Abstract: In examples, a wafer chip scale package (WCSP) comprises a semiconductor die including a device side having circuitry formed therein. The WCSP includes a redistribution layer (RDL) including an insulation layer abutting the device side and a metal trace coupled to the device side and abutting the insulation layer. The WCSP includes a conductive member coupled to the metal trace, the conductive member in a first vertical plane that is positioned no farther than a quarter of a horizontal width of the semiconductor die from a vertical axis extending through a center of the semiconductor die. The WCSP includes a lead coupled to the conductive member and extending horizontally past a second vertical plane defined by a perimeter of the semiconductor die.

Abstract: A steel sheet has a specific chemical composition and has a structure represented by, by area ratio, ferrite: 5 to 60%, and bainite: 40 to 95%. When a region that is surrounded by a grain boundary having a misorientation of 15° or more and has a circle-equivalent diameter of 0.3 ?m or more is defined as a crystal grain, the proportion of crystal grains each having an intragranular misorientation of 5 to 14° to all crystal grains is 20 to 100% by area ratio. A precipitate density of Ti(C,N) and Nb(C,N) each having a circle-equivalent diameter of 10 nm or less is 1010 precipitates/mm3 or more. A ratio (Hvs/Hvc) of a hardness at 20 ?m in depth from a surface (Hvs) to a hardness of the center of a sheet thickness (Hvc) is 0.85 or more.

Abstract: A pipe is manufactured through injecting a chloride ion-containing aqueous solution into a copper pipe to fill the copper pipe, thereby forming a copper oxide film on an inner surface of the copper pipe.

Abstract: Compositions, methods, and kits for treating a surface of an object made of copper or a copper alloy to produce a patina thereon. One composition includes a mild acid solution and a powdered salt in a concentration of up to about one pound per gallon of mild acid solution. One method includes treating a surface of an object made of copper or a copper alloy by applying a patina composition to the surface, the patina composition comprising a mild acid solution and a powdered salt in a concentration of up to about one pound per gallon of mild acid solution, allowing the patina composition to remain in contact with the surface for a predetermined amount of time sufficient to permit the patina composition to chemically react with the copper or copper alloy surface to produce patina, and applying water to the surface to remove residual patina composition from the surface.

Abstract: An engine is configured to extract energy from a heat source as follows. A shaft is adapted to be rotatably coupled to a support and rotatable in a first direction. A plurality of vessels is coupled to and arranged about the shaft. At least a first vessel of the plurality of vessels includes a thermally insulative portion and a thermally conductive portion. A plurality of conduits connects the plurality of vessels together. Each of the plurality of vessels is in communication with at least one other of the plurality of vessels via at least one of the conduits. The plurality of vessels is arranged to allow the thermally conductive portion of the first vessel to encounter the heat source. The thermally conductive portion is capable of transferring heat to at least partially vaporize volatile fluid within the first vessel to cause a mass to at least partially move towards a connected vessel located above the first vessel.

Abstract: The invention relates to a method for obtaining a surface of a titanium-based metal implant intended to be inserted into bone tissue, comprising: (a) projecting particles of aluminum oxide under pressure on the external area of the implant; (b) chemically treating the sandblasted external area of the implant with an acid composition comprising sulfuric acid and hydrofluoric acid; and (c) thermally treating the sandblasted external area of the implant by heating at a temperature of 200-450° C. for 15-120 min. The invention likewise defines a metal implant having said surface. The surface thus obtained has good micrometer-scale roughness with a suitable morphology, as well as a composition which is virtually free of impurities and a thickness which is approximately three times the thickness of conventional surfaces, which characteristics provide it with very good osseointegration properties.

Abstract: An organic solderability preservative solution includes pyrazine derivatives which inhibit corrosion of metal. The solution is applied to metal surfaces of components for electronic apparatus to improve solderability of electrical connections between the components in the electronic apparatus.

Abstract: A system for passivating a plurality of hollow copper strands in a stator water cooling system including; a first storage tank containing a cleaning solution, a second storage tank containing rinsing water; a third storage tank containing a passivation solution; a plurality of conduits connecting the first, second, and third storage tanks in a closed loop with the plurality of hollow copper strands; and an alkaline pump for pumping the cleaning solution, the rinsing water, and the passivation solution through the closed loop.

Abstract: The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I).

