Abstract: An electrostatic chuck and a base member are separated from each other while heating up a substrate mounting member to a thermal decomposition temperature within a range from a thermal decomposition starting temperature to a thermal decomposition ending temperature and then softening and decomposing an organic adhesive layer.

Abstract: Process for waterproofing semimanufactured footwear, clothing items and accessories, said semimanufactured product having a three-dimensional conformation with at least one inner surface and one outer surface, which comprises the following operative steps: arranging the semimanufactured product onto a shaped support (14; 27, 28; 30, 31) with at least one waterproofing sheath (18) shaped for entirely or partially cover the surfaces to be waterproofed of the semimanufactured product, at least one glue layer being arranged between these surfaces and the waterproofing sheath (18); pressing between two deformable plates (2, 2?) the semimanufactured product provided with the waterproofing sheath (18) and arranged on the shaped support (14; 27, 28; 30, 31). The present invention also relates to a machine that carries out said process, as well as the semimanufactured products obtained with said process or machine.

Abstract: There is disclosed a method of producing a solar cell module comprising the steps of: mounting a body to be laminated onto a tabular member, carrying in the body to be laminated along with the tabular member onto a heated mounting board; heat-bonding the body to be laminated by pressing with an expanding unit; carrying out the body to be laminated along with the tabular member from the mounting board after parting the expanding unit from the body to be laminated; and separating the body to be laminated from the tabular member. By using the method, a temperature of the body to be laminated does not increase rapidly and a foaming phenomenon is suppressed, thereby allowing manufacturing of the solar cell module with a high yield.

Abstract: A vacuum forming machine according includes a chamber configured to be loaded with a base member and a decorative sheet, a frame arranged to surround the base member that has been loaded into the chamber, a pressure reducer arranged to reduce the pressure inside the chamber, and a communication path arranged to establish communication between the inside of the frame and an external space at the atmospheric pressure.

Abstract: A tool on which material (M) can be moulded to form a moulded article, the tool comprising a surface, which may be provided on a surface layer, defining one or more pathways for the removal of gaseous material from beneath the material (M) being moulded on the tool.

Abstract: An improved wafer-to-wafer bonding method includes aligning an upper and a lower wafer and initiating a bond at a single point by applying pressure to a single point of the upper wafer via the flow of pressurized gas through a port terminating at the single point. The bond-front propagates radially across the aligned oppositely oriented wafer surfaces at a set radial velocity rate bringing the two wafer surfaces into full atomic contact by controlling the gas pressure and/or controlling the velocity of the motion of the lower wafer up toward the upper wafer.

Abstract: An apparatus for forming a hollow FRP article by internal pressure molding includes a vacuum chamber, a forming die positioned in the vacuum chamber, a vacuum-chamber opening/closing mechanism, a composite-body support device for supporting a composite body without making the composite body come into contact with the forming die in a state where the forming die is opened by the vacuum-chamber opening/closing mechanism, the composite body including an airtight internal-pressure holding tube and a prepreg fitted on said airtight internal-pressure holding tube, an evacuation system for evacuating the vacuum chamber, an internal-pressure supplying device for applying pressure to an inside of the internal-pressure holding tube, and a controller for actuating the vacuum-chamber opening/closing mechanism to clamp the forming die to thereby bring the forming die and the composite body into intimate contact with each other.

Abstract: There is provided a laminating apparatus laminating an object to be laminated in a laminating part which has a diaphragm on an upper side and a heater panel on a lower side, by melting a filler in the object to be laminated and pressing the object to be laminated sandwiched between the diaphragm and the heater panel, the apparatus including: a sheet conveying the object to be laminated placed thereon to/out of the laminating part; and a lift mechanism lifting up/down a support part capable of supporting the sheet from the lower side.

Abstract: An inter-substrate material layer is formed between a first substrate and a second substrate to generate a bonding strength. A plurality of metal elements are present in the inter-substrate material layer. An interface element existence ratio of the plurality of metal elements is 0.07 or above. A device can be obtained in which substrates difficult to bond (for example, SiO2 substrates) are bonded at room-temperature to have practical bonding strength.

