With Cutting Of One Lamina Only While Adhered Patents (Class 156/248)
  • Patent number: 10601082
    Abstract: A signal collection assembly and a power battery module are provided. The signal collection assembly includes: a substrate; a signal collection line including a sheet-like metal conductive element disposed on the substrate; a signal collection member disposed on the substrate and connected with the signal collection line; and a signal collection terminal disposed on the substrate. The signal collection terminal includes a first terminal connected with the signal collection line and a second terminal connected with a power connection member of the power battery module.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: March 24, 2020
    Assignee: BYD COMPANY LIMITED
    Inventors: Yan Huang, Qun Zhou, Yingying Wang, Zhiming Gu
  • Patent number: 10602616
    Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: March 24, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yang Je Lee, Dek Gin Yang, Dong Gi An, Jae Ho Shin
  • Patent number: 10526245
    Abstract: The invention relates to a method for partially coating a surface of an object, comprising the following steps: (a) optional hydrophobization of the surface of the object; (b) partial application of (b1) a liquid and subsequent application of a powderous or granular substance or (b2) a solution or suspension of said powderous or granular substance in a liquid; (c) drying the surface to form spatially-delimited salt or powder crusts; (d) coating the surface with at least one layer of a metal or a metal compound; and (e) removing the salt or powder crusts that have been produced. The invention also relates to products that have been produced according to the claimed method.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: January 7, 2020
    Assignee: D. Swarovski KG
    Inventors: Heinz Nothdurfter, Rudolf Ernst Altenberger, Franz Kaltenecker, Arno Recheis
  • Patent number: 10426739
    Abstract: An adhesive patch assembly and method for making same. The assembly can include an adhesive patch and a release liner. The patch can include a backing and a skin-contact adhesive. The release liner can further include a first portion and a second portion separated by a hinge. The first portion can be positioned to overlay the backing of the patch when the release liner is folded upon the hinge, and the second portion can be positioned to underlie the skin-contact adhesive of the patch. The method can include positioning the patch on the release liner, such that patch is located on one of the first portion and the second portion of the release liner; and folding the release liner about to locate the patch between the first portion and the second portion of the release liner.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: October 1, 2019
    Assignee: 3M Innovative Properties Company
    Inventor: Gordon P. Knutson
  • Patent number: 10123413
    Abstract: A temporary package substrate includes a first copper layer, a second copper layer, a third copper layer, a first plating copper layer, a second plating copper layer, a third plating copper layer, a first dielectric layer, a second dielectric layer and two circuit structures. The second copper layer is located between the first and the third copper layers, and edges of the second copper layer are retracted a distance compared to edges of the first copper layer and edges of the third copper layer. The first and the second dielectric layers completely encapsulate the edges of the second copper layer and the edges of the second plating copper layer. Each of the circuit structures includes at least two patterned circuit layers, an insulation layer located between the patterned circuit layers, and a plurality of conductive through hole structures penetrating the insulation layer and electrically connected with the patterned circuit layers.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: November 6, 2018
    Assignee: Subtron Technology Co., Ltd.
    Inventors: Chih-Hong Chuang, Chien-Hung Wu
  • Patent number: 10094817
    Abstract: A process for the production of at least one analytical device is disclosed. The analytical device comprises at least one capillary element. The process comprises providing at least one carrier layer; providing at least one spacer layer; applying the spacer layer on top of the carrier layer; providing at least one cover layer; and applying the cover layer on top of the spacer layer. The process further comprises at least one cutting step. At least one capillary channel of the capillary element is cut out from the spacer layer. The cutting step is performed by using at least two cutting tools. The cutting tools complement one another to form a contour of the capillary channel.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: October 9, 2018
    Inventors: Siegfried Dick, Markus Fischer
  • Patent number: 10046547
    Abstract: A system and method are provided for implementing relatively low temperature joining processes, including displacement/vibration welding techniques and/or heat staking techniques, in a process of building up laminate layers to form and/or manufacture three-dimensional objects, parts and components in additive material (AM) manufacturing systems. A multi-stage 3D object forming scheme is described involving steps of laminate cutting (with lasers or other cutting devices); laminate transport between processing stations (including using one or more of conveyors, robotic pick and place devices and the like); laminate stacking, clamping and adhering through comparatively low temperature welding or other mechanical joining (including displacement/vibration welding or heat staking); and mechanical surface finishing (via CNC machining or other comparable process).
