Abstract: This invention provides color development methods of metallic titanium used for manufacture of black titanium or titanium tinted in other chromatic colors. In one method, metallic titanium is treated with an alkali solution. It enables colored titanium rich in color variation with high efficiency, irrespective of the material configuration. The brightness of black is further reduced by conducting a nitriding process, after this process. In another method, the metallic titanium is oxidized after forming the titanium nitride film on its surface by nitriding it. Black titanium is produced with low brightness. In this way, colored titanium with various tones is produced. Moreover, the close adherence of the film with colors developed thereon is enhanced.

Abstract: An organic rust-roof treated copper foil characterized in that it has a metallic rust-proof layer formed on the non-adhesive side of the original copper foil and has an organic rust-proof layer formed on said metallic rust-proof layer, the organic rust-proof layer comprising a mixture of at least two kinds of chemicals selected from the group consisting of benzotriazole, its derivatives, aminotriazole and its isomers and derivatives is provided with on said metallic rust-proof layer, or it further has a chromate-treated layer formed between said metallic rust-proof layer and said organic rust-proof layer.

Abstract: A composition useful for the surface treatment of copper, in particular for micro-roughening of the copper surface so as to improve the adhesion characteristics of the copper surface, comprises an oxidizing agent for copper and an aromatic sulfonic acid or a salt thereof. In a preferred embodiment, the oxidizing agent is hydrogen peroxide and the aromatic sulfonic acid is sodium m-nitrobenzenesulfonate. The composition preferably also includes an inorganic acid such as sulfuric acid and a corrosion inhibitor such as benzotriazole.

Abstract: A copper alloy plumbing fixture containing interdispersed lead particles coated non-continuously on a water contact surface to resist the leaching of lead into potable water systems. The leach resistant fixture is prepared by immersing conventional copper alloys in a bismuth nitrate solution, selectively and non-continuously coating the lead dispersoid particles on the water contact surface with bismuth, tin or copper.

Abstract: Compositions and processes are disclosed for producing improved environmental protection, corrosion resistance and improved paint adhesion for metals e.g., ferrous, aluminum, or magnesium alloys, as well as other substrates upon contact. The compositions and processes comprise use of one or more Group IV-A metals, such as zirconium, in combination with one or more Group III-A metals, such as cerium, in an acidic solution with one or more oxyanions or other non-fluoanions to stabilize and solubilize the metals while fluorides are specifically excluded from the processes and compositions above certain levels. The processes can contain pretreatment stages that serve to activate a substrate surface and/or promote formation of mixed-metal oxide matrices through use of an oxygen donor. The compositions are at a pH below about 7.0 and are preferably in a range between about 1.0 and about 4.0.

Abstract: In the method for stabilizing an artificial patina layer produced on a copper panel, a transparent cover layer consisting of water glass and hydroxycellulose is applied onto the patina layer immediately after it is produced. The cover layer can consist of sodium or potassium water glass and hydroxycellulose, and is applied onto an artificially patinated copper panel by either immersion or spraying. After immersion or spraying, the cover layer is dried. This occurs in an atmosphere with a temperature of approximately 20.degree. C. to 150.degree. C., within a time period of approximately one to one and a half hours.

Abstract: Disclosed is a material capable of readily developing natural patina, comprising a basis material made of Cu or a Cu alloy at least on the surface; and a layer of at least one compound selected from the group consisting of CuCl, CuBr and CuI formed on the surface of said basis material, and also a process for producing such material, which comprises anodizing the surface of a basis material made of Cu or a Cu alloy at least on the surface in an aqueous solution containing at least one kind of halogen ion selected from the group consisting of Cl.sup.-, Br.sup.- and I.sup.-. This material develops natural patina in a very short time after exposure outdoors.

Abstract: A surface treatment, especially for titanium and aluminum alloys, forms a sol-gel film covalently bonded on the metal surface to produce strong, durable adhesive bonds between the metal and an organic adhesive without using toxic chemicals and while significantly reducing or eliminating rinse water requirements of traditional anodizing or etching processes. An aqueous sol containing an alkoxyzirconium and an organosilane with an organic acid catalyst and zirconium stabilizer is applied to etched or grit blasted substrates by dipping, spraying, or drenching, to produce bonds in a single application comparable in strength and performance to standard anodize controls. Parameters affecting performance include the sol composition, the Si/:Zr ratio, the ratio of sol ingredients, the concentration of the sol, the carrier solvent, solution age, catalysts, surface pretreatment, application method, curing process, and primer used.

