Phenolic-aldehyde Resin Patents (Class 156/335)
  • Patent number: 11149173
    Abstract: Provided is an adhesive using bark, which is advantageous not only in that the proportion of the bark is increased so as to effectively utilize the bark, and the proportion of the phenolic resin is reduced to lower the adhesive solids content, but also in that the composition of the adhesive is simple. An adhesive using bark, which comprises a resol type phenolic resin and a radiata pine bark powder, wherein the adhesive contains 30 to 40 parts by mass of the radiata pine bark powder, relative to 100 parts by mass of the total of the resol type phenolic resin solids and the radiata pine bark powder.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: October 19, 2021
    Assignee: WOOD ONE CO., LTD.
    Inventors: Masayoshi Horito, Naoko Kurushima, Tomoyuki Matsumae, Yusho Nakamoto, Yoshikazu Yazaki
  • Patent number: 10961150
    Abstract: The present invention relates to a sizing composition for mineral fibers, especially glass fibers or rock fibers, containing a liquid phenolic resin having a free formaldehyde content, expressed with respect to the total weight of liquid, of 0.1% or less and an extender. Preferably, the liquid phenolic resin is mainly composed of phenol-formaldehyde and phenol-formaldehyde-amine condensates and has a water dilutability, at 20° C., at least equal to 1000%. Another subject of the present invention is the insulating products based on mineral fibers treated by said sizing composition.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: March 30, 2021
    Inventors: Olivier Pons Y Moll, Boris Jaffrennou, Jerome Douce
  • Patent number: 10889655
    Abstract: This invention relates to new destructured starch derivatives and elastomer compositions containing them. In particular this invention relates to destructured starch silyl ethers in which at least one oxygen atom of the destructured starch is covalently bonded to at least one silicon atom and/or to at least one compound containing silicon.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: January 12, 2021
    Assignee: NOVAMONT S.P.A.
    Inventors: Paolo Magistrali, Sebastia Gesti′Garcia
  • Patent number: 10858554
    Abstract: Most processes currently being proposed and/or used for the production of lignin from kraft or soda black liquors are capable of producing two main types of lignin: high residual content (HRC) lignin and low residual content (LRC) lignin. Surprisingly, it was discovered that HRC lignin, is a suitable ingredient in alkaline adhesives, particularly wood adhesives of the phenolic type (e.g. resole resins). This biomaterial is environmentally green and remarkably low cost, which makes it an industrially viable material to be used as a novel and major ingredient in phenolic adhesives for the manufacture of exterior grade plywood, laminated veneer lumber, oriented strand board (OSB) and other wood products—this was successfully demonstrated in a number of laboratory experiments as well as several different mill trials. The composition, preparation and application of such wood adhesives are hereby disclosed.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: December 8, 2020
    Assignee: FPInnovations
    Inventors: Martin W. Feng, Guangbo He, Yaolin Zhang, Xiang-Ming Wang, Lamfeddal Kouisni, Michael Paleologou
  • Patent number: 10604613
    Abstract: A rubber composition comprises at least one phenol/aldehyde resin based on at least one aromatic polyphenol comprising at least one aromatic ring bearing at least two hydroxyl functions in the meta position relative to one another, the two positions ortho to at least one of the hydroxyl functions being unsubstituted, and at least one aldehyde of formula (A): in which X comprises N, S or O, and R represents —H or —CHO.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: March 31, 2020
    Inventors: David Doisneau, Anne-Lise Thuilliez, Odile Gavard-Lonchay
  • Patent number: 10017636
    Abstract: The present invention relates to a method for producing a binder composition, wherein the method comprises the following steps: (i) forming an aqueous composition comprising reactant components including lignin molecules of 11-60 lignin units, lignin molecules of 1-10 lignin units, polymerizable substance and crosslinking agent in the presence of a catalyst; and (ii) cooking the composition at a temperature of 60-95° C. for polymerizing the reactant components until a binder composition with a predetermined viscosity value is formed.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: July 10, 2018
    Inventors: Sanna Valkonen, Suvi Pietarinen, Okko Ringena, Kati Oinonen
  • Patent number: 9957137
