Abstract: A resin film is released from a supporting substrate without using light irradiation, with ease, and without damaging the resin film or the like. Preparation for separating the supporting substrate on which the resin film is cohesively formed into a first part and a second part; and at least one of the first part and the second part is allowed or caused to move in a direction parallel to an one surface of the first part while the first part of the supporting substrate and at least an edge of the second part facing the first part being moved with respect to one another, while a close contact between the resin film and an one surface of the second part of the supporting substrate being maintained, such that the first part and the edge of the second part are separated along a perpendicular direction to the one surface of the first part.

Abstract: A system for bonding a windshield to a windshield frame, the system comprising: at least one layer of bonding material that bonds the windshield to the windshield frame; at least one heating element embedded in the bonding material; at least one shape memory element formed from a shape memory material embedded in the at least one layer of bonding material in close proximity to the at least one heating element; at least one electrical power source coupled to the at least one heating element; and a controller operable to control the at least one electrical power source to generate current in the at least one heating element to generate heat that softens and weakens the bonding material and causes the at least one shape memory element to transition to a remembered shape that operates to disrupt the bonding layer and free the windshield from the windshield frame.

Abstract: A semiconductor package and a manufacturing method are provided. The semiconductor package includes a die, a dummy cube, a stress relaxation layer, an encapsulant and a redistribution structure. The dummy cube is disposed beside the die. The stress relaxation layer covers a top surface of the dummy cube. The encapsulant encapsulates the die and the dummy cube. The redistribution structure is disposed over the encapsulant and is electrically connected to the die. The stress relaxation layer is interposed between the dummy cube and the redistribution structure.

Abstract: When conventional photo-reactive compounds are to be liquefied with the application of light, liquefaction thereof is time-consuming due to poor sensitivity to ultraviolet light. In the case of conventional photo-reactive compounds, disadvantageously, light does not penetrate through layers to be adhered to each other when such layers are thick. Thus, peeling is not sufficiently performed. Accordingly, it is an object of the present invention to overcome such drawbacks of conventional photo-reactive compounds and provide a photo-reactive adhesive agent exhibiting high sensitivity to light for fluidization and capable of easy peeling.

Abstract: A method of manufacturing a display device includes preparing a base substrate including a first area, a second area, and a bending area disposed between the first and second areas, the base substrate having a coating film pattern formed on a first surface thereof in the bending area; disposing a support plate, which includes an adhesive film and a support film, on the first surface of the base substrate to cover the coating film pattern; and separating the support plate and the coating film pattern, which overlap with each other in a thickness direction, from the base substrate, wherein the disposing the support plate includes disposing the support plate in such a manner that the adhesive film is in contact with the coating film pattern and the first surface of the base substrate.

Abstract: Systems and methods for self-service recycling are provided. In particular, some embodiments include graphical user interfaces and backend systems that allow users to engage in remote inquiries of available salvage automotive parts in salvage yards. A user makes a request for a type of recyclable assembly. Examples of types of recyclable assemblies include, but are not limited to, automobiles, tractors, electronic devices, home appliances, and vending machines. The request is compared to a database of end-of-life vehicles across a number of salvage yards. When a salvage yard is identified as having the specified end-of-life vehicle, local parts pullers who are on site are notified and a communication channel between the parts puller and the user is initiated. This is facilitated through geofencing and location aware devices. Using this information, the user can determine if any of the identified parts remain on the vehicle and may purchase the parts from the SSAR facility for resale.

Abstract: A micro device transferring method and a micro device transferring apparatus are provided. The micro device transferring method exemplarily includes: providing a carrier substrate including a transparent base, a light radiation activated adhesiveness-loss layer located on a first surface of the transparent base and multiple micro devices arranged in an array on the light radiation activated adhesiveness-loss layer; locally irradiating the light radiation activated adhesiveness-loss layer from a second surface of the transparent base to reduce adhesiveness of multiple target areas of the light radiation activated adhesiveness-loss layer to the micro devices respectively located in the multiple target areas, the multiple target areas being areas corresponding to the micro devices to be transferred; picking up the micro devices in the multiple target areas; and aligning the picked up micro devices with corresponding locations of a receiving substrate, and releasing them onto the receiving substrate.

