Sequential Heating And Cooling During Pressure Applying Patents (Class 156/311)
  • Patent number: 6881287
    Abstract: An area where a liquid substance, for instance, is present inside a bag, that is, the area where the liquid substance adheres to the inner surface of the bag, is ultrasonically sealed (thus forming an ultrasonically sealed area), and then an area that is separated from the ultrasonically sealed area by a predetermined distance toward the edge of the mouth of the bag is heat-sealed (thus forming a heat-sealed area), so that the a portion of the liquid substance, that is separated and is present above the ultrasonically sealed area, is sealed inside the space between the two sealed areas.
    Type: Grant
    Filed: February 11, 2003
    Date of Patent: April 19, 2005
    Assignee: Toyo Jidoki Co., Ltd.
    Inventor: Masanori Yasuhira
  • Patent number: 6881929
    Abstract: A portable heat sealer for sealing heavy grade thermoplastic films comprises a plurality of adjacent, segmented heating elements positioned along the underside of a heated sealing bar. The segmented heating elements are under the control of a microprocessor for controlling the energy applied to the heated sealing bar to avoid the formation of hot spots and to obtain a strong seal. Each heating element is maintained in firm contact with the heated sealing bar by means of a tension spring. A thermoplastic film bag is placed on the heated sealing bar and a movable sealer jaw is lowered on top of the bag. A jaw switch is activated by the sealer jaw which turns-on power to the heat sealer. A latch 32 attaches to a clip on the end of the sealer jaws and secures the sealer jaw in place. Pilot lights are provided to indicate to an operator the cycles of “ready”, “heat” and “cool”.
    Type: Grant
    Filed: April 23, 2003
    Date of Patent: April 19, 2005
    Assignee: Idolon Technologies
    Inventor: George B. Hovorka
  • Patent number: 6833180
    Abstract: An adhesive for semiconductor parts, comprising, as a base polymer, at least one cyclic structure-containing thermoplastic polymer selected from the group consisting of (a) a cycloolefin polymer and (b) an aromatic-condensed polymer having a repeating unit of an aromatic ring in its main chain, and having a number average molecular weight of 1,000 to 500,000, an adhesive sheet formed of the adhesive, a semiconductor part package making use of the adhesive, and a production process of the package.
    Type: Grant
    Filed: January 4, 2000
    Date of Patent: December 21, 2004
    Assignee: Nippon Zeon Company, Ltd.
    Inventor: Junji Kodemura
  • Publication number: 20040247801
    Abstract: A flat non-porous unitary solid surface structure is formed. A texture is imparted to a first flat non-porous unitary thermoplastic polymeric sheet having first and second planar aspects, the texture is imparted to the first planar aspect. A decorative material is arranged on the first planar aspect. A second flat non-porous unitary thermoplastic polymeric sheet is placed in contact with the decorative material in opposition with the first planar aspect; whereby a lay-up sandwich is formed. A predetermined amount of heat and pressure is applied by contact with cauls of a press to the lay-up sandwich for a predetermined period of time. Opening the press allows air and gases to escape from the lay-up sandwich. The press is closed and is applying a predetermined amount of heat and pressure to the lay-up sandwich for a predetermined period of time whereby the first and second polymeric material sheets melt together.
    Type: Application
    Filed: March 5, 2004
    Publication date: December 9, 2004
    Inventor: Dennis Schober
  • Publication number: 20040182512
    Abstract: The invention relates to a pressure sensitive adhesive composition containing an acrylic polymer having a weight average molecular weight of 300,000 or higher and produced copolymerizing: a C1-14 alkyl (meth)acrylate; 0.2 to 1.
    Type: Application
    Filed: October 31, 2003
    Publication date: September 23, 2004
    Applicant: Toyo Ink Mfg. Co., Ltd.
    Inventor: Masayoshi Matsumoto
  • Publication number: 20040140051
    Abstract: A high concentration central receiver system and method provides improved reflectors and a unique heat removal system. The central receiver has a plurality of interconnected reflectors coupled to a tower structure at a predetermined height above ground for reflecting solar radiation. A plurality of concentrators are disposed between the reflectors and the ground such that the concentrators receive reflective solar radiation from the reflectors. The central receiver system further includes a heat removal system for removing heat from the reflectors and an area immediately adjacent the concentrators. Each reflector includes a mirror, a facet, and an adhesive compound. The adhesive compound is disposed between the mirror and the facet such that the mirror is fixed to the facet under a compressive stress.