    Abstract: The elevator car includes a floor, a ceiling, and side walls connecting the floor and the ceiling. At least the inner surface of at least some of the side walls of the elevator car may be covered with sheets of board. The board includes a fire retardant plywood having a front surface and an opposite back surface. The front surface of the fire retardant plywood may be coated with a first material layer including a fire retardant laminate. The fire retardant laminate may be attached with heat resistant or fire retardant glue to the fire retardant plywood. The back surface of the fire retardant plywood may be coated with a second material layer having a same thickness and a same material properties as the laminate.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: May 1, 2018
    Assignee: Kone Corporation
    Inventors: Kari Soljamo, Matti Räsänen, Mika Alvesalo, Mikael Alanen
  • Patent number: 9634308
    Abstract: A single layer structure of micron or nano fibers, and a multi-layer structure of micron and nano fibers. The single layer structure of micron fibers includes a web of micron fibers and an impregnating resin, and has a pore size of 1 nm-500 nm. The web of micron fibers is formed by plural interweaved micron fibers (D?1 ?m). The single layer structure of nano fibers includes a web of nano fibers formed by plural interweaved nano fibers (D<1 ?m). The multi-layer structure of micron and nano fibers includes a web of interweaved micron fibers, a web of nano fibers formed by plural nano fibers interweaved on the web of micron fibers, a mixture layer formed by parts of the interweaved nano and micron fibers, and a resin at least impregnating the mixture layer and parts of the micron fibers of the web of micron fibers.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: April 25, 2017
    Inventors: Wan-Shu Chen, Shu-Hui Cheng, Jung-Ching Hsing, Tzu-Hsien Han, Ming-Lung Lee
  • Patent number: 9561736
    Abstract: A vehicle component may include a sandwich structure having a first supporting sheet, a second supporting sheet, and an essentially planar electro-chemical battery. The essentially planar electro-chemical battery may be arranged between, and abutting against, the first and the second supporting sheets.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: February 7, 2017
    Assignee: Volvo Car Corporation
    Inventor: Per-Ivar Sellergren
  • Patent number: 9469795
    Abstract: The present invention relates to a method for producing a binder composition, wherein the method comprises the following steps: (i) forming an aqueous composition comprising reactant components including lignin molecules of 11-60 lignin units, lignin molecules of 1-10 lignin units, polymerizable substance and crosslinking agent in the presence of a catalyst; and (ii) cooking the composition at a temperature of 60-95° C. for polymerizing the reactant components until a binder composition with a predetermined viscosity value is formed.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: October 18, 2016
    Assignee: UPM-Kymmene Corporation
    Inventors: Sanna Valkonen, Suvi Pietarinen, Okko Ringena, Kati Eskelinen
  • Patent number: 9243682
    Abstract: A power transmission belt. The power transmission belt includes a body having an inner perimeter and an outer perimeter. A fabric is attached to the inner perimeter of the body for reinforcement wherein the fabric is a double knit fabric formed using textured yarns in at least the cross-machine direction. The belt may further include a layer of reinforcing cords surrounding the outer perimeter of the body.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: January 26, 2016
    Assignee: Highland Industries, Inc.
    Inventors: Matthew Floyd Avery, Terry Wayne Hinson, Nicholas Edward Irwin, William James Canipe
  • Patent number: 9204943
    Abstract: The present invention relates to dental implants and provides a flexible core abutment system using an implantable base member, a flexible inner core and an outer shell for receiving a restoration wherein the flexibility of the abutment simulates the shock absorbing properties typically provided by the ligaments of natural teeth.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: December 8, 2015
    Inventor: Parsa T. Zadeh
  • Patent number: 8323450
    Abstract: The invention relates to a method of manufacturing a heat storage material that contains heat storage capsules. The heat storage capsules include a phase change material that absorbs and/or discharges latent heat in response to a change in temperature. The phase change material resides within outer shells of the heat storage capsules. The method involves binding abutting peripheral portions of a plurality of heat storage capsules with a molding binder, so as to form an intermediate granular molded heat storage material. An outer peripheral surface portion of the granular molded heat storage material is coated with a coating binder. The coated granular molded heat storage material is then subjected to a treatment that causes the coating binder of the coating layer to polymerize. The invention also relates to heat storage adsorbent materials, and articles (e.g., canisters) that include such heat storage adsorbent materials.