Abstract: A flexible compaction sheet is used to compact uncured composite plies onto the surface of a ply layup. The compaction sheet includes a peripheral seal that seals the perimeter of the sheet to the surface of the part layup and forms a vacuum chamber over the plies which is evacuated through the sheet to apply compaction pressure to the plies.

Abstract: A device for manufacturing a composite material part that includes a resin matrix reinforced by fibers and having a recessed shape with a small opening, whereby the device includes a mold whose shapes are adapted to those of the part to be produced, a compacting membrane and at least one shim that is placed in the recessed zone between the part and the compacting membrane whose function is to transmit the pressure exerted by the compacting membrane to the surfaces of the part that is in contact with the shim. The shim can be expanded and is able to occupy a first state before polymerization in which it occupies a low volume so as to allow its insertion into the recessed zone, and a second state, in particular during polymerization, in which it occupies a larger volume so as to exert pressure on the surfaces of the recessed zone.

Abstract: A lamination apparatus and a laser-induced thermal imaging method using the same are provided. The lamination apparatus comprising: a chuck for fixing first and second substrates; and having at least one vacuum hole located therein and exposed outside of the first substrate therein.

Abstract: It is an aspect of the present invention to provide a wafer bonding apparatus having a pressing apparatus configured to press wafers fixed in a fixing apparatus, wherein the fixing apparatus is configured to allow the pressing apparatus to press the wafers without interference. The wafer bonding apparatus may include an upper wafer and a lower wafer, a support member configured to support the upper wafer and the lower wafer, a push member on the upper wafer, and a fixing apparatus configured to fix the push member to the support member, wherein the push member includes a fixing part extending outward from a periphery of the upper wafer, and the fixing apparatus is coupled to the fixing part. It is also an aspect of the present invention to provide a method for bonding wafers.

Abstract: A method and a laminating press for laminating work pieces which have at least one adhesive layer that can be activated by heat, under the effects of pressure and heat. Here, at least one work piece is introduced into an open press chamber of a laminating press that can be closed in an air-tight fashion. The press includes an upper chamber half and a lower chamber half. They are movable in reference to each other in order to open and close the press chamber, and a circumferential gasket is arranged between the upper and the lower chamber half. A membrane is mounted directly or indirectly at the upper chamber half and divides the press chamber in an air-tight fashion, and a heater is located to heat the work piece.

Abstract: A machine for decorating objects (1, 17, 36) having any shape whatsoever, comprising: a decoration plane on which the object to be decorated is placed; a decoration device (7, 51) with a component made of a thin, elastic and flexible material on which an image of the decoration is generated; a pressure device for deforming said component in flexible material to make it adhere, together with the decoration of the image, to the curved surface of the object to be decorated, acting with greater pressure on the back of said component in flexible material with respect to the pressure applied to the surface with the image; characterised in that the object to be decorated (1, 17, 36) is transported on a conveyor belt (2, 16, 22, 32, 35, 45) into the machine from the loading area (4) to the decoration area (6, 37) and then to the unloading area (5); furthermore, the component in flexible material is a thin, elastic and flexible tape (3), stretched over transport and rolling organs is positioned at a short distance fro

Abstract: In one embodiment of the invention, a bonding material is used to bond a substitute substrate to the LED, wherein the bonding material does not including gold or tin. The bonding material preferably includes gallium (Ga), such as a combination of Ga and Al or Cu. This bonding material has high thermal conductivity, high strength, high temperature stability and is low cost. In another embodiment of the invention, the substitute substrate is first thinned before it is bonded to the LED structure, so that the substitute substrate is flexible and conforms to the shape of the LED structure. In yet another embodiment of the invention, an apparatus is used for bonding a substitute substrate to a LED which comprises a plurality of semiconductor epitaxial layers, said semiconductor epitaxial layers having been grown on the growth substrate so that said semiconductor epitaxial layers are curved in shape.

