Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).

Abstract: In accordance with one aspect of the present invention is the metamorphic processing of a beryllium-copper alloy. The alloy is (i) thermodynamically treated for greater than about 10 hours at a temperature generally within a range of 900° to 1500° F., (ii) warm worked at greater than about 30% strain at a strain rate {acute over (&egr;)} greater than or equal to about (2.210×107)/exp[(2.873×104)/(T+459.4°)], where T is in ° F., at the temperature, (iii) annealed at a temperature between 1375° and 1500° F. for about 15 minutes to about 3 hours, (iv) water quenched, and (v) thermal hardened at a temperature generally within a range of about 480° and 660° F. Grain size is reduced with concomitant improvements in ultimate strength, toughness, total elongation, % reduction in area and ultrasonic inspectability.

Abstract: Copper fine powder has an electrical resistance in its powdery state of not more than 1×10−3&OHgr;.cm; a BET specific surface area ranging from 0.15 to 0.3 m2/g; a tap density of not less than 4.5 g/cc; a product of the tap density and the particle size, of not less than 13, the particle size being calculated from the specific surface area and a particle size distribution observed in the microtrack measurement as expressed in terms of D50 and D90 ranging from 4 to 7 &mgr;m and 9 to 11 &mgr;m, respectively; and a weight loss through hydrogen-reduction of not more than 0.30%. The copper fine powder is prepared by adding an alkali hydroxide to an aqueous copper salt solution containing divalent copper ions maintained at not less than 55° C. in an amount of not less than the chemical equivalent to form cupric oxide; then gradually adding a reducing sugar to the reaction system while maintaining the temperature of the system to not less than 55° C.

Abstract: A corrosion-resistant copper material has a surface layer of a copper alloy containing 10-50 at % (i.e. % by atom) of silicon and of 10-1,000 .ANG. thick. It is produced simply by annealing a copper material containing 0.01-5 at % of silicon at 100-600.degree. C. in a hydrogen-containing gas. Because of its excellent resistance to surface corrosion due to heat and aging, the resulting copper material lends itself well to automotive and electrical applications requiring heat resistance, and is also suitable for use in electrical wire and in leadframes for semiconductor devices.

Abstract: A copper alloy having improved resistance to stress relaxation contains controlled additions of iron, phosphorous and magnesium. Free magnesium, in solid solution with the copper, increases the alloy's resistance to stress relaxation. Copper alloys of the invention retain at least 70% of the initial stress following exposure to a temperature of 105.degree. C. for 3000 hours, making the alloys particulary useful for electrical connector components.

Abstract: A hardenable copper alloy, suitable as a material for manufacturing casting rolls and casting wheels that are subjected to changing temperature stresses, is disclosed. The hardenable copper alloy comprises 1.0 to 2.6% nickel, 0.1 to 0.45% beryllium, and the remainder of copper, inclusive of impurities resulting from manufacturing and the customary processing additives, and has a Brinell hardness of at least 200 and an electric conductivity of over 38 m/.OMEGA. mm.sup.2.

Abstract: For bonding pure beryllium to a copper alloy, a functionally gradient beryllium-copper material comprising a single layer or multiple layers having a thickness of 0.3-3.0 mm and containing at least 50 atomic % of Cu is inserted between the pure beryllium and the copper alloy to prevent bonding strength from degrading in the bonding process or during operation of a nuclear fusion reactor, by effectively mitigating formation of brittle intermetallic compounds and generation of thermal stress at the bonding interface.

Abstract: Copper trolley wire consisting essentially of at least 99.90% copper and at most 0.10% of a metal selected from the group consisting of silver, cadmium, tellurium, titanium, magnesium, manganese, chromium, zirconium, tin and combinations thereof, has a minimum tensile strength well exceeding that listed in ASTM Standard B47-95a for copper trolley wire. The copper trolley wire has a uniform fine grain size. The copper trolley wire is manufactured using a process of casting a copper rod of the appropriate composition, hot working or "conforming" the cast rod to reduce its diameter, and then cold working it to form the desired wire by drawing it through one or more dies. Preferably, no annealing step is used.