    Type: Application
    Filed: January 12, 2004
    Publication date: July 22, 2004
    Inventors: James B. Blackmon, Nelson Edwin Jones, Robert E. Drubka
  • Patent number: 6761783
    Abstract: A method for repairing a damaged area, referred to as the repair area, of a composite structure comprises steps of: making alignment markings on the repair area; fabricating a pair of alignment templates; preparing the repair area for a hot bonded, vacuum bagged repair; assembling a repair patch; consolidating the repair patch; heating the repair patch; transferring and aligning the repair patch to the repair area; vacuum bagging, heating, and cooling the repair patch for a partial cure at the repair area; heating and cooling the repair patch in an oven; and bonding the repair patch to the repair area.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: July 13, 2004
    Assignee: The Boeing Company
    Inventors: Russell L. Keller, Wesley S. Owen
  • Publication number: 20040126561
    Abstract: A method of making biopreform from the stem of monocotyledonous caudex plant, that is suitable for liquid infiltration and gaseous transportation of materials, is disclosed. Wood from caudex stem of trees such as coconut (Cocos nucifera), palmyra palm (Borassus flabellifer), date palm (Phoenics dactylifera), is used as a precursor material which is transformed under simple pyrolitic conditions under self-generated ambient atmosphere to biopreform having microstructural features typical of a monocotyledonous caudex tree. The biopreform is capable of liquid infiltration and gaseous transportation processing of materials in an appreciably shorter processing periods, because of its preservation of the structural and anatomical features of the parent plants with high precision.
    Type: Application
    Filed: December 30, 2002
    Publication date: July 1, 2004
    Applicant: Council of Scientific and Industrial Research
    Inventors: Omprakash Chakrabarti, Himadri Sekhar Maiti, Rabindranath Mazumdar
  • Publication number: 20040115399
    Abstract: A decorative abrasion resistant flooring laminate having a distinct surface decor and a process for the production thereof.
    Type: Application
    Filed: November 21, 2002
    Publication date: June 17, 2004
    Inventors: Hans Sjolin, Kent Lindgren
  • Patent number: 6723763
    Abstract: The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provides at higher cure speeds and comparable physical properties for the reaction products formed therefrom.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: April 20, 2004
    Assignee: Henkel Loctite Corporation
    Inventors: Qinyan Zhu, Shabbir Attarwala
  • Patent number: 6699354
    Abstract: The gluing together of flat materials between belt faces (21, 22), facing one another, of belt conveyors (15, 16) arranged over one another is effected usually with the application of heat and pressure. However there are pressure sensitive materials that with the gluing may only be impinged with a slight pressure. Here already the weight of the sagging belt face (21) of the upper belt conveyor may lead to an excessive pressure loading and a permanent deformation of the materials caused by way of this. The invention solves the mentioned problem in that the upper belt face (21) located above the materials to be glued is held up without contact, e.g., by means of suction nozzles or magnets. The sagging of the belt face (21) is alleviated by way of this and an undesirable high pressure loading of the materials to be glued is avoided. By way of the contactless holding-up of the belt face (21) the suction nozzles or magnets do not interfere.
    Type: Grant
    Filed: May 24, 2001
    Date of Patent: March 2, 2004
    Assignee: Schaetti AG
    Inventors: Peter Schwenk, Wilfried Dreischmeier
  • Publication number: 20040014574
    Abstract: Impression roller (10) for a laminating machine for producing a packaging material which comprises a carcass layer (40) consisting of paper or carton, which carcass layer exhibits through holes (42), and which carcass layer exhibits, on one of its sides, a barrier layer (44), a plastic lining (46, 47) which is arranged outside the barrier layer, and a film of laminant thermoplast (43) which is arranged between the carcass layer (40) and the barrier layer (44), with the said impression roller exhibiting a jacket surface which is faced with an inner facing layer (12) consisting of an elastic material, exhibiting a first hardness and a first thickness. According to the invention, an outer facing layer (13) consisting of an elastic material, exhibiting a second hardness and a second thickness, with the said first hardness being greater than the said second hardness and with the said first thickness being greater than the said second thickness, is arranged on the outside of the said inner facing layer (12).
