With Lamina Formation By Molding Or Casting Patents (Class 156/242)
  • Patent number: 11180237
    Abstract: A method of making an aircraft acoustic structural panel (10) begins with preforming a core honeycomb laminate (12) having preformed foam (3) bonded inside cells (14) thereof by a distinct adhesive (2). The preformed honeycomb laminate (12) is then stacked between opposite top and bottom structural outer laminates (16,18). The stacked honeycomb laminate (12) and outer structural laminates (16,18) are then compressed together under heat and pressure into a unitary structural panel (10) having the core honeycomb laminate (12) integrally bonded between outer skins (20,22). The outer laminates (16,18) may include imperforate acoustic septums (4) bounding the core honeycomb laminate (12) followed by an outer honeycomb (5) and structural fiber layers (6,7,8) defining the outer skins (20,22).
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: November 23, 2021
    Assignee: The NORDAM Group LLC
    Inventors: Timothy Dustin Penn, Matthew Shaun Fritz, Jane Alice Benbenek
  • Patent number: 11179902
    Abstract: A bladder mandrel package, used to manufacture a composite structure, includes a mandrel and a wrap ply, surrounding the mandrel to form a wrapped mandrel. The bladder mandrel package also includes a first radius filler, coupled to the wrap ply at a first radius of the wrapped mandrel, and a second radius filler coupled to the wrap ply at a second radius of the wrapped mandrel. The mandrel, the wrap ply, the first radius filler, and the second radius filler are consolidated to from the bladder mandrel package.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: November 23, 2021
    Assignee: The Boeing Company
    Inventors: Richard A. Prause, Andrew E. Modin, Allen J. Halbritter, Richard E. Heath
  • Patent number: 11174363
    Abstract: A method of preparing a thermoplastic polyurethane membrane with high adhesion and high elasticity includes the following steps: (a) preparing a modifying solution, wherein the modifying solution is one or a mixture of at least two of diethylenetriamine, diethylaminopropylamine, and diaminodiphenylmethane; (b) preparing a semi-finished product by applying the modifying solution on at least one surface of a thermoplastic polyurethane membrane; and (c) subjecting the semi-finished product to a temperature of 50° C.˜180° C. in order for the semi-finished product to undergo a reaction and thus form the thermoplastic polyurethane membrane with high adhesion and high elasticity.
    Type: Grant
    Filed: June 16, 2019
    Date of Patent: November 16, 2021
    Assignee: TAIWAN TEXTILE FEDERATION, R.O.C.
    Inventors: Shu-Hui Huang, Sheng-Jen Lin, Yao-Hung Kuo, Jian-Fan Chen, Hung-Kung Chien, Yu-chuan Lin, Yun-chin Kuo
  • Patent number: 11130285
    Abstract: A print head is disclosed for use with an additive manufacturing system. The print head may include a nozzle tip, a first matrix source configured to selectively supply a structural matrix to the nozzle tip, and a second matrix source configured to selectively supply a temporary support matrix to the nozzle tip. The print head may also include a reinforcement supply configured to supply a continuous reinforcement through the nozzle tip only when the first matrix source is supplying the structural matrix to the nozzle tip.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: September 28, 2021
    Assignee: Continuous Composites Inc.
    Inventors: Kenneth Lyle Tyler, Ryan C. Stockett
  • Patent number: 11127938
    Abstract: A method of fabricating a battery electrode includes forming a mixture including an electrode material and a binder; forming an electrode blank from the mixture; heating the electrode blank at a predetermined temperature for a predetermined time to form an annealed electrode blank; and laminating the annealed electrode blank to a current collector. The current collector may include a conductive carbon coating. In such event, the method may further include heating the current collector at a selected temperature for a selected time prior to laminating the annealed electrode blank to the current collector.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: September 21, 2021
    Assignee: Pacesetter, Inc.
