Abstract: According to one embodiment of the present invention, an azo polymer forms a complex with a lithium ion and a sodium ion among alkali metal ions, but does not form a complex with a potassium ion. Therefore, the azo polymer is expected to be utilized as a material for a sensor capable of selectively detecting a specific alkali metal ion, or as a novel material capable of selectively trapping a specific alkali metal ion from a solution in which metal ions are mixed.

Abstract: A manufacturing apparatus includes a first supporting section to support a first tape section. The first tape section has a first surface facing away from the first supporting section. For example, a semiconductor chip can be disposed on the first surface. A second supporting section of the apparatus supports a second tape section in a facing arrangement with the first tape section. The second tape section has a second surface facing away from the second supporting section. For example, a semiconductor chip can be transferred from the first surface to the second surface in a manufacturing process. A ring element is between the first and second tape sections and surrounds a space between the first and second tape sections. The ring element has a port allowing fluid communication between the space and an outlet port.

Abstract: Certain example embodiments relate to methods for low temperature direct graphene growth on glass, and/or associated articles/devices. In certain example embodiments, a glass substrate has a layer including Ni formed thereon. The layer including Ni has a stress pre-engineered through the implantation of He therein. It also may be preconditioned via annealing and/or the like. A remote plasma-assisted chemical vapor deposition technique is used to form graphene both above and below the Ni-inclusive film. The Ni-inclusive film and the top graphene may be removed via tape and/or the like, leaving graphene on the substrate. Optionally, a silicon-inclusive layer may be formed between the Ni-inclusive layer and the substrate. Products including such articles, and/or methods of making the same, also are contemplated.

Abstract: A customizable garment patch having a least a first layer, the first layer being a printed graphical layer, a second layer attached to the first layer being a fabric substrate layer, the first layer attached to the second layer by sublimation printing, an adhesive applied to the second layer, the adhesive capable of connecting the garment patch to a surface and the adhesive being a water soluble glue.

Abstract: The invention relates to an adhesive composition comprising at least one natural latex and at least one polymeric composition having a glass transition temperature ranging from ?50° C. to 0° C. The invention also relates to a membrane obtained after drying the adhesive composition according to the invention, to a combination of a flexible surface coating with an adhesive composition according to the invention, to a method for applying a flexible surface coating onto a substrate as well as a substrate coated with a peelable adhesive membrane according to the invention.

Abstract: The purpose of the present invention is to provide a method for manufacturing a three-dimensional structure, a method for manufacturing a scintillator panel, a three-dimensional structure, and a scintillator panel that enable the type and thickness of a substrate of the scintillator panel to be selected freely. The present invention provides a method for manufacturing a three-dimensional structure, by which a three-dimensional structure is obtained by forming a glass pattern on a base member and then separating the glass pattern from the base member.

Abstract: A process is disclosed for using two polymeric bonding material layers to bond a device wafer and carrier wafer in a way that allows debonding to occur between the two layers under low-force conditions at room temperature. Optionally, a third layer is included at the interface between the two layers of polymeric bonding material to facilitate the debonding at this interface. This process can potentially improve bond line stability during backside processing of temporarily bonded wafers, simplify the preparation of bonded wafers by eliminating the need for specialized release layers, and reduce wafer cleaning time and chemical consumption after debonding.

Abstract: The system includes support sections and locking clips. Each support section has an L-shaped base portion, a back portion, and a flange for insertion into a slot in a track around the pool. so that when the track flange is inserted in the slot, part of the base portion extends down near the pool wall, part of the base portion extends away from the pool wall to a distal end, the back portion being attached to the distal end, the back portion extends above the track, and the locking hole is proximate to the slot. Each locking clip has a protrusion sized and configured to extend through the locking hole in the support section and into the slot in the track so that the clip abuts and supports the support section and is locked into place by a friction fit between the protrusion and the track.

Abstract: There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond.

Abstract: A system and method for creating three-dimensional nanostructures is disclosed. The system includes a substrate bonded to a carrier using a bonding agent. The bonding agent may be vaporizable or sublimable. The carrier may be a glass or glass-like substance. In some embodiments, the carrier may be permeable having one or a plurality of pores through which the bonding agent may escape when converted to a gaseous state with heat, pressure, light or other methods. A substrate is bonded to the carrier using the bonding agent. The substrate is then processed to form a membrane. This processing may include grinding, polishing, etching, patterning, or other steps. The processed membrane is then aligned and affixed to a receiving substrate, or a previously deposited membrane. Once properly attached, the bonding agent is then heated, depressurized or otherwise caused to sublimate or vaporize, thereby releasing the processed membrane from the carrier.

