Abstract: Disclosed herein is a method of manufacturing a glass core capable of continuously manufacturing the glass core by an automated process. The method includes: providing a glass sheet; laminating an insulating sheet on the glass sheet; laminating a copper clad sheet on the insulating sheet to manufacture the glass core; laminating a buffering sheet on the copper clad sheet; pressing and temporarily hardening the buffering sheet; delaminating the temporarily hardened buffering sheet; thermally hardening the glass core by a heater after the delaminating of the temporarily hardened buffering sheet; and cutting the glass core at a predetermined size after the thermal hardening of the glass core.

Abstract: A dressing for treating a tissue site with negative pressure is described. The dressing includes a tissue interface and a sealing member. The dressing further includes a sealing tape configured to be coupled to the sealing member and epidermis. The sealing tape includes a bonding adhesive and a sealing adhesive coupled to a side of the sealing tape. The sealing tape includes a layer of the bonding adhesive disposed on a film layer and a layer of sealing adhesive having one or more apertures disposed on the bonding adhesive. The sealing tape can include a layer of the bonding adhesive disposed on a portion of a film layer and a layer of the sealing adhesive disposed on a uncovered portions of the film layer.

Abstract: Discussed is a display device including a substrate having at least one of a first and a second electrode, a conductive adhesive layer configured to cover the wiring substrate, and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first and second electrode, wherein the conductive adhesive layer has a first conductive adhesive layer disposed in a first region and a second conductive adhesive layer disposed in a second region adjoining to the first region such that the conductive adhesive layer is partitioned into a plurality of regions on the wiring substrate.

Abstract: A method for manufacturing an electronic component includes a first step of preparing a piezoelectric body with a flat surface, a second step of implanting ions into the piezoelectric body such that an ion-implanted layer is formed in the piezoelectric body, a third step of forming sacrificial layers on the flat surface of the piezoelectric body, a fourth step of forming an insulating body over the flat surface of the piezoelectric body and the sacrificial layers to form a piezoelectric structure, a fifth step of dividing the piezoelectric body at the ion-implanted layer to form a piezoelectric laminar structure in which a piezoelectric film separated from the piezoelectric body is bonded to the insulating body, a sixth step of forming electrodes on portions of a division surface of the piezoelectric film, and a seventh step of removing the sacrificial layers from the piezoelectric laminar structure.

Abstract: Disclosed herein are a carrier and a method of manufacturing a printed circuit board using the same. More specifically, in the carrier according to the present invention, the carrier has characteristics of a coefficient of thermal expansion (CTE), a glass transition temperature (Tg), and a storage modulus which are improved by an insulating layer including an epoxy resin and a liquid crystal oligomer. In addition, a first metal layer is formed on the insulating layer, such that the printed circuit board stacked on one surface or both surfaces of the carrier may be protected from deformation by physical impact and the warpage phenomenon may be minimized.

Abstract: A touch sensor with an ornament includes a transparent substrate with a flat center part and a raised outer rim part, and a film substrate based transparent conductive sensor with a transparent conductive film layer attached to the inner face of the transparent substrate. A transparent conductive film layer circuit of the transparent conductive film layer is formed at the flat center part, and a routing circuit for detecting an electric signal from the transparent conductive film layer circuit and a decorative print layer for concealing the routing circuit are formed at the raised outer rim part.

Abstract: A method for removing a label affixed to a material includes exposing the label to one or more of heat, hot gas, or hot liquid having a predetermined temperature, in the absence of any caustic solution, for a period sufficient for the label to release from the material to which it was affixed.

Abstract: The present invention relates generally to an article comprising a curable film on a release substrate and/or carrier substrate. More particularly, the curable film comprises at least one specific cyanoacrylate monomer and at least one film forming (co)polymer. The article may take the form of a label, a single-sided tape, a transfer tape or a double-sided tape.

Abstract: A method for manufacturing an adhesive sheet according to the present invention is a method for manufacturing an adhesive sheet including a long peeling base material 1 and an adhesive layer 2 provided on the peeling base material 1 in the form of an island, the method including a peeling step of, after laminating a long adhesive layer 2 on the peeling base material 1, peeling off an unnecessary portion 6 of the adhesive layer 2 so that a predetermined portion of the adhesive layer is left on the peeling base material 1 in the form of an island, wherein, in the peeling step, the width W of a narrow portion 8, which is the narrowest in width in a short direction of the unnecessary portion 6 of the adhesive layer 2, is adjusted so that the breaking strength in the narrow portion 8 is 200 g or more.