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: August 14, 2018
    Assignee: Xerox Corporation
    Inventors: Steven R Moore, Abu Saeed Islam, Bruce H. Smith
  • Patent number: 10037717
    Abstract: A printable magnetic label tape including a magnetic first layer and a printable second layer. The printable magnetic label tape includes spaced apart transverse oriented lines of weakness along the length of the label tape. A printable magnetic label, and methods of making.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: July 31, 2018
    Assignee: MAGNUM MAGNETICS CORPORATION
    Inventors: Jason Thomas Sargent, Trygve Paul Koren, Ryan Ray Watters
  • Patent number: 9849270
    Abstract: An adhesive composite dressing useful for applying an active ingredient to a treated skin site, as well as methods of manufacture and use of such dressings. In one embodiment, an adhesive composite dressing comprising an anchor member, a target member, and a folding member, where the anchor member comprises a first skin-contact adhesive, the target member comprises an opening adapted to enable skin treatment, the folding member comprises a drug reservoir, and where the folding member is attached to the anchor portion through a hinge defined by a line of attachment that is not contiguous with an edge of the anchor member.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: December 26, 2017
    Assignee: 3M Innovative Properties Company
    Inventor: Andrew J. Stockholm
  • Patent number: 9812361
    Abstract: Consistent with an example embodiment, there is a method for preparing integrated circuit (IC) device die from a wafer substrate having a front-side with active devices and a back-side. The method comprises pre-grinding the backside of a wafer substrate to a thickness. The front-side of the wafer is mounted onto a protective foil. A laser is applied to the backside of the wafer, at first focus depth to define a secondary modification zone in saw lanes. To the backside of the wafer, a second laser process is applied, at a second focus depth shallower than that of the first focus depth, in the saw lanes to define a main modification zone, the secondary modification defined at a pre-determined location within active device boundaries, the active device boundaries defining an active device area. The backside of the wafer is ground down to a depth so as to remove the main modification zone. The IC device die are separated from one another by stretching the protective foil.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: November 7, 2017
    Assignee: NXP B.V.
    Inventors: Hartmut Buenning, Sascha Moeller, Guido Albermann, Martin Lapke, Thomas Rohleder
  • Patent number: 9796555
    Abstract: An image forming apparatus includes: an image forming section configured to form a toner image on a sheet having a paste component; and an end pressing section provided on an upstream side of the image forming section in a sheet conveyance direction, and configured to exert a pressure on an end portion of the sheet while moving from a center toward an end of the sheet in a sheet width direction orthogonal to the sheet conveyance direction.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: October 24, 2017
    Assignee: KONICA MINOLTA, INC.
    Inventors: Tatsuya Furuta, Tomohiro Kawasaki, Shota Sakurai, Tetsuya Ishikawa, Natsuko Kawai
  • Patent number: 9761475
    Abstract: The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ? of the thickness of the separator.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: September 12, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai
  • Patent number: 9693468
    Abstract: A method of manufacturing a package substrate is provided. A first copper layer and a first plating copper layer formed thereon, a first dielectric layer, a second copper layer and a second plating copper layer formed thereon, a second dielectric layer, a third copper layer and a third plating copper layer formed thereon are provided and laminated, so that the first and the second dielectric layers encapsulate edges of the second copper layer and the second plating copper layer to form a temporary carrier. Two circuit structures are formed on two opposite surfaces of the temporary carrier. The temporary carrier and the circuit structures are cut to expose the edges of the second copper layer and the second plating copper layer, and separated along the exposed edges of the second copper layer and the second plating copper layer to form two package substrates independent from each other.
    Type: Grant
    Filed: September 7, 2015
    Date of Patent: June 27, 2017
    Assignee: Subtron Technology Co., Ltd.
