Having Strip, Film Or Plate-type Thermocouples Patents (Class 136/225)
  • Patent number: 10910543
    Abstract: A thermoelectric device to generate electrical power at high voltages, for example 110 volts to 900 volts, using a thermopile, a temperature differential applied to the thermopile and the Seebeck Coefficient of dissimilar materials assembled in a defined manner and in conjunction with controls and batteries to power electric devices.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: February 2, 2021
    Inventor: Karl Joseph Steutermann
  • Patent number: 10709384
    Abstract: Wearable heat flux devices are disclosed that can detect heat flux based on evaporative cooling for determining a core body temperature of a user, and that can heat or cool a surface of a user for reaching a steady-state heat flux to determine the core body temperature of the user. Exemplary heat flux devices can include a heat flux sensor and a wicking layer. The heat flux sensor can be configured to detect heat flux at a location on a user. The wicking layer can be configured to absorb moisture at the location and to transport the moisture above the heat flux sensor. The heat flux subsequently detected by the heat flux sensor includes the evaporative cooling from the evaporation of the moisture.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: July 14, 2020
    Assignee: MC10, INC.
    Inventors: Hoi-Cheong Steve Sun, Milan Raj, Xianyan Wang, Brian Murphy, Valerie Susan Hanson
  • Patent number: 10578496
    Abstract: A first heat flux sensor, which outputs a first sensor signal according to a heat flux passing therethrough, a second heat flux sensor, which outputs a second sensor signal according to a heat flux passing therethrough, a thermal buffer body, which has a predetermined heat capacity, and a heat releasing body, which has a predetermined heat capacity, are provided, and the first heat flux sensor, the thermal buffer body, the second heat flux sensor and the heat releasing body are arranged in this order from a sensing subject side. The first sensor signal, which corresponds to the heat flux between the sensing subject and the thermal buffer body, is outputted from the first heat flux sensor, and the second sensor signal, which corresponds to the heat flux between the thermal buffer body and the heat releasing body, is outputted from the second heat flux sensor.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: March 3, 2020
    Assignee: DENSO CORPORATION
    Inventors: Norio Gouko, Atusi Sakaida, Toshihisa Taniguchi, Keiji Okamoto, Yoshihiko Shiraishi
  • Patent number: 10515579
    Abstract: A display device includes: a substrate including at least two layers; a driving circuit on the substrate; a pixel electrode connected to the driving circuit; a common electrode on the pixel electrode; a display layer between the pixel electrode and the common electrode; and a thermoelectric element located between the at least two layers of the substrate.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: December 24, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Chaungi Choi, Jihun Ryu, Taekyung Ahn
  • Patent number: 10481008
    Abstract: In a radiant heat sensor, first and second thermoelectric members are alternately arrayed one by one in a direction along a first surface of a plate-shaped member so as to be separated from each other, and each of the first and second thermoelectric members configure a portion of the first surface. First conductor patterns extend the first surface, disposed on the first surface so as to span a single first thermoelectric member and a single second thermoelectric member that are adjacent to each other, and configure hot contact portions between the first and second thermoelectric members. Second conductor patterns extend along the first surface, disposed on the first surface so as to span a single first thermoelectric member and a single second thermoelectric member that are adjacent to each other, and configure cold contact portions between the first and second thermoelectric members.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: November 19, 2019
    Assignee: DENSO CORPORATION
    Inventors: Keita Saitou, Atusi Sakaida, Toshikazu Harada, Hirohito Matsui, Yukikatsu Ozaki
  • Patent number: 10347811
    Abstract: Provided is a thermoelectric conversion module which is folded in a bellows-like shape and is capable of preventing a thermoelectric conversion layer from coming into contact with other member even in a state in which bellows is closed and performing highly effective power generation.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: July 9, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Hideyuki Suzuki, Shinji Imai
  • Patent number: 10128427
    Abstract: An apparatus for generating electricity. The apparatus comprises a collar arranged to couple to a pipe and a support having a first planar face, the support being attached to the collar such that it projects away from the collar. The apparatus also has at least one thermoelectric generator attached to the first planar face of the support and a cover attached to the at least one thermoelectric generator.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: November 13, 2018
    Assignee: EXNICS LIMITED
    Inventor: Stuart James Ellison
  • Patent number: 10094691
