Abstract: Disclosed are integrity-enhanced thermoelectric devices and methods of their preparation. Such devices have the following characteristics: (1) there is, on average, no greater than about 10% incidence of function loss (failure) of the device on application to the device of a substantial impact or distortion force or corrosion exposure, and (2) the device have at least about 85% of the thermal performance of thermoelectric devices without integrity enhancement (i.e., thermal conductivity across the integrity-enhanced devices is significantly less than 0.0021 Cal-Cm/Cm.sup.2 Sec .degree.C., and is less than or equal to about 0.0015 Cal-Cm/Cm.sup.2 Sec .degree.C.; empirically expressed as maintenance of at least a 40.degree. C. temperature differential over the intra-plate distance which is about 3/16 to about 1/4 of an inch.).

Abstract: A thermocouple arrangement for developing, evaluating, monitoring and adjusting any process performed on or otherwise so as to thermally affect a printed circuit board assembly or other electronic assembly (including bare circuit board or boards in the manufacturing process), such as soldering/desoldering and various other production, rework and repair processes including cleaning, fluxing, preheating, thermocompression bonding and spot welding. In accordance with various embodiments, a layer of a first conductor material is applied on a first surface of an electrically insulative support, while a second layer of a second, dissimilar, conductor material is applied to at least one other surface of the support using conventional printed circuit board construction techniques.

Abstract: A method of forming printed circuits on an insulating film comprising the steps of forming a panel plating layer, plating the circuits onto the panel plating layer, applying a film to the plated panel plating layer and chemically removing the panel plating layer. In addition, the printed circuit is impressed into the film so as to form a planar surface and a protective film is placed over the film and impressed circuit. The method of making a thermocouple by this process is also disclosed.

Abstract: A composite semiconductive thermoelectric refrigerating module comprises dozens or hundreds composite P-N couples which are electrically connected in series to form an array of required configuration which is fixed with electrical and thermal insulator and combined with the heat absorber and a thermal radiator, respectively, by thermoconductive greased films of electrical insulation. The refrigerating device is characterized by a good conductor sandwiched between the semiconductor head parts of a thermoelectric element by surface-to-surface brazing. This device can be substituted for small sized vapor compression refrigerating devices. The first embodiment of the invention is of circular configuration, while the second embodiment is rectangular. Other embodiments of specific configurations in accordance with requirements can also be constructed.

Abstract: A new and improved semiconductor thermoelectric device which could be used either as a thermoelectric cooler or as a thermopile heat sensor with high output voltage. This invention comprises an array of thermocouples fabricated on a semiconductor substrate. The thermocouples comprise segments of tantalum and segments of conductively doped polysilicon as two electric conductor materials of different thermoelectric properties which are buried between two layers of oxide. A layer of metal as a heat collector covers the surface of the thermopile and distributes heat from a nearby heat source.

Abstract: The electric resistor of this invention is comprised of a Si-Ge alloy thin film containing amorphous and microcrystal phases which serve as an electric resistance, thereby keeping the resistance value ratio substantially constant and uninfluenced by frequency changes which range from d.c. to 32 GHz. In addition, the power detector of this invention uses a thermocouple which is made by connecting the conductor film with the above-mentioned alloy thin film having great thermoelectric power. The thermocouple is provided with beam lead electrodes at cold junction areas to thereby produce large temperature differences between the hot and cold junctions, so that the thermocouple is provided with a sufficient thermal gradient to detect very low power with high accuracy.

Abstract: A thermopile detector is disclosed consisting of a semiconductor supporting rim which is doped across all of the rim. The rim supports a series of polycrystalline silicon and metal thermocouples. The fully doped semiconductor area serves as an etch stop for a single-sided etch which eliminates the need for front-to-back alignment of the device. The semiconductor doped rim also serves as a good thermal conductor for supporting the cold junctions. The hot junctions of the thermocouples may be supported by a thin dielectric membrane spanning the device and the cold junctions are formed on the doped rim. The thin dielectric window provides thermal isolation between the semiconductor rim and the center of the window where the hot junctions are located. The thermocouple material layers may be stacked to enable greater thermocouple density on the device. Refractory metals may be employed as the thermocouple metal, to increase sensitivity.

