Abstract: A method uses a three-dimensional, woven preform to assemble two components, the preform having at least a pair of legs extending from a base. The woven preform is infused with a resin, and at least one surface of one of the components is bonded to the legs of the preform using the resin within the preform. The other of the components is then attached to the preform by adhering the component with the resin in the preform. The preform is squeegeed into place, ensuring that air pockets are eliminated and a continuous bond line is created. Resin systems providing for oven or room-temperature curing may be used.

Abstract: The subject invention pertains to an aqueous primer for use on metal surfaces to which a composite or a metal adherend is bonded. The primer composition includes an aqueous dispersion of: (a) at least one thermosetting resin curable at an elevated temperature; (b) at least one organosilane, each said organosilane containing at least one hydrolyzable group; and (c) a curing agent. The aqueous primer composition contains substantially no volatile organic solvent, is environmentally superior to solvent-based primers, is storage stable, exhibits excellent solvent resistance and performs without loss of physical properties.

Abstract: A bonded laminate structure which is obtainable by bonding a PBN layer (or PBT layer) to a thermoplastic resin layer without the use of an adhesive material. The bonded laminate structure comprises: a first layer comprising at least one of polybutylene naphthalate (PBN) and polybutylene terephthalate (PBT) as an essential component and having a surface subjected to an electric discharge treatment such as a plasma treatment; and a second layer comprising an amine-rich resin as an essential component and bonded to the surface of the first layer.

Abstract: A multiple cure adhesive (204) is used to secure a circuit substrate (104) to an underlying rigid surface (106). The adhesive is screen printed on the underlying surface. A first cure is then applied to the adhesive to at least partially cure the adhesive and to make the adhesive tacky. The circuit substrate is mounted on the tacky adhesive and a second cure is applied to the adhesive to firmly secure the circuit substrate to the housing. By screen printing the adhesive on the underlying surface, the process of mounting a circuit substrate on a rigid surface can be completely automated, providing cost saving and waste reduction.

Abstract: A method of preparing a cured laminate employing electron beam radiation is provided. The cured laminate is prepared from an uncured laminate including a prepolymer composition containing oligomer, tackifying resin, and optionally, monomer. Also provided are a prepolymer composition and an article including the cured laminate prepared by the method of this invention. The method is useful for preparing cured laminates such as flexible laminates for food packaging.

Abstract: An applicator of heat-reactive adhesive-impregnated tape has a pair of side-by-side, spaced-apart wheels which carry an endless belt. A support mechanism holds the belt against a moving sheet of material that the tape is being applied to. A tape dispenser heats the tape to melt its adhesive and feeds the heated tape onto the sheet of material. The tape travels with the sheet of material under the belt and the belt presses the tape into contact with the sheet of material. The distance between the wheels is such that the belt is in contact with the tape until the adhesive is completely cured.

Abstract: A heat tack application involves arranging an adhesive between a strand of conductive material and a strand of insulation material; applying a temperature of about 100-300° C. and a pressure of about 5-100 psi for about 5-120 seconds to tack the adhesive. A stack can thereby be formed, and a plurality of stacks assembled to form a nascent rotor coil that is subsequently arranged in a rotor slot. An applied temperature of about 100-500° C. and a pressure of about 100-1,500 psi can fully cure the adhesive after the coil is arranged within the rotor slot. Depending on the context of use, the conductive material may more generally be a first component, and the insulation material may more generally be a second component.

Abstract: A method of fabricating a decorative wood article includes the steps of applying a decorative overlay onto at least one surface of a wood article, applying a radiation curable powder coating onto the outer surface of the overlay, heating the applied radiation curable powder coating at a temperature sufficient to melt and flow the powder coating, and exposing the applied powder coating to radiation energy to cure the powder coating and form a film on the outer surface of the decorative overlay.

Abstract: To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.

Abstract: Acrylic polymer compositions with crystalline side chains are disclosed. Solution polymerization, aqueous suspension polymerization, and aqueous dispersion polymerization processes for the preparation of the acrylic polymer compositions with crystalline side chains are also disclosed. Methods of use for the acrylic polymer compositions with crystalline side chains, including dry powder coatings; wax replacements in floor polishes and wood coatings; nonwoven and textile coatings; adhesives; and hot melt adhesives are also disclosed.

