleaning tissue webs in a rewinder utilize the Coanda effect to produce an improved tissue product. The Coanda effect web cleaner utilizes the smooth flow of a thin layer of air to scrub off dust and lint embedded and entangled in the web surface while stabilizing the web in its travel. Two of these Coanda effect web cleaners arranged on opposite sides of a multiple-ply web in a rewinder are effective when operated according to the method of the invention to produce a rewound tissue with an unexpectedly low loose dust and lint count on its surfaces.

Abstract: In this method for washing motor vehicles in a gantry-type washing installation with two movable gantries, washing is performed with a single pair of vertical brushes which wash between two horizontal brushes and are located on one of the two gantries. During a forward movement of the gantries, the washing process is commenced with the first horizontal brush in the front third of the vehicle, while the nose is washed with the two vertical brushes. Then the nose and the top of the vehicle approximately up to the rear third of the vehicle are washed with the second horizontal brush. The direction of travel of the gantries is reversed as soon as the tail wash has been executed with the two vertical brushes and before the second horizontal brush has reached the tail of the vehicle.

Abstract: The water-repellent mixture comprises i) a halogenated dispersant chosen from the group constituted by a totally halogenated molecule and a partially halogenated molecule with at least one atom of hydrogen and ii) a copolymeric silicone having a hydrophilic function, for drying solids by the movement of water, the copolymeric silicone preferably being a polyalkylineoxide modified polydimethylsiloxane of formula: with 0≦m≦100, 4≦n≦50 and R being a radical chosen from the group of radicals constituted by a hydrogen atom, an alcohol group, an amine group and a polyalkyl group containing 1 to 5 carbon atoms.

Abstract: A process for extracting inorganic ionic contaminants from a front surface of a silicon wafer for chemical analysis. The wafer is placed in a container upon a support which holds the wafer in a generally level orientation and isolates the wafer to inhibit air circulation over the front surface. Air circulation can introduce contaminants to the extraction fluid, causing a false measurement of contaminants on the wafer. A layer of extraction fluid is deposited upon only the front surface of the wafer and held for a period of time so that contaminants on the front surface are extracted into the layer of fluid. A portion of the layer of fluid is collected by a sampling device for subsequent analysis.

Abstract: A machine dish washing process wherein a detergent is given such a composition and/or is dispersed over the crockery in such a way that with the detergent a cleaning layer with an appearance distinct from water is formed on preferably at least substantially the complete surface of the crockery, which distinction preferably can be discerned by the naked eye.

Abstract: Material retained on a trash rake is washed in a washing chamber by compacting the material before it enters the washing chamber with a screw conveyor passing horizontally through the washing chamber, injecting washing water into the washing chamber until the washing water has reached a level determined by the material in the washing chamber to loosen and wash the compacted material to wash out contaminations, draining the washing water and the contaminations through a screen from the washing chamber to dewater the material, and discharging the dewatered compacted material from the washing chamber. To assure advantageous washing conditions, the injection of washing water is periodically discontinued to lower the level of the washing water filling the washing chamber periodically from this level to a residual level sufficient to ensure discharge of the material from the washing chamber.

Abstract: A workpiece is moved past a rotor descaling device, which intermittently sprays the workpiece with at least one liquid jet formed intermittently in dependence on angular positions of a rotor rotating on a rotational axis intersecting the surface (23) of the workpiece (22).

Abstract: A particulate removal and lens bond test device includes a base for receiving a waffle pack holding a plurality of optical subassemblies (OSAs) to be tested and an associated applicator for applying a predetermined flow of gas across the OSAs to remove loose particulates and to test the bond strength of the lens on the OSA. The applicator includes a flow regulator and a plurality of orifices arranged to direct the flow of gas onto each individual OSA in the waffle pack.

Abstract: Process for cleaning a transport belt of a machine for manufacturing and/or processing a material web with at least one cleaning device. The process includes detecting the contamination of the transport belt with at least one sensor, generating a state matrix which contains the location coordinates of the detected contamination, and one of controlling and regulating the at least one cleaning device for cleaning over at least a width of the transport belt with a varying desired intensity of cleaning in accordance with the generated state matrix.

Abstract: In a method for removing toner or similar substance deposited on a recording sheet or similar sheet, projections are formed on a back-up member and located at portions on which the rear of a separating member slide. While a sheet is passed through a pressing portion in contact with the separating member, the projections raise the rear of the separating member toward the surface of the sheet carrying the toner. Hence, even solitary particles of the substance adjoining relatively thick and large masses of the substance can contact the front of the separating member. Hence, the solitary particles are prevented from remaining on the sheet.