Abstract: A surface treating agent for copper and a copper alloy, comprising an aqueous solution containing an imidazole compound or a benzimidazole compound, a complexon, and iron ions. The agent forms a chemical film selectively on the surface of copper while forming no film on other metals.

Abstract: Described herein is a printed circuit board surface protective agent containing compounds as expressed by Formula I. ##STR1## (herein, Y is a linear or a branched alkyl group having 1 to 20 carbon atoms or (2) ##STR2## X is any of halogen atom, amino group, di-lower alkylamino group, hydroxy group, lower alkoxy group, cyano group, formyl group, acetyl group, benzoyl group, carbamoyl group, carboxyl group, lower alkoxycarbonyl group, or nitro group; X' is any of alkyl group, halogen atom, amino group, di-lower alkylamino group, hydroxy group, lower alcoxy group, cyano group, formyl group, acetyl group, benzoyl group, carbamoyl group, carboxyl group, lower alkoxycarbonyl group or nitro group; n is an integral number from 1 to 4, and X may be either identical or different when n is in a range from 2 to 4. m is an integral number in a range from 1 to 10, p is 0 or an integral number in a range from 1 to 4, and X' may be either identical or different when p is in a range from 2 to 4.

Abstract: A black uniform coating with excellent adhesion, bend flexibility, and cosion resistant characteristics can be formed on metals such as aluminum and its alloys, zinc and its alloys, and copper and its alloys such as brass, with the deposition of zinc and antimony compounds through a base solution and sealed with a water base sealer. The water based sealer comprises an organic film forming resin, an organic solvent, and emulsifying agents and an alkyd resin.

Abstract: The invention relates to a method for the surface treatment of a metallic material, the coating being designed for creating an artificial patina in a copper-bearing material after the material is installed in its final location of use. According to the invention, in connection with the filtering and washing stage, including at least one step, of the precipitate formed of the ingredient components of the coating material, the solids content of the precipitate is adjusted within the range of 15-50% by weight, as calculated from the weight of the coating material after the filtering stage, and the coating material with an adjusted solids content is stored at a temperature lower than 5.degree. C. prior to applying said coating material onto the target surface.

Abstract: A copper alloy plumbing fixture containing interdispersed lead particles coated noncontinuously on a water contact surface to resist the leaching of lead into potable water systems. The leach resistant fixture is prepared by immersing conventional copper alloys in a bismuth nitrate solution, selectively and noncontinuously coating the lead dispersoid particles on the water contact surface with bismuth. Tin may be substituted for bismuth to obtain similar results.

Abstract: A method for improving the tip and nozzle of a gas welder in which a conventional or new surface oxidation chemical treatment was applied to improve the surface properties of the tip and nozzle of a gas welder made of copper or copper alloys. Continuous welding operation could then be possible for extended periods of time. If a black copper oxide layer is formed by chemical conversion coating treatment on the surface of the nozzle which is made of copper or copper alloys, then the splatters do not easily stick to the surface. Further, even if the splatters stick, they are more easily removed. In the case of the tip, a black copper oxide layer formed by chemical conversion coating treatment in the small hole of the tip makes the supply of the filler metal wire flow smoothly without troubles. Further, the black copper oxide layer formed by chemical conversion coating treatment also inhibits the sticking of splatters, so that the supply of the filler metal wire is smooth.

Abstract: A copper foil for printed circuits of which a shiny side has resin dust resistance, excels in heat discloration resistance and rust preventiveness, and does not adversely affect the solderability and resist adhesion, and a method of treating the surface of such copper foil. The copper foil for a printed circuit comprises a first layer of zinc alloy composed of zinc and nickel and/or cobalt, formed on the shiny side surface of a copper foil, and a second layer composed of a mixture or compound of benzotriazole derivative and phosphorus compound (and silicon compound) formed on the layer. The method for treating the surface of a copper foil for a printed, circuit comprises the steps of forming a first layer of zinc alloy composed of zinc and nickel and/or cobalt be electroplating on the shiny side surface of a copper foil, and forming a second layer by immersing it in an aqueous solution of benzotriazole derivative and phosphorus compound (and silicon compound).