Abstract: The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device and breakage of the interconnections when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of the substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load in comparison with structures using conventional anisotropic conductive films and the like, so that heat-press bonding mounting with a high productivity and a low cost can be applied.

Abstract: A method of manufacturing circuit board comprising: holding a laminate with metal foil or resin-coated metal foil disposed on both surfaces or on one surface of board material or board material with metal foil circuit formed thereon between metal plates, and applying at least one of heat and pressure to the laminate. A hard coat layer formed on both surfaces or on one surface of the metal plate protects the metal plate. Accordingly, the metal plate is hardly scratched by its contact with the conveyor and the like or by handling by the operator during the production of the circuit boards. Further, since the hard coat layer surface is smoothly finished, resin or contamination sticking to the metal plate can be easily removed, thereby prolonging the life of the metal plate. As a result, it is possible to produce high-quality circuit boards at low costs.

Abstract: The present invention provides a method and apparatus for a multilayer optical articles. A method comprises forming a first multilayer article with a first substrate, first adherent, and second substrate using a first holder and a second holder. The method further comprises forming a second multilayer article with the first multilayer article, a second adherent, and a third substrate using the first holder and second holder to grasp the second multilayer article. After removal of the first and second holders, the first and second adherent maintains the second multilayer article in a posture at which the second multilayer article was held by the first and second holders, wherein the first and second adherent comprise a photopolymer such that the article is capable of storing data in a reflective holographic data storage system.

Abstract: The method of producing a two-disc laminated optical video disc, includes first forming, on a first substrate, a first reflecting film capable of partially reflecting and partially transmitting a laser beam. Next on a second substrate, a second reflecting film is formed having a reflectance higher than that of the first reflecting film. A liquid ultraviolet-setting resin is applied to the first reflecting film and/or the second reflecting film. The above treated first substrate and the second substrate are bonded together, with a light-transmissible middle layer interposed therebetween. The liquid ultraviolet-setting resin is solidified by means of an ultraviolet light directed from below the first substrate.

Abstract: Cured ethylene terpolymer attaches a film to the metal surface of a condensing heat exchanger of a condensing furnace to prevent corrosion of the condensing heat exchanger. After applying a layer of ethylene terpolymer to the metal surface of the condensing heat exchanger, a film is positioned on the layer. Water reacts with the organosilicone functional groups on the ethylene terpolymer chain, cross-linking the organosilicone functional groups and adhering the film to the surface of condensing heat exchanger. The water is provided in the film or is added by an external source. Preferably, the film is polar to encourage adhesion of the water to the film and encourage cross-linking of the organosilicone functional groups.

Abstract: A dielectric structure, and an associated method of fabrication, wherein two fully cured photoimageable dielectric (PID) layers of the structure are nonadhesively interfaced by a partially cured PID layer. The partially cured PID layer includes a power plane sandwiched between a first partially cured PID sheet and a second partially cured PID sheet. The partially cured PID layer be formed either in isolation, or by successively forming upon one of the fully cured PID layers: the first partially cured PID sheet, the power plane, and the second partially cured PID sheet. The first partially cured PID sheet and the second partially cured PID sheet is the result of partially curing, by radiative exposure, a first uncured PID sheet and a second uncured PID sheet, respectively. The fully cured PID layers each include an internal power plane, a plated via having a blind end conductively coupled to the internal power plane, and a plated via passing through the fully cured PID layer.

Abstract: An antireflection film and method of making same includes a substrate having a first surface and a second surface, an inorganic layer deposited on the first surface of the substrate, and an optically active polymer layer formed by curing a curable composition in situ on the inorganic layer, the polymer layer having a refractive index not greater than about 1.53 over the wavelength range of 400 nm to 700 nm and a thickness of from about 20 nm to about 200 nm, and an adhesive layer deposited on the second surface of the substrate.

Abstract: This invention relates to methods of making visually uniform, light transmitting panels and to the resulting panels, which include a cellular core sandwiched between two light transmitting sheets and possess improved light transmitting characteristics.