    Type: Application
    Filed: May 15, 2003
    Publication date: January 22, 2004
    Inventor: Rolf Lasson
  • Patent number: 6663238
    Abstract: A laminating apparatus includes a lamination object conveying unit for conveying an object, a laminating film conveying unit for conveying the laminating film, and a heating-pressurizing unit for overlapping the object with the laminating film, and heating and pressurizing the object and the laminating film. A heat dissipating unit is disposed downstream from the heating-pressurizing unit in a conveying direction, with the heat dissipating unit dissipating heat from the object and the laminating film overlapped by the heating-pressurizing unit. In addition, a heating-pressurizing releasing unit releases the heating-pressurizing by the heating-pressurizing unit.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: December 16, 2003
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tetsuo Kikuchi, Eiichi Adachi
  • Publication number: 20030221777
    Abstract: A fixture having a bottom plate, top plate and an expansion block interposed between the bottom plate and top plate. A workpiece is positioned between the expansion block and bottom plate. When the fixture is heated, there is a net displacement exerted by the expansion block so as to apply pressure to the workpiece. The pressure applied by the fixture to the workpiece is due solely to the thermal expansion of the fixture when it is heated.
    Type: Application
    Filed: May 28, 2002
    Publication date: December 4, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Dale C. McHerron, Kaushal S. Patel, Christopher Lee Tessler, Jerry A. Gorrell, James Edward Tersigni
  • Patent number: 6579396
    Abstract: A durable, low-density, high performance insulating material is suitable for use as a high temperature thermal and acoustic insulation. The insulation includes fiber batting made with non-thermoplastic fibers or blends of fibers such as aramid fibers and ceramic fibers, which are bound within at least some interstices by high temperature non-flammable thermoplastic binder such as polyphenylene sulfide. In addition, a fireblocking layer can be provided on at least one surface of the insulation to further improve fire ablation or flame retardance.
    Type: Grant
    Filed: March 8, 2002
    Date of Patent: June 17, 2003
    Assignee: Tex Tech Industries, Inc.
    Inventor: David F. Erb, Jr.
  • Patent number: 6568148
    Abstract: The present disclosure involves a covering element for building surfaces and a method for the production thereof. The covering element includes a decorative visible side generally having a support plate having top and bottom surfaces, an upper transparent face sheet bonded to the top surface of the support plate, and a lower face sheet bonded to the bottom surface of the support plate. The upper face sheet has a support layer having cellulose in which an abrasion-resistant material is embedded in the form of corundum particles. In the present configuration, a decorative layer is applied to the bottom of the support layer by a color printing process. The decorative layer, which is underneath the support layer, is visible after all the layers have been pressed together under the application of heat. This process causes it to become transparent. The support layer and the decorative layer are covered with bonding material having melamine resin.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: May 27, 2003
    Assignee: Akzenta Paneele + Profile GmbH
    Inventor: Ralf Eisermann
  • Patent number: 6550513
    Abstract: A method and apparatus for binding documents by individually binding each media sheet to previously bound media sheets using imaging material as the binding material.
    Type: Grant
    Filed: May 24, 2001
    Date of Patent: April 22, 2003
    Assignee: Hewlett-Packard Company
    Inventor: Roland Boss
  • Publication number: 20030010442
    Abstract: A reactive polyurethane hot melt adhesive having improved adhesion to wood contains a polymeric isocyanate.
    Type: Application
    Filed: July 9, 2001
    Publication date: January 16, 2003
    Inventors: James W. Nowicki, Daniel T. Rumack
  • Publication number: 20020189755
    Abstract: A platen for use in a laminating press is provided which includes a body of material having first and second faces and spaced first and second ends. Preferably, at least one heating device is disposed in the body of material. First and second spaced cooling channels are formed in the body of material, the first cooling channel being adjacent the first face and having a fluid inlet port adjacent to or in the first end, and a fluid outlet port adjacent to or in the second end, and a second cooling channel being adjacent the second face and having a fluid inlet port adjacent to or in said second end, and a fluid outlet port adjacent to or in the first end. The invention also contemplates using such platens for laminating a book or stack of sheets of material to form a unitary single member having reduced stresses.