Abstract: A water-based surface treatment agent is used to provide a chemical layer on a copper or copper alloy printing wiring board (PWB). The chemical layer shows excellent heat-resistance and moisture-resistance. The treated PWB maintains excellent solderability for extended lengths of time. The water-based surface treatment agent contains as an active ingredient 2,4-diphenylimidazole, 2,4-diphenyl-5-methylimidazole or 2-phenyl-4-benzyl-5-methylimidazole. The treating compositions with a lower carboxylic acid of up to 4 carbon atoms are soluble in water, and have improved solder wetting properties and improved solder paste spreading property. A copper compound may be included in the aqueous solution to increase the rate at which the chemical layer is formed.

Abstract: Heating an aqueous mixture of a fluoroacid such as H.sub.2 TiF.sub.6 and an oxide, hydroxide, and/or carbonate such as silica produces a clear mixture with long term stability against settling of any solid phase, even when the oxide, hydroxide, or carbonate phase before heating was a dispersed solid with sufficiently large particles to scatter light and make the mixture before heating cloudy. The clear mixture produced by heating can either be mixed with water soluble and/or water dispersible polymers, for example with dispersed polymers of the diglycidyl ether of bisphenol-A or an acrylic acid polymer, or with soluble hexavalent and/or trivalent chromium, to produce a composition that improves the corrosion resistance of metals treated with the composition, especially after subsequent painting.

Abstract: An water-based surface treatment agent used for the copper on a printed wiring board (PWB). Chemical layer formed on PWB shows excellent heat-resistance and moisture-resistance; therefore, the treated PWB preserves excellent soldability for a long time. The water-based surface treatment agent contains, as an active ingredient, a 2-arylimidazole compound represented by the following formula, ##STR1## wherein R is a hydrogen atom or a methyl group, R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, and R3 and R4 are hydrogen atoms, lower alkyl groups, halogen atoms, lower alkoxy groups, di-lower alkylamino groups, cyano groups or nitro groups, ##STR2## wherein R is a hydrogen atom or a methyl group, and R1 and R2 are hydrogen atoms, lower alkyl groups or halogen atoms, but excluding the case where R, R1 and R2 are all hydrogen atoms.

Abstract: A Ti--Al system intermetallic compound comprised of 25 at. % to 75 at. % of aluminum and the remainder of titanium. The compound includes 0.004 at. % to 1.0 at. % each of at least one halogen element selected from the group consisting of fluorine, chlorine, bromine and iodine. Alternatively, to provide a Ti--Al system intermetallic compound with oxidation resistance, the surface of the Ti--Al system intermetallic compound is heated to 800.degree. C. to 1125.degree. C. in a mixture of gas including 2 ppm to 1% by volume of at least one halogen element selected from the group consisting of fluorine, chlorine, bromine and iodine, and also including 0.1% by volume or more of oxygen. Thus, a dense aluminum oxide film is formed on the surface of the intermetallic compound. Alternatively, to form the dense aluminum oxide film, at least one halogen element is first disposed on the part providing the oxidation resistance of the intermetallic compound, and heated for 0.2 hour or longer at 800.degree. C. to 1125.degree.

Abstract: A method of applying a surface hydrophilic treatment to a heat-transfer tube with a good productivity, which obtains an excellent surface hydrophilic property not deteriorated for a long term. The method includes the steps of: heating a copper or copper alloy heat-transfer tube for 5 to 10 min at a temperature ranging from 250.degree. to 350.degree. C. in an atmosphere mainly containing an inert gas; and applying corona discharge or plasma discharge to the copper or copper alloy heat-transfer tube. To prevent the coloring, the atmosphere preferably contains O.sub.2 in a concentration of 3% or less and CO in a concentration of 1 to 5%, the balance being an inert gas.

Abstract: A novel benzimidazole derivative is disclosed. The benzimidazole derivative is represented by the following formula (I), ##STR1## wherein R.sup.1 is a hydrogen atom, a lower alkyl group, or a halogen atom; R.sup.2 is a hydrogen atom or a lower alkyl group; R.sup.3 is an alkylene group with 1 to 18 carbon atoms; and n and m are integers from 0 to 3. The compound has an excellent rust preventing effect and can be used as a component of a composition for the treatment of surfaces of copper and copper alloys comprising the benzimidazole derivative which is particularly useful in preventing rust in printed-wiring boards.

