Abstract: Provided are a soldering flux or paste containing an organic substance which has at least two hydroxyl (--OH) groups in a molecule and of which the temperature at which the mass % becomes approximately 0% is not lower than approximately 170.degree. C. and not lower than the solid phase linear temperature of the solder, as measured by thermal gravimetry in which a flow rate of an air or nitrogen (N.sub.2) gas atmosphere is 200 ml/min and a rate of temperature rise is 10.degree. C./min, and a soldering method using the same. The soldering flux or paste of the present invention gives good wettability to a matrix to be bonded in a normal temperature profile and in a non-reductive atmosphere without leaving any residue.

Abstract: The present invention is a brazing composition for brazing a tube made of aluminum or aluminum alloy and a fin made of aluminum or aluminum alloy when manufacturing a heat exchanger such as evaporators, condensers, radiators, etc., comprising a powder of Al--Si--Zn alloy and binder, wherein the content of Zn in the powder of Al--Si--Zn alloy is in a range of 10 to 55 wt %.

Abstract: A resin-based VOC-free soldering flux consists of 40 to 50 wt % of a liquid epoxy resin, 25 to 30 wt % of a non-volatile liquid epoxy diluent, 20 to 33 wt % of a polyfunctional carboxylic acid, and 2.0 to 3.5 wt % of a thixotropic agent. There are no volatile organic solvents or compounds in the flux which can evaporate during the reflow process. The carboxylic acids are provided in powdered form and are suspended in the epoxy blend wherein they remain as solid particles until heated in the solder reflow process. A VOC-free solder paste formed from the flux consists of 40 to 95 wt % soldering particles, and 5 to 60 wt % of the VOC-free soldering flux. The thixotropic agent improves printability of the solder paste onto printed wiring boards. A VOC-free flux-core solder wire includes the VOC-free flux as the inner core of the wire with an outer shell of solder alloy.

Abstract: A flux cored wire for gas shielded arc welding with a mixed gas comprising argon and carbon dioxide which comprises:a seam-welded steel sheath; and a core filled in the steel sheath and comprising, all in weight percent:a slag and arc stabilizer comprising 4.0 to 6.0% TiO.sub.2, 0.2 to 0.8% SiO.sub.2, 0.4 to 0.8% ZrO.sub.2, 0.2 to 0.8% Al.sub.2 O.sub.3, 0.06 to 0.25% Na.sub.2 O+K.sub.2 O, and 0.1 to 0.4% metal fluoride;an alloying agent and metal deoxidizer comprising 0.03 to 0.06% C, 0.20 to 0.80% Si, 1.50 to 2.20% Mn, and 0.30 to 0.60% Mg; andnot less than 2% Fe;in which the difference between the percentages of iron or a combination of Na and K segregated in any two quartered cross section of the wire that are defined by equations (1) and (2) in the specification are not more than 10% and not more than 0.15%, respectively.

Abstract: According to the present invention, the oxidation of the surface of solder particles is inhibited and the generation of solder balls in the reflow soldering process is inhibited. More specifically, the present invention protects the surface of the solder particles from oxidation during all steps, including the storage of a solder powder, formation of a paste from the solder powder, printing, transferring to a reflow oven and reflow soldering, to minimize the oxidation of the solder particles at these steps so that the generation of solder balls is minimized. In addition, the present invention provides a method for making the solder powder and a solder paste using the solder powder. The objective of the present invention is achieved by the solder powder, the particles of which have on the surface thereof an organometallic compound composed of adipic acid and a metal of the solder alloy. This solder powder is produced by reacting particles of the solder alloy powder with vaporized adipic acid.

Abstract: Soldering paste obtained by mixing solder material with photosetting flux, which hardens by the irradiation of ultraviolet light, is used for reflow soldering. The photosetting flux contains flux base material, flux base material solvent, a photopolymerization initiator and photosetting prepolymer. The soldering paste obtained by mixing this photosetting flux is printed and bonded on the surface of soldered portion of a printed substrate, and is brought into tight contact with the pad portion of a lead of an electronic part to be soldered. The surface of soldering paste exposed is irradiated with ultraviolet light to cause the surface to gel. Thereafter, soldering is effected by means of preliminary heating and solder melting and heating(reflow heating). Since the surface of the soldering paste is thereby hardened by the irradiation of ultraviolet light, no sags occur during preliminary heating, thus making it possible to prevent any defective bridge caused by sags.

