Evacuated Or Fluid Pressure Chamber Patents (Class 156/382)
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Patent number: 8062451Abstract: A method of laminating a decorative layer to a molded part comprises molding a part formed of an amorphous or semi-crystalline thermoplastic resin and applying a segment of co-extruded an amorphous or semi-crystalline thermoplastic resin film to the part. The part is loaded into a vacuum forming nest and maintained in a heated state. The film is heated and then positioned over the part in a pressure box. A vacuum is applied through the vacuum forming nest to a first side of the film facing the part at the same time air pressure is applied through the pressure box to a second side of the film. The film is bonded directly to the part without the need for an adhesive.Type: GrantFiled: February 23, 2009Date of Patent: November 22, 2011Assignee: Delta Engineered PlasticsInventors: Wilfried Mozer, Brian L. DeSmith
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Patent number: 8048254Abstract: A mounting method is provided for mounting electric components on both faces of a substrate. Because the electric components on a front face and a rear face of the substrate are simultaneously pressed with first and second pressing rubbers, the electric components can be connected to the front face and the rear face of the substrate at a time. Because the peripheries of the first and second pressing rubbers are surrounded by a dam member when the first and second pressing rubbers deform, the first and second pressing rubbers are dammed by the dam member and not spread. Thus, positional slip of the electric components does not occur. Because the electric components are connected to the substrate at the same positions as at the time of temporary compression bonding, an electric component having high connection reliability is obtained.Type: GrantFiled: August 20, 2008Date of Patent: November 1, 2011Assignee: Sony Chemical & Information Device CorporationInventor: Takashi Matsumura
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Publication number: 20110240214Abstract: A system for processing a composite material may comprise a chamber, a mandrel, an upper ramp, and an upper diaphragm. The chamber generally provides structural support while a vacuum is applied to the system and may have a six-sided generally rectangular box shape. The mandrel generally provides support for the composite material, and may be located within the chamber. The upper ramp generally provides a path for the upper diaphragm to follow under vacuum, and may be located adjacent to the mandrel and tilted at approximately 45 degrees downward thereto. The upper diaphragm may be placed over an opening along one side of the chamber. During processing, a vacuum may be applied to chamber and the upper diaphragm may be pulled inward through the opening to press the composite material against the mandrel.Type: ApplicationFiled: April 6, 2010Publication date: October 6, 2011Applicant: SPIRIT AEROSYSTEMS, INC.Inventors: William Joseph Bryant, Christopher J. Morrow, Kenneth I. Fried
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Patent number: 8028735Abstract: There is provided a laminating apparatus laminating an object to be laminated by introducing a fluid into an upper chamber demarcated by a diaphragm and sandwiching and pressing the object to be laminated placed on a heater panel by the diaphragm expanded by the introduced fluid, the apparatus including: a tank part in which the fluid to be introduced into the upper chamber is stored; and a heating mechanism heating the fluid stored in the tank part.Type: GrantFiled: November 9, 2007Date of Patent: October 4, 2011Assignee: NPC IncorporatedInventor: Yoshiro Chikaki
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Publication number: 20110232820Abstract: A frame transport unit places a ring frame on a frame holding section of a holding table, and a holding arm suspendingly holds a protection sheet to place it on a wafer holding table. The holding arm suction-holds a wafer to place it on the protection sheet such that a circuit surface of the wafer is directed downward. An adhesive tape is joined to the wafer and the ring frame suction-held via the protection sheet.Type: ApplicationFiled: March 17, 2011Publication date: September 29, 2011Inventors: Masayuki Yamamoto, Chouhei Okuno
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Patent number: 8024067Abstract: Immediately before a robot 20 starts to move at a high speed, a monitoring area 53 is expanded in a returning direction Y, and absence of an obstacle in the monitoring area 53 is confirmed. During the high speed movement of the robot 20, the monitoring area 53 is expanded forward, so that a safety of an operator is secured, an effective use of a working station area can be made, and an improvement of productivity can be achieved.Type: GrantFiled: May 24, 2006Date of Patent: September 20, 2011Assignee: Honda Motor Co., Ltd.Inventors: Yoshiharu Sakai, Tetsuya Ozawa, Kazuyoshi Fukuzawa, Yoshito Ohtake, Hiroki Baba
