Exposure Of Work To Electrode Patents (Class 156/274.4)
  • Patent number: 10154933
    Abstract: A compressible or retractable support (10, 80, 90, 100) is installed inside an air blower cavity (36) of a body support system (30), such as a medical mattress with forced air flow. The support is compressed or retracted within the cavity when the air blower (40) is inserted in the dynamic configuration of the body support system. The support rebounds to an uncompressed state to fill a greater portion of the air blower cavity when the air blower is removed to convert the body support system to a static configuration.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: December 18, 2018
    Assignee: FXI, Inc.
    Inventors: Marc J. Albero, Christopher S. Weyl
  • Patent number: 10119735
    Abstract: The invention discloses an electronic expansion valve. The electronic expansion valve includes: a valve body (10), a first chamber being formed in the valve body (10), a liquid inlet (11) and a liquid outlet (12) being oppositely provided at two ends of the valve body (10); a second chamber, provided in the first chamber, a coil (20) being provided in the second chamber; a third chamber, an inlet end of the third chamber being communicated with the liquid inlet (11), an outlet end of the third chamber being communicated with the liquid outlet (12), the inlet end of the third chamber and the outlet end of the third chamber being coaxially provided, and a valve core (31) being provided in the third chamber; and the first chamber being communicated with the liquid inlet (11) via the first liquid passage hole (33).
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: November 6, 2018
    Assignee: GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI
    Inventors: Yaguo Zhang, Peigang Song, Yunyu Su, Wu Li
  • Patent number: 9365022
    Abstract: A method of joining a first bulk composite core and a second bulk composite core by applying an adhesive to a surface network of the first bulk composite core; inserting a plurality of mandrels into a plurality of cell members of the first bulk composite core and a plurality of cell members of the second composite core, thereby aligning the cell members of the first bulk composite core to the cell members of the second bulk composite core; pressing the respective surface networks of the first bulk composite core and the second bulk composite core together with the adhesive located therebetween; and curing the adhesive.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: June 14, 2016
    Assignee: Bell Helicopter Textron Inc.
    Inventors: Phillip A. Kendrick, S. Brent Woychesin
  • Publication number: 20150140276
    Abstract: In a method for solid body joining of a carrier body (10) and a cover layer (20), in particular by anodic bonding, the cover layer (20) is pressed with a pressing force against a curved carrier body surface (11), wherein the pressing force during the solid body joining is distributed by way of a pressure intermediary device (30) areally and simultaneously over the whole cover layer (20) and is directed perpendicularly to the curvature of the carrier body surface (11). A composite component comprising a carrier body (10) and a cover layer (20) is also disclosed, wherein a curved areal joining region (13) is formed between a cover layer surface (21) and a carrier body surface (11).
    Type: Application
    Filed: November 19, 2014
    Publication date: May 21, 2015
    Inventors: Carsten PAMPUCH, Khaldoun HALALO, Volker SCHMIDT
  • Publication number: 20150013898
    Abstract: Provided is a method for joining composite materials including a thermoplastic resin as a matrix resin and carbon fibers, by which the composite materials can be easily joined to each other to attain good bond strength. The method for joining composite materials includes: (i) a step in which a composite material A including a thermoplastic resin and carbon fibers and having a protrusion part on one surface thereof and a composite material B including a thermoplastic resin and carbon fibers are layered and fixed so that the protrusion part of the composite material A faces inward; and (ii) a step in which a current is applied to a joining portion including the protrusion part to generate heat.