    Type: Application
    Filed: June 15, 2001
    Publication date: December 19, 2002
    Applicant: International Business Machines Corporation
    Inventors: Varaprasad Venkata Calmidi, Donald S. Farquhar, Michael Joseph Klodowski, Randall Joseph Stutzman
  • Patent number: 6488806
    Abstract: A method for assembling a flip-chip package having a low stress chip comprises providing a laminate chip carrier having a chip electrically connected thereon, applying the underfill material between the chip and the laminate chip carrier, providing a cover plate and applying an adhesive to the cover plate or chip or both, placing the cover plate adjacent to the chip such that the adhesive contacts the chip and the cover plate, and curing the underfill material together with the adhesive. The resultant flip-chip package has low internal. stress and experiences enhanced fatigue life during thermal cycling.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: December 3, 2002
    Assignee: International Business Machines Corporation
    Inventors: Timothy F. Carden, Aleksander Zubelewicz
  • Patent number: 6485606
    Abstract: A method and apparatus for binding documents by individually binding each media sheet to previously bound media sheets using imaging material as the binding material.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: November 26, 2002
    Assignee: Hewlett-Packard Company
    Inventor: Roland Boss
  • Patent number: 6472067
    Abstract: Non-flammable, fibrous-siloxane cured composites derived from the polymerization of dialkoxysilanes, trialkoxysilanes and tetraalkoxysilanes, in an aqueous medium, to obtain viscous polysiloxane resins. These siloxane resins are used to impregnate or coat various fibrous materials such as carbon fibers or glass cloth which are subsequently subjected to heat and pressure to form cured, non-flammable siloxane-impregnated composites e.g. panels having a density of about 1 to 3 g/cc. and a limited oxygen index above 30. These non-flammable, fibrous-siloxane composites are particularly useful in the manufacture of fire-proof materials for various transportation vehicles and for building materials e.g. panels as a fire barrier.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: October 29, 2002
    Assignee: HC Chem Research and Service Corp.
    Inventors: Ming-Ta S. Hsu, Timothy S. Chen
  • Publication number: 20020155279
    Abstract: A method for manufacturing a dimensionally stable composite cellulosic product having side and edge surfaces involves applying a sheet of thermoplastic material to at least one side surface of the composite product. Pressure and heat are applied for a pre-determined period via a heated press to melt the thermoplastic material to bond to and coat the at least one side surface of the product. The resulting product enjoys significantly improved dimensionally stability when exposed to water. Thickness swelling of the coated product is reduced by over 70% as compared to a conventional composite cellulosic product without the coating. In the case of oriented strand board (OSB) manufactured according to the method of the present invention, thickness swell of 2-5% after 24 hour water soaking is observed as compared to 10-15% swell with conventional OSB.
    Type: Application
    Filed: February 14, 2001
    Publication date: October 24, 2002
    Inventors: Chunping Dai, Peter Ens
  • Publication number: 20020144778
    Abstract: An apparatus and method for heating and cooling a polymer structure employs a tube structure. The tube structure includes a conductive tube and a conductive strip. The tube is composed of a first conductive material having a first electrical resistivity, and the strip is composed of a second conductive material having a second electrical resistivity less than the first resistivity. The strip is connected to only a portion of an outer surface of the tube and extends along a length of the tube. In the method, an impulse of electric current is passed through the tube structure until the strip is heated to a predetermined sealing temperature. The strip and the polymer structure are brought into contact with each other for a dwell time sufficient to generate a heat seal in the polymer structure. A cooling medium is passed through the tube to cool the strip to a predetermined release temperature that facilitates release of the strip from the polymer structure.
    Type: Application
    Filed: November 15, 1999
    Publication date: October 10, 2002
    Inventors: WILLIAM P. BELIAS, EDWARD M. BULLARD, ROBERT T. MADDOCK
  • Publication number: 20020122926
    Abstract: A thermoplastic laminate article has a first thermoplastic layer selected from polyester and polycarbonate with first and second surfaces, a second thermoplastic layer selected from polyethylene and polypropylene has a third surface disposed toward the first surface, and a bonding agent is disposed between the first and third surfaces. In preparing the thermoplastic laminate article, the bonding agent is coated onto at least one of the first or third surfaces, the layers are then placed in a superposed relationship and thereafter sufficient heat and pressure are applied to the second surface and an outer surface of the second thermoplastic layer to cause the bonding agent to flow and spread between the first and third surfaces to form a bond between the first thermoplastic layer and the second thermoplastic layer.
    Type: Application
    Filed: March 1, 2002
    Publication date: September 5, 2002
    Inventor: Raymond L. Goodson
  • Patent number: 6436223
    Abstract: A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate.