Abstract: A nanostructure on Cu comprising a plurality of Cu(OH)2 nanofibers wherein the nanofibers are formed by treating the Cu surface with ammonia solution to produce a layer of malachite on the Cu surface and treating the malachite coated Cu with NaOH aqueous solution to convert the malachite layer on the Cu surface into Cu(OH)2 nanofibers. The nanostructure may be formed on a Cu thin film. The thin film may be a layer of a laminated lithium ion battery.

Abstract: A method of forming an implant to be implanted into living bone is disclosed. The method comprises the act of roughening at least a portion of the implant surface to produce a microscale roughened surface. The method further comprises the act of immersing the microscale roughened surface into a solution including potassium hydroxide to produce a nanoscale roughened surface consisting of a web-like structure superimposed on the microscale roughened surface. The nanoscale roughened surface has a property that promotes osseointegration.

Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.

Abstract: This invention introduces a method for treating a surface of an electrically conductive object with a refractory metal. In one embodiment, the refractory metal is tantalum and the object is a titanium substrate. A surface layer of mixed tantalum and titanium oxides is created by first heating the object and tantalum chloride in a reaction chamber and subsequently heat treating the object in an oxygen containing environment. The electrically conductive object can in a non-limiting way be DSA solutions (Dimensionally Stable Anodes), fuel cells or connector plates.

Abstract: The present invention relates to a method for preparing an artificial patination material to substrates, preferably made from copper or copper alloys and a patination material. The raw material is a copper salt, which reacts with an alkali metal hydroxide. The precipitate is dispersed with powerful mixing and an addition of a dispersing agent. An oxidative agent like manganese dioxide is used, and carbon is used as an agent for catalyzing natural patina forming. Metal compounds are used to achieving desired color and/or color tinge. The invention relates also to the corresponding patination material.

Abstract: A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.

Abstract: A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.

Abstract: A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.

Abstract: This high-strength steel sheet includes: in terms of percent by mass, 0.03 to 0.10% of C; 0.01 to 1.5% of Si; 1.0 to 2.5% of Mn; 0.1% or less of P; 0.02% or less of S; 0.01 to 1.2% of Al; 0.06 to 0.15% of Ti; and 0.01% or less of N; and contains as the balance, iron and inevitable impurities, wherein a tensile strength is in a range of 590 MPa or more, and a ratio between the tensile strength and a yield strength is in a range of 0.80 or more, a microstructure includes bainite at an area ratio of 40% or more and the balance being either one or both of ferrite and martensite, a density of Ti(C,N) precipitates having sizes of 10 nm or smaller is in a range of 1010 precipitates/mm3 or more, and a ratio (Hvs/Hvc) of a hardness (Hvs) at a depth of 10 ?m from a surface to a hardness (Hvc) at a center of a sheet thickness is in a range of 0.85 or more.

Abstract: Metallic medical supplies include a metallic material as a base material, and a film having micro pores and/or micro unevenness on a surface of the base material, wherein the micro pores and/or micro unevennesses are impregnated with iodine or iodine compounds.

Abstract: There are provided a ferrite stainless steel for a polymer fuel cell separator having excellent corrosion resistance and interfacial contact resistance under an operating environment of a polymer fuel cell, and a preparation method of the stainless steel. A stainless steel includes C: 0.02 wt % or less, N: 0.02 wt % or less, Si: 0.4 wt % or less, Mn: 0.2 wt % or less, P: 0.04 wt % or less, S: 0.02 wt % or less, Cr: 25.0 to 32.0 wt %, Cu: 0 to 2.0 wt %, Ni: 0.8 wt % or less, Ti: 0.5 wt % or less, Nb: 0.5 wt % or less, waste Fe and inevitably contained elements. A preparation method of the stainless steel having a second passive film formed on a surface thereof includes forming a first passive film on the surface of the stainless steel by bright-annealing or annealing-pickling the stainless steel; removing the first passive film by pickling the stainless steel in a 10 to 20 wt % sulfuric acid solution at a temperature of 50 to 75° C.

Abstract: An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 ?m on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.