    Abstract: A flow sensor arrangement for determining the flow of a fluid comprises a substrate. A heater is arranged in or on the substrate as well as at least one first thermocouple for generating a first signal proportional to a temperature difference between a location downstream from the heater and a first reference location, and at least one second thermocouple for generating a second signal proportional to a temperature difference between a location upstream from the heater and a second reference location which second reference location is different from the first reference location. In addition, at least one third thermocouple is arranged in or on the substrate for generating a third signal proportional to a temperature difference between the first reference location and the second reference location.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: October 9, 2018
    Assignee: Sensirion AG
    Inventors: Harry Figi, Mark Hornung, Robert Wuest
  • Patent number: 9786829
    Abstract: In one aspect, the present invention relates to a thermocouple device comprising a flexible non-planar substrate, a first printed thermocouple element comprising a first metal containing ink composition applied to the flexible non-planar substrate, and a second printed thermocouple element in electrical contact with the first printed thermocouple element making a thermocouple junction. The second printed thermocouple element comprises a second metal containing ink composition with a Seebeck coefficient sufficiently different from the first metal containing ink composition for the first and second printed thermocouple elements to together produce a thermocouple effect. The present application further relates to medical devices comprising the thermocouple and methods of making such devices.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: October 10, 2017
    Assignee: Micropen Technologies Corporation
    Inventors: William J. Grande, Lori J. Shaw-Klein, Li Min
  • Patent number: 9759613
    Abstract: Disclosed are a temperature sensor device using a thermopile, the total number n of thermocouples thereon can be increased without greatly increasing the internal resistance of the thermopile r, providing high output level and high S/N ratio, a highly sensitive radiation thermometer using the device, and production method of the device using organic material for thin films to form the thermopile. These provide a standardized inexpensive multi-layered thin film thermopile, a radiation thermometer with high sensitivity, and production method of these devices. The temperature sensor device is a device wherein a thermopile which is formed on a thin film thermally isolated from a substrate is place in a temperature sensing part, and the thin film is formed as a multi-layered thin film, a layered thermopile is formed on each layered thin film, the substrate functioning as a heat sink which is one junction of the reference temperature of the thermopile.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: September 12, 2017
    Assignees: HME CO., LTD., TOHOKU GAKUIN
    Inventors: Mitsuteru Kimura, Nobuo Tanaka, Hironori Shimobayashi
  • Patent number: 9658110
    Abstract: A thermal sensor device using a combination of thermopile and pyroelectric sensors is disclosed. The combination is achieved in a process flow that includes ferroelectric materials, which may be used as a pyroelectric sensor, and p-poly/n-poly for thermopiles. The combination retains the sensitivity and accuracy of the thermopile sensor and speed of pyroelectric sensors. The combination provides lower noise than individual thermopile sensors and results in a higher signal-to-noise ratio.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: May 23, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Henry Litzmann Edwards
  • Patent number: 9612458
    Abstract: A resonant photonic device is provided. The device comprises an optical waveguiding element, such as an optical resonator, that includes a diode junction region, two signal terminals configured to apply a bias voltage across the junction region, and a heater laterally separated from the optical waveguiding element. A semiconductor electrical barrier element is juxtaposed to the heater. A metallic strip is electrically and thermally connected at one end to a signal terminal of the optical waveguiding element and thermally connected at another end to the barrier element.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: April 4, 2017
    Assignee: Sandia Corporation
    Inventors: Anthony L. Lentine, Christopher DeRose
  • Patent number: 9494471
    Abstract: A power measuring sensor for an optical beam which utilizes the temperature difference across a thin layer of heat insulating material, generated by the axial flow of the absorbed beam, from an absorber layer on which the beam impinges, to a cooled heat sink which dissipates the heat after passage through the sensor. The axial heat flow is measured by means of a continuous matrix of adjacent thermocouple junctions over the heat flow region of the sensor disc, with the thermal insulating layer, which generates the temperature drop, having thicker and thinner regions at alternate junctions. The junctions on the thicker regions of the insulator thus become the hot junctions, and those on the thinner regions of the insulating layer become the cold junctions, and the sum of the voltages generated by the thermocouples is proportional to the flow of heat, and thus to the incident optical power.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: November 15, 2016
    Assignee: OPHIR OPTRONICS SOLUTIONS LTD.
