With Stripping Of Adhered Lamina Patents (Class 156/247)
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Patent number: 8758635Abstract: The present disclosure relates to a method for making a thermoacoustic element. In the method, a graphene film is arranged on a metal substrate. A nonmetal substrate is stacked with the graphene film located on the metal substrate to form a laminate structure. The graphene film is sandwiched between the nonmetal substrate and the metal substrate. The metal substrate is removed from the stacked structure. A number of through-holes are formed in the nonmetal substrate. The graphene film is exposed through the plurality of through-holes.Type: GrantFiled: November 23, 2011Date of Patent: June 24, 2014Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: Kai-Li Jiang, Xiao-Yang Lin, Lin Xiao, Shou-Shan Fan
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Patent number: 8758554Abstract: A silicone tape having inherent elasticity and flexibility to allow for its significant stretching, which when unrolled from its tape roll, and its laminar film removed, can be stretched around the furniture or other componentry to hold it in position until any applied adhesive hardens, during furniture repair or manufacture.Type: GrantFiled: June 8, 2012Date of Patent: June 24, 2014Assignee: MOCAP L.L.C.Inventor: Joseph T. Miller
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Publication number: 20140168816Abstract: Various methods for attaching a crystalline write pole onto an amorphous substrate and the resulting structures are described in detail herein. Further, the resulting structure may have a magnetic moment exceeding 2.4 Tesla. Still further, methods for depositing an epitaxial crystalline write pole on a crystalline seed or template material to ensure that the phase of the write pole is consistent with the high moment phase of the template material are also described in detail herein.Type: ApplicationFiled: December 18, 2012Publication date: June 19, 2014Applicant: SEAGATE TECHNOLOGY LLCInventors: Mark Anthony Gubbins, Marcus Benedict Mooney
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Publication number: 20140166186Abstract: A glass film laminate includes a glass film and a supporting glass. The glass film and the supporting glass have surfaces in contact with each other, and each of the surfaces has a surface roughness Ra of 2.0 nm or less.Type: ApplicationFiled: February 20, 2014Publication date: June 19, 2014Applicant: Nippon Electric Glass Co., Ltd.Inventors: Tatsuya TAKAYA, Masahiro TOMAMOTO, Hiroshi TAKIMOTO, Hirokazu OKAMOTO
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Publication number: 20140163382Abstract: An ultrasound transducer cover (100) includes a base (202), including an acoustically transmissive membrane (110) with first and second opposing sides. The cover further includes walls (204, 206) protruding from the base in a same direction away from the first side of the base, forming a cavity about the acoustically transmissive membrane with a geometry that conforms to a geometry of a probe head of an ultrasound apparatus housing a transducer array and a corresponding acoustic window. The cover further includes an acoustically transmissive adhesive (108) disposed on the membrane in the cavity, wherein the acoustically transmissive adhesive maintains the cover on the ultrasound apparatus in response to installing the cover on the ultrasound apparatus.Type: ApplicationFiled: July 22, 2011Publication date: June 12, 2014Applicant: SOUND TECHNOLOGY INC.Inventors: Alessandro Gubbini, Bradley Nelson
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Publication number: 20140158280Abstract: Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, the entire fixing agent spreading between the both translucent rigid substrates is cured every time the translucent rigid substrates are bonded.Type: ApplicationFiled: July 13, 2012Publication date: June 12, 2014Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventor: Hiroyuki Kurimura
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Patent number: 8746846Abstract: A nozzle plate includes: a nozzle plate main body made of metal, the nozzle plate main body having nozzle rows formed of nozzles arranged in parallel and penetrating the nozzle plate main body in a thickness direction, wherein at the outer edge of the nozzles on a droplet discharge surface of the nozzle plate main body, a water-repellent film is provided, and primer treatment is performed on at least part of the periphery of the droplet discharge surface of the nozzle plate main body, the periphery outside the water-repellent film.Type: GrantFiled: December 8, 2010Date of Patent: June 10, 2014Assignee: Seiko Epson CorporationInventor: Katsuji Arakawa
