Abstract: A method of printing foil images upon textiles is provided. Advantageously, a digital inkjet printer can be utilized to apply an adhesive for affixing a foil embellishment. The method of printing foil images upon textiles includes applying a pretreatment solution upon a textile. After the pretreatment solution has dried, a white underbase in the form of a fanciful design is printed upon the textile using a digital inkjet printer. A heavy color layer of color ink is then digitally inkjet printed upon the white underbase. Thereafter, the textile is removed from the inkjet printer and positioned upon a heat press table. Foil transfer paper is positioned upon the textile so as to cover the white underbase and heavy color layer. The heat press is activated so as to adhere the foil, but only to those regions where the white underbase and color ink has been printed. Once cool to the touch, the foil is slowly peeled from the textile so as to leave a fanciful foil design.

Abstract: The aim of the invention is to improve the supply of transfer foil in a coating module in which the image-forming layers of a transfer foil are transferred to a printing material. To achieve this, a partial pressing surface is located in the coating module for transferring the layers of the transfer foil. This permits targeted control of the foil feed. The transfer foil can be fed past a pressure cylinder in an approximately tangential manner and with a limited width.

Abstract: A carrier film of thermoplastic polyester has releasable metal adhesive properties suitable for a metal transfer in which the polyester film is metalized and the metal layer is subsequently transferred to a permanent adhesive-coated substrate. The metal layer is in direct contact with the polyester carrier film and no intermediate release layer is present. Desired metal adhesion is provided by dispersing an suitable surfactant, and optionally, a hydrocarbon wax, uniformly into the polyester film. Surfactant on the outer surface of the carrier film modifies metal adhesion to the polyester such that the metal can be removed in a metal transfer operation.

Abstract: The steps of a method for fabricating a proximity sensing module that is adapted to be attached to a mobile device, include: (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film; and (c) forming a through hole in the adhesive sheet such that the upper connective pad is exposed from the through hole.

Abstract: There is provided a method of manufacturing a stamp for a plasmonic nanolithography apparatus. The method includes forming metal patterns on a substrate, coating a hydrophobic thin film on external surfaces of the metal patterns to hydrophobic processing the external surfaces of the metal patterns, selectively hydrophilic processing only the external surfaces of the metal patterns, laminating a buffer layer on the substrate and the metal patterns, and transcribing the metal patterns and the buffer layer from the substrate to a base formed of light transmission material to be combined with the base.

Abstract: A keyboard includes a plurality of keys, and a keyframe into which the plurality of keys are assembled. Each of the keys includes: i) a plunger on which a character is printed, and ii) a keycap made of a transparent material. The keycap covers at least a portion of a top of the plunger.

Abstract: An embodiment of the invention provides a method for forming an antenna which includes: providing a workpiece having a surface; providing a compression head including a main body, a soft rubber head disposed on the main body, and at least a through-hole, wherein the through-hole penetrates through the main body and the soft rubber head; adsorbing and fixing a conducting film on the soft rubber head through the through-hole; moving the compression head against the surface of the workpiece to press the conducting film onto the surface of the workpiece; removing the compression head; and patterning the conducting film.

Abstract: A method of manufacturing a thin film device according to an aspect of the invention may include: preparing a substrate on which a sacrificial layer and a thin film to be transferred are sequentially formed; temporarily bonding the thin film to a circumferential surface of the transfer roll, and simultaneously removing the sacrificial layer to separate the thin film from the substrate at a first position of a transfer roll that is rolling; and transferring the thin film onto a sheet by running the sheet so that a surface of the sheet is bonded to the thin film temporarily bonded to the circumferential surface of the transfer roll. The substrate may be a transparent substrate.

Abstract: A textile printing method includes coating a printing surface of a fabric with a pretreatment liquid; ejecting an adhesive liquid onto the printing surface to form an adhesive layer, after the coating of the printing surface; and transferring metallic foil onto the adhesive layer by bringing a sheet, on which the metallic foil is formed, into contact with the adhesive layer.

Abstract: Fabrics made for watersports and outerwear apparel, tents, sleeping bags and the like, in various composites, constructed such that there is at least one metal layer, forming a radiant barrier to reduce heat loss via radiation, and insulating this metal layer from conductive heat loss, and a process for its manufacture.

Abstract: When a formed position of a via formed on a board is the same as a position of a footprint of a chip component located on the back surface of the board corresponding to an area on which a BGA is mounted, a board designing apparatus determines that the chip component and the BGA can be connected using chip on hole. When it is determined that the chip component and the BGA can be connected, the board designing apparatus carries out chip on hole by forming a via in an area of the board on which the BGA is mounted, the via leading to the footprint of the chip component located on the back surface of the board.

