Abstract: A laminated structure (1) comprising a substrate (3) and a polymer layer (5) is provided. The polymer layer consists of conductive areas (7) having a sheet resistance of maximally 1000 .OMEGA./square. The adjacent parts of the polymer layer are substantially non-conductive and have a sheet resistance which is a factor of 10.sup.6 higher. An electrodeposited metal layer (9), for example of copper, is present on the conductive areas (7).A simple method of photochemically generating the conductive pattern (7) which can be reinforced in an aqueous metal-salt solution by electrodeposition of a metal layer (9) is also provided and most preferably the conductive pattern is inter alia, the patterned exposure of a layer of 3,4-ethylene dioxythiophene or polyaniline. The method can very suitably be used for the manufacture of metal patterns on insulating substrates, such as printed circuit boards.

Abstract: The invention relates to a process for production of a copper clad, electrically insulated base for printed circuit boards, wherein a foil, of copper, copper alloy, aluminum or aluminum alloy by electroplating on preferably both sides furnished with a 1-35 .mu.m thick unpatterned layer of copper or copper alloy, is under heat and pressure laminated with the copper surfaces facing an electrically insulating, resin containing base. The copper layers are electroplated onto the foil in such a way that the layers after lamination strongly adhere to the insulating base and at the same time exhibit a very poor adhesion to the foil, which easily can be stripped from the copper layers without splitting these. The foil works during the lamination as a mold plate, whereby conventional mold plates can be excluded. The invention also comprises the use of such a copper clad foil as a combined mold plate and base for the copper layers during the lamination.

Abstract: An adhesive is applied onto a flexible resistive film 1 and dried to form an adhesive layer 2. A metal foil 3 is contacted onto the layer 2, which is subjected to a heat and pressing treatment. The foil 3 is polished. An ultraviolet light curable ink is applied on the foil 3 and dried to form a first layer 4. A negative film is placed on or over the layer 4 and ultraviolet light is irradiated thereto through the film so that the layer 4 is cured. Uncured portions of the layer 4 is removed so that cured portions thereof remain and the foil 3 is exposed between the remaining cured portions. The metal foil 3 is subjected to an etching treatment to remove exposed portions of the foil 3 so that unexposed portions of the foil 3 remain and form conductors 3A. The cured portions of the layer 4 is removed from the conductors 3A. A metal plating film 5 is formed on each conductor 3A to form each electrical conductive circuit 9.

Abstract: A method of forming a multi-layer circuit board which includes electrical interconnections between adjacent circuit board layers of the multi-layer board. A via hole is provided through a circuit board layer. The via hole is filled with a via metal. The via metal is plated with a low melting point metal. An adhesive film is deposited over the circuit board layer. Adjacent layers of the multi-layer circuit board are stacked and aligned together. The layers are laminated under heat and pressure. The low melting point metal provides an electrical interconnection between adjacent layers.

Abstract: The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.

Abstract: Process of imparting conductivity to a three-dimensional net-shaped porous sheet can be performed efficiently before carrying out electroplating process. Fine metallic powders are applied to the porous sheet made of a foamed sheet, a nonwoven sheet, a mesh sheet or a plurality of sheets layered one on the other, so that a conductive metallic layer is formed on the porous sheet. Then, an electroplated layer is formed on the surface of the conductive metallic layer. The conductive metallic layer remains when the porous sheet burned out. Consequently, a metallic layer of the conductive metallic layer and the electroplated layer forms the metallic framework of the metallic porous sheet.

Abstract: Molded, one-piece articles having selected surfaces suitable for adherent metallization, molded, metallized, one-piece articles and processes for making the articles are disclosed. The molded one-piece articles may be formed by: molding into a first mold cavity a first portion of the article using a first electrically insulating material which is capable of adhesion promotion by an adhesion promotion process and is catalytic for adherent metallization or is capable of being rendered catalytic for adherent metallization by an activating process; inserting the first portion into a second mold cavity; and molding into the second mold cavity a second portion of the article using a second electrically insulating material, leaving selected surfaces of the first portion exposed.

Abstract: A microwave assembly having molded thermoplastic components that are first assembled into an enclosure, and then electroless copper plated to provide for RF conductivity. Assemblies are made by bonding bare thermoplastic components, after which the bonded assembly is electroless copper plated. The components are made of an injection molding material, polyetherimide, or a high strength, high temperature thermoplastic. The components are assembled using a one component epoxy adhesive, for example. All components are designed to be self locating to aid in assembly. A bonding fixture is used to apply clamping pressure to the components while the adhesive cures. After bonding, the waveguide assembly has its critical flange surfaces finish machined prior to plating.

