With Specified Workpiece Support Patents (Class 156/345.23)
  • Patent number: 10043650
    Abstract: A method for performing a wet chemical process over a semiconductor wafer is provided. The method includes moving the semiconductor wafer into a chemical solution. The method further includes leaving the semiconductor wafer in the chemical solution for a processing time period. The method also includes turning the semiconductor wafer upside down while the wafer is in the chemical solution. Moreover, the method includes removing the semiconductor wafer from the chemical solution.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: August 7, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventor: Yung-Ho Chen
  • Patent number: 9947517
    Abstract: Embodiments described herein generally related to a substrate processing apparatus. In one embodiment, a process kit for a substrate processing chamber disclosed herein. The process kit includes a first ring having a top surface and a bottom surface, an adjustable tuning ring having a top surface and a bottom surface, and an actuating mechanism. The bottom surface is supported by a substrate support member. The bottom surface at least partially extends beneath a substrate supported by the substrate support member. The adjustable tuning ring is positioned beneath the first ring. The top surface of the adjustable tuning ring and the first ring define an adjustable gap. The actuating mechanism is interfaced with the bottom surface of the adjustable tuning ring. The actuating mechanism is configured to alter the adjustable gap defined between the bottom surface of the first ring and the top surface of the adjustable tuning ring.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: April 17, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Olivier Luere, Leonid Dorf, Rajinder Dhindsa, Sunil Srinivasan, Denis M. Koosau, James Rogers
  • Patent number: 9218996
    Abstract: A substrate position aligner includes a substrate holding assembly, a plurality of rollers, a rotation mechanism, and a sensor. The substrate holding assembly is configured to hold a substrate in a vertical orientation. The plurality of rollers include at least two idler rollers and a drive roller. Each roller has a point on its perimeter spaced on a common radius from a center of substrate rotation defined within the substrate holding assembly. The sensor is positioned approximately on the common radius and configured to detect the presence of an orientation cut in the substrate when the orientation cut is not orientated within a range between about ?44 degrees and about +44 degrees from horizontal. A method of aligning a substrate having an orientation cut includes sensing a presence of the orientation cut when the orientation cut is not orientated within the above recited range.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: December 22, 2015
    Assignee: Applied Materials, Inc.
    Inventor: Manoj A. Gajendra
  • Patent number: 9202724
    Abstract: Provided is a substrate treatment apparatus that treats a surface of a substrate while rotating the substrate. The substrate treatment apparatus includes: a physical tool unit including a physical tool configured to treat the surface of the substrate; a nozzle unit including a liquid supply nozzle configured to supply a liquid to the surface of the substrate and a gas supply nozzle configured to supply a gas to the surface of the substrate; a physical-tool-unit moving mechanism configured to move the physical tool unit along the surface of the substrate; and a nozzle-unit moving mechanism configured to move the nozzle unit along the surface of the substrate.
    Type: Grant
    Filed: November 19, 2009
    Date of Patent: December 1, 2015
    Assignee: Shibaura Mechatronics Corporation
    Inventor: Konosuke Hayashi
  • Publication number: 20150114561
    Abstract: A liquid processing apparatus of the present disclosure performs a liquid processing by supplying a processing liquid to a substrate that is rotating. A substrate holding unit configured to be rotatable around a vertical axis is provided with a holding surface to attract and hold a bottom surface of the substrate horizontally. A guide unit is formed integrally with the substrate holding unit, disposed around the substrate held in the substrate holding unit, and provided at a position equal to or lower than a height of a top surface of a periphery of the substrate. The guide unit includes a guide surface configured to guide the processing liquid. A rotary cup rotates integrally with the substrate holding unit, and guides the processing liquid towards the cup between the rotary cup and the guide unit.
    Type: Application
    Filed: October 28, 2014
    Publication date: April 30, 2015
    Inventors: Jiro HIGASHIJIMA, Yuichi DOUKI, Masami AKIMOTO, Shigehisa INOUE
  • Patent number: 9011632
    Abstract: A support disk fixing apparatus which includes an upper surface to which a wafer is bonded, a lower surface, a cylindrical side surface between the upper surface and the lower surface, and a chamfered portion between the upper surface and the side surface, includes a base upon which the support disk is placed; and a fixture that is provided on the base, and that has a first surface that abuts against the side surface of the support disk and covers the side surface of the support disk, and a second surface that abuts against the chamfered portion of the support disk and covers the chamfered portion of the support disk.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: April 21, 2015
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Taichi Yoshida
  • Publication number: 20150093905
    Abstract: A substrate processing apparatus includes: a substrate holder to hold a substrate in a horizontal posture while rotating the substrate about a vertical rotary axis passing through the center of a plane of the substrate; a guard member having a shape extending along at least part of a surface peripheral area of the substrate, the guard member being placed in a position close to the surface peripheral area of the substrate held by the substrate holder in a noncontact manner; a cup being a tubular member with an open top end, the cup being provided so as to surround the substrate held by the substrate holder and the guard member together; and a nozzle from which a processing liquid is discharged to the surface peripheral area of the substrate held by the substrate holder. The nozzle is placed on a side opposite the cup with respect to at least part of the guard member.