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Patent number: 8746490Abstract: A package film is provided for attaching to a base member to define a package. The package film construction includes a top layer having a top surface and a bottom surface. A removable adhesive is provided having a defined pattern applied below the bottom surface. A polyethylene (PE) emulsion layer is provide that covers at least a portion of the adhesive pattern, with the PE emulsion layer being heat sealable to the base member.Type: GrantFiled: November 6, 2012Date of Patent: June 10, 2014Assignee: Sonoco Development, Inc.Inventors: Scott William Huffer, Donovan Young
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Publication number: 20140154452Abstract: The present application discloses a method for fabricating a composite structure for use as a resilient cushion, including: (a) placing a sheet of first resilient material on a surface; (b) cutting the sheet of first resilient material by pressing a cutter on to the first resilient material to produce a cut sheet of first resilient material displaying a cutting pattern of discrete first resilient elements of defined widths and lengths, wherein at least one of the first resilient elements touches adjacent resilient elements along its side; and (c) mounting a first expanse of material on at least one of the first resilient elements of the cut sheet of first resilient material to form a first composite structure.Type: ApplicationFiled: May 23, 2013Publication date: June 5, 2014Applicant: Applied FT Composite Solutions Inc.Inventor: Daniel Kim
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Publication number: 20140151328Abstract: A release layer is adequately protected by a protective layer when a laminate is subjected to a desired treatment. A method for forming a laminate 10 includes a protective layer forming step of forming a protective layer 15 for covering a face that is a surface of a release layer 14 and which is not adhered to a support plate 12 and not superimposed at least on an adhesive layer 13; and a protective layer removal step of removing a portion of the protective layer 15, which is exposed at the time of forming the laminate 10.Type: ApplicationFiled: November 5, 2013Publication date: June 5, 2014Applicant: Tokyo Ohka Kogyo Co., Ltd.Inventors: Atsushi Miyanari, Akihiko Nakamura
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Publication number: 20140150961Abstract: Provided is a method for manufacturing a solid battery by which a high-power solid battery can be manufactured. The present invention is a method for manufacturing a solid battery having a pair of electrode layers, and a solid electrolyte layer disposed between the pair of electrode layers, the method including a preparing step to prepare a foil-electrolyte laminated body having a foil and a solid electrolyte layer which contains a binder and is disposed on at least one face of the foil, an electrode layer forming step to form an electrode layer by laminating an electrode material on a surface of the solid electrolyte layer of the foil-electrolyte laminated body prepared by the preparing step and pressing them, and a foil removing step to remove the foil after the electrode layer forming step.Type: ApplicationFiled: July 27, 2011Publication date: June 5, 2014Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Shigenori Hama, Shiyo Tadokoro, Koji Kawamoto
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Publication number: 20140153160Abstract: A method includes providing a touch panel interposer, where providing the touch panel interposer comprises providing a touch panel device, applying a first adhesive layer to a cover side of the touch panel device, and applying a second adhesive layer to a display side of the touch panel device. The method further includes providing a touch panel display, where providing the touch panel display comprises applying a cover to the first adhesive layer, and applying a display panel to the second adhesive layer.Type: ApplicationFiled: November 30, 2012Publication date: June 5, 2014Applicant: DELL PRODUCTS, LPInventor: Stefan Peana
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Patent number: 8741089Abstract: A method for fabricating a display device 1 includes a first step of attaching a display panel and a first substrate member to each other with a first adhesive sandwiched between the display panel and the first substrate member, and a second step of attaching a second substrate member to the first substrate member on a surface of the first substrate member opposite to the display panel with a second adhesive sandwiched between the first and second substrate members, where the second step is carried out subsequently to the first step. The second adhesive used in the second step has a glass transition point higher than a glass transition point of the first adhesive.Type: GrantFiled: May 13, 2011Date of Patent: June 3, 2014Assignee: Sharp Kabushiki KaishaInventors: Kenichiro Tsuchida, Tomoo Takatani, Hiroshi Fukushima