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Publication number: 20110214816Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.Type: ApplicationFiled: May 6, 2011Publication date: September 8, 2011Inventors: Takayuki Goto, Jun Utsumi, Kensuke Ide, Hideki Takagi, Masahiro Funayama
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Patent number: 8002939Abstract: Methods and devices are provided for improving the encapsulation processes for an organic electronic device.Type: GrantFiled: December 29, 2005Date of Patent: August 23, 2011Assignee: E. I. du Pont de Nemours and CompanyInventors: James Daniel Tremel, Matthew Dewey Hubert
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Patent number: 7993565Abstract: Disclosed is a folding and shape-forming apparatus for a prepreg which includes a vacuum chamber which can generate a vacuum pressure in the inside thereof, an expanding portion disposed inside the vacuum chamber, provided with a prepreg thereon, and expanding because of the vacuum pressure inside the vacuum chamber, a heating portion disposed inside the vacuum chamber for heating the prepreg, a mandrel loaded at a portion of an upper surface of the prepreg, a first pressing portion which is brought into contact with an upper surface of the mandrel to press the mandrel, and a second pressing portion which simultaneously presses both another portion of the upper surface of the prepreg and the expanding portion.Type: GrantFiled: March 25, 2009Date of Patent: August 9, 2011Assignee: Korean Air Lines Co., Ltd.Inventors: Jae Hak Kim, Joong Won Han, Jae Hwan Lee, Do Young Lee, Jin Hyun Kim
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Publication number: 20110186230Abstract: An attaching device and a method of fabricating an organic light emitting device using the same are disclosed. The attaching device includes a process chamber, first and second substrate supporters, a substrate detachable part, and an open-close valve. The first and second substrate supporters are positioned inside the process chamber, load and fix substrates. The substrate detachable part is positioned inside the second substrate supporter, and moves up and down to allow the second substrate supporter to instantaneously receive a physical pressure. The open-close valve is positioned on a portion of the process chamber, and opens and closes the process chamber to control a pressure inside the process chamber.Type: ApplicationFiled: April 11, 2011Publication date: August 4, 2011Inventors: Choong Keun YOO, Ae Kyung Jeon, Choong Keun Yoo
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Patent number: 7980284Abstract: An vacuum laminator for laminating workpieces includes a grasping assembly, an alignment assembly, a pickup head, and a sealed body. The grasping assembly is configured for grasping one workpiece. The alignment assembly is connected to the grasping assembly for adjusting a position of the workpiece on the grasping assembly. The pickup head is configured for picking up another workpiece. The grasping assembly and pickup head are received in the sealed body opposite to each other. The grasping assembly includes two grasping members grasping and releasing the workpiece.Type: GrantFiled: August 27, 2009Date of Patent: July 19, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Dong-Sheng Lin, Tzyy-Chyi Tsai, Zhi-Bin Wang
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Publication number: 20110168333Abstract: A method for manufacturing light emitting devices is provided. The method may reduce the inner pressure of a laminated image emitting device panel, thereby preventing failure of the panel. The method includes holding a first substrate with a lower chuck located in a vacuum chamber; holding a second substrate with an upper chuck located opposite the first chuck in the vacuum chamber; creating a high vacuum in the vacuum chamber; correcting positions of the first substrate and the second substrate; supplying gas having a temperature of about 50 to about 200° C. into the vacuum chamber; temporarily laminating the first substrate and the second substrate; venting the vacuum chamber; and bonding the first substrate and the second substrate. The panel is laminated after being filled with a heated gas and thus, when it is exposed to room temperature, the mobility of the gas decreases while reducing its initial inner pressure, thereby preventing panel failure.Type: ApplicationFiled: March 22, 2011Publication date: July 14, 2011Inventors: Choong Keun Yoo, In Sun Yoo, Kang Ju Lee
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Patent number: 7975744Abstract: A substrate bonding apparatus comprises a platen and a press. The press is movable relative to the platen for pressing at least one substrate stack between the press and platen. In one embodiment, a consumable compliant member is disposed between the press and the platen. In another embodiment, the apparatus further comprises a substrate carrier adapted for holding and carrying more than one substrate stack in and out of the apparatus. A method for bonding substrates is also described.Type: GrantFiled: January 18, 2006Date of Patent: July 12, 2011Assignee: Suss MicroTec Inc.Inventor: Brad Johnson