    Type: Grant
    Filed: April 22, 2009
    Date of Patent: December 4, 2012
    Assignee: Osaka Gas Chemicals Co., Ltd.
    Inventor: Kenji Seki
  • Patent number: 8252427
    Abstract: The invention comprises an aqueous phenol-formaldehyde resole resin liquid fortified with powdered (e.g., spray dried) phenol-formaldehyde resole resin, preparing wood composites, particularly oriented strand board (OSB), waferboard, particleboard, medium density fiber board, and hardboard, using the solids-fortified liquid resin, and related wood composites bonded with the solids-fortified resin.
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: August 28, 2012
    Assignee: Georgia-Pacific Chemicals LLC
    Inventors: Robert A. Breyer, James H. Knight, Daniel C. Yeager, Herbert J. Kennedy, Harmon E. Brehmer, Jr.
  • Patent number: 8142605
    Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: March 27, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Publication number: 20110209822
    Abstract: A powder primer composition particularly useful as a primer intended to be used in conjunction with an adhesive topcoat in rubber to metal bonding. And a method for bonding an elastomeric substrate to a metallic substrate comprising, applying a powder primer composition onto one of said substrates, wherein the powder primer composition comprises a rubbery polymer and at least one of a phenolic resin and a phenoxy resin, applying an adhesive covercoat to form a coated substrate, contacting the coated substrate with the other of said substrates, and heating the contacted substrates to effect bonding of the metallic substrate to the elastomer.
    Type: Application
    Filed: November 9, 2009
    Publication date: September 1, 2011
    Inventor: James R. Halladay
  • Publication number: 20110159307
    Abstract: A method glues two plastic surfaces together via an adhesion produced by a heat-activatable adhesive. An adhesive, which is used as a heat-activatable adhesive, is based on i) at least one thermoplastic having a softening temperature or melting temperature in the region of between 90 and 120° C.
    Type: Application
    Filed: August 26, 2009
    Publication date: June 30, 2011
    Applicant: TEASA SE
    Inventors: Marc Husemann, Markus Brodbeck
  • Publication number: 20110091699
    Abstract: The present invention relates to a method for manufacturing a laminate product by assembling two substrates provided with liquid coating layers by passing said substrates between two rotating guide rollers. The object of the present invention is to provide a method for manufacturing a laminate product in which the number of process steps for applying two or more liquid layers is minimised Another object of the present invention is to provide a method for manufacturing a laminate product in which the inclusion of air between the individual layers is minimised.
    Type: Application
    Filed: May 15, 2009
    Publication date: April 21, 2011
    Inventor: Wilhelmus Josephus Alex Van De Wall
  • Publication number: 20110083805
    Abstract: Compositions obtained by reacting the cardanol-containing raw material cashew nut shell liquid (CNSL) with (a) ammonia, or an amine which comprises at least one primary or at least two secondary amino groups, and (b) formaldehyde, are disclosed as adhesives.
    Type: Application
    Filed: September 30, 2010
    Publication date: April 14, 2011
    Inventors: Paul Birnbrich, Hans-Josef Thomas
  • Publication number: 20110064953
    Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.
    Type: Application
    Filed: April 6, 2009
    Publication date: March 17, 2011
    Applicant: Arizona Board of Regents, a body Corporate of the State of Arizona acting for and on the behalf of A
    Inventors: Shawn O'Rourke, Douglas Loy, Hanqing Jiang
  • Patent number: 7651582
    Abstract: A bioadhesive composition for bonding together adjacent surfaces of wood comprises a microbially-produced fermentation residue containing adherent microbial cells and glycocalyx. This residue finds particular application as a replacement for a significant amount of phenol-formaldehyde (PF) or other conventional adhesive component commonly used in the production of plywood and other wood products.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: January 26, 2010
    Assignee: The United States of America as represented by the Secretary of Agriculture
    Inventors: Paul J. Weimer, Linda F. Lorenz, Anthony H. Conner, Charles R. Frihart
  • Publication number: 20100015194
    Abstract: Process for the production of wood-based materials containing wood parts, comprising the steps a) bringing wood parts into contact with a1) alkaline binder and a2) thiacloprid and b) pressing a bed of wood parts, containing wood parts treated according to step a), under pressure at a temperature of the press contact surfaces of 126° C. to 240° C.
