Abstract: A high-strength and high-conductivity copper alloy is disclosed which contains essentially of: (a) from 0.5 to 2.5 wt % of Ni; (b) from 0.5 to 2.5 wt % of Co; (c) from 0.5 to 0.8 wt % of Si; (d) from 0.05 to 0.15 wt % of either Mg or P or both; and (e) the balance of Cu. The amounts of Co, Ni, and Si satisfy the following equations: 2%<(Ni+Co)<4%, and 0.8<(Ni/4+Co/6)/Si<1.2. The new copper alloy exhibits substantially improved electrical conductivity, greater than 65% IACA, than the commercially available C7025 copper alloy, while maintaining a satisfactory tensile strength (greater than 600 MPa), and, thus, can be most advantageously used for preparing leadframes for use in high pin-number (greater than 100 pins) IC application.

Abstract: A family of copper-nickel-zinc-palladium alloys for sliding and static electrical contact applications comprises, on a weight percent basis, about 15-65 percent copper, up to about 30 percent nickel, about 5-30 percent zinc, about 5-45 percent palladium, and up to about 35 percent silver. One embodiment of the family of alloys is age hardenable and provides alloys with hardness values in excess of 300 Knoop (100g load) and significant improvement in high-temperature properties, formability, tensile strength and ductility. A second embodiment provides an alloy with increased strength and hardness in the wrought condition, relative to the prior art Cu—Ni—Zn alloys.

Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).

Abstract: A copper based casting alloy in which lead is replaced by 0.1 to 7 wt % bismuth and 0.1 to 2 wt % mischmetal or its rare earth equivalent is used to improve the distribution of bismuth in the alloy. The alloy is further defined by additions of tin, zinc, nickel, manganese, silicon, aluminum, iron and/or antimony.

Abstract: A copper base alloy for terminals that is of the Cu-Ni-Sn-P or Cu-Ni-Sn-P-Zn system and that has a tensile strength of at least 50 kgf/mm.sup.2, a spring limit of at least 40 kgf/mm.sup.2, a stress relaxation of not more than 10% and a conductivity of at least 30% IACS is provided. Terminals the spring portion or the entire part of which is produced from that copper base alloy, having an insertion/extraction force of 0.2-3 kgf and a resistance of not more than 3 m.OMEGA. at low voltage and current as initial performance, with the added characteristic that the terminals will experience not more than 20% stress relaxation are also provided. The alloy is superior to the conventional bronze, phosphor bronze and Cu-Sn-Fe-P alloys for terminals in terms of tensile strength, spring limits, stress relaxation characteristic and conductivity and, hence, the terminals manufactured from those alloys have higher performance and reliability than the terminals made of the conventional copper base alloys for terminals.

Abstract: A wear-resistant copper alloy which consists essentially of 56 to 65 wt. % of Cu, 28 to 32 wt. % of Zn, 3.5 to 5.5 wt. % of Al, 0.5 to 2.0 wt. % of Fe, 1.0 to 3.0 wt. % of Ni, 0.1 to 1.0 wt. % of Nb, and 0.4 to 1.5 wt. % of Ti, provided that Ti+Nb is equal to or greater than 0.7 wt. %. The alloy includes two discrete intermetallic compounds comprising Ti-Ni-Fe-Al and Nb-Fe-Al uniformly dispersed in a microstructure preferably including at least 50 volume % beta phase and limited alpha and gamma phases. A synchronizer ring made of the copper alloy is also provided.

Abstract: A method for the manufacture of a copper based alloy and the alloy produced thereby having improved mechanical properties. An alloy containing a dispersoid ingredient and a precipitating ingredient are spray cast so that during spray casting the dispersoid ingredient forms a second phase as a uniform dispersion of relatively small dispersoids. After solution treating and aging, the solid state precipitating ingredient precipitates as a third phase of a solid state precipitate.

Abstract: A copper alloy for an electronic device comprises 2.0 wt% -8 wt% of Ni, 0.1 wt% -0.8 wt% of P, 0.06 wt% -1 wt% of Si and the rest being Cu and unavoidable impurities.The rest may include 0.03 wt% -2.0 wt% of Zn. The copper allow has an oxygen content of 20 ppm or less.