Abstract: The invention relates to a method for obtaining a surface of a titanium-based metal implant intended to be inserted into bone tissue, comprising: (a) projecting particles of aluminium oxide under pressure on the external area of the implant; (b) chemically treating the sandblasted external area of the implant with an acid composition comprising sulfuric acid and hydrofluoric acid; and (c) thermally treating the sandblasted external area of the implant by heating at a temperature of 200-450° C. for 15-120 min. The invention likewise defines a metal implant having said surface. The surface thus obtained has good micrometer-scale roughness with a suitable morphology, as well as a composition which is virtually free of impurities and a thickness which is approximately three times the thickness of conventional surfaces, which characteristics provide it with very good osseointegration properties.

Abstract: A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1): wherein R1 is hydrogen or methyl, and either R2 and R3 represent chlorine and R4 and R5 represent hydrogen, or R2 and R3 represent hydrogen and R4 and R5 represent chlorine.

Abstract: The present invention relates generally to a process and chemical composition for the removal of adherent niobium-rich second-phase particles (SPPs) from pickled niobium-containing zirconium alloys which includes applying to the alloy surface a chemical composition comprising alkaline hydrogen peroxide; an alkali metal meta-silicate; and a magnesium salt.

Abstract: A process for increasing the adhesion between a copper or copper alloy surface and a polymeric material is disclosed. The process comprises treating the copper or copper alloy surface with an aqueous solution of cupric ions at a pH from 2.8 to 4.2 to form an oxide conversion coating on the copper or copper alloy surface. The so treated surface can then be bonded to the polymeric material.

Abstract: A metal material whose surface is modified by bonding of aromatic groups, optionally substituted by functional groups.

Abstract: An aqueous solution for depositing an inorganic corrosion resistant coating on a metal substrate is disclosed. The aqueous solution comprises a film-forming agent, a supplemental anion, and a substrate activator. The film-forming agent is a vanadate salt that forms the corrosion resistant coating. The supplemental anion accelerates the rate at which the corrosion resistant coating is formed. The substrate activator serves to remove any existing oxides from the metal substrate prior to the formation of the corrosion resistant coating. The present invention additionally covers objects so coated and methods of application.

Abstract: A composition for treating the surface of a ferrous metal. The composition comprises aluminum sulfate, boric acid or a boric acid precursor, and polycarboxylic acid or salt thereof. Treatment of the ferrous metal with an aqueous solution of the composition at elevated temperature and low pH provides a coating that imparts lubricity to the metal, thereby facilitating metalworking processes such as drawing for wire production.

Abstract: A method, a composition and a method for making the composition for anodizing metal surfaces, especially magnesium surfaces is disclosed. The composition is a basic aqueous solution including hydroxylamine, phosphate anions and nonionic surfactants. A complementary method, composition and method for making the composition for rendering an anodized metal surface, especially a magnesium surface, conductive is disclosed. The composition is a basic aqueous solution including bivalent nickel, pyrophosphate anions, sodium hypophosphite and either ammonium thiocyanate or lead nitrate.

Abstract: The diamter of &bgr;-titanium alloy wire is reduced by cold wire-drawing and the &bgr;-titanium alloy wire is subjected to heat treatment. The heat treatment comprises the first aging process for precipitation strengthening and the second aging process for removing processing strain. &bgr;-titanium alloy wire is heat-treated under the supply of tension at the second aging process.

Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).

Abstract: It is an object of the present invention to provide a processing method for preventing elution of lead in a lead-containing copper alloy to prevent lead from eluting from a faucet metal, etc. made of a lead-containing copper alloy, and a drinking water service fitting made of a lead-containing copper alloy in which elution of lead has been prevented. By forming a chromate film on the surface of a lead-containing copper alloy material, it is possible to reduce elution of the lead left in a limited amount on the surface. A drinking water service fitting made of a lead-containing copper alloy is immersed in an alkaline etching solution in a pre-processing step for a nickel chromium plating step to selectively remove lead on the surface of the lead-containing copper alloy material and is then activated in a solution such as sulfuric acid and hydrochloric acid.

Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).

Abstract: The invention features and methods and compositions for oxide production on a Copper substrate, e.g., a Copper or Copper alloy substrate, to provide for improved adhesion of Copper substrate to polymeric material, e.g., such as used in manufacture of printed circuit boards. The oxide-producing compositions of the invention, which may be either acidic or ammoniacal, comprise 1) a source of Cu++ (Cupric) ions; 2) a source of a primary electrolyte that is non-interactive with Copper ions; 3) a Cuprous ligand, e.g., a halide ion, preferably chloride, which also serves as a secondary electrolyte; and 4) an optional organic. Acidic oxide-producing compositions comprise a strong acid as the primary electrolyte. The primary electrolyte of ammoniacal oxide-producing compositions is a non-interactive, ammonium salt of acid, which provides a highly soluble Cupric ammonium salt. The secondary electrolyte of the oxide-producing compositions is selected so as to be compatible with the primary electrolyte.