    Type: Application
    Filed: September 16, 2014
    Publication date: April 2, 2015
    Inventors: Tomonori FUJIWARA, Nobuyuki SHIBAYAMA, Yukifumi YOSHIDA, Tetsuya SHIBATA, Akiyoshi NAKANO
  • Publication number: 20150059977
    Abstract: A fixture for etching PCD drill inserts is provided. The fixture system includes an etching fixture having a body with a generally cylindrical top section, a bore through the body allowing a cylindrical cutting insert to be placed into the body and to extend partially out of the bore, and a sealing element disposed adjacent an end of the bore to seal against a cutting insert which is inserted into the bore. The fixture system also includes a cap disposed over the top section of the body which extends around the outside of the top section of the etching fixture body and engages the outside of the top section of the body to seal against the body and seal the first end of the bore.
    Type: Application
    Filed: September 5, 2013
    Publication date: March 5, 2015
    Applicant: Stingray Group, LLC
    Inventor: Allen Turner
  • Publication number: 20150060407
    Abstract: A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off a liquid remaining on the substrate, and a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate.
    Type: Application
    Filed: September 2, 2014
    Publication date: March 5, 2015
    Inventors: Sei NEGORO, Ryo MURAMOTO, Yasuhiko NAGAI, Tsutomu OSUKA, Keiji IWATA
  • Publication number: 20150013905
    Abstract: A wet processing apparatus, such as a plating apparatus, and an etching apparatus, is disclosed. A wet processing apparatus includes a substrate-holder advancing mechanism configured to elevate a movable support to raise a substrate holder until the substrate holder is separated from a fixed support, move the movable support together with the substrate holder by a predetermined distance toward a holder takeout position, lower the movable support until the substrate holder is supported on the fixed support and the movable support is separated from the substrate holder, and move the movable support by the predetermined distance toward a holder put-in position.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 15, 2015
    Inventors: Yoichi NAKAGAWA, Yoshitaka MUKAIYAMA, Junitsu YAMAKAWA
  • Patent number: 8926788
    Abstract: An improved design for a closed chamber process module for single wafer wet processing utilizes a combination lid and gas showerhead for sealing the chamber from above. One or more media arms dispense liquid onto a wafer in the chamber. The media arms are mounted inside the chamber but are connected by a linkage that passes through the chamber wall to a drive unit mounted outside the chamber.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: January 6, 2015
    Assignee: Lam Research AG
    Inventor: Karl-Heinz Hohenwarter
  • Publication number: 20140374023
    Abstract: In accordance with an embodiment of the present invention, a method of polishing a device includes providing a layer having a non-uniform top surface. The non-uniform top surface includes a plurality of protrusions. The method further includes removing the plurality of protrusions by exposing the layer to a fluid that has gas bubbles and a liquid.
    Type: Application
    Filed: September 9, 2014
    Publication date: December 25, 2014
    Inventor: Johann Kosub
  • Patent number: 8900363
    Abstract: An inline vacuum processing apparatus includes a deposition unit, a process execution unit, a determination unit, and a control unit. The deposition unit causes one deposition chamber of a first deposition chamber and a second deposition chamber to execute a deposition process. The process execution unit causes the other deposition chamber to execute a process necessary for the deposition process. The determination unit measures the number of substrates processed in one deposition chamber and determines whether all substrates included in a first lot have undergone the deposition process. The control unit switches, based on a determination result from the determination unit, a process to be executed in each of the first deposition chamber and the second deposition chamber.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: December 2, 2014
    Assignee: Canon Anelva Corporation
    Inventor: Masahiro Kawata
  • Patent number: 8899565
    Abstract: A sputtering device includes a chamber; and a substrate transferring unit for loading a substrate into, or unloading the substrate from the chamber, the substrate transferring unit including a gas injection assembly forming a gas cushion between the substrate and an upper surface of the substrate transferring unit.
    Type: Grant
    Filed: June 9, 2010
    Date of Patent: December 2, 2014
    Assignee: LG Display Co., Ltd.