Abstract: The present disclosure provides an OLED display device and a method of making the same. The method includes defining a recess in a first substrate; forming an alignment mark outside the recess; forming a second substrate in the recess; forming a thin film transistor layer and a pixel array layer sequentially on the second substrate. In the present disclosure, the first substrate is accurately aligned with mask plates when forming the pixel array layer, and the second substrate is not deformed during the process of vapor deposition, thereby avoiding the problem of color mixed in vapor deposition.

Abstract: A customizable garment patch including at least a first layer, the first layer being a printed graphical layer, a second layer attached to the first layer being a fabric substrate layer, the first layer attached to the second layer by sublimation printing, an adhesive applied to the second layer, the adhesive capable of connecting the garment patch to a surface and the adhesive being a water soluble glue.

Abstract: An adhesive delamination layer including at least one non-linear organopolysiloxane and methods for display device substrate processing are disclosed. The method includes securing the display device substrate to a carrier substrate with an adhesive delamination layer including a cured product of curing a precursor adhesive composition. The precursor adhesive composition includes Component (A), a hydrogenorganopolysiloxane and Component (B), a (C2-C20)alkenyl-functionalized organopolysiloxane, wherein the (C2-C20)alkenyl group is uninterrupted or interrupted by 1, 2, or 3 groups independently chosen from —O—, —S—, substituted or unsubstituted —NH—, —(O—(C2-C3)alkylene)n- wherein n is 1 to 1,000, —Si((C1-C5)alkoxy)2-, and —Si((C1-C5)alkyl)2- wherein at least one of Component (A) and Component (B) is non-linear.

Abstract: At least some aspects of the present disclosure feature a computing device configured to display visual representations of digital notes and one or more group images representing one or more groups on a user interface, where each group may include one or more digital notes. The computing device is further configured to receive one or more user inputs via the user interface and change the compositions of the groups based on the received user inputs.

Abstract: A method for repairing surface of carbon nanotube array is provided. A carbon nanotube array located on a substrate are provided. The carbon nanotube array comprises a plurality of carbon nanotubes, and at least part of the plurality of carbon nanotubes are aslant arranged on the surface of the substrate. An adhesive tape is placed on a surface of the carbon nanotube array away from the substrate. A bond force between the plurality of carbon nanotubes and the substrate is greater than a bond force between the plurality of carbon nanotubes and the adhesive tape. The adhesive tape is peeled off, and the at least part of the plurality of carbon nanotubes are pulled up vertically by a bond force of the adhesive tape.

Abstract: Disclosed herein is a wafer processing method including a protective film forming step of forming a protective film with which the whole of a surface of a wafer is coated, a laser beam irradiation step of irradiating the wafer with a laser beam along streets to remove a functional layer and expose a substrate, a protective film detecting step of detecting the coating state of the protective film in plural device regions over the wafer after the laser beam irradiation, a protective film re-forming step of forming the protective film again in such a manner that the protective film covers each device region if a part that is not coated with the protective film exists in the device regions, a plasma irradiation step of carrying out plasma irradiation for the wafer, and a dividing step of dividing the wafer by cutting along the streets.

Abstract: A technique comprising: providing an assembly temporarily adhered on opposite sides to respective carriers by respective adhesive elements, the assembly including at least one plastic support sheet; heating the assembly while mechanically compressing the assembly between the carriers, wherein the strength of adhesion of one of said adhesive elements to the respective carrier and/or to the assembly is partially reduced during said heating of the assembly under mechanical compression; and wherein the strength of adhesion of the said adhesive element to the carrier and/or to the assembly is further reducible by further heating the said adhesive element after partially or completely relaxing the pressure at which the assembly is mechanically compressed between the two carriers.