    Type: Application
    Filed: April 15, 2009
    Publication date: January 21, 2010
    Inventors: Steffen Donath, Thomas Jaetsch, Peter Spetmann, Tobias Zahlmann, Andreas Bottcher, Erasmus Vogl
  • Patent number: 7629056
    Abstract: A circuit terminal connected structure and a circuit terminal connecting method are provided. Both the structure and the method feature a circuit connecting material formulated with the following components: a curing agent capable of generating free radicals upon heating; an acrylate or methacrylate radical polymerizable substance; and either an acrylic rubber or a maleimide radical polymerizable substance having at least two maleimide groups per molecule. In some embodiments, the curing agent features a 10-hour half life temperature of 40° C. or above and a 1-minute half-life temperature of 180° C. or below. In other embodiments, the circuit connecting material includes conductive particles. In additional embodiments, the circuit connecting material includes a hydroxyl-group-containing resin having a weight average molecular weight of 10,000 or more.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: December 8, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Patent number: 7482064
    Abstract: Disclosed is a composite wood component having upper and lower surface layers and a core layer; a first glueline layer; a second glueline layer; and an overlay layer.
    Type: Grant
    Filed: August 8, 2005
    Date of Patent: January 27, 2009
    Assignee: Huber Engineered Woods LLC
    Inventor: Brian Christopher Gerello
  • Patent number: 7476435
    Abstract: Disclosed herein is a back-grooved laminate wood flooring in which a high pressure melamine laminate (HPL) is laminated on a waterproof plywood layer. The back-grooved laminate wood flooring comprises an upper HPL (20), an adhesive layer (40) and a waterproof plywood layer (10) wherein the upper HPL (20) includes a second core layer (25), a first core layer (23), a decorative paper layer (22) and a surface-protective paper layer (21) layered in this order from the bottom, the upper HPL (20) and waterproof plywood layer (10) are adhered to each other by the adhesive layer (40), and the waterproof plywood layer (10) is back grooved.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: January 13, 2009
    Assignee: LG Chem, Ltd.
    Inventors: Kie-Sun Han, Seong-Chan Park
  • Patent number: 7144937
    Abstract: A sealant composition comprising a sealant, an adhesive resin, and a long chain ester, particularly dimerate and trimerate esters, is capable of unexpected adhesion to substrates such as ceramic substrates (e.g., concrete), glass substrates, metal substrates such as metal flat stock materials, polymeric substrates including substrates comprising natural and/or synthetic rubbers and substrates comprising thermoplastic polymeric materials, particularly for use in sealing around bathroom fixtures, in storage areas, vents, plumbing lines, flooring, wheel wells, and the like.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: December 5, 2006
    Assignee: CPH Innovations Corp.