    Inventors: Chih-Hong Chuang, Chien-Hung Wu
  • Patent number: 9561641
    Abstract: A method for continuously manufacturing an optical display panel includes feeding a carrier film 12 on which an optical film 13 is placed with a pressure-sensitive adhesive interposed therebetween, peeling off the optical film 13 from the carrier film 12 by using a folding-back part 40a to inwardly fold back the carrier film 12 being fed, taking up the carrier film 12 from which the optical film 13 is peeled off, feeding an optical cell P and bonding the optical film 13, which is peeled off from the carrier film 12, to the optical cell P with the pressure-sensitive adhesive interposed therebetween, and reducing a difference between a first tension on the carrier film 12 located upstream of the folding-back part 40a and a second tension on the carrier film 12 located downstream of the folding-back part while reducing one of the first and second tensions before the bonding step.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: February 7, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventors: Satoshi Hirata, Seiji Kondo, Kazuya Hada, Satoru Koshio
  • Patent number: 9475044
    Abstract: The test strip stabilizes skin prior to incision by a lancet tip. The innovative test strip includes a pair of skin contacting tabs that apply pressure linearly to the skin to stretch the skin taut. Beneficially an incision by a lancet tip to an accurate depth can be formed on the taut skin. Moreover, pressure from the tabs is applied linearly to the skin which results in a higher ratio of pressure to surface that can be reached as compared to applying pressure laminarily to skin. Some manufacturing techniques of the skin contacting tabs include cutting or stamping through all of the layers and test area of the test strip to form these tabs. These techniques increase the manufacturing efficiency and cost savings associated with test strips and integrated lancet testing devices. Contamination from other sampling events is eliminated since the test strips are disposed of after each use.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: October 25, 2016
    Assignee: Roche Diagnostics Operations, Inc.
    Inventor: Michael Keil
  • Patent number: 9421749
    Abstract: An apparatus for removal of the liner of a self-adhesive balancing weight is disclosed. A stripper wheel or stripper belt is rotated in close proximity over the surface of a balancing weight, and interacting with the liner and pulling the liner off from the balancing weight by means of a plurality of teeth. The speed of the stripper wheel or stripper belt is slightly higher than the speed of motion of the balancing weight.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: August 23, 2016
    Assignee: WEGMANN AUTOMOTIVE GMBH & CO. KG
    Inventor: Hans-Ulrich Bürgel
  • Patent number: 9376286
    Abstract: A method of making a pad of labels comprises: printing display information on a top surface of a substrate; affixing a first layer of lamination material to a bottom surface of the substrate; affixing a second layer of lamination material to the top surface of the substrate, the second layer of lamination material having a release coating applied to a top surface thereof; applying an adhesive strip to a bottom surface of the first layer of lamination material, the adhesive strip being covered by a liner material; cutting the substrate having first and second layers of lamination material affixed into at least one label; removing the liner material to expose the adhesive strip after cutting the substrate into at least one label; and arranging the labels into a pad of labels.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: June 28, 2016
    Assignee: Electronic Imaging Services, Inc.
    Inventors: Paul Browning, Gene Bethards, Scott Aten, Brian LeFevre, Patrick Cross
  • Patent number: 9362330
    Abstract: Methods for forming backside illuminated (BSI) image sensors having metal redistribution layers (RDL) and solder bumps for high performance connection to external circuitry are provided. In one embodiment, a BSI image sensor with RDL and solder bumps may be formed using a temporary carrier during manufacture that is removed prior to completion of the BSI image sensor. In another embodiment, a BSI image sensor with RDL and solder bumps may be formed using a permanent carrier during manufacture that partially remains in the completed BSI image sensor. A BSI image sensor may be formed before formation of a redistribution layer on the front side of the BSI image sensor. A redistribution layer may, alternatively, be formed on the front side of an image wafer before formation of BSI components such as microlenses and color filters on the back side of the image wafer.