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Publication number: 20140146490Abstract: A laminated structure includes a first substrate, an adhesive, a graphene, and a second substrate. The adhesive is provided on a principal surface of the first substrate, and the adhesive has a storage elastic modulus of 7.2*104 Pa or more and 6.1*105 Pa or less at 23° C. The graphene is bonded to the adhesive, and the graphene has one or a plurality of layers. The second substrate is bonded to the graphene.Type: ApplicationFiled: November 18, 2013Publication date: May 29, 2014Applicant: Sony CorporationInventors: Masashi Bando, Keisuke Shimizu, Koji Kadono, Nozomi Kimura, Toshiyuki Kobayashi
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Publication number: 20140146491Abstract: A flexible display apparatus including a flexible display panel, at least one flexible circuit board, at least one driving chip, and a sealing layer is provided. The flexible display panel has a display area and a bonding area located outside the display area. The flexible circuit board is disposed in the bonding area of the flexible display panel. The driving chip is disposed on the flexible circuit board. The sealing layer encapsulates a periphery of the flexible display panel and extendedly covers the bonding area and a portion of the flexible circuit board.Type: ApplicationFiled: July 25, 2013Publication date: May 29, 2014Applicant: E Ink Holdings Inc.Inventors: Lih-Hsiung Chan, Chu-Kuang Tseng
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Publication number: 20140144581Abstract: A method for manufacturing magnet-conductive device includes a filling step and an adhering step. The filling step includes providing a glue by a glue dispenser and contacting the glue with a first magnet-conductive plate to make the glue adhered to a lower surface of the first magnet-conductive plate. The adhering step includes making the lower surface of the first magnet-conductive plate face toward a second magnet-conductive plate, making the first magnet-conductive plate and the second magnet-conductive plate stackable from each other and adhering the first magnet-conductive plate and the second magnet-conductive plate via the glue. Eventually, by repeatedly performing the filling step and the adhering step, the desirable stacking quantity is achieved to form a magnet-conductive device.Type: ApplicationFiled: October 16, 2013Publication date: May 29, 2014Applicant: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTREInventors: Kuo-Yin Tu, Hsing-Chih Tsai, Hsin-Te Wang, Pin-Jyun Chen, Chih-Hao Lin, Po-Fu Hsu, Ching-Hua Hsieh
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Patent number: 8732923Abstract: A method for manufacturing an acoustic wave device includes: adhering wafer-shaped first and second piezoelectric substrates to a front face of a first and second adhesive sheet respectively and dividing the first and the second piezoelectric substrates into rectangles; adhering a third and fourth adhesive sheet to the first and second piezoelectric substrates respectively and moving at least one divided portions of the first and second piezoelectric substrates selectively to the third and fourth adhesive sheet respectively; moving the first piezoelectric substrate on the first adhesive sheet to the fourth adhesive sheet; and moving the second piezoelectric substrate on the second adhesive sheet to the third adhesive sheet.Type: GrantFiled: May 24, 2012Date of Patent: May 27, 2014Assignee: Taiyo Yuden Co., Ltd.Inventors: Kazunori Inoue, Tsutomu Miyashita, Kazuhiro Matsumoto
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Publication number: 20140139920Abstract: A polarizer includes a substrate, a carbon nanotube film, and a number of metal particles. The carbon nanotube film is located over the substrate and includes a number of carbon nanotube yarns, each of which comprises a number of substantially parallelly bundled carbon nanotubes. The metal particles are adhered to the carbon nanotubes of the carbon nanotube film.Type: ApplicationFiled: January 24, 2014Publication date: May 22, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: SEI-PING LOUH
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Publication number: 20140141234Abstract: A joining surface formed of a composite structure having at least one ply and a peel ply cured to an outer surface of the composite structure, the peel ply including a plurality of microcapsules each filled with a joining material, wherein upon removal of the peel ply from the outer surface of the composite structure, the microcapsules fracture and release the resin to form an uncured surface for joining.Type: ApplicationFiled: November 16, 2012Publication date: May 22, 2014Applicant: THE BOEING COMPANYInventor: THE BOEING COMPANY