Abstract: A tool for laminating a metal foil and polymer film to form a laminate structure is disclosed. A method of using the tool to form a laminate structure is also disclosed.

Abstract: A method and a device for laminating essentially planar work pieces with at least one adhesive layer that can be activated by heat, under the effects of pressure and heat. Initially at least one work piece is inserted into a vacuum chamber of a vacuum lamination press which is divided by a gas-tight flexible compression member into a product half and a pressure half. In the product half of the vacuum chamber, the work piece is subjected to a lamination process under the effects of heat, in which the product half is evacuated and the compression member is pressed directly or indirectly against the bottom of the vacuum chamber by the pressure difference developing here and/or by an additional pressurization of the pressure half of the vacuum chamber. The lamination process is interrupted by opening the vacuum lamination press, the work piece is transferred into a laminator, and here it is subjected to a temperature at or above the activation temperature and/or the curing temperature of the adhesive layer.

Abstract: The invention relates to methods for making panels of an expanded renewable material, essentially starch, characterised in that it comprises: extruding unit members or strings having a small section and a substantial length L; assembling by juxtaposing and gluing these strings thus obtained along their longitudinal axis in order to produce a layer having a width A; superimposing and assembling by gluing at least two of said string layers in order to produce a block having a height B and a length L, said block thus exhibiting a section with a side A and a side B having dimensions related to the number of assembled unit members; and cutting said block transversally relative to the longitudinal axis along a length l in order to obtain plates having a maximal section of A×B with a selected thickness l. The invention also relates to a related device.

Abstract: A bonding machine for fabricating an liquid crystal display (LCD) panel to which a liquid crystal dropping method been performed includes a bonding chamber of a one pieced body for carrying out bonding of substrates, at least two or more than two air extraction tubes in communication with an interior space of the bonding chamber, and at least two vacuum means respectively connected to the air extraction tubes each for generating an air suction power to evacuate the bonding chamber. A method for fabricating an LCD panel by using the bonding machine includes loading a first substrate onto which liquid crystal has been dropped and a second substrate having sealant coated thereon into a bonding chamber, evacuating the bonding chamber, bonding the first and second substrates, applying varying bonding pressure, and unloading the bonded first and second substrates.

Abstract: A target assembly including a plurality of target tiles bonded to a backing plate by adhesive, for example of indium or conductive polymer, filled into recesses in the backing plate formed beneath each of the target tiles. A sole peripheral recess formed as a rectangular close band may be formed inside the tile periphery. Additional recesses may be formed inside the peripheral recess, preferably symmetrically arranged about perpendicular bisectors of rectangular tiles. The depth and width of the recesses may be varied to control the amount of stress and the stress direction.

Abstract: An apparatus for attaching two substrates to one another includes a lower chamber that holds a first substrate and an upper chamber that holds a second substrate. The upper and lower chambers are brought together to provide a space in which an attaching process is performed. Chamber transportation mechanisms are located at corners of the lower chamber and serve to move the lower chamber up toward the upper chamber so that it can be coupled with the upper chamber. Guide parts are also formed on side surfaces of the lower chamber to guide movement, and to reduce deformation of the chamber when pressure differentials act to deform the sides of the chamber.

Abstract: The invention relates to a method for the production of sandwich components with an open core structure 2 and a cover layer 1, 3 applied to each side, wherein the cover layers 1, 3 are formed with a curable plastic material, and the sandwich component is cured in a closed device under pressure. According to the invention, a charging gas, in particular nitrogen or air, is introduced to the core structure 2 prior to at least partial solidification of the cover layers 1, 3, wherein a charging gas pressure pCharging gas is selected that is less than or equal to an operating pressure pOperating of the closed device in order to, in particular, at least largely prevent the formation of sink marks in the cover layers (1, 3). Furthermore, the invention relates to a press for implementing the method.

