Abstract: A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.

Abstract: The embodiments of the invention provide a semiconductor chip mounting methods to prevent the occurrence of particles created while mounting a thin semiconductor chip onto a substrate. A semiconductor chip having conductive bumps on its main surface is held by its back via an elastic film using a suction tool having a plurality of suction holes, the semiconductor chip is positioned against a substrate provided with connection wires corresponding to said conductive bumps, and the semiconductor chip is mounted onto the substrate in such a manner that the conductive bumps connect to said connection wires, and uniform pressure is applied from the oversized bonding tool suction to the semiconductor chip via said film while said semiconductor chip is being pressed against said substrate by oversized bonding tool to keep constant pressure in order to bond said conductive bumps with said connection wires.

Abstract: An apparatus, system and method for performing ELO are disclosed. Device assemblies are contemporaneously etched in a stacked arrangement. Each device assembly may be placed in a respective tray, where the trays are overlapped and spaced apart from one another. In this manner, more device assemblies can be etched per unit area compared to conventional systems. Further, by stacking device assemblies during etching, the yield can be improved and/or the cost of the etch tank and associated hardware can be reduced.

Abstract: During the joining of PTFE parts (10), a binder (20) is applied to the joint surfaces of the PTFE parts, e.g. by welding, before the parts are joined. By establishing a bond between PTFE and binder in a separate, initial process, the parameters of this initial process may be determined regardless of other conditions, such as maintaining the dimensions, and the quality of this bond may be controlled and approved before the subsequent joining of the PTFE parts. During the subsequent joining, the temperature may be kept at a level, which is sufficiently low so as not to deform the PTFE material permanently, or the joining may be carried out by a process, which does not require heating, for example gluing.

Abstract: A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the product substrate.

Abstract: A board separation apparatus and an operating method thereof are provided. The board separation apparatus includes a board separation machine and a composite board constituted of a plurality of circuit boards and carrier panels. The board separation machine includes a frame, first and second suction devices, and a linkage. The second suction device is positioned above the first suction device, and the composite board is placed in between the suction devices. The linkage connects the driving mechanism and second suction device. A separable interface layer is located in the composite board. When the suction devices are powered up to stick to the top and the bottom surfaces of the composite board, the linkage is pushed by the driving mechanism, so that the second suction device can move in relation to the first suction device, and one of the circuit board is separated from another one of the carrier panels.

Abstract: A method for producing an organic EL device includes the steps of: preparing an adhesive sheet on which a resin substrate is laminated, allowing the resin substrate to adhere onto a hard substrate with the adhesive sheet interposed therebetween, forming an organic EL element on the resin substrate, thereby producing an organic EL device including the resin substrate and the organic EL element, and peeling the organic EL device from the hard substrate. The adhesive sheet includes a first adhesive layer for being bonded to the hard substrate, and a second adhesive layer formed on the first adhesive layer and bonded to the resin substrate. A non-adhesive region is defined at an end portion of the resin substrate, the non-adhesive region not overlapping with the second adhesive layer but overlapping with the first adhesive layer when projected in the thickness direction.

Abstract: A device is provided for ensuring the sterile integrity of two separate fluid pathways during interconnection of the two pathways with a two-part connector assembly. The two-part connector assembly is of the type which comprises a male portion and a female portion, each portion initially having a port covered and protected by a peel-away strip. The device comprises a base assembly, a connector clamp assembly mounted to the base assembly and configured for securing the two-part connector assembly in position for interconnection of the male and female portions, and a strip withdrawal assembly mounted to the base assembly and configured for simultaneous withdrawal of the peel-away strips from the ports of the male and female portions.

Abstract: An apparatus for removing an adhesive layer from a wafer surface includes a chuck, a contact roller, a pick-up roller and a detaping tape. The chuck supports and holds a wafer that has an adhesive layer on its top surface. The contact roller rotates around a first axis and moves linearly along a direction perpendicular to the first axis over the chuck and the supported wafer. The pick-up roller rotates around a second axis, that is parallel to the first axis. The detaping tape rolls around the contact roller and the pick-up roller, and as it rolls it attaches to the adhesive layer, and then is removed together with the adhesive layer. The contact roller has a surface that has a footprint of a circle when rolled along a flat surface.