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Publication number: 20110146906Abstract: Out-of-autoclave curing of a composite part is performed using a double vacuum chamber assembly comprising integrated inner and outer vacuum chambers.Type: ApplicationFiled: December 18, 2009Publication date: June 23, 2011Inventors: Michael R. Anderson, Edoardo P. Depase
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Publication number: 20110146893Abstract: A method of bonding a film (2) to a curved substrate (1) comprises preforming the film by applying a pneumatic pressure difference between two sides of the film and by heating said film. An intermediate shape is then conferred on the film, which is suitable for applying the film against a curved face of the substrate. This application is carried out, on the one hand, by keeping the film m the intermediate shape by means of an adjusted pressure difference applied between the two sides of the film and, on the other hand, by pressing the substrate against the film by means of a movable support (12-14). Such a method is used to obtain a defect-free ophthalmic lens with a film bonded to it.Type: ApplicationFiled: June 7, 2007Publication date: June 23, 2011Applicant: Essilor International (Compagnie Generale D'optique)Inventors: Antoine Marty, Paul Lefillastre
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Patent number: 7964054Abstract: A method of applying material on a substrate. The material to be applied can be a pattern of material.Type: GrantFiled: June 15, 2007Date of Patent: June 21, 2011Assignees: Sony Deutschland GmbH, Forschungszentrum Juelich GmbHInventors: Jurina Wessels, Akio Yasuda, Daniel Schwaab, Dirk Mayer, Andreas Offenhaeusser
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Publication number: 20110143100Abstract: A method of assembling and shaping a laminate panel. An intermediate member is mounted on a lay-up table and a lay-up is assembling by laying a series of plies onto the intermediate member on the lay-up table. The intermediate member and the lay-up are then removed from the lay-up table and placed them on a shaped surface. The lay-up is then forced against the shaped surface, via the intermediate member, in a manner that modifies the shape of the lay-up to form a shaped laminate panel. Finally the shaped laminate panel is removed from the intermediate member. The lay-up table can thus support the flexible intermediate member during assembly, and can be relatively flat to enable the lay-up to assembled by an automated process.Type: ApplicationFiled: August 28, 2009Publication date: June 16, 2011Applicant: AIRBUS OPERATIONS LIMITEDInventors: Andrew Levers, Gary Wiles
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Publication number: 20110142679Abstract: A rotor blade and a method and a manufacturing mold for the production of a rotor blade for a wind turbine, which extends longitudinally in the operational state from a blade root area to the connection to a rotor hub of the wind turbine and which is divided into at least two segments for its production, wherein at least one subdivision is provided approximately transverse to its longitudinal extension between the blade root area and the blade tip. The method facilitates and shortens the production of the rotor blade, in particular for a series production and to still provide the completed rotor blade as a familiar uniform rotor blade. In the method, the at least two segments, preferably after they have been at least partially produced or partially produced mainly parallel in time, are interconnected in an integration device.Type: ApplicationFiled: June 10, 2009Publication date: June 16, 2011Applicant: REPOWER SYSTEMS AGInventors: Urs Bendel, Enno Eyb, Martin Knops
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Patent number: 7958612Abstract: A low-pressure process apparatus for processing a substrate comprises a base, a stage, a housing and at least one first roller set. The stage is disposed on the base for supporting the substrate. The housing is detachably disposed on the base moving between a first position and a second position, wherein when the housing is in a first position, the housing and the base form a chamber to receive the stage. When the housing is detached, the first roller set contacts and supports the housing to facilitate movement thereof in a first horizontal direction.Type: GrantFiled: June 1, 2006Date of Patent: June 14, 2011Assignee: Au Optronics Corp.Inventor: Ting-Hui Huang
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Publication number: 20110126960Abstract: An apparatus for applying a “shrink sleeve” label to a container includes a casing member for enclosing a container in a closed chamber, a heating device for heating a heat-shrinkable element that is a precursor of a “shrink sleeve” label arranged around the container so as to heat-shrink the heat-shrinkable element, and a pressure-reducing member to reduce the pressure in the closed chamber.Type: ApplicationFiled: April 27, 2009Publication date: June 2, 2011Applicant: SACMI VERONA S.P.A.Inventors: Ireneo Orlandi, Daniele Marastoni