Abstract: Thermopile has a plurality of reference junctions and a plurality of measurement thermocouple junctions connected electrically alternately in series on a dielectric support. Each reference junction has thereover a first medium which is nonthermally responsive and each measurement junction has thereover a second medium which is thermally responsive. The first and second mediums occupy areas which are arranged in a checkerboard pattern, the reference junctions under areas occupied by said first medium each being electrically connected directly to a measurement thermocouple under an area occupied by said second medium.

Abstract: In order to increase the thermoelectromotive force delivery by a thermoelectric element as a whole or regulate the temperature coefficient of such thermoelectromotive force, n-type semiconductive ceramic members and p-type semiconductive ceramic members are assembled to form such element and are electrically connected with each other. The n-type and p-type semiconductive ceramic members are provided in the form of plate members, which are stacked so as to be interconnected by insulating layers and conductor layers. The insulating and conductor layers are provided on opposite surfaces of adjacent plate members by thick film printing and baking performed thereafter.

Abstract: Disclosed is a thermopile improved in its measurement sensitivity and manufacturing cost, which comprises a pillar-shaped substrate having a side extending in the parallel direction to an incident light to be measured so as not to be irradiated with the incident light, and first and second thermoelectric material layers arranged alternately on the side of the pillar-shaped substrate along the extending direction of the side of said pillar-shaped substrate.

Abstract: A temperature sensor construction suitable for use in mechanically oscillating systems features a protective tube 8 containing a temperature sensor 11, a springy carrier board 1 with conductive tracks 2,3 and terminals 4,5,6,7 for a signal transmission conductor. The carrier 1 is mounted, under spring tension, facing the inner surface of the protective tube 8. The conductive tracks preferably run parallel to the axis of the protective tube and have contacts 4,5 at one end for connection to the temperature sensor 11 and contacts 6,6',7,7' at the other end for connection to the signal transmission leads 12, 12', 13, 13'.

Abstract: A multiple thermocouple sensor for thermal analysis includes a plurality of thermocouples with elements and element junctions mounted on a carrier plate in the form of a thick film. The elements extend in semicircles and the element junctions are arranged in a circle to form a measuring point. Each measuring point has an electric connection. Since the thermocouples are in the form of thick film, they can be arranged closely together. Twenty element junctions may be provided at each measuring point. A sample dish and a reference dish used at the measuring points have multiple contact with the element junctions. This increases not only the measuring accuracy but also the sensitivity of the multiple thermocouple sensor.

Abstract: Thermoelectric device having a number of thermoelectric elements electrically connected in series and thermally connected in parallel. Each element is provided with two element halves, electrically connected in series and thermally connected in parallel, of opposite conductivity types. Each element half has two semiconducting end pieces and an electrically conducting intermediate piece which are electrically connected in series.

Abstract: A thermoelectric semiconductor multicouple array comprises a substrate of semi-insulating material 10, alternate n-type and p-type strips or legs ion implanted into said substrate and connected together electrically in series, and terminal means 11 connected to said series-connected strips or legs. The array may be incorporated in an integrated circuit chip. A method of making such thermoelectric semiconductor multicouple arrays is also disclosed.

Abstract: A thermoelectric semiconductor multicouple array comprises a substrate of semi-insulating material 10, alternate n-type and p-type strips or legs ion implanted into said substrate and connected together electrically in series, and terminal means 11 connected to said series-connected strips or legs. The array may be incorporated in an integrated circuit chip. A method of making such thermoelectric semiconductor multicouple arrays is also disclosed.

Abstract: A transparent thin film thermocouple and a method of manufacturing comprig a positive element of indium tin oxide (ITO) and a negative element of indium oxide (In.sub.2 O.sub.3) formed on a surface by reactive sputtering with the elements being electrically joined to form a hot junction for conversion of heat into electricity.

Abstract: The electric resistor of this invention is comprised of a Si-Ge alloy thin film containing amorphous and microcrystal phases which serve as an electric resistance, thereby keeping the resistance value ratio substantially constant and uninfluenced by frequency changes which range from d.c. to 32 GHz. In addition, the power detector of this invention uses a thermocouple which is made by connecting the conductor film with the above-mentioned alloy thin film having great thermoelectric power. The thermocouple is provided with beam lead electrodes at cold junction areas to thereby produce large temperature differences between the hot and cold junctions, so that the thermocouple is provided with a sufficient thermal gradient to detect very low power with high accuracy.