    Inventor: Xiaofei Jiang
  • Patent number: 11091595
    Abstract: Presented are fiber-reinforced polymer (FRP) sandwich structures, methods for making/using such FRP sandwich structures, and motor vehicles with a vehicle component fabricated from a compression molded thermoset or thermoplastic FRP sandwich structure. A multidimensional composite sandwich structure includes first and second (skin) layers formed from a thermoset of thermoplastic polymer matrix, such as resin or nylon, filled with a fiber reinforcing material, such as chopped carbon fibers. A third (core) layer, which is encased between the first and second skin layers, is formed from a thermoset/thermoplastic polymer matrix filled with a fiber reinforcing material and a filler material, such as hollow glass microspheres. The first, second and third layers have respective rheological flow properties that are substantially similar such that all three layers flow in unison at a predetermined compression molding pressure.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: August 17, 2021
    Assignee: GM Global Technology Operations LLC
    Inventors: Hamid G. Kia, Selina X. Zhao
  • Patent number: 11059239
    Abstract: Rib-and-sheet structures include a rib comprising continuous, aligned fibers. The rib is fabricated via compression molding from continuous, aligned fiber, thereby providing an aligned, continuously reinforced rib. In one embodiment, rib-and-sheet structures are produced in a two-step compression-molding process, wherein a near net-shape rib is molded, in a first mold, from fiber-bundle based preforms, and then a rib-and-sheet part is molded by placing, in a second mold, the rib with either: (i) a preformed sheet, (ii) plies that form a laminate/sheet or (iii) chopped fibers that form a sheet during the molding process. In another embodiment, rib-and-sheet structures are fabricated in a one-step compression-molding process, wherein fiber-bundle-based preforms and (i) a preformed sheet, (ii) plies that form a laminate/sheet, or (iii) chopped fibers are combined in a single mold and molded in a single step.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: July 13, 2021
    Assignee: Arris Composites Inc.
    Inventors: Erick Davidson, Riley Reese, Ethan Escowitz, J. Scott Perkins
  • Patent number: 11058008
    Abstract: A manufacturing method, Printed Circuit Board (PCB) panel, and a PCB are disclosed. The method includes forming a cavity in a PCB that is in a PCB panel that includes a frame and stays, mounting an electronic component, heating the PCB panel, and cutting the stays. The PCB panel includes a frame body and a PCB coupled to the frame body via stays. The PCB includes a cavity. A first cavity stay is located near the cavity. Extended lines extend from the cavity, and the cavity stay extends at least between the extended lines. The PCB includes a cavity and a connection point from a cavity stay near the cavity.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: July 6, 2021
    Assignee: Lenovo (Singapore) PTE. LTD.
    Inventors: Hirohide Komiyama, Seiji Yamasaki, Hua Wang, Yanping Zhou
  • Patent number: 11027597
    Abstract: A decorative member includes a light-transmitting substrate which is made of resin and is formed with a recessed portion on a back surface thereof, a hot stamping foil layer which is formed on the back surface of the light-transmitting substrate except for the recessed portion, and a metal vapor deposition film layer which is laminated on the recessed portion on the back surface of the light-transmitting substrate and the hot stamping foil layer.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: June 8, 2021
    Assignee: KOITO MANUFACTURING CO., LTD.
    Inventor: Yasuhiro Kameoka
  • Patent number: 11014272
    Abstract: A laundry bead molding mold is disclosed, including a first mold cavity and a second mold cavity which are separated from each other and could be filled with detergent or detergent additives to meet different washing demands. The first mold cavity has two opposite side walls at a certain angle, which could ensure the shape of the bead product is a preset shape. The mold could be used to mold a laundry bead having at least two cavities, and could obtain a multifunctional laundry bead, has a simple structure and a high yield of the formed bead. A laundry bead formed by the mold is also disclosed, including a plurality of beads, which facilitates the washing process. A laundry bead molding method is also disclosed.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: May 25, 2021
    Assignee: WHEALTHFIELDS (GUANGZHOU) CO., LTD.
    Inventors: Tai Yung Titus Cho, Jing Wang, Haitao Liu
  • Patent number: 11007549
    Abstract: This flocking powder coated article comprises a base material (10) and a flocking coating layer (11). The flocking coating layer (11) includes: a coating film (110) constituted by a powder coating, and a portion of a flocking organic filler (13) buried in the powder coating; and a flocking layer (111) constituted by another portion of the flocking organic filler (13) projecting from the coating film (110). This flocking powder coated article does not have an adhesive layer for fixing the flocking organic filler (13).