Abstract: A label assembly and method of using the same to label articles durably, yet removably. In one embodiment, the method includes providing an image removing laminate. The image removing laminate includes (i) a remover support, and (ii) a remover layer secured to the remover support, the remover layer, upon being activated by at least one of heat and light, being bondable to an ink image on a garment in such a way that the bonding between the remover layer and the ink image is stronger than the bonding between the ink image and the garment. The method then includes bonding the remover layer of the image removing laminate to the ink image on the garment and, then, detaching the ink image from the garment by separating the image removing laminate away from the garment.

Abstract: A motor includes a motor housing, a motor body, and a damping member. The motor body includes a drive shaft. The motor body is housed in the motor housing. The damping member is disposed on an outer surface of the motor housing. The damping member includes a damping layer and a constraining layer. The damping layer is made of an organic polymeric material, and bonded to the outer surface of the motor housing. The constraining layer is made of at least one of a resin mixed with an inorganic compound and an elastomer mixed with an inorganic compound. The constraining layer is disposed on the damping layer.

Abstract: Microelectronic packages and methods for fabricating microelectronic packages having optical mask layers are provided. In one embodiment, the method includes building redistribution layers over the frontside of a semiconductor die. The redistribution layers includes a body of dielectric material in which a plurality of interconnect lines are formed. An optical mask layer is formed over the frontside of the semiconductor die and at least a portion of the redistribution layers. The optical mask layer has an opacity greater than the opacity of the body of dielectric material and blocks or obscures visual observation of an interior portion of the microelectronic package through the redistribution layers.

Abstract: Disclosed is a photocurable elastomer composition that exhibits, when cured, excellent flexibility and barrier properties and has low compression set. The photocurable elastomer composition may comprise components (A) to (D) such that the mass ratio of the component (A) to the component (B) ((A):(B)) is from 25:75 to 75:25, and that the content of the component (C) is 50 mass % or less based on the total content of the components (A), (B), and (C).

Abstract: An assembly that is removably mountable to a wall, the assembly including a base plate and a mounting plate that is asymmetrically deflectably coupled to the base plate.

Abstract: A lining material and method that prevent peeling at overlapping both circumferential ends (overlapping portion) of a lining material installed in a conduit. A lining material is inverted to be inside out to line a conduit. The lining material includes: an impermeable layer; a lining material main body provided inside the impermeable layer, the lining material main body made into a tubular form by rolling a base material sheet, with its both circumferential ends overlapping each other; and a tubular member provided inside the lining material main body.

Abstract: A method for manufacturing the display device (70, 80) comprises: providing a first flexible substrate (101) comprising a first and second surfaces and a second flexible substrate (102) comprising a third and fourth surfaces; joining the second surface of the first flexible substrate with the third surface of the second flexible substrate by a connecting element (11) to form a laminated structure, wherein the first surface of the first flexible substrate (101) is a first outer surface of the laminated structure, and the fourth surface of the second flexible substrate (102) is a second outer surface of the laminated structure; forming a first flexible display element layer (10a) and a second flexible display element layer (10b) respectively on the first and second outer surfaces of the laminated structure; separating the first flexible substrate (101) from the second flexible substrate (102) of the laminated structure.

Abstract: A method of laying up a segment on a layup surface using a layup head that is mobile with respect to the layup surface, the layup head supporting a spool of a tape of material which includes at least one layer to be laid up from which said segment is cut and at least one interliner, the method including applying the tape of material against the layup surface and removing the interliner using a separator. The tape of material is pressed firmly by a press roller against the layup surface before the interliner is removed as the layup head moves in an advancing movement. A layup head for implementing the method and a layup machine including the layup head are also described.

Abstract: A manufacturing method of a flexible device comprises: an adjustment step of adjusting adhesive characteristics of an adhesive layer formed over a supporting substrate; a temporary bonding step of temporarily bonding the flexible substrate; an electronic device formation step of forming an electronic device; and a separation step of separating the flexible substrate. In the adjustment step, the adhesive characteristics of the adhesive layer are adjusted to satisfy a relationship of PB<PA, where PA denotes a peel strength of the adhesive layer after the electronic device formation step, in a case where the adhesive layer undergoes the electronic device formation step without undergoing the adjustment step, and PB denotes a peel strength of the adhesive layer after the electronic device formation step, in a case where the adhesive layer undergoes the electronic device formation step after undergoing the adjustment step.

