Abstract: Provided is a titanium copper foil which has required high strength when used as a spring, and has improved etching uniformity, and which can be suitably used as a conductive spring material for use in electronic device parts such as autofocus camera modules. The titanium copper foil contains from 1.5 to 5.0% by mass of Ti and from 10 to 3000 pm by mass of Fe, the balance being Cu and inevitable impurities, wherein the titanium copper foil has crystal orientation having A of from 10 to 40, in which A is represented by the following equation (1) when measuring a rolled surface by an X-ray diffraction method: A=?{220}/(?{200}+?{311}) ??Equation (1) in which the ?{220}, the ?{200}, and the ?{311} represent half-value widths of X-ray diffraction peaks at a {220} crystal plane, a {200} crystal plane, and a {311} crystal plane, respectively.

Abstract: Provided is a copper alloy powder which is a metal powder to be used for additive manufacturing by a laser beam system, and which is able to achieve a higher laser absorption rate and additionally suppress heat transfer through necking, and a method for producing this copper alloy powder. A copper alloy powder which contains one or more elements selected from among Cr, Zr and Nb in a total amount of 15 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, and a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less.

Abstract: A crystallizer for continuous casting including a tubular body formed of a first and a second tubular element both monolithic each made in one single piece in a metal alloy and mounted coaxial, the first inside the second with radial play, one of the first and second tubular element being provided with one or more grooves opened towards the other tubular element; the first and second tubular element are mechanically coupled together, by plastic deformation by means of drawing between a die and a mandrel appropriately shaped, in such a manner to eliminate the radial play, so that the tubular body is monolithic and the grooves are radially closed, forming conduits in the tubular body configured to serve as cooling conduits and/or housing reinforcement bars.

Abstract: The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has a plated layer in which an underlying Cu plated layer and a Sn plated layer have been laminated in this order on a surface of the base metal, and has an adhesive strength of 1 N or more as measured by a solder adhesive strength test according to the definition in the specification.

Abstract: There is provided an injection molding machine that includes a melting device in which a molding material melts to generate a molten material; an injection device from which the molten material supplied from the melting device is injected; and a connecting member including a communication path communicating with the melting device and the injection device. The melting device includes a material supply port to which the molding material is supplied, a partition plate that partitions the inside excluding at least both ends of the melting device and extends from the side of the material supply port to the side of the communication path, and a stirrer configured to stir the molten material in a manner of circulating around the partition plate.

Abstract: A casting mold material of the present invention includes, as a composition: 0.3 mass % to less than 0.5 mass % of Cr, 0.01 mass % to 0.15 mass % of Zr, and a balance consisting of Cu and inevitable impurities, and the casting mold material has acicular precipitates or plate-like precipitates containing Cr.

Abstract: A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 ?m and (maximum crystal grain size?minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I0{420}>1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I0{420}, respectively.

Abstract: A copper alloy consisting of two or more of Cr, Ti and Zr, and the balance Cu and impurities, in which the relationship between the total number N and the diameter X satisfies the following formula (1). Ag, P, Mg or the like may be included instead of a part of Cu. This copper alloy is obtained by cooling a bloom, a slab, a billet, or a ingot in at least in a temperature range from the bloom, the slab, the billet, or the ingot temperature just after casting to 450° C., at a cooling rate of 0.5° C./s or more. After the cooling, working in a temperature range of 600° C. or lower and further heat treatment of holding for 30 seconds or more in a temperature range of 150 to 750° C. are desirably performed. The working and the heat treatment are desirably performed a plurality of times. log N?0.4742+17.629×exp(?0.

Abstract: A copper alloy consisting of two or more of Cr, Ti and Zr, and the balance Cu and impurities, in which the relationship between the total number N and the diameter X satisfies the following formula (1). Ag, P, Mg or the like may be included instead of a part of Cu. This copper alloy is obtained by cooling a bloom, a slab, a billet, or a ingot in at least in a temperature range from the bloom, the slab, the billet, or the ingot temperature just after casting to 450° C., at a cooling rate of 0.5° C./s or more. After the cooling, working in a temperature range of 600° C. or lower and further heat treatment of holding for 30 seconds or more in a temperature range of 150 to 750° C. are desirably performed. The working and the heat treatment are most desirably performed for a plurality of times. log N?0.4742+17.629×exp(?0.

Abstract: An alloyed 2N copper wire for bonding in microelectronics contains 2N copper and one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.009 wt % and about 0.99 wt %.