Abstract: A process and apparatus prepares and collects metal nanoparticles by forming a vapor of a metal that is solid at room temperature, the vapor of the metal being provided in an inert gaseous carrying medium. At least some of the metal is solidified within the gaseous stream. The gaseous stream and metal material is moved in a gaseous carrying environment into or through a dry mechanical pumping system. While the particles are within the dry mechanical pumping system or after the nanoparticles have moved through the dry pumping system, the vaporized metal material and nanoparticles are contacted with an inert liquid collecting medium.

Abstract: A method of modifying a surface is disclosed. The method includes contacting the surface with a hydridosilane under conditions and for a time sufficient to form a covalent bond between a silicon atom of the hydridosilane and the oxygen atom of a hydroxyl group on the surface. The hydridosilane has the formula where at least one of Ra, Rb, Rc, and Rd is H, and at least one of Ra, Rb, Rc, and Rd is not H.

Abstract: A method is provided for the selective deposition of an organic solderability preservative (OSP) coating on copper surfaces of articles such as electronic components, e.g., printed wiring boards, to serve as a protective coating and preserve the solderability of the copper surface while substantially excluding gold surfaces from attracting the same OSP coating which coating causes cosmetic defects in the form of staining and may reduce the conductivity of the gold contact surface. The method improves the conventional OSP process and utilizes a pre-treatment of the copper surface before applying the OSP coating comprising treating the cleaned and preferably micro-etched copper with an aqueous solution of benzimidazole or derivative thereof to form a precoat on the copper surface. After the pre-treatment step, the precoated copper surface is conventionally treated with a suitable OSP solution such as an aqueous solution of a substituted benzimidazole compound, preferably at the 2-position.

Abstract: From the time that they are immersed into a marine environment, bronze propellers are prone to attack by marine organisms, such as barnacles, coral and algae, which attach themselves to the bronze metallic surface, creating lumps on the propeller, which adversely affect its balance and cause impedance and vibration of the propeller and its boat in the water. Anti-fouling paints are either too toxic for the marine environment or lack smoothness on the surface. These problems have been overcome by polishing the propeller to prepare it for electroplating, cleansing to remove dirt and grease, electroplating with copper, followed by spraying with a standard solution (5%) of sodium hypochlorite and sodium chloride and allowing sufficient time for a reaction of the hypochlorite solution with the copper to form a firmly adhering conversion coating of basic cupric chloride. The coating is blue-green in color.

Abstract: An article is protected with a wear-resistant coating. The wear-coated article is thereafter treated to produce a chemical conversion coating on any portions of the surface of the article accessible through micropores in the wear-resistant coating. For steel articles, the wear-resistant coating is preferably a titanium nitride-based intermetallic compound such as TiN, Ti2N, (TiAl)N, Ti(CN), (TiAl)(CN), ZrN, and CrN, and the chemical conversion coating is preferably a phosphate-based compound.

Abstract: An antifouling member comprising a highly corrosion-resistant metal comprising titanium, zirconium, tantalum, niobium, or an alloy based on any of these metals and, deposited thereon, a coating layer of silver or a silver alloy so as to have a bonding strength as high as at least 0.2 MPa. The member can be prevented from marine organisms attaching thereto.

Abstract: There are provided a treatment solution for reducing a copper oxide formed on the surface of copper to copper, wherein dimethylamine borane is contained in an amount of 0.3 to 2.0 g/L and the relationship y≧0.232x−0.185 holds between the concentration y (g/L) of dimethylamine borane and an area x (dm2/L) to be treated per unit solution amount, and a treatment method for reducing a copper oxide formed on the surface of a copper material to copper by dipping the copper material in the treatment solution as described above, wherein the addition of dimethylamine borane to water is carried out within 10 minutes before the dipping of the copper material or after the dipping of the copper material.