Abstract: A wear-resistant copper-base alloy having superior self-lubricity includes, by weight %,Ni: 10.0 to 30.0%;Si: 0.5 to 3%;Co: 2.0 to 15.0%;at least one metal selected from the group consisting of Mo, W, Nb and V:2.0 to 15.0%; andthe balance being Cu and unavoidable impurities, and having a structure in which hard phase grains containing 5 vol% or more of silicide of at least one metal selected from the group consisting of Mo, W, Nb and V are uniformly dispersed in an amount of 10 to 60 vol% in a copper-rich matrix, to which 2.0 to 15.0% of Fe and/or 1.0 to 10.0% of Cr may be further added.

Abstract: A copper based alloy, which when employed in a marine environment with a cathodic protection system or when galvanically coupled to a dissimilar metal, is resistant to hydrogen embrittlement, copper being present in an amount of about 70% to 80% by weight, and the alloy having in addition, (by weight):______________________________________ nickel 13.5% to 20.0% aluminium 1.4% to 2.0% manganese 3.4% to 9.3% iron 0.5% to 1.5% chromium 0.3% to 1.0% niobium 0.5% to 1.0% ______________________________________and wherein the constituent elements are so controlled that:A Cu/(Mn+Ni) is less than 4.9 in terms of weight %;B Cu/(Mn+Ni) is greater than 3 in terms of weight %;C Al+Nb is at least 2.1 in terms of weight %; andD Ni/(Al+Nb) is at least 6.0 in terms of weight %.

Abstract: A copper base alloy exhibits improved wear resistance particularly at elevated temperatures, which consists essentially of, in percent by weight, 10-40% of Ni, 1-7% of Si, 0.5-5% of B, 1-20% of Cr, and the balance of Cu, wherein particles of at least one of chromium boride and chromium silicide having a size of about 0.1 to about 50 .mu.m are evenly dispersed in a copper-nickel base matrix. The alloy may further contain W, Mo or Fe and/or a high-melting carbide such as WC and TaC.

Abstract: Worm gearing having improved wear and strength properties comprises a Cu, 8.0-13.0 w/o Sn, 3.5-5.0 w/o Ni alloy aged in the as-cast condition to strengthen the dendritic microstructural constituent (e.g., alpha phase) while retaining the as-cast, relatively hard interdendritic constituents. The overall Ni concentration of the alloy does not exceed about 5 w/o and the Ni concentration across individual as-cast dendrites is decreased at the dendrite edges (grain boundaries) to hinder formation of a discontinuous, embrittling grain boundary product that is deleterious to these properties.

Abstract: An iron/copper/chromium alloy material for a high-strength lead frame or pin grid array, which comprises 20 to 90% by weight of Cu and 2.5 to 12% by weight of Cr, with the balance being mainly iron, and which has an average grain size number of at least 10 in each of the iron/chromium phase and the copper phase, is prepared by continuous casting, cold-working, and aging.

Abstract: A particle dispersion-strengthened copper alloy consisting essentially of copper as the main component, 0.1-10% by weight of nickel, 0.1-10% by weight of tin, 0.05-5% by weight of silicon, 0.01-5% by weight of iron, and 0.0001-1% by weight of boron. The alloy is suitable for use in electronic parts due to its good electrical conductivity, heat conductivity, strength, hardness, plating ability, soldering ability, elasticity, and excellent corrosion resistance including resistance to acids.

Abstract: A copper-nickel-silicon-chromium alloy having the combination of high hardness and high electrical conductivity. The alloy is composed by weight of 9.5% to 11.5% nickel, in an amount sufficient to provide a nickel-silicon ratio of 3.4 to 4.5, 0.5% to 2.0% chromium, and the balance copper. The alloy is heat treated by initially heating the alloy to a solution temperature and is thereafter quenched. The quenched alloy is then aged to precipitate the metal silicides. Because of the specific ratio of nickel to silicon, the heat treated alloy develops during heat treatment a hardness in excess of 30 Rockwell C and an electrical conductivity in excess of 24% of pure copper.