Abstract: In a process for producing a lead-free sliding bearing material, a material which is based on copper and contains iron and phosphorous is atomized to form a powder.

Abstract: Disclosed herein are compositions comprising a dispersion of solid particles of a substantially insoluble copper compound in an amount from 0.001% to 10% by weight of the composition; a boron-containing compound, a fluoride-containing compound, or a combination thereof; and an aqueous carrier; wherein the composition has a viscosity of 125 to 425 tenths of a millimeter (tmm) as measured using a penetrometer, wherein at least 20% of the particles of the composition comprise particles having particle size greater than 25 microns, and wherein the composition contains no more than 36 grams volatile organic compounds (VOCs) per liter of wood preservative coating. Also disclosed herein are methods of making and using the same.

Abstract: To provide a high-strength titanium-copper foil that is more suitable as a conductive spring material that can be used in electronic device components such as an autofocus camera module. A titanium copper foil containing Ti in an amount of 2.0 to 4.0 mass %, a remainder being copper and unavoidable impurities, said foil having a 0.2% yield strength of 1000 MPa or more and a spring limit value of 800 MPa or more in both directions parallel and perpendicular to a rolling direction, wherein no cracking occurs at bending radius/foil thickness=2 when a W bending test in conformity with JIS H3130: 2012 is performed at a width of 0.5 mm in a direction perpendicular to the rolling direction.

Abstract: A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×109 number/mm2 or more. A number density of fine second phase particles is not more than 5.0×107 number/mm2. A number density of coarse second phase particles is 1.0×105 number/mm2 or more and not more than 1.0×106 number/mm2. The material has crystal orientation satisfying the following equation (1): I{200}/I0{200}?3.0??(1) wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I0{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.

Abstract: An apparatus for manufacturing wire comprising: a wire delivering equipment, a wire winding equipment, and an annealing while running equipment installed between the wire delivering equipment and the wire winding equipment, the age-precipitation copper alloy wire being passed in such manner that the wire turns around a plurality of times along a running route in the annealing while running equipment. The current applying equipment to raise a temperature of the age-precipitation copper alloy wire by generated Joule heat may be installed at upstream side of the annealing while running equipment. Another current applying equipment for solution treatment may be installed in tandem at upstream side of the annealing while running equipment. In place of the annealing while running equipment, a current applying equipment may be connected in tandem for age-treatment. By using those equipments, age-precipitation copper alloy wire having the diameter of from 0.03 mm to 3 mm may be obtained.

Abstract: A sheet material of a copper alloy has a chemical composition including 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 ?m and (maximum crystal grain size?minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, and the material having a crystal orientation satisfying I{420}/I0{420}>1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I0{420}, respectively.

Abstract: A Cu—Ti based copper alloy sheet material contains, in mass %, from 2.0 to 5.0% of Ti, from 0 to 1.5% Ni, from 0 to 1.0% Co, from 0 to 0.5% Fe, from 0 to 1.2% Sn, from 0 to 2.0% Zn, from 0 to 1.0% Mg, from 0 to 1.0% Zr, from 0 to 1.0% Al, from 0 to 1.0% Si, from 0 to 0.1% P, from 0 to 0.05% B, from 0 to 1.0% Cr, from 0 to 1.0% Mn, and from 0 to 1.0% V, the balance substantially being Cu. The sheet material has a metallic texture wherein in a cross section perpendicular to a sheet thickness direction, a maximum width of a grain boundary reaction type precipitate is not more than 500 nm, and a density of a granular precipitate having a diameter of 100 nm or more is not more than 105 number/mm2.

Abstract: An electrode core material that may be used in electrodes of spark plugs and other ignition devices to provide increased thermal conductivity to the electrodes. The electrode core material is a precipitate-strengthened copper alloy and includes precipitates dispersed within a copper (Cu) matrix such that the electrode core material has a multi-phase microstructure. In several exemplary embodiments, the precipitates include: particles of iron (Fe) and phosphorous, particles of beryllium, or particles of nickel and silicon.

Abstract: Provided by the present invention are a fine crystallite high-function metal alloy member, a method for manufacturing the same, and a business development method thereof, in which a crystallite of a metal alloy including a high-purity metal alloy whose crystal lattice is a face-centered cubic lattice, a body-centered cubic lattice, or a close-packed hexagonal lattice is made fine with the size in the level of nanometers (10?9 m to 10?6 m) and micrometers (10?6 m to 10?3 m), and the form thereof is adjusted, thereby remedying drawbacks thereof and enhancing various characteristics without losing superior characteristics owned by the alloy.