    Inventors: Jerome M. Klosowski, Gary Wentworth, Zhi Chen, Stephen Semlow, Stephen O'Rourke, Kimberly L. Stefanisin, John English
  • Patent number: 7097734
    Abstract: Methods for securing wood members together are disclosed. The methods include the use of an adhesive that quickly cures without heating. Adhesives may be impingement sprayed or splattered onto a contact surface. The methods may be used to form high-strength bonds between wood and/or plastic members in short processing times.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: August 29, 2006
    Inventor: David A. Hill
  • Patent number: 6940177
    Abstract: A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 ?m/m° C. between ?40 and 150° C. and a modulus of from 1 to 300 MPa at 25° C., and the silicone member is prepared by the method of the invention.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: September 6, 2005
    Assignee: Dow Corning Corporation
    Inventors: Stanton James Dent, Lyndon James Larson, Robert Thomas Nelson, Debra Charilla Rash
  • Patent number: 6830646
    Abstract: A radiation curable resin formulation suitable for planarizing an ink jet heater chip. The resin formulation includes a multifunctional epoxy component, a difunctional epoxy component, a silane coupling agent, an aryl sulfonium salt photoinitiator, and a non-photoreactive solvent. The resin formulation is substantially devoid of acrylate polymer components. Radiation curable resins according to the invention exhibit enhanced adhesion with the nozzle plate adhesive thereby reducing the incidence of delamination between the nozzle plate and a semiconductor chip containing the resin layer. Another advantage is that the resin layer, according to the invention, reduces pigment flocculation on the surface of the resin layer when using pigment-based ink jet inks.
    Type: Grant
    Filed: April 18, 2003
    Date of Patent: December 14, 2004
    Assignee: Lexmark International, Inc.
    Inventors: Girish S. Patil, Brian C. Hart
  • Publication number: 20040166346
    Abstract: The present invention relates to a composition containing a hydrogenated nitrile-butadiene rubber (HNBR), a peroxide crosslinking system and a resorcinol-formaldehyde resin, to a process for the preparation of the composition, to the use of the composition as an adhesion promoter, and also to a multilayer product containing the composition according to the present invention.
    Type: Application
    Filed: February 13, 2004
    Publication date: August 26, 2004
    Inventor: Dirk Achten
  • Patent number: 6734275
    Abstract: The present invention relates to a method of gluing wood based materials by providing an adhesive system onto wood based materials followed by curing, the adhesive system comprises a urea based amino resin and a hardener composition, wherein the hardener composition comprises an acid and a phenolic resin. The invention also relates to an adhesive system and a hardener composition as well as wood based products obtained by the method or through the use of the adhesive system.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: May 11, 2004
    Assignee: Akzo Nobel N.V.
    Inventors: Salme Pirhonen, Benyahia Nasli-Bakir, Ingvar Lindh
  • Patent number: 6730385
    Abstract: A laminate, which is in the form of an O-ring, a square ring, a rubber roll, a diaphragm, a rubber hose, a rubber tube or a vial stopper, comprising a layer of a perfluororubber, a layer of other rubber and an adhesive layer containing a polyfunctional compound which adheres the rubber layers by vulcanization is produced by coating a polyfunctional compound on a surface of at least one of the perfluororubber layer or the other rubber layer, laminating the layers with the coated surface facing the other layer, and vulcanizing the layers to adhere them. Thereby, the adhesion strength between the layer of perfluororubber and the layer of the other rubber is improved.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: May 4, 2004
    Assignee: Daikin Industries, Ltd.
    Inventors: Hiroyuki Tanaka, Shoji Kawachi, Masanori Yamashita, Yoshihiro Shirai, Yutaka Ueta
  • Patent number: 6703104
    Abstract: A method and apparatus comprising combining ballistic and fragment resistant fabrics in multiple layers with a central geometrically shaped composite core in a resin forming a composite armor panel, wherein the multiple layers present a fragment projectile with alternating tougher and softer resistances to penetration to enhance the stopping power of the composite armor while retaining a lightweight configuration is disclosed. The panel allows the fabric layers and geometric core to interact in such a manner as to function as a drumskin, flexing and elastically deforming to absorb and attenuate the energy of a forced entry attack.
    Type: Grant
    Filed: January 4, 2002
    Date of Patent: March 9, 2004
    Inventor: Murray L. Neal
  • Publication number: 20030221775
    Abstract: A method is provided for improving the bond strength and quality between a borate-treated wood material and a phenolic resin in a wood composite product, the method having the steps of bonding the wood material with an adhesive system comprising the resin and an additional base, the base providing a substantial increase in the alkalinity of the adhesive system over that provided by the resin, the increase sufficient to limit the bonding of borate molecules with the phenolic resin molecules to such an extent as to allow a substantially complete cross-linking of the phenolic resin molecules to occur. An adhesive system is also disclosed for use in the production of wood composite products.