Abstract: A method for making a metal-clad laminate product including: providing a carrier film; depositing directly onto the carrier film a release agent layer, the release agent layer comprising an aqueous soluble polymer; forming a conductive metal layer on the release agent layer, the metal layer having a thickness of less than about 10,000 Angstroms; bonding the metal layer to a circuit board laminate layer; and removing the carrier film from the metal layer by peeling the carrier layer from the release agent layer.

Abstract: The liner provided metallic shell having an outer-facing surface and an inner-facing surface, said inner-facing surface including a cured enamel coating thereon comprising a solids mixture of an epoxy resin, a phenolic resin, carboxypolyolefin resin and polyester resin; and a shaped thermoplastic elastomer member adhered to said enamel inner surface.

Abstract: A high Tg acrylic polymer is provided as well as an epoxy-blend thereof for use as a pressure sensitive adhesive. The high Tg acrylic polymer comprises a copolymer of an alkyl (meth)acrylate monomer having a Tg>20° C., a C1-30 (meth)acrylate monomer, an nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the polymer having a Tg>50° C. When blended with an epoxy resin, the resulting mixture exhibits desirable pressure sensitive adhesive properties and may be thermocured.

Abstract: The invention provides protective articles comprising a backing that comprises a fluorinated polymer and a curable adhesive on at least one layer of the backing. The protective articles of the invention may be used to provide substrates or articles of the invention having a fluorinated surface. The invention also provides methods of preparing such articles, methods of repairing appliqués, and methods of edge sealing appliqués.

Abstract: A bonded part such as a rubber to metal bonded part and process for producing a bonded part including a rubber and metal part, and particularly for producing an automotive torsional vibration damper, comprising the steps of placing uncured elastomer composition comprising an elastomer, at least one curative, and preferably, at least one rubber-to-metal adhesive adjuvant into a shape-forming mold, and curing the elastomer in two stages, wherein in the first curing stage the elastomer composition is less than fully cured and in the second curing stage, preferably performed with the elastomer composition in contact with a metal surface of the rubber and metal part, the elastomer composition is at least substantially fully cured. According to one embodiment, the present invention allows for the elimination of the step of applying an adhesive to the metal surface prior to application of the elastomer composition.

Abstract: A process for seaming seamed component for use in seaming members useful in electrostatographic, contact electrostatic, digital and other like machines, including: a) compounding an adhesive; b) forming the adhesive in contact with a first side of the seam and the mutually mating members; c) contacting the adhesive and first side of the seam to a first heated clamp; d) contacting the second side of the seam to a second heated clamp; e) subjecting the adhesive in contact with the mutually mating members to a first cure at a first temperature to form a cured adhesive; and f) subjecting the cured adhesive to a second cure at a second temperature to form a dual-cured adhesive, wherein the second temperature is higher than the first temperature.

Abstract: Non-flammable, fibrous-siloxane cured composites derived from the polymerization of dialkoxysilanes, trialkoxysilanes and tetraalkoxysilanes, in an aqueous medium, to obtain viscous polysiloxane resins. These siloxane resins are used to impregnate or coat various fibrous materials such as carbon fibers or glass cloth which are subsequently subjected to heat and pressure to form cured, non-flammable siloxane-impregnated composites e.g. panels having a density of about 1 to 3 g/cc. and a limited oxygen index above 30. These non-flammable, fibrous-siloxane composites are particularly useful in the manufacture of fire-proof materials for various transportation vehicles and for building materials e.g. panels as a fire barrier.

Abstract: The present invention provides a method of making a laminated, gathered, elastic web. The method includes the steps of feeding a first substrate in a machine direction, feeding a second substrate aligned with the first substrate in the machine direction, and feeding an array of elastomeric strand material between the first and second substrates in such a manner that the elastomeric strand material is stretched in the machine direction and aligned with the first and second substrates. A hot melt pressure sensitive adhesive, such as a styrene-isoprene-styrene based adhesive, is applied to one substrate, and a curable adhesive, such as a polyurethane based adhesive, is applied to the other substrate. Thereafter, the two substrates and the elastomeric strand material are compressed to form a laminate elastic web while maintaining the elastomeric strand material in its stretched state. Machine direction tension is maintained on the laminate until the hot melt adhesive cools and bonds the layers together.