Abstract: The present disclosure relates to coating a carrier component by means of cold gas dynamic spraying. For example, a method for coating a carrier component may include: laying a mask with an opening on the component; depositing a material through the opening to completely fill up the mask opening; removing any material located above the upper side to form a flat surface even with the upper side of the mask; laying a second mask on the first mask; depositing the material again; removing any deposited material located above the upper side of the second mask to form a flat surface even with the upper side of the second mask; repeating layers of additional masks and material deposition until the deposited material reaches a required thickness on the carrier component; and after completion of the coating to the required thickness, removing the masks.

Abstract: According to the utility model, there is provided a film laminator for cell phones, useful for film lamination on a surface of a cell phone, including: a cell phone fixing plate, on which a through hole for receiving the cell phone is established, and a top surface of which is a horizontal face; with at least one position limiting plate for abutting the cell phone within the through hole being also fixed on the top surface. The film laminator for cell phones further includes: a film laminating plate for fixing a cell phone film; one end of which is hinged to the cell phone fixing plate, and the other end of which is movable freely so that the film laminating plate is bonded with the top surface of the cell phone fixing plate.

Abstract: Provided is a method for producing a glass unit. The method comprises a step (A) of obtaining a glass plate; a step (B) of applying a protective sheet to one face of the glass plate; an optional step (C) of subjecting the glass plate to at least one process selected from the group consisting of transportation, storage, processing, washing and handling; a step (D) of removing the protective sheet from the glass plate; and a step (E) of assembling a glass unit using the glass plate. The protective sheet comprises a substrate layer, and a PSA layer provided to at least one face of the substrate layer. The PSA layer has a surface hardness of 0.3 MPa or greater.

Abstract: A flexible, self-heating food container capable of withstanding high temperatures is provided. The container comprises a two-layer laminate structure having an air access flap that can be lifted by the consumer to allow air to enter the part of the container where an exothermic reaction takes place.

Abstract: A method for mending damaged areas in fiber composite components formed from a plurality of unidirectional fiber layers includes the steps of automatically lifting at least one fiber layer of the fiber composite component at a cutting edge of the at least one fiber layer using a delaminating device, removing the at least one fiber layer in the extension direction of the fiber orientation of the at least one fiber layer, and separating off the removed at least one fiber layer in a defined manner at a separating edge defined by a separating device placed on the fiber composite component.

Abstract: A slider is provided with a conformal coating (e.g., an oxide) on the air-bearing surface (ABS) to provide a consistent surface energy to the ABS. The conformal coating may be formed by an atomic layer deposition (ALD) process. A consistent surface energy inhibits accumulation of contaminants on the slider ABS, such as at topographical transition areas.

Abstract: The present disclosure provides a preparation method of a flexible display and a flexible display, and the method may include: coating an adhesive on a first surface of a first substrate to form an adhesive layer; bonding the first substrate on the second substrate by the adhesive layer on the first surface; providing a flexible display body on the second surface of the first substrate; separating the second substrate from the first substrate by a hygroscopic swelling to obtain the flexible display. By the above-mentioned method, a preparation process flow may be simplified, and the product quality may be improved.

Abstract: A method for manufacturing a mode converter including a substrate that is a single member and includes a first main surface, a second main surface opposite to the first main surface, and a micro hole which is formed in the first main surface, grounding conductor layers that are formed on the first main surface and the second main surface, a plane circuit that is formed on the first main surface, and a pin that is formed so as to cover an inner surface of the micro hole and is electrically connected to the plane circuit, the method includes: irradiating the substrate with laser light to form a first modified portion to a desired depth from one main surface of the substrate; removing the first modified portion to form the micro hole; and filling the micro hole with a conductive material to form the pin.

Abstract: An ink jet recording apparatus of the present invention includes an image forming unit which forms an ink image by discharging and applying ink containing at least a resin and a liquid component as an ink droplet onto a transfer body, a liquid removing unit which removes the liquid component in the ink image, a transfer unit which transfers removes the image, from which the liquid component is removed, onto a recording medium, a fixing unit which performs heating and pressing fixing on the image formed on the recording medium by pressing a fixing substrate, a liquid adhesion determination unit which determines whether a liquid adheres to a surface of the fixing substrate, and a liquid removing condition changing unit which changes a liquid removing condition of the liquid removing unit based on the determination result of the liquid adhesion determination unit.