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Patent number: 7950432Abstract: A graphic transfer assembly is disclosed. The graphic transfer assembly includes an inflatable member that is capable of expanding to fill the interior of an article of footwear. The graphic transfer assembly can include a fluid pump for filling the inflatable member.Type: GrantFiled: June 24, 2009Date of Patent: May 31, 2011Assignee: NIKE, Inc.Inventors: Elizabeth Langvin, Zvi Rapaport
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Patent number: 7921893Abstract: A method and apparatus is disclosed for joining of composites with thermoplastic surfaces. The process includes the location of the said components within a load bearing frame, and bringing the thermoplastic surfaces to be joined into contact. Pressure application devices, in the form of fluid filled bladders, are also located within the frame, and are located such that pressure is applied evenly to said thermoplastic surfaces. Where components have a high level of curve or twist, form blocks that have the approximate shape of the component surface are located between the frame and bladders. Pressure and heat are applied to the joint area, and heat removed while the joint area is maintained under some pressure. A feature of the present invention is the option of using opposing pressure application devices, reducing the need for substantial tooling in order to maintain component location accuracy.Type: GrantFiled: September 22, 2006Date of Patent: April 12, 2011Assignee: Advanced Composite Structures LimitedInventors: Andrew Beehag, Kenneth Douglas Horton, Bruce Cartwright
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Publication number: 20110061808Abstract: A sheet sticking apparatus 10 includes: an openable and closeable case 14 for accommodating a table 11 for supporting a semiconductor wafer W, and forming a decompression chamber C therein; a feeding means 15 for feeding an adhesive sheet S to a position where the adhesive sheet S faces the semiconductor wafer W; and a sandwiching means 29 disposed, in the case 14, in a position relative to the table 11. The sandwiching means 29 sandwiches only an outer periphery portion of the semiconductor wafer W together with the adhesive sheet S by interaction with the table 11 in a state where a single decompression chamber C is formed by closing the case 14. Thereafter, the adhesive sheet S is stuck to the semiconductor wafer W by releasing the reduced pressure in the decompression chamber C.Type: ApplicationFiled: May 22, 2009Publication date: March 17, 2011Applicant: LINTEC CORPORATIONInventor: Kan Nakata
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Publication number: 20110048616Abstract: An example method of sealing a laminate assembly includes preloading a laminate assembly having a plurality of laminations, pressurizing the laminate assembly, and pressurizing an enclosed volume disposed adjacent an end portion of the laminate assembly to hold the laminations in sealed positions.Type: ApplicationFiled: August 25, 2009Publication date: March 3, 2011Inventors: Robert G. Barnett, Jorge E. Hidalgo
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Publication number: 20110042010Abstract: The invention pertains to a combination of a substrate (6) and a wafer (15), wherein the substrate (6) and the wafer (15) are arranged parallel to one another and bonded together with the aid of an adhesive layer (8) situated between the substrate (6) and the wafer (15), and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer (8) is only applied annularly between the substrate (6) and the wafer (15) in the edge region of the wafer (15).Type: ApplicationFiled: November 1, 2010Publication date: February 24, 2011Inventor: Erich Thallner
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Patent number: 7886793Abstract: A substrate bonding device for fabricating a liquid crystal display (LCD) device accurately aligns substrates of the LCD device while preventing the introduction of foreign material into the substrate bonding device, thereby substantially preventing the generation of defects within liquid crystal material of the LCD device.Type: GrantFiled: August 20, 2007Date of Patent: February 15, 2011Assignee: LG Display Co., Ltd.Inventors: Sang Seok Lee, Myoung Gu Kang, Young Kug Lim, Soo Min Kwak, Jong Han Kim, Heung Sun Kim
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Patent number: 7887655Abstract: A fluid enveloping device includes a housing having a vacuum chamber; a valve for blocking off the communication of the vacuum chamber and atmospheric environment; a vacuum pump module connected to the vacuum chamber for extracting air until the vacuum chamber is close to a vacuum state; a die holder for locating a lower thin film and receiving the fluid at the lower thin film; a punch holder for locating an upper thin film; and a sealing nip in the vacuum chamber for hot-pressing the upper and the lower thin films to envelope the fluid therein.Type: GrantFiled: September 10, 2007Date of Patent: February 15, 2011Inventor: Hui-Mei Chen