    Type: Application
    Filed: December 26, 2012
    Publication date: January 15, 2015
    Applicant: TEIJIN LIMITED
    Inventor: Takumi Kato
  • Patent number: 8927091
    Abstract: A display device and method thereof which minimizes introduction of oxygen and moisture from the outside includes an insulating substrate, a display part formed on the insulating substrate, a cover substrate combined with the insulating substrate, a filler provided between the insulating substrate and the cover substrate, the filler includes a first region and a second region spaced from the first region and formed at a circumference of the first region, and a moisture absorbent formed in a space between the first region and the second region.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: January 6, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Un-cheol Sung, Hoon Kim, Sang-pil Lee, Sung-soo Lee
  • Patent number: 8906177
    Abstract: A method for controlling a contact angle between a glue and a surface of a substrate during manufacture of microchip packages is disclosed. The method includes applying a glue to a surface of a substrate, and placing an electrode in electrical connection with the glue. A potential difference is applied between the electrode and the substrate. The potential difference is applied across the glue and causes a contact angle between the glue and the surface of the substrate to be altered.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: December 9, 2014
    Assignee: STMicroelectronics (Research & Development) Limited
    Inventor: William Halliday
  • Patent number: 8882077
    Abstract: This invention relates seed layers and a process of manufacturing seed layers for casting silicon suitable for use in solar cells or solar modules. The process includes the step of positioning tiles with aligned edges to form seams on a suitable surface, and the step of joining the tiles at the seams to form a seed layer. The step of joining includes heating the tiles to melt at least a portion of the tiles, contacting the tiles at both ends of at least one seam with electrodes, using plasma deposition of amorphous silicon, applying photons to melt a portion of the tiles, and/or layer deposition. Seed layers of this invention include a rectilinear shape of at least about 500 millimeters in width and length.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: November 11, 2014
    Assignee: AMG Idealcast Solar Corporation
    Inventor: Nathan G. Stoddard
  • Publication number: 20140318703
    Abstract: A continuous production process for a polytetrafluoroethylene functional film for electro-mechanical energy conversion is disclosed. The process includes a step of thermal bonding a composite film having a micro-porous structure and electrically charging the composite film. The composite film having a micro-porous structure includes one layer of porous polytetrafluoroethylene film sandwiched between two adjacent layers of polytetrafluoroethylene film thermally bonded by two heated rollers. The process also has a step of electrically charging the composite film to obtain a polytetrafluoroethylene piezoelectric electret film. The electrically charging the composite film can be corona-polarizing the composite film by introducing the composite film between an electrode roller and a corona electrode, or introducing the composite film into an electroplating region and attaching electrodes to the upper and lower surfaces thereof, followed by introducing the film to a charging region by a contacting process.
    Type: Application
    Filed: May 31, 2012
    Publication date: October 30, 2014
    Applicant: SHANGHAI DAGONG NEW MATERIALS CO., LTD.
    Inventors: Xiangshan Gong, Xiaoqing Zhang, Miya Tsugunari
  • Publication number: 20140246793
    Abstract: A fill pack assembly and method for assembling a fill pack from individual sheets utilizes integrally bonded sheet pairs. Each sheet pair is a pair of two individual adjacent fill sheets which have been bonded together via any suitable bonding method. A plurality of the thus formed sheet pairs can then be attached together to form an entire fill pack or portion of a fill pack. Such fill packs are useful in heat exchange devices such as industrial cooling towers.
    Type: Application
    Filed: May 16, 2014
    Publication date: September 4, 2014
    Inventors: Eldon F. MOCKRY, Ohler L. KINNEY, JR., Kenneth P. MORTENSEN, Glenn S. BRENNEKE
  • Publication number: 20140154494
    Abstract: A method of obtaining a high-strength bonded body between composite materials, each containing a thermoplastic resin and carbon fibers, with a low current in a short period of time, wherein the bonded body is rarely susceptible to deformation such as warp. The method of manufacturing a bonded body, comprises the steps of: (i) preparing a plurality of composite materials, each containing a thermoplastic resin and discontinuous carbon fibers which are randomly oriented; (ii) overlapping the composite materials each other; (iii) sandwiching at least a part of the overlapped portion between a pair of electrodes; and (iv) applying electricity between the electrodes to weld together the thermoplastic resins with Joule heat.
    Type: Application
    Filed: April 6, 2012
    Publication date: June 5, 2014
    Applicants: ORIGIN ELECTRIC CO., LTD., TEIJIN LIMITED
    Inventors: Takumi Kato, Kiyoshi Saito, Akio Komatsu
  • Publication number: 20140138024
    Abstract: In a process of welding pieces of tubing into films with a central electrode the central electrode is divided to facilitate the welding in a single process. In the case of tools with or without a central electrode, electrode lamellae lying next to one another have a free visual connection between edges lying towards the insert piece to obtain a tight welded joint.
