Abstract: An improved white manganese bronze alloy containing, in weight percent, about 1.0-3.0 wt % aluminum, about 2.0-4.0 wt % bismuth, about 53-59 wt % copper, about 0.8-2.0 wt % iron, about 11-15 wt % manganese, about 5.0-7.0 wt % nickel, about 1.3-2.5 wt % tin, and about 18-24 wt % zinc, as well as incidental amounts of antimony, lead, phosphorus, silicon and sulfur, which is able to withstand vigorous cleaning and disinfection, and is not subject to galling.

Abstract: A copper alloy which is adapted for use as terminals and connectors, which comprises from 0.1 wt % to less than 0.5 wt % of Ni, from larger than 1.0 wt % to less than 2.5 wt % of Sn, from larger than 1.0 wt % to 15 wt % of Zn, and further comprises from at least one element selected between from 0.0001 wt % to less than 0.05 wt % of P and from 0.0001 wt % to 0.005 wt % of Si, and the balance being Cu and inevitable impurities The alloy has an electrical conductivity of 90% or below relative to a maximum electrical conductivity of an annealed copper alloy and an area ratio of insoluble matters such as precipitates is 5% or below.

Abstract: A copper-tin-titanium alloy which consists of 12 to 20% by weight tin, 0.002 to 1% by weight titanium, remainder copper and usual impurities. It is possible to add further elements. Semifinished products made from the copper alloy according to the invention are preferably produced by thin-strip casting or spray compacting. Due to a particularly advantageous combination of high mechanical strength properties with excellent ductility, combined with good resistance to corrosion, semifinished products made from the copper alloy according to the invention have numerous possible uses.

Abstract: A leadframe of a single frame structure for supporting leads on IC chips. The leadframe is made of a high-strength, high-electroconductivity copper alloy. The copper alloy is produced by preparing an ingot of a copper alloy of 0.05-0.40 wt. % Fe, 0.05-0.40 wt. % Ni, 0.01-0.30 wt. % P, and optionally a total of 0.03-0.50 wt. % of either Sn or Zn or both and a total of 0.05-0.50 wt. % of at least one element of Ag, Co, B, Mn, Cr, Si, Ti and Zr, with the balance being Cu and incidental impurities, heating the ingot to 800 to 950.degree. C. and hot working the ingot to a reduction ratio of 50% or more, quenching the hot worked material from 600.degree. C. or above down to 300.degree. C. or below at a cooling rate of at least 1.degree. C./seconds, heat treating the quenched material at 380 to 520.degree. C. for 60-600 minutes without cold working, and subsequently carrying out cold working and heat treating at 450.degree. C.

Abstract: A corrosion-resistant copper material has a surface layer of a copper alloy containing 10-50 at % (i.e. % by atom) of silicon and of 10-1,000 .ANG. thick. It is produced simply by annealing a copper material containing 0.01-5 at % of silicon at 100-600.degree. C. in a hydrogen-containing gas. Because of its excellent resistance to surface corrosion due to heat and aging, the resulting copper material lends itself well to automotive and electrical applications requiring heat resistance, and is also suitable for use in electrical wire and in leadframes for semiconductor devices.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 0.1 to about 1.5% by weight, phosphorous in an amount from about 0.01 to about 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, zinc in an amount from about 1.0 to about 15% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: A high strength, highly electrically conductive copper-based alloy and method for producing the alloy are provided, with the alloy containing boron in the range of 0.0-2.9 at. %, magnesium in a range of about 2.8-7.6 at. %, tin in a range of about 2.1-4.3 at. %, and the balance copper and unavoidable impurities. The method for producing the high-strength, highly conductive alloy includes solution heat treating or annealing the material to dissolve the solute elements into a solid solution including the copper, rapidly quenching the material to freeze the solute elements in solid solution, and aging the material at a temperature in a range of about 400-475.degree. C. to precipitation harden the alloy material.