Abstract: The present invention relates to methods of making a prosthesis or a stent with a smooth covering.

Abstract: A method for bonding a product substrate to a carrier substrate via a connection layer, wherein a soluble layer is applied between the connection layer and the product substrate, and wherein a) the soluble layer is soluble due to an interaction with an electromagnetic radiation of a radiation source, and b) the connection layer and the carrier substrate are at least predominantly transparent to the electromagnetic radiation. A method for debonding a product substrate from a carrier substrate bonded to the product substrate via a connection layer, wherein a soluble layer is applied between the connection layer and the product substrate, and wherein a) the soluble layer is dissolved through an interaction with an electromagnetic radiation of a radiation source, and b) the connection layer and the carrier substrate are at least predominantly transparent to the electromagnetic radiation. A corresponding product-substrate-to-carrier-substrate bond is also disclosed.

Abstract: [Object] To provide a method and an apparatus for manufacturing electronic devices by transferring the device chips from one substrate for producing device chips to the other substrate for a product having a large display. [Means of Realizing the Object] A substrate having a plurality of device chips is brought into contact with a first drum including a selective adhesive region, the device chips are transferred by making the device chips be adhered to the selective adhesive layer of the first drum and separating at least part of the device chips from the substrate by rotating the first drum, then, the device chips on the first drum are made to be come into contact with the other substrate for the product, and the device chips are transferred to the substrate for the product by rotating the first drum.

Abstract: There is provided a joining structure of a resin member for a vehicle body and a stud bolt that can more strongly fix a stud bolt to a resin member for a vehicle body by an ultraviolet curable adhesive. Convex portions are provided at a portion, which structures a flange-adjacent portion, of a mounting surface portion of a resin member for mounting. Therefore, a surface area of adhesion with adhesive at a place, which is covered by a flange portion as seen in a plan view, of the mounting surface portion can be made to be large. As a result, adhesive force of a portion, which is cured by diffused ultraviolet rays, of the adhesive A that is covered by the flange portion as seen in a plan view can be made to be large.

Abstract: Provided is a retroreflective article comprising a fibrous material and a perforated retroreflective material attached to said fibrous material. Embodiments of the article achieve desirable values under the ASTM F2731-11 Transmitted and Stored Energy Test, the E96/E96M-12 Moisture Vapor Transmission Rate Test, and ASTM E810-03 (2013) Standard Test Method for Coefficient of Retroreflection of Retroreflective Sheeting Utilizing the Coplanar Geometry.

Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

Abstract: The present disclosure relates to the technical field of display, and in particular, to a polarizer applicable to a display device. The polarizer comprises a stack which at least includes: a functional layer, capable of affecting a polarization direction of an optical wave and converting wavelength of the optical wave, and a protective layer located at an outermost part of the stack. In this manner, two important functions are integrated into the polarizer, which can not only improve the color gamut and the light utilization rate of the display device, but also ensure that light emitted can have a desired polarization state, thus enhancing the display quality of the display device.

Abstract: A roofing shingle comprising a base mat having a tab portion covered with granules and a headlap portion covered with a mask or film layer. An asphalt-based coating is applied to at least a top surface of the base mat. The film layer is adhered to the asphalt-based coating applied to the headlap portion and the granules are adhered to the asphalt-based coating applied to the tab portion. The film layer is adapted for preventing granules from adhering to the headlap portion of the base mat and, as such, the headlap portion may be substantially free from any granules adhered thereto. A method for manufacturing a roofing shingle is also provided wherein granules that are not adhered to the tab portion of one shingle may be collected and reapplied the tab portion of another shingle.

Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

Abstract: Certain embodiments of the present disclosure are directed to a stretch removable adhesive tape comprising a thermoplastic polyurethane film having a unique combination of properties leading to a unique stretch removal profile.