    Type: Application
    Filed: June 5, 2007
    Publication date: May 22, 2014
    Inventor: Heinz Hinterseer
  • Patent number: 8715437
    Abstract: A composite foam product comprising a foam core surrounded by a gas-impermeable film. The gas-impermeable film retains the gas formed from the blowing agent so that the pressure inside the foam core is above ambient pressures.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: May 6, 2014
    Assignee: Novation IQ LLC
    Inventor: Michel Marc
  • Publication number: 20140106095
    Abstract: The invention relates to a device comprising a wafer comprising a silicon area and a wafer comprising a glass area fastened to each other, the fastening zone thus formed between the wafers defining a multilayer structure comprising a first layer protecting the silicon from physical changes caused by attack of the surface, which layer covers the silicon area, and a second layer protecting the glass from physical changes caused by attack of the surface, which layer covers the glass area; said multilayer structure furthermore comprising at least one additional layer enabling anodic bonding between the two protective layers; said device containing at least one fluid channel protected by said protective layers and able to contain a solution temporarily.
    Type: Application
    Filed: June 7, 2012
    Publication date: April 17, 2014
    Applicant: DEBIOTECH S.A.
    Inventor: Francois Bianchi
  • Patent number: 8695186
    Abstract: Providing a method for manufacturing a package capable of suppressing occurrence of a discharge phenomenon during the anodic bonding and achieving stable anodic bonding of the base board and the bonding film. Providing a method for manufacturing a package including: an alignment step where an inner surface of the lid board 50 is superimposed onto an inner surface of the base board 40, and an outer surface of the base board 40 is disposed on an electrode base portion 70 for anodic bonding; and an anodic bonding step where a bonding voltage is applied between the bonding film 35 and the electrode base portion 70 while heating them to a bonding temperature, whereby the bonding film 35 and the base board 40 are anodically bonded, wherein the anodic bonding step involves applying the bonding voltage in a state where the penetration electrodes 32, 33 are exposed to a void portion 73 formed in the electrode base portion 70.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: April 15, 2014
    Assignee: Seiko Instruments Inc.
    Inventor: Takeshi Sugiyama
  • Patent number: 8698054
    Abstract: An induction heating inductor and perforated susceptor are formed as an integral unit to provide a low cost, physically stable, efficient, and easily cleaned unit.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: April 15, 2014
    Inventor: Bernard C. Lasko
  • Publication number: 20140090780
    Abstract: Provided are a sealing method and device of a pouch type secondary battery including a pouch and an electrode tab provided for electrical connection with the pouch, in which the electrode tab is heated so that heat may be supplied to a tab sealant bonding between a bonding surface of a sealing part of the pouch and the electrode tab at the time of sealing the pouch type secondary battery.
    Type: Application
    Filed: May 10, 2012
    Publication date: April 3, 2014
    Applicant: SK INNOVATION CO., LTD.
    Inventor: Byoung Cheon Jeong
  • Patent number: 8668803
    Abstract: A sandwich of impact resistant material comprising: a first tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the first tile and the first tile comprises a hardness value; a second tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the second tile and the second tile comprises a hardness value; and a third tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the nano-particles is present in the third tile and the third tile comprises a hardness value, wherein the second tile is coupled in between the first tile and the third tile, and the second tile comprises a hardness value greater than the first tile and the second tile.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: March 11, 2014
    Assignee: SDCmaterials, Inc.
    Inventor: Maximilian A. Biberger
  • Patent number: 8545652
    Abstract: A method of making a tile, the method comprising: providing a plurality of nano-particles, wherein the plurality of nano-particles comprises a plurality of ceramic nano-particles; and performing a spark plasma sintering (SPS) process on the plurality of nano-particles, thereby forming a tile comprising the plurality of nano-particles, wherein the nano-structure of the nano-particles is present in the formed tile. In some embodiments, the tile is bonded to a ductile backing material.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: October 1, 2013
    Assignee: SDCmaterials, Inc.
    Inventor: Maximilian A. Biberger
  • Patent number: 8470112
    Abstract: A method of making a composite material, the method comprising: providing a tile, wherein the tile comprises an inorganic material; and bonding the tile to a ductile backing material using heat-curable adhering material and catalyzed foamable exothermic material between the tile and the ductile backing material, wherein heat generated from the use of the catalyzed foamable exothermic material cures the heat-curable adhering material. In some embodiments, the exotherm from the foaming of the foamable exothermic material cures the heat-curable adhering material for a time sufficient to unite a solid foam body to the heat-curable adhering material of the tile and the ductile backing material. The method is particularly advantageous in bonding a tile composed of nano-particles to a ductile backing material, as it helps retain the nanoscale properties of the nano-particles in the tile.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: June 25, 2013
    Assignee: SDCmaterials, Inc.