    Inventor: Sung Eun Kim
  • Publication number: 20140339192
    Abstract: A three-dimensional object fabrication method and apparatus to fabricate a three-dimensional object from a foamed material are provided. The method includes applying a solvent to dissolve the foamed material; dissolving and contracting the foamed material; and molding a three-dimensional object. The solvent is applied to a surface of the foamed material, thereby dissolving and contracting of the foamed material in a depth direction, or otherwise, the solvent is applied to an interior portion of the foamed material, thereby releasing air contained inside the foamed material and starting contraction of the foamed material itself. The method further includes adjusting an amount of the solvent depending on a thickness of the three-dimensional object, filling in a recess or a concavity formed in the foamed material with a molding material; solidifying the molding material as a mold; and transferring a shape of the recess or the concavity to the molding material.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 20, 2014
    Applicant: RICOH COMPANY, LTD.
    Inventor: Satoshi Kitaoka
  • Patent number: 8882960
    Abstract: An etchant is stored in a treating tank; a glass substrate is transported with transport rollers into the treating tank; the etchant is discharged from below the substrate to raise the substrate to a position above the transport rollers and below the surface of the etchant; the discharge of the etching liquid is stopped and the glass substrate is lowered to a position for contacting the transport rollers; the etchant is drained from the treating tank; and the glass substrate is unloaded with the transport rollers out of the treating tank. The disclosed method and apparatus can treat both front and back surfaces of the substrate uniformly.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: November 11, 2014
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Norio Yoshikawa, Kazuo Jodai, Yukio Tomifuji, Shigeki Minami, Kazuto Ozaki
  • Patent number: 8858755
    Abstract: A substrate edge bevel etch module for etching a material from a peripheral edge of a substrate with an etchant is described. The substrate edge bevel etch module includes a rotatable substrate holder having a support for a substrate, and a surface tension etch applicator comprising a wetted etching surface opposing a substrate surface proximate an edge of the substrate when the surface tension etch applicator is located proximate to the edge of the substrate. The surface tension etch applicator further includes an etchant dispensing portion, proximate the wetted etching surface, which dispenses an etchant in a region between the wetted etching surface and the substrate surface and wet at least a portion of the wetted etching surface and the substrate surface. A spacing between the wetted etching surface and the substrate surface is selected to retain the etchant using surface tension forces and form a meniscus there between.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: October 14, 2014
    Assignee: Tel Nexx, Inc.
    Inventors: Daniel Goodman, Arthur Keigler, Terry McElroy, Gary Boulet
  • Patent number: 8852383
    Abstract: A wet processing apparatus and method that takes advantage of a fluid meniscus to process at least a portion of a surface of an object. After one surface of the object has been processed another side or surface of the object can be similarly processed. This processing can be coating, etching, plating, to name a few. An application of the apparatus and method is in the semiconductor processing industry, especially, the processing of wafers and substrates. The method and apparatus also allows the processing of multiple surfaces of an electronic component.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: October 7, 2014
    Assignee: Materials and Technologies Corporation
    Inventor: Ricardo I. Fuentes
  • Publication number: 20140283994
    Abstract: An apparatus for liquid treatment of substrates, comprises a substrate holder and a liquid collector surrounding the substrate holder. The liquid collector comprises a trough for collecting liquid that has been used to treat a substrate. The trough is in fluid communication with a discharge conduit, and the liquid collector further comprising a recessed surface extending from a discharge opening in the trough to an inlet opening of the discharge conduit that is positioned lower than the trough. The discharge opening in the trough has a cross-sectional area that is at least twice as large in cross sectional area than the inlet opening of the discharge conduit.
    Type: Application
    Filed: March 22, 2013
    Publication date: September 25, 2014
    Applicant: LAM RESEARCH AG
    Inventor: Andreas GLEISSNER
  • Publication number: 20140272704
    Abstract: Among other things, one or more techniques and systems for performing a spin coating process associated with a wafer and for controlling thickness of a photoresist during the spin coating process are provided. In particular, a thickening phase is performed during the spin coating process in order to increase a thickness of the photoresist. For example, air temperature of down flow air, flow speed of the down flow air, and heat temperature of heat supplied towards the wafer are increased during the thickening phase. The increase in down flow air and heat increase a vaporization factor of the photoresist, which results in an increase in viscosity and thickness of the photoresist. In this way, the wafer can be rotated at relatively lower speeds, while still attaining a desired thickness. Lowering rotational speed of wafers allows for relatively larger wafers to be stably rotated.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventors: Chun-Wei Chang, Chia-Chieh Lin, Chih-Chien Wang, Wang-Pen Mo, Hung-Chang Hsieh
  • Publication number: 20140263183
    Abstract: A fixture for etching PCD drill inserts is provided. The fixture design allows the fixture to be injection molded, significantly reducing costs and allowing the fixture to be disposed of after a single use. The fixture allows for faster use and more accurate etching of the PCD insert.