Abstract: A temperature difference detecting element utilizing thermoelectromotive force which is generated by a Seebeck effect when temperature gradients are applied to a semiconductive ceramic material. A substrate has a plurality of thermoelements. Each thermoelement comprises a semiconductive ceramic material and a pair of hot-side and cold-side electrodes which are provided on the semiconductive ceramic material with a prescribed spacing, to form a hot junction and a cold junction respectively. A plurality of such hot-side electrodes are arranged on a first region of the substrate to be adjacent to each other, while a plurality of such cold-side electrodes are arranged on a second region of the substrate to be adjacent to each other. The plurality of thermoelements are sequentially connected in series with each other by electrically connecting, for example, the hot-side electrodes of the thermoelements with the cold-side electrodes of those adjacent thereto.

Abstract: A thermoelectric heat pump or power source device is provided with P-type and N-type elements made of either thin films or thick films for use on flexible or nonflexible substrates. For flexible units the film type elements are formed on substrates of such flexible, electrically insulation material as, for example, MYLAR and TEFLON; while for inflexible units the elements are formed on substrates of such materials as, for example, Beryllia, Alumina, ceramics, or plastics. Further, the elements are patterned on the different substrates for particular usages. For example, radial element patterns are used for cooling hot spots and ladder element patterns are used for cooling linear hot bodies. Ladder element patterns may also be used on flexible substrates to be folded to form corrugations having cold strips and hot strips on opposing sides to which sheets of suitable material can be attached to form panels, blankets, therapeutic devices or pipe coverings for heating or cooling their contents as desired.

Abstract: A device is provided for measuring the intensity of a radiative flux and optionally also a convective flux, including a thin support made from an insulating material; a thin continuous strip of meandering shape made from a first conducting material; a series of discontinuous deposits made from a second conducting material having a thermoelectric power different from that of the first material and a high electric conductivity, the whole of the deposits and of the associated underlying strip portion forming an elementary thermocouple and having, in the transverse direction with respect to the direction of extension of the strip, a width which varies between its two ends, the variation in width being in the same direction for the successive deposits along the strip; and a coating with high emissivity intimately covering at least the successive deposits. The device may also include a heat conducting layer.

Abstract: The invention relates to a composite material, which comprises a sheet of insulating matter comprising on one face a meandering strip of Constantan covered with zones of copper, so as to define a fluxmeter formed by successive rows of individual thermocouples. Between the rows defined between the meanders of the strip are provided free spaces in which are made first patterns likewise of Constantan constituting a first arm of a thermocouple; the other face of the insulating sheet is coated with a sheet of copper in which are provided second patterns likewise of copper constituting a second arm of thermocouples. The first patterns and the second patterns are in electrical contact by metal welds also of copper, thus forming temperature detector thermocouples. A composite material is thus obtained forming a fluxmeter and a temperature sensor combined in a single device making it possible to detect the measurements in one plane, which is easy to manufacture.

Abstract: The present invention relates to a rapid response thermocouple probe 10 having a resilient, replaceable thermocouple element 50 probe 10, comprising cylindrical body 20 having housing means 30 at one end, securing means 40 associated with housing means 30 and comprising two securing elements, 40a and 40b, in electrical isolation from each other, and a resilient thermocouple element 50 comprising an arcuate strip of two dissimilar metals joined together, ends, 55 and 57, of thermocouple element 50 being removably secured to securing means 40. The thermocouple probe of this invention eliminates the necessity of discarding the entire probe upon wear or breakage of thermocouple element 50.

Abstract: A thermocouple consists of a first thin layer of metal disposed on a mylar sheet. The metal layer is then covered with a varnish by employing a printing process which prints spaced apart apertures on the metal layer indicative of a hot junction and a reference junction terminal. Another top metal layer is deposited upon the varnish layer in a line grating pattern to cover one hole in each pair to thus form a hot junction by connecting the top metal layer to the first layer via the hole. The other aperture forms one terminal of the reference junction. The metal layers are extremely thin as deposited by a vapor evaporation process and hence the thermocouple exhibits a rapid response to temperature change. The method of fabrication of the devices enables one to provide mass produced units at extremely low cost.

Abstract: A novel multilayer photoconductive I.R. detector is formed by incorporating alternate p and n-type layers, such that many layers occupy the detector thickness. The detector may be considered as a n-type photoconductor containing buried isolated p-type regions which give rise to internal electric fields the effect of which is to enhance minority carrier lifetime and inhibit motion of minority carriers towards surfaces.