Abstract: The invention provides a soldering flux for mounting circuit substrates, which is free from any organic solvent attributable to air pollution and dispenses with any washing step. The soldering flux is obtained by dissolving a rosin modified by an unsaturated organic acid according to the Diels-Alder reaction in an aqueous solvent. A volatile basic agent may further be contained in the flux.

Abstract: A metal-core weld wire usable for gas shielded arc welding gapless joints on low carbon and low alloy galvanized and galvanealed steels. The metal-core weld wire includes a low carbon steel sheath surrounding a core composition. In one embodiment, the low carbon steel sheath includes, by total weight of the metal-core weld wire, between approximately 0.01-0.03% C, and the core composition includes, by total weight of the metal-core weld wire, between approximately 0.05-0.20% Ti, between approximately 0.05-1.00% Nb, Fe powder, and Mn to the extent that the metal-core weld wire includes between approximately 0.1-1.0% Mn wherein the metal-core weld wire includes between approximately 0.1-1.0% Si. The core composition is, by total weight of the metal-core weld wire, between approximately 0.001-12.0%. The metal-core weld wire provides, at weld rates up to 150 cm/min, reduced arc ionization potential and spatter, and improved arc stability and shielding.

Abstract: A polymer-based solder paste composition having the strength and corrosion resistance of joints produced by conventional solder technology and the environmental and processing advantages of ICA technology comprises a powdered solder metal with a single component (single package) polymerizable flux composition. The polymerizable flux composition includes 55%-65% by weight of an epoxy such as epoxy novolac, the diglycidyl ethers of bisphenol A and F, and mixtures thereof, 0-15% by weight of a dicarboxylic acid, 9%-11% by weight of a polyalcohol, 3%-5% by weight of an amine thermal curing agent, and the balance including a chelating agent, a defoamer, a thixotrope and a surfactant. Upon heating, the solder metal spontaneously segregates from the flux composition, fuses, and forms a metallurgical joint, while the single-component polymerizable flux composition encapsulates the fused metal in a polymer coating which remains firm but pliable at reflow temperatures.

Abstract: A mixture of a dye including one or more water soluble fluorescent dyes and a water soluble solder flux provides simple optical inspection under ultraviolet illumination with simple apparatus. The optical inspection is thus made highly sensitive to the presence of residual water soluble flux after washing and highly specific to the water soluble flux with which the dye is mixed. Thus, optical inspection can assure that all water soluble flux is removed to avoid subsequent corrosion while providing the possibility of leaving so-called "no clean" fluxes in place.

Abstract: The present invention is a brazing composition for brazing a tube made of aluminum or aluminum alloy and a fin made of aluminum or aluminum alloy when manufacturing a heat exchanger such as evaporators, condensers, radiators, etc., comprising a powder of Al-Si-Zn alloy and binder, wherein the content of Zn in the powder of Al-Si-Zn alloy is in a range of 10 to 55 wt %.

Abstract: A flux for soft soldering is disclosed. It comprises a chelating agent as an activator for facilitating a connection of a conductor metal to a soft solder by removing an oxide film naturally formed on the surface of the conductor metal, and for securing insulating reliability after soft soldering by forming complexes with copper and tin which are insulating substance, and a solvent capable of dissolving the chelating agent and further preferably evaporating at soldering process.

Abstract: Brazing fluxes comprising a combination of a fluoroaluminate complex and selected metal fluorosilicates, including their method of manufacture and use, are disclosed.

Abstract: A method of manufacturing a multiple layer circuit board with stacked vias of fine dimension and pitch. A base laminate with conductive pattern is coated with a dielectric which is photolithographically processed to create holes exposing selected regions of the underlying conductive pattern. The holes through the dielectric are plated to form via connections between the surface and the conductive pattern on the base laminate. The recess created by the via is filled with a conductive and plateable polymer which upon curing forms a conductive plug. A second dielectric layer is deposited on the board structure and in succession photolithographically processed to expose the underlying plated via and plug. The hole in the second dielectric is plated and filled with conductive polymer so as to create a second via vertically aligned with and electrically connected to the underlying first via.

Abstract: A method of brazing is described, the method comprising the steps of applying a layer of particles of an aluminum alloy filler material said particles having a coating of a flux-type material selected from the group comprising a compound of potassium fluoride and aluminum fluoride together, or other inorganic flux-type material, to at least one of said articles such that said particles are retained at or adjacent at least a part of the joint between said articles; heating to cause the flux-type material and said aluminum alloy filler material to melt and form a brazed joint.