    Inventors: Ephraim Greenfield, Eliyahu Bender, Shimon Elstein
  • Patent number: 9478682
    Abstract: The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: October 25, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masao Kirihara, Hiroshi Yamanaka, Yoshiharu Sanagawa, Takanori Aketa, Yushi Nakamura, Mitsuhiko Ueda
  • Patent number: 9412928
    Abstract: A thermoelectric device includes a plurality of thin-film thermoelectric elements. Each thin-film thermoelectric element is a Seebeck-Peltier device. The thin-film thermoelectric elements are electrically coupled in parallel with each other. The thermoelectric device may be fabricated using conventional semiconductor processing technologies and may be a thin-film type device.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: August 9, 2016
    Assignee: STMICROELECTRONICS, INC.
    Inventor: William Donley
  • Patent number: 9360382
    Abstract: The invention relates to a device for measuring a heat flux, comprising a thermopile formed of a plurality of thermojunctions of distributed type. The device is formed of a first and a second ceramic substrate (Ce1, Ce2), a first face of the first substrate (Ce1) is composed of cavities which are separated by ceramic spacers (Ca1, Ca2, Ca3, Ca4), the thermopile is placed on a second planar face of the first substrate which is located opposite the first face, the spacers of the first substrate are arranged beneath one thermojunction (Tj2, Tj4, Tj6, Tj8) in two of the thermopile, a face of the second substrate (Ce2) is composed of cavities which are separated by ceramic spacers (Ca5, Ca6, Ca7, Ca8, Ca9), the spacers of the second substrate rest on a thermojunction (Tj1, Tj3, Tj5, Tj7, Tj9) beneath which a spacer of the first substrate is not arranged.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: June 7, 2016
    Assignee: UNIVERSITE DU MAINE
    Inventors: Lionel Camberlein, Etienne Gaviot, Frédéric Polet, Bruno Beche, Guillaume Failleau, Ronan Morice, Véronique Le Sant
  • Patent number: 9219214
    Abstract: The invention provides a thermoelectric conversion element having a lot of pn junction pairs per unit area and having a thermoelectric material chip which is hardly broken, and a producing method thereof. In the thermoelectric conversion element of the invention, plural substrates in each of which a film-shaped thermoelectric material is formed in a surface thereof are disposed. As a result, because the number of pn junction pairs per unit area is increased, a high output can be obtained. Because the thermoelectric material is formed into the film shape, reliability degradation caused by a breakage of the thermoelectric material can be prevented, even in the thermoelectric material having many pn junction pairs per unit area, namely, a sectional area is small.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: December 22, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kaori Toyoda, Takaaki Higashida, Yoshihisa Ohido, Takashi Kubo
  • Patent number: 9190596
    Abstract: A three-dimensional thermoelectric energy harvester and a fabrication method thereof. Low-resistivity silicon is etched to form a plurality of grooves and silicon columns between the grooves, and an insulating layer is formed on a surface of the groove, and thermoelectric columns are fabricated by using a thin-film deposition technique, so that the thermoelectric column and a neighboring silicon column form a thermocouple pair; and then, a metal wiring is fabricated by processes such as etching and deposition, followed by thinning of the substrate and bonding of the supporting substrates, thereby completing fabrication of the three-dimensional thermoelectric energy harvester. Fabrication of the thermocouple pair structure by one thin-film deposition process simplifies the fabrication process. The thermocouple pair using silicon ensures a high Seebeck coefficient. The use of vertical thermocouple pairs having a column structure improves the mechanical stability of the thermoelectric energy harvester.