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: May 18, 2021
    Assignee: CHUO HATSUJO KABUSHIKI KAISHA
    Inventors: Takashi Yamashita, Hidekazu Ito, Seiki Ito, Toshio Kuwayama
  • Patent number: 10923412
    Abstract: Systems and methods include an integrated circuit assembly that includes a semiconductor substrate; a heat transfer element; and an ambulatory thermal interface arranged between the semiconductor substrate and the heat transfer element, the ambulatory thermal interface comprising: a thermally conductive material, and a friction reduction material, wherein: the thermally conductive material is arranged along a surface of the heat transfer element, the friction reduction material is arranged along a surface of the semiconductor substrate, opposing surfaces of the thermally conductive material and the friction reduction material define a slidable interface when placed in contact.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: February 16, 2021
    Assignee: Cerebras Systems Inc.
    Inventor: Jean-Philippe Fricker
  • Patent number: 10905014
    Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: January 26, 2021
    Assignee: Molex, LLC
    Inventors: Marko Spiegel, Victor Zaderej, Amrit Panda
  • Patent number: 10889032
    Abstract: A method for producing a laminated moulded part comprises a pressure moulding of a blank to form a moulded part in a moulding cavity between a first moulding tool unit and a second moulding tool unit, introducing of a laminating element into the moulding cavity after the pressure moulding of the blank, and a bonding of the moulded part with the laminating element in the moulding cavity.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: January 12, 2021
    Assignee: INTERNATIONAL AUTOMOTIVE COMPONENTS GROUP GMBH
    Inventor: Fritz Schweindl
  • Patent number: 10865283
    Abstract: The present disclosure relates to sheet moulding compounds (SMC) and to a method for producing composite fiber components from said SMC, based on a polyurethane reaction mixture consisting of (A) at least one aromatic isocyanate component, (B) 70 to 100 wt % of at least one polyol component having at least 70% secondary OH groups, a number average OH count of 15-500 mg KOH/g and functionality of 1.9-2.5, (C) 0-30 wt % of at least one polyol having a number average OH count of 15-500 mg KOH/g and a functionality of 1.9-2.5, (D) as applicable, short-chain polyol, (E) internal separating agent, (F) a thermolatent catalyst, and (G) as applicable, auxiliary and/or additional substances, wherein the PUR reaction mixture has an initial viscosity of 2,500-14,000 mPas at 23° C. and the ratio of NCO groups/OH groups is 1.35:1-10:1.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: December 15, 2020
    Assignee: COVESTRO DEUTSCHLAND AG
    Inventor: Marcel Schornstein
  • Patent number: 10856082
    Abstract: An audio system with sound-field-type nature sound effect includes: a first primary channel playing device for playing a primary audio signal generated according to a left channel audio signal and/or a right channel audio signal; a first secondary signal circuit for generating a first secondary audio signal according to the left channel audio signal and the right channel audio signal; and a first sound field control playing device connected to the first secondary signal circuit and adapted to play the first secondary audio signal; wherein a first playing delay period exists between the playing of the first secondary audio signal and the playing of the primary audio signal; wherein the first secondary audio signal played by the first sound field control playing device does not undergo audio mixing with the primary audio signal by a first audio mixing circuit.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: December 1, 2020
    Assignee: ECHOWELL ELECTRONIC CO., LTD.
    Inventor: Hsi-Hsien Chen
  • Patent number: 10841547
    Abstract: The present invention provides a method for fabricating small right angle prism mirrors, projecting system, and small right angle prism mirrors fabricated by a semiconductor process. The method comprises: coating a reflecting layer on a top surface of a glass substrate; forming an optical glue layer on a bottom surface of the glass substrate; utilizing a mold to form a 3D shape on the optical glue layer; exposing the optical glue layer having the 3D shape to solidify the optical glue layer having the 3D shape and combine the glass substrate having the reflecting layer and the optical glue layer having the 3D shape; removing the mold to form a small prism array; and dicing the small prism array to generate a plurality of small right angle prism mirrors.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: November 17, 2020
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Han-Yi Kuo, Yin-Dong Lu, Shi-Jen Wu, Chih-Sheng Chang, Teng-Te Huang
  • Patent number: 10828591
    Abstract: A method is provided for producing at least one ash-forming element (1) for a particulate filter of an exhaust gas system of a gasoline engine or diesel engine. The method includes providing of a strip-shaped center layer (3), and making receiving holes (6) in the center layer (3). The method continues by providing of a strip-shaped bottom layer (4), and permanently connecting of the bottom layer (4) to the center layer (3). The method proceeds by filling the receiving holes (6) of the center layer (3) with ash-forming components (2), providing a strip-shaped top layer (5), and permanently connecting the top layer (5) to the center layer (3). The method then includes punching out of at least one ash-forming means (1) from the wafer, and making throughflow openings (7) in regions where there are no ash-forming components (2).