    Inventor: Maximilian A. Biberger
  • Patent number: 8460492
    Abstract: A method for thermally welding an adhesive tape to a polymeric substrate wherein the backing of the adhesive tape enters into a cured physical connection with the polymeric substrate is disclosed. The adhesive tape is comprises a spunbonded backing that is coated, at least partially, on one side with a pressure sensitive adhesive, preferably natural rubber or acrylate. The spunbonded backing can comprise polyester or polypropylene fibers that do not melt during the welding process, and may optionally include additives such as pigments, UV stabilizers and flame retardants.
    Type: Grant
    Filed: July 12, 2006
    Date of Patent: June 11, 2013
    Assignee: tesa SE
    Inventor: Martin Hopf
  • Patent number: 8444801
    Abstract: An anodic bonding method of anodically bonding a base wafer 10 and a lid wafer 11 includes:(1) superimposing the base wafer 10 and the lid wafer 11 onto each other in a direction where a bonding film 9 faces a cavity C; (2) subsequent to the superimposition step, pressurizing and holding the base wafer 10 and the lid wafer 11 in a vacuum state in the superimposition direction; and (3) subsequent to the pressurizing step, partitioning and setting a plurality of intended bonding areas A1, A2, A3 and A4 in a concentric form on a contacting surface where the base wafer 10 and the lid wafer 11 are in contact with each other and applying a DC voltage to each of the plurality of intended bonding areas A1, A2, A3 and A4.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: May 21, 2013
    Assignee: Seiko Instruments Inc.
    Inventor: Kiyoshi Aratake
  • Publication number: 20130068165
    Abstract: A microfluidic device for use with a microfluidic delivery system, such as an organic vapor jet printing device, includes a glass layer that is directly bonded to a microfabricated die and a metal plate via a double anodic bond. The double anodic bond is formed by forming a first anodic bond at an interface of the microfabricated die and the glass layer, and forming a second anodic bond at an interface of the metal plate and the glass layer, where the second anodic bond is formed using a voltage that is lower than the voltage used to form the first anodic bond. The second anodic bond is formed with the polarity of the voltage reversed with respect to the glass layer and the formation of the first anodic bond. The metal plate includes attachment features that allow removal of the microfluidic device from a fixture.
    Type: Application
    Filed: September 19, 2011
    Publication date: March 21, 2013
    Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
    Inventors: Stephen Forrest, Gregory McGraw, Siddharth Harikrishna Mohan, Diane L. Peters
  • Patent number: 8366861
    Abstract: Provided is an anode bonding method by which a silicon substrate and a glass substrate are well anodically bonded without generating positional shift, even when an electrode cannot be arranged on a surface on the opposite side to a bonding surface of a glass substrate and the bonding surface is large. The method for anodically bonding the glass substrate and the silicon substrate is provided with a step of placing on the glass substrate the silicon substrate whereupon a through hole is arranged; a step of bringing the anode electrode into contact with the surface of the overlapped silicon substrate opposite to the surface facing the glass substrate, and bringing an cathode electrode into contact with the glass substrate through the through hole arranged on the silicon substrate; and a step of applying a direct current voltage to the anode electrode and the cathode electrode in a state where the glass substrate and the silicon substrate are heated.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: February 5, 2013
    Assignee: Konica Minolta Holdings, Inc.
    Inventor: Nobuhiro Ueno
  • Publication number: 20130000833
    Abstract: The invention provides a method of fastening lamellae of a lamellar material that is at least partially conductive onto an insulating substrate (2) containing oxides that are suitable for dissociating into mobile ions of given charge and stationary ions of opposite charge, the method comprising the steps of: placing a sample (1) of the lamellar material against a surface of the substrate; causing the oxides of the substrate to dissociate; and subjecting the substrate and the sample to an electric field by means of an electrode in contact with the substrate and an electrode in contact with the sample.