Abstract: In order to produce accurate sensor element in a simple way, the invention provides a method for producing a sensor element (10) for a pressure or force sensor. Steps include, providing a component (13) to be deformed. Applying to the component (13), a sensor function and contact layer (24) consisting of a material with a k-factor between 2 and 10. Performing planar ablation of the material of the sensor function and contact layer (24) by means of a laser, in such a manner that strain gauges (44) with a resistance structure with a meandering shape and contact pads (46.1, 46.2, 46.3, 46.4) remain standing.

Abstract: An apparatus for melting thermoplastic material is disclosed. The apparatus includes a heated manifold and at least one heating element disposed within the heated manifold. The heated manifold defines a plurality of cavities, a pump supply passage, and a discharge passage. The plurality of cavities are spaced apart from one another, and each receives particles of thermoplastic material from a hopper. The particles of thermoplastic material are melted within the plurality of cavities. The pump supply passage receives molten thermoplastic material from the plurality of cavities and supplies the molten thermoplastic material to a pump. The discharge passage receives pressurized molten thermoplastic material from the pump and is in fluid communication with a dispenser. The heating element transfers heat substantially throughout the heated manifold.

Abstract: A process for creating an abstract art image may include forming a wire sculpture from conductive electrical wire; mounting the wire sculpture in a framework; operatively connecting the wire sculpture to a power supply having a voltage and a current necessary to melt the wire sculpture; starting the power on the power supply to slowly melt the wire sculpture; and photographing the melting wire sculpture over an extended time period.

Abstract: According to the utility model, there is provided a film laminator for cell phones, useful for film lamination on a surface of a cell phone, including: a cell phone fixing plate, on which a through hole for receiving the cell phone is established, and a top surface of which is a horizontal face; with at least one position limiting plate for abutting the cell phone within the through hole being also fixed on the top surface. The film laminator for cell phones further includes: a film laminating plate for fixing a cell phone film; one end of which is hinged to the cell phone fixing plate, and the other end of which is movable freely so that the film laminating plate is bonded with the top surface of the cell phone fixing plate.

Abstract: Disclosed herein is a releasable carrier that includes a supporting carrier, a carrier conductive layer, and a releasable tape located between the supporting carrier and the carrier conductive layer. The releasable tape attaches the supporting carrier to the carrier conductive layer. The releasable tape is configured to release the supporting carrier from the carrier conductive layer after being exposed to an activating source. The releasable carrier further includes a thin conductive layer attached to the carrier conductive layer, the thin conductive layer creating a surface configured to receive a conductive circuit. Further disclosed is a method for fabricating the releasable carrier and a method for making a semiconductor device using the releasable carrier.

Abstract: A method of making a laminated shingle is provided. The method includes coating a shingle mat with roofing asphalt to make an asphalt-coated sheet, adhering a reinforcement member to a portion of the asphalt-coated sheet, covering the asphalt-coated sheet, and optionally covering the reinforcement member, with granules to make a granule-covered sheet, dividing the granule-covered sheet into an overlay sheet and an underlay sheet, wherein the overlay sheet has a tab portion normally exposed on a roof and a headlap portion normally covered-up on a roof, the headlap portion having a lower zone adjacent the tab portion and an upper zone adjacent the lower zone, and wherein the reinforcement member is adhered to the lower zone of the headlap portion and laminating the overlay sheet and the underlay sheet to make the laminated shingle.

Abstract: A chip electronic component includes a magnetic body including an insulating substrate, and an internal coil part formed on at least one surface of the insulating substrate. The internal coil part includes first coil patterns formed on the insulating substrate, second coil patterns disposed on the first coil patterns, and third coil patterns disposed on the second coil patterns, and interface parts distinguished from the first to third coil patterns are disposed on at least one of interfaces between the first and second coil patterns and interfaces between the second and third coil patterns.

