Abstract: A substrate processing apparatus includes liquid tanks, a conveyor mechanism that dips multiple semiconductor substrates, arranged with provision of spaces, collectively into liquids in the liquid tanks, and water vapor spray nozzles disposed in gaps between the multiple semiconductor substrates so as to face rear surfaces of the semiconductor substrates. Heated water vapor is sprayed out of the water vapor spray nozzles onto the respective rear surfaces of the multiple semiconductor substrates prior to dipping the semiconductor substrates into the liquid in the liquid tanks.

Abstract: A system for removing paint and other coatings from hard surfaces is mounted on a truck for over-the-road travel. The truck bed carries a high power vacuum pump, a self propelled tractor with an attached blast head, a liquid reservoir, a sump or vacuum tank, and a ramp for loading the tractor. The reservoir is connected to a low pressure pump that transfers water to the high pressure pump. The high pressure pump is connected to the blast head by a high pressure hose. A vacuum hose is connected to the sump which has an internal enclosure for separating the waste materials from the liquid for easy dumping of semi dried materials.

Abstract: An industrial robot including a plurality of arms movable relative each other about a plurality of joints, and electrical motors moving the arms. The robot is also arranged and designed to resist corrosion in a harsh environment. The robot is also mobile and arranged for movement or travel and suitable for maintenance and inspection tasks in an installation for oil and gas.

Abstract: To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere.

Abstract: A pressure is maintained within a volume within which a semiconductor wafer resides at a pressure that is sufficient to maintain a liquid state of a precursor fluid to a non-Newtonian fluid. The precursor fluid is disposed proximate to a material to be removed from the semiconductor wafer while maintaining the precursor fluid in the liquid state. The pressure is reduced in the volume within which the semiconductor wafer resides such that the precursor fluid disposed on the wafer within the volume is transformed into the non-Newtonian fluid. An expansion of the precursor fluid and movement of the precursor fluid relative to the wafer during transformation into the non-Newtonian fluid causes the resulting non-Newtonian fluid to remove the material from the semiconductor wafer.

Abstract: The invention relates to a cleaning method to be used on secondary surfaces in coating systems. Before the coating, an anti-adhesion layer (10) is applied to the secondary surfaces. After coating material has been deposited onto the anti-adhesion layer, the secondary surfaces are cleaned by means of dry ice blasting or CO2 snow-jet cleaning.

Abstract: An apparatus and associated method are provided for treating a workpiece with a cryogenic impingement fluid. A fixture supports the workpiece in an upright position and operably connects an electrical component of the workpiece to a power source in the supported position. A cryogenic impingement fluid applicator sprays a stream of the cryogenic impingement fluid against the supported workpiece and laterally moves the stream in accordance with a predetermined path. A shield deflects the stream of cryogenic impingement fluid to prevent the stream from contacting at least a part of the workpiece as the stream is moved along the predetermined path.

Abstract: A heat exchanger may be cleaned by introducing compressed nitrogen and a flushing composition through an injection device.

Abstract: A megasonic cleaning method and a megasonic cleaning apparatus are provided. Microcavitation bubbles may be formed by applying an electromotive force to a cleaning solution using a megasonic energy in a separate room from an object to be cleaned. The microcavitation bubbles having a stable oscillation among the formed microcavitation bubbles may be moved to the object to be cleaned. A surface of the object to be cleaned may be cleaned using the microcavitation bubbles having the stable oscillation. Particles attached onto the surface of the object to be cleaned may be effectively removed while preventing pattern damage.

Abstract: The present invention is a processing method for applying predetermined processing to a workpiece with said workpiece mounted on a mounting stage arranged in a process chamber in a depressurized atmosphere, in which when no workpiece is mounted on the mounting stage, an inactive gas is discharged from at least a heat transfer gas supply hole of the mounting stage in the process chamber so that a gas layer is formed on a mounting surface of the mounting stage. The present invention is also a processing apparatus.