Abstract: The present invention relates to a method of infusing coloration in solder to facilitate inspection of soldered portions in the production of electronic machinery, equipment and apparatus, and further, a method of forming a colored membrane on the surface of the soldered portions by employing colored solder materials. Physically and chemically stable colored powders composed of rare earth compounds or metallic fluoride compounds, having properties of specific gravity lighter than that of solder and further being indecomposable even at a temperature higher than that of the melting points of solders, are mixed into flux. After soldering by employing solder cream containing the mixture, a colored membrane or layer may be formed on the surface of soldered portions by deposition of the colored powder compounds.

Abstract: Solder pastes presently harden or congeal over time. This results in wasted solder paste and in production down time. This hardening is a result of the long polymer chains created by the dicarboxylic acid in the activator and the indium (In) or tin (Sn). A solder paste is described in which the metal alloy is coated by an agent that inhibits the reaction with the dicarboxylic acid. One solution involves coating the metal alloy powder with monocarboxylic acids, which truncate the polymer chain. Another manner for truncating the polymer is to coat the metal alloy powder with complexing agents. The metal alloy powder can also be coated by a stable metal such as lead (Pb), gold (Au), silver (Ag), bismuth (Bi), palladium (pd), platinum (Pt), a silver palladium alloy (AgPd) or a silver platinum alloy (AgPt).

Abstract: The present invention relates to a method of infusing coloration in solder to facilitate inspection of soldered portions in the production of electronic machinery, equipment and apparatus, and further, a method of forming a colored membrane on the surface of the soldered portions by employing colored solder materials.Physically and chemically stable colored powders composed of rare earth compounds or metallic fluoride compounds, having properties of specific gravity lighter than that of solder and further being indecomposable even at a temperature higher than that of the melting points of solders, are mixed into flux. After soldering by employing solder cream containing the mixture, a colored membrane or layer may be formed on the surface of soldered portions by deposition of the colored powder compounds.

Abstract: Machinable lead free brasses for potable water applications are provided wherein a combination of bismuth and selenium are substituted in the alloy for lead and the bismuth and selenium are added to the alloy in the form of an additive product comprising bismuth selenide. A method of making the brasses which meets environmental and safety regulations is also provided. The bismuth selenide is preferably made by sintering particles of bismuth and selenium in a Bi/Se weight ratio of about 1.8 or greater and fusing the sinter.

Abstract: The invention provides a solder-precipitating composition containing Sn-Pb alloy powder and an organic acid salt of Pb as essential components, and capable of precipitating solder as a result of substitution between Sn contained in the Sn-Pb alloy powder and Pb contained in the organic acid salt of Pb. Further, the invention provides a mounting method including the steps of supplying a conductor on a board with a solder-precipitating composition which contains Sn-Pb alloy powder and an organic acid salt of Pb as essential components, heating the solder-precipitating composition supplied on the conductor, to precipitate solder on the conductor and pre-coat the conductor with solder, as a result of substitution reaction between Sn in the Sn-Pb alloy powder and Pb ions in the organic acid salt of Pb, mounting a device on the solder pre-coated conductor, and melting the solder layer to securely mount the device on the conductor.

Abstract: A corrosion inhibiting primer for metal pieces which need not be removed prior to welding the pieces includes an alkali metal silicate binder having a silicone wetting agent incorporated therewith, a powder metal and an oxygen scavenger. The primer can be sprayed onto the metal. Zero porosity welds can be achieved up to speeds of about 750 mms/sec. by welding through the primer.

Abstract: A solder paste is made from solder powder having two different alloys. The individual particles in the solder powder consist of a low melting solder coating (115) that surrounds a nucleus (120) of a higher melting solder. The low melting solder is compositionally distinct from the higher melting solder. The particles are suspended in a matrix of a solder paste vehicle, which may also contain a fluxing agent. In one embodiment of the invention, the low melting solder is an alloy of 43% tin, 43% lead and 14% bismuth, and the higher melting solder is an alloy of 52% tin, and 48% bismuth.

Abstract: A rosin-free, low VOC, no-clean soldering flux consists essentially of one or more halide-free carboxylic acid activators in an aggregate amount not exceeding about 8% by weight of the flux; one or more alkyl amines capable of forming amine salt of the one or more activators and in an aggregate amount not exceeding about 10% by weight of the flux; and water, with or without a surfactant. The flux is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary.