    Type: Application
    Filed: June 6, 2014
    Publication date: September 18, 2014
    Applicant: STINGRAY GROUP, LLC
    Inventor: Allen Turner
  • Publication number: 20140251539
    Abstract: Disclosed are a substrate processing apparatus and a substrate processing method configured to perform a processing of a substrate by a processing liquid, in which the processing liquid is supplied to a substrate which rotates to process the substrate. The substrate processing apparatus includes a substrate rotating unit that rotates the substrate, a processing liquid supply unit that supplies the processing liquid to the substrate, a collection cup disposed around the substrate to collect the processing liquid supplied to the substrate, and form an air stream that flows downward from an opening formed at a top of the collection cup through a periphery of an outside of the substrate, and a negative pressure generating unit which is provided at an inside of the collection cup and at an outside of the opening and generates a negative pressure which acts toward the outside of the substrate.
    Type: Application
    Filed: March 6, 2014
    Publication date: September 11, 2014
    Applicant: Tokyo Electron Limited
    Inventors: Tsuyoshi Mizuno, Yoichi Tokunaga, Hiromitsu Namba, Tatuhiro Ueki, Jun Nogami, Jiro Higashijima, Yoshifumi Amano, Takatoshi Miyama
  • Patent number: 8821681
    Abstract: Disclosed is an apparatus for wet treatment of a disc-like article, which comprises: a spin chuck for holding and rotating the disc-like article, and an inner edge nozzle dispensing treatment liquid directed towards a first peripheral region of the first surface of the disc-like article, wherein the first surface is facing the spin chuck and the first peripheral region is defined as being a region of the first surface with an inner radius (ri), which is greater than 1 cm less than the disc-like article's radius (ra), wherein the inner edge nozzle is positioned in a stationary manner between the disc-like article (when placed on the spin chuck) and the spin chuck, wherein the inner edge nozzle is feed through a central pipe, which is disposed in a stationary manner and penetrates centrally through the spin chuck, for supplying a treatment liquid against a first surface of the disc-like article.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: September 2, 2014
    Assignee: Lam Research AG
    Inventors: Michael Puggl, Alexander Schwartzfurtner, Dieter Frank
  • Publication number: 20140231013
    Abstract: A substrate processing apparatus includes a phosphoric acid supply device for supplying phosphoric acid aqueous solution onto the upper surface of a substrate held on a spin chuck, a heater for emitting heat toward a portion of the upper surface of the substrate with the phosphoric acid aqueous solution being held on the substrate, a heater moving device for moving the heater to move a position heated by the heater within the upper surface of the substrate, a water nozzle for discharging water therethrough toward a portion of the upper surface of the substrate with the phosphoric acid aqueous solution being held on the substrate and a water nozzle moving device for moving the water nozzle to move the water landing position within the upper surface of the substrate.
    Type: Application
    Filed: February 12, 2014
    Publication date: August 21, 2014
    Applicant: DAINIPPON SCREEN MFG. CO., LTD.
    Inventors: TAIKI HINODE, TAKASHI OTA, NAOKI FUJIWARA
  • Publication number: 20140231012
    Abstract: A substrate processing apparatus includes a spin chuck for holding a substrate horizontally, a phosphoric acid supply device for supplying phosphoric acid aqueous solution onto the upper surface of the substrate held on the spin chuck to form a liquid film of phosphoric acid aqueous solution covering the entire upper surface of the substrate, a heating device for heating the substrate with the liquid film of phosphoric acid aqueous solution held thereon and a pure water supply device for supplying pure water onto the liquid film of phosphoric acid aqueous solution.
    Type: Application
    Filed: February 11, 2014
    Publication date: August 21, 2014
    Applicant: DAINIPPON SCREEN MFG, CO., LTD.
    Inventors: Taiki HINODE, Takashi OTA, Naoki FUJIWARA
  • Publication number: 20140199638
    Abstract: After a developing step, a substrate is spun at high speeds without supplying a cleaning liquid to a surface of the substrate. This causes a large centrifugal force to act on a developer on a resist film. Consequently, the developer can be removed rapidly from the surface of the substrate. As a result, development can be stopped at an expected timing. Moreover, a circuit pattern having an expected dimension can be obtained. At this time, a dissolved product is also removable with the developer from the substrate. This can avoid failure in development caused by the dissolved product. Consequently, suitably maintained quality of negative development can be achieved with a reduced usage amount of the cleaning liquid.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 17, 2014
    Applicant: SOKUDO CO., LTD.