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Publication number: 20140139919Abstract: A method of manufacturing a polarizing plate according to an embodiment of the present invention includes: stretching and dyeing a laminate having a resin substrate and a polyvinyl alcohol-based resin layer formed on at least one side of the resin substrate to produce a polarizing film on the resin substrate; laminating an optically functional film on the laminate on a polarizing film side to produce an optically functional film laminate; and peeling the resin substrate from the optically functional film laminate. The peeling is performed so that an angle ? formed between a surface of the optically functional film laminate immediately before the peeling and a peeling direction of the resin substrate is smaller than an angle ? formed between the surface of the optically functional film laminate immediately before the peeling and a peeling direction of the polarizing film.Type: ApplicationFiled: October 17, 2013Publication date: May 22, 2014Applicant: NITTO DENKO CORPORATIONInventors: Shusaku Goto, Yuuki Nakano, Kentaro Ikeshima, Nobuyuki Haida, Minoru Miyatake, Osamu Kaneko
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Patent number: 8729797Abstract: A manufacturing method of an OLED display is provided. The method includes: forming an organic emission layer and a thin film encapsulation layer covering the organic emission layer on a substrate including a pixel area and a peripheral area; adhering a laminating film including a plurality of adhesive layers and an upper protective layer that covers an upper adhesive layer from among the adhesive layers on the thin film encapsulation layer, a lower adhesive layer from among the adhesive layers contacting the thin film encapsulation layer; radiating UV light on the laminating film that corresponds to the peripheral area of the substrate to decrease adhesion between the lower adhesive layer and the thin film encapsulation layer corresponding to the peripheral area; and peeling the laminating film corresponding to the peripheral area from the thin film encapsulation layer to maintain the laminating film that corresponds to the pixel area.Type: GrantFiled: November 22, 2011Date of Patent: May 20, 2014Assignee: Samsung Display Co., Ltd.Inventors: So-Young Lee, Yoon-Hyeung Cho, Min-Ho Oh, Byoung-Duk Lee, Yong-Tak Kim, Sang-Hwan Cho, Yun-Ah Chung, Seung-Yong Song, Jong-Hyuk Lee
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Publication number: 20140130970Abstract: A method of manufacturing a miniaturization image capturing module includes adhesively placing a double side adhesive element onto a carrier board; adhesively placing an image capturing chip onto the double side adhesive element; adhesively placing a substrate unit onto the double side adhesive element, the substrate unit including a hollow substrate body adhered to the double side adhesive element and surrounding the image capturing chip; forming a fixing glue between the hollow substrate body and the image capturing chip to fix the position of the image capturing chip relative to the hollow substrate body; electrically connecting the image capturing chip to the substrate unit; positioning a lens unit on the top side of the hollow substrate body, the lens unit including a lens group disposed above the image capturing chip; and then removing the carrier board to expose the double side adhesive element.Type: ApplicationFiled: January 21, 2014Publication date: May 15, 2014Applicants: LITE-ON TECHNOLOGY CORPORATION, LITE-ON ELECTRONICS (GUANGZHOU) LIMITEDInventor: TI-LUN LIU
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Publication number: 20140130967Abstract: A fabric has an adhesive on one side that can be used to cover tags and seams in articles of clothing. Typically, people remove tags from clothing to prevent irritation from the tags. However, this can cause holes in the fabric and also can result in the user losing size and care information for the garment. The adhesive fabric can be used to cover the tags and seams that may be uncomfortable, providing a soft fabric material attaches to the article of clothing so as not to rub against and irritate the wearer. The adhesive fabric does not alter the condition of the apparel for further use, sale or consignment.Type: ApplicationFiled: November 11, 2012Publication date: May 15, 2014Inventor: Kelly Ann Oberholtzer
