Abstract: A thermoelectric device and a method for manufacturing the same are provided. The thermoelectric device includes a middle substrate, electrodes, N-type thermopiles, and P-type thermopiles, in which the N-type thermopile and the P-type thermopile are electrically connected to each other by the electrodes in series. The thermoelectric device includes further includes an upper substrate bonded to an upper surface of the middle substrate and a lower substrate bonded to a lower surface of the substrate, such that a temperature difference is provided between opposite sides of each of the N-type thermopiles and the P-type thermopiles.

Abstract: A thermoelectric module capable of minimizing thermally and physically induced stress includes a pair of substrates having a plurality of electrically conductive contacts disposed on opposing faces, a plurality of P-type and N-type thermoelectric elements interposed between the pair of substrates forming a thermoelectric element circuit, and one or more of a stress minimizing structural element interposed between the pair of substrates where the stress minimizing structural element has a first surface fixed to one of the pair of substrates and a second surface fixed to the other of the pair of substrates in locations between the pair of substrates that minimize the effects of physical and thermal stresses on the plurality of P-type and N-type thermoelectric elements.

Abstract: Inexpensive, lightweight, flexible heating and cooling panels with highly distributed thermoelectric elements are provided. A thermoelectric “string” is described that may be woven or assembled into a variety of insulating panels such as seat cushions, mattresses, pillows, blankets, ceiling tiles, office partitions, under-desk panels, electronic enclosures, building walls, refrigerator walls, and heat conversion panels. The string contains spaced thermoelectric elements which are thermally and electrically connected to lengths of braided, meshed, stranded, foamed, or otherwise expandable and compressible conductor. The elements and a portion of compacted conductor are mounted within the insulating panel On the outsides of the panel, the conductor is expanded to provide a very large surface area of contact with air or other medium for heat absorption on the cold side and for heat dissipation on the hot side.

Abstract: A template 100 for three-dimensional thin-film solar cell substrate formation for use in three-dimensional thin-film solar cells. The template 100 comprises a substrate which comprises a plurality of posts 102 and a plurality of trenches 104 between said plurality of posts 102. The template 100 forms an environment for three-dimensional thin-film solar cell substrate formation.

Abstract: In one aspect, the present invention relates to a thermocouple device comprising a flexible non-planar substrate, a first printed thermocouple element comprising a first metal containing ink composition applied to the flexible non-planar substrate, and a second printed thermocouple element in electrical contact with the first printed thermocouple element making a thermocouple junction. The second printed thermocouple element comprises a second metal containing ink composition with a Seebeck coefficient sufficiently different from the first metal containing ink composition for the first and second printed thermocouple elements to together produce a thermocouple effect. The present application further relates to medical devices comprising the thermocouple and methods of making such devices.

Abstract: P-type semiconductor sheets and n-type semiconductor sheets formed by mixing a powder of semiconductor material, a binder resin, a plasticizer, and a surfactant are prepared. In addition, separator sheets formed by mixing a resin such as PMMA and a plasticizer are prepared. Through holes are formed in each of the separator sheets and then filled with a conductive material. Thereafter, the p-type semiconductor sheet, the separator sheet, the n-type semiconductor sheet and the separator sheet are stacked. The resultant laminated body is cut into a predetermined size and then subjected to a baking process.

Abstract: An energy harvesting system for collecting energy from sources of thermal energy that exist in the environment and convert the energy to electricity. The system has N-P junctions mounted on the outer surface of a conduit, pipe or flue. A hot medium flows through the conduit, pipe or flue. The p-n junctions operate as thermoelectric power generators. Heat absorbed at the p-n junctions increases the kinetic energy of charge carriers causing migration of the charge carriers. This thermally-driven migration of charge carriers is used to drive an electrical current in an external circuit.

Abstract: In various embodiments of the present invention, a thermoelectric device is provided. The thermoelectric device includes one or more thermoelements that transfer heat across the ends of the thermoelectric device. A method for creating the thermoelectric device includes forming a metal substrate, and etching one or more surfaces of the metal substrate to form etched portions. The unetched flat portions on the metal substrate are referred to as mesa cores. Thereafter, thermoelectric films are deposited on the one or more surfaces of the metal substrate. The deposition of the thermoelectric films on the mesa cores results in the formation of a thermoelement.