Abstract: The invention is a heat flux gage applied to a surface, for the measurement of surface heat transfer. All elements of the gage are thin films, deposited on the surface by sputtering or an equivalent process. The gage comprises a plurality of thermocouple junctions connected as a differential thermopile, with hot and cold junctions on the two faces of a planar thermal resistance element. Electrical insulating and protective layers are deposited between the surface and the gage, and over the exterior of the gage. The gage output signal is a voltage indicative of heat flux.

Abstract: Thermal fluxmeter with a plurality of thermocouples comprising a continuous thin layer of a first conductor or semiconductor material such as constantan, covered on at least one of its faces by a succession of areas comprised of very thin deposits of a second conductor or semiconductor material such as copper, having a thermoelectric power different from that of the first material; the characteristic of the invention is that at least one channel traverses from side to side through each deposit area and through the underlying thin layer, said channels being offset in the same direction with respect to the center of the traversed area; said channels may be provided with an inner coating of a deposit of the second material; appropriately, the thin layer is deposited on a substrate of insulating material.

Abstract: A thermoelectric unit is disclosed having superposed PN semiconductor thermoelectric stages (10, 12) thermally and electrically connected together by a planar ceramic coupler (14) therebetween. The PN semiconductor blocks (16, 18) of each stage are connected by metallic bridging elements (20), which bridging elements are soldered to isolated metallized areas (40) on each face surface of the ceramic coupler (14) to thereby form a thermal path between the stages. Each stage further includes power source tabs (22,24; 26,28), the tabs (26,28) of one stage receiving power from the other stage through electrically conductive metallized edge paths (42, 44) on the ceramic coupler (14). This forms an interstage connection for connecting the PN semiconductor blocks of the one stage to the PN semiconductor blocks of the other stage.

Abstract: A mold of a caterpillartype track mold for a continuous caster features at least at one place a pair of wires which form a thermocouple and make first contact outside the mold. The wires are inserted into the mold in such a manner that their other ends are separated from the surface of the mold facing the melt by a metallic layer which joins these wires and is at most 100 .mu.m thick. The process for manufacturing this mold is such that the metallic layer is electro-deposited on to the ends of the wires.

Abstract: A gas sensor has a 100-400 .mu.m thick gas-sensitive layer containing 5-30 mole % of a platinum group metal or an alloy thereof.

Abstract: A thermocouple consists of a first thin layer of metal disposed on a mylar sheet. The metal layer is then covered with a varnish by employing a printing process which prints spaced apart apertures on the metal layer indicative of a hot junction and a reference junction terminal. Another top metal layer is deposited upon the varnish layer in a line grating pattern to cover one hole in each pair to thus form a hot junction by connecting the top metal layer to the first layer via the hole. The other aperture forms one terminal of the reference junction. The metal layers are extremely thin as deposited by a vapor evaporation process and hence the thermocouple exhibits a rapid response to temperature change. The method of fabrication of the devices enables one to provide mass produced units at extremely low cost.

Abstract: The detecting element of a thermoelectric infrared detector consists of p-n junctions of a thermopile which are located on a thin layer of unsupported silicon dioxide. The silicon dioxide spans an opening which extends through a silicon semiconductor substrate. The reference junctions of the thermopile are located above the silicon substrate. The detecting p-n junctions on the thin silicon dioxide above the opening in the substrate have a low heat capacity and respond rapidly to temperature changes, whereas the reference junctions above the thick substrate have a much higher heat capacity and tend to maintain their ambient temperature. The conduction of heat between the detecting p-n junctions and the reference junctions is limited by the thin insulating layer of silicon dioxide which joins the detecting p-n junctions to the substrate under the reference junctions.

Abstract: A heat sensitive cable operable over a temperature range of between approximately -20.degree. F. and 1650.degree. F. The cable includes a tubular metallic sheath which is substantially temperature resistant and moisture impervious. It also includes a mass of compacted insulation material filling the sheath and having an insulation resistance variable with temperature in the range of between approximately 100 and 50,000 ohms. The cable further includes at least one thermoelectric conductor positioned within the insulation material filling the sheath. A method of manufacturing the cable includes the step of preparing the insulation material and advancing the thermoelectric conductor through a given region. It also includes the step of advancing a strip of flat metal material past apparatus for forming and welding a tubular sheath surrounding the given region.

