Metal Foil Lamina Patents (Class 156/233)
  • Patent number: 10405421
    Abstract: A layup for multiple-layer printed circuit board manufacturing is formed according to a process that includes selectively applying a dielectric resin to a high resin demand region of a circuitized core layer without applying the dielectric resin to another region of the circuitized core layer. The process also includes partially curing the dielectric resin within the high resin demand region. The process further includes forming a layup that includes a layer of pre-impregnated (prepreg) material adjacent to the partially cured dielectric resin within the high resin demand region of the circuitized core layer.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: September 3, 2019
    Assignee: International Business Machines Corporation
    Inventors: Bruce J. Chamberlin, Matthew S. Kelly, Scott B. King, Joseph Kuczynski
  • Patent number: 10336034
    Abstract: A carrier-attached metal foil includes a plate-shaped carrier, a metal foil laminated on at least one of surfaces of the carrier, and a fixing unit configured to fix a periphery of the carrier and a periphery of the metal foil to each other.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: July 2, 2019
    Assignee: FREESIA MACROSS CORPORATION
    Inventor: Beji Sasaki
  • Patent number: 10244623
    Abstract: A method and apparatus for forming a circuit on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface of an object is described. An amount of electrically conductive material to form a circuit between two points on the object is determined. The determined amount of electrically conductive material is deposited on a first surface of a stretchable substrate. The stretchable substrate with the deposited electrically conductive material is applied to the object to form a circuit between two points on the object.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: March 26, 2019
    Assignee: FLEXTRONICS AP, LLC
    Inventors: Anwar Mohammed, Weifeng Liu, Murad Kurwa
  • Patent number: 10232601
    Abstract: A decoration method of a printed matter includes: forming a printed layer on a surface of a sheet or of a mounting paper with a transparent varnish, printing a predetermined pattern on the surface of the printed layer by an ink or by a resin which are capable of being adhered to the printed layer; and pressing a metal foil onto the pattern printed by the ink or the resin with an adhesive agent. The adhesive agent does not adhere to the printed layer but adheres to the pattern. As a result, the metal foil 6 is printed only to the pattern.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: March 19, 2019
    Assignee: Japan Card Products Co., Ltd.
    Inventors: Yoshiyuki Kawakami, Tomoki Tsunoda
  • Patent number: 10178773
    Abstract: Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.
    Type: Grant
    Filed: December 24, 2012
    Date of Patent: January 8, 2019
    Assignee: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Nam Boo Cho, Young-Koo Han, Myung Bong Yoo, Woong Ku On
  • Patent number: 10064273
    Abstract: Control panels with antimicrobial copper sheet overlays are disclosed. In some embodiments, the antimicrobial copper used in the copper sheet overlays can be selected from copper or copper alloys containing from about 60 to about 100 wt % copper. In other embodiments, the copper sheet overlays have one or more deflection spots to permit an operator to use the control panel to operate an electronic device. Some embodiments include methods to manufacture the control panels comprising antimicrobial copper sheet overlays. Further embodiments include methods for operating an electronic device using the control panels comprising antimicrobial copper sheet overlays.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: August 28, 2018
    Assignee: MR Label Company
    Inventor: Patrick H. Meehan, Jr.
  • Patent number: 10042308
    Abstract: Herein is disclosed a method of electrostatic printing and foiling comprising: forming a colored toner image on a print substrate by electrostatically printing an electrostatic ink comprising a first resin component comprising an ethylene acrylic acid resin, an ethylene methacrylic acid resin or combinations thereof; forming an adhesive toner image disposed on the colored toner image on the print substrate by electrostatically printing a liquid electro photographic (LEP) printing composition comprising a first resin component comprising an ethylene acrylic acid resin, an ethylene methacrylic acid resin or combinations thereof, and a second resin component present in an amount of about 20% to about 80% by weight of total solids content of the LEP printing composition, the second resin component having a melting point of from about 50° C. to about 75° C.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: August 7, 2018
    Assignee: HP Indigo B.V.