Abstract: A portable system for treating, for example, cleaning and/or drying, surfaces, including both indoor and outdoor surfaces, is provided. The system includes a pressurized air outlet assembly, or “air knife” assembly, coupled to a source of pressurized air, for example, a blower, a fan, or a turbine. The air knife assembly concentrates a high volume exhaust flow of air into a high velocity, high temperature, and/or high pressure air stream directed at a target surface. The air stream can be angularly varied to propel water, snow, debris, and other particulate from the target surface, for example, a path or roadway being cleaned or dried. The air knife blade assembly is substantially long enough to allow a single lane of roadway or runway to be dried and cleaned in one pass, but can also be shortened to allow treatment of narrower paths.

Abstract: Method and apparatus for removing residues of hazardous materials from vapor in a tank (1), wherein such a vapor is heated, passed outside the tank and subsequently cooled and the remaining dry vapor is recirculated, characterized in that a) said vapor is heated to a temperature of at least 5° C. above the melting point and below the self ignition point of the hazardous material, b) the vapor mixture thus formed is passed by means of a pump (3) from the tank through a discharge unit to a recovery unit, c) is cooled to a temperature of at least 5° C. lower and above the melting point of the hazardous material in a recovery unit, d) the liquid components of the vapor are recovered and the dry gas mixture is recirculated to the tank after reheating to the desired temperature, e) said recirculation being repeated as required.

Abstract: A method of cleaning a turbo pump is described. The turbo pump is coupled with a CVD chamber of depositing a material and thus accumulates the material therein. The method includes switching off the turbo pump and using another pump to pump a reactive gas, which can react with the material to form gaseous products, through the turbo pump. Thereby, the turbo pump is cleaned up and is prevented from being a particle source in subsequent CVD operations.

Abstract: A method for removing a hardened photoresist from a semiconductor substrate. An example method for removing a hardened photoresist layer from a substrate comprising a low-? dielectric material preserving the characteristics of the low-?dielectric material includes: a)—providing a substrate comprising a hardened photoresist layer and a low-? dielectric material at least partially exposed; b)—forming C?C double bonds in the hardened photoresist by exposing the hardened photoresist to UV radiation having a wavelength between 200 nm and 300 nm in vacuum or in an inert atmosphere; c)—breaking the C?C double bonds formed in step b) by reacting the hardened photoresist with ozone (O3) or a mixture of ozone (O3) and oxygen (O2) thereby fragmenting the hardened photoresist; and d)—removing the fragmented photoresist obtained in step c) by wet processing with cleaning chemistries.

Abstract: A rinsing and drying apparatus of a clinical analyzer probe drain station is provided. The rinsing and drying apparatus has a group of nozzles that are offset from a longitudinal axis of a probe passage and may be inclined and oriented to provide tangentially oriented fluid-jet trajectories exiting into the sample probe passage. The offset nozzles, nozzle orientation, and cavity geometrical features of the device permit the drying capacity of probe-impinging planar air-knife jets to be maximized by stabilizing local internal fluid movement to form a swirling (e.g., helical) gas flow field directed away from a drying region and toward a vacuum exhaust. The rinsing and drying apparatus eliminates rinse water re-circulated entrainment and up-wash (spitting) during the air-knife drying operation. Therefore, the rinsing and drying apparatus significantly reduces water carryout on sampling probes thereby reducing sample/reagent dilution.

Abstract: The disclosure relates to a device for dispensing one or more jets of cryogenic fluid, particularly liquid nitrogen, comprising a fluid conveying pipeline feeding one or more fluid dispensing nozzles arranged at the downstream end of said pipeline, and a motor collaborating with the fluid conveying pipeline via a rotary transmission shaft and a transmission mechanism.