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: November 10, 2020
    Assignee: Dr. Ing. h.c. F. Porsche Aktiengesellschaft
    Inventors: Lukas Engin, Michael Wessels
  • Patent number: 10827602
    Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: November 3, 2020
    Assignee: ABB Power Electronics Inc.
    Inventors: Robert Joseph Roessler, Anjana Shyamsundar
  • Patent number: 10774173
    Abstract: The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: September 15, 2020
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Hee Jin Cho, Do Kyung Sung, Sae Rom Nam
  • Patent number: 10773473
    Abstract: The purpose of the present invention is to obtain a fiber-reinforced plastic that is capable of controlling anisotropy, has excellent mechanical characteristics, has little variation, has excellent heat resistance, and has good fluidity during forming. A production method for fiber-reinforced plastic, having: a step in which a material (A) (100) including a prepreg base material is obtained, said prepreg base material having cuts therein and having a thermoplastic resin impregnated in reinforcing fibers (110) arranged in parallel in one direction; a step in which a pressurizing device is used that applies a substantially uniform pressure in a direction (X) orthogonal to the travel direction of the material (A) (100) and the material (A) (100) is caused to travel in the one direction and is pressurized while being heated to a prescribed temperature (T), an angle (.theta.) of ?20-20 .degree.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: September 15, 2020
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Masao Tomioka, Takeshi Ishikawa, Takayuki Kobayashi
  • Patent number: 10766172
    Abstract: A method of bonding a thermoplastic component to a carpeted component is provided. The method includes providing a base component, a thermoplastic component and a fibrous carpet or mat between the components. The carpet has a large number of cavities. The carpet is made of a thermoplastic material adapted to bond to the thermoplastic component in response to heat at the interface between the thermoplastic component and the carpet. The method also includes heating the thermoplastic component and the carpet at the interface between the thermoplastic component and the carpet for a period of time to soften the carpet. The method finally includes pressing the components and the softened carpet together under a pressure to cause the softened carpet to flow and at least partially fill the cavities. The carpet at the interface is transformed into a solid bonding layer to bond the components together to create a finished structure.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: September 8, 2020
    Assignee: Global IP Holdings, LLC
    Inventors: Darius J. Preisler, Christopher A. Heikkila
  • Patent number: 10759713
    Abstract: A fibrous preform (1) is produced, provided with a sandwich structure comprising an intermediate flexible core (4) and two outer fibrous frames (2, 3), respectively arranged on opposing outer faces of said flexible core (4) and assembled by sections of wire (8, 9) passing through said fibrous frames (2, 3), said preform (1) being impregnated with resin. Said preform is then hardened and the core (4) is removed, preferably by pre-densification with chemical vapour infiltration, and the structure produced is then densified with liquid-phase infiltration.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: September 1, 2020
    Assignees: MBDA FRANCE, AIRBUS DEFENCE AND SPACE GMBH
    Inventors: Marc Bouchez, Steffen Beyer, Stephan Schmidt-Wimmer
  • Patent number: 10751984
    Abstract: A method of bonding a thermoplastic component to a carpeted component and the carpeted component to cellulose-based core in a single pressing step is provided. The method includes providing a base component of a reinforced thermoplastic material, the thermoplastic component, a fibrous thermoplastic carpet or mat between the components, a sheet of thermoplastic adhesive and a core of cellulose-based material. The method also includes heating the thermoplastic component and the carpet at the interface between the thermoplastic component and the carpet for a period of time to soften the carpet. The method finally includes pressing the components, the sheet, the core and the softened carpet together under a pressure to cause the softened carpet to flow. The carpet at the interface is transformed into a solid bonding layer to bond the components together and the sheet bonds the base component and the core together to create a finished structure.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: August 25, 2020
    Assignee: Global IP Holdings, LLC
    Inventors: Darius J. Preisler, Christopher A. Heikkila
  • Patent number: 10714259
    Abstract: A method for forming an MLCC with an identification mark consisting of non-active internal electrodes which can be used to determine chip orientation for mounting or reeling. The method includes printing layers, forming a stack of the layers, sintering the stack, dicing the stack and forming external terminations.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: July 14, 2020
    Assignee: KEMET Electronic Corporation
    Inventors: Randal J. Vaughan, Gregory L. Crosby
  • Patent number: 10688738