Abstract: A method of fabricating a microwave waveguide component wherein a plurality of joinable thermoplastic members are first formed. The members, when joined, comprise a microwave waveguide component having an internal surface that is adapted to be plated. The thermoplastic members are then bonded together. Then, the internal surface is plated to form the finished microwave waveguide component. The present method forms microwave components from plated, injection molded thermoplastic and reaction injection molded thermosetting plastics. In particular, the plastic components made using the present invention exhibit comparable electrical performance, as measured by voltage standing wave ratio (VSWR) and insertion loss, decreased device weight and cost, and reliable and repeatable manufacturability when compared with devices formed using metals, conventional thermosetting plastics that have been metallized, and molded, plated and soldered thermoplastics.

Abstract: A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit.

Abstract: A method of forming a transferable pattern or image of an inorganic film by coating an embossed substrate with an inorganic layer, that may comprise one or more films, over both recessed and raised surface portions, adhesively laminating a transfer substrate to the inorganic layer coating the raised surface portions of the embossed substrate and separating the embossed substrate and the transfer substrate. The adhesive is selected such that the bond between the transfer substrate and the inorganic film on the raised surface portions is greater than the bond between the inorganic layer on the raised surface portions and the embossed substrate.The embossed substrate resulting after removal of the inorganic layer coating the raised surface portions may be modified to include additional inorganic layers over the recessed surface portions by tinning or electroplating methods such that this thickened inorganic layer may also be transferred from the embossed substrate to a transfer substrate as set forth above.

Abstract: A corrosion resistant barrier is provided for isolated circuity. An isolated circuit (10, 12) with raised interconnection features (16, 18) having a corrosion resistant gold coating (34) is formed on a reusable stainless steel mandrel (22) which is provided with indentations to define raised features. A seed layer (32) of copper is electroplated on the mandrel in a pattern of the isolated circuit to be formed. The copper seed layer (32) is then followed by electroplated layers of gold (34), nickel (36) and copper (38) until a total desired conductor thickness is achieved. A dielectric substrate (44, 46) is laminated on the multilayer conductive traces of the circuit. After removal of the multilayer circuit from the mandrel, a predrilled dielectric coverlay (50) is laminated to the circuit with holes in the coverlay receiving the raised circuit features (52). The finished part is then etched to remove the copper seed layer from the raised features.

Abstract: A fiber-reinforced resin member of the present invention comprises a solid or hollow rod member (2) made of a fiber-reinforced resin material (5, 6), a soft metal layer (3) formed on the outer periphery of the rod member by squeezing a soft metal on the outer periphery of the rod member so as to cause the soft metal to adhere under pressure to the outer periphery of said rod member, and a hard metallic deposit (4) formed on the surface of the sot metal layer. The present invention also provides a method of producing the fiber-reinforced resin member.

Abstract: Shaped contacts (40, 42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool (16, 18, 26, 28) makes indentations (24a, 24b) of predetermined shape in the surface of the mandrel (10), which is provided with a pattern of dielectric, such as Teflon (12), or photoresist. Areas of the steel mandrel, including the indentations (24a,24b), are electroplated with a pattern of conductive material (34, 36, 38), and a dielectric substrate (32) is laminated to the conductive material. The circuit features formed by the indentations define raised contacts of a conical (18) or pyramidal (28) shape, having free ends with a small area that allows higher pressures to be applied to a surface against which the contacts are pressed.

Abstract: The disclosure relates to a method for forming a porous sheet comprising a plurality of porous sheets such as foamed sheet, mesh sheet and nonwoven fabric sheet. These sheets are adhered and layered to each other either by a melting or with an adhesive or by layering without each other with adhering these sheets to each other. Then, the porous sheet thus layered is plated at a high current density by forcibly applying plating liquid to the layered sheet in a direction substantially perpendicular thereto in a plating tank, or by vacuum evaporation while the layered sheet is being transported inside the vapor deposition vacuum container enclosed by a cooking tank through a cooling roller mounted therein. The metallic porous sheet formed according the above-described method is preferably used as the electrode of a battery.