Abstract: A film application system having multiple foil application stations. Each foil application station has a support for an elongated plastic component (typically vinyl) having an input and an output side. A drive moves successive elongated components along a path through the application station from the input side to the output side as decorative foil is applied to a surface of the component. A properly positioned and oriented transfer head applies heat and pressure to the elongated film as the component moves through the application station. The disclosed system must accommodate different style and shape components corresponding to different style windows, doors, or sashes. A backing fixture that is configured to support a given configuration component is positioned to support the component as the component moves through the application station in a region of the transfer head.

Abstract: A wrapper (16) for a smoking article filter, the wrapper comprising at least one aperture (20) and an additional strengthening material (22) around the at least one aperture. A filter for a smoking article comprising such a wrapper, and a method of manufacturing such a wrapper and such a filter.

Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

Abstract: The volume hologram recording photosensitive composition provided by the present invention contains at least a fluorine-contained photoreactive compound represented by the following formula (1): R1—R3—(CF2)n-R4—R2 wherein R1 and R2 are photoreactive groups which can be bonded to each other by photoreaction, and each of R3 and R4 is independently a single bond or a bivalent hydrocarbon group having 1 to 5 carbon atoms, and n is an integer of 1 or more. This volume hologram recording photosensitive composition is used to form a recording section of a recording medium, and then the section is exposed to light, whereby a bright volume hologram can be obtained.

Abstract: A method of printing foil images upon textiles is provided. Advantageously, a digital inkjet printer can be utilized to apply an adhesive for affixing a foil embellishment. The method of printing foil images upon textiles includes applying a pretreatment solution upon a textile. After the pretreatment solution has dried, a white underbase in the form of a fanciful design is printed upon the textile using a digital inkjet printer. A heavy color layer of color ink is then digitally inkjet printed upon the white underbase. Thereafter, the textile is removed from the inkjet printer and positioned upon a heat press table. Foil transfer paper is positioned upon the textile so as to cover the white underbase and heavy color layer. The heat press is activated so as to adhere the foil, but only to those regions where the white underbase and color ink has been printed. Once cool to the touch, the foil is slowly peeled from the textile so as to leave a fanciful foil design.

Abstract: Provided are a substrate including a base with a pattern on at least one side thereof, in which a refractive index in a lower region of the pattern and a refractive index in an upper region of the pattern are different from each other according to a shape of the pattern; and a water repellent coating layer provided on at least one side with the pattern of the base, an optical product including the same, and a manufacturing method of the substrate. The substrate according to the present invention has both an excellent anti-reflective property and an excellent water repellent property.

Abstract: An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.

Abstract: A cold film transfer method with dynamic film tensioning guides a film web intermittently through a transfer nip with dancers to use less film web. The intermittent drive and action of a transfer cylinder channel result in undesired fluctuations in film tension or web force, which directly affect dancer motors. A control system is used to avoid high loads on the motors and the web. A control circuit acts on the dancer movement, a first process variable is mapped in the control circuit and the first process variable is a function of a force acting on the dancers as a result of the transfer film or is a function of the actual current movement profile of the dancers. A measure for web tension is calculated as a function of the first process variable and/or the amplitude of the web tension is at least limited by the control system.

Abstract: Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.

Abstract: A method of manufacturing a device-incorporated substrate as well as a printed circuit board. A transfer sheet is formed having a structure that includes two layers, a metal base material and a dissolvee metal layer and a conductor pattern is formed on the dissolvee metal layer by electroplating. After the transfer sheet on which the conductor pattern is formed is adhered onto an insulating base material, the transfer sheet is removed by separating the metal base material from the dissolvee metal layer and thereafter selectively dissolving and removing the dissolvee metal layer with respect to the conductor pattern.

Abstract: In a roll-to-roll step, an adhesive solution is applied to a release film 1 including a polyethylene terephthalate film and this film 1 is passed through a drying oven 500 regulated to 60 to 150° C. to thereby form an adhesive layer 2. Subsequently, an insulating film 3 including a polyimide film is laminated on the adhesive layer 2 at room temperature (about 25° C.) to thereby produce a layered product 6 including the release film 1, adhesive layer 2 and insulating film 3. Next, the release film 1 is stripped from the layered product 6 and a conductor film 4 including a copper foil is laminated to the adhesive layer 2 to thereby produce a conductor-clad laminate 8.