    Abstract: A pultrusion process for making a strip for an elongate reinforcing structure of a wind turbine blade, the process comprising drawing fibres (42) and resin through a pultrusion die (40) in a process direction to form a strip (102); and applying an infusion-promoting layer (110) to a surface of the strip down-stream from the die in the process direction. A pultrusion apparatus is also disclosed.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: June 23, 2020
    Assignee: Vestas Wind Systems A/S
    Inventor: Jonathan Smith
  • Patent number: 10668697
    Abstract: Included are removing an outermost layer or outermost layers on one side or both sides of liquid crystal polymer film; and a molding step of performing thermocompression molding on liquid crystal polymer film and metal foil stacked on the side of liquid crystal polymer film whose outermost layer is removed. A heating temperature in the molding step is in a range from a temperature equal to a melting start temperature, of the liquid crystal polymer film, measured by using a rigid body pendulum type viscoelasticity measuring device to a temperature 60° C. higher than the melting start temperature inclusive.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: June 2, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masaya Koyama, Kiyotaka Komori, Hiroaki Takahashi, Yoshinori Matsuzaki, Tadashi Mori
  • Patent number: 10667407
    Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: May 26, 2020
    Assignee: Molex, LLC
    Inventors: Marko Spiegel, Victor Zaderej, Amrit Panda
  • Patent number: 10640235
    Abstract: Disclosed is a method of producing an airframe component. The method comprises: providing an initial component having a first surface; providing an over press tool having a second surface complementary to the first surface; applying, to the first surface, an adhesive (94), one or more layers of a material; at least for some time during curing of the adhesive, positioning the over press tool such that the second surface is in contact with an outer surface of the material and the material is between the first and second surfaces, and forcing the over press tool against the first surface such that a normal force is exerted on the first surface; and, thereafter removing the over press tool from the one or more layers of material, thereby providing the airframe component.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: May 5, 2020
    Assignee: BAE Systems plc
    Inventors: Steven Neil Sanderson, William Smith Scott
  • Patent number: 10580679
    Abstract: Disclosed herein is a method comprising disposing on a first substrate a two-dimensional exfoliatable material; patterning an exfoliatable material using a photoresist in a manner such that a portion of the photoresist remains in contact with the two-dimensional exfoliatable material after the patterning; disposing a polymer layer on the two-dimensional exfoliatable material to form a printing block; contacting a substrate with the printing block; and removing the polymer layer and the photoresist from the printing block to leave behind the patterned exfoliatable material on the substrate.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: March 3, 2020
    Assignee: THE UNIVERSITY OF MASSACHUSETTS
    Inventors: Qiangfei Xia, Peng Lin
  • Patent number: 10563285
    Abstract: The method comprises the following steps: a) Providing a sonotrode (1) formed from an essentially inert material with respect to the liquid metal, such as a ceramic, and preferably a silicon nitride or a silicon oxynitride, such as SIALON, or a metal essentially inert to said liquid metal, b) Immersing at least partially the sonotrode (1) in a bath of said metal, c) Applying to the sonotrode (1) power ultrasounds, particularly ultrasounds having a power greater than 10 watts to obtain the wetting of said sonotrode by said metal, d) Applying continuously to the sonotrode (1) measurement ultrasounds, also known as testing ultrasounds, particularly ultrasounds wherein the frequency is between 1 and 25 MHz, e) Applying intermittently to the sonotrode (1) power ultrasounds, particularly ultrasounds having a power greater than 10 watts, to maintain said wetting.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: February 18, 2020
    Assignee: CONSTELLIUM ISSOIRE
    Inventors: Jean-Louis Achard, Pierre Le Brun
  • Patent number: 10549907
    Abstract: An apparatus includes a containment structure having a floor and one or more free-standing flexible walls extending along an outer perimeter of the floor and surrounding a central portion of the floor. The floor includes one or more pieces of fabric, and each free-standing flexible wall includes one or more pieces of shape memory material and extending above the floor. The one or more pieces of shape memory material are attached to the one or more pieces of fabric via a liquid-impervious material applied to the one or more pieces of fabric along the outer perimeter of the floor. The liquid-impervious material is located on the one or more pieces of fabric and the one or more pieces of shape memory material such that the floor and the one or more free-standing flexible walls are liquid-impervious and define a space configured to retain liquid in the containment structure.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: February 4, 2020
    Assignee: TitanLiner, Inc.