    Inventors: Hannoch Ron, Shai Lior, Mark Sandler, Gleb Romantcov, Daniel Skvirsky
  • Patent number: 10030309
    Abstract: A chemical engraving machine to engrave a plate of stainless steel moved along an horizontal direction, said machine comprising a base, an acid liquid circuit adapted to chemically attack said plate of stainless steel at locations where it is not protected by a protection mask, a lower guiding device, an upper guiding device, the lower and upper guiding devices being configured to maintain said plate of stainless steel substantially vertically, and a nozzle support bearing a plurality of spraying nozzles projecting horizontally the acid liquid toward the plate of stainless steel. A method chemically engraves a plate of stainless steel in a vertical position.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: July 24, 2018
    Assignee: THE DILLER CORPORATION
    Inventors: Franck Dupuy, Joël Harmand, Inocencio Marcos, François Lapeyre
  • Patent number: 10010785
    Abstract: A gaming ticket and method for providing the same includes foil applied to the gaming ticket surface such that the foil covers less than the entire surface of any surface of the gaming ticket.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: July 3, 2018
    Assignee: Muncie Novelty Company, Inc.
    Inventor: Brian Overholt
  • Patent number: 9966472
    Abstract: A stacked structure includes: an insulating substrate; a graphene film that is formed on the insulating substrate; and a protective film that is formed on the graphene film and is made of a transition metal oxide, which is, for example, Cr2O3. Thereby, at the time of transfer of the graphene, polymeric materials such as a resist are prevented from directly coming into contact with the graphene and nonessential carrier doping on the graphene caused by a polymeric residue of the resist is suppressed.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: May 8, 2018
    Assignee: FUJITSU LIMITED
    Inventor: Junichi Yamaguchi
  • Patent number: 9849624
    Abstract: A film-embossing apparatus with a hot-embossing device which has a heated embossing stamp. With the formation of a contact pressure, a transfer layer, arranged on a carrier film, of a hot-embossing film is transferred to a surface of a workpiece. The hot-embossing device has control inputs and outputs. The film-embossing apparatus has an industrial robot with control inputs and outputs. The control inputs and outputs of the hot-embossing device and of the industrial robot are connected to a control unit. The industrial robot is formed such that it guides the workpiece to the hot-embossing device, positions the workpiece on the embossing stamp, guides the workpiece past the embossing stamp, and guides the embossed workpiece away from the hot-embossing device. The industrial robot can also position the hot-embossing device on the workpiece.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: December 26, 2017
    Assignee: LEONHARD KURZ STIFTUNG & CO. KG
    Inventors: Ljubisa Drinic, Michael Triepel, Ralf Friedmann, Thomas Meier
  • Patent number: 9839141
    Abstract: There is provided a method for manufacturing a component interconnect board (150) comprising a conductor structure for providing electrical circuitry to at least one component (114) when mounted on the component board, the method comprising providing a conductor sheet (100) with a first predetermined pattern (115), providing a solder resist sheet (112) with a second predetermined pattern for defining solder areas (125) of the component board, forming a subassembly (120) by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate (130). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: December 5, 2017
    Assignee: PHILIPS LIGHTING HOLDING B.V.
    Inventor: Antonius Petrus Marinus Dingemans
  • Patent number: 9823394
    Abstract: The present disclosure relates to prismatic retroreflective articles that includes a security mark and to methods of making such articles.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: November 21, 2017
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Suman K. Patel, Bruce D. Orensteen, Mikhail L. Pekurovsky
  • Patent number: 9789995
    Abstract: A method for manufacturing an ammonia storage cartridge includes a step for supplying a material by ammonia absorption or adsorption by absorbent salts, a step for producing an intermediate element, including compacting the material to form the intermediate element, a step for stacking at least two intermediate elements in a shell of the cartridge, and a step for compressing the stack of intermediate elements in the shell.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: October 17, 2017
    Assignee: Faurecia Systemes D'Echappement
    Inventor: Serge Saint-Dizier
  • Patent number: 9719263
    Abstract: A system, kit, and method of resurfacing and/or embellishing a surface is provided. The kit includes a plurality of materials, such as cleaner, primer, adhesive, paper, and sealer. Each material is provided in a quantity for covering a pre-determined area such that the kit is capable of refinishing and/or embellishing a surface having a size equal to the pre-determined area. The kit also includes tools for refinishing and/or embellishing the surface. The method includes cleaning and priming the surface, cutting and/or tearing paper, adhering the paper to the primed surface, and sealing the paper between the surface and a sealer layer. The system and method enables a user to resurface a variety of surfaces, including surfaces that include a variety of edges, corners, curves, and/or recessed areas, enabling the user to transform the appearance of the surface so that it resembles a more expensive surface, such as natural stone.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: August 1, 2017
    Assignee: King Conroy, LLC