Abstract: A method for making a lamination insulated by iron-manganese phosphate comprises the following operations:1. The lamination is treated with an acid or basic medium to eliminate the surface layer of the lamination that contains excess silicon and aluminum.2. The lamination is rinsed.3. The lamination is brought into contact with a solution of phosphoric acid containing iron phosphate and manganese phosphate for sufficient time to obtain an insulative layer of the required thickness.

Abstract: A method of solder-coating a metallic pad provided on a substrate, whereby at least the surface of the pad is provided with a deposit of solder paste, which paste comprises a suspension of metallic solder particles which, when molten, have a surface energy lower than the critical surface energy of the metallic pad but higher than the critical surface energy of the substrate surface outside the borders of the pad, whereby application of heat causes metallic solder particles within the paste lying upon the pad to melt and fuse together into an essentially continuous metallic solder layer, whereas the metallic solder particles within any paste lying upon the substrate surface outside the borders of the pad do not thus fuse together into a layer but are instead deposited as mutually-isolated solder beads, which beads can be subsequently removed from the substrate surface after completion of the heating process.

Abstract: A brazing agent consists essentially of a compacted powder mixture of an aluminum-silicon alloy and a flux, the agent having an apparent density of 90% or more of a theoretical density. Si is contained at about 3-15% by weight of all the elements other than the flux, so that the ratio in weight of all the elements to the flux is from 99.9:0.1 to 70:30. The brazing agent may further contain one or more elements selected from a group consisting of zinc, tin and indium, at about 0.1-5%, 0.01-0.5% and 0.01-0.5% by weight of all the elements other than the flux, respectively. A brazing sheet may be of such a structure that a core sheet made of aluminum or its alloy has at least one surface clad with a skin layer which has a thickness of 10 .mu.m or more for each surface.

Abstract: A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.

Abstract: Low residue water-based soldering flux, and process and system for using the same. The flux includes a mixture of succinic, glutaric and adipic acid in water, and optionally a wetting agent. The flux is applied to a surface to be soldered. The flux is dried. The surface is soldered. The flux is applied at an application station, dried at a drying station and soldered at a soldering station.

Abstract: In a method of hot brazing aluminum articles, the steps of: interposing an amount of a flux-containing brazing agent (12) between portions of aluminum articles (11, 11) which are to be adjoined one to another; gripping the portions with a pair of heaters (13); and then activating the heater so that heat conducted therefrom melts the brazing agent (12) to braze the aluminum articles (11), are carried out in this order. The brazing agent (12) is a compacted agent composed of a matrix powder and a flux powder, at a ratio in weight of 99.9:0.1 to 70:30, and the agent has a density corresponding to 90% or more of a theoretical value.

Abstract: A flux formulation for use in the assembly of electronic circuit boards having components to be joined by soldering. The formulation comprises a medium which acts as a carrier and solvent for the fluxing agent, which includes in a preferred embodiment supercritical carbon dioxide. The formulation also includes a fluxing agent, being at least partially soluble in the supercritical carbon dioxide which serves to transport the fluxing agent before deposition thereof upon a soldering site. The supercritical fluid is delivered through a nozzle to the circuit board, the supercritical condition being maintained until the supercritical fluid is discharged from the nozzle. The fluxing agent at least partially loses its solubility in the fluid thereupon and is transported to the board by a stream of carbon dioxide gas. Also disclosed is a method for delivering a flux formulation to the electronic circuit board.

Abstract: Flux for soldering comprising inorganic ion-exchanger and activator containing halogen atom, solder composition the flux and solder particles, soldering method comprising coating the solder composition on a portion for soldering, soldering method comprising coating flux containing activator on a portion for soldering, applying inorganic ion-exchanger to the portion and applying solder to the portion, and soldering method comprising mixing inorganic ion-exchanger with creamy solder to give mixture, coating the mixture on a circuit pattern of a wiring plate and heating the wiring plate. The flux for soldering and the soldering composition are excellent in metal ion-migration resistance, corrosion resistance, soldering property and storage stability, and can be preferably used without cleaning and the soldering methods can be preferably used in practical no-clean soldering methods.