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METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR SUBSTRATE MANUFACTURING APPARATUS
Publication number: 20110030901Abstract: An object is to provide a uniform semiconductor substrate in which defective bonding is reduced. A further object is to manufacture the semiconductor substrate with a high yield. A first substrate and a second substrate are bonded in a reduced-pressure atmosphere by placing the first substrate at a certain region surrounded by an airtight holding mechanism provided over a support to surround the certain region of a surface of the support; placing the second substrate so as to come to be in contact with the airtight holding mechanism to ensure airtightness of a space surrounded by the support, the airtight holding mechanism, and the second substrate; evacuating the space whose airtightness is secured, thereby reducing an pressure in the space; disposing the second substrate in close contact with the first substrate using difference between the pressure in the space and outside atmospheric pressure; and performing heat treatment.Type: ApplicationFiled: October 13, 2010Publication date: February 10, 2011Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.Inventors: Akihisa SHIMOMURA, Masaki KOYAMA, Satohiro OKAMOTO -
Patent number: 7883599Abstract: There is provided a device for bonding ceramic structural bodies. In the state in which a set of ceramic structural bodies provided with a bonding agent between bonding surfaces and provided with elastic sleeves disposed on a peripheral surface of the set of the structural bodies are placed in a tubular container with an elastic sheet disposed between the elastic sleeves and the tubular container, the device is able to charge a hydrostatic pressure medium between the tubular container and the elastic sheet to press and bond the structural bodies. By bonding the ceramic structural bodies with the device, it may provide accurate positioning of the bonding surfaces. It may also provide a uniform distance between bonded surfaces, and reduce the number of bonding operations, thereby affording an excellent working efficiency.Type: GrantFiled: June 7, 2007Date of Patent: February 8, 2011Assignee: NGK Insulators, Ltd.Inventors: Jun Fujita, Takahisa Kaneko
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Patent number: 7878229Abstract: Introduction guides 12 are provided above and below a sheet-introduction opening portion of a pressure-reduced chamber 10, and heating means 17 is provided between the introduction guides. Each resin sheet 3 is attracted and attached respectively to the circumferential surface of a corresponding emboss roller 11 by reducing pressure. Pins 112 of the emboss roller 11 are truncated cone-shaped. The ratio of the total area of the lower bases of the pins 112 to the area of the circumferential surface of the emboss roller is 0.5 or more. The rising angle ? of the pin side face, in the vertical plane including the central axis of the pins 112, is in the range from 50 degrees to 70 degrees. Furthermore, a multilayered hollow structure plate 140 is formed by attaching non-air-permeable sheets 130 onto both the front and back of a core member obtained by fusing together hollow protrusions 112 in two thermoplastic resin sheets.Type: GrantFiled: December 31, 2007Date of Patent: February 1, 2011Assignee: UBE Nitto Kasei Co., Ltd.Inventors: Masahiko Nakajima, Takeshi Miyazaki, Takayuki Oda, Kenji Kozuka
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Publication number: 20110011536Abstract: A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate.Type: ApplicationFiled: March 11, 2008Publication date: January 20, 2011Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Satoshi Tawara, Jun Utsumi, Yoichiro Tsumura, Kensuke Ide, Takenori Suzuki
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Patent number: 7857026Abstract: The present invention relates to a method for bonding a component, such as a bushing, into a part, such as a panel. The method broadly comprises attaching a vacuum chamber to a surface of the part, seating the component into a slot in the part, and applying an adhesive material about a circumference of the component while drawing a vacuum in the vacuum chamber to allow the adhesive material to flow between the part and the component.Type: GrantFiled: September 22, 2005Date of Patent: December 28, 2010Assignee: United Technologies CorporationInventor: Daniel M. Stadtlander
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Patent number: 7858003Abstract: A soft mold includes a polymer layer having a printing pattern on at least a first surface thereof; and a back-plane attached to a second surface of the polymer layer.Type: GrantFiled: June 7, 2006Date of Patent: December 28, 2010Assignee: LG Display Co., Ltd.Inventors: Gee Sung Chae, Gyoo Chul Jo, Jin Wuk Kim, Chang Hee Lee