    Type: Application
    Filed: May 31, 2002
    Publication date: December 4, 2003
    Inventors: Martin Feng, Axel Andersen, Paul Morris
  • Patent number: 6645341
    Abstract: A two-component epoxy-based adhesive comprising a resin component and a curing agent. The resin component comprises an epoxy resin, a polymer polyol, and fumed silica. The curing agent comprises a polyoxyalkyleneamine, an amine terminated butadiene-acrylonitrile polymer, tris(2,4,6-dimethlaminomethyl)phenol, polyamide resin, silane and fumed silica. The adhesive composition is particular useful for bonding of metals, plastics and composites and for functions such as laminating, honeycomb bonding, automotive assembly and construction assembly.
    Type: Grant
    Filed: August 6, 2002
    Date of Patent: November 11, 2003
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Terry Gordon
  • Patent number: 6613182
    Abstract: The present invention comprises a evaporative cooling pad and method of making the same. The cooling pad features a non-reflective, non-light transmissive surface finish incorporated directly into the cooling pad. In one embodiment, this surface finish would be a dark color, gray to black, with a non-gloss surface. The coupling of this type of finish and colored sheet with the plurality of angled cross-corrugated flutes featured on the cooling pad serves the function of breaking the light source at various flute angles and attenuating the light value during its passage through the cooling pad.
    Type: Grant
    Filed: February 10, 2003
    Date of Patent: September 2, 2003
    Assignee: General Shelters of Texas, S.B., Ltd.
    Inventor: Phillip D. Calvert
  • Patent number: 6602379
    Abstract: A composition for the promotion of adhesion between a rubber formulation and a textile substrate is provided. The inventive composition comprises either a mixture of specific amine functional silanes and organo-functional silanes having reactive groups or groups with an affinity for rubber. The inventive method entails the use of the inventive composition or a silane compound having both an amine moiety and a reactive group having an affinity for rubber formulations, particularly an unsaturated carbon-carbon bond. The composition may be utilized to adhere any standard reinforcement-type textile, such as polyester or polyamide, to a standard rubber composition, such as SBR, NBR, or EPDM. A method for adhering textiles to rubber formulations is also provided involving a pre-dip, -spray, -coat, and the like, of the inventive composition on a reinforcement-type textile surface followed by the contacting of the rubber formulation.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: August 5, 2003
    Assignee: Milliken & Company
    Inventors: Shulong Li, Dany Felix Maria Michiels
  • Patent number: 6568148
    Abstract: The present disclosure involves a covering element for building surfaces and a method for the production thereof. The covering element includes a decorative visible side generally having a support plate having top and bottom surfaces, an upper transparent face sheet bonded to the top surface of the support plate, and a lower face sheet bonded to the bottom surface of the support plate. The upper face sheet has a support layer having cellulose in which an abrasion-resistant material is embedded in the form of corundum particles. In the present configuration, a decorative layer is applied to the bottom of the support layer by a color printing process. The decorative layer, which is underneath the support layer, is visible after all the layers have been pressed together under the application of heat. This process causes it to become transparent. The support layer and the decorative layer are covered with bonding material having melamine resin.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: May 27, 2003
    Assignee: Akzenta Paneele &plus; Profile GmbH
    Inventor: Ralf Eisermann
  • Publication number: 20030079833
    Abstract: The present invention relates to a method of gluing wood based materials by providing an adhesive system onto wood based materials followed by curing, the adhesive system comprises a melaminic amino resin and a phenolic resin composition, wherein the phenolic resin composition comprises an acid and a phenolic resin. The invention also relates to an adhesive system and a stable phenolic resin composition as well as wood based products obtained by the method or through the use of the adhesive system.
    Type: Application
    Filed: October 18, 2002
    Publication date: May 1, 2003
    Applicant: AKZO NOBEL N.V..