Abstract: High strength, high conductivity copper alloy wire and a cable therefrom and method for manufacturing same, wherein the copper alloy contains chromium from 0.15-1.30%, zirconium from 0.01-0.15% and the balance essentially copper. The alloy wire is heat treated, cold worked to an intermediate gage, heat treated, cold worked to final gage, and finally heat treated. A major portion of the chromium and zirconium are present as precipitated, sub-micron sized particles in a copper matrix. In addition, the wire has a gage of 0.010 inch or less and a tensile strength of at least 55% ksi, an electrical conductivity of at least 85% IACS, and a minimum elongation of 6% in 10".

Abstract: A copper alloy achieves high electrical conductivity, in excess of 70% IACS; high strength, ultimate tensile strength in excess of 75 ksi; good surface cosmetics; and good stampability, above 25% break, by controlled additions of magnesium, iron and phosphorous. There is a critical iron content to achieve both good stampability and high electrical conductivity and a critical phosphorous content to achieve high strength and relatively small metal phosphide particles. There is further, a critical relationship between the amount of iron and phosphorous. An additions of magnesium, in amounts of more than 0.03%, broadens the effective ratio of iron to phosphorous, widening the composition box of the alloys of the invention.

Abstract: A sintered friction material includes a copper alloy base and hard particles. The copper alloy base includes copper and at least one of, and preferably both, Zn and Ni within a total range of 5 to 40 wt % of the copper alloy base. The hard particles are uniformly dispersed in a matrix formed by the original composite copper alloy powder constituting the base, in a content amount j within a range of 10 to 30 wt % of the friction material.

Abstract: A biaxially textured article includes a rolled and annealed, biaxially textured substrate of a metal having a face-centered cubic, body-centered cubic, or hexagonal close-packed crystalline structure; and an epitaxial superconductor or other device epitaxially deposited thereon.

Abstract: A contact material for a vacuum valve including, a conductive constituent including at least copper, an arc-proof constituent including at least chromium and an auxiliary constituent including at least one selected from the group consisting of tungsten, molybdenum, tantalum and niobium. The contact material is manufactured by quench solidification of a composite body of the conductive constituent, the arc-proof constituent and the anxiliary constituent.

Abstract: A copper alloy having improved resistance to stress relaxation contains controlled additions of iron, phosphorous and magnesium. Free magnesium, in solid solution with the copper, increases the alloy's resistance to stress relaxation. Copper alloys of the invention retain at least 70% of the initial stress following exposure to a temperature of 105.degree. C. for 3000 hours, making the alloys particularly useful for electrical connector components.

Abstract: This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.

Abstract: The invention relates to a method of manufacturing a copper-nickel-silicon alloy with a composition Cu (balance), Ni 1.5-5.5%, Si 0.2-1.05, Fe 0-0.5% and Mg 0-0.1% (all in percent by weight), and use of the alloy for pressure-englazable casings. The method permits an alloy with a very high elastic limit with very good conductivity and good cold reformability and differs from the conventional method of manufacturing such alloys by heating to about 950.degree. C. and fairly rapid cooling after a preceding cold rolling operation. An improvement in the properties can be achieved by ageing of the alloy at 300.degree. C. to 600.degree. C. for several hours.

Abstract: There is provided a copper alloy sheet for forming a connector, having a chemical composition consisting essentially of:Mg: 0.3-2% by weight;P: 0.001-0.02% by weight;C: 0.0002-0.0013% by weight;O: 0.0002-0.001% by weight; andCu and inevitable impurities: the balance. The copper alloy sheet has a structure that fine particles of oxides including Mg oxide having a particle size of not more than 3 .mu.m are evenly dispersed in a matrix of the copper alloy sheet. The copper alloy sheet is excellent not only in tensile strength, elongation, electric conductivity and spring limit value before forming, but also in spring limit value after forming, and high-temperature creep strength.

Abstract: There is provided a machinable .alpha.+.beta. brass containing bismuth and phosphorous. By maintaining the phosphorous content within a critical range, the alloy exhibits good elevated temperature tensile elongation in the temperature range of 100.degree. C.-350.degree. C. without a decrease in machinability due to phosphide formation. In preferred embodiments, the alloy further contains a tin addition for enhanced corrosion resistance. The combination of tin and phosphorous provides enhanced corrosion resistance to the alloy than could be predicted from either addition alone.