Abstract: Pyrolysis methods for disassociating an organic mass, or coating from an article, by placing the article in an air tight processing chamber, circulating a gaseous mixture of ambient air and at least 40% water vapor from an opening, through the processing chamber and out of an exhaust port, and maintaining the processing chamber at a temperature above 650 degrees Fahrenheit for a sufficient time to disassociate the organic material. A batch oven and a continuous processing oven including entrance and exit air closures that utilize the pyrolysis methods are described.

Abstract: A manual air hand pump operated and powered by two hands of a user for blowing dust and debris from computer related equipment and accessories. The hand pump contains a cylinder, a handle, a piston movable inside the cylinder, and a cone shaped nozzle. The piston is attached to the handle at the first end of the cylinder; and the cylinder has the nozzle at the second end of the cylinder. The cone shaped hollow nozzle has a hole or opening at its tip of ideal size for blowing dust and debris from electronics, computer related equipment, and for general use in a clean manufacturing environment. A battery operated or rechargeable shake or crank flashlight or crank low voltage electric generator may also be attached to or combined with the pump to make it multifunctional and add to its utility.

Abstract: A device for recovering magnetic particles trapped on a magnetic plug, which includes a supporting end and a magnetized element for retaining the magnetic particles in a liquid resulting from the wear of parts with which the liquid has been in contact, the recovery device including a magnetization device and an enclosure having an opening, the enclosure to receive the magnetic plug via the opening such that the magnetized element is located inside the enclosure and the supporting end is located outside the enclosure. The opening is sized such that the supporting end blocks the opening. The device also includes an injection nozzle to inject a gaseous fluid inside the enclosure, the nozzle being oriented such that the flow of gaseous fluid expels the magnetic particles retained on the magnetized element toward the bottom of the enclosure. The magnetization device traps the particles urged toward the bottom of the enclosure.

Abstract: Disclosed is a method for cleaning solar panels by means of a washing apparatus (1) which can be displaced on the solar panel (2) and applies rinsing water to the surface of the solar panel (2) and washes the surface with the help of washing nozzles and/or brushes. The washing apparatus (1) embraces the solar panel (2) in the edge region in such a way that the washing apparatus (1) is guided in a longitudinally movable way directly on the solar panel (2).

Abstract: Three-dimensional parts having porous protective structures built with powder-based additive manufacturing systems, the porous protective structures being configured to protect the three-dimensional parts from damage during de-powdering processes.

Abstract: A method for purging of, and debris removal from, a hole created with laser energy in which a swirling purge gas stream is provided in a hole containing debris to be removed, imparting a swirl to the debris and lifting the debris from a bottom of the hole. In accordance with one embodiment, the purge gas is swirled in a purge gas nozzle providing purge gas into the hole. In accordance with another embodiment of this invention, the purge gas is swirled directly in the hole.

Abstract: A substrate cleaning method that includes: a step in which, while a substrate holder is being continuously rotated, a to-be-discharged position of the cleaning liquid on the substrate is changed to an eccentric position deviated from the central part of the substrate, and a gas is discharged from a gas nozzle to the central part of the substrate so as to form a dried area of the cleaning liquid under a condition in which a shortest distance between an edge of a cleaning liquid flow output from the cleaning-liquid nozzle and an edge of a gas flow output from the gas nozzle is set between 9 mm and 15 mm.

Abstract: To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere.

Abstract: The invention relates to a facility and a method for the stripping, de-scaling, and surface treatment of coated and uncoated materials such as metals, concrete, wood, polymers, plastics or any other type of material, by means of cryogenic fluid jets at very high pressure.

Abstract: A method for removing the edge bead from a substrate by applying an impinging stream of a medium that is not a solvent for the material to be removed. The medium is applied to the periphery of the substrate with sufficient force to remove the material. Also an apparatus to perform the inventive method.