Abstract: An antireflection coating includes one or more inorganic antireflection layers (typically metal oxide or silica layers) and a polymer layer cured in situ, the polymer layer having a refractive index not greater than about 1.53 over the wavelength range of 400 to 700 nm and a thickness of from about 20 to about 200 nm. The polymer layer provides good scratch and fingerprint protection, and also enables the thicknesses of the inorganic antireflection layers to be reduced, thereby reducing the cost of the coating.

Abstract: A photocurable adhesive composition is disclosed which includes a photocurable adhesive and an effective amount of a ceramic-containing modifier which does not substantially reduce a photocure rate of the photocurable adhesive. The modifier alters the flow properties of the composition to facilitate controlled dispensing of the uncured adhesive composition. The modifier alters the thermal expansion properties of the cured composition to reduce bondline stress. The preferred modifier includes inert, alkali alumino-silicate microspheres. A method of adhesive bonding is also disclosed in which an adherend is adhered to a substrate using a photocurable adhesive composition containing a photocurable adhesive and microspheres.

Abstract: The present invention includes a method of reducing slippage between a mat having a flexible polymer back surface and a second surface contiguous to the back surface, the method comprising applying a liquid comprising an aqueous solution of poly(vinyl acetate) to the back surface and contacting the back surface with the liquid thereon to the second surface while the aqueous solution is still wet. The method is especially effective where the mat comprises a flexible polymeric back surface comprising a flexible polymer selected from the group consisting of natural rubber, synthetic rubber, natural elastomers and synthetic elastomers. The contacting may be performed before the aqueous solution is completely dried. The aqueous solution may be applied directly to the back surface or directly to the back surface by spraying said aqueous solution onto said the surface. The aqueous solution may applied directly to the second surface, also possibly by spraying.

Abstract: A composite polyurethane foam structure and method of preparing the composite structure, which structure includes a semirigid-rigid polyurethane foam layer having bonded, free, unreacted, ethylenically unsaturated groups like allyl or acrylic groups. The structure includes a cured, unsaturated resin composition layer which is chemically bonded to one or both surfaces of the polyurethane foam layer through the polymerization of the allyl or acrylic group in the foam surface with the polyester resin composition.

Abstract: A composite article comprising a fluoropolymer directly bonded to a silicone-containing polymer is provided. The fluoropolymer is capable of providing a reactive site either through dehydrofluorination or by incorporating a reactive monomer in the fluoropolymer.

Abstract: A method for manufacturing an optical device is disclosed. The method includes coating a substrate with a resin thin layer, wherein temperature of the resin thin layer is controlled lower than a polymerization reaction starting temperature thereof and the resin is not substantially polymerized, heating the resin thin layer to a temperature higher than polymerization reaction starting temperature and glass-transition temperature but lower than a thermal decomposition starting temperature of the resin so that the resin thin layer is polymerized on the substrate to form a resin thin film thereon, pressing a stamp having an inverted micro-asperity pattern against the resin thin film such that a micro-asperity pattern is formed on a surface of the resin thin film; cooling the resin thin film to a temperature lower than the glass-transition temperature; and separating the stamp from the resin thin film.

Abstract: A method of laminating two substrates by coating at least one side of a substrate with a laminating adhesive, bringing a coated side of the substrate into contact with a second substrate to form a three layer film, and treating the three layer film with a free radical initiator. The laminating adhesive is formed by mixing an ethylenically unsaturated acid, a bis-silane and a polyamine, and the polyamine optionally can have a crosslinker reacted therein.

Abstract: A method for manufacturing a thin metal film with an embossed pattern, which enables the precise transfer of the embossed pattern and generates a strong interference color is provided. An embossing belt 10 having an embossed pattern formed on one surface thereof is coated with a thermosetting transparent resin 12. The transparent resin 12 is dried and cured and is coated with PVA which is sintered to form a PVA layer 20, whereby the transfer of the embossed pattern is completed. After that, the transparent resin 12 with the PVA layer 20 bonded to the surface opposite to the embossed pattern is peeled from the embossing belt 10 and reeled in, and an aluminum layer 24 is deposited on the surface of the belt 10 on which the embossed pattern is formed. The aluminum layer 24 is coated with another transparent resin and the PVA layer 20 is removed through a dissolving step. Resulting resin layers are pulverized to create a hologram pigment.