Abstract: A carrier sheet (1) for a plurality of information carriers (2). The carriers can be secured to the upper side of the carrier sheet (1) and can be marked using a marking device. The carrier sheet (1) allows simple and fast marking of information carriers (2) followed by simple handling of the information carriers (2) and carrier sheet (1) by virtue of the fact that, on the upper side of the carrier sheet (1), a plurality of fields (3) is arranged, each of which can be used to position an information carrier (2) on the upper side of the carrier sheet (1), these fields (3) being able to be separated from the rest of the carrier sheet (1).

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl?200 ?m, as well as a line-to-line spacing width Ws?200 ?m. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.

Abstract: The present invention relates to a peeling bar, apparatus, and method for peeling a polarizing film from a panel. This invention can minimize friction between the peeling bar and the polarizing film since the peeled polarizing film is in contact with a front part of the peeling bar. Also, in order to equalize tension applied to the polarizing film in a peeling process, this invention makes both ends of the polarizing film closely adhere to the peeling bar. According to this invention, fracture of the polarizing film is prevented, and thereby the polarizing film can be stably peeled from the panel without fracture.

Abstract: A composite component includes a plurality of layers. A fracture region includes at least one fracture inducing layer in an overlapping relationship with at least one of the plurality of layers.

Abstract: A method for producing a roadway structure includes: applying pellets of an adhesive composition to a non-tacky surface of a substrate having a support structure, wherein the adhesive composition has at least one solid epoxy resin and at least one thermoplastic polymer that is solid at room temperature; and applying a bitumen-based bearing course. The method permits rapid and efficient production of a roadway structure with good adhesion between the substrate and the asphalt and is suitable in particular for the restoration of asphalt coverings, which must be carried out under time pressure. The application of primer courses is not required.

Abstract: Provided is a foil removal device and a method for removing a foil from a tire tread in a removal direction, wherein the foil removal device includes a foil collection unit with a winding element, a winding drive for receiving the foil at or near one of the ends of the foil, a gripper for engaging the foil prior to the removal of the foil and a gripper drive for moving the gripper from the gripping position towards the foil collection unit to partially remove the foil from the tire tread. The gripper is arranged for releasing the foil when the foil collection unit has received the foil. The winding drive is arranged for driving the winding element to engage and subsequently remove the foil. The removal device includes a displacement drive for moving the foil collection unit simultaneously with the winding drive driving the winding element.

Abstract: A motor driving device including a printed board on which an insulating component is mounted. The insulating component integrally includes a plate-shaped insulation part formed by a heat resistant resin having an electrical insulation property, and a plate-shaped adhesive part provided at an end portion of the insulation part and formed by a thermoplastic resin having an electrical insulation property, and the insulating component is adhered to a surface of the printed board by thermal welding by heating and melting the adhesive part.

Abstract: The invention provides a cloth taking-up device including: a platform, on which glue/cloth to be taken-up are disposed; and a clamp part movable with respect to the platform, which can clamp a roller and roll the glue/cloth to be taken-up successively onto the roller. An outside surface of the platform has an included angle of 0°-180° with respect to the horizontal plane, on which the glue/cloth to be taken-up are disposed, and the clamp part can keep the roller in parallel with the outside surface. The cloth taking-up device can avoid uneven pressure applied to the glue/cloth to be taken-up in the down-press manner, improving uniformity of taken-up glue/cloth. Meanwhile, the foreign matters on the glue/cloth to be taken-up can easily fall off, and the foreign matters on the rollers cannot drop onto the glue/cloth to be taken-up with the rotation, thereby ensuring glue/cloth taking-up quality.

Abstract: A conductor on glass security layer may be located within a printed circuit board (PCB) of a crypto adapter card or within a daughter card upon the crypto adapter card. The conductor on glass security layer includes a glass dielectric layer that remains intact in the absence of point force loading and shatters when a point load punctures or otherwise contacts the glass dielectric layer. The conductor on glass security layer also includes a conductive security trace upon the glass dielectric layer. A physical access attempt shatters a majority of the glass dielectric layer, which in turn fractures the security trace. A monitoring circuit that monitors the resistance of the conductive security trace detects the resultant open circuit or change in security trace resistance and initiates a tamper signal that which may be received by one or more computer system devices to respond to the unauthorized attempt of physical access.