Abstract: A Cu-Ni-Sn alloy with excellent fatigue properties comprising 6 to 25 wt % of Ni, 4 to 9 wt % of Sn, 0.04 to 5 wt % in total of at least one element selected from the following elements:Zn . . . 0.03-4 wt %, Zr . . . 0.01-0.2 wt %,Mn . . . 0.03-1.5 wt %, Fe . . . 0.03-0.7 wt %,Mg . . . 0.03-0.5 wt %, P . . . 0.01-0.5 wt %,Ti . . . 0.03-0.7 wt %, B . . . 0.001-0.1 wt %,Cr . . . 0.03-0.7 wt %, Co . . . 0.01-0.5 wt %,and the rest being substantially Cu, and subjected, before final finish working, to heat treatment for structure arrangement at a temperature of 500.degree. to 770.degree. C., then to finish working of at most 50%, followed by age treatment at a temperature of 350.degree. to 500.degree. C. for 3 to 300 minutes.

Abstract: A copper alloy comprising:(A) 0.15-1.0 wt % Fe,(B) 0.05-0.3 wt % P, and(C)(1) 0.01-0.1 wt % Ni and 0.01-0.05 wt % Si or(2) 0.01-0.1 wt % Ni and 0.005-0.05 wt % b or(3) 0.05-0.3 wt % Mg and 0.05-0.3 wt % Pb or(4) 0.01-0.1 wt % Mn and 0.005-0.05 wt % Si,with the balance being essentially composed of Cu.

Abstract: A dispersion strengthened Cu (copper)-base alloy for a wear-resistant overlay formed on a metal substrate consists essentially of, by weight %,Ni: 5 to 30%;B: 0.5 to 3%;Si: 1 to 5%;Fe: 4 to 30%;Sn: 3 to 15% and/or An: 3 to 30%; andthe remainder being Cu and unavoidable impurities, and has a structure in which particles of boride and silicide of the Fe-Ni system are dispersed in a Cu-base matrix, and Cu-base primary crystals contain Sn and/or Zn in a solid solution state. If necessary, 0.1 to 5% of Al, 0.1 to 5% of Ti, and/or 1 to 10% of Mn may be added. 0.02 to 2% of C, and 0.1 to 10% of Cr and/or 0.3 to 5% of Ti may be further added. Instead of or along with Sn and/or Zn, 2 to 20% of Pb can be used, and nonsoluble Pb particles are uniformly dispersed between Cu-base .alpha. phase dendrites and serve as a solid lubricant.

Abstract: Cermet electrode compositions and methods for making are disclosed which comprise NiO--NiFe.sub.2 O.sub.4 --Cu--Ni. Addition of an effective amount of a metallic catalyst/reactant to a composition of a nickel/iron/oxide, NiO, copper, and nickel produces a stable electrode having significantly increased electrical conductivity. The metallic catalyst functions to disperse the copper and nickel as an alloy continuously throughout the oxide phase of the cermet to render the electrode compositon more highly electrically conductive than were the third metal not present in the base composition. The third metal is preferably added to the base composition as elemental metal and includes aluminum, magnesium, sodium and gallium. The elemental metal is converted to a metal oxide during the sintering process.

Abstract: Cermet electrode compositions comprising NiO-NiFe.sub.2 O.sub.4 -Cu-Ni, and methods for making, are disclosed. Addition of nickel metal prior to formation and densification of a base mixture into the cermet allows for an increase in the total amount of copper and nickel that can be contained in the NiO-NiFe.sub.2 O.sub.4 oxide system. Nickel is present in a base mixture weight concentration of from 0.1% to 10%. Copper is present in the alloy phase in a weight concentration of from 10% to 30% of the densified composition. Such cermet electrodes can be formed to have electrical conductivities well in excess of 100 ohm.sup.-1 cm.sup.-1. Other alloy and oxide system cermets having high content metal phases are also expected to be manufacturable in accordance with the invention.