Abstract: A resist removing device 1 functions to remove a resist from a substrate while preventing occurrence of popping phenomenon and at the same time attains reduction in cost of energy for the resist removing and has a simplified constitution. The resist removing device 1 is equipped with a chamber 2 for containing therein a substrate 16 (for example, a substrate having a high-doze ion implanted resist), and with a pressure below the atmospheric pressure, the chamber 2 is fed with ozone gas, unsaturated hydrocarbons and water vapor. The ozone gas may be an ultra-high concentrated ozone gas that is produced by subjecting an ozone containing gas to a liquefaction-separation with the aid of a vapor pressure difference and then vaporizing the liquefied ozone. For cleaning the substrate 16 thus treated, it is preferable to use ultra-pure water. The chamber 2 is equipped with a susceptor 15 for holding the substrate 16. The susceptor 15 is heated to a temperature of 100° C. or below.

Abstract: The invention relates to a cleaning method, and in particular, to a vacuum cleaning apparatus and a vacuum cleaning method thereof. A vacuum cleaning method comprising (a) positioning a dust receiver joined to one end of a vacuum suction device in the vicinity of the object of cleaning, (b) positioning a spray nozzle joined to one end of an air spray system adjacent to the object of cleaning, (c) operating the vacuum suction device, and (d) removing the foreign substances adhered to a surface of the object of cleaning by adjusting the pneumatic pressure of the air sprayed from the spray nozzle, may efficiently remove foreign substances adhered to the object of cleaning located in a narrow space.

Abstract: A method is provided for the removal from a heat exchange of lint that is generated during a drying process in a domestic appliance for laundry care. A rinsing fluid is run through the heat exchanger for cleaning and the rinsing fluid is deflected during a cleaning phase with the magnitude of deflection or the direction of deflection of the rinsing fluid being a function of the strength of an air flow that is applied to deflect the rinsing fluid. The rinsing fluid is thus run through various regions of the heat exchanger depending on the deflection.

Abstract: A device for dislodging accrued deposits is disclosed. The device includes a gas impulse generating device for generating gas blasts directed in a predetermined direction; and an additive supply device for introducing an additive into the gas blasts. A method and a computer program product for dislodging accrued deposits are also disclosed.

Abstract: Process for decontaminating, cleaning a solid organic substrate contaminated by solid radioactive particulate inorganic contaminants, in which: the said solid substrate is brought into contact with an extraction medium, devoid of water, comprising: dense pressurized CO2; at least one nonhalogenated surface-active compound chosen from block copolymers of poly(ethylene oxide) PEO and poly(propylene oxide) PPO, such as (EO)x-(PO)y diblock copolymers, (EO)x-(PO)y-(EO)x triblock copolymers and (PO)x-(EO)y-(PO)x, triblock copolymers, where x and y are integers from 2 to 80 with x other than y; and polydi(1 to 6C)alkylsiloxanes, such as polydimethylsiloxane (PDMS); and at least one complexing agent chosen from tributyl phosphate (TBP), crown ethers, tributylphosphine oxide, triphenylphosphine oxide and tri(n-octyl)phosphine oxide; the solid substrate and/or the extraction medium is/are subjected, simultaneously with the contacting operation, to a mechanical action.

Abstract: Herein disclosed is a device and a method for liquid treatment of a disc-like article comprising rotating a disc-like article, dispensing liquid onto the disc-like article when rotated, collecting liquid, which is flung off the disc-like article when rotated, providing a plate arranged parallel to the disc-like article and facing the disc-like article when rotated, and directing gas parallel to the plate across the plate.

Abstract: A wafer W is processed by supplying a two-fluid, high pressure jet water, or mega-sonic water onto the wafer W, while rotating the wafer W in an essentially horizontal state. After supply of the cleaning fluid is stopped, the wafer W is dried by rotating the wafer W at a higher speed than that used in supplying the cleaning fluid. No rinsing process using purified water is performed in a period after stopping supply of the cleaning fluid and before rotating the substrate at the higher speed.