    Inventors: Kelly S. King, Michael C. Conroy
  • Patent number: 9688062
    Abstract: A method of fabricating a device includes providing a process substrate on a carrier substrate, where the process substrate has a rectangular shape with a pair of long sides and a pair of short sides, providing a device on the process substrate, and continuously peeling the process substrate from the carrier substrate along a curve passing through a starting point which is one of vertices the process substrate, where the curve substantially perpendicularly passes through one of the short sides spaced apart from the starting point.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: June 27, 2017
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Yukinori Asakawa
  • Patent number: 9585261
    Abstract: A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: February 28, 2017
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Ayumu Tateoka, Shinichi Obata, Toshiyuki Shimizu
  • Patent number: 9570952
    Abstract: A disk motor including: a rotor; a stator; an output shaft concentrically fixed to the rotor; at least one coil disk which is provided to one of the rotor or the stator, a coil pattern which includes a plurality of radial patterns or radial pattern groups extending outwards in a radial direction from a center part of the coil disk being formed on at least one surface of the coil disk; an electric current supply portion which supplies electric current to the coil pattern; a magnetic flux generating portion which is provided to another of the rotor or the stator and faces the coil pattern; and an intermediate pattern which is formed between adjacent radial patterns or adjacent radial pattern groups on the coil disk.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: February 14, 2017
    Assignee: HITACHI KOKI CO., LTD.
    Inventors: Kenichirou Yoshida, Hideyuki Tanimoto
  • Patent number: 9554472
    Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a substantially rectangular base, situating an outer conductive foil situated on the inner foil, or coupling, using a connective material, the inner foil and the outer conductive foil near edges of the outer conductive foil and the inner foil.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: January 24, 2017
    Assignee: Intel Corporation
    Inventors: Ching-Ping Janet Shen, Ravi Shankar, Yonggang Li, Dilan Seneviratne, Charan K. Gurumurthy
  • Patent number: 9554468
    Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: January 24, 2017
    Assignee: Intel Corporation
    Inventors: Ching-Ping Janet Shen, Charan K. Gurumurthy, Dilan Seneviratne, Ravi Shankar, Liwen Jin, Deepak Arora
  • Patent number: 9522521
    Abstract: In various embodiments, an apparatus for separating a stacked arrangement including a first layer, a second layer and a release layer between the first layer and the second layer may be provided. The apparatus may include an attachment surface configured to suspend the stacked arrangement by attaching to the first layer. The apparatus may further include an actuating mechanism configured to form a curvature of the first layer by bending the attachment surface. The apparatus may also include a holder to hold an etchant for etching the release layer to separate the first layer from the second layer.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: December 20, 2016
    Assignee: Nanyang Technological University
    Inventors: Soon Fatt Yoon, Dawei Xu, Chiew Yong Yeo
  • Patent number: 9278512
    Abstract: A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: March 8, 2016
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Shuo-Yang Sun, Wan-Chen Huang, Wei-Ting Lin, Chun-Cheng Cheng
  • Patent number: 9247649
    Abstract: Methods for fabricating printed circuit boards, devices for use in the fabrication of printed circuit boards, and structures for a printed circuit board. A mold may be formed as a device that includes a plurality of features, such as recesses, corresponding to a layout of a plurality of conductors for the printed circuit board. A sheet comprised of an electrically-conductive material may be deformed to match the features of the mold. A substrate may then be added to support the sheet, and the sheet may be selectively removed with a mechanical process to define the conductors of the printed circuit board.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: January 26, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventor: Craig N. DeVarney
  • Patent number: 9023166
    Abstract: A method of transferring graphene is provided. A method of transferring graphene in accordance with an exemplary embodiment of the present invention may include forming a graphene layer by composing graphene and a base layer, depositing a self-assembled monolayer on the graphene layer, and separating a combination layer comprising the self-assembled monolayer and the graphene layer from the base layer.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: May 5, 2015
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jin Sik Choi, Young-Jun Yu, Jin Tae Kim, Kwang Hyo Chung, Doo Hyeb Youn, Choon Gi Choi
  • Publication number: 20150114551
    Abstract: A carrier film of thermoplastic polyester has releasable metal adhesive properties suitable for a metal transfer in which the polyester film is metalized and the metal layer is subsequently transferred to a permanent adhesive-coated substrate. The metal layer is in direct contact with the polyester carrier film and no intermediate release layer is present. Desired metal adhesion is provided by dispersing an suitable surfactant, and optionally, a hydrocarbon wax, uniformly into the polyester film. Surfactant on the outer surface of the carrier film modifies metal adhesion to the polyester such that the metal can be removed in a metal transfer operation.