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Publication number: 20100324208Abstract: The present invention relates to a recyclable composite having natural (4) and carbon fibres (6) as a reinforcement material and epoxy resin (8) as a matrix. Preferably, the natural fibres are hemp. Furthermore, the present invention relates to a method for producing such a recyclable composite comprising the steps of preparing the composite, vacuum bagging it and then heating it with a heating cable (12). Finally, the present invention relates to a kit having a frame (10), a heating cable (12) and an apparatus box with a thermostat and heat sensors and which can be used for performing the method according to the invention.Type: ApplicationFiled: September 10, 2008Publication date: December 23, 2010Inventors: Giottis Motsanos, Mats Dalborg
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Publication number: 20100314042Abstract: In a method for reinforcing a fibre composite component for aviation and space flight, a vacuum mat is configured with at least one receiving portion for reproducibly receiving at least one reinforcing element. The at least one reinforcing element is introduced into the at least one receiving portion of the vacuum mat. The vacuum mat with at least one introduced reinforcing element is applied reproducibly in a sealed manner to the fibre composite component to be reinforced to form a mould portion and at least the formed mould portion is cured to connect the at least one reinforcing element to the fibre composite component. The vacuum mat is then removed from the reinforced fibre composite component so that the vacuum mat can be reused.Type: ApplicationFiled: June 16, 2010Publication date: December 16, 2010Inventors: Christian Luebbering, Hauke Lengsfeld, Roland Brandenburg
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Patent number: 7849901Abstract: An improved autoclave for curing retread tires includes a chamber with circulating air flow having turbulence generating devices located in a middle length-wise portion of the chamber. The turbulence generating devices include apertures to guide air from a supply duct into the chamber, and/or wedge-shaped elements or fins mounted on the interior wall of the chamber to disrupt the air flow and cause turbulence.Type: GrantFiled: December 6, 2006Date of Patent: December 14, 2010Assignee: Michelin Recherche et TechniqueInventors: Jan Lahmann, Theophile Henry Louchart, III
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Patent number: 7850815Abstract: A technique which solves the problem of conventional laminating apparatuses that a substrate may be deformed when released by pushing lift pins against the substrate held on an adhesive member by suction. An upper table inside a chamber has, on its substrate holding face, an elastic plate provided with an elastic body, a vacuum suction means and a purge gas blow means. A plurality of adhesive pins are provided on an adhesive pin plate which can move up and down independently from the upper table. The upper table and the elastic plate have through holes through which the adhesive pins can move and the adhesive pins have adhesion means at their tips.Type: GrantFiled: May 15, 2007Date of Patent: December 14, 2010Assignee: Hitachi Plant Technologies, Ltd.Inventors: Takuya Kaizu, Hiroaki Imai, Masayuki Saito
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Patent number: 7836934Abstract: A substrate bonding apparatus for use in fabricating LCD devices substantially prevents substrates held to upper stages from sagging. The substrate bonding apparatus may, for example, include upper and lower stages having a plurality of passages for holding respective substrates; suction force applying means having one end mounted within each passage for transmitting a suction force to operably proximate portions of a substrate, wherein the one end of the suction force applying means is projectable from within each passage to a predetermined distance from the stage; and a vacuum pump for providing a suction force to the suction force applying means.Type: GrantFiled: November 20, 2007Date of Patent: November 23, 2010Assignee: LG Display Co., Ltd.Inventors: Young Sang Byun, Kyung Su Chae
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Publication number: 20100288442Abstract: A press for laminating essentially planar work pieces under the effects of pressure and heat is provided, having a bottom half of the press and a top half of the press, which are movable in reference to each other in order to open and close the press, with the bottom half of the press and the top half of the press, in the closed state, together with circumferential seals forming a vacuum chamber. A pliable diaphragm divides the vacuum chamber into a product space that can be evacuated and is provided to receive at least one work piece, and a pressure space that can be evacuated and/or impinged with pressure. The diaphragm is embodied and arranged such that due to the pressure difference in the vacuum chamber, created by evacuating the product space and/or by impinging it with pressure, the work piece is pressed directly or indirectly against the bottom of the vacuum chamber 14.Type: ApplicationFiled: May 12, 2010Publication date: November 18, 2010Applicant: Robert Burkle GmbHInventor: Norbert Damm