Abstract: A copper alloy obtained by preparing a blank of an alloy that consists of 1.0-3.0% Ni, 0.5-1.5% Ti (the ratio of Ni/Ti in weight percent being in the range of 1-3), 0.1-2.0% Zn, 0.01-0.5% Mg, no more than 50 ppm of oxygen, and the balance being Cu and incidental impurities, all percents being on a weight basis; and reducing the thickness thereof to the final value by cold rolling, wherein at least one cycle of solution heat-treatment is applied at a temperature of not lower than 900.degree. C., followed by quenching with water with no more than 50% reduction in plate thickness being attained to the final value subsequent to the final solution heat-treatment, and at least one cycle of aging treatment is applied at a temperature of 500.degree.-600.degree. C.

Abstract: An iron/copper/chromium alloy material for a high-strength lead frame or pin grid array, which comprises 20 to 90% by weight of Cu and 2.5 to 12% by weight of Cr, with the balance being mainly iron, and which has an average grain size number of at least 10 in each of the iron/chromium phase and the copper phase, is prepared by continuous casting, cold-working, and aging.

Abstract: A method for processing a copper alloy wherein the alloy comprises from 0.2-1.0% beryllium, 1.4-2.2% nickel or cobalt and remainder copper. Said method comprising one or more processing steps and characterized in that said steps conclude with cold working the alloy to an area reduction of at least 99% followed by a batch annealing at a temperature of 750.degree.-950.degree. F. for a period of 1-4 hours.

Abstract: Herein disclosed is a dispersion strengthened copper-base alloy having an excellent wear resistance, which alloy contains 5 to 30% (in weight) of nickel, 1 to 5% of silicon, 0.5 to 3% of boron and 4 to 30% of iron, the remainder being copper and unavoidable impurities, and having a structure in which hard particles composed chiefly of a silicide of iron-nickel system are dispersed in a copper-base matrix. The copper-base alloy is suitably cladded (or deposited) locally on a metallic base. The alloy may contain at least one of 0.1 to 5% of aluminum, 0.1 to 5% of Ti and 1 to 10% of Mn, if necessary, in addition to the above specified components. If necessary, 0.02 to 2% of carbon and 0.5 to 10% of chromium and/or 0.3 to 5% of titanium may be further added. Then, the structure is modified such that both the particles composed chiefly of the iron-nickel silicide and carbide particles are coexistently dispersed in the copper-base matrix.

Abstract: A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy may be processed to provide improved bend formability at some sacrifice in strength. The alloy in the stabilized condition shows surprising improvement in stress relaxation resistance. The alloy comprises a Cu-Ni-Si alloy to which about 0.05 to about 0.45% by weight magnesium is added.

Abstract: A wire having a tensile strength of at least 95 psi and conductivity of at least 60 percent IACS is provided. The wire is manufactured from a precipitation hardenable alloy, the alloy consisting essentially of about 0.38 percent beryllium, 1.66 percent nickel or cobalt and the remainder copper. The manufacture comprises one or more processing steps concluding with cold working the alloy to a wire and an area reduction of at least 99 percent.

Abstract: The present invention relates to a copper base alloy consisting essentially of from about 3.5% to about 6.0% aluminum, from about 0.1% to about 3.0% nickel, from about 0.03% to about 1.0% magnesium and the balance essentially copper. The alloys of the present invention have been found to be cost effective and easily processable. They have also been found to have particular utility in electronic and electrical applications such as electrical connectors.

Abstract: An excellent material for lead frames is provided which is economical and easily punched out to produce lead frames without bending or breakage, and has both superior tensile strength and high electrical conductivity, as well as splendid heat dissipation properties and good soldering properties.

Abstract: A low cost electroconductive spring material excellent in electroconductivity and spring performance, has from 1.8 to 3.0% by weight of Ni, from 0.15 to 0.35% by weight of Be, from 0.2 to 1.2% by weight of Si and the balance being copper. This low cost electroconductive spring material can be used in electric devices. As preferred embodiments, the electroconductive spring material may further contain from 0.05 to 3.0% by weight in a total amount of at least one component selected from Sn, Al and Zn provided that each of Sn, Al and Zn does not exceed 1.5% by weight, or from 0.01 to 1.5% by weight in a total amount of at least one component selected from Co, Fe, Zr, Ti and Mg, provided that each of Co, Fe, Zr, Ti and Mg does not exceed 1.0% by weight. Moreover, the electroconductive spring material is subjected to a final solidification heat treatment at a temperature of 880.degree.-950.degree. C., a cold processing of not greater than 80%, and an aging treatment at a temperature of 380.degree.-530.degree. C.