    Type: Grant
    Filed: March 17, 2014
    Date of Patent: June 7, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Swarnal Borthakur, Kevin W. Hutto, Andrew Perkins, Marc Sulfridge
  • Patent number: 9320137
    Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a flexible substrate divided into first, second, and third regions, a first rigid substrate in the first region of the flexible substrate, and a second rigid substrate in the third region of the flexible substrate. The first and second substrates expose the second region of the flexible substrate.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: April 19, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Dong Wan Kim, Tae Ho Kim, Il Sang Maeng, Song Hee Cho
  • Patent number: 9227812
    Abstract: While a transporting unit transports an adhesive sheet attached to a separator larger than the adhesive sheet, a chuck member on a tip of a swing arm of a separating unit holds a portion of the separator protruding from an end of the adhesive sheet. Under such a condition, the chuck member moves in a direction crossing a transportation direction of the adhesive sheet, and the transporting unit moves in the transportation direction in synchronization with the chuck member while folding back the separator at an end of a supporting plate contacting the separator as a starting point. Accordingly, the separator is separated from the adhesive sheet. The transporting unit transports while holding the adhesive sheet with the separator separated therefrom to join the adhesive sheet to a workpiece.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: January 5, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventor: Osamu Degawa
  • Patent number: 9039866
    Abstract: The present invention relates to a method of manufacturing a web of a plurality of conductive structures which may be used for example to produce an antenna, electronic circuit, photovoltaic module or the like. The method involved simultaneously patterning at least one pattern in a conductive layer using a plurality of registration marks. The registration marks serve to align and guide the creation of the plurality of conductive structures. Optical brighteners may also be utilized within the adhesive layer and the registration marks of the present invention in order to detect the location where conductive structures are to be placed.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: May 26, 2015
    Assignee: Avery Dennison Corporation
    Inventors: Ian J. Forster, Christian K. Oelsner, Robert Revels, Benjamin Kingston, Peter Cockerell, Norman Howard
  • Publication number: 20150136312
    Abstract: A method for processing a workpiece including: a supporting plate preparing step of preparing a supporting plate having, on a top surface side of the supporting plate, a recessed portion configured to house a projecting portion provided in a device region of the workpiece; a positioning step of mounting the workpiece on the supporting plate such that the recessed portion of the supporting plate and the device region of the workpiece correspond to each other; a bonding step of forming a welded region in which the workpiece is welded to the supporting plate by irradiating a peripheral surplus region of the workpiece mounted on the supporting plate with a laser beam, whereby the workpiece is fixed on the supporting plate; and a processing step of processing the workpiece after performing the bonding step.
    Type: Application
    Filed: November 3, 2014
    Publication date: May 21, 2015
    Inventors: Frank Wei, Hiroshi Morikazu, Nao Hattori
  • Publication number: 20150125665
    Abstract: By preparing a polyimide film with a face at the support side and subjected to a surface treatment; subjecting at least one of a face of the support and the face of the polyimide film which are opposite to each other to a patterning treatment using a coupling agent to form a satisfactorily bondable part and an easily releasable part which differ in adhesion/peel strength; subsequently, superposing the support and the polyimide film to be subjected to a pressurizing/heating treatment and to be bonded to each other, subjecting the surface of the polyimide film to an organic alkali treatment; and then, applying a polyamic acid solution free from a slip agent ingredient, drying the coating film and imidizing the film, a layered product having a structure of at least three layers in which at least one layer contains a slip agent material and both surface layers have no slip agent material is produced.
    Type: Application
    Filed: June 12, 2013
    Publication date: May 7, 2015
    Inventors: Katsuki Nakase, Tetsuo Okuyama, Toshiyuki Tsuchiya, Satoshi Maeda, Kazuyuki Ouya
  • Publication number: 20150107764
    Abstract: Provided is a process for producing an adhesive sheet having a singulated adhesive layer (b) on a carrier film (a), comprising the following steps in the order mentioned: Step A: cutting an adhesive film having a carrier film (a), an adhesive layer (b), and a cover film (c) in the order mentioned locally only at the adhesive layer (b) and the cover film (c) by means of local half-cutting; Step B: peeling only the cover film (c) at unwanted parts of the adhesive film; Step C: applying adhesive tape to the side of the cover film (c) of the adhesive film; and Step D: peeling the adhesive layer (b) at unwanted parts and the cover film (c) at desired parts of the adhesive film together with the adhesive tape. Also provided are a process for producing an adhesive sheet comprising a singulated adhesive disposed at a specific position, and equipment for producing an adhesive sheet.
