Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and second metal films, forming first and second semi-cured resin layers, stacking a first assembly of the first carrier, the first metal film, the first copper film and the first semi-cured resin layer on a second assembly of the second carrier, the second metal film, the second copper film and the second semi-cured resin layer, and vacuum hot pressing the first and second assemblies so as to complete cure and integrate the first and second semi-cured resin layers.

Abstract: The present invention describes a die to manufacture pieces of plastic materials, molded by injection, projection or blowing processes that does not need end finishing during its construction, and that does not need to employ additional demolding agents during its whole useful life to release the objects molded. Said die is specially useful to obtain pieces of plastic materials that must be painted or must be dealt superficially with the purpose of being employed in various industries, such as the automobile industry, electro-domestic accessories manufacturing, communications, computers, or decoration, etc. This die is also specially useful to obtain pieces that must be adhered in an efficient and substantially permanent way to others as are the soles for the industrial manufacturing of shoes and of sports shoes.

Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and second metal films, sandwiching a prepreg containing a curable resin body, between a first assembly of the first carrier, the first metal film and the first copper film, and a second assembly of the second carrier, the second metal film and the second copper film, and vacuum hot pressing the prepreg and the first and second assemblies so as to completely cure the curable resin body of the prepreg to form a cured resin body that is bonded to the first and second copper films of the first and second assemblies.

Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and second metal films, forming first and second semi-cured resin layers, stacking a first assembly of the first carrier, the first metal film, the first copper film and the first semi-cured resin layer on a second assembly of the second carrier, the second metal film, the second copper film and the second semi-cured resin layer, and vacuum hot pressing the first and second assemblies so as to complete cure and integrate the first and second semi-cured resin layers.

Abstract: A method of providing a decorative metal pattern on an electrically non-conductive substrate, such as a glass or plastic substrate, which includes applying a mixture of heat fusible material, such as glass or plastic, with a metal having a particle size less than about 500 mesh constituting at least 50% of the mixture, to the substrate in the desired pattern, heating the so-applied mixture until the heat fusible material fuses and bonds to the substrate, cleaning the substrate with the pattern thereon, and a electroplating the pattern with the desired finish metal. In one method in which the mixture includes glass, a negative resist is adhesively secured to the substrate and the mixture is applied. The resist disintegrates upon heating. In another method, used when the substrate is plastic, a mixture of plastic and metal in past form is applied to the substrate by silk screening or pad printing to form the pattern.

Abstract: The present invention discloses a color-modifying method, which comprises the provision of a metal oxide thin film (14) based on Ni and/or Cr. The method is characterized in that, when coloring the metal oxide film (14), exposing the metal oxide thin film to ozone, and when bleaching the metal oxide film, exposing the metal oxide film to UV radiation (18). A lamination process or a deposition of another thin film may follow the exposure. Preferably, exposing the metal oxide thin film (14) to ultraviolet radiation (18) in an oxygen-containing atmosphere (20) provides the ozone exposure and exposing the metal oxide thin film to ultraviolet radiation (18) in an oxygen-free atmosphere (20) provides the ultraviolet exposure.

Abstract: The present invention is a method of producing an electrode probe assembly, comprising, providing a flexible polymer substrate bearing a coating of conductive material and using photolithography and electroplating to form a set of contacts and conductors on the flexible polymer substrate. A resilient material substrate is provided and laminated to the flexible polymer substrate. The assembly may be sized and shaped so that it may be driven through brain tissue.

Abstract: An adhesive bonding process for making vehicle structures wherein a surface portion of an aluminum alloy body is anodized in an aqueous solution of hypophosphorous acid (H3PO2) to form an anodic oxide coating. A layer of adhesive is applied onto the surface portion and the adhesive coated anodized surface portion is joined to an adjacent metal structure.

Abstract: Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.

Abstract: Low acoustic solid wave attenuation structures are formed with an electroformed nickel mold, and are incorporated within acoustic ink emitters, between the focusing lens and surface of an ink layer. The structures have characteristics of low attenuation of acoustic waves to increase the efficiency of acoustic wave transmission within the acoustic ink emitter. Using the described structures, acoustic ink printers can accurately emit materials having high viscosity, including hot melt inks.

Abstract: A method of manufacturing a semiconductor substrate can effectively prevent a chipping phenomenon and the production of debris from occurring in part of the insulation layer and the semiconductor by removing a outer peripheral portion of the semiconductor substrate so as to make the outer peripheral extremity of the insulation layer to be located between the outer peripheral extremity of the semiconductor layer and that of the support member and hence the semiconductor layer and the insulation layer produce a stepped profile.