Abstract: A peeling apparatus peels a protective member off a wafer, the protective member including a resin and a film which is fixed to one surface of the wafer with the resin interposed therebetween. The film has a protrusive marginal side extending radially outwardly beyond an outer circumferential edge of the wafer. A holding unit holds another surface of the wafer with the protective member disposed therebelow. A gripping unit grips the protrusive marginal side of the protective member. A peeling mechanism peels the protective member off the wafer by relatively moving the gripping unit and the holding unit radially inwardly from the outer circumferential edge of the wafer toward the center of the wafer. A camera then captures an image of the wafer, and a decision unit determines whether residue of the resin remains on the wafer from the image captured by the camera.

Abstract: A labeling device, comprising a scale control assembly (11) and a stripping assembly (12), the scale control assembly (11) being configured to obtain a material strip (10) and to lead out a predetermined length of the material strip (10); the stripping assembly (12) being configured to grasp a target label (101) on the material strip (10) led out by the scale control assembly (11) and to affix the target label (101) to a product (D) to be labeled at a pre-set position so as to obtain a labeled product. Said device controls, by means of the scale control assembly, the length of the material strip that is led out at each time when labeling the product to be labeled, so as to improve the precision of the stripping assembly grasping the label and affixing the label to the product to be labeled.

Abstract: A rollable display apparatus includes a rolling drum; and a flexible display panel comprising an end bonded to the rolling drum, the flexible display panel being windable around an outer circumferential surface of the rolling drum, the flexible display panel including a flexible substrate including a first surface on which a display device is arranged; and a first protection film over the first surface of the flexible substrate, the first protection film including a first layer including an elastic polymer, and a second layer on the first layer and having a smaller surface frictional force than the first layer, and the second layer includes a plurality of first grooves each indented in a depth direction of the second layer from a surface of the second layer.

Abstract: A product, system, and method for creating a film capable of allowing a user to create a custom graphical representation is described, which may allow a user to create a custom graphical representation in a film by depressing select areas of the film to form the custom graphical representation.

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

Abstract: The present disclosure is intended to reduce the resistance of a high-loading electrode, to improve the impregnation ability of an electrolyte and thus to improve the rate characteristics of a battery.

Abstract: An object of the present invention is to provide a multilayered printed wiring board provided with split through holes excellent in through-hole formability and co-planarity in inner layer wirings around through holes for providing of a conduction isolation portion. To achieve the object, “a copper clad laminate provided with a protective layer for manufacturing of a printed wiring board having a conduction isolation portion electrically isolating a through hole, the copper clad laminate is characterized in that the copper clad laminate is provided with a protective layer on the surface that can be released after forming of the through holes for providing of a conduction isolation portion and filling of the through holes for providing of a conduction isolation portion by a plating resist” is employed.

Abstract: A novel endoscope, which can be a spectrally encoded endoscope (SEE) probe having forward-view, side-view, or a combination of forward and side views is provided herein. The SEE probe includes a light guiding component, a light focusing component, and a grating component. The probe is configured to forward a light such as a spectrally dispersed light from the grating component to a sample with no intermediate reflections between light guiding component and the grating component. A triangular grating, such as a staircase grating or an overhang grating may be used as the grating component.

Abstract: A device for dismantling a liquid crystal display includes a carrier platform, a dismantling bracket, a dividing piece and a driving component; the carrier platform includes a carrying surface for supporting the liquid crystal display to be dismantled thereon, and the liquid crystal display to be dismantled includes a display panel and a backlight unit bonded to each other; the dividing piece is located above the carrier platform and mounted onto the dismantling bracket; the dividing piece is capable of being driven by the driving component so as to move in a first direction and into a slit between the display panel and the backlight unit; and the first direction intersects with an extending direction of the dividing piece. The dismantling device for liquid crystal display can solve the problem that the display panel and the backlight unit are difficult to be dismantled.

Abstract: Disclosed is a terminal device. The terminal device includes a haptic unit for providing a haptic effect by changing at least one of frequency, strength, wavelength, and rhythm, an input unit for receiving information corresponding to an emotional state, and a controller for controlling the haptic unit so that a haptic effect of the emotional state corresponding to the received information is provided to a user.