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: August 20, 2002
    Assignee: International Business Machines Corporation
    Inventors: David L. Edwards, Enrique C. Abreu, Ronald L. Hering, David C. Olson
  • Patent number: 6375776
    Abstract: A method of continuously forming a multi-layer laminate of thermoplastic polymeric films wherein one surface thereof has a precision pattern of embossed elements thereon and wherein the thermoplastic polymeric films can be dissimilar. A generally cylindrical seamless metal embossing tool with an outer surface having the reverse of the pattern to be formed on the surface of the sheeting is used. The laminate is formed by continuously feeding onto a heated embossing tool a superimposed first resinous film and a first carrier film wherein the first resinous film is pressed against the embossing tool and is heated above its glass transition temperature thereby becoming embossed with the pattern, while the first carrier film remains at a temperature below its glass transition temperature.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: April 23, 2002
    Assignee: Avery Dennison Corporation
    Inventors: Drew J. Buoni, Alan R. Kaufman
  • Patent number: 6367531
    Abstract: A process for the manufacture of a rim preform or rim-element having an axis of revolution by the placing on a preforming matrix pre-assembled fibers along two orientations defining deformable meshes. A winding of a strip of fibers is fastened on a circumference of the preforming matrix with asymmetrical orientation of the fibers, whereupon it is applied progressively until covering the entire surface of the preforming matrix by subjecting it to tensions of substantially circumferential orientation.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: April 9, 2002
    Assignee: Compagnie Générale des Etablissements Michelin - Michelin & Cie
    Inventors: Francois Finck, Yves Vernet
  • Patent number: 6368440
    Abstract: A flexible electrostatographic imaging member belt comprises two ends with matching puzzle-cut patterns of fingers arranged to be joined. The belt is fabricated by a method comprising the steps of: first, joining the two belt ends to form a juncture; second, applying an adhesive strip to the juncture; third, applying a compressing force to the adhesive strip; fourth, heating the adhesive strip for a heating period; fifth, cooling the adhesive strip for a cooling period; thus forming a puzzle-cut seam; and, sixth, determining when the puzzle-cut seam is satisfactory. When it is determined the puzzle-cut seam is not satisfactory, the heating and cooling steps are repeated. When it is determined the puzzle-cut seam is satisfactory, the compressing force is removed. In one embodiment, the method determines when the puzzle-cut seam is satisfactory based on the total time heat is applied to the adhesive strip.
    Type: Grant
    Filed: March 22, 2000
    Date of Patent: April 9, 2002
    Assignee: Xerox Corporation
    Inventors: Robert C. U. Yu, Edward L. Schlueter, Jr.
  • Patent number: 6355134
    Abstract: In a method for joining two or more solid parts, a foil is provided between the two parts, the foil is heated to an elevated temperature by means of a thermode such that it becomes soft, and then the foil is cooled down below the elevated temperature, thus providing a permanent connection. The method can be used for bonding a gas-permeable membrane to a housing such as to produce a liquid chromatography degasser. The bonding method ensures that no unwanted substances are released when liquid comes into contact with the bonding region.
    Type: Grant
    Filed: July 15, 1999
    Date of Patent: March 12, 2002
    Assignee: Agilent Technologies, Inc.
    Inventors: Manfred Berndt, Werner Karl Schomburg, Zeno Rummler, Ralf-Peter Peters, Mario Hempel
  • Patent number: 6344101
    Abstract: A process and plant for producing boards of wood-based materials having either a structured upper surface or a smooth upper surface. The plant has a continuously operating production press and a continuously operating embossing press. A discharge section and a transfer section are located between the continuously operating production press and embossing press. The continuously operating production press compresses and cures a mat of pressing stock to create a board that retains heat, while the continuously operating embossing press imparts the permanent embossed pattern on an upper surface of a board. The transfer section has a water spray device and a covered steam hood for cooling the board and producing steam.
    Type: Grant
    Filed: August 13, 1999
    Date of Patent: February 5, 2002
    Assignee: Maschinfabrik J. Dieffenbacher GmbH & Co.
    Inventor: Matthias Graf
  • Publication number: 20020005250
    Abstract: Polymeric carpet and a method of making and recycling such carpet, the carpet having fibers, backing and extruded adhesive all of completely recyclable materials, the recycling being accomplished in one melting step, without a separation step.
    Type: Application
    Filed: May 10, 2001
    Publication date: January 17, 2002
    Inventors: Gary D. Jerdee, Brad D. Rodgers, Eugene D. Medlock, Roger Kolm
  • Patent number: 6336982
    Abstract: A welded seam of an imaging belt comprises a surface roughness. To reduce the surface roughness, the welded seam is treated by compressing a portion of the belt comprising the welded seam and adjacent belt portions and, while compressing, heating the welded seam to a heating temperature near but less than the glass transition temperature of the imaging layer of the belt, then cooling the welded seam to a cooling temperature. The compressing continues while the heating and cooling steps are repeated until the surface roughness is determined to be satisfactory. The process then ceases.