    Inventors: Salme Pirhonen, Benyahia Nasli-Bakir, Ingvar Lindh
  • Publication number: 20020162618
    Abstract: The present invention is directed to a method of manufacturing of sintered bonded adhesive plates. The present invention comprises the steps of clearing the metal cores, applying thermosetting adhesives, such as phenolic or epoxy adhesives, to the core layer, then applying sintered layers on top of the adhesive layers and bonding said layers at a temperature in the range of 375-475 F, pressure in the range of 25-1000 psi and bonding such structure for at least 30 seconds. The metal core may be fabricated from metals whose melting point is at least 450 F, such as aluminum. The present invention presents a relatively inexpensive way of manufacturing sintered bonded adhesive plates.
    Type: Application
    Filed: May 4, 2001
    Publication date: November 7, 2002
    Inventors: David Landa, Barry Gindoff, Bob Hawkins, Raymond Engel
  • Patent number: 6464813
    Abstract: A laminating and coating system is employed with a gravure or flexographic set up using an enclosed doctor blade system with recirculation to coat adhesive onto a film and then laminate it to another film. The preferred adhesive is a two-stage epoxy consisting of a zero VOC 100% solids laminating adhesive having a mixed viscosity of 200-400 cps with the viscosity remaining within a desired range of 50-110 degrees F for up to 3 hours that will cure at ambient temperature. The adhesive is solventless and is unaffected by moisture. The adhesive consists of ingredients which make it permissible for use as an adhesive for laminations of films designed for food packaging pursuant to F.D.A. Regulation 175.105.
    Type: Grant
    Filed: October 31, 2000
    Date of Patent: October 15, 2002
    Assignee: AdLamCo., Inc.
    Inventors: Peter J. McQuaid, Werner Lynen, Cathy D. Kephart
  • Patent number: 6461469
    Abstract: A finished product from lignocellulose, such as a length of wood or chipboard, is impregnated with a composition containing a thermosetting resin in a nonaqueous solvent, and a styrene polymer in a nonaqueous solvent. Excess impregnating composition is removed from the impregrnated material. The solvent or solvents are also removed. The thermosetting resin may thereafter be subjected to temperature conditions for polymerization to form a finished product.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: October 8, 2002
    Assignee: Windsor Technologies Limited
    Inventor: Michael Windsor Symons
  • Patent number: 6440255
    Abstract: A process is provided for producing fast curing bonded with phenolic resin, which comprises pulverulent phenolic resins mixed with or applied to the substrate to be adhered together with pulverulent addition polymers selected from the group consisting of polyvinyl alcohols and addition polymers, stabilized by hydroxyl-containing protective colloids of at least one monomer selected from the group consisting of the vinyl esters of branched or unbranched carboxylic acids of 1 to 12 carbon atoms, the esters of acrylic acid and methacrylic acid with branched or unbranched alcohols of 1 to 12 carbon atoms, vinylaromatics, vinyl halides, olefins and dienes, and subsequently, by the employment of elevated temperature and optionally elevated pressure, cured and processed into a shaped article.
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: August 27, 2002
    Assignee: Wacker-Chemie GmbH
    Inventors: Klaus Kohlhammer, Claudia Schmidt
  • Publication number: 20020114968
    Abstract: The disclosed invention is a dimensionally stable laminate prepared by layering resin saturable sheets, treating the layered sheets with a polymeric resin, pressing the treated layered sheets together under high pressure and high temperature to form a laminate and then subjecting the newly manufactured laminate to high humidity (greater than 65%) at relatively low temperatures (32°-45° C.) before exposure to ambient conditions.
    Type: Application
    Filed: February 13, 2002
    Publication date: August 22, 2002
    Applicant: Westvaco Corporation
    Inventors: Yvette A. Tramount, Edward P. Klein
  • Patent number: 6432254
    Abstract: A method for making a consolidated wood product comprising coating wood components with a B-stageable, phenol-formaldehyde resole resin; heating the coated wood components to about 80 to 140° C. for a time sufficient to advance the resin to a B-stage; forming a mat or stack of the wood components coated with the B-stage resin; exposing the mat or stack of coated wood components to a saturated or superheated steam atmosphere in a hot press; and compressing the layup to form the consolidated wood product. The phenol-formaldehyde resole resin used in the method has a number average molecular weight of between about 200 and 600, has a F:P mole ratio of about 1.3:1 to 2.0:1, and has been modified with 0 to about 5.5 wt % of caustic based on resin solids.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: August 13, 2002
    Assignee: Georgia-Pacific Resins Inc.