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Publication number: 20140130968Abstract: A method for fabricating a patterned retarder includes bonding first trans-missive substrate that has a patterned photomask layer to a front surface of second light-transmissive substrate, and forming a photo-orientable layer on a rear surface of the second light-transmissive substrate such that a distance between the photomask layer and the photo-orientable layer is relatively small. Linear polarized light is allowed to pass through light-transmissive regions in the photomask unit to irradiate first regions of the photo-orientable layer. Due to the small distance, the polarized light can be either collimated light or uncollimated light.Type: ApplicationFiled: November 11, 2013Publication date: May 15, 2014Applicant: FAR EASTERN NEW CENTURY CORPORATIONInventors: Wei-Che HUNG, Yu-June Wu, Da-Ren Chiou
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Publication number: 20140130962Abstract: A method includes receiving a carrier with a release layer formed thereon. A first adhesive layer is formed on a wafer. A second adhesive layer is formed over the first adhesive layer or over the release layer. The carrier and the wafer are bonded with the release layer, the first adhesive layer, and the second adhesive layer in between the carrier and the wafer.Type: ApplicationFiled: January 16, 2014Publication date: May 15, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chen-Hua YU, Kuo-Ching HSU, Chen-Shien CHEN, Ching-Wen HSIAO, Wen-Chih CHIOU, Shin-Puu JENG, Hung-Jung TU
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Publication number: 20140130969Abstract: New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.Type: ApplicationFiled: July 9, 2012Publication date: May 15, 2014Applicant: BREWER SCIENCE INC.Inventors: Jeremy McCutcheon, Tony D. Flaim, Susan Bailey
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Patent number: 8722279Abstract: Composition in the form of a solution and/or dispersion, comprising: at least one polyazole with an intrinsic viscosity, measured in at least 96% by weight sulfuric acid, in the range from 3.0 to 8.0 g/dl, and orthophosphoric acid (H3PO4) and/or polyphosphoric acid, wherein the polyazole content, based on the total weight of the composition, is in the range from 0.5% by weight to 30.0% by weight, the H3PO4 and/or polyphosphoric acid content, based on the total weight of the composition, is in the range from 30.0% by weight to 99.5% by weight, the H3PO4 and/or polyphosphoric acid concentration, calculated as P2O5 (by acidimetric means), based on the total amount of H3PO4 and/or polyphosphoric acid and/or water, is in the range from 70.5% to 75.45%. Additionally protected are particularly advantageous processes for preparation and for use of the inventive composition.Type: GrantFiled: June 17, 2010Date of Patent: May 13, 2014Assignee: BASF SEInventors: Jörg Belack, Klaus Leitner, Thomas Justus Schmidt, Gunter Christ, Bernd-Steffen von Bernstorff
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Publication number: 20140126166Abstract: Disclosed herein is a method of forming a solder resist (SR) post, including: (A) forming an SR layer on a printed circuit board; (B) disposing a patterning film on an upper surface on the SR layer; (C) forming a plurality of openings in the patterning film or the SR layer; (D) filling SR ink in the openings and performing an exposure process to form a plurality of SR posts; (E) delaminating the patterning film; (F) removing an uncured portion of the SR ink on which the exposure process is performed; and (G) drying the plurality of SR posts.Type: ApplicationFiled: December 28, 2012Publication date: May 8, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Su Il Kim, Soon Jin Cho
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Publication number: 20140124131Abstract: Various methods and systems are provided for fabrication of nanoporous membranes. In one embodiment, among others, a system includes electrode pairs including substantially parallel electrodes, a controllable power supply to control the electrical potential of each of the electrode pairs, and a syringe to eject an electrically charged solution from a needle to form a nanofiber. The orientation of the nanofiber in a nanofiber layer is determined by the electrical potentials of the electrode pairs. In another embodiment, a method includes providing a nanoporous membrane including nanofiber layers between a transferor and a mainmold of a stamp-through-mold (STM) where adjacent nanofiber layers are approximately aligned in different directions. A patterned membrane is sheared from the nanoporous membrane using the transferor and the mainmold of the STM and transferred to a substrate.Type: ApplicationFiled: May 10, 2012Publication date: May 8, 2014Inventors: Pitfee Jao, Yong-Kyu Yoon, Gloria Jung-a Kim