    Inventors: Tadashi MIYAGI, Tsuyoshi MITSUHASHI, Takehiro WAJIKI
  • Publication number: 20140190634
    Abstract: The present disclosure provides a method of fabricating a semiconductor device. The method includes dispensing a liquid on a wafer. The method includes raising the wafer. The method includes lowering the wafer after the raising. The wafer is spun as it is lowered, thereby removing at least a portion of the liquid from the wafer. The present disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer chuck that is operable to hold a semiconductor wafer and secure the wafer thereto. The wafer has a front surface and a back surface. The apparatus includes a dispenser that is operable to dispense a liquid to the front surface of the wafer. The apparatus includes a mechanical structure that is operable to: spin the wafer chuck in a horizontal direction; and move the wafer chuck downwards in a vertical direction while the wafer chuck is being rotated.
    Type: Application
    Filed: January 21, 2014
    Publication date: July 10, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Chieh Huang, Hung Chang Hsieh
  • Publication number: 20140174657
    Abstract: An apparatus for treating a wafer-shaped article includes a rotary chuck configured to hold a wafer-shaped article of a predetermined diameter such that a surface of the wafer-shaped article facing the rotary chuck is spaced from an upper surface of the rotary chuck. A ring is mounted on the rotary chuck, and includes a first upper surface overlapping an outer peripheral edge of a wafer-shaped article when positioned on the rotary chuck and a second upper surface positioned radially inwardly of the first surface. The second upper surface is elevated relative to the first upper surface, to define an annular gap between the second upper surface and a wafer-shaped article when positioned on the spin chuck that is smaller than a distance between the first upper surface and a wafer-shaped article when positioned on the rotary chuck.
    Type: Application
    Filed: December 20, 2012
    Publication date: June 26, 2014
    Applicant: LAM RESEARCH AG
    Inventors: Koichi TASAKA, Masaichiro Ken MATSUSHITA
  • Publication number: 20140150974
    Abstract: A flexible membrane for a carrier head of a chemical mechanical polisher includes a main portion, an annular outer portion, and three annular flaps. The main portion has a substrate mounting surface with a radius R. The annular outer portion extends upwardly from an outer edge of the main portion and has a lower edge connected to the main portion and an upper edge. The three annular flaps include a first annular flap joined to an inner surface of the main portion at a radial position between 75% and 95% of R, a second inwardly-extending annular flap joined to the annular outer portion at a position between the lower edge and the upper edge, and a third inwardly-extending annular flap joined to the upper edge of the annular outer portion.
    Type: Application
    Filed: November 12, 2013
    Publication date: June 5, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Jamie Leighton
  • Patent number: 8741099
    Abstract: Disclosed is a liquid processing apparatus that includes: a rotational unit configured to rotate a substrate to be processed while the substrate is being held horizontally; and a processing liquid supplying unit configured to supply a processing liquid to the bottom surface of the substrate to be processed which is rotating. The rotational unit includes an enclosing member surrounding the periphery of the substrate to be processed, the enclosing member includes a plurality of guide grooves formed on the bottom surface of the enclosing member and configured to guide the processing liquid, and each of the plurality of guide grooves elongates outwardly from the inner periphery and is arranged in the circumferential direction of the enclosing member.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: June 3, 2014
    Assignee: Tokyo Electron Limited
    Inventor: Jiro Higashijima
  • Patent number: 8735261
    Abstract: A method and a system are described herein for applying etchant to edges of a plurality of wafers. The system includes a sump configured for holding etchant, a roller having an outer surface in fluid communication with the sump and configured to have etchant thereon, a wafer cassette configured to retain wafers positioned therein so that edges of the wafers are in contact with the roller. The cassette permits axial rotation of the wafers about an axis. A method of applying etchant to the edge of the wafer includes placing the wafer edge in contact with the roller and rotating the roller about a longitudinal axis of the roller. At least a portion of the roller contact an etchant contained in a sump during rotation so that etchant is applied to the wafer edge.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: May 27, 2014
    Assignee: MEMC Electronic Materials, Inc.
    Inventor: Robert W. Standley
  • Publication number: 20140127881
    Abstract: A support disk fixing apparatus which includes an upper surface to which a wafer is bonded, a lower surface, a cylindrical side surface between the upper surface and the lower surface, and a chamfered portion between the upper surface and the side surface, includes a base upon which the support disk is placed; and a fixture that is provided on the base, and that has a first surface that abuts against the side surface of the support disk and covers the side surface of the support disk, and a second surface that abuts against the chamfered portion of the support disk and covers the chamfered portion of the support disk.
    Type: Application
    Filed: October 21, 2013
    Publication date: May 8, 2014
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Taichi YOSHIDA
  • Publication number: 20140102637
    Abstract: In an apparatus and process for treating wafer-shaped articles, a spin chuck holds a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck. A heating assembly comprises a housing containing at least one infrared heating element. The heating assembly is mounted above the upper surface of the spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck. The housing also contains a conduit having an inlet connected to a source of cooling fluid and an outlet returning cooling fluid to the source of cooling fluid.