Abstract: A flexible thermoelectric device and a manufacturing method thereof are provided. Flexible substrates are formed by using LIGA process, micro-electro-mechanical process or electroforming technique. The flexible substrates are used to produce thermoelectric device. The structure and the material property of the substrates offer flexible property and tensile property to the thermoelectric device. Thermal transfer enhancement structures such as thermal via or metal diffusion layer are formed on the flexible substrates to overcome the low thermal transfer property of the flexible substrates.

Abstract: A module having a plurality of thermoelectric elements electrically connected in series, each being made of at least one n-layer and at least one p-layer made of thermoelectric material with a pn-transition implemented along a boundary layer. A temperature gradient parallel to the boundary layer between a hot and a cold side of each thermoelectric element can be applied or detected. Resistances of the electrical contacts of the individual thermoelectric elements are reduced and the thermal connection to a heat sink or heat source is improved for generating a temperature gradient along the boundary layer. The substrate and the thermoelectric elements are produced in separate processes, and the thermoelectric elements are adhered to previously structured, thermally and electrically conductive regions of the substrate using different adhesives for the cold and hot side of each thermoelectric element.

Abstract: The invention relates to method for manufacturing a thermoelectric generator, comprising the steps of replicating a structure into a flexible substrate (4) for providing a set of cavities (4a); providing an initiator (2a) in the cavities for growing respective piles (6, 7) of thermoelectric materials; growing the respective piles of thermoelectric materials from said initiator; providing electrical connection between the respective piles of thermoelectric materials for forming thermocouples of the thermoelectric generator. The invention further relates to a wearable thermoelectric generator and a garment comprising the same.

Abstract: A method for manufacturing thermopile carrier chips comprises forming first type thermocouple legs and second type thermocouple legs on a first surface of a substrate and afterwards removing part of the substrate form a second surface opposite to the first surface, thereby forming a carrier frame from the substrate and at least partially releasing the thermocouple legs from the substrate, wherein the thermocouple legs are attached between parts of the carrier frame. First type thermocouple legs and second type thermocouple legs may be formed on the same substrate or on a separate substrate. In the latter approach both types of thermocouple legs may be optimised independently. The thermocouple legs may be self-supporting or they may be supported by a thin membrane layer. After mounting the thermopile carrier chips in a thermopile unit or in a thermoelectric generator, the sides of the carrier frame to which no thermocouple legs are attached are removed.

Abstract: A method and apparatus for providing electrical energy to an electrical device wherein the electrical energy is originally generated from temperature differences in an environment having a first and a second temperature region. A thermoelectric device having a first side and a second side wherein the first side is in communication with a means for transmitting ambient thermal energy collected or rejected in the first temperature region and the second side is in communication with the second temperature region thereby producing a temperature gradient across the thermoelectric device and in turn generating an electrical current.

Abstract: A thermoelectric conversion device and a manufacture method thereof are provided. The manufacture method includes an electrode board stamping process, an insulating frame molding process, a punching process, an element fixing process, a bending process and an insulating frame integrating process. Band-shaped plate members which function as heat radiating fins and heat absorbing fins and are integrated with insulating frame members are respectively folded-back in such a manner that the folding-back directions of the band-shaped plate members are alternately reverse to each other in the longitudinal direction of the band-shaped plate member. The insulating frame members are joined to each other to be arranged substantially in line, to construct an insulating frame unit. Thus, the component number and the assembly labor can be reduced, while the manufacture quality and the product quality can be improved.

Abstract: A thermoelectric device at least includes a ring-shaped insulated substrate and plural sets of thermoelectric thin film material pair (TEP) disposed thereon. The ring-shaped insulated substrate has an inner rim, an outer rim and a first surface. The sets of TEP electrically connected to each other are disposed on the first surface of the ring-shaped insulated substrate. Each set of TEP includes a P-type and an N-type thermoelectric thin film elements (TEE) electrically connected to each other. Also, the N-type TEE of each set is electrically connected to the P-type TEE of the adjacent set of TEP. When a current flows through the sets of TEP along a direction parallel to the surfaces of P-type and N-type thermoelectric thin film elements, a temperature difference is generated between the inner rim and the outer rim of the ring-shaped insulated substrate.

Abstract: A thermocouple disposed on a substrate comprises a first leg of thermoelectric material, a second leg of thermoelectric material, and a thermocouple junction electrically connecting the first leg and the second leg, wherein a height of the thermocouple junction is substantially a height of the first or second legs.