Abstract: A method of repairing metal surfaces, in particular hydraulic cylinder interior walls and pistons, which are damaged by scoring, denting, grooving, etc. A catalytically hardened synthetic resin, preferably an epoxy, is mixed with a selected metal powder to form a mixture which, when hardened has a coefficient of thermal expansion substantially equal to that of the metal surface. A hardener is mixed with the filled resin and the damaged areas are filled with the mixture. The resin is cured, then dressed so that the damaged areas conform to adjacent undamaged surfaces. The repair area (and other surface areas, if desired) is then electroplated with a hoard, tough, wear-resistant metal, preferably by brush plating. The plated areas are then polished and the repaired article is ready for use.

Abstract: Nonwoven webs are fabricated by forming unitary multicomponent fibers comprising a plurality of individual segments partially exposed at the surface of the fiber; bonding the multicomponent fibers, such as by thermal point bonding, and then hydroentangling the bonded multicomponent fibers with a water pressure from about 400 to 3000 psi wherein the entangling process separates the individual segments of the unitary multicomponent fibers into microfibers and also entangles the fibers to form an integrated nonwoven web. The nonwoven webs include entangled webs of thermoplastic multicomponent fibers and microfibers having partially degraded bond areas comprising from about 5% to about 50% at the surface area of the web.

Abstract: A manufacturing method for a high precision mold comprises the steps of (a) placing a plastic body on a conductor substrate, (b) forming a plurality of perforating apertures in the plastic body using X-ray deep etching molding, (c) rounding the edges at the front end of the perforating apertures using ultraviolet (UV) lithography, and (d) electroforming the high precision mold using the plastic body with perforating apertures as a model. A fiber connector sleeve can be further manufactured by (e) molding a fiber aligning element using the high precision mold, (f) molding a fiber sleeve body using an usual mold, and (g) combining the fiber aligning element with the fiber sleeve body using ultrasonic waves to form the fiber connector sleeve.

Abstract: An object of the invention is to prolong the seal life of a color EL display apparatus. The initial thickness of a light-transmitting main substrate is larger than a predetermined reference thickness WC. First, a plurality of thin-film EL devices are formed on one surface of the main substrate. Then, a sealing substrate having a concave portion formed in one surface thereof is bonded onto the one surface of the main substrate at predetermined intervals. Then, a protective material for protecting the thin-film EL devices is filled in the gap between the one surface of the main substrate and the sealing substrate. Then, the main substrate is processed so as to have the reference thickness WC. Then, a color filter portion is formed on the other surface of the main substrate. Lastly, a reinforcing substrate is attached to the other surface of the main substrate with the color filter portion in between.

Abstract: Photosensitive resin is applied to an internal conductive pattern layer (2) as well as to an inside layer which has a hole (3a) filled with conductive paste (3b). A hole (4a) communicating to the internal conductive pattern layer (2) by exposure and development is formed. Then, metal plated film (6a) is formed on the surface of the photosensitive resin (4) including the hole (4a). Metal plated film (6a) is processed into an external conductive pattern layer (6a). This manufacturing method can increase the wiring density on the external conductive pattern layer (6), and thus a multilayer printed wiring board of increased wiring density can be obtained.

Abstract: It is an object of the present invention to provide an anodizing apparatus capable of efficiently performing anodizing. In order to achieve this object, an anodizing apparatus for anodizing a substrate to be processed in an electrolytic solution includes a process tank for storing the electrolytic solution, the process tank having an opening in a wall, a negative electrode arranged in the process tank to oppose the opening, and a positive electrode contacting a surface of the substrate to be processed which is arranged to close the opening from an inside of the process tank, the surface being open outside the process tank through the opening.

Abstract: Polyester-containing multilayer biaxially-oriented polypropylene films are provided. According to the invention, a two- or three-layer polyester-containing cap layer is bonded to a monoaxially oriented polypropylene core, followed by orientation of the resulting composite in a direction transverse to the direction of orientation of the core layer. At least one tie layer is interposed between the core and the polyester. Advantageously, the polyester contains silicone fluid as a processing aid.

Abstract: A surface-treating method of of screw parts, which method consists of coating beforehand a liquid organic resin based coating composition capable of forming a film having a volume resistivity of 1014 &OHgr;·cm or more at normal temperature onto a thread of screw parts to be mounted onto an automobile body by welding prior to a coating step of the automobile body, followed by heating and drying.