Abstract: Disclosed is a beryllium-free copper alloy having high strength, high electric conductivity and good bending workability and a method of manufacturing the copper alloy. Provided is a copper alloy having a composition represented by the composition formula by atom %: Cu100-a-b-c(Zr, Hf)a(Cr, Ni, Mn, Ta)b(Ti, Al)c [wherein 2.5?a?4.0, 0.1<b?1.5 and 0?c?0.2; (Zr, Hf) means one or both of Zr and Hf; (Cr, Ni, Mn, Ta) means one or more of Cr, Ni, Mn and Ta; and (Ti, Al) means one or both of Ti and Al], and having Cu primary phases in which the mean secondary dendrite arm spacing is 2 ?m or less and eutectic matrices in which the lamellar spacing between a metastable Cu5(Zr, Hf) compound phase and a Cu phase is 0.2 ?m or less.

Abstract: Provided are a Cu—Zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance of bending formability and bending elastic limit at a high level and a process for manufacturing the Cu—Zr-based copper alloy plate. The copper alloy plate contains 0.05% to 0.2% by mass of Zr and a remainder including Cu and unavoidable impurities, and the average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction pattern system is 1.5° to 1.8°, the R/t ratio is 0.1 to 0.6 wherein R represents the minimum bending radius which does not cause a crack and t represents the thickness of the plate in a W bending test, and the bending elastic limit is 420 N/mm2 to 520 N/mm2.

Abstract: Substrates suitable for mirrors used at wavelengths in the EUV wavelength range have substrates (1) including a base body (2) made of a precipitation-hardened alloy, of an intermetallic phase of an alloy system, of a particulate composite or of an alloy having a composition which, in the phase diagram of the corresponding alloy system, lies in a region which is bounded by phase stability lines. Preferably, the base body (2) is made of a precipitation-hardened copper or aluminum alloy. A highly reflective layer (6) is preferably provided on a polishing layer (3) of the substrate (1) of the EUV mirror (5).

Abstract: The present invention relates to a Cu—Co—Si—Zr alloy material which contains 1.0-2.5 wt % of Co, 0.2-0.7 wt % of Si and 0.001-0.5 wt % of Zr with the elemental ratio Co/Si being 3.5-5.0. The Cu—Co—Si—Zr alloy material contains second phase particles having a diameter of 0.20 ?m or more but less than 1.00 ?m at a density of 3,000-500,000 particles/mm2, and has a crystal grain size of 10 ?m or less, an electrical conductivity of 60% IACS or more and good bending workability. The alloy material can be produced by setting the temperature of heating that is carried out after casting and before a solution heat treatment to a temperature that is higher than the later-described solution heat treatment temperature by 45° C. or more, by setting the cooling rate from the start temperature of hot rolling to 600° C. to 100° C./min or less, and by selecting the solution heat treatment temperature from (50× Co wt %+775)° C. to (50× Co wt %+825)° C. (inclusive).

Abstract: In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processibility. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.

Abstract: A Cu—Co—Si-based alloy that has even mechanical properties and that is provided with favorable mechanical and electrical properties as a copper alloy for an electronic material is provided. The copper alloy for an electronic material comprises 0.5% by mass to 3.0% by mass of Co, 0.1% by mass to 1.0% by mass of Si, and the balance Cu with inevitable impurities. An average grain size is in the range of 3 ?m to 15 ?m and an average difference between a maximum grain size and a minimum grain size in every observation field of 0.05 mm2 is 5 ?m or less.

Abstract: A Cu—Co—Si alloy having an improved balance between electrical conductivity and strength is provided. Disclosed is a copper alloy for electronic materials, which contains 0.5% to 4.0% by mass of Co and 0.1% to 1.2% by mass of Si, with the balance being Cu and unavoidable impurities, and in which the mass % ratio of Co and Si (Co/Si) is 3.5?Co/Si?5.5, an area ratio of discontinuous precipitation (DP) cells is 5% or less, and an average value of a maximum width of discontinuous precipitation (DP) cells is 2 ?m or less.

Abstract: The present invention provides a Cu—Co—Si system alloy sheet, being suitable for use in a variety of electronic device components, in particular, having excellent uniform adhesive property for plate. The copper alloy sheet for electronic materials, contains 0.5 to 3.0 mass % Co, 0.1 to 1.0 mass % Si, the balance being Cu and unavoidable impurities, wherein an average grain size in the center part of the sheet thickness is 20 ?m or less, and the number of the crystal grain, being tangent to a surface of the sheet and having 45 ?m or more of the length of major axis, is 5 or less in the area of 1 mm in a rolling direction.