Abstract: A process for producing a roll stamper which molds a substrate sheet for information recording mediums by continuously transferring preformat patterns on a resin sheet. The roll stamper has the feature that the preformat pattern on the roll stamper has a value b/a of greater than 1, where the length of the preformat pattern in the direction parallel to the direction in which the resin sheet is transported is defined as a and the length in the direction perpendicular thereto as b.

Abstract: A method of fabricating free-standing thin films of polyimide by casting a polyamic acid solution onto a substrate that is free of parting agents and release agents is disclosed. The polyamic acid film is imidized on the substrate. The thickness of the polyimide film can range from about 200 .ANG. to about five microns. A frame is adhered to the polyimide film while the film still attached to the substrate, and the frame, film, and substrate assembly is immersed in an aqueous based liquid bath for several hours wherein the liquid bath is free of reactive chemical agents. The liquid bath is heated, preferably, to a temperature within the range 30.degree. to 100.degree. C. The liquid is prevented from contacting the polyimide film within the interior region of the frame. Next, the assembly is removed from the water bath. The film is scored around the outside edge of the frame with a cutting tool; this cutting step may be performed either prior to, during, or after the immersion step.

Abstract: Susceptors used for browning or crisping food prepared in microwave ovens and processes for the production of such susceptors. The susceptors are produced by laminating an anodizable metal (e.g. aluminum, tantalum, niobium, zirconium, titanium or tungsten) onto a suitable non-metallic substrate (e.g a heat resistant polyester film, a paperboard sheet or a glass, plastic or ceramic article) and anodizing the metal layer to form an anodic film covering a residual metal layer of suitable thinness to generate heat by resistance heating when irradiated by microwaves. The anodic film acts as a barrier to prevent the migration of any degradation products to the foodstuff undergoing the heating procedure. The susceptors can be used as wrappings for food items, as package inserts or as internal coatings on food containers and the like.

Abstract: A pressure-type contact for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers (100) in which one wafer is plated with a raised conductive interconnection feature (122). The electrical circuitry (118, 120) is made on a stainless steel mandrel (10, 10a) having a TEFLON pattern (16, 16a) on its surface that allows the desired electrical circuit (30, 32, 34, 30a, 32a, 34a, 78) to be electrolytically plated upon the conductive mandrel surface. The mandrel surface is formed with projecting features in the form of depressions (24, 24a) that will form a series of dots or raised interconnection features on the termination wafers. The mandrel also has projecting posts (76) for providing electrical connection through the substrate.

Abstract: A bilayer oxide film which comprises a preferably porous layer containing aluminum oxide and a non-porous layer comprising an oxide of a valve metal, e.g. tantalum. The layers are integral. The film is produced by forming a coating of aluminium or an anodizable aluminum alloy on a valve metal (or alloy), anodizing the resulting structure in an electrolyte (preferably one capable of converting the aluminum (or alloy) to a porous oxide film) in the presence of an adhesion-reducing agent (e.g. fluoride ions) that makes the resulting anodized bilayer film easily detachable from the remaining valve metal. The bilayer film is then detached from the valve metal, e.g. by adhering a flexible plastic film to the bilayer and using the film to peel off the bilayer from the valve metal. The resulting bilayer can be used for a variety of purposes, e.g. as a vapor or oxygen barrier useful for packaging, or as a coating containing magnetic particles used to make a magnetic recording medium.

Abstract: The invention relates to a laminated tamper-evident structure which exhibits an irreversible color change upon delamination. The structure includes a laminate of at least two layers capable of generating a color by a light interference and absorption phenomenon that requires direct and intimate contact between an adjacent two of the layers. The strength of attachment among the layers of the laminate is such that the laminate can be uniformly and reliably peeled apart at the interface between the adjacent two layers. An overlying flexible strip of transparent or translucent material is adhered to the laminate to facilitate the peeling operation. Upon peeling apart the laminate, the generated color is irreversibly lost, thus providing evidence that the structure has been tampered with. The structure can be incorporated into a variety of closable articles or products to provide evidence of opening or tampering.

Abstract: A process for producing a printed circuit board includes steps, sequentially conducted of dispersing in water or organic solvent:(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure, (B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and (C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of the components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l; separating the solids from the slurry and drying and molding them. Thereafter the solids are either subjected to melting with heating and pressure forming into the molded article, or they are impregnated with a thermoplastic resin which is then cured. Finally, a metal layer is provided on the molded article.