Abstract: An electrographic imaging element useful for forming colored images is described. The element contains an imaging layer structure and a support structure. The support structure contains an electrically conductive polymeric release layer formed by polymerizing a mixture containing a polymerizable, ethylenically unsaturated ammonium precursor; a polymerizable, ethylenically unsaturated, organo-silicone precursor; a polymerizable precursor containing at least two polymerizable, ethylenically unsaturated functional groups; optionally, a polymerizable, ethylenically unsaturated acidic precursor containing at least one carboxylic acid group; and, optionally, a monofunctional precursor containing one polymerizable, ethylenically unsaturated functional group. The element is particularly useful for forming large size images, such as are required for banners, billboards, and other out-of-doors advertisements.

Abstract: In a method of manufacturing an ultrasonic transducer array a plurality of discrete transducer elements are formed on an initially flat flexible substrate together with electrically conductive tracks, through which the transducer elements will be energized in use, the flexible substrate with the discrete transducer elements and conductive tracks mounted thereon then being formed into a cylinder and mounted on the end of a catheter tube, the substrate being radially outwardly of the transducer elements so that it is in a position to act also as an acoustic matching layer between the material of the transducer elements and the human tissues or blood when in use.

Abstract: A laminated material for sliding members having improved resistance to abrasion, hardness and wear resistance. The laminated material has a support structure and a sliding layer with electrodeposited matrix material, hard particles being embedded into the matrix material, having a diameter of <2 .mu.m and being provided in the form of individual particles distributed in a completely homogenous manner with a proportion of 2 to 20% by volume in the matrix material. The process to produce sliding members provides that a ternary electroplating bath free of fluoro-borate and without brighteners, using non-ionic surfactants and free alkyl sulphonic acids, and a grain refining agent and a fatty acid polyglycol ester is used. The hard particles are kept in the electroplating bath during electroplating at a steady concentration.

Abstract: An electronic part having a plurality of substrates and a process for producing the same are disclosed, the electronic part comprising (1) a laminate comprising at least two previously fired substrates different in electrical characteristics each containing in the inside thereof a passive element, and an adhesive layer comprising glass which is interposed between said substrates, and (2) an outer electrode which is formed on the surface of the laminate of the substrates and is electrically connected to the passive elements, and the process comprising the steps of: separately firing at least two substrates different in electrical characteristics each containing in the inside thereof a passive element; adhering the substrates with an adhesive comprising glass; and forming an outer electrode on the surface of the laminate of the substrates in electrical connection to each passive element. Each substrate is free from warpage or cracking and containing no part remaining non-sintered.

Abstract: A method of minimizing warp and die stress in the production of an electronic assembly includes connecting one surface of a die to a package, and connecting an opposite surface of the die to a lid disposed over a constraining ring that is mounted to the package. The lid has a size, shape and coefficient of thermal expansion (CTE) selected to generate a bending moment that opposes bending moments resulting from connecting the die to the package.

Abstract: A manufacturing line including a plurality of processing sections disposed in a series for manufacturing multi-layered printed circuit boards by continuously conveying and processing boards through the plurality of processing sections, in which the plurality of processing sections have at least two specific processing sections for conducting a common type of processes, and the specific processing sections are disposed in a common area.

Abstract: The present invention relates to a manufacture procedure of vehicle sunshade curtain including:A. Two PET (polyethylene terephthalate) sheets in different thickness are used;B. Both sides of the interior and exterior films are electroplated;C. The interior and exterior films are glued together by a melted PE material constituting an inceptive sunshade curtain;D. The inceptive sunshade curtain is folded in two by facing the interior film inside and then curled up from the folding end; andE. The curled inceptive sunshade curtain is heated 40 minutes at about 110.degree. C. to shrink the interior and exterior films. After quick cooling down, the inceptive sunshade curtain is set to a curled finished sunshade curtain.The present invention is to simplify the vehicle sunshade curtain manufacture procedure, lower the manufacture cost, increase the production speed and enhance the sunlight reflecting feature.

Abstract: A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e.g., copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e.g., when the flexible circuit is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.

Abstract: In a method for manufacturing a nozzle plate, two parts of the nozzle plate are fabricated separately from one another. The fabrication of the two parts is carried out by microstructuring/lithography, electroforming and plastic molding. Advantageously, a filter structure is provided in the first part. The two parts are joined together by means of laser welding, diffusion soldering or a chemical joining process. The nozzle plate is particularly well suited for injection valves, atomization nozzles, paint spray nozzles or other spraying systems.

Abstract: A new method of preparing blind vias in printed circuit boards and other substrates allows for the drilling of holes for connection between conductive layers, in insulating layers prior to laminating insulating layers together. Each insulative layer is prepared with patterned conductive wiring and holes are drilled through the layer at points where wiring is to connect to another level of wiring. Two layers are aligned, using mechanical, optical, or other alignment mechanisms, and subsequently laminated together. The holes are plated with conductor after lamination to form an electrical connection. Additional layers can be added by the same method.