Abstract: A method of cleaning a filter element includes directing a jet of pressurized gas from a nozzle onto a filter element, with the jet having a non-round cross-sectional shape that is a same general cross-sectional shape as the opening in a tube sheet holding the filter element. The nozzle has a channel for the pressurized gas that is obstruction-free.

Abstract: To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere.

Abstract: Provided is a substrate processing method that prevents generation of watermarks on a substrate and can be performed at a low cost. The method controls the ambient humidity around the substrate depending on the kind of the chemical liquid, when the substrate is processed with the chemical liquid. The control of the humidity is performed at least in a drying step that dries the substrate W. In one embodiment, the ambient humidity around the substrate is controlled when a fluid containing IPA as a drying fluid is supplied to the substrate W after processing the substrate W with the chemical liquid.

Abstract: A substrate processing method includes a cleaning processing step, a mixed organic solvent supplying step, and a fluorine organic solvent supplying step. The cleaning processing step is a step of cleaning a main surface of a substrate by supplying deionized water to the substrate. The mixed organic solvent supplying step is a step of supplying a fluid of a mixed organic solvent to the main surface of the substrate after the cleaning processing step. The fluid of the mixed organic solvent contains a fluid of a water-soluble organic solvent and a fluid of a fluorine organic solvent having a smaller surface tension than that of the deionized water and a lower water solubility than that of the fluid of the water-soluble organic solvent. The fluorine organic solvent supplying step is a step of supplying the fluid of the fluorine organic solvent to the main surface of the substrate without supplying the fluid of the water-soluble organic solvent after the mixed organic solvent supplying step.

Abstract: A dust collecting installation for collecting airborne dust adjacent to a moving web. An elongate duct extends transversely to the direction of movement of the web and is positioned adjacent to the web. The duct is shaped and positioned so as to form an opening into the duct that receives at least a proportion of a layer of dust laden air adjacent to and moving with the web surface, and dust laden air is in turn withdrawn from the duct. The duct is positioned and so shaped that air flow into the opening is augmented by a jet of air generated where the moving surface converges with and comes into contact with a surface of a roller which the web passes over and contacts.

Abstract: A pills counting device is provided. It comprises a tray comprising a base member and a trough member. The device also comprises a lid member mounted on the base member and being movable between two extreme positions. The device also comprises at least one port provided in the tray and/or in the lid member and adapted to be connected in fluid communication with the base member and with an air intake of a vacuum device that can be remotely controlled. When a vacuum is applied to the at least one port, an air stream is established to entrain toward the vacuum device particles that may be present on surfaces of the device. A cleaning method using the aforesaid pills counting device is also disclosed.

Abstract: Three-dimensional parts having porous protective structures built with powder-based additive manufacturing systems, the porous protective structures being configured to protect the three-dimensional parts from damage during de-powdering processes.

Abstract: A method of forming a semiconductor device includes chemically cleaning a surface of a substrate to form a chemical oxide material on the surface. At least a portion of the chemical oxide material is removed at a removing rate of about 2 nanometer/minute (nm/min) or less. Thereafter, a gate dielectric layer is formed over the surface of the substrate.

Abstract: Methods for processing substrates in dual chamber processing systems comprising first and second process chambers that share resources may include performing a first internal chamber clean in each of the first process chamber and the second process chamber; and subsequently processing a substrate in one of the first process chamber or the second process chamber by: providing a substrate to one of the first process chamber or the second process chamber; providing a process gas to the first process chamber and the second process chamber; forming a plasma in only the one of the first process chamber or the second process chamber having the substrate contained therein; and providing an inert gas to the first process chamber and the second process chamber via one or more channels formed in a surface of respective substrate supports disposed in the first process chamber and the second process chamber while processing the substrate.