Abstract: An article surface ornamental structure that is easy to work and able to form a decorative pattern of an optional design and a high-grade feeling produced thanks to the metallic luster and, if necessary, to form a third dimensional decorative pattern. A metal-coated layer is formed by depositing a metal material with metallic luster on a surface of a base material. The metal-coated layer is at least partly provided with a separation part, in which the based material has its surface exposed to create an ornamental pattern thanks to a difference between the outer appearance of the base material and the metallic luster of the remaining metal-coated layer. With the base material and the metal-coated layer exposed, respectively, each of their surfaces is coated with a clear-coating layer made of synthetic resin material having transmittancy in order to protect the surface of the ornamental pattern.

Abstract: A special patch is adhered to the bare metal of a dash panel in covering relation to one or more pass-through holes and their margins before a truck cab is primed and painted. After painting, a cover of the patch is peeled off to expose an electrically conductive medium that remains adhered to the bare metal. A ground block is mounted on the dash panel with a stud passing through a pass-through hole. The electrically conductive medium establishes conductivity of the body of the ground block to the dash panel.

Abstract: An aspect of the present invention is directed to a method for forming a mirror-reflecting film on a waveguide in an optical wiring board, characterized in that a multilayer film, in which a base, a metal layer and an adhesive layer are layered in this order, is used, and the metal layer is transferred and bonded to an inclined face for mirror-reflecting film formation provided on the waveguide, with the adhesive layer of the multilayer film intervening. The present invention provides a method which, when forming a mirror-reflecting film on a waveguide in an optical wiring board, enables inexpensive and easy formation of the mirror-reflecting film, using the smallest quantity of metal possible and employing comparatively simple facilities and techniques.

Abstract: A printed metalized in mold label (IML) or insert for use in manufacturing injection molded or blow molded drinkware or containers. The labels generally include a metalized film assembly that comprises a base substrate and a metalized layer applied thereon. One or more image or graphic layers are then either printed directly onto the metalized film assembly or laminated thereto. Protective substrates, films, or coatings are applied to the assembly to protect by sandwiching the one or more ink or printed layers between the protective layer and the metalized layer.

Abstract: A method for preparing a golf ball with surface indicia such as a letter or image having metallic luster includes the steps of forming an adhesive indicia made of a thermoplastic resin on a golf ball surface, bonding the metal thin-film on a metal thin film-bearing film over the indicia under pressure or heat and pressure, then peeling off the film so as to leave a portion of the metal thin-film having the same shape as the indicia adhering to and laminated with the indicia.

Abstract: Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole, to thereby easily process a hole for forming a via and have high design freedom.

Abstract: The present invention provides a method of finely depositing lithium metal powder or thin lithium foil onto a substrate while avoiding the use of a solvent. The method includes depositing lithium metal powder or thin lithium foil onto a carrier, contacting the carrier with a substrate having a higher affinity for the lithium metal powder as compared to the affinity of the carrier for the lithium metal powder, subjecting the substrate while in contact with the carrier to conditions sufficient to transfer the lithium metal powder or lithium foil deposited on the carrier to the substrate, and separating the carrier and substrate so as to maintain the lithium metal powder or lithium metal foil, deposited on the substrate.

Abstract: A metallic laminate and a method of manufacturing a core substrate using the same are disclosed. In accordance with an embodiment of the present invention, the metallic laminate includes an insulation material, a carrier layer, which is stacked on both surfaces of the insulation layer and in which the carrier layer is a metal, and a first metal foil, which is stacked on one surface of the carrier layer. By symmetrically forming two core substrates on either surface above and below the insulation material, each process of forming the core substrate can be performed at the same time in the shape of a pair of facing core substrates, thereby increasing the productivity by twice. The remaining insulation material having the carrier layer stacked thereon can be used as a base substrate that is used to manufacture a printed circuit board, thus preventing unnecessary waste of the insulation material.

Abstract: The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.

Abstract: A conductive member for a non-contact type data carrier such as a wireless tag is simply and cheaply manufactured. A method for manufacturing a conductive member for a non-contact type data carrier comprises: a printing process during which, while a base material (4) is run, a bonding agent layer (5) is printed in a predetermined pattern on the surface thereof, and is dried; a bonding process during which a conductive layer (6) is laminated on the surface of the bonding agent layer (5) for heating and bonding; a punching process during which the conductive layer (6) is punched in the above-described pattern on the base material (4); and a separating process during which an unnecessary portion (6b) of the conductive layer (6) is separated from the base material (4). Accordingly, a conventional multilayered laminated sheet is not required to realize reduction in the material.