    Type: Application
    Filed: October 12, 2012
    Publication date: April 17, 2014
    Applicant: LAM RESEARCH AG
    Inventors: Michael BRUGGER, Otto LACH, Olivier POSTEL
  • Patent number: 8662008
    Abstract: A non-contact edge coating apparatus applies coating material to an edge of a non-circular solar cell substrate without physical contact. The apparatus may include a rotatable substrate support configured to hold the substrate. The apparatus may further include an applicator configured to receive a coating material and apply the coating material to an edge of the substrate while the substrate is rotated without any portion of the applicator physically touching the edge of the substrate. The substrate support may be mechanically coupled to a cam, which contacts a follower mechanically coupled to the applicator. A variety of coating materials may be employed with the apparatus including hot melt ink and UV curable plating resist.
    Type: Grant
    Filed: February 7, 2008
    Date of Patent: March 4, 2014
    Assignee: SunPower Corporation
    Inventors: Emmanuel Abas, Luca Pavani
  • Publication number: 20140053982
    Abstract: An apparatus and method for processing wafer-shaped articles features a spin chuck that is axially displaceable between at least two exhaust levels within a surrounding collector. A gas supply system comprises ducts for supplying gas separately to a first interior region of the collector that is above the spin chuck and a second interior region that is below the spin chuck. The pressure differential within the collector above and below the spin chuck can thereby be controlled to prevent cross-contamination between collector levels.
    Type: Application
    Filed: August 23, 2012
    Publication date: February 27, 2014
    Applicant: LAM RESEARCH AG
    Inventors: Karl-Heinz HOHENWARTER, Reinhold SCHWARZENBACHER
  • Publication number: 20140051259
    Abstract: It is an object to reduce a chemical treating width in a peripheral edge part of a substrate while suppressing deterioration in each of uniformity of the chemical treating width and processing efficiency. In order to achieve the object, a substrate processing device for carrying out a chemical treatment for a substrate using a processing liquid having a reaction rate increased with a rise in temperature includes a substrate holding portion, a rotating portion for rotating the substrate held in the substrate holding portion in a substantially horizontal plane, a heating portion for injecting heating steam to a central part of a lower surface of the substrate to entirely heat the substrate, and a peripheral edge processing portion for supplying the processing liquid from above to a peripheral edge part of the substrate heated by the heating portion, thereby carrying out a chemical treatment for the peripheral edge part.
    Type: Application
    Filed: July 30, 2013
    Publication date: February 20, 2014
    Applicant: DAINIPPON SCREEN MFG. CO., LTD.
    Inventor: Nobuyuki SHIBAYAMA
  • Publication number: 20140051258
    Abstract: It is an object to carry out a chemical treatment for a peripheral edge part of a substrate while suppressing an amount of consumption of a processing liquid and a time required for processing. In order to achieve the object, a substrate processing device injects heating steam to a peripheral edge part of a substrate to heat the peripheral edge part when carrying out a chemical treatment for the peripheral edge part of the substrate while rotating the substrate in a substantially horizontal posture. Moreover, the substrate processing device injects a gas from above the substrate toward a predetermined injection target region defined within a range surrounded by a rotating track of the peripheral edge part of the substrate in an upper surface of the substrate, thereby generating, on the substrate, a gas flow which flows from the injection target region toward the peripheral edge part of the substrate.
    Type: Application
    Filed: July 30, 2013
    Publication date: February 20, 2014
    Applicant: DAINIPPON SCREEN MFG. CO., LTD.
    Inventors: Kenji IZUMOTO, Nobuyuki SHIBAYAMA
  • Publication number: 20140041803
    Abstract: In an apparatus and method for treating a wafer-shaped article, a rotary chuck is configured to hold a wafer-shaped article of a predetermined diameter such that a surface of the wafer-shaped article facing the rotary chuck is spaced from an opposing peripheral surface of the rotary chuck. The opposing peripheral surface comprises a first surface overlapping an outer peripheral edge of a wafer-shaped article when positioned on the spin chuck and a second surface positioned radially inwardly of the first surface and meeting the first surface at an interface that is radially inward of and substantially concentric with a wafer-shaped article when positioned on the rotary chuck. The second surface is substantially more hydrophobic than the first surface.