Abstract: A braze filler metal alloy paste containing braze metal alloy powders, such as a nickel- or cobalt-based braze filler metal, homogeneously dispersed throughout an aqueous gel solution comprising a binder such as a cellulose material, for example, sodium carboxymethyl-cellulose and a dispersants such as mineral oil and glycerine.

Abstract: A no-VOC or low-VOC no-clean flux formulation for use in the assembly of electronic circuit boards having a conformal coating. The formulation comprises a solvent, a water-soluble weak organic acid, a halide-free, non-ionic surfactant, and a biocidal co-solvent. The formulation is compatible with the conformal coating, permits no or low VOC emissions into the environment, and eliminates post-soldering cleaning steps.

Abstract: A repair coating for superalloy articles, such as gas turbine engine components, includes a volatile organic carrier or water-based carrier, a fluxing agent, a thickening agent, balance a filler mix. The filler mix consists of at least two distinct particulate components. The mix includes a first particulate component having a composition which approximates that of the article being repaired. The mix also includes a second particulate component having a composition approximating that of the article and a melting point depressant, such as boron. This melting point depressant is substantially in excess of that in the article and sufficient to provide melting of a portion of the mix at a processing temperature below the melting temperature of the article. The above filler mix is blended with the other constituents to form the repair coating which is applied to an article.

Abstract: A soldering composition consisting essentially of an alloy comprising tin, indium, antimony, silver and in the range of 0.0% to about 10.5% by weight bismuth.

Abstract: A solder suspension is disclosed of solder powder, organic binder, organic solvent, and, if necessary, flux, with which it is possible to apply solder layers without cracks and pores to substrates by means of immersion or spraying. The solder powder must have a particle size of 5 to 50 .mu.m, where 55 to 70% of the particles are smaller than the particle size at the maximum on the particle size distribution curve. In addition, the ratio between the average particle size of the solder powder and the density of the solder powder must be between 0.1 and 20.

Abstract: A wear-resistant layer on a component which is exposed to a high wear loading has a material mixture comprising at least one metallic material in powder form and a non-metallic oxide-dissolving fluxing agent in powder form which by the addition of a resin-like non-corroding stable binding agent is converted into a form which is applied to the component by being spread or laid thereon, and fused.

Abstract: A surface treatment material for a metallic base of an artificial tooth is made of brazing filler metal which melts at a relatively lower temperature than melting points of components of the metallic base and which comprises fine powder of non-ferrous metal which boils at a brazing temperature and fine powder of non-ferrous metal which does not boil at the same temperature. By using the surface treatment material, a bonding strength between a facing portion of the metallic base and a formed material made of hard resin can be improved.

Abstract: A soldering flux comprising a bis (2-oxazoline) compound, a dithiol compound, an organic carboxylic acid compound and an activator which does not require post-soldering cleaning and, yet, does not cause corrosion of the base metal or deterioration of electrical characteristics and helps to clear the statutory regulations on the use of chlorofluorohydrocarbons.A soldering flux comprising, in addition to the above components, an organic solvent, a thermoplastic resin or/and an epoxy group-containing compound.

Abstract: Spherical solder drops having precise and accurate shape are formed by an ejection device and solidified to form solder balls for making solder pastes. The diameters of the solidified solder balls are determined by an excitation signal applied to the ejection device and changes in the diameter of the orifice in the ejection device. A solder paste is produced by mixing solidified solder balls of a single diameter or a combination of several different diameters with a carrier.

Abstract: A solder paste of the type utilized in forming a solder onnectin for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.

Abstract: A soldering flux composition includes an aqueous solution containing as component (A) a compound selected from (i) hydrohalides and hydrophosphates of guanidine and substituted guanidines, (ii) hydrohalides and hydrophosphates of a five-membered nitrogen containing heterocyclic amine of the formulaC.sub.x N.sub.y H.sub.3in which x is 1 or 2 and y is 4 or 5, and mixtures of (i) and (ii) and as component (B) at least one compound selected from hydrohalides and hydrophosphates of aliphatic amines selected from aliphatic monoamines of formula CH.sub.3 (CH.sub.2).sub.n NR.sub.2 and aliphatic diamines of formula R.sub.2 N(CH.sub.2).sub.m NR.sub.2 in which n is 0 to 10, m is 5 to 10 and R is hydrogen, methyl, ethyl, propyl or butyl, the components (A) and (B) being present in the relative proportions of 25 to 100% by weight of (A) and 75 to 0% of (B).