    Type: Application
    Filed: December 30, 2014
    Publication date: April 30, 2015
    Applicant: TORAY PLASTICS (AMERICA), INC.
    Inventor: Jan Moritz
  • Patent number: 9005391
    Abstract: An embodiment of the inventive method of transfer lamination bonding a first metallized side of a film to a substrate. Then a breakaway coating is applied to a second, non-metallized side of the film after the first metallized side has been bonded to the substrate. The bonded film and substrate are then placed in an oven. The film is then stripped from the substrate leaving metal from the film deposited on the substrate. The application of the breakaway coating is performed as an inline part of the transfer lamination process thereby providing an ease of manufacture presently unknown.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: April 14, 2015
    Assignee: Hazen Paper Company
    Inventor: John Hazen
  • Patent number: 8961725
    Abstract: A method of placement of a component on a stretchable substrate is described. A base substrate, having a stretchable substrate layer, and a flexible foil, having an integral arrangement of multiple flexible foil components, are aligned, so as to be used in a reel based manufacturing process. Through lamination of the base substrate and the flexible foil an electro/optical via connection between in plane interconnecting traces on the stretchable substrate layer and component pads of the integral component arrangement is provided. The integral arrangement of flexible foil components are mechanically separated. The method may be used in a manufacturing process for multi-foil systems.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: February 24, 2015
    Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
    Inventors: Marinus Marc Koetse, Harmannus Franciscus Maria Schoo, Margaretha Maria De Kok
  • Patent number: 8945702
    Abstract: The present invention provides flexible packaging webs comprising a non-oriented metallized sealant film characterized by a secant modulus of less than 120,000 psi and an elongation at break of greater than 150%, wherein the non-oriented metallized sealant film comprises (1) a thermoplastic base layer of a material selected from the group consisting of ethylene/vinyl alcohol copolymer, ethylene/acrylic acid copolymer, ethylene/norbornene copolymer, polyamide and blends thereof; (2) a metal coating deposited on the base layer and having an optical density of 1.0 to 3.0; and (3) a heat sealing layer. The packaging webs of the present invention each exhibit an oxygen gas transmission rate of between 0 to 10.0 cm3/100 in2/24 hours at 73° F. (0 to 155 cm3/m2/24 hours at 23° C.) and 0% relative humidity and a water vapor transmission rate of between 0 to 0.1 g/100 in2/24 hours at 100° F. (0 to 1.55 g/m2/24 hours at 38° C.) and 90% relative humidity. The sealant films are formed by a blown coextrusion method.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: February 3, 2015
    Assignee: Bemis Company, Inc.
    Inventors: Sam Edward Wuest, Curtis Randolph Barr, Chris Scott Mussell, Steven James Dennis
  • Patent number: 8932425
    Abstract: The invention relates to a method and a transfer strip for decorating surfaces, in particular for decorating outer packagings. A transfer strip comprising a strip-like backing film (11), a decorative layer (13) and a release layer (12) arranged between the decorative layer (13) and the backing film is provided. The decorative layer (13) has a multiplicity of identical optically variable decorative elements, which are arranged in first area regions, which are separate from one another and spaced apart from one another in the longitudinal direction of the transfer strip. The decorative layer (13) has second area regions, which are separate from one another and spaced apart from one another in the longitudinal direction of the transfer strip and in which the decorative layer (13) has one or more individualizable layers for providing respectively different machine-readable optical markings.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: January 13, 2015
    Assignee: Leonhard Kurz Stiftung & Co. KG
    Inventors: Norbert Lutz, Walter Kurz, Ludwig Brehm, Hans Peter Bezold
  • Publication number: 20140356574
    Abstract: Fabrics made for apparel, tents, sleeping bags and the like, in various composites, constructed such that a combination of substrate layers and insulation layers is configured to provide improved thermal insulation. The fabric composites are constructed to form a radiant barrier against heat loss via radiation and via conduction from a body.