Abstract: In construction of a clad material for ornamental use such as eyeglass frames and watch bands, use of age-hardenable alloy sheath followed by age-hardening enables production of product with light weight, high mechanical strength, excellent workability and good fit to brazing and plating.

Abstract: The invention contemplates a thermomechanical process applicable to beryllium copper alloys consisting essentially of about 0.2 wt % to about 0.7 wt % beryllium; from about 1.0 wt % to about 3.5 wt % nickel and cobalt in the aggregate, where nickel comprises at least about 1.0 wt %; up to about 1.0 wt % zirconium; up to about 0.005 wt % lead; up to about 0.1 wt % magnesium; up to about 1.5 wt % silver; up to about 0.5 wt % incidental impurities including lead; and the balance essentially copper; which process comprises solution annealing said alloy at a temperature of at least about 90% of the incipient melting point of the alloy expressed in degrees Fahrenheit, cold working the solution treated alloy to reduce the section thickness thereof at least about 60% or much more, and then aging the alloy to produce therein an improved combination of properties including strength, ductility, formability and conductivity.

Abstract: A copper base alloy capable of forming a microstructure comprising a plurality of discrete particles in a surrounding metal matrix having a lower melting point than the particles. The alloy consists essentially of from about 3% to about 6% nickel, from about 2% to about 4.25% aluminum, from about 0.25% to about 1.2% silicon, from about 5% to about 15% zinc, up to about 5% iron and the balance essentially copper. When iron is included in an amount from about 3% to about 5% and zinc is restricted to a range of from about 8% to about 10%, the alloy is capable of forming the desired structure in the as-cast condition using a process which does not include stirring during casting.

Abstract: A lead frame consists of a copper alloy containing 0.1 to 1% by weight of chromium and 0.001 to 0.5% by weight of zirconium and having a precipitate with a grain size of 0.5 to 50 .mu.m distributed therein at a rate of 1,000 to 10,000 grains/mm.sup.2. The lead frame is manufactured by casting a copper alloy containing 0.1 to 1% by weight of chromium and 0.001 to 0.5% by weight of zirconium by continuous casting, and performing rolling, a solution treatment, a cold working, and an age-hardening. The lead frame has an excellent bonding performance with an Au wire, hardness and bending strength, and is inexpensive.

Abstract: A spring material for electric and electronic parts having a high modulus of elasticity and good electrical conductivity. The material is made by melting Cu, Ni, Ti or mother alloy thereof and Cu--P as deoxidizer at a temperature between a melting point and 1,400.degree. C. to obtain a molten alloy consisting of 0.5.about.2.0% by weight of Ni, 0.1.about.1.0% by weight of Ti, less than 0.2% by weight of P and the remainder being Cu; casting the molten alloy into a metal mold to obtain an ingot; subjecting the ingot to hot (or warm) working, cold working and annealing; and finally rolling the annealed sheet above 50% and annealing it at low temperature with air cooling to obtain a formed product having a stable structure.

Abstract: A copper-nickel-tin-titanium-alloy suitable for use as a base material for semiconductors includes, by weight, 0.25 to 3.0% nickel, 0.25 to 3.0% tin, and 0.12 to 1.5% titanium, the remainder being copper and common impurities. An alternative form of the inventive alloy includes, by weight, 0.25 to 3.0% nickel, 0.25 to 3.0% tin, 0.12 to 1.5% titanium, and 0.05 to 0.45% chrome, the remainder being copper and common impurities. A method for making these alloys includes the steps of homogenizing the alloy at temperatures of 850.degree. to 950.degree. C. between 1 and 24 hours, hot-rolling the alloy at temperatures of 600.degree. to 800.degree. C. in one or more passes, and cooling the alloy to room temperature with a cooling speed of between 10.degree. C. per minute and 2000.degree. C. per minute.