Abstract: There are disclosed processing methods to improve the properties of copper base alloys containing chromium and zirconium. One method of processing results in a copper alloy having high strength and high electrical conductivity. A second method of processing results in a copper alloy with even higher strength and a minimal reduction in electrical conductivity. While a third method of processing results in a copper alloy having improved bend formability.

Abstract: Spray cast copper-manganese-zirconium alloys are disclosed. In one embodiment, the alloy is spray cast in nitrogen and contains from about 1 ppm to about 20 ppm of dissolved nitrogen. In a second embodiment, the alloy contains an addition selected from the group consisting of chromium, titanium, erbium and mixtures thereof. The alloys are useful for sound damping as the combination of zirconium and the addition inhibits degradation of the specific damping capacity of the alloy.

Abstract: A method for forming an electrical contact material comprises the steps of melting a mixture of Cu and Cr into a molten alloy, atomizing the molten alloy into fine particles to obtain alloyed particles. Cr particles in the alloyed powder disintegrate to less than 5 .mu.m in mean particle diameter. The alloyed powder is sintered thereafter and a mean particle diameter of chromium in the sintered article is fined in a range of 2 to 20 .mu.m. An electrical contact material is composed of a copper matrix and chromium particles having a mean particle diameter of 2 to 20 .mu.m. The chromium particles are homogeneously dispersed in the copper matrix.

Abstract: A method for forming unsegregated metal oxide-silver composites includes preparing a precursor alloy comprising silver and precursor elements of a desired metal oxide and oxidizing the alloy under conditions of high oxygen activity selected to permit diffusion of oxygen into silver while significantly restricting the diffusion of the precursor elements into silver, such that oxidation of the precursor elements to the metal oxide occurs before diffusion of the metallic elements into silver. Further processing of the metal oxide composite affords an oxide superconducting composite with a highly unsegregated microstructure.

Abstract: Oxidation resistant particles composed of copper and at least one metal having a valence of +2 or +3 and having an intermediate lattice energy for the metal in its hydroxide form. The metal is selected from nickel, cobalt, iron, manganese, cadmium, zinc, tin, magnesium, calcium and chromium. In one embodiment, the phases of copper and at least one metal in the particles are separate and the concentration of the metal is greater near the surface of the particles than inwardly thereof. Process for making the oxidation resistant copper particles includes the steps of dissolving a copper salt and a salt of at least one of the metals in a suitable solvent or diluent; forming primary particles of copper and at least one metal in basic form by mixing a base and the salt solution; separating, washing and drying the primary particles; reducing the primary particles to metallic form; and heat treating the particles in metallic form at an elevated temperature.

Abstract: The invention concerns a process and an apparatus for manufacturing soldering rods with a copper percentage of at least 60 weight-%. An extruder serves to convert a block of the alloy at a temperature between 540.degree. and 680.degree. C. into an individual wire of a maximum diameter of 10 mm. Upon emerging from the extruder, the wire is chilled to a temperature below 250.degree. C. and either intermediately stored or directly further processed. Immediately following a conductive heating to temperature between 200.degree. and 280.degree. C., the wire is fed to a multi-stage reducing mill where it is reduced by rolling in each stage by a maximum of 25% until it has reached its final cross section.

Abstract: Alloy powder which is low in price and is unlikely to be oxidized on the surface, and a dispersion-type conductor using the alloy powder in which electromigration is not likely to occur. Melt of copper and silver is cooled at a high cooling speed of 10.sup.5 .degree. C./s or higher. Alloy powder having a composition expressed by a chemical formula Cu.sub.x Ag.sub.1-x (where 0.80.ltoreq.X.ltoreq.0.99) is obtained. Also, a dispersion-type conductor is produced by dispersing 100 parts by weight of the alloy powder in between 5-100 parts by weight of a binder. Thus, the low-priced alloy powder and the dispersion-type conductor of high quality and high reliability can be obtained.

Abstract: A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.