Abstract: Bismuth bearing copper-nickel-manganese-zinc corrosion and gall resistant castable alloy, particularly for use in food processing machinery, with the following weight percentage range:Nickel=12-28Manganese=12-28Zinc=12-28Aluminum=0.5-2.00Bismuth=2-6Phosphorus=0-0.3Tin =0-1.5Iron=0-1.

Abstract: High strength, high conductivity copper alloy wire and a cable therefrom and method for manufacturing same, wherein the copper alloy contains chromium from 0.15-1.30%, zirconium from 0.01-0.15% and the balance essentially copper. The alloy wire is heat treated, cold worked to an intermediate gage, heat treated, cold worked to final gage, and finally heat treated. A major portion of the chromium and zirconium are present as precipitated, sub-micron sized particles in a copper matrix. In addition, the wire has a gage of 0.010 inch or less and a tensile strength of at least 55% ksi, an electrical conductivity of at least 85% IACS, and a minimum elongation of 6% in 10".

Abstract: A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be) +(0.40-1.25% Ni)+(0-0.25% Sn)+[(0.06-1% Zr) and/or (0.06-1% Ti)], the balance copper, where the sum of % Zr and % Ti is generally within a range of 0.06% and 1%, the alloy being characterized by improved electrical conductivity, bend formability and stress relaxation resistance without sacrificing strength.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 1.0 to 11.0% by weight, phosphorous in an amount from about 0.01 to 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 1.0 to 11.0% by weight, phosphorous in an amount from about 0.01 to 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: There is provided a phosphor bronze alloy having a grain structure that is refined by the addition of a controlled amount of iron. Direct chill cast alloys containing from 1.5% to 2.5%, by weight tin, from 1.65% to 2.65% iron, from 0.03% to 0.35% phosphorous and the remainder copper and inevitable impurities have an as-cast average crystalline grain size of less than 100 microns and are readily hot worked. When the iron content is too low, the average crystalline grain size increases and the alloy cracks during hot working. When the iron content is too high, iron stringers form, detrimentally impacting both the appearance and properties of a wrought strip.

Abstract: A copper alloy having an improved corrosion resistance in an alcohol-containing medium, which consists essentially of 0.5 to 8 weight percent tin and/or nickel alone or in combination, 0.02 to 0.15 weight percent zirconium, and remainder weight percent copper. The zirconium is dispersed in the copper alloy as precipitates. The copper alloy is suitable for a commutator material used in a DC motor having an improved abrasive resistance.

Abstract: Copper base alloys consisting essentially of 1.0 to 4.0% tin, 0.01 to 0.20% phosphorous, 0.01 to 0.80% iron, 0.1 to 12.0% zinc and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix. The alloy is characterized by an excellent combination of physical properties. The process of the present invention includes homogenizing, rolling, process annealing and stress relief annealing.

Abstract: There is provided a tin brass alloy having a grain structure that is refined by the addition of controlled amounts of both zinc and iron. Direct chill cast alloys containing from 1% to 4%, by weight of tin, from 0.8% to 4% of iron, from an amount effective to enhance iron initiated grain refinement to 20% of zinc and the remainder copper and inevitable impurities are readily hot worked. The zinc addition further increases the strength of the alloy and improves the bend formability in the "good way", perpendicular to the longitudinal axis of a rolled strip.