Abstract: A high efficiency thermo electric device comprising a multi nanolayer structure of alternating insulator and insulator/metal material that is irradiated across the plane of the layer structure with ionizing radiation. The ionizing radiation produces nanocrystals in the layered structure that increase the electrical conductivity and decrease the thermal conductivity thereby increasing the thermoelectric figure of merit. Figures of merit as high as 2.5 have been achieved using layers of co-deposited gold and silicon dioxide interspersed with layers of silicon dioxide. The gold to silicon dioxide ratio was 0.04. 5 MeV silicon ions were used to irradiate the structure. Other metals and insulators may be substituted. Other ionizing radiation sources may be used. The structure tolerates a wide range of metal to insulator ratio.

Abstract: A power sensor having a microstrip transmission line, comprising: a dielectric substrate; a strip conductor disposed on one surface of the substrate; and a ground plane conductor disposed on an opposite surface of the substrate. The power sensor includes a plurality of thermocouples extending from the strip conductor, proximal end portions of the thermocouples being thermally coupled to the strip conductor. A plurality of electrical conductors is provided, each one having a first end electrically connected to a distal end of a corresponding one of the thermocouples and a second end electrically connected to the proximate end of one of the plurality of thermocouples disposed adjacent to such corresponding one of the thermocouples. The proximal ends of the thermocouples are electrically insulated one from the other.

Abstract: A thermoelectric device at least includes a ring-shaped insulative substrate and plural sets of thermoelectric thin film material pair (TEP) disposed thereon. The ring-shaped insulative substrate has an inner rim, an outer rim and a first surface. The sets of TEP electrically connected to each other are disposed on the first surface of the ring-shaped insulative substrate. Each set of TEP includes a P-type and an N-type thermoelectric thin film elements (TEE) electrically connected to each other. Also, the N-type TEE of each set is electrically connected to the P-type TEE of the adjacent set of TER When a current flows through the sets of TEP along a direction parallel to the surfaces of P-type and N-type thermoelectric thin film elements, a temperature difference is generated between the inner rim and the outer rim of the ring-shaped insulative substrate.

Abstract: In a thermoanalytical sensor with a substrate and a thermocouple arrangement that is formed at a measurement position on the substrate, an increase in sensitivity can be achieved by way of a special geometry of the thermocouple arrangement and/or the selection of the material for the substrate. In addition, a manufacturing method is proposed for the inventive sensor.

Abstract: The present disclosure relates to thermoelectric generators (TEGs) and more specifically to TEGs operated with a heat source having a high thermal resistance, more specifically to TEGs operated under conditions of non-constant heat flow and non-constant temperature difference between a hot plate and a cold plate. A thermoelectric generator for connection between a heat source and a heat sink comprises a thermopile unit, the thermopile unit comprising at least one thermopile stage, each thermopile stage comprising a number of thermocouples each having a couple of thermocouple legs, the thermocouple legs being provided in between a hot junction plane and a cold junction plane.

Abstract: An MOCVD process provides aligned p- and n- type nanowire arrays which are then filled with p- and n-type thermoelectric films to form the respective p-leg and n-leg of a thermoelectric device. The thermoelectric nanowire synthesis process is integrated with a photolithographic microfabrication process. The locations of the p- and n-type nanowire micro arrays are defined by photolithography. Metal contact pads at the bottom and top of these nanowire arrays which link the p- and n-type nanowires in series are defined and aligned by photolithography.

Abstract: A thermoelectric structure and device including at least first and second material systems having different lattice constants and interposed in contact with each other, and a physical interface at which the at least first and second material systems are joined with a lattice mismatch and at which structural integrity of the first and second material systems is substantially maintained. The at least first and second material systems have a charge carrier transport direction normal to the physical interface and preferably periodically arranged in a superlattice structure.

Abstract: Method for manufacturing thermoelectric converters, consisting in weaving electroconducting threads (12, 14) of two different natures, parallel and arranged alternately, with threads (10) made of an electrically insulating material in moving the electroconducting threads together two by two at predetermined intervals, in welding them in their contact zones (20) and in cutting them at the level of the welds so as to obtain strips (34) comprising, on the longitudinal edges thereof, a large number of thermocouples connected in series.

Abstract: The invention relates to a heat flux comparator comprising two substantially planar and mutually parallel input faces, capable of receiving each a heat flux, and comprising a thermoelectric circuit including at least a strip of a first metallic material partly covered on one of its surfaces with first separate metal pads of a second metallic material. The heat flux comparator also comprises layers of an insulating material arranged on either side of the thermoelectric circuit, second and third pads arranged on respective faces of the two layers of insulating material which are directed away from the thermoelectric circuit. The second and third pads are made of a same material and have substantially a same thickness, and the layers of insulating material have a same thickness too.