Abstract: The inventive laminator for laminating structural components, in particular solar module cells or laminated glass panes by combining pressing force and heat, wherein said laminator comprises at least one laminating chamber for receiving one or several structural components, which is provided with a support for said structural components, a heating unit and with a flexible compression membrane which is sealingly stretched in the chamber above the structural element support and is movable with respect thereto. Said membrane separates a lower part of the chamber from a top part thereof, thereby enabling each part to be void of air and aerated. The inventive laminator is characterised in that the copression membrane is embodied in the form of a multiple membrane consisting of a plurality of superimposed membranes.

Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.

Abstract: A device and a method for bonding a tape, by which a tape member may be preferably bonded to a work piece, and simplified processing, reduced cost, and improved bonding strength may be realized.

Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

Abstract: A tape bonding device for bonding a tape member to a work piece: having a rubber sheet on the upper surface of which the work piece is mounted, a first vacuum chamber located on the side of the upper surface of the rubber sheet, a second vacuum chamber located on the side of the lower surface of the rubber sheet, a holding member which holds the rubber sheet without coming and going of the air between a first and a second vacuum chambers and, a tape holding unit which holds the tape member in a stretched state, and locates the tape member in the upper portion of the work piece, a first sucking unit which performs vacuum suction of a first vacuum chamber, a first air introducing unit which introduces the air into the first vacuum chamber, a second sucking unit which performs vacuum suction of a second vacuum chamber, a second air introducing unit which introduces the air into the second vacuum chamber.

Abstract: A device and method for bonding objects to be bonded each having a metal bonding portion on a substrate, comprising cleaning means for exposing the metal bonding portions to a plasma having an energy enough to etch the surfaces of the metal bonding portions at a depth of 1.6 nm or more over the entire surfaces of the metal bonding portions under a reduced pressure and bonding means for bonding the metal bonding portions of the objects taken out of the cleaning means in an atmospheric air. By using a specific scheme, metal bonding portions after the plasma cleaning can be bonded in the atmospheric air, thereby significantly simplifying the bonding process and the whole device and lowering the cost.

Abstract: A device and a method for filling with a gas other than air an insulating glazing unit composed of at least two glass panes and at least one spacer frame, comprising a movable and a fixed bed. The fixed bed is provided with retractable suckers suitable to capture a lower flap of a glass pane and move therewith with a motion of retraction with respect to the movable bed, such as to provide straightening of the lower flap of the glass pane.

Abstract: There are provided an adhesion promoting process using a comparatively small amount of an adhesion promoting gas for processing a workpiece, an adhesion promoting device for carrying out the adhesion promoting process, a coating and developing system including the adhesion promoting device, and a storage medium storing a program specifying a set of instructions for carrying out the adhesion promoting process.

Abstract: A method of sealing an Organic Light-Emitting Diode (OLED) assembly is disclosed. A dry film adhesive is applied to a capping layer. An OLED assembly is placed in a cavity of a fixture. The capping layer is positioned in the cavity of the fixture such that a first edge of the capping layer contacts the OLED assembly and a second edge of the capping layer is separate from the OLED assembly. Atmospheric pressure is reduced between the capping layer and the OLED assembly. The second edge of the capping layer is dropped such that the second edge of the capping layer is adjacent the OLED assembly.

Abstract: An apparatus to apply a material to an object. An ambience of a first chamber can be kept in inert gas. An ambience of a second chamber can be replaced between inert gas and air. A connecting channel connects between the first and second chambers. A first openable and closable door is provided between the first and second chambers. A second first openable and closable door is provided on the second chamber. A first holder in the first chamber can detachably hold an applicator. A second holder in the second chamber can detachably hold the applicator. A moveable table in the second chamber moves the applicator which is filled with the material and held by the second holder from the second chamber to the first chamber through the connecting channel. The moveable table moves the applicator which ends the application of the material from the first chamber to the second chamber through the connecting channel.