Abstract: This invention relates to a high strength, high electrical conductivity copper alloy having excellent mechanical and physical properties, including thermal softening resistance, in which precipitate particles are finely dispersed (growth of the precipitate is suppressed), and the production process. The alloy is the precipitation suppressed copper alloy consisted of 0.5.about.4.0 wt % nickel, 0.1.about.1.0 wt % silicon, 0.05.about.0.8 wt % tin (Sn) and balance copper and inevitable impurities, wherein sizes of precipitate particles are below 0.5 .mu.m. The production process includes the steps of melting and casting raw materials, surface machining and cold rolling of the ingot, subjecting the cold rolled ingot to a precipitation process at a temperature ranging 450.about.520 deg. C. for 5.about.12 hours, cold rolling the precipitation processed material, and subjecting the cold rolled material to a tension annealing process at a temperature ranging 350.about.550 deg. C. for below 90 seconds.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 1.0 to 11.0% by weight, phosphorous in an amount from about 0.01 to 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: Reduced-lead yellow brass alloys are disclosed. The alloys comprise copper; zinc; an amount of bismuth effective to enhance castability of the alloys; and an amount of selenium effective to increase machinability of the alloy. Preferably, the alloys further include an amount of antimony effective to inhibit dezincification of the alloys. In a particularly preferred embodiment, an alloy according to the present invention comprises zinc; copper in an amount ranging from about 62.5% to about 64.0% by weight; tin in an amount ranging from about 0.2% to about 0.4% by weight; iron in an amount ranging from about 0.1% to about 0.3% by weight; nickel in an amount ranging from about 0.15% to about 0.25% by weight; aluminum in an amount ranging from about 0.3% to about 0.6% by weight; bismuth in an amount ranging from about 0.8% to about 1.0% by weight; antimony in an amount ranging from about 0.02% to about 0.04% by weight; and selenium in an amount ranging from about 0.05% to about 0.25% by weight.

Abstract: There is provided a machinable .alpha.+.beta. brass containing bismuth and phosphorous. By maintaining the phosphorous content within a critical range, the alloy exhibits good elevated temperature tensile elongation in the temperature range of 100.degree. C.-350.degree. C. without a decrease in machinability due to phosphide formation. In preferred embodiments, the alloy further contains a tin addition for enhanced corrosion resistance. The combination of tin and phosphorous provides enhanced corrosion resistance to the alloy than could be predicted from either addition alone.

Abstract: A copper alloy for use in an electrical and electronic parts contains Fe of 1.8-2.0 weight %, P of 0.025-0.040 weight %, Zn of 1.7-1.9 weight %, Sn of 0.40-1.0 weight %, and Ca of 0.0001-0.01 weight %, the balance being Cu and inevitable impurities. Further the copper alloy may contain one kind or two kinds of the elements selected from the group of Cr of 0.001-0.01 weight % and Mg of 0.001-0.01 weight %, by 0.001-0.01 weight % at a total amount. This copper alloy for use in electrical and electronic parts can dissolve the prior problem that cracking is apt to occur on the ingot during heating on the hot working process or during hot working, and can prevent a short-circuit due to the migration phenomenon of copper which is apt to occur with the high density integration of the electrical and electronic parts made of copper alloy, and further can improve the tool service life (wear resistance) of the die and can decrease the producing cost thereof.

Abstract: A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, and from 3 to 10 wt. % of Sn and the remainder being Cu and unavoidable elements.

Abstract: A copper based alloy for use as a material for electrical and electronic parts has a chemical composition by weight, of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to 0.8% Si, 0.1 to 3 Zn, 0.007 to 0.25% Fe, 0.001 to 0.2% P, 0.001 to 0.2% Mg, 0.0001 to 0.001% C, and if required, further containing 0.001 to 0.3% at least one element of Cr and Zr, and the balance being Cu and inevitable impurities. The obtained copper alloy is excellent in electric conductivity, solder-exfoliation resistance when bent, high-temperature creep strength, and migration resistance, while being superior in hot workability and blankability to the conventional copper based alloy.

Abstract: A copper-based alloy, viz. a dezincification-resistant brass, excels in various properties such as resistance to dezincification, hot forgeability and machinability and, therefore, tolerates use particularly in the atmosphere of a corrosive aqueous solution. The brass of one species has a composition of 59.0 to 62.0 wt % of Cu, 0.5 to 4.5 wt % of Pb, 0.05 to 0.25 wt % of P, 0.5 to 2.0 wt % of Sn, 0.05 to 0.30 wt % of Ni, with or without 0.02 to 0.15 wt % of Ti, and the balance of Zn and unavoidable impurities. The brass of another species has a composition of 61.0 to 63.0 wt % of Cu, 2.0 to 4.5 wt % of Pb, 0.05 to 0.25 wt % of P, 0.05 to 0.30 wt % of Ni, with or without 0.02 to 0.15 wt % of Ti, and the balance of Zn and unavoidable impurities.