    Type: Application
    Filed: June 26, 2013
    Publication date: April 23, 2015
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Masaya Katayama, Hiroyuki Niwa, Toshihisa Nonaka
  • Publication number: 20150107763
    Abstract: An adhesive film or films are applied to a surface of an object by providing a tape with an adhesive on the rear surface and a release characteristic on the front surface. The tape has two or three parallel spaced filaments in the adhesive which are used to tear through the film or film to form butting edges of the films and to form a strip of one of the films which is attached to the object as a visible stripe thereon either as a stand-alone stripe or as a protective cover for the butting edges.
    Type: Application
    Filed: October 21, 2013
    Publication date: April 23, 2015
    Inventor: Garry Cyrille Alfred VanDenBerghe
  • Publication number: 20150090398
    Abstract: A nasal dilator comprises a laminate of vertically stacked layers each comprising at least one member or component. The layers form a unitary, or single body, truss. The truss features horizontal regions adapted to engage outer wall tissues of first and second nasal passages and to traverse the bridge of a nose therebetween. The dilator acts to stabilize and/or expand the nasal outer wall tissues and prevent said tissues from drawing inward during breathing. Dilator members, including components thereof, are configured to dimensional criteria suitable to engage and provide effective dilation to nasal passages, that create lateral and longitudinal registration of dilator members or components during manufacture, and that facilitate manufacture with minimal material waste. Methods of manufacture further include progressive steps that fabricate and assemble components into finished devices, including user assembly thereof.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Inventor: Joseph V. IERULLI
  • Patent number: 8992714
    Abstract: A method produces adhesive tapes which are adhesive at least on one side, wherein an adhesive tape web, in which the at least one adhesive side is covered by a first liner, is guided into a cutting device in which a total of N individual adhesive tape strips located next to one another are produced in the machine direction from the adhesive tape web. Every other adhesive tape strip is removed from the first liner and is applied to a second liner in each case having a spacing a between the individual adhesive tape strips. The liners are cut between the adhesive tape strips located on the first liner and on the second liner, and the individual adhesive tapes, together with the liner strips, are wound up in a total of X rolls in a form of an Archimedean spiral.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: March 31, 2015
    Assignee: tesa SE
    Inventors: Michael Tach, Bruce Dirk Ehlers, Markus Gabriel, Christian Fröhlich
  • Patent number: 8992712
    Abstract: In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: March 31, 2015
    Assignee: Arizona Board of Regents, a Body Corporate of the State of Arizona Acting for and on Behalf of Arizona State University
    Inventors: Douglas E. Loy, Emmett Howard, Jesmin Haq, Nicholas Munizza
  • Patent number: 8992713
    Abstract: Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: March 31, 2015
    Assignee: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Seiichiro Ohashi, Eiichi Hayashi, Tadahiko Yokota
  • Publication number: 20150083312
    Abstract: A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.
    Type: Application
    Filed: January 29, 2014
    Publication date: March 26, 2015
    Applicant: AU Optronics Corporation
    Inventors: Shuo-Yang SUN, Wan-Chen HUANG, Wei-Ting LIN, Chun-Cheng CHENG
  • Patent number: 8986486
    Abstract: The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ? of the thickness of the separator.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: March 24, 2015
    Assignee: Nitto Denko Corporation
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai
  • Publication number: 20150072449
    Abstract: A manufacturing method of an organic light emitting diode (“OLED”) display includes: forming a contact pattern on a panel region of a surface of a board glass, where the board glass includes the panel region, and a peripheral area which surrounds the panel region; contacting the paper glass with a surface of the contact pattern corresponding to the panel region and the surface of the board glass corresponding to the peripheral area; adhering the surface of the board glass corresponding to the peripheral area to a surface of the paper glass; forming an organic light emitting element on the paper glass corresponding to the panel region; and separating the paper glass from the board glass by cutting the paper glass at a position corresponding to an end portion of the panel region adjacent to the peripheral area.
    Type: Application
    Filed: February 27, 2014
    Publication date: March 12, 2015
    Applicant: Samsung Display Co., Ltd.