Abstract: A system for sealing thermoplastic film includes one or more bag sealing units, each comprising a lower vacuum platen and a vacuum chamber cover adapted for sealing engagement on the platen to form a vacuum chamber. A sealing bar assembly includes a sealing bar designed for constant heated operation and a pair of cooling plates which function as heat sinks. The sealing bar assembly is pneumatically reciprocated between a raised, disengaged position and a lowered position with the sealing bar engaging the neck of a bag for hermetically sealing same. The cooling plates clamp the bag neck against a sealing support assembly. A method of sealing a thermoplastic film bag includes the steps of placing a packaging object in a thermoplastic bag and placing the bag on a cradle with the bag neck extending over a bag support assembly. A. vacuum chamber cover is placed on the platen and evacuated to form a vacuum chamber. A sealing bar assembly melds the thermoplastic to form a sealed area across the bag neck.

Abstract: An apparatus for laminating substrates includes a laminating fixture having an open-topped recessed space formed by a pair of corresponding sidewalls for holding a target substrate therein. The recessed space is communicable with an air evacuation passage. A supporting structure is formed in the recessed space for supporting two opposite ends of a flexible substrate thereon, such that a bottom of the flexible substrate is spaced from a laminating surface of the target substrate by a predetermined distance. A soft plate is disposed over the open-topped laminating fixture to form an airtight chamber in the laminating fixture. When the airtight chamber is vacuumed using a vacuum pump via the evacuation passage, the soft plate is subjected to a suction pressure and downward deformed to press the flexible substrate downward, causing the flexible substrate to deflect to attach its bottom on the laminating surface of the target substrate.

Abstract: A tape binding device includes a table. The table includes a tape passage groove allowing to pass a tape having a greater width than a width of a material to be bound. A loop forming mechanism for forming a loop of the tape includes a first belt conveying mechanism disposed below the table. The first belt conveying mechanism includes a plurality of conveying belts provided with spaces to be spaced apart in a direction perpendicular to a conveyance direction of the tape. The tape is sucked to the conveying belts and conveyed by sucking air through the spaces. Placing portions of plurality of placing members driven to an upper position by a driving mechanism place the material to be bound thereon located above the conveying belts of the first belt conveying mechanism. At least one of the placing portions is arranged to advance above the conveying belts through a space between the corresponding conveying belts.

Abstract: Embodiments of the present invention generally relate to sputtering targets used in semiconductor manufacturing. In particular, the invention relates to bonding the sputtering target to a backing plate that supports the sputtering target in a deposition chamber. In one embodiment, a method of bonding at least one sputtering target tile to a backing plate comprises providing an elastomeric adhesive layer between the at least one sputtering target tile and the backing plate, and providing at least one metal mesh within the elastomeric adhesive layer, wherein at least a portion of the at least one metal mesh contacts both the at least one sputtering target tile and the backing plate, and the at least a portion of the at least one metal mesh is made of metal wire with diameter greater than 0.5 mm.

Abstract: Certain example embodiments of this invention relate to evacuation and sealing techniques for VIG units, and/or multi-chamber vacuum ovens for accomplishing the same. In certain example embodiments, a VIG assembly is inserted into a multi-chamber apparatus to successively reduce the chamber pressure and thus the pressure between substrates comprising the VIG assembly until a final evacuation pressure is reached. Once the final evacuation pressure is reached, a pump-out port or tube of the VIG assembly is sealed forming a VIG unit while the VIG assembly is still in the vacuum chamber. After sealing, chamber pressures are gradually increased to atmospheric while the gap between the substrates of the VIG unit remains at a pressure less than atmospheric which is close to the final evacuation pressure.

Abstract: A pressure debulking system includes a debulking chamber having a debulking chamber interior, a pressure bladder having a bladder interior provided in the debulking chamber interior, a vacuum port disposed in fluid communication with the debulking chamber interior and a pressure port disposed in fluid communication with the debulking chamber interior. A pressure debulking method is also disclosed.

Abstract: The invention relates to a method for manufacturing a moulding from a plastic, preferably a fibre-reinforced plastic, which method comprises at least the steps of stacking at least one plastic layer to form a laminate; arranging the laminate between at least two membranes, at least one of which comprises heating elements; bringing the thus formed assembly to a first temperature by heating the heating elements of at least one membrane; forming the assembly by making use of a shaping tool brought to a second temperature. The invention also relates to a device for performing the method and a heatable membrane to be applied in the method.