    Inventors: Eric P. Black, Michael E. Hittmeier, W. Hayes Ingram, R. Scott Johnson
  • Patent number: 6402869
    Abstract: The invention relates to a method of gluing veneers to form LVL and plywood boards from veneers laid one over the other in several layers by curing the adhesive placed between the single layers in a heated press. The invention consists in the fact that the gluing and pressing of the outer layers of a veneer pack to form LVL and plywood boards is performed by high-temperature adhesive and the inner layers by low-temperature adhesive, so that the amount of heat to be put into the veneer pack decreases from the outside in.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: June 11, 2002
    Assignee: Maschinenfabrik J. Dieffenbacher GmbH & Co.
    Inventor: Gernot von Haas
  • Publication number: 20010051247
    Abstract: A flame retardant article produced by forming a thermoplastic material around at least a portion of a core of partially cured phenolic resin is disclosed. The article has reduced flammability and improved dimensional stability when exposed to flame compared to an article consisting solely of the thermoplastic material. By positioning the thermoplastic between the core and at least all surfaces of the article which may become directly exposed to fire or heat when the article is in use, it is possible to impart the flexibility, colorability and impact resistance characteristics of thermoplastic materials to the article. At the same time, the inner core of the phenolic resin reduces the flammability and improves the dimensional stability of the article when the article is exposed to flame.
    Type: Application
    Filed: April 6, 2001
    Publication date: December 13, 2001
    Inventors: Phillip A. Waitkus, Theodore N. Morrison
  • Patent number: 6306241
    Abstract: There is provided a method for producing lignocellulosic composites. This method is useful in reducing the thickness swell of these composites on their exposure to water. This method also is useful in reducing the hot-press times required to make lignocellulosic composites. Furthermore, there is provided a method by which wax sizing may be used without the previously expected reduction in physical properties. Also, there is provided a method by which caul plate sticking may be reduced when hydrogen peroxide is used as a furnish add-on.
    Type: Grant
    Filed: August 8, 2000
    Date of Patent: October 23, 2001
    Inventor: Shui-Tung Chiu
  • Patent number: 6132885
    Abstract: A single package, ready-to-use (RTU) resin/wax emulsion adhesive and a method of preparing the same by heating a thermosetting resin and adjusting the pH of the wax emulsion prior to combining the resin and wax emulsion. The use of the adhesive in making bonded composites such as wood products, including oriented strand board (OSB), parallel strand lumber, wafer board and particle board composites.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: October 17, 2000
    Assignee: Georgia-Pacific Resins, Inc.
    Inventors: Brian M. Peek, Barry W. Sewell, Roger Scott Johnson, Daniel DiCarlo
  • Patent number: 6132549
    Abstract: Discloses compositions of urea dissolved in aqueous, polymerizable phenolic resole resins, wood-product laminated composite products produced with such resins, with or without the urea, and methods for the production of wood-product laminated composites with such resins. The resins contain the alkaline polymerization product of (a) formaldehyde polymerized with phenol and aliphatic hydrocarbylphenol or (b) aliphatic hydrocarbylphenol dissolved in the resin containing the polymerization product of phenol and formaldehyde, wherein the hydrocarbylphenol has from 9 to 17 carbon atoms in the hydrocarbyl group and the quantity of hydrocarbylphenol is from about 0.2% to 5% based on the weight of the aqueous resole resin. Wood-product laminate composites bound with the above resole resin, after curing, exhibit unexpectedly low water absorption, good internal bond strength and reduced thickness swell properties.
    Type: Grant
    Filed: September 22, 1998
    Date of Patent: October 17, 2000
    Assignee: Borden Chemical, Inc.
    Inventors: Gregory F. Nieckarz, Fred E. Carlson, William D. Detlefsen