Abstract: A dispersion-strengthened copper alloy is disclosed having an exceptional combination of strength, ductility, and thermal conductivity. The copper alloy comprises: copper, 0.01 to 2.0 weight % boron and 0.1 to 6.0 weight % cobalt, and cobalt-boride disperoids that range in size between 0.025 and 0.25 microns in diameter. A copper alloy is made by rapid solidification of the melt into a powder. Strong, thermally conductive articles can be made by compacting the powder at temperatures below the melting temperature of the copper alloy.

Abstract: A high-strength and high-conductivity copper alloy sheet is provided, which consists of a composition of from 6 to 24 wt. % Ag, and Cu and impurities as the balance, and has a sheet structure in which Cu solid solution and Ag solid solution are streched into a fiber shape.

Abstract: A process for producing the beryllium-copper alloy comprises the steps of casing a beryllium-copper alloy composed essentially of 1.00 to 2.00% by weight of Be, 0.18 to 0.35% by weight of Co, and the balance being Cu, rolling the cast beryllium-copper alloy, annealing the alloy at 500.degree. to 800.degree. C. for 2 to 10 hours, then cold rolling the annealed alloy at a reduction rate of not less than 40%, annealing the cold rolled alloy again at 500.degree. to 800.degree. C. for 2 to 10 hours, thereafter cold rolling the alloy to a desired thickness, and subjecting the annealed alloy to a final solid solution treatment. The beryllium-copper alloy obtained by this producing process is also disclosed, in which an average grain size is not more than 20 .mu.m, and a natural logarithm of a coefficient of variation of the grain size is not more than 0.25.

Abstract: A copper based alloy and method for the manufacture thereof having improved properties. The copper alloy contains iron and zirconium with the iron being present as a uniformly dispersed second phase of the dispersoids. The dispersoids have a mean particle size of from about 0.1 micron to about 1.0 micron. The iron is present in the amount of from about 0.25 to about 5.0% by weight.

Abstract: There is disclosed a copper base alloy which contains specified additions of chromium, zirconium, cobalt and/or iron, and titanium as well as methods for the processing of the copper alloy. One method of processing results in a copper alloy having high strength and high electrical conductivity. A second method of processing results in a copper alloy with even higher strength and a minimal reduction in electrical conductivity.

Abstract: An aluminum-silicon alloy having excellent mechanical characteristics is formed by pressure casting of a molten material concurrently with modifying thereof by a flux which includes at least one element selected from the group of Na, Sb, Sr, and/or Ca, allowing a substantially fine grain of silicon to be dispersed in the alloy. Alternatively, the step of the pressure casting is replacable by substantial uniform cooling of the molten material regardless of a thickness thereof by cooling a die having a mold formed of a Cu-W type material, which mold corresponds to a substantially thick portion of the alloy.

Abstract: A method for making a non-magnetic alloy structure. Alloy samples are for by taking three volumes V1 of host matrix material having a first susceptibility X1 and adding to each of them one of three volumes V2, V3 and V4 of a magnetically compensating material having a second opposite susceptibility X2. The volume V3 is chosen so that (V1)(X1) =(V3)(X2). The volumes V2 and V4 are chosen so that V3/V1-V2/V1 is equal to 0.299 percent and V4/V1-V3/V1 is equal to 0.531 percent. The magnetizations of the alloy samples are determined and ploted as a function of their volume percentages. A volume percentage V5/V1 is determined from the plot, such that the volume percentage, V5/V1, has zero magnetization. This volume percentage V5/V1 is used to make nonmagnetic alloy structures having this volume percentage V5/V1.

Abstract: Copper bearing alloy comprises more than 4% by weight and up to 35% by weight of Bi, 0.2 to less than 1.5% by weight of Pb and the rest of Cu. This considerably improves the erosion resistance while maintaining the excellent seizure resistance and fatigue strength.

Abstract: A copper alloy composition comprising 100 parts by weight of powder of copper alloy represented by the general formula Ag.sub.x Cu.sub.y (wherein x and y are atomic ratio values; 0.001.ltoreq..times..ltoreq.0.999, 0.001.ltoreq.y.ltoreq.0.999, x+y=1), 5 to 200 parts by weight of one or more organic binders and 0.01 to 100 parts by weight of an additive capable of removing copper oxide; and a paste for screen printing, electromagnetic shielding, an electrically conductive additive, a paste for electrode and a paste for through hole, which are obtained by using said composition.