Abstract: A method for fabricating a flexible display device is provided. The method comprises: attaching a first flexible substrate of the flexible display device onto a conductive adhesive layer, wherein the conductive adhesive layer is disposed on a conductive rigid substrate; fabricating other parts of the flexible display device on the first flexible substrate; aging the conductive adhesive layer; peeling off the flexible substrate from the conductive rigid substrate so as to obtain the flexible display device.

Abstract: A transferring assembly for transferring onto an object a RFID identification device consisting of a microchip connected to an antenna made of electrically conductive material, wherein a film of adhesive material is applied to a supporting element, the microchip is applied on the film of adhesive material in a zone of the supporting element, the antenna is formed by applying the wire made of electrically conductive material to the film of adhesive material and electrically connecting the antenna to the microchip, and the zone is pressed against a surface of the object, with the RFID identification device facing the surface, the adhesive material, and/or the supporting element, being chosen so that the adhesive material has an adhesiveness on the surface of the object that is significantly greater than the adhesiveness of the film on the supporting element.

Abstract: An assembly can include a first microelectronic package and a circuit structure comprising a plurality of dielectric layers and electrically conductive features thereon. The first package can include a substrate having a plurality of first contacts at a first or second surface thereof and a plurality of second contacts at the first surface thereof, and a first microelectronic element having a plurality of element contacts at a front surface thereof. The first contacts can be electrically coupled with the element contacts of the first microelectronic element. The electrically conductive features of the first circuit structure can include a plurality of bumps at the first surface of the circuit structure facing the second contacts of the substrate and joined thereto, a plurality of circuit structure contacts at a second surface of the circuit structure, and a plurality of traces coupling at least some of the bumps with the circuit structure contacts.

Abstract: A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.

Abstract: A method of manufacturing a cavity substrate of the present invention includes respectively laminating second and third substrates on upper and lower surfaces of a first substrate having an opening and having an external dimension larger than an external dimension of each of the second and third substrates to ensure that an end portion of the first substrate protrudes a first length from the second and third substrates, and cutting the end portion of the first substrate protruding from each of the second and third substrates to a second length smaller than the first length.

Abstract: A lead frame having a plurality of concentric lead frame rings configured to receive and support a variety of integrated circuit die having a variety of sizes. The rings are separated from each other by gaps and coupled together by a plurality of tie bars. The concentric rings may be circular or rectangular. The tie bars may extend diagonally from the rings or perpendicularly to the rings.

Abstract: The present invention is intended to provide an adhesive composition for temporarily fixing which exhibits high adhesive strength and peeling property in water, and which is applicable to members having opaque area, and still which leaves no adhesive deposit on released members, so that it realize the excellent workability and environment. The present invention is a two-component composition for temporarily fixing members, comprising (A) a polyfunctional (meth)acrylate, (B) a mono-functional (meth)acrylate, (C) an organic peroxide, (D) a decomposition accelerator, (E) a polymerization initiator and (G) particulate matter, and composed of two-component system of a first agent and a second agent, said first agent containing at least said component (C) and said second agent containing at least said component (D), wherein cured body of said composition being used to bond members is brought into contact with water to be decomposed and release said members.

Abstract: An electronic circuit assembly comprises a substrate and circuit components attached to the substrate by means of an electrically conductive adhesive, wherein the adhesive is releasable under predetermined release conditions, whereby to enable the circuit components to be removed from the substrate for recovery or re-use.

Abstract: Portions of microwave energy interactive material may be cut and removed during intermediate steps in a lamination processes, so that remaining microwave energy interactive material in a resultant laminate is arranged in a pattern. Regarding the removal of the portions of the microwave energy interactive material, a compound laminate may be delaminated into parts, and one of the parts may be a sacrificial laminate that includes the removed portions of the microwave energy interactive material.

Abstract: A film growing method includes: (A) attaching wall members to ends of a film grown surface of a base material; (B) growing a film on the film grown surface by a cold spray method; and (C) removing the wall members after a thickness of the grown film on the film grown surface becomes equal to a desired film thickness. It can be prevented that the side ends of the grown film are formed in a slope when a thick film is to be grown by using the cold spray.