Abstract: A conductive copper foil for use in preparing printed circuit boards is protected from damage during storage, shipment and further processing by covering one side of the foil with a sheet of polyethylene film. The film is removably joined with the foil by an adhesive material placed between the film and the foil in a marginal area of the latter. The film is selected to be sufficiently resistant to laminating temperature and pressure conditions so as to remain in its covering, protecting relationship to the foil and avoid sticking to the laminating press plate and retain its removability from the foil after lamination.

Abstract: An optical device manufacturing method includes a step of accumulating an optical device inorganic material on a stamper by use of a vacuum thin-film growing method, and a step of removing the accumulated material from the stamper, thereby producing an optical device.

Abstract: A process for coating a packaging film with a transparent barrier coating. The process starts with a metal substrate made of, or having a surface coating of, a valve metal or valve metal alloy. The metal substrate is anodized to form an anodic film of the valve metal on the metal substrate. The anodic film is made readily detachable from the metal by carrying out the anodization step in the presence of an adhesion-reducing agent, e.g. a fluoride. The packaging film is then attached to the anodic film and the anodic film is detached from the metal. The transferred anodic film forms a thin dense oxide coating on the packaging film that acts as a barrier against oxygen and moisture transport. The invention can be used for making packaging films suitable for packaging foodstuffs, and the like.

Abstract: A process for coating a packaging film with a transparent barrier coating. The process starts with a metal substrate made of, or having a surface coating of, a valve metal or valve metal alloy. The metal substrate is anodized to form an anodic film of the valve metal on the metal substrate. The anodic film is made readily detachable from the metal by carrying out the anodization step in the presence of an adhesion-reducing agent, e.g. a fluoride. The packaging film is then attached to the anodic film and the anodic film is detached from the metal. The transferred anodic film forms a thin dense oxide coating on the packaging film that acts as a barrier against oxygen and moisture transparent. The invention can be used for making packaging films suitable for packaging foodstuffs, and the like.

Abstract: A process for coating a polymer sheet with a transparent coating having moisture and oxygen barrier properties. The process starts with a metal substrate made of, or having a surface coating of, a valve metal or valve metal alloy. The metal substrate is anodized to form an anodic film of the valve metal on the metal substrate. The anodic film is made readily detachable from the metal by carrying out the anodization step in the presence of an adhesion-reducing agent, e.g. a fluoride. The polymer sheet, usually in the form of a thin transparent layer, is then attached to the anodic film and the anodic film is detached from the metal. The transferred anodic film forms a thin dense oxide coating on the polymer sheet that acts as a barrier against oxygen and moisture transport. The invention can be used for making packaging sheets suitable for packaging foodstuffs, and the like.

Abstract: A printed circuit is formed by conventional methods over an adhesive coating applied to a flexible high temperature withstandability disposable backing to form a flexible laminate which is positioned in a cavity of an injection mold to conform to surface variations. The printed circuit conductors are surrounded on three sides by molten plastic material injected into the mold cavity to embed the conductors in the respective surfaces of the molded plastic article, which surfaces are non-coplanar and adjoining and the conductors are continuous from one surface to the other. The bond strength of the adhesive is preferably high with regard to the backing and low with regard to the printed circuit conductors to permit adhesive and backing to be peeled away after molding, thereby providing a three diemensional printed circuit in, for example, a recessed area of a molded plastic housing part of electrical apparatus.

Abstract: A method of fabricating a multilayer circuit board having rigid and flexible sections using Z-axis laser routing. A rigid superstructure is provided for lamination to a flexible circuit substrate, wherein the superstructure includes specially configured strips of laser reflective material, disposed on the laminating surface thereof, defining the boundary between the rigid and flexible sections of the multilayer circuit board. In subsequent processing, a beam of laser energy is directed through the rigid superstructure, along the Z-axis thereof, superjacent to each strip of laser reflective material, thereby cutting through the material of the superstructure creating a laser routed channel which forms an interface between the rigid and flexible sections of the finished multilayer circuit board.