Abstract: Disclosed herein are a prepreg for a printed circuit board, a manufacturing method thereof, and a printed circuit board including the same. More particularly, the manufacturing method of a prepreg for a printed circuit board includes: coating an insulating composition on each of the two carrier films to form an insulating layer and drying the coated insulating composition to form first and second carrier substrates; disposing glass fiber between the insulating layers of the first and second carrier substrates and bonding the first and second carrier substrates to each other to form a laminated substrate; pressing the laminated substrate; and removing the carrier film from the laminated substrate subjected to the pressing. The prepreg may be manufactured so as to have the desired thickness or maintain a uniform thickness, such that thickness quality may be stabilized, and a coefficient of thermal expansion property may be improved.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: A sling label comprises a single layer label portion having an upper surface and a lower surface, a cut in the label portion forming a sling, and adhesive on the lower surface of the label portion. The adhesive is inactivated on the lower surface of the label corresponding to the position of the sling. Further, a method for making a sling label comprises placing a single layer label portion over a backing layer so that the label portion adheres to the backing layer by means of the adhesive, and inactivating a portion of the adhesive on the lower surface of the label portion. A diecut is made in the label portion where the adhesive on the lower surface of the label portion has been inactivated, and the label portion is re-fastened to the backing layer.

Abstract: An embodiment of the inventive method of transfer lamination bonding a first metallized side of a film to a substrate. Then a breakaway coating is applied to a second, non-metallized side of the film after the first metallized side has been bonded to the substrate. The bonded film and substrate are then placed in an oven. The film is then stripped from the substrate leaving metal from the film deposited on the substrate. The application of the breakaway coating is performed as an inline part of the transfer lamination process thereby providing an ease of manufacture presently unknown.

Abstract: Provided is a heating device, including: a first heating region including a first material; and a second heating region including a second material, the second heating region having a smaller temperature coefficient of resistance than a temperature coefficient of resistance of the first heating region, the first heating region and the second heating region being connected to each other.

Abstract: A method for forming a graphene circuit pattern on an object includes the following steps of: forming a patterned graphene layer on a surface of a film so as to form a laminate; and covering an object with the laminate so as to attach the patterned graphene layer to the object.

Abstract: The embodiments of the present invention relate to semiconductor device manufacturing, and more particularly, a method of temporarily bonding a semiconductor wafer to a wafer carrier with a multi-layered contact layer as well as a structure. A method is disclosed that includes: forming a first layer on a surface of a semiconductor wafer; forming a second layer on the first layer; bonding a perforated carrier to the second layer; and removing the semiconductor wafer from the perforated carrier. The first layer may be composed of an adhesive. The second layer may be composed of a material having a higher outgassing temperature than the first layer.

Abstract: A fabrication method for providing a relatively smooth surface associated with lightning strike protection for composite materials joined with fasteners recessed below the surface is described. The method includes coating at least one of a head of the fastener and a preformed dielectric insert with an adhesive, inserting the preformed dielectric insert into the recess such that the adhesive engages both contours of the recess and the preformed dielectric insert, and removing any excess adhesive from the surface area of the composite material and a top surface of the insert.

Abstract: A manufacturing method of a package carrier includes the following steps. Firstly, two base metal layers are bonded together. Then, two supporting layers are laminated onto the base metal layers respectively. Next, two release metal films are disposed on the supporting layers respectively, wherein each of the release metal films includes a first metal film and a second metal film separable from each other. Next, two patterned metal layers are formed on the release metal films respectively, wherein each of the patterned metal layers is suitable for carrying and electrically connected to a chip. Then, the base metal layers are separated from each other to form two package carriers independent from each other. A package carrier formed by the manufacturing method described above is also provided.

Abstract: A method produces adhesive tapes which are adhesive at least on one side, wherein an adhesive tape web, in which the at least one adhesive side is covered by a first liner, is guided into a cutting device in which a total of N individual adhesive tape strips located next to one another are produced in the machine direction from the adhesive tape web. Every other adhesive tape strip is removed from the first liner and is applied to a second liner in each case having a spacing a between the individual adhesive tape strips. The liners are cut between the adhesive tape strips located on the first liner and on the second liner, and the individual adhesive tapes, together with the liner strips, are wound up in a total of X rolls in a form of an Archimedean spiral.

Abstract: Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.

Abstract: In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.

Abstract: The present invention has an object to provide a glass laminate in which a glass substrate can be easily peeled even after a long-time treatment under high temperature conditions. The present invention relates to a glass laminate including: an inorganic layer-attached supporting substrate including a supporting substrate and an inorganic layer containing at least one kind selected from the group consisting of a metal silicide, a nitride, a carbide and a carbonitride, arranged on the supporting substrate; and a glass substrate peelably laminated on the inorganic layer.