    Type: Grant
    Filed: May 30, 2000
    Date of Patent: January 8, 2002
    Assignee: Xerox Corporation
    Inventors: Robert C. U. Yu, William A. Hammond, Edward L. Schlueter, Jr., Constance J. Thornton
  • Patent number: 6328843
    Abstract: A method for continuously producing finished board from a mat of a pressing stock mixed with a binder in a continuously operating press having steel belts, friction reducing elements, heating plates and cooling plates, the method comprising choosing a cooling length of a cooling section to cure the mat of pressing stock and to ensure a harmless vapor pressure within a finished board; introducing the mat between the steel belts of the continuously operating press; heating and pressing the pressing stock in a heating section of the continuously operating press; and cooling surfaces of the pressing mat just before the reaction starting temperature is reached, wherein the surfaces of the mat are subject to cooling when the temperature at the center of the stock is about 85% to 95% of the temperature required for curing the pressing stock. A continuously operating press for producing boards from a pressing stock has a press table and a press ram located above the press table.
    Type: Grant
    Filed: August 13, 1999
    Date of Patent: December 11, 2001
    Assignee: Maschinenfabrik J. Dieffenbacher GmbH & Company
    Inventors: Friedrich B. Bielfeldt, Matthias Graf
  • Patent number: 6329468
    Abstract: A flexible polyolefin-based hot melt adhesive composition having a variety of end uses, particularly in bonding polyethylene and polypropylene films, nonwoven fabrics and elastic attachment applications in nonwoven disposable articles. The composition includes a flexible polyolefin polymer or a blend of flexible polyolefin polymers, a tackifier resin, a plasticizer, and optionally a wax and a stabilizer. The preferred flexible polyolefin polymer has a melt flow rate greater than 5 g/10 min. and a density between 0.86 to 0.90 g/cm3. The hot melt adhesive composition provides a novel combination of desirable properties including good adhesion to a variety of substrates, low viscosity, good heat stability and oil resistance. The adhesive can be applied using common application techniques such as extruding or spraying.
    Type: Grant
    Filed: January 21, 2000
    Date of Patent: December 11, 2001
    Assignee: Bostik Findley, Inc.
    Inventor: Baoyu Wang
  • Patent number: 6320115
    Abstract: A semiconductor device having a semiconductor element, characterized in that said semiconductor device comprises a stacked body obtained by providing a laminate comprising said semiconductor element and a sealing resin which are interposed between a front surface member and a back face member, evacuating said laminate at a vacuum of 5 Torr or less for 5 to 40 minutes, subjecting the laminate thus treated to thermocompression bonding at a vacuum degree of 5 Torr or less, and cooling the laminate subjected to said thermocompression bonding so as to engage in contact bonding. The laminated semiconductor device is free of the air bubbles therein.
    Type: Grant
    Filed: July 19, 1996
    Date of Patent: November 20, 2001
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ichiro Kataoka, Takahiro Mori, Satoru Yamada, Hidenori Shiotsuka, Ayako Komori
  • Publication number: 20010030017
    Abstract: A method for producing an intermediate product made of a fiber-reinforced composite composed of a reinforcing fiber impregnated with a thermosetting resin or a thermoplastic resin, comprising: (a) the first process where a plurality of sheets made of the fiber-reinforced composite are laminated to each other, heated under a pressure, and cooled under a pressure to provide a flat plate-shaped laminate; (b) the second process where the flat plate-shaped laminate is cut into a plate; and (c) the third process where the plate is softened by heating, placed on a forming tool, and formed by cooling under a pressure.
    Type: Application
    Filed: April 12, 2001
    Publication date: October 18, 2001
    Inventor: Keiichi Sato
  • Patent number: 6290797
    Abstract: The invention provides a process for manufacturing a golf ball, particularly a multi-layer golf ball. The process comprises forming a pre-molded center, molding two substantially hemispherical shells having substantially hemi spherical cavities, shaping the shells in a press having a top mold and a bottom mold, each with cavities concaving toward each other and a center plate having top and bottom protrusions. The shells are placed in the cavities of the bottom mold and the protrusions of the center plate. The three parts of the press are aligned and closed as the press is heated to a temperature below the cure activation temperature of the shell material. The center plate is then removed from the press with the shells in the cavities of the top and bottom mold. as ball center is inserted between the shells and the press is again closed and heated to a second temperature, above the cure activation temperature, fusing the shells around the center and forming a golf ball core.