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Patent number: 7819159Abstract: A bonding apparatus, suitable for accurately bonding large substrates for a liquid crystal display, includes Z-axis drive mechanisms, and upper and lower chambers. The Z-axis drive mechanisms for moving an upper frame vertically are disposed at four corners of a mount. The upper chamber is supported by the upper frame and has an upper table inside. The lower chamber has a lower table inside and is supported on the mount. The upper and lower chambers are united through a seal ring to define a vacuum chamber. Moving the upper frame moves the upper chamber vertically to open or close the vacuum chamber. The lower table is supported via a free joint stage between the plurality of support legs and the table, and is moved horizontally by a side thrust mechanism disposed outside of the vacuum chamber.Type: GrantFiled: May 25, 2006Date of Patent: October 26, 2010Assignee: Hitachi Plant Technologies, Ltd.Inventors: Masaaki Ito, Yukinori Nakayama, Tatsuharu Yamamoto, Hiroaki Imai
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Publication number: 20100243171Abstract: An vacuum laminator for laminating workpieces includes a grasping assembly, an alignment assembly, a pickup head, and a sealed body. The grasping assembly is configured for grasping one workpiece. The alignment assembly is connected to the grasping assembly for adjusting a position of the workpiece on the grasping assembly. The pickup head is configured for picking up another workpiece. The grasping assembly and pickup head are received in the sealed body opposite to each other. The grasping assembly includes two grasping members grasping and releasing the workpiece.Type: ApplicationFiled: August 27, 2009Publication date: September 30, 2010Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: DONG-SHENG LIN, TZYY-CHYI TSAI, ZHI-BIN WANG
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Publication number: 20100243170Abstract: A system for fabricating a composite item from a layup may comprise a debulking device, a vacuum generator and a curing device. The debulking device may include a vacuum chamber, an envelope and a heater. The vacuum chamber may have a chamber pressure. The envelope may be contained within the vacuum chamber and may have an envelope pressure. The layup may be received within the envelope. The heater may heat the layup. The vacuum generator may be in fluid connection with the debulking device. The curing device may cure the layup.Type: ApplicationFiled: June 8, 2010Publication date: September 30, 2010Applicant: THE BOEING COMPANYInventors: Mark S. Wilenski, Arvid J. Berg
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Publication number: 20100243147Abstract: A laminating apparatus including a decompression chamber, a heater table provided in the decompression chamber, and a pressing member provided above the heater table in the decompression chamber. The pressing member includes an elastic sheet facing the heater table, and a supporting frame to support the elastic sheet by partitioning and to form expansion chambers for partitions, each of which makes the elastic sheet expand to the heater table side by a pressure of a fed gas.Type: ApplicationFiled: March 10, 2010Publication date: September 30, 2010Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Tomohiro Matsui, Masaaki Furuya, Hiroaki Kobayashi, Toshihiko Shinoda
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Publication number: 20100243152Abstract: The present invention provides a connecting device for connecting an unhardened fibre layer which is arranged on a surface section of a fibre compound structure to the fibre compound structure. The connecting device comprises pressure cushion comprising a pressure cap for being arranged above the surface section and a pressure tight cap mat which is pressure tightly connected to a circumferential border of the pressure cap, thereby forming a pressure area which is limited by the pressure cap and by the cap mat. The connecting device further comprises a pressure inducing means for inducing an overpressure which presses the cap mat against the fibre layer into the pressure area. According to a further aspect the invention provides a processing method for processing a fibre compound structure. In a first step at least one unhardened fibre layer is arranged on a surface section of the fibre compound structure.Type: ApplicationFiled: June 5, 2008Publication date: September 30, 2010Applicant: AIRBUS OPERATIONS GMBHInventors: Felix Caspar Helfrich, Hans Marquardt