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Patent number: 8715443Abstract: A method of manufacturing a spectroscopic sensor 1 comprises a first step of forming a cavity layer 21 by nanoimprinting on a handle substrate; a second step of forming a first mirror layer 22 on the cavity layer 21 after the first step; a third step of joining a light-transmitting substrate 3 onto the first mirror layer 22 after the second step; a fourth step of removing the handle substrate from the cavity layer 21 after the third step; a fifth step of forming a second mirror layer 23 on the cavity layer 21 without the handle substrate after the fourth step; and a sixth step of joining the light detection substrate 4 onto the second mirror layer 23 after the fifth step.Type: GrantFiled: September 21, 2011Date of Patent: May 6, 2014Assignee: Hamamatsu Photonics K.K.Inventors: Katsumi Shibayama, Masaomi Takasaka
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Patent number: 8715454Abstract: A method for sealing electrodes on a semiconductor device using a sealing film which includes a resin layer having a flow within the range of 150 to 1800 ?m at 80° C., or having a resin layer with a viscosity within the range of 10,000 to 100,000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of ?50 to 50° C. and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 ?m, and (C) a colorant.Type: GrantFiled: September 14, 2012Date of Patent: May 6, 2014Assignee: Hitachi Chemical Company, Ltd.Inventors: Hiroyuki Kawakami, Katsuyasu Niijima, Naoki Tomori, Daichi Takemori, Takuya Imai
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Patent number: 8715433Abstract: A method for fabricating a liquid crystal display panel includes a step where, on a first mother substrate having an alignment film formed thereon, a first sealing member is provided to surround a display area and overlap the alignment film, and a second sealing member is provided such that the second sealing member extends along at least a side of the first sealing member and is spaced from the alignment film; and a step where the first mother substrate having the first and second sealing members provided thereon and a second mother substrate having an alignment film formed thereon are attached to each other such that the first and second sealing members are united each other with their side edges being in contact with each other.Type: GrantFiled: March 3, 2011Date of Patent: May 6, 2014Assignee: Sharp Kabushiki KaishaInventor: Masahito Zennyoji
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Patent number: 8715802Abstract: The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.Type: GrantFiled: June 19, 2009Date of Patent: May 6, 2014Assignee: Industrial Technology Research InstituteInventors: Pao-Ming Tsai, Liang-You Jiang, Yu-Yang Chang, Hung-Yuan Li
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Publication number: 20140116759Abstract: A method for manufacturing a printed wiring board includes fixing a lower metal foil on a support plate, forming a lower insulating layer on the lower metal foil, laminating a core metal layer on the lower insulating layer, patterning the core metal layer such that the core metal layer is formed into a core conductive layer, forming an upper insulating layer on the core conductive layer and lower insulating layer, laminating an upper metal foil on the upper insulating layer, removing the plate from the lower foil such that a core substrate including the lower metal foil, lower insulating layer, core conductive layer, upper insulating layer and upper metal foil is formed, and forming on the core substrate a buildup layer including an insulating layer and a conductive layer. The core metal layer has a thickness which is set to be greater than thicknesses of the lower and upper foils.Type: ApplicationFiled: October 28, 2013Publication date: May 1, 2014Applicant: IBIDEN CO., LTD.Inventor: Satoshi WATANABE
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Publication number: 20140120295Abstract: A multilayer structure sheet for manufacturing an optical information recording medium having a multilayer structure with a plurality of recording layers is disclosed. The multilayer structure sheet comprises at least one unit structure in which a pressure sensitive adhesive layer, a recording layer, a recording layer support layer having a glass transition temperature higher than that of the pressure sensitive adhesive layer, and a recording layer are laid one on top of another in this order, and a release sheet is attached to an outside of an outermost pressure sensitive adhesive layer.Type: ApplicationFiled: January 9, 2014Publication date: May 1, 2014Applicant: FUJIFILM CorporationInventors: Hidehiro MOCHIZUKI, Tatsuo MIKAMI, Toshiyuki KITAHARA
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Patent number: 8710458Abstract: A method of forming an integrated circuit includes providing a wafer, and a tape adhered to the wafer, wherein the tape has a main surface perpendicular to a first direction. The tape is exposed to a light to cause the tape to lose adhesion. In the step of exposing the tape, the wafer and the tape are rotated, and/or the light is tilt projected onto the tape, wherein a main projecting direction of the light and the first direction form a tilt angle greater than zero degrees and less than 90 degrees.Type: GrantFiled: October 19, 2010Date of Patent: April 29, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Hsiang Hu, Chen-Fa Lu, Chung-Shi Liu