    Inventors: Beung Hwa JEONG, Hong Ro LEE, Chang Mo PARK, Yo Seoph KO, Dong Min LEE, Sung Hoon HONG
  • Publication number: 20150053952
    Abstract: A method for manufacturing a joined body composed of a first substrate and a second substrate joined together by sealing resin material attached to a predetermined area of the first substrate includes: attaching a sheet material to the first substrate so as to cover the predetermined area, the sheet material including a sheet base material and the resin material provided on one main surface of the sheet base material; forming, after the attaching, in the sheet material, a slit by reducing a thickness of the resin material along an outline of the predetermined area; and separating, after the forming, part of the resin material inside the slit from the sheet base material to keep the part of the resin material inside the slit on the predetermined area of the first substrate and not to keep the rest of the resin material outside the slit on the first substrate.
    Type: Application
    Filed: August 6, 2013
    Publication date: February 26, 2015
    Applicant: PANASONIC CORPORATION
    Inventors: Hiroko Okumura, Hiroyuki Masuda
  • Patent number: 8961729
    Abstract: A method of manufacturing a touch panel is disclosed. The method includes providing a plurality of substrates, each having a size, providing a carrier including a plurality of grooves each having a size corresponding with the size of the substrates. The method also includes placing the plurality of substrates into the grooves, simultaneously forming a touch structure layer on each of the substrates, and separating substrates from the carrier.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: February 24, 2015
    Assignee: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Lijun Zhao, Jun Ma
  • Publication number: 20150028225
    Abstract: A method for manufacturing a TEM-lamella is disclosed. The method includes: disposing a self-supporting protective structure on a surface of a substrate; bonding the protective structure to the substrate; cutting out a lamella from the substrate using a particle beam so that the lamella remains bonded to at least a portion of the protective structure; fastening a first tool to the lamella; and moving away the lamella from a residual portion of the substrate by moving the first tool relative to the substrate.
    Type: Application
    Filed: July 22, 2014
    Publication date: January 29, 2015
    Inventor: Lorenz Lechner
  • Publication number: 20150021084
    Abstract: Disclosed herein are a copper clad laminate, a printed circuit board, and a method of manufacturing the same. The copper clad laminate includes: an insulating layer having one surface and the other surface; and first and second copper foil layers having one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively, wherein one surface of the insulating layer contacts the rough surface of the first copper foil layer and the other surface of the insulating layer contacts the smooth surface of the second copper foil layer.
    Type: Application
    Filed: July 16, 2014
    Publication date: January 22, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Ho Ko, Chang Jae Lee, Jun Ho Kang, Seok Jun Ahn
  • Publication number: 20150020962
    Abstract: Provided is a label production method capable of significantly reducing production costs by producing many single labels using one member. A label substrate that an adhesive and a release agent are applied to is passed through a laminating device twice, first label substrate passed for the first time and second label substrate passed for the second time are pseudo-adhered by joining the release agent of the first label substrate passed for the first time to the adhesive of the second label substrate passed for the second time, and single labels are punched out from the second label substrate by a cutting tooth of a punching device at a position on the downstream side after the label substrate is passed through the laminating device for the second time. The first label substrate passed for the first time is used as a seat for the cutting tooth of the punching device.
    Type: Application
    Filed: March 2, 2012
    Publication date: January 22, 2015
    Applicant: WE'LL CORPORATION
    Inventor: Hiroshi Nakamura
  • Patent number: 8936693
    Abstract: A method of manufacturing a flexible composite panel having a plurality of reservoirs connected by at least one capillary includes forming a capillary assembly by winding a flexible, deformable capillary base web partially around a rotating cylinder that has a plurality of recessed features formed therein; drawing the capillary base web into the recessed features to form the capillaries in the capillary base web; filling the capillaries; and laminating a capillary barrier web over the capillary base web. A flexible reservoir assembly is formed by cutting the perimeter of the at least two reservoirs and associated catchments into a flexible reservoir web; removing the waste cut interiors of the reservoirs and the catchments from the reservoir web; securing the reservoir web to a base layer; overfilling each reservoir; and laminating the capillary assembly over the reservoir assembly, driving excess filler from the reservoirs into the catchments.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: January 20, 2015
    Assignee: Mark Andy, Inc.