    Inventor: Joshua D. Hopkins
  • Patent number: 10525655
    Abstract: A composite material for a pharmaceutical packaging is provided that includes a substrate and a protective layer. The substrate has a contact region in contact with the protective layer. The contact region includes a contact area between the substrate and the protective layer and a region of the substrate close to the surface. The substrate is made of glass or of a cyclic olefin polymer or a cyclic olefin copolymer, while the protective layer is made of ceramic material. The substrate in the contact region is different from the substrate outside the contact region.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: January 7, 2020
    Assignee: SCHOTT AG
    Inventors: Matthias Bicker, Manfred Lohmeyer, Tanja Woywod
  • Patent number: 10511389
    Abstract: Provided is a piezoelectric module capable of attempting further miniaturization. In the piezoelectric module, a resonance point is excluded from a frequency band of a transmitted signal to avoid shortening of a signal transmission distance, thereby attempting improvement in stability of communication. In addition, since a resonance space is not provided, further miniaturization may be easily attempted.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: December 17, 2019
    Assignee: TDK CORPORATION
    Inventors: Kaoru Kijima, Akira Satoh
  • Patent number: 10507638
    Abstract: An additive manufacturing method may involve: Providing a first and a second material, the second material capable of reacting with the first material to form a reaction product; forming at least the first material into a first layer; subjecting at least a portion of the first layer to energy in the presence of the second material, the energy being sufficient to initiate a reaction between at least the first and second materials to form a portion of the article, the portion of the article comprising the reaction product; forming a second layer of at least the first material on the first layer; and subjecting at least a portion of the second layer to energy in the presence of the second material, the energy being sufficient to initiate a reaction between the first and second materials to form an additional portion of the article.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: December 17, 2019
    Assignee: Elementum 3D, Inc.
    Inventors: Jacob S. Nuechterlein, Jeremy Joseph Iten
  • Patent number: 10472478
    Abstract: A prepreg includes: a woven fabric base; and a semi-cured product of a resin composition, which fills an inside of the woven fabric base and coats a surface of the woven fabric base. The resin composition includes a thermosetting resin, an inorganic filler, a first thermoplastic resin soluble in an organic solvent, and a second thermoplastic resin insoluble in an organic solvent. With respect to 100 parts by mass of the thermosetting resin, a content ratio of the inorganic filler ranges from 50 parts by mass to 150 parts by mass, inclusive, and a total content ratio of the first thermoplastic resin and the second thermoplastic resin ranges from 20 parts by mass to 50 parts by mass, inclusive.