Abstract: A method and an arrangement is provided for treating substrates, such as, for example, silicon wafers (1), in which the latter are immersed for some time in a bath (2) containing a liquid (1) and are then taken therefrom so slowly that practically the whole quantity of liquid remains in the bath (2). According to the invention, the substrates (1) are brought from the liquid (3) directly into contact with a vapor not condensing thereon via leads (17) with outlet nozzles (18). The vapor is of a substance miscible with the liquid (3), which, when mixed therewith, yields a mixture having a surface tension lower than that of the liquid. It has been found that no drying marks with organic or metallic residues or other contaminations then remain on the substrates (1).

Abstract: Radioactively contaminated material is cleaned by placing the material in a permeable container, such as a bag, and inserting the container into an apertured, rotatable vessel. The material is then subjected within the rotating vessel to a leaching cycle, using nitric acid, and a washing cycle, using fresh water. Preferably, at least one further washing cycle is employed. After discharging the washing liquid, the material is subjected to a spin-drying operation. The material undergoing cleaning is a filter medium which includes a glass component.

Abstract: A process and machine for cleaning ophthalmic lenses and blocks heats a washing solution in a wash tank and a rinsing solution in a rinse tank to approximately 140.degree. F. Ultrasonic wave agitation is then initiated in the solutions. A set of lenses or blocks is immersed in the ultrasonically agitated washing solution for approximately one-half the predetermined time of the wash cycle. Mechanical agitation of the immersed set of lenses or blocks is initiated in the ultrasonically agitated washing solution for the remainder of the predetermined time of the wash cycle. The set of lenses or blocks is then raised above the washing solution for a predetermined drip period. The set of lenses or blocks is then immersed in the ultrasonically agitated rinsing solution for approximately one-half the predetermined time of the rinse cycle.

Abstract: A washing method provides a liquid jet washing by jetting a liquid against a rotating thin-plate-shaped workpiece from a nozzle which shifts while being positioned opposite a front or back surface of the workpiece, thus removing dust adhering to the front or back surface and thereby washing the workpiece. The locus of the shifting nozzle is caused to pass in the vicinity of, but not over, the center of rotation of the workpiece. Electronic circuitry present at the central portion of workpiece is prevented from suffering electrostatic breakage caused by collision with washing liquid. At the same time, an appropriate quantity of washing liquid is made to collide with the entire surface of a workpiece, so that the workpiece can be washed satisfactorily.

Abstract: Artificial filament is washed, rinsed and dried in a portable apparatus. The filament is fed onto a substantially horizontal conveyor for transportation through a washing cycle. A plurality of oscillating spray nozzles provide a washing solution from over the filament material as it is transported on the conveyor. The washed filaments are distributed to an upward sloping conveyor which directs the filaments between two substantially vertical conveyors belts. The filaments are rinsed while being carried upward between the vertical conveyor belts. The filaments are then transported horizontally on a conveyor belt. Drying nozzles direct air across the filaments to dry the filaments. The dried material is then ejected from the apparatus or redirected to the washing conveyor if it is determined that a second cleaning cycle is required.

Abstract: A pickling plant for a steel strip and a method for controlling the pickling plant, including monitoring at least one quantity of state represented by thickness, width and quantity of scale of the steel strip, and at least one quantity of state of operation of a plant represented by concentration, quantity and temperature of acid supplied into a pickling tank of the pickling plant, line speed of the steel strip, and temperature of the steel strip immediately before entering the pickling tank calculating on the basis of values of said quantity of state and quantity of state of operation, at least one of concentration distribution of acid, concentration distribution of iron and descaling rate at optional plural positions, and on the basis of the calculating the optimum quantity of state for operation of the plant is determined.

Abstract: A method is provided for cleaning a surface of an embossing roll in which the surface of the embossing roll is cleaned by directing pressurized air through an air nozzle as the embossing roll rotates. The air nozzle directs the pressurized air as an air knife that extends for the width of the embossing roll to clean the surface. A lubricant and solvent solution may be added to the air supply of the air nozzle to prevent deposits from sticking to the surface of the embossing roll and to dissolve any deposits that do stick to the surface of the embossing roll.

Abstract: A chemical mechanical cleaning method utilizes an ammonium persulphate solution with simultaneous mechanical brushing to remove residual slurry particles from copper surfaces. The pH of the solution is selected to electrostatically repel charged slurry particles from the copper surface.