Abstract: The method is for adding images or text on a beverage can lid. A beverage can lid is provided that has a handle member, the handle member attached to a top surface of the beverage can lid. An image is printed on the foil member. The printed foil member is placed on top of the top surface of the beverage can lid so that a first cut out segment is placed above the handle member and a second cut out segment is aligned with a weakened segment of the beverage can lid. With the foil member placed on top of the weakened segment, the handle member is lifted to engage the weakened segment and push the second cut out segment and a portion of the weakened segment through the beverage can lid.

Abstract: A selectively metallized heat transfer label for transfer to a substrate includes a support portion having a carrier layer and a release layer applied to the carrier layer, and a transfer portion including a protective layer applied to the release layer, a metallizable layer applied to the protective layer, a metal layer applied to the metallizable layer, a metal transferring adhesive layer applied to the metal layer and configured to adhere to both the metal layer and the desired substrate and a non-metal transferring ink layer applied to the metal layer and configured to adhere to the desired substrate but not to the metal layer. When heat and pressure are applied to the carrier, the metal transferring adhesive adheres to both the metal layer and the substrate while the non-transferring ink layer adheres only to the substrate.

Abstract: A method for reducing graphene film thickness on a donor substrate and transferring graphene films from a donor substrate to a handle substrate includes applying a bonding material to the graphene on the donor substrate, releasing the bonding material from the donor substrate thereby leaving graphene on the bonding material, applying the bonding material with graphene onto the handle substrate, and releasing the bonding material from the handle substrate thereby leaving the graphene on the handle substrate. The donor substrate may comprise SiC, metal foil or other graphene growth substrate, and the handle substrate may comprise a semiconductor or insulator crystal, semiconductor device, epitaxial layer, flexible substrate, metal film, or organic device.

Abstract: A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a fine-pitch conductor pattern can be formed on an insulating layer with high precision while securing the dimensional stability of the conductor pattern, are provided. A transfer sheet (61) has a structure that includes two layers, a metal base material (62) and a dissolvee metal layer (64), and a conductor pattern (55) is formed on the dissolvee metal layer (64) through electroplating. Then, after the transfer sheet (61) on which the conductor pattern (55) is formed is adhered onto an insulating base material (51), the transfer sheet (61) is removed through a step of separating the metal base material (62) from the dissolvee metal layer (64), and a step of selectively dissolving and removing the dissolvee metal layer (64) with respect to the conductor pattern (55).

Abstract: A resin sheet with a copper foil, comprising: a carrier layer; a copper foil layer having a thickness 0.5 to 5 ?m provided over the carrier layer; and an insulating resin layer formed over the copper foil layer, wherein the insulating resin layer is once abutted with base material, and then the carrier layer is delaminated from the copper foil layer, and wherein the insulating resin layer contains a cyanate ester resin having phenolic novolac backbone and a polyfunctional epoxy resin.

Abstract: Articles for applying color on a surface comprise a sheet of dry color component and an adhesive on one surface of the sheet of dry color component. The article further includes a releasable liner, and the sheet of dry color component is arranged between the releasable liner and the adhesive. Methods for providing a substantially permanent color effect on an architectural surface comprise delivering such an article to the architectural surface.

Abstract: The present invention provides an image displaying medium with a metallic image, which comprises a metallic image formed on a transfer receiving material with a color image formed thereon, wherein the metallic image is formed by using a thermal transfer sheet in which at least a resinous peelable layer and a metal thin layer are provided on one surface of a substrate film in this order, the resinous peelable layer comprising a pigment and a thermoplastic resin having a glass transition temperature of 60° C. or higher and the metal thin layer comprising a composition containing an aluminum pigment prepared by forming an aluminum film by deposition on a carrier sheet with a releasing layer provided thereon, and peeling the aluminum film from the carrier sheet to finely divide it, and a binder of a thermoplastic resin having a glass transition temperature of 50 to 150° C.

Abstract: A method and a device for the automated application of a self-adhesive paint film to a three-dimensionally curved bodywork part, using a robotic application tool, the paint film being held ready in the form of a multi-layered film composite ready for picking up. After picking up has taken place, a protective strip on the adhesive side is removed from the film section, which is held taut, by means of a contact piece attached to the film composite on the end side and the adhesive side of the film section is thereby exposed. The paint film section is subsequently aligned above the body part to be covered, at a small distance from it, and is progressively pressed onto the bodywork part from the spaced-apart, taut position by means of a roller or doctor moving over the paint film.

Abstract: Method and apparatus for providing a printed substrate including at least a portion having a foil image adhered to the substrate which includes providing a heated thermal transfer plate and a makeready plate for supporting the substrate, providing means for moving a sheet of substrate one sheet at a time to a position between the thermal transfer plate and the makeready plate, means for moving foil to a position between the substrate and the thermal transfer plate and means for pressing the foil against the substrate to produce an image on the substrate.