Abstract: A copper based casting alloy in which lead is replaced by 0.1 to 7 wt % bismuth and 0.1 to 2 wt % mischmetal or its rare earth equivalent is used to improve the distribution of bismuth in the alloy. The alloy is further defined by additions of tin, zinc, nickel, manganese, silicon, aluminum, iron and/or antimony.

Abstract: A hot working material of corrosion resistant copper-based alloy having a metal composition of 61.0 weight percent to less than 63.0 weight percent copper, 1.0 weight percent to 3.5 weight percent lead, 0.7 weight percent to 1.2 weight percent tin, 0.2 weight percent to 0.7 weight percent nickel, 0.03 weight percent to 0.4 weight percent iron, 0.02 weight percent to 0.10 weight percent antimony, and 0.04 weight percent to 0.15 weight percent phosphorus, with the balance composed of zinc and inevitable accompanying impurities. The alloy is subjected to hot working and subsequent heat treatment at 500.degree. C. to 600.degree. C. for 30 minutes to 3 hours and sufficient that the alloy has an .alpha. single-phase structure and addition elements are dispersed uniformly in the entire structure.

Abstract: Alloys for brazing used in heat exchangers, particularly in radiators. The alloys contain 14-31% by weight zinc, 0.1-15% by weight iron, 0.001-0.05% by weight phosphorus and 0-0.09% by weight arsenic, the balance being copper and incidental impurities.

Abstract: A copper alloy contains beryillium ranging from 0.2 to 0.7% in weight, nickel ranging from 0.1% to 2% in weight, and the balance copper and incidental impurities. Preferably, the incidental impurities include sulfur. A first preferable additional substance includes cobalt, zirconium or iron. A second preferable substance includes tin or zinc. A lead frame with a fine lead pattern is formed from a sheet of the copper alloy without burr, thereby improving the production yield of the lead frame.

Abstract: The invention relates to low-nickel copper alloys to be used as brazing filler metals, which alloys also contain phosphorus, tin and possibly small amounts of manganese. The alloys are produced by means of atomization methods. Their advantages are low liquidus temperature and narrow mushy zone, high joint strength and good corosion properties. The alloys are cadmium free and economical in price and they are mainly used for brazing copper and its alloys.

Abstract: An alloy consisting essentially of about 0.1 to 7% bismuth, up to about 16% tin, up to about 25% zinc, up to about 27% nickel, about 0.1 to 1% mischmetal and the balance copper and incidental impurities.

Abstract: A high-tensile copper alloy for current conduction and having superior flexibility is disclosed. The hightensile copper alloy, in a first embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.05 to 0.3% by weight of Sn; and the balance of Cu. The high-tensile copper alloy, in a second embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.2% by weight of Co; and the balance of Cu. The high-tensile copper alloy, in a third embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.3% by weight of Mg; and the balance of Cu. The high-tensile copper alloy, in a fourth embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.

Abstract: Deflection of laser beams, irrespective as to whether this is implemented within or externally of the laser itself; necessitating the utilization of metal mirrors or reflectors of high-quality which, in short, are designated as laser mirrors or reflectors. Laser mirrors of that type require an extremely good mirror surface, a high reflective capability and a good geometric planicity, as well as a high surface hardness. Brass possessing an inherently known microduplex matrix or grain structure provides a significant improvement in the properties of laser mirrors. A material of that type has, by nature, a microcrystalline structure, possesses a freedom from stresses, a high degree of stiffness, and a good material hardness.