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: September 18, 2001
    Assignee: Acushnet Company
    Inventors: Steven M. Gosetti, Douglas Goguen
  • Patent number: 6251202
    Abstract: A method and system for bonding plastic parts together utilizing a heat-activated adhesive and at least one infrared lamp are disclosed. The system preferably includes first and second infrared lamps for emitting infrared radiation. A first base section supports a first infrared lamp adjacent the first plastic part and a second base section supports the second infrared lamp adjacent the second plastic part. The system also includes a controller coupled to the first and second infrared lamps for controlling power supplied to the first and second infrared lamps so that the first infrared lamp emits infrared radiation which propagates through the first plastic part and is absorbed by the adhesive and the second infrared lamp emits infrared radiation which propagates through the second plastic part and is absorbed by the adhesive for a time sufficient to heat the adhesive to a desired temperature at which the adhesive is activated. The activated adhesive bonds the plastic parts together.
    Type: Grant
    Filed: May 5, 1999
    Date of Patent: June 26, 2001
    Assignee: Patent Holding Company
    Inventor: John F. Murphy
  • Patent number: 6224711
    Abstract: A method for assembling a flip-chip package having a low stress chip comprises providing a laminate chip carrier having a chip electrically connected thereon, applying the underfill material between the chip and the laminate chip carrier, providing a cover plate and applying an adhesive to the cover plate or chip or both, placing the cover plate adjacent to the chip such that the adhesive contacts the chip and the cover plate, and curing the underfill material together with the adhesive. The resultant flip-chip package has low internal stress and experiences enhanced fatigue life during thermal cycling.
    Type: Grant
    Filed: August 25, 1998
    Date of Patent: May 1, 2001
    Assignee: International Business Machines Corporation
    Inventors: Timothy F. Carden, Aleksander Zubelewicz
  • Patent number: 6217699
    Abstract: A method and apparatus for welding thermoformed sheets of plastic material having lands formed therein such that the lands are welded to one another utilizing tubes which are positioned to be in line with the lands in a stack of thermoformed sheets so as to direct hot and cold gas to the lands to complete the welding process. In some embodiments, a plurality of tubes are inserted from opposite sides of blocks of stacked thermoformed sheets such that the tubes enter cells defined between the sheets of the block.
    Type: Grant
    Filed: May 5, 1998
    Date of Patent: April 17, 2001
    Assignee: Harmon Thermal Europe (France)
    Inventor: Claude Martin
  • Patent number: 6207248
    Abstract: Reactive hot melt polyurethane adhesives are useful in the graphic arts area, and in particular, for bookbinding applications such as casemaking, casing-in, gluing-off or thread-securing, facing, slip cases, lining-up, tightbacking, and bonding sides and joints; and for puzzle and gameboard lamination.
    Type: Grant
    Filed: December 18, 1997
    Date of Patent: March 27, 2001
    Assignee: H. B. Fuller Licensing & Financing, Inc.
    Inventors: Kang Yang, David B. Malcolm, Michelle B. Acquaye, Kevin J. Reid, John M. Zimmel
  • Patent number: 6156145
    Abstract: A method for manufacturing a multi-layer piezoelectric transducer having enhanced mechanical output displacement capability resulting from an increase in the amount of "pre-stress" applied to the electroactive (ceramic) layer by the pre-stress layer. The pre-stress layer is heated to a temperature above the temperature of the ceramic layer and bonded at an elevated temperature to the ceramic layer, such that, as the pre-stress layer subsequently cools down to ambient temperature, it applies a compressive stress to the ceramic layer. During the step of cooling the layers to ambient temperature, the temperature drop of the pre-stress layer is greater than the temperature drop of the ceramic layer, thereby increasing the amount of "pre-stress" applied to the electroactive (ceramic) layer by the pre-stress layer.
    Type: Grant
    Filed: August 21, 1998
    Date of Patent: December 5, 2000
    Assignee: Face International Corp.
    Inventor: Stephen Clark
  • Patent number: 6106658
    Abstract: A method of producing a laminate board (10) involves the steps of heating a continuous belt-like metallic sheet (2) by a heating furnace (1), laminating a thermoplastic resin film (3) on at least one of the surfaces of the metallic sheet, pressing and passing both of them between a pair of laminate rolls (4 and 5), and thermally bonding the film (3) to the metallic sheet (2), wherein the laminate sheet (10) coming out from between the pair of laminate rolls (4 and 5) is pushed by a deflector roll (6) in a transverse direction so as to bias the travelling direction towards the laminate roll (4) in contact with the film (3). The invention also discloses an apparatus (A) used for his method.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: August 22, 2000
    Assignee: Toyo Kohan Co. Ltd.