    Inventors: Kevin Stone Manes, John Robinson
  • Patent number: 8936692
    Abstract: Provided is an optical functional film in which air bubbles can be effectively prevented from forming during lamination, and preferably in which a carrier film does not tear readily. Also provided is a method for manufacturing a liquid crystal display device using this optical functional film. A belt-shaped optical functional film is used in order to cut away the optical functional film at predetermined intervals from the belt-shaped optical functional film to which a carrier film is bonded, with the carrier film remaining uncut; to subsequently turn over the carrier film by an edge-shaped member and peel away the optical functional film; and to laminate the exposed surface of the optical functional film to a sheet member while the optical functional film is being peeled away, wherein the optical functional film is characterized in that the flexural rigidity of the carrier film per unit length in the longitudinal direction is from 5.0×10?5 N·mm2 to 8.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: January 20, 2015
    Assignee: Nitto Denko Corporation
    Inventors: Satoshi Hirata, Kazuo Kitada, Tomokazu Yura, Satoru Koshio, Takuya Nakazono
  • Patent number: 8920589
    Abstract: A pressure sensitive adhesive film attached to a surface is cut by pulling a filament from an adhesive tape applied on to the surface through that part of the film over the tape so as to cut the film and to form a cut edge of the film. The filament is a polyester multi-fiber filament of the order of 16 tex which provides a strength to break of the order of 2 pounds force and an extension of the order of 15% under a load of 1.0 pounds force. The tape comprises a polyethylene substrate of 0.125 inch in width. The filament is extendible so that, when the tape is stretched the filament stretches with the tape and does not pull out or separate. The filament can be broken by hand and has an ability to bend to a radius of curvature of less than 0.5 inches without any stiffness in the filament.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: December 30, 2014
    Inventor: Garry Cyrille Alfred VanDenBerghe
  • Patent number: 8920586
    Abstract: Method for producing a fastening system, in particular for components of photovoltaic systems, preferably on roof surfaces of buildings, includes providing a support surface (1) and applying at least one fastening component (7, 19) of loops and/or other interlocking elements on the support surface. After applying the fastening component (7, 19) in the mounted state of the support surface (1), at least one other corresponding fastening component (7, 19) provided with other interlocking elements can be detachably connected to the fastening components (7, 19) on the support surface.
    Type: Grant
    Filed: January 7, 2013
    Date of Patent: December 30, 2014
    Assignee: Gottlieb Binder GmbH & Co. KG
    Inventor: Konstantinos Poulakis
  • Publication number: 20140376836
    Abstract: A re-sealable package and method which includes roll stock, a pressure sensitive label and a release member. The re-sealable package includes an outer layer laminated to an inner sealant layer. The pressure sensitive label has a first preselected shape and includes a pressure sensitive adhesive on one side. The side having the pressure sensitive layer is adhered to the inner sealant layer of the roll stock. The release member is formed in the outer layer, the release member having a second preselected shape which is smaller than the first preselected shape of the pressure sensitive label. As the release member is lifted from the pressure sensitive label, an area of the pressure sensitive adhesive is exposed to allow portions of the package to be removably adhered to the area of pressure sensitive adhesive.
    Type: Application
    Filed: June 24, 2013
    Publication date: December 25, 2014
    Inventor: William C. SCHIEBER
  • Publication number: 20140367032
    Abstract: A method for the production of an elastic composite material with a textile surface. First, a laminate is produced, which has elastic cover layers and a core composed of a nonwoven fabric. Subsequently, the laminate is separated into two strips, each of which has a cover layer and an adhering layer of nonwoven fabric, by tearing open the core.
    Type: Application
    Filed: September 2, 2014
    Publication date: December 18, 2014
    Applicant: MONDI CONSUMER PACKAGING TECHNOLOGIES GMBH
    Inventors: Dieter HOMOELLE, Marcus SCHOENBECK
  • Publication number: 20140356688
    Abstract: The present disclosure provides a separator for lithium battery, particularly to a separator including a middle layer formed by a punch method. Also, a manufacturing method of the separator is provided. The separator formed by the punch method has a better heat-resistant property in an elevated temperature and features a high mechanical strength.