Abstract: A thermopile structure containing improved heat sinks for thermocouples in the detectors is described. The heat sinks are provided without additional processing. The heat sinks are added by using “dummy traces” to the polysilicon mask. The “dummy traces” act as heat sinks to transfer of thermal energy from the narrow metallic traces used in the thermocouple. The “dummy traces” are not electrically connected to the thermopile, therefore they do not affect the electrical resistance of the thermopile. Also, the “dummy trace” does not add significant mass to the thermopile/membrane system; therefore they do not adversely affect the thermal conductance of the system.

Abstract: Disclosed is a foil segment for a thermoelectric generator comprising a top plate disposed in spaced relation above a bottom plate. An array of the foil segments is perpendicularly disposed in side-by-side arrangement between and in thermal contact with the bottom and top plates. Each foil segment comprises a substrate having a thickness of about 7.5-50 microns, opposing front and back substrate surfaces and a series of spaced alternating n-type and p-type thermoelectric legs disposed in parallel arrangement on the front substrate surface. Each of the n-type and p-type legs is formed of a bismuth telluride-based thermoelectric material having a thickness of about 5-100 microns, a width of about 10-100 microns and a length of about 100-500 microns. The alternating n-type and p-type thermoelectric legs are electrically connected in series and thermally connected in parallel such that a temperature differential between the bottom and top plates results in the generation of power.

Abstract: A sample holder for differential thermal analysis has a substrate with a planar surface provided with a sample position for a sample material and a reference position for reference material. The substrate allows heat flow between a heat source thermally coupled to the sample holder and the sample and reference positions. A first thermoelement arrangement in the area of the sample and reference positions is provided for supplying a thermoelectric signal corresponding to a differential between the temperatures at the sample and reference positions. First connectors are formed on the substrate for tapping the thermoelectric signal corresponding to the temperature differential. A second thermoelement arrangement provides a thermoelectric signal corresponding to an absolute temperature of the sample and reference positions. Second connectors are provided on the substrate for tapping the thermoelectric signal corresponding to the absolute temperature.

Abstract: A self-detecting type cantilever for an atomic force microscope (AFM) has an electro-flexural conversion element for converting a flexural amount of the cantilever into an electric current or voltage, a temperature measurement element disposed at a front end portion of the cantilever for measuring a temperature, and a heating element disposed at the front end portion of the cantilever for heating the temperature measurement element. The temperature measurement element and the heating element are superposed with each other on a main face of the cantilever via an electrical insulating layer. As a result, even if the amount of electric energy supplied to the heating element is reduced, it is possible to effectively supply an amount of heat necessary for measurement to the temperature measurement element. Therefore, by minimizing the heat to be supplied to a sample and the cantilever, the respondency of measurement is improved and temperature measurement can be performed with a high degree of accuracy.

Abstract: A thermoelectric module with a simple structure with less breakage by thermal stress is provided. For this purpose, the thermoelectric module includes p-type and n-type thermoelectric elements (13, 14) which are alternately placed, and outer electrodes (15) and inner electrodes (16), which are alternately placed between the thermoelectric elements (13, 14), and at least part of at least either one of the outer electrode (15) or the inner electrode (16) has a shape approximately along an object which exchanges heat with the electrodes (15, 16). The inner electrodes (16) surround an object which exchanges heat with the electrodes (15, 16).

Abstract: A thermoelectric generator comprising a plurality of semi-conductor elements of type n an type p alternatingly disposed and connected at the ends thereof to form a plurality of thermocouples on two opposite faces of the generator, said elements being thin polycrystalline semi-conductor ceramic layers deposited on a microporous support by means of serigraphy and fixed to said support by sintering.

Abstract: In a thermo pile infrared ray sensor, an opening portion is formed by etching a substrate from a second surface after an n-type poly-Si layer and a thin aluminium layer are formed so that first and second connection portions are formed by parts thereof. An infrared ray absorbent layer is formed on the substrate to cover the first connection portion with a screen print after the opening portion is formed.

Abstract: A sensor designed for measurement of conducted heat flux passing through a solid object consists of a thin film thermopile deposited on a planar substrate whose thermal properties match those of the solid object. The thermopile is protected by a thin rectangular plate made of the same material as the substrate. The sensor is imbedded in the solid object and measures the vector of heat flux along the thermopile axis with minimal distortion of the heat flow pattern. Applications include measurement of heat flux in casting molds, boiler tubes, well surveying instruments and laser weapons testing.