Abstract: An apparatus for laying fiber tapes includes a deflection guide for the fiber tapes consisting of pressure plates which are arranged adjacent to one another transversely to the deflection axis and a frame which is displaceable in the laying direction for accommodating the pressure plates. At least a part of the pressure plates respectively form a sliding shoe which is resilient in the pressing direction for the deflection of the tape.

Abstract: A semiconductor package may include a lower substrate with one or more electronic components attached to a surface thereof and an upper substrate with one or more cavities wherein the upper substrate is attached to the lower substrate at a plurality of connection points with the one or more electronic components fitting within a single cavity or a separate cavity for each component that allow the overall form factor of the semiconductor package to remain smaller. The plurality of connection points provide a mechanical and electrical connection between the upper and lower substrate and may include solder joints there between as well as conductive filler particles that create an adhesive reinforcement matrix when compressed for assembly.

Abstract: Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.

Abstract: Provided is a peeling apparatus configured to suppress damage to a substrate, by forming a peeling start point. The peeling apparatus separates a superimposed substrate made by joining first and second substrates into the first and second substrates, and includes a blade configured to form a notch as a peeling start point between the first and second substrates, and an inspection unit configured to inspect a state of a cutting edge of the blade. The inspection unit includes an imaging unit configured to image the cutting edge of the blade, and an image processing unit configured to process an image of the imaging unit.

Abstract: The invention relates to a module package which comprises a module substrate 1, a chip 2, 3 applied using the flip chip process, and an encapsulation layer 8, and to a method for producing same. The chip 2, 3 has component structures on the top side 13, 14 thereof. Said top said 13, 14 faces the module carrier 1, wherein a gap 4, 5 is formed between the top side 13, 14 of the chip and the module carrier 1. A filler is added to the encapsulation layer 8. The encapsulation layer 8 partly fills underneath the chip 2, 3, wherein at most the part of the chip 2, 3, on which no component structures are present, is underfilled, and at a minimum the material of the encapsulation layer 8 completely encloses the sides of the chip 2, 3.

Abstract: According to an exemplary embodiment of the disclosure, a method of removing a waste part of a substrate is provided. The method includes: using a laser to partially drill the substrate to define the waste part; and applying megasonic vibration to the substrate to remove the waste part from the substrate.

Abstract: A filter component for motor vehicle air conditioning including a filtration part made of a material able to filter air and a noise reduction part made of a material able to reduce noise. Also disclosed is a filtration assembly which includes the filter component, and a motor vehicle air conditioning device including the filtration assembly.

Abstract: A SATA cable capable of grounding noise, includes a cable body; a lead group embedded in the cable body, having two ends exposed from two ends of the cable body, respectively, and comprising a signal transmitting lead group, a signal receiving lead group, power leads and ground leads, the signal transmitting lead group further comprising a first signal transmitting lead and a second signal transmitting lead, and the signal receiving lead group further comprising a first signal receiving lead and a second signal receiving lead; a first metal shield layer unit disposed on a surface of the cable body; a second metal shield layer unit disposed on another surface of the cable body; and a noise lead embedded in the cable body, electrically connected to ground leads, and having two ends exposed from the cable body to thereby electrically connect with the first metal shield layer unit.

Abstract: A multi-layer resin substrate is a multi-layer resin substrate integrated by stacking and thermocompression bonding a plurality of resin layers each composed of a thermoplastic resin as a main material and having a main surface. The plurality of resin layers include a resin layer having a pattern member arranged on the main surface. A surface of at least some resin layers of the plurality of resin layers has a paint layer, which is obtained by applying a thermoplastic resin paint to a region corresponding to a region insufficient in thickness as a stack as a whole during a process for stacking and thermocompression bonding the plurality of resin layers. The pattern member is provided, for example, by a conductor pattern.

Abstract: A cut-out laminated sheet can be prepared by laminating a protection sheet on a base sheet, followed by a simple two-step shearing process. The cut-out laminated sheet thus prepared features a protruding section that helps improving productivity by making the removal of the protection sheet easy; and thus, can be effectively used in a wide range of industrial applications such as a brittle sheet and a flexible sheet.

Abstract: A substantially rigid batten is attached to an external face of a vacuum bag to reduce wrinkling of the bag during vacuum bag compaction of a composite laminate layup.

Abstract: The invention is directed to a temporary adhesive containing (A) a polymer compound having a radical polymerizable group in its side chain, (B) a radical polymerizable monomer, and (C) a heat radical polymerization initiator, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.