Abstract: A copper alloy material suitable for materials for electronic and electrical equipments such as movable connectors having excellent bending workability and being able to show high electrical conductivity was achieved by a Cu—Co—Si alloy material containing 1.5 to 2.5 wt % of Co and 0.3 to 0.7 wt % of Si, having a Co/Si element ratio of 3.5 to 5.0, containing 3,000 to 150,000 second phase particles per mm2 having diameters of from 0.20 ?m or more to less than 1.00 ?m, having a grain size of 10 ?m or less, an electrical conductivity of 60% IACS or more, and good bending workability. The above alloy material contains 10 to 1,000 second phase particles per mm2 having diameters of from 1.00 to 5.00 ?m, the 0.2% yield strength may be 600 MPa or more, the temperature of hot heating performed after casting and before solution treatment is a temperature that is 45° C. or more higher than the solution treatment temperature selected below, the cooling rate from the temperature at the start of hot rolling to 600° C.

Abstract: A copper alloy sheet material, having an R value of 1 or greater, which is defined by: R=([BR]+[RDW]+[W])/([C]+[S]+[B]) wherein [BR], [RDW], [W], [C], [S], and [B] represent an area ratio of crystal texture orientation component of BR orientation {3 6 2}<8 5 3>, RD-rotated-cube orientation {0 1 2}<1 0 0>, cube orientation {1 0 0}<0 0 1>, copper orientation {1 2 1}<1 1 1>, S-orientation {2 3 1}<3 4 6>, and brass orientation {1 1 0}<1 1 2>, respectively, in crystal orientation analysis in an EBSD (electron back scatter diffraction) analysis, and having a proof stress of 500 MPa or greater, and an electrical conductivity of 30%IACS or higher; and a production method of the same.

Abstract: A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200}Cu plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle ?, the normalized intensity being obtained during a ? scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle ? in a range of 40° to 60° to a maximum value B of the normalized intensity with angle ? in a range of 80° to 90° is equal to or greater than 4; and when the normalized intensity increases with increasing angle ? in a range of 25° to 45°, there is essentially no area in which the normalized intensity increases stepwise.

Abstract: The present invention provides Cu—Co—Si system alloys that have desirable mechanical and electrical characteristics as a copper alloy for electronic materials, and have uniform mechanical characteristics. The copper alloys for electronic materials contain 0.5 to 4.0 mass % Co, 0.1 to 1.2 mass % Si, and the balance being Cu and unavoidable impurities. An average grain size is 15 to 30 ?m and an average difference between maximum grain size and minimum grain size in every observation field of 0.5 mm2 is not more than 10 ?m.

Abstract: Provided is a Cu—Ti-based copper alloy sheet material that satisfies all the requirements of high strength, excellent bending workability and stress relaxation resistance and has excellent sprig-back resistance. The copper alloy sheet material has a composition containing, by mass, from 1.0 to 5.0% of Ti, and optionally containing at least one of at most 0.5% of Fe, at most 1.0% of Co and at most 1.5% of Ni, and further optionally containing at least one of Sn, Zn, Mg, Zr, Al, Si, P, B, Cr, Mn and V in an amount within a suitable range, with the balance of Cu and inevitable impurities, and having a crystal orientation satisfying the following expression (1) and preferably also satisfying the following expression (2). The mean crystal grain size of the material is controlled to be from 10 to 60 ?m. I{420}/I0{420}>1.0??(1) I{220}/I0{220}?3.

Abstract: A copper alloy material for an electric/electronic part, having a composition comprising Co 0.5 to 2.0 mass % and Si 0.1 to 0.5 mass %, with the balance of Cu and inevitable impurities, in which a copper alloy of a matrix has a grain size of 3 to 35 ?m, a precipitate composed of Co and Si has a particle size of 5 to 50 nm, the precipitate has a density of 1×108 to 1×1010 number/mm2, and the copper alloy material has a tensile strength of 550 MPa and an electrical conductivity of 50% IACS or more.