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Patent number: 7802597Abstract: A press apparatus includes upper and lower heating plates arranged in a vertical direction to hot-press the product therebetween, a fixed platen to which the upper heating plate is fixed, a movable platen to which the lower heating plate is fixed, a movable platen driving unit configured to move the movable platen along the vertical direction with respect to the fixed platen, an upper cooling plate, a lower cooling plate, the upper and lower cooling plates being arranged in the vertical direction to cold-press the product therebetween, and a cooling plate driving unit moving the upper and lower cooling plates in a horizontal direction between a first position for cold pressing that is located between the upper and lower heating plates and a second position for hot pressing that is located apart from the upper and lower heating plates in the horizontal direction.Type: GrantFiled: September 25, 2007Date of Patent: September 28, 2010Assignee: Kitagawa Seiki Kabushiki KaishaInventors: Shizuaki Okazaki, Hideki Kondo, Ryoji Yumito
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Patent number: 7793819Abstract: An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber is disclosed. The component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between the current position of the component and the current position of the substrate, for placing and pressing the component on the substrate. The combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of the lower side of the component to be connected and the pressing direction of the component, the angle corresponding to the angle between the normal of the substrate surface area to be connected and the pressing direction of the component.Type: GrantFiled: March 19, 2007Date of Patent: September 14, 2010Assignee: Infineon Technologies AGInventors: Karsten Guth, Alfred Kemper, Roland Speckels
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Patent number: 7779884Abstract: A multi-layer laminating press including hot plates arranged over top of and movable in reference to each other, conveyers revolving around the hot plates, sealing elements that assist in forming vacuum chambers between each of a first hot plate and a respectively adjacent second hot plate arranged thereabove when the press is closed. The second conveyor lower run of the second hot plate rests on the first conveyor upper run of the first hot plate and the work piece to be laminated is arranged between the first conveyor upper run and the second conveyor lower run in the vacuum chamber. Connections are provided to pressurize and/or evacuate the vacuum chambers. The vacuum chambers are limited by either the first hot plate and the second conveyor lower run, or the second hot plate and the first conveyor upper run, without the interposition of another membrane for laminating the workpiece.Type: GrantFiled: May 1, 2008Date of Patent: August 24, 2010Assignee: Robert Burkle GmbHInventors: Norbert Damm, Dagmar Metzger
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Method And Apparatus For Manufacture And Inspection Of Swatch Bearing Sheets Using A Vacuum Conveyor
Publication number: 20100200165Abstract: An apparatus and method of high speed manufacture of swatch bearing sheets wherein each sheet is directed through various operating stations via sequentially releasing a suction force from an endless vacuum belt conveyor while sequentially pulling the sheet onto another endless vacuum belt conveyor with a suction force to allow for substantially continuous engagement of the sheet with the endless vacuum conveyors during the manufacture and inspection of the sheets.Type: ApplicationFiled: April 20, 2010Publication date: August 12, 2010Applicant: COLOR COMMUNICATIONS, INC.Inventors: Stanley I. Lerner, Steven B. Winter, Gregory O'Brien -
Publication number: 20100193134Abstract: A vacuum container for a tyre curing mold having two sidewalls and a number of lateral sectors; the container having an inclined-surface actuating device, which moves the lateral sectors radially, is activated by a press having a movable plate with a central airtight chamber, and has, for each lateral sector, a wedge integral with the lateral sector, and a conical bell fitted in sliding manner to the wedges; and the container having: an air shut-off plate integral with the movable plate of the press to transmit motion to the conical bell; an adjusting ring integral with the air shut-off plate and the conical bell; a static first annular seal interposed between the conical bell and the adjusting ring; and a static second annular seal interposed between the air shut-off plate and the movable plate of the press.Type: ApplicationFiled: June 28, 2007Publication date: August 5, 2010Applicant: BRIDGESTONE CORPORATIONInventor: Pierpaolo Scala
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Publication number: 20100186899Abstract: A mandrel assembly that includes an elongated hollow structure comprising a thermoplastic material that is extrudable having a first end and a second end. A first end cap attached to the first end. A vent tube attached to the first end cap, the vent tube extending from the first end cap. A second end cap attached to the second end. The mandrel assembly adapted to shape and form a composite structure in or outside an autoclave.Type: ApplicationFiled: January 14, 2010Publication date: July 29, 2010Inventors: Aubrey G. Jackson, John D. Maligie