Abstract: A high-tensile copper alloy for current conduction and having superior flexibility is disclosed. The high-tensile copper alloy, in a first embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.05 to 0.3% by weight of Sn; and the balance of Cu. The high-tensile copper alloy, in a second embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.2% by weight of Co; and the balance of Cu. The high-tensile copper alloy, in a third embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.3% by weight of In; from 0.01 to 0.3% by weight of Mg; and the balance of Cu. The high-tensile copper alloy, in a fourth embodiment, is consisting essentially of: from 2.0 to 4.0% by weight of Ni; from 0.4 to 1.0% by weight of Si; from 0.05 to 0.

Abstract: Worm gearing having improved wear and strength properties comprises a Cu, 8.0-13.0 w/o Sn, 3.5-5.0 w/o Ni alloy aged in the as-cast condition to strengthen the dendritic microstructural constituent (e.g., alpha phase) while retaining the as-cast, relatively hard interdendritic constituents. The overall Ni concentration of the alloy does not exceed about 5 w/o and the Ni concentration across individual as-cast dendrites is decreased at the dendrite edges (grain boundaries) to hinder formation of a discontinuous, embrittling grain boundary product that is deleterious to these properties.

Abstract: A metal liner for a shaped charge device having a ductile metal matrix and a discrete second phase is provided. The allow composition is selected so the second phase is molten when the liner is accelerated following detonation. The molten phase reduces the tensile strength of the matrix so that the liner slug is pulverized on striking a well casing. The slug does not penetrate the hole perforated in the well casing by the liner jet and oil flow into the well bore is not impeded. The liner is formed by directly casting the desired alloy to the desired shape.

Abstract: A copper alloy for electronic instruments is disclosed which comprises 2.0 to 7.0 wt. % of Sn, 1.0 to 6.0 wt. % in total amount of at least one kind of Ni, Co and Cr, o.1 to 2.0 wt. % of Si, and the remainder of Cu and unavoidable impurities, thereby further the content of O.sub.2 in unavoidable impurities being not more than 50 ppm, the content of S being not more than 20 ppm, and the average particle diameter of precipitates being not larger than 10 .mu.m. As the uses of such copper alloys, lead material for semiconductor elements and connector, socket, spring and terminal for electronic and electric instruments are claimed.

Abstract: A method for the manufacture of copper base alloys having improved resistance to thermally induced softening is provided. The alloy composition is selected so that the alloy undergoes either a peritectic or eutectic transformation during cooling. The solidification rate is controlled so that the second phase forms as a uniform dispersion of a relatively small dispersoid. The dispersoid inhibits recrystallization resulting in an alloy less susceptible to softening at elevated temperatures.

Abstract: A dispersion strengthened Cu (copper)-base alloy for a wear-resistant overlay formed on a metal substrate consists essentially of, by weight %,Ni: 5 to 30%;B: 0.5 to 3%;Si: 1 to 5%;Fe: 4 to 30%;Sn: 3 to 15% and/or An: 3 to 30%; andthe remainder being Cu and unavoidable impurities, and has a structure in which particles of boride and silicide of the Fe-Ni system are dispersed in a Cu-base matrix, and Cu-base primary crystals contain Sn and/or Zn in a solid solution state. If necessary, 0.1 to 5% of Al, 0.1 to 5% of Ti, and/or 1 to 10% of Mn may be added. 0.02 to 2% of C, and 0.1 to 10% of Cr and/or 0.3 to 5% of Ti may be further added. Instead of or along with Sn and/or Zn, 2 to 20% of Pb can be used, and nonsoluble Pb particles are uniformly dispersed between Cu-base .alpha. phase dendrites and serve as a solid lubricant.

Abstract: A copper alloy having satisfactory pressability and a method of manufacturing this alloy. The alloy contains: 0.1 to 0.4% (weight %) of Fe, 0.05 to 0.20% of Ti, 0.003 to 0.10% of Mg, 0.5 to 1.5% of Sn, and 0.01 to 1.0% of any one or two or all of the elements Zn, Ni and Co, the rest consisting of Cu except for impurities. The method comprises the steps of: hot-working this alloy; cold-working and annealing the hot-worked alloy one or more times, batch-annealing it at least once at 400.degree. to 600.degree. C. for 30 to 600 minutes and keeping the final cold-working ratio at 60% or less; and performing low-temperature annealing of the alloy at a temperature of 250.degree. to 400.degree. C.