Abstract: A thermoelectric conversion device that eliminates differences in the distance between two adjacent junctions. The thermoelectric conversion device includes an insulative core. A thermocouple assembly is formed spirally around the insulative core contacting the circumferential surface and includes a plurality of series-connected thermocouples. Each of the thermocouples defines a single loop of the spiral and has a first metal body, which is formed in half of the loop, and a second metal body, which is formed in the remaining half of the loop from a metal differing from the first metal body. A plurality of junctions are formed between the first metal body and the second metal body of each thermocouple. The junctions are formed at 180° intervals along the spiral thermocouple assembly.

Abstract: A combined thermocouple and thermopile capable of producing multiple EMF signals. The combined thermocouple and thermopile construction is particularly adapted for use as an electric generator capable of producing multiple EMF signals and able to respond faster to changes to the presence or absence of a pilot or gas burner flame. The conductors of the thermopile are comprised of dissimilar metals joined at each end to form hot and cold thermocouple junctions. The thermopile may provide multiple EMF signals when a third wire lead is affixed to a cold junction between either end of the array. The array of thermocouples is formed in a circle and enclosed in a metal sleeve or jacket.

Abstract: A nanoscale force sensing device includes a probe having a tip with multiple isolated channels which can receive different materials. The device may be either straight or cantilevered and may be mounted to permit detection of surface forces while performing other functions at the same time.

Abstract: A thermopile on an electrically insulating substrate. A pattern is arranged on this substrate of parts which consist of a first conductive material, to which a second conductive material is applied, and parts which consist only of the first conductive material. The second material is better electrically conducting than the first and, connected as thermopile, can thereby generate a certain thermo-voltage. The second material is applied to the first, starting from a layer of the first material on the substrate, by etching stripes therein via the so-called “blind-hole etching” technique and applying the second material in these stripes.

Abstract: A thermoelectric conversion component includes a substrate having a cavity. An insulating film is formed on the upper surface of the substrate. A small heat-capacity region is formed in the center of the insulating film, and a large heat-capacity region is formed in the outer peripheral portions of the substrate and the insulating film. A thermoelectric pattern is formed on the upper surface of the insulating film so that hot junctions and cold junctions are respectively placed on the small heat-capacity region and the large heat-capacity region. Thermosensitive resistor patterns are formed on the outer peripheries of the cold junctions of the thermoelectric pattern.

Abstract: An infrared detecting device possible to improve SN ratio, which is provided with a semiconductor substrate, a diaphragm set on the semiconductor substrate, a thermopile formed on the diaphragm by arranging a plurality of thermocouples composed of p-type polysilicon and n-type polysilicon in a row and electrically connecting them each other in series, and a heat absorption film formed on the central portion through an insulation layer, and sectional areas of the p-type and n-type polysilicons between hot and cold junctions of each of the thermocouples are made different from each other.

Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.

Abstract: A sensor, in particular thermal sensor, having a silicon element and a largely self-supporting membrane layer equipped with at least one sensor element, is proposed. The membrane layer is furthermore spaced away from the silicon element by way of at least one contact column and is at least largely supported thereby. The contact column moreover makes electrical contact to the sensor element. Also proposed is a method for manufacturing a largely self-supporting membrane, a polymer layer first being deposited on a base element, patterned, and equipped with at least one cutout. The cutout is subsequently filled with a filler material, and a membrane layer is applied onto the polymer layer. Lastly, the polymer layer is removed again. The proposed method for manufacturing a largely self-supporting membrane layer is suitable in particular for constructing a sensor, in particular a thermal sensor or a thermal sensor array.

Abstract: A nondestructive inspection device (or method) is basically configured such that a laser beam (1300 nm) is irradiated on a surface (or back) of a semiconductor device chip to scan. Due to irradiation of the laser beam, a defect position is heated to cause a thermoelectromotive current, which induces a magnetic field. A magnetic field detector such as SQUID detects a strength of the magnetic field, based on which a scan magnetic field image is produced. A display device superimposes the scan magnetic field image on a scan laser microphotograph on a screen, so it is possible to perform defect inspection on the semiconductor device chip. Incidentally, a semiconductor device wafer is constructed to include a thermoelectromotive force generator and its wires, which are electrically connected to first-layer wires. By irradiation of the laser beam on the thermoelectromotive force generator, it is possible to detect a short-circuit defect, which lies between the first-layer wires.