Abstract: Nano-scale or micro-scale adhesive structures comprising an array of nano-fabricated, pillars, the pillars having coated upon, or having disposed on a working surface thereof, a protein-mimetic, marine-adhesive coating. Methods of fabricating the nano-scale pillars, synthesis of the protein-mimetic coating or wet adhesive and application of the adhesive to the pillars are described.

Abstract: A method for producing a light emitting diode device includes the steps of preparing a laminate including, in order, a supporting layer, a constraining layer and an encapsulating resin layer, each formed in a thickness direction; cutting the encapsulating resin layer and the constraining layer in the laminate into a pattern corresponding to the light emitting diode element; removing a portion which does not correspond to the light emitting diode element in the encapsulating resin layer and the constraining layer that are cut into the pattern; allowing the encapsulating resin layer corresponding to the light emitting diode element to be opposed to the light emitting diode element to be pressed in the direction where they come close to each other so as to encapsulate the light emitting diode element by the encapsulating resin layer; and removing the supporting layer and the constraining layer from the laminate.

Abstract: A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises: lifting of the plates to a height H1 above the surface of a cover plate; lowering of a first pair of plates with L-shaped supporting edge; optionally, lowering of a second pair of plates with L-shaped supporting edge; lifting of the plates that have not yet been lowered to a height H2>H1; staggered lowering of plates that have not yet been lowered, with at least one or several plates not being lowered; optionally, lowering of the plates that have not yet been lowered to a height H3<H2; lowering of the plates until all plates are lowered, and moving away of the chip gripper, wherein the chip gripper touches the semiconductor chip before lowering the last three plates.

Abstract: It is described an apparatus for removing a flexible film seal (12) from a tubular specimen container (3), comprising a vertical mounting shaft (5) upon which is mounted a holding member (6) for a head assembly (9) having a cavity (13) and pinch means (14, 15). There is provided driving means for causing coupling motion of said head assembly (9) and said specimen container (3) towards each other to receive the seal (12) into said cavity (13), then operating said pinch means for pinching the flexible film seal (12), and finally causing removing motions of said head assembly (9) and said specimen container (3) away from each other to remove the flexible film seal (12) from the head of the specimen container (3).

Abstract: A method and apparatus for removing a pad adhesively secured to a platen. The apparatus includes a barrel assembly having a clamp assembly fixedly attached to a perimeter of the barrel assembly; a rotatable handle assembly nested within the barrel assembly; and a ratchet assembly nested between the handle assemble and the barrel assembly the ratchet assembly configured to engage the rotatable handle assembly.

Abstract: The present invention relates to a polarizer film peeling machine and a polarizer film peeling method thereof. The polarizer film peeling machine includes an operation platform and a conveyor device having a translatable surface. The operation platform forms a slit at a site where a polarizer film is peeled off. The translatable surface of the conveyor device is located under the slit. In peeling off a polarizer film, a glass substrate from which the polarizer film is to be removed is set to slide on the a top surface of the operation platform to pass through the slit and the peeled-off polarizer film is guided through the slit to be laid flat on the translatable surface of the conveyor device and move with the translatable surface of the conveyor device.

Abstract: The present invention provides a method and machine for separating a liquid crystal panel and a liner pad. The method includes (1) providing a separation machine and a combination of the liquid crystal panel and liner pad to be separated, the separation machine including a separation device that includes a suction device, air blasting devices and shaking devices; (2) the suction device moving toward the combination; (3) a central suction nozzle first engaging and sucking a liner pad of the combination and later the first suction nozzles engaging the sucking the liner pad of the combination; (4) the shaking devices being operated to subject the combination to vibration and the air blasting devices being operated to eject air streams to side edges of the combination; and (5) the combination, after being subjected to vibration and air streams, being separated so as to realize separation of the liquid crystal panel and liner pad.

Abstract: A method of manufacturing a honeycomb structure having honeycomb segments, which includes a masking step (S1) of attaching masking materials (8) to both end surfaces (2a) of the honeycomb segments (2), a stacked body bonding step (S2) of bonding the honeycomb stacked body (3) by bonding the plurality of honeycomb segments (2) together while interposing adhesive layers therebetween, an adhesive layer drying step (S3) of integrally fixing the honeycomb stacked body (3) by heating and drying the adhesive layers, a masking material separating step (S4), of separating the masking materials (8), and a grinding step (S5) of grinding an outer peripheral portion of the honeycomb stacked body (3) into a predetermined shape.