    Type: Grant
    Filed: April 5, 2012
    Date of Patent: November 17, 2015
    Assignee: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY of SCIENCE
    Inventors: Dehui Xu, Bin Xiong, Yuelin Wang
  • Patent number: 9178084
    Abstract: Disclosed are a solar cell and a method for manufacturing the same. The solar cell includes a support substrate; a back electrode layer on the support substrate, the back electrode layer being formed with at least one first through hole to expose a part of a top surface of the support substrate; a light absorbing layer on the back electrode layer; a buffer layer on the light absorbing layer; a window layer on the buffer layer; and a high-resistance region on a lateral side of the back electrode layer forming the first through hole. The high-resistance region has a resistance value higher than a resistance value of the light absorbing layer.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: November 3, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Kyung Am Kim
  • Patent number: 9151676
    Abstract: An infrared (IR) detector including a plurality of thermal sensing elements for generating an image of an object is provided. The IR detector comprises a first thermal sensing element and includes a thermopile and a first switch. The thermopile is configured to receive at least a portion of a thermal output from the object and to provide a modulated electrical output indicative of at least a portion of the received thermal output. The first switch is operatively coupled to the thermopile and is configured to provide a bypass in the event the thermopile is damaged such that remaining thermal sensing elements of the plurality of thermal sensing elements are capable of providing an electrical output therefrom.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: October 6, 2015
    Assignee: UD Holdings, LLC
    Inventor: David Kryskowski
  • Patent number: 9136160
    Abstract: A solid hole array and a method for forming the same are disclosed. The solid hold array may comprise: substrate with a via; a top hole array base formed on a top surface of the substrate and a bottom hole array base formed on a bottom surface of the substrate, wherein a front hole is located in the top hole array base at a place corresponding to the via; and top protection layer formed on a surface and sidewalls of the top hole array base and a bottom protection layer formed on a surface of the bottom hole array base, wherein a rear window is located in the bottom hole array base and the bottom protection layer at a place corresponding to the via.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: September 15, 2015
    Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Lijun Dong, Chao Zhao
  • Patent number: 9105781
    Abstract: A method for the low-cost production of sheet-like thermocouples comprises the following steps: —providing an electrically and thermally conductive substrate having at least one clearance, which subdivides the substrate into substrate regions, —fitting thermolegs onto the substrate, wherein each thermoleg is connected to a region of the substrate on a hot side and on a cold side, —applying an encapsulation, so that at least each thermoleg is enclosed and the encapsulation enters into a material bond with the regions of the substrate, —separating parts of the substrate in such a way as to prevent a flow of electric current between the regions of the substrate through the at least one clearance. The invention also relates to a substrate that is suitable for carrying out the method and to a thermocouple that can be produced by the method.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: August 11, 2015
    Assignee: O-FLEXX TECHNOLOGIES GMBH
    Inventor: Stefan Hoppe
  • Patent number: 9093606
    Abstract: Provided is a thermoelectric device including two legs having a rough side surface and a smooth side surface facing each other. Phonons may be scattered by the rough side surface, thereby decreasing thermal conductivity of the device. Flowing paths for electrons and phonons may become different form each other, because of a magnetic field induced by an electric current passing through the legs. The smooth side surface may be used for the flowing path of electrons. As a result, in the thermoelectric device, thermal conductivity can be reduced and electric conductivity can be maintained.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: July 28, 2015
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Younghoon Hyun, Moon Gyu Jang, Young Sam Park, Taehyoung Zyung, Yil Suk Yang, Jong-Kee Kwon
  • Patent number: 9059373
    Abstract: Provided is a method for protecting a thermal sensitive component mounted on a board during a thermal process. The method includes: providing the board, providing a protection apparatus which is removable and made of a thermoelectric material to protect the thermal sensitive component during the thermal process, wherein the protection apparatus cools the thermal sensitive component during the thermal process in response to applying a voltage to the protection apparatus. Further provided is the protection apparatus for the thermal sensitive component mounted on the board during the thermal process.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: June 16, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Cliff Chen, Ben Chiu, Michk Huang, Theron L Lewis
  • Patent number: 8969703
    Abstract: Inexpensive, lightweight, flexible heating and cooling panels with highly distributed thermoelectric elements are provided. A thermoelectric “string” is described that may be woven or assembled into a variety of insulating panels such as seat cushions, mattresses, pillows, blankets, ceiling tiles, office partitions, under-desk panels, electronic enclosures, building walls, refrigerator walls, and heat conversion panels. The string contains spaced thermoelectric elements which are thermally and electrically connected to lengths of braided, meshed, stranded, foamed, or otherwise expandable and compressible conductor. The elements and a portion of compacted conductor are mounted within the insulating panel On the outsides of the panel, the conductor is expanded to provide a very large surface area of contact with air or other medium for heat absorption on the cold side and for heat dissipation on the hot side.
    Type: Grant
    Filed: May 4, 2011
    Date of Patent: March 3, 2015
    Assignee: Tempronics, Inc.
    Inventors: Tarek Makansi, Steve Wood, John L. Franklin, Mark N. Evers
  • Patent number: 8933317
    Abstract: In one embodiment, a system includes a strap configured to be coupled to a container. The strap includes a plurality of plates arranged to allow the strap to flex. The system also includes a thermoelectric device coupled to the strap. The strap is configured to transfer heat between the thermoelectric device and the container. The system includes a thermal interface situated between the thermoelectric device and the strap.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: January 13, 2015
    Assignee: Marlow Industries, Inc.