Abstract: The present disclosure provides a bonding apparatus. The bonding apparatus includes a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer.

Abstract: Collation and welding of card component sheets can be performed in a simple facility. Plastic cards such as IC cards having substantially no distortion and twisting are provided. A round hole (17) and an ellipse hole (18) are formed at the corresponding positions in layered component sheets (19a to 19d), and positioning pins (21) are inserted and passed through respective holes. Since at this occasion, the ellipse hole (18) has play relative to the positioning pin (21), the distortion and twisting of each card component sheet can be adsorbed, and the appearance can be improved by avoiding printing dislocation and the like. It is also able to prevent mechanical strength from lowering due to residual stress.

Abstract: An object is to provide a uniform semiconductor substrate in which defective bonding is reduced. A further object is to manufacture the semiconductor substrate with a high yield. A first substrate and a second substrate are bonded in a reduced-pressure atmosphere by placing the first substrate at a certain region surrounded by an airtight holding mechanism provided over a support to surround the certain region of a surface of the support; placing the second substrate so as to come to be in contact with the airtight holding mechanism to ensure airtightness of a space surrounded by the support, the airtight holding mechanism, and the second substrate; evacuating the space whose airtightness is secured, thereby reducing an pressure in the space; disposing the second substrate in close contact with the first substrate using difference between the pressure in the space and outside atmpspheric pressure; and performing heat treatment.

Abstract: A thermal contact-bonding method employs a thermal contact-bonding apparatus including at least a hot plate, an upper chamber, and a resin sheet provided at a lower portion of the upper chamber. The method includes the steps of pressing the upper chamber against the hot plate, while at least a part of a surface of the hot plate is separated from the resin sheet, to be in a stand-by state of the thermal contact-bonding apparatus, for a time of not charging a material to be processed, charging the material to be processed between the resin sheet and the hot plate, and subjecting the material to be processed to a thermal contact-bonding processing by making a space between the resin sheet and the hot plate under a vacuum state.

Abstract: A ply placement device uses a ply guide to place plies on a curved substrate surface. The ply guide includes a guide surface and a guide edge that are each curved to match the contour of the substrate so that the ply transitions smoothly from its planar form to a curved form as the ply is placed onto the substrate. The ply guide may be flexible or segmented to allow reconfiguration of the guide surfaces to match various substrate contours.

Abstract: The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.

Abstract: The present disclosure is directed to a substrate lamination system and method. A substrate lamination apparatus may comprise: (a) a vacuum chamber; (b) a flexible membrane; and (c) a substrate support. A system for laminating substrates may comprise: (a) a vacuum chamber; (b) a flexible membrane; (c) a substrate support; (d) a vacuum pump; (e) a compressor; and (f) a control unit, wherein the control unit is configured to carry out the steps: (i) evacuating the vacuum chamber; and (ii) applying pressure to at least one of a first substrate and a second substrate.

Abstract: The present disclosure is directed to a substrate lamination system and method. A method for laminating substrates may comprise: (a) disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) evacuating the vacuum chamber; (d) applying pressure to at least one of the first substrate and the second substrate.

Abstract: The present invention relates to a method of manufacturing a laminate with the formation of underpressure between a mould and a vacuum foil and supply of resin from injection areas to the layers of the laminate situated in the mould. The novel aspect according to the invention comprises movement of the injection areas while the resin is supplied. This is accomplished by use of a movable suction unit which is arranged on top of the vacuum foil and which, by means of an underpressure between the suction unit and the vacuum foil, forms injection areas for supply of the resin, which can be moved by moving the suction unit. The invention further relates to such movable suction unit and the use thereof in the manufacture of laminates.

Abstract: Provided is an adjusting method of a gap width of a laminated body composed of a color filter substrate and a TFT array substrate. A decompression chamber acting as a closed space communicating with a vacuum pump is decompressed, while a pressurization chamber that includes a decompression chamber is pressurized by driving a compressor.