    Type: Application
    Filed: August 8, 2012
    Publication date: February 13, 2014
    Applicant: LAM RESEARCH AG
    Inventors: Takehito KOSHIZAWA, Noriaki KAMEKAWA, Kei KINOSHITA, Michael PUGGL
  • Publication number: 20140041689
    Abstract: A substrate processing apparatus includes a substrate holding part, a substrate rotating mechanism, and a chamber. The substrate rotating mechanism incudes an annular rotor part disposed in an internal space of the chamber and a stator part disposed around the rotor part outside the chamber. The substrate holding part is attached to the rotor part in the internal space of the chamber. In the substrate rotating mechanism, a rotating force is generated about a central axis between the stator part and the rotor part. The rotor part is thereby rotated about the central axis, being in a floating state, together with a substrate and the substrate holding part. In the substrate processing apparatus, the substrate can be easily rotated in the internal space having excellent sealability. As a result, it is possible to easily perform single-substrate processing in a sealed internal space.
    Type: Application
    Filed: August 2, 2013
    Publication date: February 13, 2014
    Applicant: DAINIPPON SCREEN MFG. CO., LTD.
    Inventor: Toshimitsu NAMBA
  • Publication number: 20130309874
    Abstract: An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, a liquid dispenser for dispensing a treatment liquid onto a downwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and a gas dispenser for dispensing a gas within a gap defined between the downwardly-facing surface of the wafer-shaped article and an upper surface of the spin chuck.
    Type: Application
    Filed: May 15, 2012
    Publication date: November 21, 2013
    Applicant: LAM RESEARCH AG
    Inventors: Kei KINOSHITA, Keisuke SATO
  • Patent number: 8580585
    Abstract: A method for forming identical isotropic etch patterns in an etch system is disclosed. The method comprises providing a wafer paddle, a wafer, a plurality of identical etch systems, utilizing identical etch recipes within each of the plurality of etch systems, providing a fixed temperature stability time FTST for each system so that the heat transfer from the paddle to the wafer is constant, wherein the FTST is the same on each of the plurality of etch systems; and utilizing the plurality of identical etch systems to produce identical etches on each of the wafers based upon the FTST, wherein a five-second preheat step in the etch process is not utilized.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: November 12, 2013
    Assignee: Micrel, Inc.
    Inventor: Howard Kurasaki
  • Publication number: 20130260574
    Abstract: In a substrate processing apparatus, with an internal space of a chamber brought into a reduced pressure atmosphere, a first processing liquid is supplied onto an upper surface of a substrate while the substrate is rotated, and the first processing liquid is thereby quickly spread from a center portion toward a peripheral portion on the upper surface of the substrate. It is thereby possible to coat the upper surface of the substrate with the first processing liquid in a shorter time as compared with under normal pressure. Further, by sucking the first processing liquid from the vicinity of an edge of the substrate, it is possible to coat the upper surface of the substrate with the first processing liquid in a still shorter time. As a result, it is possible to shorten the time required for the processing of the substrate.
    Type: Application
    Filed: March 28, 2013
    Publication date: October 3, 2013
    Applicant: DAINIPPON SCREEN MFG. CO., LTD
    Inventors: Hirofumi MASUHARA, Kenichiro ARAI, Masahiro MIYAGI, Toru ENDO
  • Publication number: 20130260570
    Abstract: In a substrate processing apparatus, with an internal space of a chamber brought into a pressurized atmosphere, an etching process is performed by continuously supplying a first processing liquid onto an upper surface of a substrate while rotating the substrate. It is thereby possible to suppress vaporization of the first processing liquid on the substrate and further suppress a decrease in the temperature of the substrate due to the heat of vaporization as it goes from a center portion of the substrate toward a peripheral portion thereof as compared with under normal pressure. As a result, it is possible to improve the uniformity in the temperature of the upper surface of the substrate during the etching process using the first processing liquid and improve the uniformity of etching over the entire upper surface of the substrate.
    Type: Application
    Filed: March 28, 2013
    Publication date: October 3, 2013
    Applicant: DAINIPPON SCREEN MFG. CO., LTD
    Inventors: Hirofumi MASUHARA, Kenichiro ARAI, Masahiro MIYAGI, Toru ENDO
  • Publication number: 20130248491
    Abstract: A support structure removal system comprising a vessel and a second component. The vessel comprises a vessel body, a porous floor configured to retain a three-dimensional part, and an impeller rotatably mounted below the porous floor. The second component comprises a surface configured to operably receive the vessel, and a rotation-inducing assembly located below the surface, where the rotation-inducing assembly is configured to rotate the impeller with magnetic fields when the vessel is received on the surface of the second component to agitate and direct flows of an aqueous fluid through the porous floor.