Abstract: Disclosed are methods and apparatus for cleaning heat exchangers and similar vessels by introducing chemical cleaning solutions and/or solvents while maintaining a target temperature range by direct steam injection into the cleaning solution. The steam may be injected directly into the heat exchanger or into a temporary side stream loop for recirculating the cleaning solution or admixed with fluids being injected to the heat exchanger. The disclosed methods are suitable for removing metallic oxides from a heat exchanger under chemically reducing conditions or metallic species such as copper under chemically oxidizing conditions. In order to further enhance the heat transfer efficiency of heating cleaning solvents by direct steam injection, mixing on the secondary side of the heat exchanger can be enhanced by gas sparging or by transferring liquid between heat exchangers when more than one heat exchanger is being cleaned at the same time.

Abstract: The present invention discloses a method for the removal of a number of molecular contaminants from surfaces within a device. A purge gas containing oxygen and/or water is introduced into the interior of the device, contacting at least a portion of the interior surfaces. A contaminated purge gas is produced by transferring a portion of the contamination from the interior surfaces into the purge gas. The contaminated purge gas is removed from the device and the process is continued until the contaminant concentration in the contaminated purge gas is below a predetermined level.

Abstract: The invention relates to a method for preventing chlorine deposition on the heat-transferring surfaces of a boiler, particularly on the superheater, in which boiler a fuel with a chlorine content, such as a biomass or waste fuel, is burned. And to which steam boiler is fed, preferably in the superheater area, a compound with a sulphate content, which forms a particular reagent to fix alkali compounds. The said compound is ferric(III)sulphate, Fe2(SO4)3 and/or aluminium(III)sulphate, Al2(SO4)3.

Abstract: A gate valve cleaning method that can clean a gate valve that brings an atmospheric transfer chamber and an internal pressure variable transfer chamber that transfer a substrate into communication with each other or shuts them off from each other without bringing about a decrease in the throughput of a substrate processing system. Before the gate valve brings the atmospheric transfer chamber and the internal pressure variable transfer chamber into communication with each other, the pressure in the internal pressure variable transfer chamber is increased so that the pressure in the internal pressure variable transfer chamber can become higher than the pressure in the atmospheric transfer chamber.

Abstract: A control mechanism of a cleaning apparatus is preset to control the apparatus for a cleaning process or a rinsing process to include delivering a process liquid, which is corresponding one of a cleaning liquid and a rinsing liquid, from a back surface liquid supply nozzle through a liquid delivery port, thereby forming a liquid film on the back surface of a substrate, and then once stopping and then re-starting delivery of the process liquid from the back surface liquid supply nozzle, thereby forming a liquid film also on a portion around the liquid delivery port, so as to process the portion around the liquid delivery port as well as the substrate.

Abstract: A cleaning liquid for an electronic material, in particular, a silicon wafer, uses ultra-pure water or hydrogen water as raw material water, and performs cleaning in combination with ultrasonic irradiation under the presence of hydrogen micro-bubbles. The method enables efficient cleaning and removal of particle components and the like on the wafer surface and prevention of re-contamination.

Abstract: The invention relates to a method and a device for cleaning the door of a coke oven, said door comprising a sealing edge and a membrane that is attached to the door panel of the coke oven. According to said method, cleaning tools comprising jet nozzles, which are supplied with a flow medium at high pressure, are situated and displaced back and forth in the region between the sealing edge and the door panel of the coke oven, in such a way that the interior surface of the membrane and the sealing edge are cleaned. The coke oven door is cleaned directly after the coke oven chamber is opened, by at least one jet nozzle element, which is supplied with compressed air and is displaced along the sealing edges. The jet nozzles are oriented in such a way that the air hits the surface to be cleaned at an acute angle.

Abstract: Method for drying a surface of a disc-shaped article includes covering the surface with a rinsing liquid, whereby a closed liquid layer is formed, and removing the rinsing liquid, wherein the rinsing liquid containing at least 50 wt. % water and at least 5 wt. % of a substance, wherein the substance lowers the surface energy of water, wherein the removing of the liquid is initiated by blowing gas onto the closed liquid layer, whereby the closed liquid layer is opened at on discrete area.