Abstract: Paint film composites comprise sheet metal, a color layer, and an optional transparent protective layer. Methods of making and using the paint film composites, and shaped articles made thereby, are also disclosed.

Abstract: A variety of methods for fabricating organic photovoltaic-based electricity-generating commercial aircraft fuselage surfaces are described. In particular, a method for fabricating curved electricity-generating commercial aircraft fuselage surfaces utilizing lamination of highly flexible organic photovoltaic films is described. High-throughput and low-cost fabrication options also allow for economical production.

Abstract: A frangible laminate includes first, second and third webs, and the second web is positioned between the first and third webs. The forming of the frangible laminate includes adhesively bonding a first plurality of sections of the second web to the first web, applying release material in order to inhibit at least some of any bonding between the first plurality of sections of the second web and the third web, and adhesively bonding a second plurality of sections of the second web to the third web. The frangible laminate is separated into a first laminate and a second laminate, so that the first laminate includes the first web and the first plurality of sections of the second web, and the second laminate includes the third web and the second plurality of sections of the second web.

Abstract: According to an aspect of the present invention, there is provided a collector member 10 comprising a sheet-shaped base material 11 having a carbon-containing fiber 11a and catalyst particles 12 adhered to an outer periphery of the fiber 11a, containing a noble metal or an alloy thereof, and having an average particle diameter of 0.1 to 2 ?m.

Abstract: A variety of methods for fabricating organic photovoltaic-based electricity-generating military aircraft fuselage surfaces are described. In particular, a method for fabricating curved electricity-generating military aircraft fuselage surfaces utilizing lamination of highly flexible organic photovoltaic films is described. High-throughput and low-cost fabrication options also allow for economical production.

Abstract: A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.

Abstract: A method for fabricating a flexible display device is provided. The method comprises: attaching a first flexible substrate of the flexible display device onto a conductive adhesive layer, wherein the conductive adhesive layer is disposed on a conductive rigid substrate; fabricating other parts of the flexible display device on the first flexible substrate; aging the conductive adhesive layer; peeling off the flexible substrate from the conductive rigid substrate so as to obtain the flexible display device.

Abstract: A light extraction product (1) for a semiconductor light emitting device is provided with a concavo-convex structure layer (11), provided with a concavo-convex structure (11a) on a surface thereof, having a first refractive index (n1) and a light extraction layer (12), provided on the convex portion of the concavo-convex structure (11a), having a second refractive index (n2), where in a first light extraction layer (12a) a distance Lcv between an average position Sh of tops of the convex-portions and a convex-portion upper interface average position Scv of the first light extraction layer (12a) meets equation (1) 10 nm?Lcv?5000 nm, in the concavo-convex structure (11a) a convex-portion average height H meets equation (2) 10 nm?H?5000 nm, an average pitch P meets equation (3) 50 nm?P?5000 nm, and the distance Lcv and the convex-portion average height H meet equation (4) 50 nm?Lcv+H?6000 nm.

Abstract: A method for manufacturing a laminated polishing pad of the present invention, comprising the steps of: forming a polishing layer by providing a light transmitting region in an opening A of a polishing region; providing an adhesive member X on one side of the polishing layer, wherein the adhesive member X contains a hot-melt adhesive; providing a removable protective member on a part of the adhesive member X corresponding to the light transmitting region; bonding a support layer to the adhesive member X on which the removable protective member is provided; and removing a part of the support layer corresponding to the light transmitting region and also removing the removable protective member to form an opening B.

Abstract: The invention relates to a method for manufacturing a semi-finished product for a module having a cell made from a photoactive material, particularly a solar cell, wherein the method has the following steps: providing a substrate (1), arranging a cell (2; 3) made from a photoactive material on the substrate (1) in such a manner that a light-incidence or light-emission side of the cell (2; 3) faces the substrate (1), constructing an adhesive-compound layer (10), into which the cell (2; 3) and a contact connector (7) formed on a connecting lead of the cell (2; 3) are partially or completely embedded, and constructing a contact region (8), which is formed on the rear side of the substrate (1) with the contact connector (7) formed herein, wherein the contact connector (7) is subsequently exposed again to construct the contact region (8), in that a layer composite arranged on the contact connector (7) is removed, and wherein an adhesion between the contact connector (7) and the adhesive-compound layer (10) arrange

Abstract: A device for punching labels from a substrate web having a carrier layer and a label layer includes a punching installation for punching labels. The punching installation has a delaminating installation for separating the label layer from the carrier layer, a metallic non-suction revolving counterpunching belt for conveying the label layer during a punching operation, and a relaminating installation for reconnecting the label layer, provided with punchings, to the carrier layer. A method for punching self-adhesive labels is also provided. In this way, a thin carrier layer can be used, and it is ensured that the carrier layer is not damaged during punching.