    Type: Application
    Filed: May 17, 2013
    Publication date: September 26, 2013
    Inventors: William J. Swanson, Dominic F. Mannella, Ronald G. Schloesser
  • Publication number: 20130180955
    Abstract: An apparatus for forming selectively coated areas on a substrate comprises an extrudate remover configured to selectively remove coating from a selected portion of the substrate. A chuck is configured to secure the substrate. A coating die is arranged proximal the substrate and is in fluid communication with a source of fluid extrudate. During relative motion between the substrate and the coating die, fluid extrudate is deposited onto the substrate. A controller is configured to selectively control the relative motion between the substrate and coating remover, and to control operation of the extrudate remover. The invention also provides a method of forming selectively coated areas on a substrate comprising the steps of inducing relative movement between a coating dispenser and the substrate, applying fluid material from the coating dispenser onto the substrate during the relative movement, and selectively removing a portion of the applied fluid from the substrate.
    Type: Application
    Filed: February 7, 2012
    Publication date: July 18, 2013
    Inventors: Gregory Gibson, Scott Snodgrass
  • Publication number: 20130164685
    Abstract: The present disclosure provides a method of fabricating a semiconductor device. The method includes dispensing a liquid on a wafer. The method includes raising the wafer. The method includes lowering the wafer after the raising. The wafer is spun as it is lowered, thereby removing at least a portion of the liquid from the wafer. The present disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer chuck that is operable to hold a semiconductor wafer and secure the wafer thereto. The wafer has a front surface and a back surface. The apparatus includes a dispenser that is operable to dispense a liquid to the front surface of the wafer. The apparatus includes a mechanical structure that is operable to: spin the wafer chuck in a horizontal direction; and move the wafer chuck downwards in a vertical direction while the wafer chuck is being rotated.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 27, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,
    Inventors: Wei-Chieh Huang, Hung Chang Hsieh
  • Patent number: 8435380
    Abstract: A substrate chucking member includes a substrate supporting member and a rotation adjustment unit. The supporting member includes a rotatable supporting plate to load a substrate, and chucking pins disposed at the supporting plate for spacing the substrate off the top of the supporting plate by supporting the edge of the substrate from a side of the substrate. Each of the chucking pins is rotatable for rotating the substrate supported on the chucking pins. The rotation adjustment unit is disposed under the supporting plate for adjusting rotation of the chucking pins. During a process, since a substrate is rotated by the chucking pins to vary points of the substrate making contact with the chucking pins, positions of the substrate where a process liquid falls after colliding with the chucking pins can be continuously varied. Therefore, the substrate can be processed without defects at an end part of the substrate.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: May 7, 2013
    Assignee: Semes Co., Ltd.
    Inventors: Bong Joo Kim, Taek Youb Lee
  • Publication number: 20130102158
    Abstract: A liquid composition for wet etching has improved selectivity for polysilicon over silicon dioxide, even when the polysilicon is heavily doped and/or the silicon dioxide is a low temperature oxide. The composition comprises 0.05-0.4 percent by weight hydrofluoric acid, 15-40 percent by weight nitric acid, 55-85 percent by weight sulfuric acid and 2-20 percent by weight water. A method and apparatus for wet etching using the composition are also disclosed.
    Type: Application
    Filed: October 19, 2011
    Publication date: April 25, 2013
    Applicant: LAM RESEARCH AG
    Inventor: Stefan DETTERBECK
  • Patent number: 8425718
    Abstract: The present invention provides a method of wet etching a silicon slice including a silicon substrate and a metal film layer thereon comprising steps of: performing lithographic process to the silicon slice forming a masked silicon slice comprising the silicon substrate and a partially masked metal film thereon; immersing the masked silicon slice into an etchant; rotating the masked silicon slice in the etchant; injecting high-purity nitrogen gas into the etchant for agitating the etchant; removing the masked silicon slice out of the etchant, upon completion of etching; and rinsing the masked silicon slice with deionized water.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: April 23, 2013
    Assignee: University of Electronic Science and Technology of China
    Inventors: Yadong Jiang, Zhiming Wu, Tao Wang, Weizhi Li, Xiaolin Han
  • Publication number: 20130062015
    Abstract: A wet etching apparatus and a wet etching method for etching a glass substrate are disclosed. The wet etching apparatus comprises a driving device, a supporting stage, a vibrating device and a substrate fixing rack. The glass substrate is fixed at the top of the substrate fixing rack and a bottom portion of the substrate fixing rack is connected with the vibrating device; the vibrating device is fixed on the supporting stage to drive the substrate fixing rack to reciprocate; and the supporting stage is disposed on the driving device and moves along with the driving device. According to the present disclosure, by controlling the vibrating device to drive the glass substrate to reciprocate in a direction where it is desired to accelerate the etching speed, the probability that the etched material interacts with the etching solution can be enhanced to increase the side etching rate.
    Type: Application
    Filed: September 20, 2011
    Publication date: March 14, 2013
    Applicant: Shenzhen China Star Optoelectronics Technology Co. Ltd.
    Inventor: Wen-da Cheng