Abstract: Electric and electronic parts, including leadframes made of a copper-based alloy having high strength and high electric conductivity said copper-based alloy is produced by a process which comprises the steps of preparing a copper-based alloy consisting essentially of 0.01-3.0 wt % Co and 0.01-0.5 wt % P with the balance being Cu and incidental impurities, quenching said alloy from a temperature not lower than 750.degree. C. down to 450.degree. C. and below at a cooling rate of at least 1.degree. C./sec, heat treating the quenched alloy at a temperature of 480.degree.-600.degree. C. for 30-600 minutes, cold working said alloy for a working ratio of 20-80%, further heat treating the alloy at a temperature of 440.degree.-470.degree. C. for 30-600 minutes, and subsequently performing cold working for a working ratio of at least 50% and heat treatment at 380.degree. C. and below. The electric and electronic parts preferably contain a plurality of conductive leads.

Abstract: Lead inclusion in copper-containing wrought alloys is coming into disfavor due to health and environmental considerations. Machinability, as well as retention of workability properties, associated with lead inclusion are assured by bismuth together with a modifying element, phosphorous, indium or tin, with such modifying element minimizes the workability-precluding embrittlement otherwise associated with bismuth. Fabrication of product dependent upon properties of the large variety of lead-containing alloys is so permitted by use of lead-free material.

Abstract: Copper-based alloys suitable for use as materials in fabricating electric and electronic parts as typified by leadframes and having high strength and high electric conductivity can be produced by a process which comprises the steps of preparing a copper-based alloy consisting essentially of 0.01- 3.0 wt % Co and 0.01- 0.5 wt % P with the balance being Cu and incidental impurities, quenching said alloy from a temperature not lower than 750.degree. C. down to 450.degree. C. and below at a cooling rate of at least 1.degree. C./sec, heat treating the quenched alloy at a temperature of 480.degree.-600.degree. C. for 30-600 minutes, cold working said alloy for a working ratio of 20-80%, further heat treating the alloy at a temperature of 440.degree.-470.degree. C. for 30-600 minutes, and subsequently performing cold working for a working ratio of at least 50% and heat treatment at 380.degree. C. and below.

Abstract: A method of hot forming beryllium-copper alloy including from 1.60 to 2.00% by weight of Be, from 0.2 to 0.35% by weight of Co and the balance being essentially Cu, under specified conditions of a working temperature, a working rate, and an amount of work strain to produce a hot formed product of an equiaxed grain structure having a uniform stable grain size.

Abstract: A copper alloy wire has a composition composed of no less than 0.01% by weight of Ag and balance Cu and unavoidable impurities. The copper alloy wire has been prepared by drawing a wire stock having the composition at a reduction ratio of no lower than 40% and subjecting the wire stock to heat treatment for half annealing to have a tensile strength of no lower than 27 kg.multidot.f/mm.sup.2 and an elongateion of 5%. An insulated elecric wire includes the copper alloy wire as a conductor and an insulation layer covering the wire. Also, a multiple core parallel bonded wire includes two or more such insulated electric wires bonded parallel to each other.

Abstract: A metal liner for a shaped charge device having a ductile metal matrix and a discrete second phase is provided. The allow composition is selected so the second phase is molten when the liner is accelerated following detonation. The molten phase reduces the tensile strength of the matrix so that the liner slug is pulverized on striking a well casing. The slug does not penetrate the hole perforated in the well casing by the liner jet and oil flow into the well bore is not impeded. The liner is formed by directly casting the desired alloy to the desired shape.

Abstract: An aged copper alloy comprising:0.15-1.0 wt % Fe,0.05-0.3 wt % P, and0.05-0.3 wt % Mg and 0.05-0.3 wt % Pbwith the balance being essentially composed of Cu.