Abstract: This invention discloses novel nanocomposite material structures which are strong, highly conductive, and fatigue-resistant. It also discloses novel fabrication techniques to obtain such structures. The new nanocomposite materials comprise a high-conductivity base metal, such as copper, incorporating high-conductivity dispersoid particles that simultaneously minimize field enhancements, maintain good thermal conductivity, and enhance mechanical strength. The use of metal nanoparticles with electrical conductivity comparable to that of the base automatically removes the regions of higher RF field and enhanced current density. Additionally, conductive nanoparticles will reduce the surface's sensitivity to arc or sputtering damage. If the surface is sputtered away to uncover the nanoparticles, their properties will not be dramatically different from the base surface.

Abstract: It is an object to provide an inexpensive alloy for heat dissipation having a small thermal expansion coefficient as known composite materials, a large thermal conductivity as pure copper, and excellent machinability and a method for manufacturing the alloy. In particular, since various shapes are required of the alloy for heat dissipation, a manufacturing method by using a powder metallurgy method capable of supplying alloys for heat dissipation, the manufacturing costs of which are low and which take on various shapes, is provided besides the known melting method. The alloy according to the present invention is a Cu—Cr alloy, which is composed of 0.3 percent by mass or more, and 80 percent by mass or less of Cr and the remainder of Cu and incidental impurities and which has a structure in which particulate Cr phases having a major axis of 100 nm or less and an aspect ratio of less than 10 are precipitated at a density of 20 particles/?m2 in a Cu matrix except Cr phases of more than 100 nm.

Abstract: An copper alloy material for electric/electronic components containing Co by 0.2 to 2 mass % and Si by 0.05 to 0.5 mass % and having a remaining component composed of Cu and unavoidable impurities, characterized in that its grain size is 3 to 35 ?m and size of precipitate containing the both of Co and Si is 5 to 50 nm, electric conductivity is 50% IACS or more, tensile strength is 500 MPa or more and bending workability (R/t) is 2 or less.

Abstract: An electrodeposited copper foil with low surface roughness having a surface roughness Rz not higher than 2.5 ?m and an elongation percentage not smaller than 6% at 180° C. in which tensile strength at 25° C. measured within 20 min of the point in time of ending electrodeposition is not higher than 500 MPa and the lowering rate of tensile strength at 25° C. measured within 300 min of the point in time of ending electrodeposition is not higher than 10%. The electrodeposited copper foil with low surface roughness is produced by a process employing aqueous solution of sulfuric acid-copper sulfate as electrolyte and conducting a DC current between an insoluble anode of titanium coated with a platinum metal element or its oxide element and a titanium cathode drum facing the anode, wherein the electrolyte contains hydroxyethylcellulose, polyethyleneimine, a sulfonate of active organic sulfur compound, acetylene glycol and chlorine ions.

Abstract: A copper alloy material according to the present invention is characterized in that the copper alloy material includes: an element X between 0.1% and 4% by mass, in which the element X represents one transition element or not less than two elements selected from Ni, Fe, Co and Cr; an element Y between 0.01% and 3% by mass, in which the element Y represents one element or not less than two elements selected from Ti, Si, Zr and Hf; and a remaining portion to be comprised of copper and an unavoidable impurity, wherein the copper alloy material has an electrical conductivity of not less than 50% IACS, an yield strength of not less than 600 MPa, and a stress relaxation rate of not higher than 20% as to be measured after the same is maintained for 1000 hours at a state under applying a stress of 80% of the yield strength.

Abstract: A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 ?m and (maximum crystal grain size?minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I0{420}>1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I0{420}, respectively.

Abstract: An apparatus for manufacturing wire comprising: a wire delivering equipment, a wire winding equipment, and an annealing while running equipment installed between the wire delivering equipment and the wire winding equipment, the age-precipitation copper alloy wire being passed in such manner that the wire turns around a plurality of times along a running route in the annealing while running equipment. The current applying equipment to raise a temperature of the age-precipitation copper alloy wire by generated Joule heat may be installed at upstream side of the annealing while running equipment. Another current applying equipment for solution treatment may be installed in tandem at upstream side of the annealing while running equipment. In place of the annealing while running equipment, a current applying equipment may be connected in tandem for age-treatment. By using those equipments, age-precipitation copper alloy wire having the diameter of from 0.03 mm to 3 mm may be obtained.

Abstract: A method of producing a copper alloy wire rod, containing: a casting step for obtaining an ingot by pouring molten copper of a precipitation strengthening copper alloy into a belt-&-wheel-type or twin-belt-type movable mold; and a rolling step for rolling the ingot obtained by the casting step, which steps are continuously performed, wherein an intermediate material of the copper alloy wire rod in the mid course of the rolling step or immediately after the rolling step is quenched.

Abstract: The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability.