    Inventors: Noriaki Kaguma, Atsuo Tanaka, Hiroyuki Iwashita, Yoshiki Sakamoto, Hiroshi Inazawa
  • Patent number: 6099938
    Abstract: A leather and low melt thermoplastic adhesive laminate and a fixture which permits the laminate to be produced in a high volume, less expensive manner is disclosed. The disclosed laminate includes a leather layer cohesively bonded to a low melt thermoplastic adhesive layer and may include a scrim layer in addition to the low melt thermoplastic adhesive layer. A method is disclosed which permits for the rapid assembly of the laminate using pre-die-cut pieces of leather, low melt thermoplastic adhesive, and scrim.
    Type: Grant
    Filed: April 3, 1998
    Date of Patent: August 8, 2000
    Assignee: Advanced LaminationTechnoloties Ltd.
    Inventor: Matthew Stoyanovich
  • Patent number: 6099675
    Abstract: An adhesive tape is applied to an article covered with a resist pattern. The article with the adhesive tape applied thereto is rapidly cooled to form cracks in the resist pattern on the surface of the article to weaken the cohesion between the resist pattern and the surface of the article. After the cooling, the adhesive tape is separated from the article, whereby the resist pattern is removed with the adhesive tape from the surface of the article.
    Type: Grant
    Filed: December 1, 1998
    Date of Patent: August 8, 2000
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Yamamoto, Makoto Namikawa, Eiji Toyoda, Shigeji Kuroda, Saburo Miyamoto, Takao Matsushita
  • Patent number: 6090468
    Abstract: A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity, comprises at least two wiring boards and an insulation adhesive layer having an elastic modulus of 1,400 MPa or lower having a coefficient of thermal expansion of 450 ppm/.degree. C. or lower in a direction of thickness and being a cured product of an adhesive film which is a semi-cured product of an adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber having a glass transition point of -10.degree. C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of an epoxy resin having a weight average molecular. weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.
    Type: Grant
    Filed: September 9, 1997
    Date of Patent: July 18, 2000
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yasushi Shimada, Yasushi Kumashiro, Teiichi Inada, Kazunori Yamamoto
  • Patent number: 6077381
    Abstract: A method of making a protective coating material wherein there is provided a matrix of melted polymeric material transparent to energy of a predetermined type and having a predetermined melting temperature. A fabric of polymeric fibers having a melting temperature higher than the melting temperature of the matrix is placed in the matrix. The fibers are thermoplastic and have a strength of at least about 0.5 GPa (70,000 psi) and an elastic (Young's) modulus of at least about 25 GPa (3.6.times.10.sup.6 psi) and said matrix has an elastic modulus in the range from about 0.2 to about 3.times.10.sup.6 psi. A pressure of from about 1000 to about 2000 psi is applied to the fabric disposed in the matrix and then the temperature is raised to about and at least the melting temperature of the fabric for about the minimum time required to cause consolidation of the fabric and the matrix. The consolidated fabric and matrix are then rapidly cooled to a temperature below the melting temperature of the fabric.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: June 20, 2000
    Assignee: Raytheon Company
    Inventors: Paul Klocek, William J. MacKnight, Richard J. Farris, Christian Lietzau
  • Patent number: 6051096
    Abstract: A method of carbonizing cellulose-containing plants is disclosed. Wood is used as a precursor material which is carbonized under controlled temperature and atmosphere conditions to produce a porous carbon product having substantially the same cellular structure as the precursor wood. The porous carbonized wood may be used for various applications such as filters, or may be further processed to form carbon-polymer or carbon--carbon composites. The carbonized wood may also be converted to a ceramic such as silicon carbide. Additional processing may be used to form ceramic-metal or ceramic--ceramic composites.
    Type: Grant
    Filed: July 11, 1996
    Date of Patent: April 18, 2000
    Inventors: Dennis C. Nagle, Christopher E. Byrne
  • Patent number: RE38248
    Abstract: A welded seam of an imaging belt comprises a surface roughness. To reduce the surface roughness, the welded seam is treated by compressing a portion of the belt comprising the welded seam and adjacent belt portions and, while compressing, heating the welded seam to a heating temperature near but less than the glass transition temperature of the imaging layer of the belt, then cooling the welded seam to a cooling temperature. The compressing continues while the heating and cooling steps are repeated until the surface roughness is determined to be satisfactory. The process then ceases.
    Type: Grant
    Filed: March 6, 2002
    Date of Patent: September 16, 2003
    Assignee: Xerox Corporation
    Inventors: Robert C. U. Yu, William A. Hammond, Edward L. Schlueter, Jr., Constance J. Thornton