Abstract: Systems and methods are provided for mechanically cleaving a bonded wafer pair by controlling the rate of cleaving. This controlled rate of cleaving results in a reduction or elimination of non-uniform thickness variations in the cleaved surface of the resulting SOI wafer. One embodiment uses flexible chucks attached to the faces of the wafers and actuators attached to the flexible chucks to cleave the bonded wafer pair. Other embodiments also use rollers in contact with the surfaces to control the rate of cleaving.

Abstract: A debonder apparatus includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder holding a first wafer of a bonded wafer pair in contact with the chuck. The flex plate assembly includes a flex plate and a second wafer holder holding a second wafer of the bonded wafer pair in contact with the flex plate. The flex plate is placed above the chuck. The contact roller is arranged adjacent to a first edge of the chuck and pushes and lifts up a first edge of the flex plate, while the resistance roller traverses horizontally over the flex plate and applies a downward force upon the flex plate and thereby the bonded wafer pair delaminates along a release layer and the first and second wafers are separated from each other.

Abstract: The present invention relates to a peeling device which peels off a reinforcing sheet stuck on a substrate, including: a supporting unit which supports one main surface of a laminate having the substrate and the reinforcing sheet; a plate-shaped flexible member to be attached to the other main surface of the laminate; a plurality of pads fixed to a surface of the flexible member lying opposite to the laminate side; a plurality of rods each of which is coupled to any one of the plurality of pads; a plurality of driving devices by which the plurality of rods are made to move, respectively, in their individual axial directions; and a control device by which a position of each of the plurality of rods is controlled on an individual basis, in which each of the plurality of pads is coupled to any one of the plurality of the rods via any one of a plurality of joints so that each pad is allowed to be pivotable centering on a vicinity of an intersection point of a centerline of the rod coupled thereto with a surface o

Abstract: A method includes positioning a layer of adhesive between a first structural component and a second structural component, positioning a first evaluation film between the first structural component and the layer of adhesive, curing the adhesive at least partially, separating the first structural component and the first evaluation film by a relative movement therebetween, and inspecting bond line quality of the adhesive.

Abstract: A method of fabricating a plurality of electronic component packages includes coupling a tape to a panel. Electronic components are coupled to the tape and encapsulated to form a molded wafer. The molded wafer is mechanically separated from the panel without heating by breaking a mechanical separation adhesive of the tape. By mechanically separating the molded wafer from the panel without heating, warpage of the molded wafer associated with heating is avoided.

Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.

Abstract: An apparatus for removing carpet including: a base; a hoist engaged with the base; a resilient line with first and second ends, wherein the first end is engaged with the hoist; a carpet gripping means removably engaged with the second end of the resilient line; and at least one friction surface engaged with a bottom of the base for holding the base in position. Further, a method for removing carpet comprising: the apparatus for removing carpet; moving the apparatus into position; engaging carpet to be removed with the carpet gripping means; and utilizing the hoist and resilient line to pull the carpet gripping means in order to remove the carpet.

Abstract: An apparatus for debonding two temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge arranged adjacent to a first edge of the chuck and connected to a hinge. The flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor moves the contact roller vertical to the plane of the chuck top surface.

Abstract: The invention relates to a label ejection device (101, 201, 301, 401, 501, 601, 1201, 1301), a labeling printing system comprising said device and a method for discarding labels, in particular self-adhesive labels (103, 203, 303, 403, 603). The invention is concerned in particular with preventing faulty labels from being applied to items (or containers containing such items), with minimal attendant interruption of machine operation. The effective labeling systems and equipment are not perfect and, on occasion, “incorrect” or faulty labels (103, 203, 303, 403, 603) may be applied to containers. There is a need for an improved label ejection device (101, 201, 301, 401, 501, 601, 1201, 1301) and an improved labeling printing system that more efficiently and effectively removes labels (103, 203, 303, 403, 503, 603) from a sheet like support (104, 204, 304, 404, 504, 604, 1204).