    Type: Application
    Filed: June 2, 2014
    Publication date: December 4, 2014
    Inventors: Brian John Conolly, Thomas Kenneth Hussey
  • Publication number: 20140338739
    Abstract: An integrated back-sheet for a back contact photovoltaic module is provided. The integrated back-sheet is formed from a polymer substrate and a conductive metal foil that is die cut to provide a metal foil circuit that is adhered to the polymer substrate. A back contact solar cell module incorporating the integrated back-sheet with the die cut metal foil circuit is also provided. Processes for forming such integrated back-sheets and back contact solar cell modules are also provided.
    Type: Application
    Filed: October 31, 2011
    Publication date: November 20, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Zelin Liu, Qiuju Wu
  • Patent number: 8840745
    Abstract: A method of printing foil images upon textiles is provided. Advantageously, a digital inkjet printer can be utilized to apply an adhesive for affixing a foil embellishment. The method of printing foil images upon textiles includes applying a pretreatment solution upon a textile. After the pretreatment solution has dried, a white underbase in the form of a fanciful design is printed upon the textile using a digital inkjet printer. A heavy color layer of color ink is then digitally inkjet printed upon the white underbase. Thereafter, the textile is removed from the inkjet printer and positioned upon a heat press table. Foil transfer paper is positioned upon the textile so as to cover the white underbase and heavy color layer. The heat press is activated so as to adhere the foil, but only to those regions where the white underbase and color ink has been printed. Once cool to the touch, the foil is slowly peeled from the textile so as to leave a fanciful foil design.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: September 23, 2014
    Inventor: Paul Green
  • Patent number: 8834659
    Abstract: The aim of the invention is to improve the supply of transfer foil in a coating module in which the image-forming layers of a transfer foil are transferred to a printing material. To achieve this, a partial pressing surface is located in the coating module for transferring the layers of the transfer foil. This permits targeted control of the foil feed. The transfer foil can be fed past a pressure cylinder in an approximately tangential manner and with a limited width.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: September 16, 2014
    Assignee: manroland sheetfed GmbH
    Inventors: Mario Preisner, Michael Zinke
  • Publication number: 20140124128
    Abstract: A carrier film of thermoplastic polyester has releasable metal adhesive properties suitable for a metal transfer in which the polyester film is metalized and the metal layer is subsequently transferred to a permanent adhesive-coated substrate. The metal layer is in direct contact with the polyester carrier film and no intermediate release layer is present. Desired metal adhesion is provided by dispersing an suitable surfactant, and optionally, a hydrocarbon wax, uniformly into the polyester film. Surfactant on the outer surface of the carrier film modifies metal adhesion to the polyester such that the metal can be removed in a metal transfer operation.
    Type: Application
    Filed: June 28, 2013
    Publication date: May 8, 2014
    Applicant: TORAY PLASTICS (AMERICA) INC.
    Inventor: Jan Moritz
  • Patent number: 8657982
    Abstract: The steps of a method for fabricating a proximity sensing module that is adapted to be attached to a mobile device, include: (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film; and (c) forming a through hole in the adhesive sheet such that the upper connective pad is exposed from the through hole.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: February 25, 2014
    Assignee: Quanta Computer, Inc.
    Inventors: Yuan-Chen Liang, Chia-Hui Wu, Hung-Ta Lee, Yi-Chun Lin, Li-Chuan Chien, Kuo-Hsiang Hsu
  • Publication number: 20130340929
    Abstract: There is provided a method of manufacturing a stamp for a plasmonic nanolithography apparatus. The method includes forming metal patterns on a substrate, coating a hydrophobic thin film on external surfaces of the metal patterns to hydrophobic processing the external surfaces of the metal patterns, selectively hydrophilic processing only the external surfaces of the metal patterns, laminating a buffer layer on the substrate and the metal patterns, and transcribing the metal patterns and the buffer layer from the substrate to a base formed of light transmission material to be combined with the base.