Abstract: A non-woven mat useful for a wide variety of purposes, including forming reinforced resin products, is produced in a manner having different specific uses of, and advantages over, conventional chopped strand mats and conventional glass tissue. The mat is preferably made by the foam process (but may be made by the liquid process), and at speeds well in excess of 60 m./min., and has a substantially uniform construction even when low density (e.g. 100 g/m2 or less). At least 20% (preferably at least 85%) of the fibers are in fiber bundles with between 5-450 fibers/bundle. The fibers (typically at least 85%) have a length between 5-100 mm, preferably 7-50 mm, substantially the same as the length of the fiber bundle they are in. The fibers are preferably held in the bundles by substantially non-water soluble sizing, such as epoxy resin or PVOH. The fibers in the bundles typically have diameters of approximately 7-500 microns, preferably about 7-35 microns.

Abstract: In accordance with the present invention, adhesive formulations have been developed which enable curing of adhesively bonded assemblies (i.e., assemblies which comprise devices which have been adhesively bonded to substrates) with dramatically reduced occurrence of void formation upon curing. In many instances, void formation can be eliminated employing invention compositions. In accordance with another aspect of the present invention, methods employing the above-described adhesive formulations are also provided, as are substantially void-free articles produced thereby.

Abstract: A process for adhering a layer of organic paint to the surface of a glass sheet, and the products produced thereby. The process comprises applying a layer of a water-based silicate paint to the surface of the glass sheet, heating to cure the paint, forming the glass sheet into a shape, sensitizing the water based paint with a layer of silane material, applying a layer of organic paint over the layer of sensitized water-based silicate paint, and curing the organic paint to provide organic paint adhered to the glass surface.

Abstract: A method of making a lightweight hose assembly (10) of the type adapted for carrying fuels and other corrosive fluids. The method includes the steps of extruding an inner tubular liner (12) of a fluorocarbon material. Glass fibers are then braided about the exterior of the liner (12) to form a braided layer (13). The inner tubular liner (12) and braided layer (13) are then passed through a reservoir containing a dispersion including a fluorocarbon polymer material, carrying agent, and surfactant therein. The surfactant distributes the fluorocarbon material throughout the braided layer (13) and about the inner liner (12). Subsequently, the assembly (10) is heated to remove the carrying agent and surfactant therefrom. The assembly (10) is then sintered to cure the fluorocarbon polymer material into a coating (14) dispersed throughout the braided layer (13) and about the inner liner (12).

Abstract: The objective of the present invention is to provide method and apparatus for manufacturing an intermediate transfer belt and a fixing belt with high quality used in copying machines, printers and the like.

Abstract: A method for manufacturing discs by bonding two disc substrates using a cationic polymerization type ultraviolet curable composition as an adhesive to produce a disc. The method includes the steps of: applying the cationic polymerization type ultraviolet curable composition onto a part of an adhering surface of one of the two disc substrates; radiating ultraviolet light onto the cationic polymerization type ultraviolet curable composition; bonding the disc substrate to the other disc substrate via the cationic polymerization type ultraviolet curable composition which has been irradiated by the ultraviolet light; and spreading the cationic polymerization type ultraviolet curable composition which is present between the two disc substrates.

Abstract: A method and system of manufacturing an air bag cover assembly utilizing infrared radiation is disclosed. The assembly includes a front panel, a back plate, a switch and infrared-absorbing material. Initially, the front panel and the back plate are positioned so that inner surfaces of the front panel and the back plate define a switch pocket therebetween. Then the switch is positioned in the switch pocket. Thereafter, infrared radiation is directed at the infrared-absorbing material for a time sufficient to heat the infrared-absorbing material to a desired temperature. The amount of heat applied to the infrared-absorbing material by the infrared radiation is controlled by a controller. Finally, the heated material cools to fixedly secures the back plate to the front panel. The heated material may be forced to flow prior to cooling.