Abstract: A novel synchronizer ring for use in a speed variator that is made of a Cu base alloy and which exhibits good initial accommodation by mating surfaces while ensuring high wear resistance is disclosed. The ring is made of a Cu base alloy containing 20-40% Zn (all percents being on a weight basis), 2-8% Al, and at least two components (intermetallic compound forming components) selected from among the following five elements, i.e., 0.1-3% of at least one of Ti, Zr and Cr, 0.1-3% Sn, 0.1-6% of at least one of Fe, Ni and Co, 0.1-5% Mn and 0.2-2% Si, and optionally at least one additional component that differs from said selected two components and which is selected from among 0-5% Mn, 0-3% Sn and 0-3% of at least one of Ti, Zr and Cr, and the balance being Cu and incidental impurities. The ring also has either an oxide film layer of aluminum oxide base with an average thickness of 0.1-10 .mu.m or a work-hardened layer with an average thickness of 5-300 .mu.

Abstract: A high strength copper alloy of excellent bending processability containing Ni: 5-20 wt %, Sn: 0.5-3 wt %, Al: 0.5-5 wt %, Mg: 0.001-0.05 wt %, Cr: 0.001-0.1 wt %, Zn: 0.05-5 wt %, the balance of Cu and inevitable impurities, and having a tensile strength of from 80 to 120 kgf/mm.sup.2. Up to 0.2 wt % of one or more of Fe,Mn,Ti,Zr,P,In,Ta and Co can be added without a deleterious effect. The alloy is non-toxic and economical, as well as shows tensile strength and elongation at least comparable with beryllium-copper alloy and has excellent solderability and solder-resistant and heat resistant peelability. The alloy can be used suitably as materials for electric terminals, connectors, etc.

Abstract: A copper alloy suitable for use as the material of a heat exchanger contains 1 to 4.5 wt % of Zn, 1.0 to 2.5 wt %, preferably 1.5 to 2.0 wt % of Sn, 0.005 to 0.05 wt %, preferably 0.01 to 0.04% of P, and the balance substantially Cu and inevitable impurities, and has grain size not greater than 0.015 mm, preferably below 0.01 mm. The alloy exhibits high resistance levels to corrosion such as stress corrosion cracking, dezincification corrosion and so forth, as well as superior workability, strength and solder wettability, and, hence, can suitably be used as the materials of the constituents of a heat exchanger such as tanks, tube plates and tubes.

Abstract: A synchronizer ring for use in an automotive speed variator. The ring not only has high strength and toughness but also exhibits high wear resistance, as well as good synchronizing characteristics with respect to a mating member as expressed in terms of friction coefficient. The Cu alloy of which this ring is made has one of the following compositions: (1) 17-40% Zn (all percents are on a weight basis), 2-11% Al and 50-3,000 ppm of oxygen, as well as 0.1-3.5% of at least one element selected from among Ti, Zr and V, 0.003-0.3% Mg and with at least one optional element selected from among Fe, Ni, Co, P, Ca, Mn, Sn, Si and Pb, the balance being Cu and incidental impurities; or (2) 17-40% Zn, 2-11% Al, 0.5-6% Mn, 0.1-2% Si, 0.1-3% of at least one of Fe, Ni and Co, 0.003-0.3% of Mg, and 30-1,000 ppm of oxygen, with at least one optional element selected from among P, Ca, Cr, Pb and Sn, and with the balance being Cu and incidental impurities.

Abstract: High strength and high wear resistance copper alloys consisting essentially of (I) 54-66% by weight of Cu, 1.0-5.0% by weight of Al, 1.0-5.0% by weight of Mn, 0.1-2.0% by weight of Si, 0.1-3.0% by weight of Sn, 0.01-1.0% by weight of B, and as the remainder, Zn and inevitable impurities, and (II) 54-66% by weight of Cu, 1.0-5.0% by weight of Al, 1.0-5.0% by weight of Mn, 0.1-2.0% by weight of Si, 0.1-3.0% by weight of Sn, 0.01-1.0% by weight of B, 0.1-4.0% by weight of one or more elements selected from Fe, Ni and Cr, and as the remainder, Zn and inevitable impurities.