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Patent number: 8709192Abstract: The invention relates to a protective cover sheet comprising a low birefringence protective polymer film and a layer that promotes adhesion to poly(vinyl alcohol), the protective cover sheet comprising at least one functional layer containing a UV-absorbing polymer.Type: GrantFiled: October 13, 2009Date of Patent: April 29, 2014Assignee: Nitto Denko CorporationInventors: Yongcai Wang, Hwei-Ling Yau, Timothy J. Hubert, Alain E. Gros, Timothy C. Schunk, Paul M. Hoderlein
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Publication number: 20140109309Abstract: An undermount sink that can be integrally mounted to a laminate or solid surface countertop. The undermount sink has a novel mounting structure to accomplish mounting to a laminate countertop. A mounting flange is attached to an outer perimeter of the undermount sink bowl, and is reinforced by way of a mounting flange support within the mounting flange that is mechanically fastened to the upper outer perimeter of the undermount sink bowl.Type: ApplicationFiled: December 27, 2013Publication date: April 24, 2014Inventor: Chad Michael Cusimano
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Publication number: 20140110045Abstract: A method and an apparatus for retaining magnetic properties of a magnet while undergoing manufacturing processes are presented. Ferrous materials with relatively good magnetic permeability are disposed adjacent to poles of magnet substantially containing magnetic field lines from the magnet within the ferrous materials. When the magnetic field lines are thereby substantially contained, the magnet can be exposed to elevated temperatures without losing magnetization strength. Adhesives, particularly adhesives that cure when exposed to elevated temperatures can be used with magnets configured to contain magnetic field lines without having the magnets lose magnetic strength.Type: ApplicationFiled: April 2, 2013Publication date: April 24, 2014Applicant: Apple Inc.Inventor: William F. Leggett
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Publication number: 20140111837Abstract: A multi-layer body (1, 21) is described, having a carrier film (7), a release layer (8), an embossed hologram layer (9) and a vapour-deposited reflection layer (10), a UV-activatable adhesive layer (4) with at least one partially activated UV adhesive-layer zone (5, 6) and a lower layer, wherein the cured adhesive regions (5) connect the lower layer and parts of the embossed hologram layer to one another inseparably, the lower layer being a transparent polycarbonate film (2), while the cured adhesive region (5) is arranged on the periphery of the uncured adhesive region (6) of the respective adhesive-layer zone (4) and surrounds it in a frame-like manner.Type: ApplicationFiled: May 31, 2012Publication date: April 24, 2014Inventor: Irina Menz
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Patent number: 8702886Abstract: According to some embodiments, there is provided a method of producing a patterned artificial marble slab (2, 5, 11, 16). The method includes adhering one or more patterned substances (1) to a surface of the artificial marble slab, processing said artificial marble slab and removing said one or more patterned substances from the surface of the artificial marble slab, thereby obtaining an elevated or recessed pattern (3, 4, 6, 7, 9) on the surface of the artificial marble, wherein the elevated or recessed pattern has essentially the form of the patterned substances.Type: GrantFiled: April 2, 2009Date of Patent: April 22, 2014Assignee: Caesarstone Sdot-Yam Ltd.Inventors: Moti Yaniv, Ruti Harel
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Publication number: 20140106153Abstract: The present invention discloses a graphene platelet fabrication method, which comprises Step (A): providing a highly-graphitized graphene having a graphitization degree of 0.8-1.0; and Step (B): providing a shear force acting on the highly-graphitized graphene to separate the highly-graphitized graphene into graphene platelets, wherein the graphene platelets have a length of 10-500 ?m and a width of 10-500 ?m and have a single-layer or multi-layer structure. The present invention also discloses a graphene platelet fabricated according to the abovementioned method.Type: ApplicationFiled: September 13, 2013Publication date: April 17, 2014Applicant: RITEDIA CORPORATIONInventors: I-Chiao LIN, Hung-Cheng LIN