Abstract: Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.

Abstract: A method for manufacturing the display device (70, 80) comprises: providing a first flexible substrate (101) comprising a first and second surfaces and a second flexible substrate (102) comprising a third and fourth surfaces; joining the second surface of the first flexible substrate with the third surface of the second flexible substrate by a connecting element (11) to form a laminated structure, wherein the first surface of the first flexible substrate (101) is a first outer surface of the laminated structure, and the fourth surface of the second flexible substrate (102) is a second outer surface of the laminated structure; forming a first flexible display element layer (10a) and a second flexible display element layer (10b) respectively on the first and second outer surfaces of the laminated structure; separating the first flexible substrate (101) from the second flexible substrate (102) of the laminated structure.

Abstract: Pillar delivery films for vacuum insulated glass units. The delivery films include a support film or pocket tape, a sacrificial material on the support film, and a plurality of pillars. The pillars are at least partially embedded in the sacrificial material or formed within sacrificial material molds, and the sacrificial material is capable of being removed while leaving the pillars substantially intact. In order to make an insulated glass unit, the delivery films are laminated to a receptor such as a glass pane, and the support film and sacrificial material are removed to leave the pillars remaining on the glass.

Abstract: Method for producing a thin optical laminated body. This method is a method for producing a laminated body including a polarization layer, a ?/2 layer, a ?/4 layer, a positive C layer, and a transfer adhesive layer, the laminated body including the polarization layer, the ?/2 layer and the ?/4 layer in this member-described order; including the positive C layer between the polarization layer and the ?/4 layer, or at the side of the ?/4 layer that is opposite to the ?/2-layer-arranged side of the ?/4 layer; and including the transfer adhesive layer between the polarization layer and the ?/4 layer or positive C layer, the method including the step of bonding a bonding body including a substrate and the transfer adhesive layer to an adherend through the transfer adhesive layer, and peeling the substrate from the resultant.

Abstract: A shield that is attachable to a touch sensitive screen is disclosed. The shield may be attached to the touch sensitive screen only at its outer peripheral portion. An air gap is enclosed between the shield and the touch sensitive screen to form a planar air bearing. The shield preferably does not touch the active area of the touch sensitive screen when the user is not touching the shield but only viewing the touch sensitive screen through the shield. This mitigates unwanted optical artifacts such as trapped air bubbles, Newton rings and chromatic interference while maintaining the sensitivity of the touch sensitive screen.

Abstract: A method of producing an optical film laminate includes: stretching and dyeing a laminate including a resin substrate and a polyvinyl alcohol-based resin layer formed on one side of the resin substrate to produce a polarizing film on the resin substrate; laminating a first protective film on the polarizing film on an opposite side to the resin substrate; and peeling the resin substrate, followed by laminating a second protective film on the polarizing film on a side from which the resin substrate has been peeled. The first protective film is a protective film to be placed on an optical cell side when the optical film laminate is attached to the optical cell, the second protective film is a protective film to be placed on an opposite side to the optical cell when the optical film laminate is attached to the optical cell.

Abstract: Provided is a method for manufacturing electronic component improved in chip-holding efficiency, pickup efficiency and contamination resistance in a well-balanced manner, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer on the rear face of a wafer, a fixing step of fixing the semi-cured adhesive layer of the wafer on a ring frame with a cohesive sheet, a dicing step of dicing the wafer into semiconductor chips, a UV-irradiating step of irradiating ultraviolet ray, and a pick-up step of picking up the chips and semi-cured adhesive layers from the cohesive layer, wherein the cohesive sheet has a cohesive layer of a cohesive agent having a particular composition formed on one face of its base film.

Abstract: A process is disclosed for using two polymeric bonding material layers to bond a device wafer and carrier wafer in a way that allows debonding to occur between the two layers under low-force conditions at room temperature. Optionally, a third layer is included at the interface between the two layers of polymeric bonding material to facilitate the debonding at this interface. This process can potentially improve bond line stability during backside processing of temporarily bonded wafers, simplify the preparation of bonded wafers by eliminating the need for specialized release layers, and reduce wafer cleaning time and chemical consumption after debonding.