    Inventors: Joshua E. Moczygemba, Overton L. Parish, IV, Ryan A. Turner, Pravesh Parmanand
  • Publication number: 20140318591
    Abstract: Self-corrugating laminates useful in the manufacture of thermoelectric devices are disclosed. The laminates include an upper and a lower shrinkable film layer and a non-shrinkable core with a thermoelectric pattern formed thereon bonded between said upper and lower shrinkable film along bond lines arranged parallel, substantially parallel, radially, or annularly. The bond lines that bond the upper shrinkable film layer to top surface of the nonshrinkable core are staggered relative to the bond lines that bond the lower shrinkable film layer to the bottom surface of the non-shrinkable core such that upon shrinkage of the shrinkable film layers, structural corrugations are formed in the non-shrinkable core. Thermoelectric modules or devices and methods for forming them from the self-corrugating laminates are also described.
    Type: Application
    Filed: February 18, 2014
    Publication date: October 30, 2014
    Applicant: EASTMAN CHEMICAL COMPANY
    Inventors: Marcus David Shelby, David B. Calvert, Freddie Wayne Williams, Scott Allen Clear, Peter Borden MacKenzie, Candace Michele Tanner, Jennifer Lynne Stikeleather-Peavey, Jeffrey Todd Owens
  • Patent number: 8872302
    Abstract: Disclosed is an electronic apparatus in which a thermoelectric conversion element and at least one of a photoelectric conversion element and a transistor or a diode are monolithically integrated, or which prevents interference between a p-type thermoelectric conversion unit and an n-type thermoelectric conversion unit. This electronic apparatus includes a thermoelectric conversion element (100) including a semiconductor layer of stacked heterostructure (38) which performs thermoelectric conversion using Seebeck effect and at least one of a photoelectric conversion element (102) in which at least a portion of the semiconductor layer of stacked heterostructure (38) performs photoelectric conversion and a transistor (104) or a diode having at least a portion of the semiconductor layer of stacked heterostructure (38) as an operating layer.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: October 28, 2014
    Assignees: Eyeviewtech Co., Ltd., 3D-Bio Co., Ltd.
    Inventor: Masayuki Abe
  • Publication number: 20140305483
    Abstract: A multi-layer thermoelectric module and a fabricating method thereof are provided. The module includes two thermoelectric element sets and a metal electrode set, in which the thermoelectric element sets are corresponding to different operating temperature ranges. Each thermoelectric element set includes a thermoelectric unit, an interfacial adhesion layer, a diffusion barrier layer and a high melting-point metal layer. In the method, the thermoelectric unit, the interfacial adhesion layer, and the diffusion barrier layer are sequentially formed on the thermoelectric unit. Then, two high melting-point metal layers are formed respectively on the electrode layers of the metal electrode set.
    Type: Application
    Filed: July 8, 2013
    Publication date: October 16, 2014
    Inventors: Jing-Yi HUANG, Huey-Lin HSIEH, Tung-Han CHUANG, Jenn-Dong HWANG, Chao-Chi JAIN
  • Publication number: 20140246067
    Abstract: A method for the low-cost production of sheet-like thermocouples comprises the following steps: —providing an electrically and thermally conductive substrate having at least one clearance, which subdivides the substrate into substrate regions, —fitting thermolegs onto the substrate, wherein each thermoleg is connected to a region of the substrate on a hot side and on a cold side, —applying an encapsulation, so that at least each thermoleg is enclosed and the encapsulation enters into a material bond with the regions of the substrate, —separating parts of the substrate in such a way as to prevent a flow of electric current between the regions of the substrate through the at least one clearance. The invention also relates to a substrate that is suitable for carrying out the method and to a thermocouple that can be produced by the method.
    Type: Application
    Filed: October 22, 2012
    Publication date: September 4, 2014
    Inventor: Stefan Hoppe
  • Publication number: 20140090150
    Abstract: A thermal-electronic device includes a first thermo-electric material having a first charge and a second thermo-electronic material having a second charge that is opposite the first charge. A flexible conductive interconnection is positioned between the first thermo-electric material and the second thermo-electric material to bond the first thermo-electric material and the second thermo-electric material into a segment. A plurality of segments are bonded together to form a thread having alternating first thermo-electric materials and second thermo-electric materials. The conductive interconnection allows a charge to flow between the first thermo-electric materials and second thermo-electric materials.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 3, 2014
    Applicant: Anzen Electronics, LLC
    Inventor: Richard J. Skertic
  • Patent number: 8664510
    Abstract: The infrared ray absorbing film 2 is provided with a first layer 21 containing TiN and a second layer 22 containing an Si based compound, converting energy of infrared ray made incident from the second layer 22 to heat. TiN is high in absorption rate of infrared ray over a wavelength range shorter than 8 ?m, while high in reflection rate of infrared ray over a wavelength range longer than 8 ?m. Therefore, if an Si based compound layer excellent in absorption rate of infrared ray over a longer wavelength range is laminated on a TiN layer, infrared ray over a wavelength range lower in absorption rate on the TiN layer can be favorably absorbed on the Si based compound layer, and also infrared ray in an attempt to transmit the Si based compound layer can be reflected on a boundary surface of the TiN layer and returned to the Si based compound layer.