    Type: Application
    Filed: December 26, 2012
    Publication date: December 26, 2013
    Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventor: KOREA INSTITUTE OF MACHINERY & MATERIALS
  • Publication number: 20130336700
    Abstract: A keyboard includes a plurality of keys, and a keyframe into which the plurality of keys are assembled. Each of the keys includes: i) a plunger on which a character is printed, and ii) a keycap made of a transparent material. The keycap covers at least a portion of a top of the plunger.
    Type: Application
    Filed: May 24, 2013
    Publication date: December 19, 2013
    Applicant: Logitech Europe S.A
    Inventors: Olivier Dumont, Baptiste Merminod, Alain Tabasso, Jean-Marc Flueckiger, Patrick Monney, Nicolas Chauvin, Gerd Schneider
  • Publication number: 20130313224
    Abstract: An embodiment of the invention provides a method for forming an antenna which includes: providing a workpiece having a surface; providing a compression head including a main body, a soft rubber head disposed on the main body, and at least a through-hole, wherein the through-hole penetrates through the main body and the soft rubber head; adsorbing and fixing a conducting film on the soft rubber head through the through-hole; moving the compression head against the surface of the workpiece to press the conducting film onto the surface of the workpiece; removing the compression head; and patterning the conducting film.
    Type: Application
    Filed: May 24, 2013
    Publication date: November 28, 2013
    Applicant: Wistron NeWeb Corp.
    Inventors: Ching-chia MAI, Chih-Ching HSU, Yuan-Chin HSU, Cheng-Han LEE
  • Patent number: 8574389
    Abstract: A method of manufacturing a thin film device according to an aspect of the invention may include: preparing a substrate on which a sacrificial layer and a thin film to be transferred are sequentially formed; temporarily bonding the thin film to a circumferential surface of the transfer roll, and simultaneously removing the sacrificial layer to separate the thin film from the substrate at a first position of a transfer roll that is rolling; and transferring the thin film onto a sheet by running the sheet so that a surface of the sheet is bonded to the thin film temporarily bonded to the circumferential surface of the transfer roll. The substrate may be a transparent substrate.
    Type: Grant
    Filed: May 15, 2009
    Date of Patent: November 5, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hwan-Soo Lee, Yongsoo Oh
  • Publication number: 20130224447
    Abstract: A textile printing method includes coating a printing surface of a fabric with a pretreatment liquid; ejecting an adhesive liquid onto the printing surface to form an adhesive layer, after the coating of the printing surface; and transferring metallic foil onto the adhesive layer by bringing a sheet, on which the metallic foil is formed, into contact with the adhesive layer.
    Type: Application
    Filed: February 27, 2013
    Publication date: August 29, 2013
    Applicant: SEIKO EPSON CORPORATION
    Inventor: SEIKO EPSON CORPORATION
  • Publication number: 20130216774
    Abstract: Fabrics made for watersports and outerwear apparel, tents, sleeping bags and the like, in various composites, constructed such that there is at least one metal layer, forming a radiant barrier to reduce heat loss via radiation, and insulating this metal layer from conductive heat loss, and a process for its manufacture.
    Type: Application
    Filed: February 14, 2013
    Publication date: August 22, 2013
    Inventors: Brian John Conolly, Thomas Kenneth Hussey
  • Patent number: 8484840
    Abstract: When a formed position of a via formed on a board is the same as a position of a footprint of a chip component located on the back surface of the board corresponding to an area on which a BGA is mounted, a board designing apparatus determines that the chip component and the BGA can be connected using chip on hole. When it is determined that the chip component and the BGA can be connected, the board designing apparatus carries out chip on hole by forming a via in an area of the board on which the BGA is mounted, the via leading to the footprint of the chip component located on the back surface of the board.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: July 16, 2013
    Assignee: Fujitsu Limited
    Inventors: Toshiyasu Sakata, Eiichi Konno
  • Patent number: 8460489
    Abstract: A film application system having multiple foil application stations. Each foil application station has a support for an elongated plastic component (typically vinyl) having an input and an output side. A drive moves successive elongated components along a path through the application station from the input side to the output side as decorative foil is applied to a surface of the component. A properly positioned and oriented transfer head applies heat and pressure to the elongated film as the component moves through the application station. The disclosed system must accommodate different style and shape components corresponding to different style windows, doors, or sashes. A backing fixture that is configured to support a given configuration component is positioned to support the component as the component moves through the application station in a region of the transfer head.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: June 11, 2013
    Assignee: GED Integrated Solutions, Inc.