    Type: Application
    Filed: February 13, 2014
    Publication date: December 4, 2014
    Applicant: BenQ Materials Corporation
    Inventors: Wei-Ting YEH, Kang-Ming PENG
  • Patent number: 8894797
    Abstract: The present invention discloses a method of splicing polarized films. The method includes steps of providing a substrate; attaching a first polarized film to the substrate; attaching a second polarized film to the substrate so that a side portion of the second polarized film is correspondingly overlapped with a side portion of the first polarized film; correspondingly cutting off the overlapped side portions of the first polarized film and the second polarized film; removing separated parts of the side portions from the first polarized film and the second polarized film; and performing a flatten treatment to the cut side portions of the first polarized film and the second polarized film. The method effectively reduces the interval between spliced polarized films so that the light leakage problem at the joint position is improved.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: November 25, 2014
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventors: Chengming He, Quan Cheng, Liang Xu, Rong Cao
  • Patent number: 8894794
    Abstract: A method of making a floor panel includes the steps of: providing an adhesive on a release member; laminating or marrying the release member to a bottom layer such that the adhesive is between the release member and the bottom layer; removing a portion of the release member to expose an area of the adhesive; and adhering a top layer to the area such that the top layer is offset with respect to the bottom layer in a direction of length and width and a marginal end portion of a top surface of the bottom layer and a marginal end portion of the bottom surface of the top layer is exposed.
    Type: Grant
    Filed: August 19, 2010
    Date of Patent: November 25, 2014
    Assignee: AWI Licensing Company
    Inventors: Richard H. Balmer, Shih Chung Lee, Dung V. Dao, John R. Eshbach, Jr., Heath E. Harrington, Michael E. Buckwalter, Kean M. Anspach
  • Patent number: 8894795
    Abstract: The method for manufacturing a liquid crystal display device includes carrier film feeding steps including feeding long carrier films from continuous rolls, respectively; peeling steps including folding back each of the carrier films at a front end part placed on a carrier film feed path so that the optical films are peeled off from the carrier films, respectively; and bonding steps including bonding the optical films to the viewer side and back side of a liquid crystal panel, wherein in the bonding steps, the optical films are bonded to the liquid crystal panel in such a manner that the number of times the optical film is bonded to the back side of the liquid crystal panel is greater than the number of times the optical film is bonded to the viewer side of the liquid crystal panel.
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: November 25, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Kazuya Hada, Satoshi Hirata, Seiji Kondo, Seiji Umemoto
  • Patent number: 8888943
    Abstract: A method of transferring a plurality of metal foil labels from a metal foil strip onto a continuous film liner in spaced apart juxtapositions, the method comprising placing metal foil strips onto a continuous web to form an assembly of the strips and the web, feeding the foil strip assembly through a compression roller module, and then feeding the foil strip assembly to a rotary die cutting module to cut through said metal foil strip and portions of said web to form a plurality of metal foil labels.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: November 18, 2014
    Assignee: Metalcraft, Inc.
    Inventors: Paul A. Degen, James A. Miller
  • Patent number: 8882954
    Abstract: The present invention relates to a method of manufacturing a rigid-flexible printed circuit board including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: November 11, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yang Je Lee, Jae Ho Shin, Dek Gin Yang
  • Publication number: 20140322500
    Abstract: The method for producing a electroconductive sheet having a substrate, in particular made of paper, and an electroconductive layer include the steps of: a/ preparing a multi-layer structure with an anti-adhesive coating inserted between a plastic film and a base layer, b/ cross-laminating the multi-layer structure and the substrate, and c/ removing the plastic film and the anti-adhesive coating from the base layer. The base layer is a layer of an electroconductive material or is covered with an electroconductive layer by an additional step consisting of: d1/ depositing an electroconductive film on the base layer; or d2/ printing the base layer with at least one ink having electrical properties, with the base layer being a printable layer with a binder base of which the rate is 15% greater in dry weight in relation to the total dry matter weight of this layer.
    Type: Application
    Filed: December 21, 2012
    Publication date: October 30, 2014
    Applicant: ARJO WIGGINS FINE PAPERS LTD.
    Inventors: Gaël Depres, Jean-Marie Vau