Abstract: Process for sheet titanium pickling followed by passivation. Pickling is carried out in an aqueous solution containing H.sub.2 SO.sub.4, HF and Fe.sup.3+ at .ltoreq.50.degree. C., continuously fed with an air flow, and with a stabilized H.sub.2 O.sub.2 quantity adjusted to the bath redox potential to be kept at -200 to 0 mV. Passivation is carried out in an aqueous bath containing 4 to 10 g/l HF, .ltoreq.1 g/l Fe.sup.3+, and not containing H.sub.2 SO.sub.4, with a redox potential kept at 500-600 mV by continuous feeding of stabilized H.sub.2 O.sub.2.

Abstract: An aluminum sheet for use in spot welding has an anodic oxide film with a thickness of 50 .mu.m or less on at least one surface thereof. The anodic oxide film is preferably overlaid with a plating layer predominantly comprising at least one metal selected from the group consisting of Zn, Cr, Co, Ni, Fe, and Mn. The aluminum sheet can be produced by subjecting an aluminum or aluminum alloy sheet to anodic oxidation in an acidic solution having a pH of 4 or less conditions of from 2 to 200 V in voltage and from 0.2 to 200 seconds in duration, optionally followed by electroplating in an acidic plating bath.

Abstract: Disclosed is a composition and process for the treatment of metallic surfaces, which comprises treating said surface with an aqueous solution comprising a benzimidazole compound which has at least one carboxylic or sulfonic acid group directly or indirectly attached to said benzimidazole compound.

Abstract: A method for forming a protective layer on a copper surface is set forth. The surface of degreased strips or sheets of copper are roughened by mechanical treatment in a controlled manner. The roughened surfaces of the strips or sheets are then chemically treated to bring about a green patination. After the chemical treatment, the strips or sheets are stored in a climate-controlled space.

Abstract: Disclosed is a composition and process for the surface treatment of metallic surfaces, which comprises treating said surface in an aqueous solution comprising a benzimidazole compound having either a halogenated phenyl group, a halogenated benzyl group or a halogenated ethyl phenyl group in the 2-position.

Abstract: The invention relates to a new process for obtaining tissue-protective devices of bone surgery implants prepared from a medical-purity metal, titanium and/or a titanium-base microalloy containing at least 98% by weight of titanium, by establishing a biocompatible (tissue-protective) coating on the metal surface by anodic oxidation after degreasing and chemical or electrochemical etching, which comprises carrying out the anodic oxidation of the etched implant surfaces in an aqueous solution of a phosphate concentration lower than 20% by weight with a current density of 2 to 50 mA/cm.sup.2 until reaching a voltage of at least 105 V, then, after washing to ion-free, heat-treating the thus-oxidized implants at a temperature between 120.degree. C. and 750.degree. C. for 5 to 120 minutes, and repeating once or twice the anodic oxidation and heat-treatment with the phosphate concentration, current density and temperature values as given above for the first step.

Abstract: A method of preventing oxidation of copper powder which comprises the steps of:mixing copper powder, boric acid, and a solvent to form a mixture; anddrying the mixture to evaporate the solvent,the boric acid being used in such an amount that the amount of boron atoms present in the copper powder after the drying step is from 0.01 to 0.1% by weight based on the weight of the copper powder,the solvent being selected from the group consisting of ketone solvents, hydrocarbon solvents and aromatic solvents, and being used in such an amount that the boric acid concentration of the mixture is not higher than the saturated concentration of boric acid.

Abstract: A method for inhibiting the corrosion of metals exposed to aqueous mixtures of sulfuric acid and hydrocyanic acid by the use of iron salts.

Abstract: A method of manufacturing a multi-layered wiring board, which is characterized in that the oxidation of a wiring layer for roughening the surface of the layer is performed by two steps (a) oxidizing a wiring layer of inner circuit plate with a first alkaline oxidizing solution thereby forming a first oxidized film comprising CuO and Cu.sub.2 O, then etching said first oxidized film to obtain a thinned first oxidized film, and (b) oxidizing said thinned first oxidized film with a second alkaline oxidizing solution thereby forming a second oxidized film enriched with Cu.sub.2 O.

Abstract: The coated article includes a refractory metal substrate having an oxidation resistant intermetallic layer formed in situ thereon; e.g., a fused refractory metal silicide layer, and a ceramic layer applied on and adhering to the intermetallic layer to provide enhanced high temperature properties and improved resistance to premature catastrophic failure in high temperature oxidizing environments where dissimilar materials are present that may destructively react with the intermetallic layer.

Abstract: Disclosed is a process for the surface treatment of copper or a copper alloy, which comprises immersing the surface of copper or a copper alloy in an aqueous solution containing a benzimidazole compound having an alkyl group of at least 3 carbon atoms at the 2-position and an organic acid.