    Type: Grant
    Filed: January 24, 2007
    Date of Patent: March 4, 2014
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Fumikazu Ojima, Jun Suzuki, Ryusuke Kitaura
  • Patent number: 8664509
    Abstract: A thermoelectric apparatus includes a first and a second assemblies, at least a first and a second heat conductors. The first assembly includes a first and a second substrates, and several first thermoelectric material sets disposed between the first and second substrates. The first substrate has at least a first through hole. The second assembly includes a third and a fourth substrates, and several second thermoelectric material sets disposed between the third and fourth substrates. The fourth substrate has at least a second through hole. Each of the first and second thermoelectric material sets has a p-type and an n-type thermoelectric element. The first and second heat conductors respectively penetrate the first and second through holes. Two ends of the first heat conductor respectively connect the second and fourth substrates, while two ends of the second heat conductor respectively connect the first and third substrates.
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: March 4, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Kai Liu, Ming-Ji Dai, Suh-Yun Feng, Li-Ling Liao
  • Patent number: 8659903
    Abstract: A device has a passive cooling device having a surface, at least one active cooling device on the surface of the passive cooling device, and a thermal switch coupled to the passive cooling device, the switch having a first position that connects the active cooling device to a path of high thermal conductivity and a second position that connects the passive cooling device to the path of high thermal conductivity.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: February 25, 2014
    Assignee: Palo Alto Research Center Incorporated
    Inventor: David Eric Schwartz
  • Patent number: 8581089
    Abstract: A module having a plurality of thermoelectric elements electrically connected in series, each being made of at least one n-layer and at least one p-layer made of thermoelectric material with a pn-transition implemented along a boundary layer. A temperature gradient parallel to the boundary layer between a hot and a cold side of each thermoelectric element can be applied or detected. Resistances of the electrical contacts of the individual thermoelectric elements are reduced and the thermal connection to a heat sink or heat source is improved for generating a temperature gradient along the boundary layer. The substrate and the thermoelectric elements are produced in separate processes, and the thermoelectric elements are adhered to previously structured, thermally and electrically conductive regions of the substrate using different adhesives for the cold and hot side of each thermoelectric element.
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: November 12, 2013
    Assignee: O-Flexx Technologies GmbH
    Inventors: Ralph Teunissen, Albert Holger Ulland
  • Publication number: 20130284228
    Abstract: The invention provides a thermoelectric conversion element having a lot of pn junction pairs per unit area and having a thermoelectric material chip which is hardly broken, and a producing method thereof. In the thermoelectric conversion element of the invention, plural substrates in each of which a film-shaped thermoelectric material is formed in a surface thereof are disposed. As a result, because the number of pn junction pairs per unit area is increased, a high output can be obtained. Because the thermoelectric material is formed into the film shape, reliability degradation caused by a breakage of the thermoelectric material can be prevented, even in the thermoelectric material having many pn junction pairs per unit area, namely, a sectional area is small.
    Type: Application
    Filed: January 23, 2012
    Publication date: October 31, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Kaori Toyoda, Takaaki Higashida, Yoshihisa Ohido, Takashi Kubo
  • Publication number: 20130285008
    Abstract: A method of forming a nanowire structure is disclosed. The method comprises applying on a surface of carrier liquid a layer of a liquid composition which comprises a surfactant and a plurality of nanostructures each having a core and a shell, and heating at least one of the carrier liquid and the liquid composition to a temperature selected such that the nanostructures are segregated from the surfactant and assemble into a nanowire structure on the surface.