Abstract: There is provided a method of manufacturing a probe card, the method including: providing a first substrate including a plurality of probe pin patterns for forming a probe pin and at least one first stress relieving groove for relieving thermal stress; forming the probe pin by filling a metal material in the plurality of probe pin patterns; bonding a surface of the first substrate where the probe pin is formed onto a surface of a second substrate; and transferring the probe pin onto the second substrate by heating the first and second substrates bonded together.

Abstract: An electronic circuit formed by removing only a baseboard from an electronic module. The electronic circuit may be formed by providing a baseboard made of a water-soluble material, applying a water-soluble polymer as an insulating material to the baseboard, and forming an electronic module by mounting electronic parts to wires formed on the baseboard. The formation of the electronic circuit may also include removing the baseboard from the electronic module by dissolving the baseboard in water and deforming and resin-encapsulating the electronic module, which includes the electronic parts and wires in the state of lacking the baseboard.

Abstract: To provide a method for manufacturing a piezoelectric thin film resonator with excellent characteristics. A method for manufacturing a piezoelectric thin film resonator in accordance with the present invention includes a step of forming a laminated body by successively laminating, above a first substrate, a piezoelectric thin film and a first electrode, a step of bonding a second substrate and the laminated body, a step of separating the first substrate from the laminated body, a step of forming a second electrode above the piezoelectric thin film, and a step of patterning the second electrode, the piezoelectric thin film and the first electrode.

Abstract: The present invention relates to a method for thermally printing a pre-selected dye image (45) onto a three dimensional object (16). The method involves placing an image carrier sheet (24) containing a pre-selected dye image (45) over the object (16). A flexible membrane (26) is lowered over the object (16) and the image carrier sheet (24). A vacuum is established under the membrane (26) causing the image carrier sheet (24) to conform to the shape of the object (16). The membrane (26) or image carrier sheet (24) carry flexible heating elements (36), which are heated, to thermally transfer the dye image (45) onto the object (16). The flexible heating elements (36) can be made by etching an electrical circuit in a metal foil (34) which is bonded to a film substrate (30).

Abstract: Process for producing a partially metalized substrate, characterized by the following process steps: a) provision of a first substrate, b) partial printing or coating of the substrate with a surface coating which adheres only weakly to the substrate, c) application of a full-area metal layer, d) lamination to an adhesive-coated second substrate and e) detachment of this second adhesive-coated substrate, as a result of which the weakly adhering surface coating with the metallic layer on top of it is detached from the first substrate and a structured metallic layer thus remains on the first substrate.

Abstract: A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a metal foil on the adhesive layer by means of plating, lamination or sputtering, and forming a high density circuit on the metal foil serving as a seed layer by means of pattern plating. Specifically, the method of the current invention includes the steps of attaching adhesive means to one surface of a reinforced substrate (rigid substrate or carrier film), forming a seed layer on the adhesive means and forming a circuit pattern on the seed layer, laminating an insulating layer on the circuit pattern and removing the reinforced substrate (rigid substrate or carrier film), and removing the seed layer.

Abstract: A release layer 22 is formed on a surface of a first supporting sheet 20. Next, an electrode layer 12a is formed on a surface of the release layer 22. When the electrode layer 12a is pressed against a surface of a green sheet 10a to bond the electrode layer 12a with the green sheet 10a, an adhesive layer 28 is formed by a transfer method on a surface of the electrode layer 12a or a surface of the green sheet 10a. It becomes possible to easily transfer a dry type electrode layer to the surface of the green sheet with high accuracy without breaking or deforming the green sheet, moreover, components of the adhesive layer do not soak in the electrode layer or green sheet. Also, the supporting sheet is extremely easily released, and a production cost of a multilayer ceramic capacitor is reduced.

Abstract: A mirror embedded optical waveguide according to the present invention comprises: a core; an angled cut face in the core; an adhesive layer on the angled cut face, the adhesive layer having approximately the same refractive index as that of the core; and a metal film on the adhesive layer, the metal film being formed by transfer.

Abstract: At the time of pressing an electrode layer 12a against a surface of a green sheet 10a having a thickness of 3 ?m or thinner to bond the electrode layer 12a with the surface of the green sheet 10a, an adhesive layer 28 having a thickness of 0.02 to 0.3 ?m is formed on a surface of the electrode layer 12a or the surface of the green sheet 10a. It is possible to easily transfer a dry type electrode layer to the surface of the green sheet with high accuracy without breaking or deforming the green sheet.