Abstract: A process for imparting tarnish resistance to copper and copper alloy materials, particularly copper foil. The material is first treated with an acidic chromium-containing solution to deposit chromium ions on said foil. Thereafter the material is treated with a basic zinc ion containing solution to deposit zinc ions thereon. Finally, the material is rinsed in distilled water to remove any residual basic solution.

Abstract: A method for artificially forming patina on copper comprising: a) removing any impurity present on the surface of copper substrate; b) polishing the copper substrate with an aqueous solution containing sodium ions, copper ions, acetate ions, chlorine ions, sulphate ions, H+ ions and OH- ions until a brown color is obtained; c) washing the polished copper substrate having brown color of step (b), with water and drying; d) gently brushing the copper substrate having been dried according to step (c), washing and thoroughly drying; e) submitting the copper substrate after having been thoroughly dried according to step (d), to a filtered aqueous solution containing copper carbonate, ammonium chloride, copper acetate, arsenic trioxide, copper nitrate and hydrochloric acid until the desired patinated copper substrate is obtained. The invention covers also the products resulting from the method, as well as specific solutions to carry steps (b) and (e).

Abstract: A composition for use in the physicochemical surface refinement of objects having surfaces of titanium, nickel, and alloys of each, normally in a vibratory mass finishing process, comprises the combination of sulfamic acid, ammonium bifluoride, and hydrogen peroxide. The maximum concentration of the peroxide is controlled to avoid inhibiting or arresting the reaction with the metal; maintaining a minimum concentration prevents excessive metal dissolution, pitting and other undesirable surface defects.

Abstract: A method of bonding copper and resin comprising the steps of:a) forming a layer of copper oxide on a surface of copper by oxidation of copper;b) reducing the layer of copper oxide thus formed to metallic copper with a reducing solution with the addition of an alkaline solution and a stabilizer at a controlled temperature under a circulated condition within a controlled period of time to modify its morphology; andc) forming a layer of copper oxide on a surface of the metallic copper by baking; andd) bonding the surface of the copper oxide formed by the baking and a resin together by heat-pressing.

Abstract: The present invention relates to a process for treating a brass-plated steel wire comprising applying to the wire an aqueous zinc phosphate solution having a pH of from about 2 to about 3 and containing (1) a total of from about 28 to 32 grams per liter of phosphoric acid, (2) from about 8 to 11 grams per liter of free phosphoric acid, (3) from about 8 to 11 grams per liter of Zn.sup.+2 which may be derived from the group consisting of zinc oxide, zinc phosphate or mixtures thereof, and (4) wherein the mole ratio of total phosphoric acid to free phosphoric acid ranges from 2.5:1 to 4.0:1. In accordance with the present invention, the zinc phosphate coating on the brass-plated steel cord inhibits corrosion and adhesion of the wire to rubber after vulcanization is improved.

Abstract: A titanium-containing metallic material having a high heat-resistant and abrasion resistant surface is produced by (A) cleaning a titanium-containing metallic material, (B) first plating the cleaned surface of the metallic material with Cu or Ni by a strike or flash plating method, (C) second plating the first plated surface of the Ti-containing material with Ni, Ni-P alloy or a composite material comprising a Ni-P alloy matrix and fine ceramic particles dispersed in the matrix by an electroplating method, (D) non-oxidatively heat treating the second plated Ti-containing material at 450.degree. C.

Abstract: A method of making an electrical contact to a metal on which an electrically insulating native oxide is formed includes applying atoms or ions to the native oxide, heating the metal and oxide to a temperature and for a time effective to make the oxide, where the atoms and/or ions have been applied, electrically conducting and in electrical communication with the metal. The invention may be employed to establish electrical contacts with native oxides on aluminum, molybdenum, niobium, tantalum, titanium, tungsten, and zirconium. The atoms and ions include aluminum, antimony, arsenic, boron, gallium, indium, phosphorus, and silicon. An aqueous solution of boric acid and trisodium phosphate may be applied to establish electrically conductive regions in an oxide on niobium, tantalum, titanium, and stainless steel after heat treatment. Brushing with palladium wires mechanically applies palladium atoms to tantalum oxide to establish electrical contact to the tantalum after heat treatment.