Abstract: The present invention provides a front plate for plasma display panels with the transparent substrate, electroconductive member and optical film fast adhered to each other, easily produced by a simple process, and excellent in productivity. The present invention further provides a method of producing the same. The present invention provides a front plate for plasma display panels comprising a transparent substrate laminated, at least on one side, with an electroconductive member and at least one type of optical film to form a monolithic structure, wherein (a) two types of adhesive layers of tackifier layer and heat-bond film are orderly placed between the optical film as the outermost layer and the adjacent member, and (b) the transparent substrate, electroconductive member and at least one type of optical film are pressed under heating.

Abstract: A semiconductor chip carrier assembly which includes a flexible substrate having a metallicized path on one of its surfaces in electrical communication with a semiconductor chip. A stiffener is disposed adjacent to said flexible substrate and is bonded thereto by an adhesive composition. The adhesive composition which comprises a microporous film laden with a curable adhesive is disposed between the flexible substrate and the stiffener. A cover plate is adhesively bonded to the semiconductor chip and to the stiffener. A process of making the assembly involving disposition of the flexible substrate in a vacuum fixture upon which the adhesive composition and stiffener is placed followed by the application of heat and pressure to cure the curable adhesive is also described.

Abstract: A method of forming a laminate for use in the production of printed circuit boards, comprising the steps of: a) forming a component comprised of a sheet of copper foil and a sheet of metal, the sheet of copper foil having an essentially uncontaminated surface facing an essentially uncontaminated surface of the sheet of metal, the surfaces of the sheets being in unattached contact with each other in an area that defines a substantially uncontaminated zone; b) applying a preformed adhesive film formed of a substantially uncured polymeric material onto an exposed surface of the copper foil, the adhesive film having a first surface and a second surface, the film being attached to the component with the first surface in contact with an exposed surface of the copper foil; and c) curing the adhesive film, wherein the second surface of the adhesive film is at least partially uncured.

Abstract: A lightweight, three dimensional structural article having low radar reflectivity characteristics and good mechanical properties is fabricated from a syntactic foam core having a structural outer skin. A syntactic foam sealing adhesive film is applied to the surface of syntactic foam core and under the outer skin to both seal the foam core and adhere the outer skin. The syntactic foam sealing adhesive is formulated to provide a uniform layer and to reduce the fabrication time and labor while improving the overall radar absorbing characteristics of the structural article.

Abstract: A gasket is provided on a porous sheet in one body. The gasket is thin and has an excellent sealability, and processability when the gasket is built in layer-built fuel cells The gasket is made of liquid rubber and has a hardness not more than 60 (JIS A). Liquid perfluoro rubber and liquid silicone rubber is preferably used for the gasket. And gasket can be made by injection molding.

Abstract: An epoxy-based soldering flux is used to solder a flip-chip IC device to a metallic bond site on a substrate material. The soldering flux is composed of a thermosetting epoxy resin and a cross-linking agent with inherent flux activity. When heated the cross-linking agent cleans the metal oxides from the metal surfaces on the chip and then reacts with the epoxy resin to form a thermosetting epoxy residue. The flux residue left on the board after soldering does not inhibit the flow of an underfill encapsulant. The underfill binds to the thermosetting residue of the flux which increases adhesion strength preventing delamination of the chip during thermal cycling.

Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.

Abstract: The present invention provides an adhesive comprising a polyester polyol or polyurethane polyol possessing structural units represented by the following general formula (I) within its molecular structure, and an organic polyisocyanate in which the isocyanate groups may be protected: wherein R1 and R2 are the same or different and each represents lower alkyl. The adhesive of the present invention exhibits an excellent initial adhesion strength; and provides adhered objects that exhibit an excellent permanent adhesion strength, hot water resistance, flexibility, flexibility at a low temperature, and fatigue resistance, and is useful in adhering plastic, metal, and the like. In addition, the present invention provides a method of mixing the aforementioned components and using the mixture for adhesion, and a use of the mixture of the aforementioned components.

Abstract: A method is provided to assemble flip chips to an electronic circuit using a printable anisotropic conductive adhesive or paste. The invention is especially useful to assemble flip chips or other components to an array of circuits provided within a large area format. The circuits in a preferred embodiment are disposable radio frequency identification devices (RFID) or Smart Cards.