Abstract: An element substrate comprises a flexible substrate, an element layer, a buffer layer and an interface layer. The element layer is disposed on the flexible substrate. The buffer layer is disposed on the flexible substrate. The buffer layer and the element layer are disposed on the opposite sides of the flexible substrate. The interface layer is disposed between the flexible substrate and the buffer layer and includes partial material of both of the flexible substrate and the buffer layer. A display apparatus including the element substrate and a manufacturing method of the element substrate are disclosed.

Abstract: A method may involve: forming a sacrificial layer on a working substrate; forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer; forming a conductive pattern on the first bio-compatible layer; mounting an electronic component to the conductive pattern; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern; and removing the sacrificial layer to release the bio-compatible device from the working substrate. The first bio-compatible layer defines a first side of a bio-compatible device. The second bio-compatible layer defines a second side of the bio-compatible device.

Abstract: A method for producing a scintillator array comprising fixing a scintillator substrate to a support plate via a double-coated adhesive sheet, at least an adhesive surface thereof to be in contact with the scintillator substrate being thermally peelable; providing the scintillator substrate with lattice-patterned grooves to form pluralities of scintillator cells; filling gaps between the scintillator cells with a liquid hardening reflector resin; curing the liquid hardening reflector resin by heating to form a resin-hardened scintillator cell body; and then peeling the double-coated adhesive sheet from the resin-hardened scintillator cell body by heating.

Abstract: Methods for fastening nanoscale structures within an anchoring structure to form a nanostructure composite and nanostructure composites formed therefrom. A primary fluid layer is formed on an anchoring substrate. Nanostructures are provided on an initial substrate, the nanostructures having a defined height and orientation with respect to the initial substrate. The nanostructures are introduced to a desired depth in the primary fluid layer, such that the orientation of the nanostructures relative to the growth substrate is substantially maintained. The primary fluid layer comprises one or more fluid layers. Ones of multiple fluid layers are selected such that when altered to form an anchoring structure, a portion of the anchoring structure can be removed, permitting exposure of at least a portion of the nanostructures from the anchoring structure in which they are affixed. The growth substrate is removed. Ends or other parts of nanostructures may be exposed from the anchoring structure.

Abstract: There is provided a laminated structure manufacturing method including bonding a graphene film of one layer or a plurality of layers formed on a first substrate to a second substrate with an adhesive resin layer, removing the first substrate, and forming a transparent layer on the graphene film.

Abstract: There is disclosed a mobile terminal including a display panel, a frame comprising a front surface where the display panel is disposed, a rear case coupled to one surface of the frame, to form an electric/electronic control unit there between the frame and the rear case, a heat spreader module provided between the display panel and the frame, wherein the heat spreader module includes a metallic plate in contact with the display panel, a heat spreading material layer disposed on a rear surface of the metallic plate and an adhesive layer disposed between the heat spreading material layer and the metallic plate to bond the metallic plate and the heat spreading material layer with each other. Even when the frame is partially eliminated, the mobile terminal may support the display panel and securing the heat spreading performance simultaneously, using the heat spreader module having a preset rigidity.

Abstract: A method of laminating substrates includes preparing a first substrate and a second substrate, forming a self-assembled monolayer on one surface of the first substrate, the self-assembled monolayer includes a region A including an alkyl chain and a region B including an alkyl chain having a carbon number less than a carbon number of the alkyl chain of the region A, and laminating the first substrate and the second substrate by contacting the self-assembled monolayer with the second substrate.

Abstract: A protective film configured to protect a substrate such as a glass panel for a display is provided. The protective film may include a discontinuous outer layer including a multitude of panels and gaps positioned therebetween. Further, the protective film may include a flexible layer positioned between the discontinuous outer layer and the substrate. When panels of the discontinuous outer layer are impacted by a foreign object, the force may be transferred to the flexible layer, rather than propagating through the outer layer. In this regard, the gaps between the panels of the discontinuous outer layer may prevent the formation of cracks that may otherwise occur. Related assemblies and methods are also provided.

Abstract: A system and method for creating three-dimensional nanostructures is disclosed. The system includes a substrate bonded to a carrier using a bonding agent. The bonding agent may be vaporizable or sublimable. The carrier may be a glass or glass-like substance. In some embodiments, the carrier may be permeable having one or a plurality of pores through which the bonding agent may escape when converted to a gaseous state with heat, pressure, light or other methods. A substrate is bonded to the carrier using the bonding agent. The substrate is then processed to form a membrane. This processing may include grinding, polishing, etching, patterning, or other steps. The processed membrane is then aligned and affixed to a receiving substrate, or a previously deposited membrane. Once properly attached, the bonding agent is then heated, depressurized or otherwise caused to sublime or vaporize, thereby releasing the processed membrane from the carrier.