Abstract: A solder paste is composed of a vehicle (or flux) system and a mixture of at least two solder powders. One component of this mixture is a eutectic or near-eutectic Sn/Pb alloy powder, while the other component comprises powders selected from at least one elemental metal powder or at least one solder alloy powder or at least one elemental metal powder and at least one solder alloy powder. Said other component is a powder or combination of powders each of which has a liquidus temperature which is lower by at least 5 degrees Centigrade (.degree.C.) than the solidus temperature of said eutectic or near-eutectic Sn/Pb alloy powder or a solidus temperature which is higher by at least 5.degree. C. than the liquidus temperature of said eutectic or near-eutectic Sn/Pb alloy powder. The eutectic or near-eutectic Sn/Pb powder makes up from 5 to 95 weight percent of the total powder mixture. Alternatively, not all powders which comprise the second component need to obey this rule so long as at least 30% by wt.

Abstract: Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Depending upon the intended end use, the compositions comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; and a reactive monomer or polymer. The compositions are useful as improved conductive adhesives, such as for attaching electrical components to electrical circuits: the compositions comprising metal powder are ideally suited for creating the conductive paths on printed circuits. The compositions for forming conductive paths may first be applied to a substrate in the desired pattern of an electrical circuit, and then heated to cure it.

Abstract: Soldering flux and solder paste compositions which are non-acidic, low-residue, and non-corrosive, leaving no substantial residue after soldering without a subsequent cleaning process and yet exhibiting excellent solderability are disclosed. The compositions comprise (A) at least one compound which generates a peroxide by decomposition or oxidation when subjected to heating, and (B) at least one ester from an inorganic or organic acid which generates an acid by decomposition in the presence of compound (A). They are particularly advantageous for eliminating the cleaning process with a solvent such as Flon to solve the ozone layer destruction problem and for improving the performance of the in-circuit test for printed-circuit boards after soldering.

Abstract: A no-clean, low-residue, rosin-free foam flux solution is described which comprises a cosolvent system free of volatile organic compound solvents which is comprised of (i) at least about 90% by weight demineralized water based on total weight of the flux solution and (ii) from about 1% by weight to about 5% by weight based on total weight of the flux solution of a non-volatile organic solvent forming a cosolvent with said demineralized water, said nonvolatile organic solvent having a boiling point above about 190.degree. C. and a vapor pressure below 0.1 millimeters Hg at 25.degree. C.; a fluxing agent present in an amount from about 1% to about 4% by weight based on total weight of the soldering flux, said fluxing agent comprising at least two carboxylic acids selected from the group consisting of C.sub.2 -C.sub.

Abstract: A brazing agent comprises an aluminum alloy which contains a flux, the agent having an apparent density of 90% or more of a theoretical density, the aluminum alloy comprises in addition to the flux: aluminum element; and silicon element at about 3-15% by weight of all the elements other than the flux, so that the ratio in weight of all the elements to the flux is from 99.9:0.1 to 70:30. The aluminum alloy may further contain one or more elements selected from a group consisting of zinc, tin and indium, at about 0.1-5%, 0.01-0.5% and 0.01-0.5% by weight of all the elements, respectively. A brazing sheet may be of such a structure that a core sheet made of aluminum or its alloy has at least one surface clad with a skin layer which has a thickness of 10 .mu.m or more for each surface.

Abstract: Solder powders coated with a thin layer of parylene and solder pastes containing the coated solder powders are disclosed. The coated solder powders can exhibit a high degree of resistance to oxidation and to reaction with the flux contained in the solder paste without substantially interfering with the reflow characteristics of the solder.

Abstract: A solder paste composition containing (a) 4-96% by weight finely divided particles of eutectic or pseudo-eutectic metal alloy or mixtures; (b) 96-4% by weight finely divided particles of a metal additive consisting of pure metal, mixtures or alloys thereof having a melting point of at least 30.degree. C. greater than the metal alloy in (a); and (c) an organic medium. The paste is particularly useful for surface mounting metallized components to metallized substrates in microelectronic packaging.

Abstract: The invention provides a welding material for welding iron containing low CTE alloys. The filler metal contains 25-55% nickel, 0-30% cobalt, 0.05-0.5% carbon, 0.25-5% niobium and balance iron with incidental impurities. The welding material also is operable with fluxes for submerged arc welding. In addition, the welding material may be configured to function as a flux coated or flux-cored electrode.