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: November 12, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Yasunori Hoshino, Shimpei Obata, Shigetoshi Fujita, Ryuji Takahashi
  • Patent number: 10433428
    Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: October 1, 2019
    Assignee: Molex, LLC
    Inventors: Marko Spiegel, Victor Zaderej, Amrit Panda
  • Patent number: 10431783
    Abstract: The present disclosure discloses a battery pack that realizes miniaturization and weight reduction by minimizing the number of components of the structure, and that is suitable for pursuing dispersion of external force and structural rigidity using the shape of the structure. The battery pack according to the present disclosure is characterized to include a lower case including both inclined side walls and fixating members facing each other at the both side walls, a battery cartridge disposed between the fixating members in the lower case, and an upper case covering the lower case and the battery cartridge, wherein the battery cartridge contacts the both side walls and the fixating members in the lower case.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: October 1, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Yang-Kyu Choi, Seong-Tae Kim, Jun-Yeob Seong, Hyuk An, Sang-Yoon Jeong
  • Patent number: 10388431
    Abstract: A method for preparing an HVDC cable for jointing or termination includes the step of providing a section of an HVDC cable comprising a conductor surrounded by a first semiconducting layer, and at least one insulation layer of a first polymer material surrounding the first semiconducting layer, where the insulation layer comprises conductive volatile by-products. A tape of a second polymer material is provided, where the additional layer comprises conductive volatile by-products. The tape is lapped onto the insulation layer thereby forming an additional layer. Heat is applied to crosslink the additional layer and redistribute the conductive volatile by-products.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: August 20, 2019
    Assignee: NEXANS
    Inventors: Susanne Nilsson, Ramona Huuva, Staffan Josefsson
  • Patent number: 10321983
    Abstract: A valve insertable into a body lumen includes a body region extending in a distal direction away from a proximal rim. The proximal rim defines an outer perimeter of the valve at a proximal end of the valve. The body region forms a first leaflet and a second leaflet, with the first leaflet in contact with the second leaflet to provide the valve with a closed position. The first leaflet includes a first segment in contact with the proximal rim and a second segment in contact with the second leaflet. The first segment is curved to include a convex exterior surface and a concave interior surface of the valve. The second segment is curved to include a concave exterior surface and a convex interior surface of the valve.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: June 18, 2019
    Assignee: Coloplast A/S
    Inventors: Gabriel Sobrino-Serrano, Niall Behan, Anthony O'Halloran
  • Patent number: 10304594
    Abstract: The invention is related to a method of providing an insulated electric DC cable or DC termination or joint, the method comprising:—providing a polymer based insulation system (11,12,13) comprising a compounded polymer composition (12), characterized by the step of:—exposing the polymer based insulation system (11,12,13) to a heat treatment procedure while the outer surface of the polymer based insulation system (11,12,13) is covered by a cover (14) permeable to all the substances present in the polymer based insulation system (11,12,13) in a non-homogenous distribution, the permeable cover (14) having a melting and/or softening temperature greater than or equal to 120° C., thereby equalizing the concentration of the substances in the polymer based insulation system (11,12,13), the cable comprising a multi-wire conductor (10) that includes a central circular wire (101) that is surrounded by several layers of adjacent quadrangular wires (102).
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: May 28, 2019
    Assignee: NEXANS
    Inventors: Ramona Huuva, Lars Lervik, Liv Lundegaard
  • Patent number: 10260706
    Abstract: A lamp cover capable of simulating multiple images comprises an optically transparent hollow body, an opaque reflector having patterned cutouts and coupled to an inner surface of the body, wherein the opaque reflector is a metal oxide, a matte transparent protective layer formed on the opaque reflector, a polychromatic semitransparent reflector coupled to an outer surface of the body and a glossy transparent protective layer formed on the polychromatic semitransparent reflector.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: April 16, 2019
    Inventor: Min He
  • Patent number: 10243452
    Abstract: An electromagnetic shield including a base portion and opposing recess walls extending from the base portion at an angle with respect to a plane in which the base portion extends, so as to, together with the base portion, define a recess. At least one recess wall may be arranged such that it has a distal edge with respect to the base portion, wherein the distal edge includes a cylindrical portion. In alternative or in addition, at least one recess wall may be arranged such that at least a portion thereof curves outwards or inwards with respect to the recess.
    Type: Grant
    Filed: November 5, 2014
    Date of Patent: March 26, 2019
    Assignee: ABB Schweiz AG
    Inventors: Dong Wu, Jing Ni, Liliana Arevalo, Raul Montano
  • Patent number: 10239242
    Abstract: A method of manufacturing an emergency lamp switch is provided. The method includes printing a symbol on a film using inks of a plurality of colors and injection-molding an emergency lamp switch body on a symbol print surface of the film. The symbol print surface is transferred to the emergency lamp switch body and the film from the emergency lamp switch body is removed.