Abstract: A method for transferring a wafer alternately uses a gas providing device and a vacuum generating device. The method includes decontaminating a wafer by contacting a wafer supporter having a wafer provided thereon with a positive pressure mediated stream of gas provided from suction cups of a transferring assembly, where the suction cups are connected to the gas providing device through a gas transmitting tube. After decontamination, the wafer supporter is vacuum adhered to the transferring assembly by contacting the wafer supporter with the suction cups, where the suction cups are connected to the vacuum generating device through the gas transmitting tube. Because the wafer is transferred by picking up the wafer supporter after removing waste washing solution from the wafer and wafer supporter, breakdown and performance deterioration of the transferring assembly is prevented.

Abstract: The method can be performed by receiving at least one sheet and guiding the sheet through an apparatus for cleaning sheet providing tension to the sheet for processing; and processing both planar surfaces of the at least one tensioned sheet.

Abstract: A method of treatment of printed circuit boards or conductor films with a chemical, electrolytic, or rinsing treatment liquid, and to a device for carrying out the method, where the printed circuit boards or conductor films are transported in a horizontal direction by transport means, In order to accelerate these processes, the surfaces of the printed circuit boards or conductor films must be exposed to a macroflow in order to apply active treatment liquid. Furthermore, the micromaterial exchange into the diffusion layer must be reinforced. This exchange is brought about by the use of hydrodynamically acting cavitation generators, which form cavitation bubbles in the liquid jets. The treatment liquid is set into an eddy current movement in the generators because the treatment liquid is applied at high pressure in a circuit through the nozzles generating the cavitation bubbles, and is conveyed to the surface in a large quantity.

Abstract: The invention relates to a specialized shoe cleaning method that will clean athletic shoes in such a manner that the newly cleaned shoes resemble brand new shoes. The method or process includes applying a chemical to the outer part of the shoe, agitating the surface dirt via a motorized spinning brush, applying high pressure air to blow off any remaining dirt from the shoe, applying a chemical spray (e.g., for shoes with different type fabric), applying pressurized steam, applying an extraction process, using a specialized tool to extract dirt to clean the interior upper, and applying a drying process to dry the shoes. The application of cleaning solutions, high pressure air and steam in conjunction with the vacuum process is especially suited for the removal of dirt, stains and other foreign matter from the shoes.

Abstract: A method of a gas turbine compressor (1) in which droplets of a cleaning fluid are sprayed into the compressor, comprising the steps of: spraying droplets of a substantially first uniform size into or onto the fluid path for a first period; and then spraying droplets of a substantially second uniform size into or onto the fluid path for a second period, wherein the first and second uniform droplet sizes are different.

Abstract: A method of cleaning the transmission system of a vehicle includes the steps of starting an engine of the vehicle and bringing it to normal operating temperature. A predetermined amount of a transmission cleaner is charged into the transmission and the vehicle is driven for a predetermined distance. The gears are changed at preselected times while driving so that all gears of the transmission are used equally. The engine is then shut down and transmission fluid is purged from the transmission fluid pan by submerging a trailing end of a first hose into the transmission fluid. A leading end of the first hose is connected into fluid communication with an inlet of a remote charging tank and an outlet of the remote charging tank is connected through a switch to a source of negative pressure. The switch is set to cause the transmission fluid to flow into a transmission fluid waste tank disposed between the outlet and the source of negative pressure.

Abstract: The present invention comprises a dry cleaning system and method, in which dry cleaning machinery is used in conjunction with a specific solvent which is derived from an organic/inorganic hybrid (organo silicone). Such solvent is used in combination with an organic and/or organo-silicone-based detergent which is specifically tailored for working in conjunction with the solvent to afford optimal cleaning. In a preferred embodiment, the method comprises the steps of loading articles into a cleaning basket; agitating the articles in the solvent and detergent composition in which they are immersed; removing most of the solvent and detergent composition; centrifuging the articles; heating the articles and remaining composition and creating vapors, condensing vapors and optionally reducing the pressure to dry the articles, recovering and recycling solvent and removing the articles from the basket after cooling the articles.

Abstract: A semiconductor cleaning method for removing particles that have adhered to the back side of a semiconductor wafer. The semiconductor wafer is placed on a support. Inert gas is blown against the back of the semiconductor wafer by a plurality of nozzles, each of which is positioned at a predetermined angle to the back of the semiconductor wafer and inclined in a first direction. An air exhaust is located near the periphery of the semiconductor wafer and arranged so as to suck in the particles removed from the semiconductor wafer with the nozzles.

Abstract: A method for rotating wafers in a double sided scrubber where a rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove in which the wafer edge is pinched. Treads or grooves extending from the groove channel liquids away from the groove to prevent wafer slippage when rotating and cleaning solutions are applied to the wafer.