Abstract: A method for determining reactive acoustic power density level and its direction in a fluid using a single sensor is disclosed. In the preferred embodiment, an apparatus for conducting the method, which is termed a thermoacoustic couple, consists of a stack of thin, spaced apart polymeric plates, selected ones of which include multiple bimetallic thermocouple junctions positioned along opposite end edges thereof. The thermocouple junctions are connected in series in the nature of a thermopile, and are arranged so as to be responsive to small temperature differences between the opposite edges of the plates. The magnitude of the temperature difference, as represented by the magnitude of the electrical potential difference generated by the thermopile, is found to be directly related to the level of acoustic power density in the gas.

Abstract: An apparatus for determining the direction of orientation of pulsed sources includes a detector having two rectangular arrays of thermocouple strips fixed to opposite surfaces of a substrate. Radiation from the source is restricted to be incident on only one of the rectangular arrays. The incident radiation is thermalized quickly by the first array, and a voltage differential between the two rectangular arrays is sensed. The orientation of the source with respect to the optical axis of the apparatus can be calculated from an identification of that portion of the array wherein local thermalization takes place.

Abstract: An energy conversion element is disclosed which is capable of efficiently converting light and thermal energies into electrical energy. The element comprises a thermoelectric material and a photoelectric material which are different in type and joined together and is capable of efficiently converting solar energy incident on the junction between the both materials into electrical energy. The thermoelectric material is most suitably formed of a transition element-silicon compound.

Abstract: A thermoelectric device exhibiting both structural integrity and decreased stress across the device notwithstanding the application of thermally cycled temperature differentials thereacross includes, electrically interconnected thermoelectric elements and a rigidly affixed substrate. Thermal stress is relieved by using flexible conductors to interconnect the thermoelectric elements, and by the use of a flexile joint to attach a second substrate to the remainder of the device. Complete elimination of the second substrate may also be used to eliminate stress. Presence of the rigidly affixed substrate gives the device sufficient structural integrity to enable it to withstand rugged conditions.

Abstract: A method and apparatus for fabricating a thermoelectric device includes forming a matrix board (12) with an array of orifices (100) formed therein. A plurality of P-type thermoelements (96) are formed and then a vacuum chuck (92) is utilized to dispose alternating ones of the elements (96) into the alternating ones of the orifices (100). A plurality of N-type elements (108) is formed and a vacuum chuck (104) is utilized to dispose alternating ones of the elements (108) into the remaining orifices (100) of the matrix (12). This forms an assembled array (52). A plurality of conductive tabs (114) is placed onto the P-type elements (98) and N-type elements (108) by a vacuum chuck (116). A second set of conductive tabs (120) is disposed on the opposite side of the assembled array by a vacuum chuck (124). A solder flow oven (54) and a solder flow oven (76) are utilized to reflow the solder on the tabs between the two operations.

Abstract: A thermoelectrical arrangement comprises a thermocouple element, each limb of which has a heat flow at one point such that a large temperature gradient is present and, as a result, the specific heat conduction at this point is reduced.

Abstract: A heat sensitive cable operable over a temperature range of between approximately -20.degree. F. and 1650.degree. F. The cable includes a tubular metallic sheath which is substantially temperature resistant and moisture impervious. It also includes a mass of compacted insulation material filling the sheath and having an insulation resistance variable with temperature in the range of between approximately 100 and 50,000 ohms. The cable further includes at least one thermoelectric conductor positioned within the insulation material filling the sheath. A method of manufacturing the cable includes the step of preparing the insulation material and advancing the thermoelectric conductor through a given region. It also includes the step of advancing a strip of flat metal material past apparatus for forming and welding a tubular sheath surrounding the given region.

Abstract: An invention is disclosed which provides improved thermoelectric devices and methods of making and using the same. The device exhibits enhanced efficiency and operating life through the use of a bonding material comprising at least 75% busmuth together with an adherent metallic layer interposed between the boundary structure and correspondary thermoelectric semiconductor element.

Abstract: A lattice array of metal sheathed mineral insulated cables each cable having a coaxial conductor comprising alternate lengths of dissimilar thermo-electric material to provide thermo-electric junctions. The junctions are in two groups of opposite polarity and those of one group are disposed at the intersections of the cables while those of the other are disposed between intersections. Localized temperature increases create differentials between groups of sensors and can be located by the co-ordinates of the lattice array.