Abstract: A process for making additive multilayer circuit boards uses separately designed and fabricated composite structures each consisting of a patterned conductive metal foil supported by a photo-processible insulating film. The composite is bonded foil pattern side down to the substrate or pre-existing multilayer structure and selected areas of the insulating film are removed down to underlying metal sites for electroless plating. All of the apertures in the insulating film are then electrolessly plated full of metal flush to the upper surface. Additional patterned composites are applied and plated up as desired to create blind vias and new conductor patterns layer by layer. In an alternate process a foil clad composite is bonded to an existing substrate foil side up. The insulating layer is selectively etched through windows photoetched in the foil layer. The voids in the insulator layer expose copper sites on the underlying composite.

Abstract: Water-compatible resins containing a residue of an aryl or cycloalkyl compound having a sufficiently bulky structure to raise the T.sub.g of a specified cured epoxy resin by more than 20.degree. C. The resins preferably are used in cathodic electrophoretically-depositable coating compositions.

Abstract: A solid propellant rocket motor casing fabricated from strong filament in a matrix of curable polymer known in the trade as a composite motor casing is protected against permeation therethrough over long periods of time of water vapor from the atmosphere by a thin, lightweight, metal foil barrier comprising a metal foil adhesively backed tape such as aluminum foil tape spirally wrapped over the cylindrical or regular surface areas and by a separate, lightweight, metallic shell or dome having a thickness of 0.005 to 0.008 inches adhesively bonded onto the dome ends of the composite material cased solid propellant rocket motor, each metallic shell or dome being made by the use of a plastic or other destructible mold which is first coated with metal by an ion-vapor deposition process to a thickness of less than 0.

Abstract: A process for producing a copper lead frame tape in which the individual fingers of the lead frame are provided with gold plated bumps. A copper foil is provided with dry film photoresist on both sides and is initially processed to provide openings in one side of the resist for electroforming of the end products directly on the copper foil. Further processing produces openings on the other resist side in locations other than opposite the first resist side bumps whereby a following chemical milling of the exposed opposite side copper yields a plurality of fingers, each consisting of an integral bump/copper foil arrangement. The electroforming step is made possible by a novel double-cell electroplating method in which a relatively high-impedance ion path connects the two cells. Bump heights of as much as 0.0013 inch or greater are produced by the disclosed process, with uniformly excellent quality.

Abstract: The present invention is directed to the use of ordered polymers as a substrate material for the preparation of printed wire boards (PWB). In preferred embodiments, the PWB of the present invention comprises a generic, high density, organic multilayer PWB capable of being employed as a high density leadless perimeter and in grid array ceramic chip packages. Specific chip package density requirements are 0.020-in. centers with up to 300 input/outputs (I/Os) for perimeter type packages and 0.050-in. center grid array type packages with up to 240 I/Os per device. In its most preferred embodiments, the present invention is directed to a method of forming a PBT PWB substrate layer of 0.0025 in. or less in thickness. Another preferred aspect of the present invention concerns the discovery that a copper layer can be bonded to a PBT film substrate with a strength comparable to existing PWB materials.

Abstract: A process for producing circuit boards involves the coating of a temporary substrate with a fluid mixture of an epoxy polymer component and a rubber polymer which is interactive therewith at temperatures of at least 180.degree. F. Preferably the rubber is a low molecular weight polyfunctional reactive butadiene/acrylonitrile interpolymer which is terminated by vinyl or carboxyl functional groups. The rubber component comprises at least 70 percent by weight of the epoxy polymer component, and the coating has a thickness of 0.001-0.015 inch. The coating is air dried upon the temporary substrate, and then the coating is transferred to the resinous substrate of the circuit board by heat and pressure. The coating is partially cured to effect partial polymerization of the epoxy prepolymer, further polymerization of the rubber, if it is of low molecular weight, and interaction of the rubber and epoxy polymer to form a matrix of the interacted rubber/epoxy.

Abstract: A wiring board comprising (A) a base substrate on which the necessary wiring pattern has already been formed, and (B) a multi-layer substrate bonded to the wiring pattern side of said base substrate (A) and comprising heat-resistant resin layers and thin-film wiring patterns formed by a thin film forming method under vacuum can mount LSI chips on the substrate and realize increased density of signal wiring.

Abstract: Water-compatible resins containing a residue of an aryl or cycloalkyl compound having a sufficiently bulky structure to raise the T.sub.g of a specified cured epoxy resin by more than 20.degree. C. The resins preferably are used in cathodic electrophoretically-depositable coating compositions.