Abstract: This invention is directed to the treatment of copper beryllium alloys, and to articles and parts made therefrom, containing special small amounts of beryllium and nickel, e.g., about 0.05% to about 0.5% beryllium and about 0.05% to about 1% nickel where cobalt may be substituted for up to about one-half of said nickel content at a substitution ratio of about 1 part by weight cobalt for about 2 parts by weight nickel, which imparts to these alloys a superior combination of stress relaxation resistance, formability, ductility, conductivity and strength by the process of solution annealing, cold working at least about 50% or at least about 70% or 90% or more and age hardening.

Abstract: A process and apparatus for forming a thin-walled, elongated member having superior strength properties from an age hardenable copper base alloy consisting essentially of about 3% to about 20% nickel, about 5% to about 10% aluminum, and the balance essentially copper, is described herein. A slug or billet of a slurry cast, age hardenable copper base alloy is formed into a semi-solid slurry having about 5% to about 40% of the alloy in a liquid phase. The semi-solid slurry is then thixoforged to form the thin-walled, elongated member. Thereafter, the member is age hardened to provide a product having desired strength properties. The process and apparatus of the instant invention may be utilized to form cartridge casings.

Abstract: The present invention relates to copper-nickel alloys having improved ductility at elevated temperatures. The alloys consist essentially of about 5% to about 45%, preferably about 5% to 35% nickel, about 0.4% to about 1.1%, preferably about 0.6% to about 1% manganese, about 0.003% to about 0.04%, preferably about 0.008% to about 0.03% phosphorous and the balance essentially copper. The alloys described herein have particular utility in brazed articles or assemblies.

Abstract: A precipitation hardenable copper base alloy adapted for forming in the semi-solid slurry condition consists essentially of from about 5 to about 8% by weight nickel, from about 5 to about 7.5% by weight aluminum, from about 0.5 to about 1.25% by weight silicon and the balance essentially copper. The alloy has a microstructure comprising discrete particles contained in a lower melting point matrix. The alloy is particularly suited for forging into components such as cartridge cases.

Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.

Abstract: Cu-Ni-Sb alloys have been discovered having a two-phase or multiphase state at low levels of antimony, and alloys in such state have high strength, high ductility, and high electrical conductivity. Tensile strengths in the range of 80,000-160,000 psi have been achieved, and electrical conductivity in the range of 30-65 percent of the conductivity of copper.Alloys of the invention can be made by processing involving homogenizing, rapid cooling, cold working, and aging; for maximized electrical conductivity, dual combined steps of cold working and aging are beneficial.

Abstract: A high temperature wear resistant material is disclosed for use in engine components such as an exhaust valve seat insert to reduce high temperature exhaust valve seat wear. The material consists by weight of about 40-70% Cu, about 20-60% Ni, about 3-14% Al and up to about 1.5% other alloying ingredients with normal processing impurities.

Abstract: A precipitation hardenable alloy suitable for forming molds for continuous casting of steel and other metal containing, by weight, 0.2-2.0% nickel, 0.05-0.5% beryllium, 0.01-1.0% niobium and the balance essentially copper. The alloy is subjected to heat treatment including solution treatment and aging, so that it has improved strength, high thermal conductivity and high toughness at elevated temperatures. The alloy may contain 0.03-0.6 wt % zirconium, 0.03-0.6 wt % zirconium and 0.01-0.1 wt % magnesium, or 0.03-0.6 wt % zirconium and 0.01-0.2 wt % titanium in place of the 0.01-1.0 wt % niobium.

Abstract: Copper alloys are disclosed which contain nickel and tin and Fe, Zn, Mn, Zr, Nb, Cr, Al, or Mg in amounts within specified limits. When cold worked and aged according to a critical schedule these alloys develop a predominantly spinodal structure which renders them strong as well as ductile. The disclosed alloys are useful, for example, in the manufacture of components of electrical apparatus such as springs, connectors and relay elements.