Abstract: A heat sensitive portion is cooled when a temperature of an object to be measured is higher than the standard temperature while a heat sensitive portion is heated when a temperature of an object to be measured is lower than the standard temperature by Peltier's effect owing to an electric current passing through a thermopile from the outside. Thus, the sensitivity of a thermopile can be improved with a device which is simple and has an inexpensive construction.

Abstract: A new and improved thermoelectric device and a method of manufacturing same takes advantage of the anisotropy of the materials employed to provide a substantially increased power output over prior art devices. The individual thermoelectric elements are pressed using techniques such as those employed in powdered metallurgy and electrically coupled such that a current path is established through the elements in a direction substantially perpendicular to the direction of pressing.The method and device of the present invention also achieve a substantially thinner device than was previously possible with no concomitant sacrifice in individual thermoelectric element integrity or increased resistance of the electrical connections between the individual thermoelectric elements. The individual thermoelectric elements are dimensioned such that each has a first dimension substantially greater than either its second or third dimensions.

Abstract: A new and improved thermoelectric device of the type which provides electrical energy in response to a temperature gradient applied across the device exhibits both structural integrity and improved efficiency. The new thermoelectric device includes a plurality of thermoelectric elements, coupling means on opposite respective sides of the thermoelectric elements for interconnecting the elements electrically in accordance with a predetermined pattern, and encapsulant means including an encapsulant material covering the exposed surfaces of the thermoelectric elements. The encapsulant forms void spaces between the elements for providing effective thermal insulation between the elements and confining substantially all of the heat flow from the temperature gradient to through the elements. The coupling means includes electrically conductive plate segments for electrically interconnecting the thermoelectric elements.

Abstract: A portable, battery operated noncontact temperature measuring device including a lens for collecting infrared radiation and a thermopile for producing a signal indicative of the intensity thereof. The thermopile signal is amplified, linearized and summed with an ambient temperature signal derived from a temperature responsive element, e.g. a diode chip mounted immediately adjacent a cold junction of the thermopile. The resulting composite temperature signal is then processed and displayed. The ambient temperature signal is also utilized to control the impedance of a dual field effect transistor, which in turn controls the gain of the amplifier. Thus, temperature induced variations in the responsivity of the thermopile are compensated by corresponding changes in the gain of the amplifier.

Abstract: A thermopile type detector which is constituted by an electrically insulating film, a thermopile supported on the film, a semiconductor substrate supporting the film, and a temperature sensing element on the surface of the substrate on which the film is supported and in the neighborhood of a cold junction of the thermopile. The temperature on the substrate immediately adjacent a cold junction of the thermopile can be measured for use in compensating the output of the thermopile for the changes in temperature of the cold junction. The temperature sensing element can be a semiconductor material such as a diode or a transistor forming a semiconductor with the substrate.

Abstract: A heat sensitive portion is cooled or heated by Peltier's effect owing to an electric current passing through a thermopile from the outside and simultaneously said electric current passing through the thermopile is controlled in dependence upon a circumferential temperature of the thermopile. A correct temperature compensation can be achieved in a simple and inexpensive construction. In addition, a thermopile can be improved in its sensitivity.

Abstract: A thermopile formed of conductor elements of dissimilar materials, the junctions of the dissimilar materials being much larger in cross-section than the normal cross-sectional area of the conductor elements, and junctions in one temperature zone being much larger than the corresponding junctions in the other temperature zone. If the thermopile is used to generate electricity, the heated junctions will be much larger in cross-section than the normal cross-sectional area of the conductor elements and they will also be much larger in cross-section than the junctions in the cooler zone. If the thermopile is to be used as a cooling device rather than an electric generating device and electricity is applied to the thermopile, then the cold junctions will be much larger in cross-section than the warm junctions and the cold junction cross-sectional area will also be much larger than the cross-sectional area of conductor elements of the thermopile.

Abstract: The disclosed thermoelectric converter element includes at least one member made of thermoelectric substance whose crystal structure is so controlled that its crystallographic axis is directed to a preferred orientation which is different from the direction of a thermoelectric current therethrough.

Abstract: A low-cost thermocouple utilizes a substrate of a first conductor, upon a surface of which is deposited on insulative layer, supporting a screen-printed conductive ink pattern. A second conductor is electrolessly plated upon the conductive ink pattern and onto at least a portion of the first conductor, through an aperture in the insulation layer therebetween. Thermocouple action occurs along the length of the plated conductor contact with the substrate conductor.