Abstract: A process for producing a Cu-Fe-Co-Ti alloy useful as conductor elements in the electronics and connector industries. The alloy is produced in the form of a bath having a Ti/Fe+Co ratio between 0.3 and 1 and a Co/Fe ratio between 0.10 and 0.90. The molten alloy bath is deoxidized with boron, cast, homogenized, cold drawn, and subjected to a precipitation heat treatment at a temperature lower, by at most 80.degree. C., than a temperature TM leading to the maximum electric conductivity.

Abstract: An electrically conductive composite material is formed by dispersing in a matrix metal the other metal which is not solid soluble with the matrix metal. The other metal is finely divided to an extent of not excessively lowering the conductivity and is mixed in the matrix metal in a particle amount with which respective particles keep a mutual distance effective to strengthen the composite material, whereby the material is sufficiently improved in the mechanical strength and wear resistance and remarkably reduced in the high temperature deformation. Such conductive composite material can be obtained through a melt atomization.

Abstract: A method for the manufacture of copper base alloys having improved resistance to thermally induced softening is provided. The alloy composition is selected so that the alloy undergoes either a peritectic or eutectic transformation during cooling. The solidification rate is controlled so that the second phase forms as a uniform dispersion of a relatively small dispersoid. The dispersoid inhibits recrystallization resulting in an alloy less susceptible to softening at elevated temperatures.

Abstract: A fine copper wire for electronic instruments is disclosed which comprises 0.05 to 10 ppm in total amount of either one or not less than two kinds of Ti, Zr, V, Hf, Cr, Ca, Mg, Y and rare-earth elements, 1 to 30 ppm of oxygen and the remainder of Cu. A method of manufacturing therefor is described wherein the hot rolling is given to the ingot obtained by melting and casting in a nonoxidative atmosphere or in vacuum, then stretch processing and at least once or more times of intermediate annealing are repeated to finish to a fixed diameter of wire, and thereafter annealing is carried out under nonoxidative or reducible atmosphere to obtain desired mechanical characteristics.

Abstract: An electric conductor for video and audio appliances and a method of manufacturing the electric conductor. The electric conductor is constituted by a linear member made of copper or silver, which is composed of an assembly of segments each regarded substantially as single crystal having a length not less than twice a diameter of the single crystal. The method includes the steps of curing molten copper or molten silver into an ingot in a single direction along a longitudinal direction of the ingot and subjecting the ingot to cold working or warm working.

Abstract: Copper rod has an improved surface smoothness and substantially no surface oxides, which rod is suitable for drawing or rolling into wire. The copper rod is produced by a process which comprises the steps of forming a bath of molten pure copper, casting the molten copper into a cast bar, conditioning the bar for hot-rolling, hot-rolling the bar to form a hot-rolled rod, cooling the hot-rolled rod and chemically shaving and pickling the hot-rolled rod. The chemical shaving and pickling step is performed with a solution containing controlled concentrations of sulfuric acid and hydrogen peroxide. Both the solution and the rod are maintained at elevated temperatures and the duration of the reaction is controlled. The interrelated process variables are regulated so that substantially all of the surface oxides and a desired amount of copper are removed from the surface of the hot-rolled rod.

Abstract: An electrically conductive composite material is formed by dispersing in a matrix metal another metal which is insoluble or slightly soluble with the matrix metal. The other metal is finely divided to an extent of not excessively lowering the conductivity and is mixed in the matrix metal in a particle amount such that respective particles keep a mutual distance effective to strengthen the composite material. The material is thereby sufficiently improved in the mechanical strength and wear resistance and remarkably reduced in high temperature deformation. Such conductive composite material can be obtained through a melt atomization.

Abstract: The invention concerns a metal alloy with large lattice spacings (>than 1 nm), and consisting essentially of, by weight: at least one element selected from a group A consisting of Al, Zn and Cu, total group A elements being 44-92%; at least one element selected from a group B consisting of Ag, Ga and Au, total group B elements being 0-46%, with % group A+group B=88-92%, and ##EQU1## a group C element which is Li in an amount of 7.2-12%; at least one element selected from a group D consisting of Mg, K, Na, and Ca, total group D elements being 0-12%, with % group C+% group D=8-12%, ##EQU2## and % group A+% group B+% group C+% group D=100%; said alloy additionally comprising elemental impurities in an amount of less than 1% each and less than 5% total, based on the total weight of the alloy.