Abstract: A process for manufacturing electroformed patterns includes the following steps: forming electroformed closed line graphic patterns and an electroformed line surrounding said patterns (optionally together with an electroformed island) on a surface of a conductive substrate; peeling the electroformed patterns and the electroformed line (optionally together with the electroformed island) from the conductive substrate to transfer them onto a pressure-sensitive adhesive layer provided on a support; injecting or printing a coating material inside the closed line graphic electroformed patterns and converting the coating material to coating films; forming a firmly bonding adhesive layer on a whole surface of the support on its side where the electroformed patterns, the coating films and the electroformed line (optionally together with the electroformed island) are retained; removing the electroformed line (optionally together with the electroformed island); separating the electroformed patterns and the coating films

Abstract: A method and apparatus are provided for aligning and laminating stiffeners to substrates in electrical circuits. Generally, this method includes placing a substrate within an alignment frame or tool; applying an adhesive on the substrate; placing a stiffener on the adhesive to form a chip package; applying sufficient pressure and heat to the package for a sufficient time to cure the adhesive. Another method of the present invention includes placing a substrate within an alignment tool or frame; applying an adhesive on the substrate within the alignment tool; placing a stiffener on the adhesive to form a package; applying sufficient heat and pressure to the package for a sufficient time to tack the stiffener to the substrate; removing the package from the alignment tool or frame; and heating the package for a sufficient time and temperature to cure the adhesive wherein the stiffener enhances rigidity of the package.

Abstract: A method of minimizing warp and die stress in the production of an electronic assembly includes connecting one surface of a die to a package, and connecting an opposite surface of the die to a lid disposed over a constraining ring that is mounted to the package. The lid has a size, shape and coefficient of thermal expansion (CTE) selected to generate a bending moment that opposes bending moments resulting from connecting the die to the package.

Abstract: An improved process for bonding a semiconductor chip to a substrate is disclosed. In the process, a gold bump is formed on an aluminum bond pad of the chip thus forming a flip chip. A screen with an opening is placed on the substrate prior to dotting insulating epoxy on the opening. The epoxy is bladed with a printing blade thus forming an epoxy layer having a predetermined area and uniform thickness. The flip chip is, thereafter, placed on the substrate such that the gold bump is brought into electrical contact with a lead finger of the substrate through thermocompression bonding. Then the chip and substrate are put in an oven in order to permanently cure the epoxy layer. It is preferable to precure the epoxy layer prior to the permanent curing step thereby allowing thermal stress to be distributed to both the gold bump and the precured epoxy layer.

Abstract: The ends of thru-holes, disposed in components that are laminated together to form a composite structure are masked prior to lamination of the components to prevent bonding material bleed through the holes during the lamination process. The method effectively solves the problem of the need to remove laminate bleed from the outer surface of the composite structure after the joining process.

Abstract: The invention generally relates to the technical field of devices using the effect to emit electrons out of a solid into vacuum due to high electric field strength. Such devices are usually called field emission devices. The invention relates more specifically to the structure of a field emission device, to the method of fabricating a field emission device, and to the use of a multitude of field emission devices in the technical field of flat panel displays. The inventive structure of a field emission device (15) comprises an individual series resistor for each electron emitting tip (1), wherein the series resistor is formed by the tip (1) itself. The tip (1) comprises a body (9) of a first material with high resistivity and an at least partial coating (7) of a second material with low work function, wherein the body (9) of the first material forms the series resistor and the coating (7) of the second material provides for electron emission.

Abstract: A substantially continuous layer of a first metal such as copper is provided with strips of a second metal such as gold by selective electroplating of the second metal, or by applying separately formed strips such as lengths of wire. A dielectric support layer is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal contiguous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple and economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead portion formed from a precious metal. The leads may incorporate sections of round cross-sectional shape to facilitate engagement by a bonding tool during use of the component.

Abstract: Flexible multilayer printed circuit boards are disclosed which utilize adhesiveless laminates interconnected in a generally superposed relationship by a conductive adhesive. In one embodiment, the adhesiveless laminates have relatively thin conductive layers and metallized through holes which exhibit high delamination resistance. The metallized through holes preferably have a thickness of at most about 25 microns, yet they are capable of withstanding multilayer assembly processes. High flexibility, reliability, packaging density, and environmental resistance are consequently available in a thin multilayer construction. In a further embodiment, adhesiveless dielectric layers are interposed between adhesiveless laminates to electrically insulate portions thereof. The adhesiveless dielectric layers may define relatively small apertures therein, thus providing greater packaging density for a multilayer printed circuit board.