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Publication number: 20140102631Abstract: Embodiments in accordance with the present invention are directed to poly(lactide) compositions that are useful for forming temporary bonding layers that serve to releasably join a first substrate to a second substrate as well as methods of both forming such a temporary bond and methods of debonding such substrates. Some such poly(lactide) compositions encompass a casting solvent, a photoacid generator and optionally a sensitizer and/or an adhesion promoter.Type: ApplicationFiled: December 13, 2013Publication date: April 17, 2014Applicant: Promerus, LLCInventors: Larry F. Rhodes, Leah J. Langsdorf, Venkat Dukkipati
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Publication number: 20140106148Abstract: The present invention relates to a method for the continuous inline production of coated polymeric substrates or laminates and also to an apparatus for implementing this method.Type: ApplicationFiled: June 15, 2012Publication date: April 17, 2014Applicant: Evonik Roehm GmbHInventors: Waldemar Kanzler, Thomas Hasskerl, Ghirmay Seyoum, Patrick Kliem, Werner Krebs, Dieter Foerster, Manfred Dannehl
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Publication number: 20140096900Abstract: The present application relates to a method and system for labeling one or more products such as packages transported along a conveyer, and more specifically to applying a label on a respective package by way of a vertically adjustable assembly positioned above the conveyor. The adjustable assembly includes at least a label printer and an applicator for printing and applying the label on a surface of the package on the conveyor.Type: ApplicationFiled: October 1, 2013Publication date: April 10, 2014Applicant: BELL AND HOWELL, LLC.Inventors: Richard WOJDYLA, Tim PALMER, Brian BOWERS, Tomasz K. BEDNAREK
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Patent number: 8691033Abstract: Applicants provide a step in the assembly of a moveable workpiece to a static base, the base bearing a sticky gasket and in which a release agent is sprayed on the sticky upper surface of the sticky gasket, which release agent will render the sticky surface temporarily unsticky.Type: GrantFiled: June 26, 2012Date of Patent: April 8, 2014Assignee: Aviation Devices & Electronic Components, LLCInventors: Jeffrey D. Busby, Douglas J. Smith
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Patent number: 8691369Abstract: A layer combination with a marking is proposed, for example, for a miniaturized electrical component. The layer combination includes a first layer and a different release layer, which is applied on it, on which a pattern is formed by a released pattern-like area. The release area is formed from an inorganic, semiconducting, insulating material, where the pattern produced thereon is machine-readable.Type: GrantFiled: October 24, 2008Date of Patent: April 8, 2014Assignee: EPCOS AGInventors: Alexander Schmajew, Hans Krueger, Alois Stelzl
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Patent number: 8689836Abstract: Apparatus and method for attaching an encapsulated marker to a flexible hose, such as a hose or cable. The method involves providing a flexible hose (100) having a rubber or plastic outer cover (202) positioned over an inner layer (203, 204). An annular segment of the outer cover is separated and removed to form an annular groove in the outer cover. A marker (101) is then positioned over the inner layer (203, 204) within the groove and a transparent encapsulating component (201) applied over the marker. A containment means (200) is then overlaid on the encapsulating component and overlaps onto a region of the outer cover either side of the groove. The cover assembly is then heated at elevated temperature. After cooling, the containment means (200) is removed. The encapsulated marker assembly is therefore provided which is chemically bonded or fused to the outer cover (202) of the flexible hose and is aligned flush with the external surface of the flexible hose.Type: GrantFiled: December 9, 2009Date of Patent: April 8, 2014Assignee: Aflex Hose LimitedInventor: Jeremy Hudson
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Publication number: 20140090879Abstract: Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed.Type: ApplicationFiled: September 29, 2012Publication date: April 3, 2014Inventors: Dilan SENEVIRATNE, Ching-Ping J. SHEN, Liwen JIN, Deepak ARORA, Vinodhkumar RAGHUNATHAN
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Publication number: 20140090768Abstract: A method for forming a knockout on a raceway includes removing a knockout from the raceway to form an opening, positioning the knockout within the opening, and thereafter attaching the knockout to the raceway by welding the knockout and the raceway together.Type: ApplicationFiled: March 15, 2013Publication date: April 3, 2014Applicant: Bemis Manufacturing CompanyInventors: David Bauer, Scott Kletzien, Jim Smith