Abstract: The present invention relates to a method of manufacturing printed circuit boards.The method of manufacturing printed circuit boards under the present invention is to provide holes on a metal plate, to attach a prepreg to the metal plate, and to fill the prepreg into the holes by heat-pressing the metal plate to which the prepreg is attached. Thereafter, lead wire holes are provided at the centers of prepreg filled the holes, and a resin plate having at least one circuit layer and through holes is glued to the metal plate. Alternately, a resin plate having at least one circuit layer and lead wire holes, or a resin plate having at least one circuit layer, through holes and lead wire holes are glued to the metal plate on the side where the prepreg is attached.

Abstract: A process for producing circuit boards involves the coating of a resinous substrate with a fluid mixture of an epoxy polymer component and a rubber polymer which is interactive therewith at temperatures of at least 180.degree. F. Preferably the rubber is a low molecular weight polyfunctional reactive butadiene/acrylonitrile interpolymer which is terminated by vinyl or carboxyl functional groups. The rubber component comprises at least 70 percent by weight of the epoxy polymer component, and the coating has a thickness of 0.001-0.015 inch. The coating is partially cured to effect partial polymerization of the epoxy prepolymer, further polymerization of the rubber, if it is low molecular weight, and interaction of the rubber and epoxy polymer to form a matrix of the interacted rubber/epoxy. The exposed surface of this coating is then etched, and metal is deposited on the surface to form a conductive layer.

Abstract: A printed wiring board comprising a plastic material is formed with a through opening for mounting electronic parts therein, and the end of the opening on the rear side of the board is closed by a metal sheet bonded to the area around the opening end on the rear of the board through an adhesive layer. The inside wall and bottom face of the opening in the board are coated with an integral plating film as are the rear surfaces of the board an metal sheet. According to this board structure, the heat generated from electronic parts mounted on the bottom of the opening is dispersed by the metal sheet, and also penetration of moisture into the opening through the plastic material and the adhesive layer, as occurs with conventional boards, is prevented by the plating film.

Abstract: Copper etching process and product particularly suitable for use in the manufacture of printed circuit boards. The copper is etched in a liquid etchant, and the crystal structure of the copper is selected and carefully controlled to provide an anisotropic etch and a vertical-to-lateral etching ratio greater than 1:1. In one disclosed embodiment, the etching solution contains nitric acid, copper nitrate or sulfuric acid, a polymer and a surfactant, and the copper has a top surface crystal structure with predominantly (111) orientation. In another disclosed embodiment, the etching solution contains hydrogen peroxide and sulfuric acid, and the copper foil has a top surface crystal structure with predominantly (311) and (511) orientations and/or (111) orientation.

Abstract: Copper etching process and product particularly suitable for use in the manufacture of printed circuit boards. The copper is etched in a liquid etchant, and the crystal structure of the copper is selected and carefully controlled to provide an anisotropic etch and a relatively high vertical-to-lateral etching ratio. In one disclosed embodiment, the etching solution contains nitric acid, copper nitrate or sulfuric acid, a polymer and a surfactant, and the copper has a top surface crystal structure with predominantly (111) to (200) orientations and relatively little (220) orientation. In another disclosed embodiment, the etching solution contains hydrogen peroxide and sulfuric acid, and the copper foil has a top surface crystal structure with predominantly (311) and (511) orientations and/or (111) and (200) orientations.

Abstract: The present invention provides a method for making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated by a resist in remaining areas which comprises (i) protecting the bare metal by electrodepositing a resin thereon, (ii) while leaving the electrodeposited resin substantially uncured, removing the resist from said remaining areas using a solvent which will not remove the electrodeposited resin, thereby exposing metal in said remaining areas, (iii) etching the metal exposed in (ii) using an etchant which does not remove the electrodeposited resin, and (iv) removing the electrodeposited resin with a suitable solvent.

Abstract: Flexible printed circuits and methods of fabricating and forming plated thru-holes therein are disclosed. The flexible printed circuits have one or more substantially rigid regions where plated thru-holes are to be formed, the regions being made rigid by the substitution of epoxy glass or other conventional rigid printed circuit board materials in place of the flexible material used for the flexible portions of the circuit. In this manner the thru-holes are formed through conventional printed circuit board layers, allowing plating of the thru-holes using conventional well developed techniques. This process avoids the necessity of plating thru-holes in flexible printed circuit materials currently requiring special equipment and techniques, and further avoids stress concentration at the junction between the rigid plated thru-holes and the adjacent flexible printed circuit. Various methods for forming such circuits and circuits so formed are disclosed.