Abstract: A method for making multi-tier laminate substrates for electronic device packaging is provided wherein a spacing mechanism is used to protect the bond fingers of a trace on a lower tier of the laminated substrate when a milling bit is used to cut an opening above a die cavity in the multi-tier substrate.

Abstract: Described is a method of making a double-sided printed wiring board (PWB) comprising a core of electrically conductive material to improve the thermal distribution and cross-talk shielding of the PWB. Relief apertures and separation slots are chemically milled into the core. A layer of particulate-free dielectric material and a layer of conductive material are laminated to both sides of the core and dielectric material substantially fills the relief apertures during lamination. Holes are drilled through the PWB at the relief apertures to accommodate electrical communication between both sides of the board. Holes are also drilled through the conductive material of the core to accommodate an electrical ground. The surface of the PWB and the side walls of the holes are coated with a second layer of electrically conductive material.

Abstract: A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.

Abstract: The present invention is directed to a method for producing a smooth and continuous pressure bonded layer of a material on a base substrate through the driving force of a pulsed laser. The method comprises the steps of selecting a laser absorptive material. Then applying thereto a thin layer of the material for pressure bonding to the base substrate. Next, placing the base substrate and the thin layer of material on the laser absorptive material in a vacuum, then placing the base substrate in close proximity to the thin layer of material. Finally, directing pulsed laser energy toward the laser absorptive material and the layer to be pressure bonded, whereby the laser energy is absorbed by the laser absorptive material causing heating and vaporization thereof to a controlled depth of the laser absorptive material, leaving remaining portions of the laser absorptive material unvaporized after the vaporization to act as a support for the material to be bonded.

Abstract: A method of producing a circuit board includes the steps of: electroplating a mold surface of a mold so that a circuit body made of a metal plating layer is formed on the mold surface of the mold; pressing the mold against a board made of a thermoplastic resin; heating and retaining the mold so that the circuit body is bonded to the board under heat and pressure; and releasing the mold from the board after cooling the board to thereby transfer the circuit body to the board. The circuit board may be in the shape of box with the circuit body on the inner surfaces thereof.

Abstract: The present invention relates to a process for preparing a laminated structure containing at least a main foil which is substantially impervious to light, B) at least one interlayer, and C) a covering foil which is substantially light-permeable. The layers are bonded together using a UV-curable and/or VIS-curable composition. The interlayer, prior to contact with the curable composition, is substantially impervious to the irradiation necessary for curing the curable composition and becomes transparent when impregnated with the curable composition so as to effect polymerization of multiple layers of curable composition in one irradiation step.

Abstract: A substantially continuous layer of a first metal such as copper is provided with strips of a second metal such as gold by selective electroplating of the second metal. A dielectric support layer is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal contiguous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple end economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead potion formed from a precious metal.

Abstract: Provided is a method for producing a photoresist film for use in producing a a precision fine process component capable of achieving removal of moisture component and film formation by heating in a short time, forming a resist film having a resolution much finer than that of the conventional method, and easily drying a thin board. The resist film obtained through the electrodeposition coating process is roll-pressed by pressure rolls with heat applied to the film.

Abstract: A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.

Abstract: A method for producing a conductive pattern includes the steps of forming a mask layer on a conductive base plate, the mask layer having a pattern defining an exposed area of the conductive base plate; forming a conductive pattern on the exposed area of the conductive base plate by electroforming using a plating liquid which substantially maintains the pattern of the mask layer; and transferring the conductive pattern onto a support layer without removing the mask layer.

Abstract: The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

Abstract: A method is disclosed for making multi-tier laminate substrates for electronic device packaging including providing a first laminating layer and a second laminating layer, each having a trace on a first side. These layers are laminated with a spacer layer and dielectric layers. A window is made in each of the spacer and the dielectric layers. After laminating the layers together, vias are formed. Then an opening is made in the first laminating layer that corresponds to the window openings in order to produce a cavity in the laminated structure for placing an electronic device therein.

Abstract: The object of a process and an arrangement for producing dose profiles for the fabrication of structured surfaces with a beam which is used for exposure and is directed on the surface consists in arranging the surface irradiation in such a way that the processing times and material outlay required for fabrication of micro-lenses and micro-lens arrays can be substantially reduced. According to the invention, the beam has at least one shaped region in cross section, which shaped region is movable relative to the surface and whose extent in the movement direction of the relative movement, in combination with the velocity of the relative movement, determines the dose. Effective lithographic fabrication of lens structures, in particular micro-lenses and micro-lens arrays, can be realized with the invention.