Abstract: A composition and process are described which are useful in treating metal surfaces, which composition comprises an oxidizer, an acid, a corrosion inhibitor, an organic nitro compound and, optionally, a benzotriazole with an electron withdrawing group in the 1-position which electron withdrawing group is a stronger electron withdrawer than a hydrogen group, optionally, a source of adhesion enhancing species selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing and optionally but preferably a source of halide ions. The composition and process are useful in increasing the adhesion of metal surfaces to polymeric substances and in preserving said adhesion through temperature variation.

Abstract: The invention relates to a process, and compositions for its implementation, to promote adhesion between an inorganic substrate and an organic polymer, especially between the copper surfaces of printed circuits for electronic use and a polymer resin, in which an organometallic layer of a dark brown colour, which is very uniform and compact, is deposited on the inorganic substrate by means of treatment in a composition which comprises: a) a silane or a mixture of functional organic silanes with a structure represented by the following general formula: Y—(CH2)n—Si(OR)3 where: Y represents a functional organic group, n is a number which has a value between 0 and 3, and R represents a hydrogen atom or any easily hydrolysable group which is capable of releasing an atom of hydrogen b) an azole compound; c) an oxygen carrier; d) an organic or inorganic acid; and preferably e) a zinc compound.

Abstract: Disclosed are methods for replenishing adhesion promoting baths from an unstable state without discarding the bath. Methods of adhesion promoting substrates, such as printed wiring boards, using the replenished baths are also disclosed.

Abstract: An improvement in a method of bonding copper and a resin together wherein a copper oxide layer is formed on the surface of copper by the oxidation of metallic copper, the copper oxide layer is reduced to metallic copper with an aqueous reducing solution containing at least one amine borane represented by the general formula: BH3NHRR′ (wherein R and R′ are each a member selected from the group consisting of H, CH3, and CH2CH3), and the metallic copper is bonded to a resin. According to the improvement, a reducing stabilizer is added to the reducing solution in an amount sufficient to decrease consumption of the amine borane during reduction to a level less than that consumed in the absence of the reducing stabilizer during the course of the copper oxide reduction process, wherein the stabilized reduction process is initiated in a reasonable time and the metallic copper layer resulting from the stabilized reduction process is resistant to acid attack.

Abstract: A method of artificially forming patina on a copper product surface comprising the steps of blowing granular sodium hydrogen carbonate powder onto the copper product surface to clean and roughen it; wetting the surface with water; and depositing granular sodium hydrogen carbonate powder onto the wet copper surface; thereby forming patina on the copper surface. The step of wetting the copper surface and the step of depositing granular sodium hydrogen carbonate powder onto the wet copper surface are preferably repeated several times. The copper surface is preferably covered with porous sheets during or after the above steps.

Abstract: This invention provides for metal surfaces which when derivatized with &agr;-&ohgr; bis-functionalized substantially linear aliphatic, including fluoroaliphatic acids and metal salts thereof exhibit changes in surface properties. In particular, composites formed from polymers and metallic surfaces derivatized according to a process of the present invention exhibit surprising durability.

Abstract: An insoluble anode for sulfate electrolytes composed of, generally, from 1 to 99 wt % titanium or titanium alloy and the remainder lead or lead alloy, comprising a titanium-lead active layer, or a titanium-lead active layer covering and a core being made from titanium or lead. The anode is produced by infiltration of porous titanium with lead, either by consolidation of the mixture of titanium and lead powders. The anode formed of the active layer, or of the active layer covering and a sheet core is fabricated in the shape of a plate. The anode formed of the active layer covering and a rod or tube core is fabricated in the shape of a lattice. Advantageously, the titanium-lead active layer is dispersion-strengthened by zirconium carbide or titanium carbide particles, and it's surface is released of a portion of lead.

Abstract: The known flourinated layer has usually a thickness of from 1000 to 3000 angstroms. After the forced oxidation of metal, the forcibly oxidized surface is flourinated. As a result of the preceding forcing oxidation, a 1 &mgr;m or more thick fluorinated layer is formed on the surface of the metal.

Abstract: In one embodiment, the present invention relates to a flexible laminate, comprising a first flexible polymeric film; a copper layer having a microcracking prevention layer on at least one side the microcracking prevention layer sufficient to prevent microcracks in a copper layer having a thickness of up to about 18 &mgr;m during at least 50,000,000 bending cycles and/or a copper layer having a thickness of up to about 35 &mgr;m during at least 20,000,000 bending cycles of the flexible laminate; and a second flexible polymeric film.