Abstract: A sensor designed for measurement of conducted heat flux passing through a solid object consists of a thin film thermopile deposited on a planar substrate whose thermal properties match those of the solid object. The thermopile is protected by a thin rectangular plate made of the same material as the substrate. The sensor is imbedded in the solid object and measures the vector of heat flux along the thermopile axis with minimal distortion of the heat flow pattern. Applications include measurement of heat flux in casting molds, boiler tubes, well surveying instruments and laser weapons testing.

Abstract: A device for generating power to run an electronic component. The device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with a high temperature region. During operation, heat flows from the high temperature region into the heat-conducting substrate, from which the heat flows into the electrical power generator. A thermoelectric material (e.g., a BiTe alloy-based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. A low temperature region is located on the side of the thermoelectric material opposite that of the high temperature region. The thermal gradient generates electrical power and drives an electrical component.

Abstract: Method for manufacturing a thermopile on an electrically insulating substrate. A pattern is arranged on this substrate of parts which consist of a first conductive material, to which a second conductive material is applied, and parts which consist only of the first conductive material. The second material is better electrically conducting than the first and, connected as thermopile, can thereby generate a certain thermo-voltage. The second material is applied to the first, starting from a layer of the first material on the substrate, by etching stripes therein via the so-called “blind-hole etching” technique and applying the second material in these stripes.

Abstract: A sensor has a series circuit, which includes first and second end terminals, a set of thermocouples electrically connected in series between the first end terminal and the second end terminal, and electrical inspection terminals, which extend from corresponding intermediate points in the series circuit between the first end terminal and the second end terminal to divide the set of thermocouples into smaller groups of thermocouples. A resistance value of each group of thermocouples is measured through adjacent two of the first and second end terminals and the electrical inspection terminals while the sensor is in a wafer state. Whether the thermopile infrared sensor is normal is determined based on the measured resistance value of each group of thermocouples.

Abstract: An improved thermopile construction particularly adapted for use as an electric generator capable of producing multiple EMF outputs in response to heat from a pilot flame. A cluster of long elements comprised of two dissimilar metals are assembled with one end of one element joined with one end of a second element to form hot and cold thermocouple junctions which are arrayed in a circle. One of the groups of two dissimilar metals being located at the beginning of the array and being longer than the rest of the array extends beyond the other hot junctions allowing for greater sensitivity and responsiveness to changes in the temperature of the pilot flame and surrounding radiating surfaces. The cold junction of the longer elements has an extension wire connected to one of the dissimilar metals forming the thermocouple which leads from the enclosure housing the cluster of thermocouples to serve as the negative lead.

Abstract: A method for forming thermal isolation for a micro thermopile device comprises steps of forming a narrow etching window on the membrane and forming a plurality of micro connection structures each crossing the narrow etching window and connecting the edge portion of the membrane on both sides of the narrow etching window, and etching the silicon substrate through the narrow etching window to form a pit between the silicon substrate and the membrane, whereby the membrane becomes a floating membrane and has thermal isolation with the silicon substrate. By this method, the area of the floating membrane is increased and the strain of the floating membrane is reduced.

Abstract: A SiO2 layer is formed on a heat sink section having a cavity by thermal oxidation and an aluminum oxide layer is formed on the SiO2 layer by an electron beam evaporation process at a substrate temperature of 60° C. or less and at a deposition rate of 0.8 nm/s or less. The resulting aluminum oxide film is amorphous and has partial oxygen defects. The SiO2 layer and the aluminum oxide layer constitute a heat insulating thin-film. A thermoelectric conversion element and an infrared-absorbing layer are formed on the heat insulating thin-film to form an infrared sensor. The infrared sensor can be produced at low production costs and has high sensitivity.

Abstract: A thermopile infrared sensor includes a substrate, at least one thermocouple cantilever beam comprising at least one thermocouple, and a suspending membrane. The cantilever beam is formed above the substrate. The cantilever beam has a first end and a second end located away from the first end. The first end is attached to the substrate to form a cold junction. A predetermined distance is formed between the second end and the substrate. The suspending membrane is formed above the cantilever beam and is supported by the second end of the cantilever beam to form a hot junction. The cantilever beam is completely hidden underneath or covered by the suspending membrane. In addition, an integrated circuit, which is underneath the suspending membrane, can be integrated with the thermopile infrared sensor.