    Type: Grant
    Filed: October 10, 2016
    Date of Patent: March 26, 2019
    Assignees: Hyundai Motor Company, Kia Motor Corporation
    Inventors: Young Ju Lee, Keon Soo Jin, Dae Ig Jung, Kwan Woo Lee, Hye Kyung Kim
  • Patent number: 10232560
    Abstract: A manufacturing method of a composite structure includes: (a) preparing: a metallic sheet(s) having a through-hole(s) penetrating throughout the metallic sheet(s) in its thickness direction; (b) setting a prepreg(s), constituting a fiber reinforced plastic sheet(s), and the metallic sheet in a pair of dies, which have a recess(es) arranged at a position(s) opposed to one side opening(s) of the through-hole(s), the recess(es) having a larger diameter than the one side opening; (c) closing the dies, wherein, upon closing, (ca) the prepreg(s) and the metallic sheet are molded to the predetermined shape, while surface-contacting therebetween, (cb) at least one of the prepreg(s) and a patch member(s) is extruded into the through-hole(s), so that the shaft part is molded, and (cc) the patch member(s) forms at least part of a head part(s) in the recess(es), the head part(s) integrated with the shaft part(s) and engaging on the metallic sheet(s).
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: March 19, 2019
    Assignee: AISIN TAKAOKA CO., LTD.
    Inventors: Kiyohito Kondo, Yuji Yamashita
  • Patent number: 10195811
    Abstract: A device for compacting a contoured elongate composite layup includes flexible first and second fiber reinforced resin flexible sections flexible along their lengths. The first section is flexible within a first plane and the second section is flexible within the first plane as well as within a second plane. The second section includes flexible joints reinforced by a spine.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: February 5, 2019
    Assignee: The Boeing Company
    Inventor: Samuel Ray Stewart
  • Patent number: 10184035
    Abstract: A system and method for producing a composite component, especially for continuous production of such composite components, includes a feeding device for feeding one or more layers of reinforcing material from a material supply along a process path, a resin application device for applying a resin matrix to the reinforcing material fed along the process path, and a forming device configured to shape or mould a profile of the reinforcing material and the resin matrix applied thereto to form a composite component as the reinforcing material is fed or conveyed along the process path.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: January 22, 2019
    Assignee: Airbus Operations GmbH
    Inventors: Hauke Seegel, Tassilo Witte
  • Patent number: 10183468
    Abstract: A tolerance ring with functional layers has an annular band and an elastomeric layer. The assembly also may have a low friction layer, which may be bonded, calendared or laminated thereto. The low friction material may completely encapsulate the annular band.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: January 22, 2019
    Assignee: SAINT-GOBAIN PERFORMANCE PLASTICS PAMPUS GMBH
    Inventors: Hans-Juergen Jaeger, Dominique Burgeff
  • Patent number: 10160840
    Abstract: A fiber tow may include a plurality of reinforcing filaments each having a filament cross-sectional width. At least a portion of the polymer nanoparticles may be coupled to at least one of the reinforcing filaments and/or to other polymer nanoparticles. The polymer nanoparticles may have a particle cross-sectional width that is less than the reinforcing filament cross-sectional width. The polymer nanoparticles may provide a local filament spacing between the reinforcing filaments to reduce or avoid direct contact between reinforcing filaments, to allow for resin flow between the filaments, and/or to meet fiber volume fraction requirements.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: December 25, 2018
    Assignee: The Boeing Company
    Inventors: Mark S. Wilenski, Samuel J. Meure, Michael P. Kozar
  • Patent number: 10150250
    Abstract: A plastics molding process is provided in which a first (2) and a second plastic part (3) are molded such that a contact surface is formed between the two parts. The first part (2) is molded firstly and, while at least the contact surface is still in a liquid or plastic state, an attachment promoting powder (16) that is compatible with, and has the characteristic of attaching to, the plastic of the first part (2), is applied to it. Thereafter, the second part (3) is molded so as to contact the first part at the contact surfaces such that as it solidifies, it attaches to the attachment promoting powder (16) and thereby to the first part (2). The second part (3) may be a plastic foam filling for a hollow first part (2). The attachment promoting powder (16) may be a suitable grade of diatomaceous earth or a natural or synthetic equivalent.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: December 11, 2018
    Inventors: Gary Wayne Ferguson, John Peter Searle