Abstract: In a method for manufacturing a stranded conductor for an electrical power cable comprising a process for forming cupric oxide films of from 0.3 .mu.m to 3 .mu.m in thickness by passing an uninsulated stranded conductor constituted by a plurality of stranded copper strands through oxidizing liquid, the stranded conductor passing through the liquid is curved in a wave to form gaps between the strands, and the oxidizing liquid is caused to penetrate between the strands through the gaps to form cupric oxide films of from 0.3 .mu.m to 3 .mu.m in thickness on the surfaces of the strands. Also disclosed is a stranded conductor for an electrical power cable constituted by a plurality of stranded copper strands, at least one of the copper strands being covered with a cupric oxide film free from exfoliation.

Abstract: A process for producing a multilayer printed wiring board, characterized in that copper surface of internal layer(s) is chemically oxidized, thereby forming a brown or black, oxidized copper surface on the internal layer board; and said oxidized copper surface of said internal layer board is treated with an acidic aqueous solution of a reducing agent containing at least one material selected from the group consisting of zinc formaldehyde sulfoxylate and sodium hypophosphite.

Abstract: The method proposes utilization of an alkali bath for surface treatment of titanium or titanium alloy parts, the bath being comprised of an alkali hydroxide, a titanium complex forming component, and an impurity ion-complex forming component. The bath can be alternatively applied by a simple dipping procedure or as a part of an anodizing process.

Abstract: A method for improving the bonding characteristics of TAB semiconductor packages to circuit boards is achieved by plating additional amounts of tin on the TAB semiconductor package leads after final package assembly is complete. Residues from the plating step are removed from the package assembly to prevent contamination. Stresses that were developed in the plated material during the plating step are removed by heating the leads.

Abstract: A composition for use in the physicochemical surface refinement of objects having surfaces of titanium, nickel, and alloys of each, normally in a vibratory mass finishing process, comprises the combination of sulfamic acid, ammonium bifluoride, and hydrogen peroxide. The maximum concentration of the peroxide is controlled to avoid inhibiting or arresting the reaction with the metal; maintaining a minimum concentration prevents excessive metal dissolution, pitting and other undesirable surface defects.

Abstract: This invention provides an aluminum alloy conversion coating composition and a process for protecting aluminum alloys, especially the alloys having greater than 1.0% Cu with a conversion coating. The coating is placed on the aluminum alloy in a multi-step process. In a first step the alloy is treated with a composition having as essential ingredients aluminum nitrate and an alkali metal nitrate, in a second step the nitrate treated alloy is treated with an alkali metal permanganate composition and in the final step the alloy is treated with an alkali metal silicate composition.The aluminum conversion coatings of this invention are provided without the need for using toxic chromium compounds.

Abstract: A process to form a uniform metal boride coating on a carbonaceous substrate by first forming a metal carbide coating and reacting the carbide coating with a boron compound.

Abstract: Black, brown, and red oxide layers having high adhesion and peel strength are formed on printed circuit boards by adding a suitable amphipathic anionic surfactant to standard oxidizing solutions. The oxide layers thus formed result in multilayer circuit boards having reduced tendency to delaminate.

Abstract: An aqueous solution of a reducing agent is applied to a chromate coated metal surface to reduce the extent to which the chromate coating undergoes dissolution during a subsequent cleaning process.

Abstract: A method of applying a coating to the inner layers of multilayer boards made of copper. The cured coating is capable of maintaining adhesion without outgassing for at least 10 seconds at 250.degree. C. It can be adhesion promoted for adherent electroless metal deposition with a chromic acid adhesion promotion solution. The coating composition comprises the product of reacting between 20 to 60% of a poly(vinyl acetal) resin with 80 to 40% of a phenolic resin in the presence of an acidic catalyst and a coupling agent having at least two amino substituted aromatic groups covalently bonded to a titanium or zirconium central atom via an oxygen containing linkage. The coating composition is applied to a metallic oxide film on the surface of the copper substrate.

Abstract: The invention provides a method of removing surface scale from a titanium or titanium alloy substrate. The method includes the steps of heating the substrate to a temperature in the range from about 100.degree. C. to about 600.degree. C., and thereafter subjecting the heated surface to a plasma formed from a gas selected from the group of consisting of CF.sub.4 and SF.sub.6. The plasma reacts with the surface scale, removing the scale, without attacking the underlying crystalline titanium or titanium alloy. Properly controlled, the plasma reaction terminates when the plasma has penetrated the scale, and encounters the underlying crystalline metal. As a result, the method of the invention is capable of uniform removal of the entire surface scale of a crystalline titanium-containing substrate, without intergranular attack of the substrate.