    Type: Application
    Filed: August 2, 2012
    Publication date: January 3, 2013
    Applicants: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, UNIVERSITE PIERRE ET MARIE CURIE (PARIS 6)
    Inventors: Abhay SHUKLA, Javed MAZHER
  • Patent number: 8172970
    Abstract: The invention relates to a method for the production of at least one layer (1) of a shoe upper or of a part of a shoe upper, wherein a nonwoven fabric (2) made of thermoplastic elastomere (TPE) is used as the basic material for at least a section of the layer (1) of the shoe upper. To influence the local properties of the material selectively in a cost efficient manner the invention suggests that at least partitions (3) of the surface of the nonwoven fabric (2) are exposed to a welding beam (4) in such a manner, that in those partitions (3) at least a partial melting of the nonwoven fabric (2) takes place, so that the density of the material is increased in the molten partitions (3).
    Type: Grant
    Filed: July 19, 2008
    Date of Patent: May 8, 2012
    Assignee: Puma SE
    Inventor: Reinhold Sussmann
  • Patent number: 8105457
    Abstract: A method for joining at least two members of a lithographic apparatus is disclosed. The method includes providing a first member, providing a second member, direct-bonding the first member and the second member to form a direct-bond, and anodically bonding the first member and the second member. At least one of the members includes ultra low expansion glass and/or ultra low expansion glass ceramics.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: January 31, 2012
    Assignee: ASML Netherlands B.V.
    Inventor: Jan Van Elp
  • Patent number: 8101040
    Abstract: A fusion-bonded body which includes a fusion-bonded part obtained by fusion-bonding to each other a first part to be fusion-bonded which comprises a first thermoplastic resin and first carbon fibers and a second part to be fusion-bonded which comprises a second thermoplastic resin and second carbon fibers. Also provided is a method for producing the fusion-bonded body which comprises a fusion-bonding step in which the first part to be fusion-bonded is brought into close contact with the second part to be fusion-bonded, an electric current is caused to flow through the two parts to generate heat and melt the first thermoplastic resin and second thermoplastic resin, and the molten resins are solidified to form a fusion-bonded part.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: January 24, 2012
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yoshinori Shibata, Shinsuke Hidaka
  • Publication number: 20120012710
    Abstract: A composite tank that can suppress electrification, corrosion and strength degradation, a wing comprising the composite tank, and a method for manufacturing the composite tank.
    Type: Application
    Filed: March 17, 2010
    Publication date: January 19, 2012
    Inventors: Hiroaki Yamaguchi, Yuichiro Kamino, Koichi Nakamura, Tooru Hashigami
  • Patent number: 8092631
    Abstract: An apparatus for welding a first plastic sheet to a second plastic sheet is provided. The apparatus includes an elongate die including a channel extending longitudinally along the die's welding face. In combination with a plate and a high frequency alternating current generator, the die and the plate are operable to compress the first and second plastic sheets in an overlapping arrangement and generate a high frequency alternating electromagnetic field between the die and the plate and weld the first and second plastic sheets to one another. The depth of the die channel prevents the formation of an electromagnetic field that is strong enough to weld the first and second plastic sheets in an area between the die channel and the plate. A die for use in such an apparatus and a method of use thereof are further provided.
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: January 10, 2012
    Assignee: Solmax International Inc.
    Inventors: Jean-Paul Germain, Steve Shannon
  • Patent number: 8048252
    Abstract: The present subject matter relates to a method which includes positioning a bottom and top polymeric separator sheet on a working surface, with a substantially planar battery anode disposed therebetween; applying a pressure and an electrical current to a cutting and welding tool such that top and bottom polymeric separator sheets are welded into a bag and such that the bag is excised from the top and bottom separator sheets, with the battery anode disposed in the bag; stacking the battery anode and at least one cathode into a battery stack; and disposing the battery stack into a battery case having at least one feedthrough, with a first terminal connected to the battery stack through the at least one feedthrough, and with the battery case filled with an electrolyte, wherein the protrusion is defined by laser cutting the cutting and welding tool, machining the cutting and welding tool, or photochemical etching the cutting and welding tool.
    Type: Grant
    Filed: May 10, 2010
    Date of Patent: November 1, 2011
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Paul Machacek, Adam J. Morgan, Benjamin J. Haasl
  • Publication number: 20110048633
    Abstract: Providing an anodic bonding method capable of suppressing uneven quality between the central and outer sides of a bonding surface being anodically bonded.