    Inventors: James B. Williams, II, Scott M. Azzarello, Timothy B. McGlinchy, Roger J. Eberwein
  • Publication number: 20130142993
    Abstract: A wrapper (16) for a smoking article filter, the wrapper comprising at least one aperture (20) and an additional strengthening material (22) around the at least one aperture. A filter for a smoking article comprising such a wrapper, and a method of manufacturing such a wrapper and such a filter.
    Type: Application
    Filed: May 24, 2011
    Publication date: June 6, 2013
    Applicant: British American Tobacco (Investments) Limited
    Inventor: Sabrina Bartram
  • Patent number: 8445102
    Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: May 21, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Mark Wisniewski, Karen Bruzda, Michael D. Craig
  • Patent number: 8431289
    Abstract: The volume hologram recording photosensitive composition provided by the present invention contains at least a fluorine-contained photoreactive compound represented by the following formula (1): R1—R3—(CF2)n-R4—R2 wherein R1 and R2 are photoreactive groups which can be bonded to each other by photoreaction, and each of R3 and R4 is independently a single bond or a bivalent hydrocarbon group having 1 to 5 carbon atoms, and n is an integer of 1 or more. This volume hologram recording photosensitive composition is used to form a recording section of a recording medium, and then the section is exposed to light, whereby a bright volume hologram can be obtained.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: April 30, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroyuki Otaki, Toshio Yoshihara, Yoshihito Maeno
  • Publication number: 20130000830
    Abstract: A method of printing foil images upon textiles is provided. Advantageously, a digital inkjet printer can be utilized to apply an adhesive for affixing a foil embellishment. The method of printing foil images upon textiles includes applying a pretreatment solution upon a textile. After the pretreatment solution has dried, a white underbase in the form of a fanciful design is printed upon the textile using a digital inkjet printer. A heavy color layer of color ink is then digitally inkjet printed upon the white underbase. Thereafter, the textile is removed from the inkjet printer and positioned upon a heat press table. Foil transfer paper is positioned upon the textile so as to cover the white underbase and heavy color layer. The heat press is activated so as to adhere the foil, but only to those regions where the white underbase and color ink has been printed. Once cool to the touch, the foil is slowly peeled from the textile so as to leave a fanciful foil design.
    Type: Application
    Filed: June 30, 2011
    Publication date: January 3, 2013
    Inventor: Paul Green
  • Publication number: 20120212816
    Abstract: Provided are a substrate including a base with a pattern on at least one side thereof, in which a refractive index in a lower region of the pattern and a refractive index in an upper region of the pattern are different from each other according to a shape of the pattern; and a water repellent coating layer provided on at least one side with the pattern of the base, an optical product including the same, and a manufacturing method of the substrate. The substrate according to the present invention has both an excellent anti-reflective property and an excellent water repellent property.
    Type: Application
    Filed: October 28, 2010
    Publication date: August 23, 2012
    Inventors: Tae-Su Kim, Jae-Jin Kim, Bu-Gon Shin, Young-Jun Hong, Hyeon Choi
  • Patent number: 8236126
    Abstract: An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: August 7, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Kuang-Jung Chen, Shu-Tang Yeh, Ping-I Shih, Kung-Yu Cheng, Jian-Lin Wu
  • Patent number: 8206527
    Abstract: A cold film transfer method with dynamic film tensioning guides a film web intermittently through a transfer nip with dancers to use less film web. The intermittent drive and action of a transfer cylinder channel result in undesired fluctuations in film tension or web force, which directly affect dancer motors. A control system is used to avoid high loads on the motors and the web. A control circuit acts on the dancer movement, a first process variable is mapped in the control circuit and the first process variable is a function of a force acting on the dancers as a result of the transfer film or is a function of the actual current movement profile of the dancers. A measure for web tension is calculated as a function of the first process variable and/or the amplitude of the web tension is at least limited by the control system.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: June 26, 2012
    Assignee: Heidelberger Druckmaschinen AG
    Inventor: Detlef Strunk