    Type: Application
    Filed: June 24, 2013
    Publication date: October 31, 2013
    Inventors: Roman VOLINSKY, Raz Jelinek
  • Patent number: 8536439
    Abstract: A thermoelectric device including a first insulating substrate (A) and a second insulating substrate (B) stacked on each other. Including a first electrode (2b) formed on the upper surface of the first insulating substrate (A), a pair of second electrodes (3c, 4c) individually formed on opposite surfaces thereof and connected to each other via a through-hole (7), and a thermoelectric material (5b) provided in the form of a thin film so as to contact the first electrode (2b) and the second electrode (3c). Furthermore, including a pair of third electrodes (8b, 9b) formed on opposite surfaces of the second insulating substrate (B) and connected to each other via a through-hole (10) while one of the third electrodes (8b, 9b) is connected to the first electrode (2b).
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: September 17, 2013
    Assignee: Daikin Industries, Ltd.
    Inventor: Junichi Teraki
  • Publication number: 20130218241
    Abstract: Thermoelectric devices and methods for making and using the devices and their intermediates are provided. Membrane-supported thermoelectric modules are fabricated by dispensing thermoelectric powder into select locations of a membrane to form electrically-isolated columns of thermoelectric material. The powder is then sintered or fused to form thermoelectric elements, which are then electrically connected and combined with thermal interface films to form the modules. The modules are the building blocks of electrical current generating, thermoelectric cooling and heat scavenging thermoelectric devices.
    Type: Application
    Filed: February 16, 2012
    Publication date: August 22, 2013
    Applicant: NANOHMICS, INC.
    Inventors: Steve M. Savoy, Byron G. Zollars, Qizhen Xue, Jeremy J. John, Paul A. Parks
  • Patent number: 8455751
    Abstract: High performance thin film thermoelectric couples and methods of making the same are disclosed. Such couples allow fabrication of at least microwatt to watt-level power supply devices operating at voltages greater than one volt even when activated by only small temperature differences.
    Type: Grant
    Filed: December 2, 2003
    Date of Patent: June 4, 2013
    Assignee: Battelle Memorial Institute
    Inventors: Larry C. Olsen, Peter M. Martin, John W. Johnston, John G. DeSteese
  • Publication number: 20130108893
    Abstract: An electronic device includes a bottom housing, a heat-generating component placed on the bottom housing, and a thermoelectric cell module placed on the bottom housing and corresponding to the heat-generating component. The thermoelectric cell module includes a first thermoelectric sheet sensing a temperature of the heat-generating component, a second thermoelectric sheet sensing a temperature of the bottom housing, and a conductive member electrically connecting the first thermoelectric sheet and the second thermoelectric sheet.
    Type: Application
    Filed: February 8, 2012
    Publication date: May 2, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: FA-GUANG SHI, JIAN-ZHOU ZHAO, YAN LIANG
  • Patent number: 8404959
    Abstract: A thermoelectric device includes a plurality of thin-film thermoelectric elements. Each thin-film thermoelectric element is a Seebeck-Peltier device. The thin-film thermoelectric elements are electrically coupled in parallel with each other. The thermoelectric device may be fabricated using conventional semiconductor processing technologies and may be a thin-film type device.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: March 26, 2013
    Assignee: STMicroelectronics, Inc.
    Inventor: William B. Donley
  • Patent number: 8378206
    Abstract: There are described thermoelectric elements that are manufactured by using a porous matrix or a porous substrate. The matrix consists of an electrically insulating material having sufficient thermal and chemical resistance as well as the lowest possible thermal conductivity, and is provided in predetermined regions with different thermoelectric materials, so that continuous conductors are formed in the matrix. These are electrically connected to one another to form thermocouples, which in turn are electrically interconnected with one another to form the thermoelectric element.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: February 19, 2013
    Assignee: Evonik Degussa GmbH
    Inventors: Ruediger Schuette, Thorsten Schultz, Georg Markowz
  • Publication number: 20130015549
    Abstract: An integrated thermoelectric generator includes a semiconductor. A set of thermocouples are electrically connected in series and thermally connected in parallel. The set of thermocouples include parallel semiconductor regions. Each semiconductor region has one type of conductivity from among two opposite types of conductivity. The semiconductor regions are electrically connected in series so as to form a chain of regions having, alternatingly, one and the other of the two types of conductivity.