    Type: Application
    Filed: August 26, 2010
    Publication date: March 3, 2011
    Inventor: Kiyoshi Aratake
  • Publication number: 20100298668
    Abstract: The present invention provides for safe and reliable electronic circuitry that can be employed in ingestible compositions. The ingestible circuitry of the invention includes a solid support; a conductive element; and an electronic component. Each of the support, conductive element and electronic component are fabricated from an ingestible material. The ingestible circuitry finds use in a variety of different applications, including as components of ingestible identifiers, such as may be found in ingestible event markers, e.g., pharma-informatics enabled pharmaceutical compositions.
    Type: Application
    Filed: August 13, 2009
    Publication date: November 25, 2010
    Inventors: Hooman Hafezi, Eric Snyder, Benedict Costello
  • Publication number: 20100288525
    Abstract: An apparatus that comprises an electronic device package 102. The package includes an electronic device 105 on a first planar substrate 110, and, a second planar substrate 112 bonded to the first planar substrate so as to form an interior chamber 115 housing the electronic device. The package includes a plurality of electrically conductive pins 120, each of the pins passing through a hole 125 in one of the first and second planar substrates. A first end 130 of each pin is located in the interior chamber and is electrically coupled to the electronic device. A second end 132 of each pin is located on an exterior side 135 of the one of the first and second substrates. An inorganic sealant 140 surrounds at least one of the first end or the second end for each of the pins.
    Type: Application
    Filed: May 12, 2009
    Publication date: November 18, 2010
    Applicant: Alcatel-Lucent USA, Incorporated
    Inventors: Nagesh Basavanhally, Christopher DW. Jones
  • Patent number: 7834292
    Abstract: A method is provided for welding a laminated metal sheet to a workpiece. The laminated metal sheet includes an outer metal sheet and an inner metal sheet bonded together by a polymer material that impedes the flow of weld current. A punch is applied against the outer metal sheet and driven through the laminated metal sheet to create a hole and also create an annular metallic burr that bridges across the polymer material layer between the outer metal sheet and the inner metal sheet. A weld electrode is positioned against the outer metal sheet at the punched hole and weld current is conducted through the first annular metallic burr to create an electric resistance weld between the laminated metal and the workpiece.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: November 16, 2010
    Assignee: GM Global Technology Operations, Inc.
    Inventors: Pei-Chung Wang, Robert J. Gollehur
  • Publication number: 20100236706
    Abstract: The invention provides a method of fastening lamellae of a lamellar material that is at least partially conductive onto an insulating substrate (2) containing oxides that are suitable for dissociating into mobile ions of given charge and stationary ions of opposite charge, the method comprising the steps of: placing a sample (1) of the lamellar material against a surface of the substrate; causing the oxides of the substrate to dissociate; and subjecting the substrate and the sample to an electric field by means of an electrode in contact with the substrate and an electrode in contact with the sample.
    Type: Application
    Filed: October 3, 2008
    Publication date: September 23, 2010
    Applicants: UNIVERSITE PIERRE ET MARIE CURIE (Paris 6), CENTRE NATIONAL DE LA RECHERCHE SCIENTIFQUE
    Inventors: Abhay Shukla, Javed Mazher
  • Publication number: 20100206475
    Abstract: Provided is an anode bonding method by which a silicon substrate and a glass substrate are well anodically bonded without generating positional shift, even when an electrode cannot be arranged on a surface on the opposite side to a bonding surface of a glass substrate and the bonding surface is large. The method for anodically bonding the glass substrate and the silicon substrate is provided with a step of placing on the glass substrate the silicon substrate whereupon a through hole is arranged; a step of bringing the anode electrode into contact with the surface of the overlapped silicon substrate opposite to the surface facing the glass substrate, and bringing an cathode electrode into contact with the glass substrate through the through hole arranged on the silicon substrate; and a step of applying a direct current voltage to the anode electrode and the cathode electrode in a state where the glass substrate and the silicon substrate are heated.
    Type: Application
    Filed: August 29, 2008
    Publication date: August 19, 2010
    Inventor: Nobuhiro Ueno
  • Publication number: 20100193664
    Abstract: This invention relates seed layers and a process of manufacturing seed layers for casting silicon suitable for use in solar cells or solar modules. The process includes the step of positioning tiles with aligned edges to form seams on a suitable surface, and the step of joining the tiles at the seams to form a seed layer. The step of joining includes heating the tiles to melt at least a portion of the tiles, contacting the tiles at both ends of at least one seam with electrodes, using plasma deposition of amorphous silicon, applying photons to melt a portion of the tiles, and/or layer deposition. Seed layers of this invention include a rectilinear shape of at least about 500 millimeters in width and length.