Abstract: A copper alloy is disclosed which comprises 0.01 to 1.0 wt. % of Cr, 0.01 to 8 wt. % of Sn, 0.001 to 5 wt. % of at least one of 0.001 to 5 wt. % of Zn, 0.001 to 0.5 wt. % of Mn and 0.001 to 0.2 wt. % of Mg and the remainder of Cu, the content of O.sub.2 therein being not more than 0.005 wt. %. A method of manufacturing therefor is described wherein, after the hot processing or the heat treatment at 800.degree. to 950.degree. C., the alloy is cooled by passage through a region of 800.degree. to 400.degree. C. within 20 minutes, then following cold processing, heating treatment is carried out for at least 1 minute at 400.degree. to 650.degree. C. The alloy with the composition aforementioned is used as an alloy material for electric or electronic instruments.

Abstract: A process for making a composite bearing material comprising a steel backed, prealloyed, lead-bronze sintered powder metal matrix whereby the first sinter step includes induction heating the prealloyed powder and steel backing to above 650.degree. C. and thereafter sintering the same at temperatures of about 850.degree. C. in a second sintering furnace. A composite bearing material made by the same process and comprising a lead particle size averaging less than about 8 microns and having no lead islands larger than about 44 microns.

Abstract: A copper alloy is disclosed, which contains 0.1 to 3.0 wt % of Ni, 0.1 to 1.0 wt % of Ti, the ratio of Ni to Ti being 4.ltoreq.Ni/Ti thereby, 0.1 to 6.0 wt % of Sn, and 0.005 to 3.0 wt % in total of one or more elements selected from the group consisting of Zn, Mn, Mg, Ca, RE, B, Sb, Te, Si, Co, Fe, Zr, Ag, Mm and Al, and consists of the remainder of Cu and the inevitable impurities. The method for the manufacture of the alloy is characterized in that, after copper alloy ingot was maintained and homogenized for 0.5 to 15 hours at 750.degree. to 960.degree. C. prior to rolling, the hot rolling is carried out starting from a temperature of 700.degree. to 880.degree. C. and the cooling is made immediately after the end of rolling.

Abstract: An age hardened spinodally decomposed alloy prepared by powder metallurgy consisting essentially of from about 5 to about 30 percent by weight nickel, from about 4 to about 13 percent by weight tin, from about 0.5 to about 3.5 percent by weight cobalt and the balance copper exhibits an excellent combination of strength, ductility, formability and electrical conductivity characteristics.

Abstract: An excellent material for lead frames is provided which is economical and easily punched out to produce lead frames without bending or breakage, and has both superior tensile strength and high electrical conductivity, as well as splendid heat dissipation properties and good soldering properties.

Abstract: There is provided a copper alloy which comprises 1.0 to 3.5 wt. % of Ni, 0.2 to 0.9 wt. % of Si, 0.02 to 1.0 wt. % of Mn, 0.1 to 5.0 wt. % of Zn, 0.1 to 2.0 wt. % of Sn, and 0.001 to 0.01 wt. % of Mg, and 0.001 to 0.01 wt. % of one or more members selected from Cr, Ti, and Zr, with the remainder being substantially Cu. The copper alloy is suitable for lead frames for semiconductors and is also suitable for terminals and connectors. The copper alloy is produced by a process which comprises starting cooling from a temperature above 600.degree. C. at a rate of 5.degree. C. per second or higher after hot rolling of an ingot of said copper alloy, performing annealing at a temperature of 400.degree. to 600.degree. C. for 5 minutes to 4 hours after cold working, performing refining finish rolling, and performing annealing at a temperature of 400.degree. to 600.degree. C. for a short time of 5 to 60 seconds.