Abstract: It is an object to provide an inexpensive alloy for heat dissipation having a small thermal expansion coefficient as known composite materials, a large thermal conductivity as pure copper, and excellent machinability and a method for manufacturing the alloy. In particular, since various shapes are required of the alloy for heat dissipation, a manufacturing method by using a powder metallurgy method capable of supplying alloys for heat dissipation, the manufacturing costs of which are low and which take on various shapes, is provided besides the known melting method. The alloy according to the present invention is a Cu—Cr alloy, which is composed of 0.3 percent by mass or more, and 80 percent by mass or less of Cr and the remainder of Cu and incidental impurities and which has a structure in which particulate Cr phases having a major axis of 100 nm or less and an aspect ratio of less than 10 are precipitated at a density of 20 particles/?m2 in a Cu matrix except Cr phases of 100 nm or more.

Abstract: An age-hardenable copper alloy made of 1.2 to 2.7% cobalt, which is able to be partially replaced by nickel, 0.3 to 0.7% beryllium, 0.01 to 0.5% zirconium, optionally 0.005 to 0.1% magnesium and/or iron and in some instances up to a maximum of 0.15% of at least one element from the group including niobium, tantalum, vanadium, hafnium, chromium, manganese, titanium and cerium. The remainder is copper and includes production-conditioned impurities and usual processing-additives. This copper alloy is used as the material for producing mold blocks for the side dams of continuous strip-casting installations.

Abstract: Superior bendability in a copper alloy and further strength improvement ensures characteristics which are sufficiently superior in view of essential qualities of strength of titanium-copper. 2.0 to 4.0 mass % of Ti, 0.01 to 0.50 mass % of one or more than one kind of element from among Fe, Co, Ni, Cr, V, Zr, B, and P as the third element group are contained, and not less than 50% of the total content of these elements is made to exist as second-phase particles.

Abstract: The aim of the invention is to provide a metal strip for epitaxial coating with a biaxially textured layer, this metal strip, however, being able to be produced in an uncomplicated manner and having a high tensile strength, low magnetic losses and/or a high electrical conductivity. According to the invention, the metal strip is comprised of Nj, Cu, Ag or alloys thereof all serving as basic material, whereby the one-layer metal strip and, in the instance of a multilayer metal strip, at least one of its layers contains 10 nm to 5 ?m large, strength-increasing dispersoids comprised of carbides, borides, oxides and/or nitrides with a volume proportion ranging from 0.1 to 5%. In the instance of a multilayer metal strip, the layers form a composite, and at least one of the layers does not contain any dispersoids and has a biaxial texture. For the production, a starting material is used, which is comprised of Ni, Cu, Ag or of alloys thereof all serving as basic material and which contains 0.

Abstract: The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy comprises inclusion particles based on any one of Zr and a Cu—Zr alloy having a diameter of 0.1 &mgr;m or more, and the proportion of the inclusion particles containing 10% or more of sulfur as one of the inevitable impurities is one particle/mm2.

Abstract: The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: nickel (Ni) 0.5-3.5% silicon (Si) 0.08-1.0%  tin (Sn) 0.1-1.0% zinc (Zn) 0.1-1.0% zirconium (Zr) 0.005-0.2%  silver (Ag) 0.02- 0.5%  The remainder is copper and includes impurities caused by smelting.

Abstract: A titanium copper alloy having excellent strength and bendability comprising 1.0 to 4.5% by mass of Ti, the balance of copper and inevitable impurities, characterized in that; diameters of the intermetallic compound particles consisting of Cu and Ti precipitated in the alloy are 3 &mgr;m or less; the average number of the intermetallic compound particles having the diameters of 0.2 to 3 &mgr;m is 700 or less per a cross-sectional area of 1000 &mgr;m2 in a transverse direction to a rolling direction; the average grain size measured in the above cross-sectional area is 10 &mgr;m or less; and a tensile strength is 890 MPa or more.

Abstract: An age-hardenable copper alloy made of 1.2 to 2.7% cobalt, which is able to be partially replaced by nickel, 0.3 to 0.7% beryllium, 0.01 to 0.5% zirconium, optionally 0.005 to 0.1% magnesium and/or iron and in some instances up to a maximum of 0.15% of at least one element from the group including niobium, tantalum, vanadium, hafnium, chromium, manganese, titanium and cerium. The remainder is copper and includes production-conditioned impurities and usual processing additives. This copper alloy is used as the material for producing mold blocks for the side dams of continuous strip-casting installations.