    Type: Application
    Filed: January 28, 2010
    Publication date: August 5, 2010
    Applicant: BP Corporation North America Inc.
    Inventor: Nathan G. Stoddard
  • Patent number: 7718027
    Abstract: The present subject matter relates to a method which includes positioning a bottom and top polymeric separator sheet on a working surface, with a substantially planar battery anode disposed therebetween; applying a pressure and an electrical current to a cutting and welding tool such that top and bottom polymeric separator sheets are welded into a bag and such that the bag is excised from the top and bottom separator sheets, with the battery anode disposed in the bag; stacking the battery anode and at least one cathode into a battery stack; and disposing the battery stack into a battery case having at least one feedthrough, with a first terminal connected to the battery stack through the at least one feedthrough, and with the battery case filled with an electrolyte, wherein the protrusion is defined by laser cutting the cutting and welding tool, machining the cutting and welding tool, or photochemical etching the cutting and welding tool.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: May 18, 2010
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Paul Machacek, Adam Morgan, Benjamin J. Haasl
  • Publication number: 20090320991
    Abstract: The invention relates to novel methods of incorporating nanotubes for use in micro- or nano-devices. The invention further relates to incorporating nanotubes in micro or nano-devices and particularly synthesizing or growing nanotubes directly in or on components of a micro- or nano-device. In a particular embodiment, the invention relates to methods of synthesizing or growing nanotubes in a gas chromatography column and their use in portable gas chromatography devices.
    Type: Application
    Filed: September 30, 2005
    Publication date: December 31, 2009
    Inventors: Paul Boyle, David Ruiz-Alonso, Andrew Koehl, Martyn Rush, Russell Parris, Ashley Wilks
  • Patent number: 7591920
    Abstract: Techniques for bonding substrates are disclosed. According to one aspect of the techniques, an index bonding is provided to ensure that non-flatness of substrates is compensated when two substrates are bonded together so as to minimize possible dynamic imbalance of a disc. According to another aspect of the techniques, a dynamic alternating electric field bonding is provided to eliminate bubbles from a type of glue used to bond two substrates, wherein a power source is used to generate a dynamic alternating electromagnetic field in accordance with the substrates and/or the characteristics of the glue.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: September 22, 2009
    Assignee: Dongguan Anwell Digital Machinery Co., Ltd.
    Inventors: Kal Leung Fan, Ming Sang Yeung
  • Patent number: 7586071
    Abstract: An RF welder, and a method of operation thereof, is disclosed that has circuitry that automatically affects system impedance so that, throughout the welding or embossing cycle, a generator is capable of delivering the same power to a die and fabric, and cabling is capable of dissipating a load that is less than a preselected amount.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: September 8, 2009
    Inventors: Mark Gruenspecht, Timothy Hopper
  • Publication number: 20090053131
    Abstract: Provided is a MgO single crystal for obtaining a magnesium oxide (MgO) single crystal deposition material which is prevented from splashing during the vapor deposition in, e.g., an electron beam deposition method without reducing the deposition rate, and for obtaining a MgO single crystal substrate which can form thereon, e.g., a superconductor thin film having excellent superconducting properties. A MgO single crystal having a calcium content of 150×10?6 to 1,000×10?6 kg/kg and a silicon content of 10×10?6 kg/kg or less, wherein the MgO single crystal has a variation of 30% or less in terms of a CV value in detected amounts of calcium fragment ions, as analyzed by TOF-SIMS with respect to the polished surface of the MgO single crystal. A MgO single crystal deposition material and a MgO single crystal substrate for forming a thin film obtained from the MgO single crystal.
    Type: Application
    Filed: March 24, 2006
    Publication date: February 26, 2009
    Applicant: TATEHO CHENMICAL INDUSTRIES CO., LTD.
    Inventors: Atsuo Toutsuka, Yoshifumi Kawaguchi, Masaaki Kunishige
  • Publication number: 20090032183
    Abstract: Disclosed is a mandrel for use in Radio Frequency welding, wherein the mandrel comprises first and second conductive portions separated by an insulating material, such that different potentials may be applied to the first and second conductive portions. Also disclosed is a method of RF welding and a method of manufacturing a mandrel.