    Type: Application
    Filed: July 13, 2012
    Publication date: January 17, 2013
    Applicant: STMicroelectronics (Rousset) SAS
    Inventors: Pascal Fornara, Christian Rivero
  • Publication number: 20120247526
    Abstract: One aspect of the present invention includes a thermoelectric conversion unit having a case in which a flow path of an open structure is molded, a first substrate covering an open portion of the flow path, a second substrate arranged opposite the first substrate, and a plurality of thermoelectric conversion elements arranged between the first substrate and the second substrate. At a bottom surface of the flow path of the case, an introduction pipe and a discharge pipe are formed integrally with the case, and each of the introduction and discharge pipes extend in a direction perpendicular to the first substrate.
    Type: Application
    Filed: March 19, 2012
    Publication date: October 4, 2012
    Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Motoaki OKUDA, Naoya YOKOMACHI, Hiromi UEDA, Junki NAKAMURA
  • Publication number: 20120111387
    Abstract: A thermoelectric device and a method for manufacturing the same are provided. The thermoelectric device includes a middle substrate, electrodes, N-type thermopiles, and P-type thermopiles, in which the N-type thermopile and the P-type thermopile are electrically connected to each other by the electrodes in series. The thermoelectric device includes further includes an upper substrate bonded to an upper surface of the middle substrate and a lower substrate bonded to a lower surface of the substrate, such that a temperature difference is provided between opposite sides of each of the N-type thermopiles and the P-type thermopiles.
    Type: Application
    Filed: May 2, 2011
    Publication date: May 10, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jin-woo CHO
  • Publication number: 20120060889
    Abstract: A thermoelectric module capable of minimizing thermally and physically induced stress includes a pair of substrates having a plurality of electrically conductive contacts disposed on opposing faces, a plurality of P-type and N-type thermoelectric elements interposed between the pair of substrates forming a thermoelectric element circuit, and one or more of a stress minimizing structural element interposed between the pair of substrates where the stress minimizing structural element has a first surface fixed to one of the pair of substrates and a second surface fixed to the other of the pair of substrates in locations between the pair of substrates that minimize the effects of physical and thermal stresses on the plurality of P-type and N-type thermoelectric elements.
    Type: Application
    Filed: September 13, 2011
    Publication date: March 15, 2012
    Applicant: FERROTEC (USA) CORPORATION
    Inventors: Robert W. Otey, David A. Kaminski
  • Publication number: 20120060885
    Abstract: Inexpensive, lightweight, flexible heating and cooling panels with highly distributed thermoelectric elements are provided. A thermoelectric “string” is described that may be woven or assembled into a variety of insulating panels such as seat cushions, mattresses, pillows, blankets, ceiling tiles, office partitions, under-desk panels, electronic enclosures, building walls, refrigerator walls, and heat conversion panels. The string contains spaced thermoelectric elements which are thermally and electrically connected to lengths of braided, meshed, stranded, foamed, or otherwise expandable and compressible conductor. The elements and a portion of compacted conductor are mounted within the insulating panel On the outsides of the panel, the conductor is expanded to provide a very large surface area of contact with air or other medium for heat absorption on the cold side and for heat dissipation on the hot side.
    Type: Application
    Filed: May 4, 2011
    Publication date: March 15, 2012
    Inventors: Tarek Makansi, Steve Wood, John L. Franklin, Mark N. Evers
  • Patent number: 8129822
    Abstract: A template 100 for three-dimensional thin-film solar cell substrate formation for use in three-dimensional thin-film solar cells. The template 100 comprises a substrate which comprises a plurality of posts 102 and a plurality of trenches 104 between said plurality of posts 102. The template 100 forms an environment for three-dimensional thin-film solar cell substrate formation.
    Type: Grant
    Filed: October 6, 2007
    Date of Patent: March 6, 2012
    Assignee: Solexel, Inc.
    Inventor: Mehrdad Moslehi
  • Publication number: 20110277803
    Abstract: In one aspect, the present invention relates to a thermocouple device comprising a flexible non-planar substrate, a first printed thermocouple element comprising a first metal containing ink composition applied to the flexible non-planar substrate, and a second printed thermocouple element in electrical contact with the first printed thermocouple element making a thermocouple junction. The second printed thermocouple element comprises a second metal containing ink composition with a Seebeck coefficient sufficiently different from the first metal containing ink composition for the first and second printed thermocouple elements to together produce a thermocouple effect. The present application further relates to medical devices comprising the thermocouple and methods of making such devices.
    Type: Application
    Filed: March 18, 2011
    Publication date: November 17, 2011
    Applicant: MICROPEN TECHNOLOGIES CORPORATION
    Inventors: William J. GRANDE, Lori J. SHAW-KLEIN, Li Min