Abstract: A process for producing circuit boards involves the coating of a resinous substrate with a fluid mixture of an epoxy polymer component and a rubber polymer which is interactive therewith at temperatures of at least 180.degree. F. Preferably the rubber is a low molecular weight polyfunctional reactive butadiene/acrylonitrile interpolymer which is terminated by vinyl or carboxyl functional groups. The rubber component comprises at least 70 percent by weight of the epoxy polymer component, and the coating has a thickness of 0.001-0.015 inch. The coating is partially cured to effect partial polymerization of the epoxy prepolymer, further polymerization of the rubber, if it is low molecular weight, and interaction of the rubber and epoxy polymer to form a matrix of the interacted rubber/epoxy. The exposed surface of this coating is then etched, and metal is deposited on the surface to form a conductive layer.

Abstract: Copper etching process and product particularly suitable for use in the manufacture of printed circuit boards. The copper is etched in a liquid etchant, and the crystal structure of the copper is selected and carefully controlled to provide an anisotropic etch and a relatively high vertical-to-lateral etching ratio. In one disclosed embodiment, the etching solution contains nitric acid, copper nitrate or sulfuric acid, a polymer and a surfactant, and the copper has a top surface crystal structure with predominantly (111) and (200) orientations and relatively little (220) orientation. In another disclosed embodiment, the etching solution contains hydrogen peroxide and sulfuric acid, and the copper foil has a top surface crystal structure with predominantly (311) and (511) orientations.

Abstract: Disclosed is a method of forming an electrically conductive circuit comprising the steps of: preparing a transferring paper in which an assembly of electrically conductive foil carrying a predetermined pattern and an insulating layer containing glass frit and an overcoat layer consisting of a resin film having good burning property are provided on a transferring paper covered with a paste layer; removing an integral structure of the conductive foil, the insulating layer, and the overcoat layer from the transferring paper; transferring the removed integral structure onto a substrate; and burning the substrate with the integral structure set thereon at a temperature where the glass is soften. According to this method, it is possible to eliminate transformation or damage of a conductive foil where a conductive foil is singly disposed on a substrate.

Abstract: Disclosed is an adhesive composition which contains (1) a polymer selected from acrylonitrile/butadiene copolymers, carboxyl group-containing acrylonitrile/butadiene copolymers, acrylic rubbers, urethane rubbers, chloroprene rubbers, chlorosulfonated polyethylene, ethylene/vinyl acetate copolymers, ethylene/acrylic acid or its ester or metal salt copolymers, ethylene/methacrylic acid ester or metal salt copolymers, thermoplastic polyurethanes, saturated polyesters and polyamides, (2) an epoxy acrylate resin, (3) an acrylic or methacrylic monomer having at least two different functional groups and/or an acrylic or methacrylic monomer of the formula: ##STR1## wherein R.sub.1 is H or CH.sub.3 and R.sub.2 is (C.sub.1 -C.sub.18) alkyl or an organic residue containing an aromatic hydrocarbon ring or a heterocyclic ring, (4) an organic peroxide and (5) an imidazole or an amino compound containing at least one tertiary amino group.

Abstract: The invention provides a method by means of which it becomes possible to produce emblems or wordmarks having three-dimensional symbols, both the front face and the raised side faces of which are metallized, while the substrate is not metallized. For that purpose, the symbols are injection molded with a carrier and they are not secured to a separately manufactured substrate until after the metallizing operation.

Abstract: Hydrogenated boron-silicon alloy films having unexpected properties permitting in one embodiment the bonding together of metal and ceramic substrates by coating the surfaces to be bonded with the film mating the surfaces and heat treating the mated surfaces to expell hydrogen therefrom and to react to resulting boron-silicon alloy film with the substrates to form a liquid reaction product which forms a surface bond with the substrates or is at least partially absorbed in the substrates. In another embodiment, at least one surface of an intermetallic compound formed from elements selected from groups III and V of the periodic table is sealed against structural degradation by forming on the surface a solid boron-silicon-hydrogen alloy film. In still another embodiment, metal and organic resin substrates are protected against attack by water vapor, dissociated oxygen and molecular oxygen by forming a solid boron-silicon-hydrogen alloy film on the substrates.