    Type: Application
    Filed: March 9, 2007
    Publication date: February 5, 2009
    Applicant: BMG DESIGNS LIMITED
    Inventors: Leslie Gilligan, Craig Miles, Grayam Miles, Alan Burke
  • Patent number: 7479202
    Abstract: Techniques for producing optical medium that can be read at substantially high speeds with greater stability and accuracy are disclosed. According to one aspect of the techniques, a bonding station is employed with what is referred to as a bubble-free bonding technique that may or may not be incorporated with an index bonding technique. The index bonding is provided to ensure that non-flatness of substrates is compensated when two substrates are bonded together so as to minimize possible dynamic imbalance of a disc. The bubble-free bonding technique is provided to generate an alternating electromagnetic field that eliminates bubbles from a type of glue used to bond two substrates, wherein a high voltage source is used to generate the alternating electromagnetic field of a predefine magnitude.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: January 20, 2009
    Assignees: Anwell Precision Technology (HK) Limited, Dongguan Anwell Digital Machinery Co., Ltd.
    Inventors: Kai Leung Fan, Ming Sang Yeung
  • Publication number: 20080047366
    Abstract: There is provided a method for producing a force sensor including: a force sensor chip; and an attenuator, in which the force sensor chip and the attenuator are joined at joint portions with a glass layer sandwiched therebetween. The method includes: a film forming step in which a glass film as the glass layer is formed on regions of the attenuator containing the joint portions or on regions of the force sensor chip containing the joint portions; and an anodic bonding step in which the force sensor chip and the attenuator are stacked as a stacked body in close contact with each other at the joint portions, and the glass film and the force sensor chip, or the glass film and the attenuator, are joined.
    Type: Application
    Filed: August 23, 2007
    Publication date: February 28, 2008
    Inventors: Nariaki Kuriyama, Jun Sasahara, Tadahiro Kubota, Daisuke Okamura, Takeshi Ohsato
  • Patent number: 7300536
    Abstract: A method is provided for attaching together a larger tube and a smaller tube in a T-shaped intersecting joint. A hole is formed in the larger tube with a flange surrounding the hole. A circumferential extending flange is formed on the outside of the smaller tube. Adhesive is placed on either the outside of the smaller tube or the inside of the flange of the larger tube. The smaller tube is inserted into the hole in the larger tube so that the adhesive is interposed between the inside of the flange of the larger tube and the outside of the smaller tube and the flange on the outside of the smaller tube comes into electrical conducting contact with the flange of the larger tube. Electrical current is applied to flow between the large tube and the small tube so that electrical resistance heating is obtained to cure the adhesive.
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: November 27, 2007
    Assignee: GM Global Technology Operations, Inc.
    Inventors: Pei-Chung Wang, John D. Fickes, Charles J. Bruggemann, Sanjay M. Shah, Joseph M. Lendway, IV
  • Publication number: 20070137780
    Abstract: A method of fabricating a micro actuator is provided including a media stage having a media loading surface and a coil for driving the media stage, formed on the opposite surface of the media stage to the media loading surface. The method includes forming a groove on a first surface of a first substrate, forming a coil on a first surface of a second substrate, bonding the first surface of the first substrate to the first surface of the second substrate, and forming the media loading surface on a second surface of the second substrate, which is opposite the first surface of the second substrate.
    Type: Application
    Filed: November 13, 2006
    Publication date: June 21, 2007
    Inventors: Hong-sik Park, Seung-bum Hong, Jong-youp Shim
  • Patent number: 7220950
    Abstract: An RF welder is disclosed that has circuitry that automatically affects system impedance so that, throughout the welding or embossing cycle, a generator is capable of sending energy through die and fabric at a predetermined frequency and cabling is capable of dissipating a load that is less than a preselected amount.
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: May 22, 2007
    Inventors: Mark Gruenspecht, Timothy Hopper
  • Patent number: 7115182
    Abstract: A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed over the first conductive layer. A second conductive layer is formed over the lower surface of the second ceramic component. The second ceramic component is stacked over the first ceramic component wherein the second conductive layer on the second ceramic component opposes the intermediate film on the first component. The first and second ceramic components are anodically bonded together.
    Type: Grant
    Filed: June 15, 2004
    Date of Patent: October 3, 2006
    Assignee: Agency for Science, Technology and Research
    Inventors: Jun Wei, Stephen Chee Khuen Wong, Sharon Mui Ling Nai