Abstract: A peeling apparatus including a first holding section that holds a first object which is in the form of a flat plate, and a second holding section that holds a second object which is in the form of a flat plate and is affixed to the first object to be integral, the peeling apparatus being configured to be capable of peeling one of the first object and the second object off the other in a state in which the first holding section holds the first object and the second holding section holds the second object. The first holding section holds the first object by being brought into contact with a surface of the first object along a direction of a thickness thereof via at least two points.

Abstract: In certain example embodiments of this invention, there is provided a method of making a window, the method including: forming a multi-layered low-E and/or solar control coating on a glass substrate; providing at least two flexible protective sheets in non-liquid form to the glass substrate over at least part of the low-E and/or solar control coating; applying at least one protective coating in liquid form, before and/or after the flexible protective sheets are provided, so as to reduce one or more gaps formed between the low-E and/or solar control coating and the flexible protective sheet(s) and/or between the flexible protective sheets; and performing one or more of cutting, edge seaming, and/or washing the coated article with the protective coating and protective sheets thereon and peeling the protective sheets and at least part of the protective coating off of the top surface of the low-E and/or solar control coating. Heat treatment (e.g.

Abstract: A method for the production of an elastic composite material with a textile surface. First, a laminate is produced, which has elastic cover layers and a core composed of a nonwoven fabric. Subsequently, the laminate is separated into two strips, each of which has a cover layer and an adhering layer of nonwoven fabric, by tearing open the core.

Abstract: After a gate line (11), a TFT (1), and a data line (30) are formed, a riblike protective insulation layer (32) which coats the data line is formed on a substrate (10) serving as the element substrate of an active matrix type color liquid crystal display device or an organic EL display device. A color filter layer (42) on a transfer film (40) is press-bonded on this substrate (10) with a roller (46) moving in the extensional direction (columnar direction) of the protecting insulation layer (32). The advancement of the transfer of a color filter in the columnar direction makes it possible to bring the substrate and the color filter in contact without gaps while expelling the gas out of a pixel space in the advancement direction. During the step of forming a color filter, the protecting insulation layer (32) protects the data line (30) from the treatment liquid etc. An organic light emitting element layer is arranged in the pixel space to form an organic EL display device.

Abstract: A vehicle is wrapped by a printed adhesive film where the film is also applied over doors and other areas intended not to be covered. The film is cut at the door edge and over the area by adhesively attaching a tape having a release coating on the front surface and carrying a filament along a center of the front side. The printed film is applied over the door, the area not to be covered and the tapes and is cut along the door edge and around the area by pulling the filament from the tape so that a strip of the film at the door edge and the film over the area can be removed. The film can be stretched and pulled away from the tape for reapplying for proper fit.

Abstract: It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 3 is composed of a jig base 30 and an contact layer 31. A concave part 2 is formed on one side of the jig base 30. The concave part 2 is sectioned into small chambers 15 by a partition 12 having a height almost equivalent to that of a sidewall 35. The contact layer 31 is disposed on the upper edge of the sidewall 35 and the partition 12 for covering the concave part 2. A through hole 17 that is communicated with the outside is formed in each small chamber 15.

Abstract: An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.

Abstract: Embodiments of the invention provide a method for debonding chamber component used in a semiconductor processing chamber. In one embodiment, a method for debonding chamber components used in a semiconductor processing chamber includes providing a first chamber component and a second chamber component bonded by an adhesive material disposed at an interface defined between the first and the second chamber components, soaking the bonded first and the second chamber components into an organic solution for between about 8 hours to about 240 hours, and removing the bonded first and the second chamber from the organic solution; and mechanically separating the soaked first and the second chamber components.

Abstract: A sheet peeling apparatus 10 comprises: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a feeding means 12 for feeding out a peeling tape T; a sticking means 14 for sticking the peeling tape T to the adhesive sheet S; a holding means 15 for holding a tip side in a feeding direction of the peeling tape T; and a peeling means 16 for imparting a peeling force to the adhesive sheet S. The peeling means 16 includes a peeling roller 44, and the peeling roller 44 abuts against an adhesive agent layer side of the peeling tape T stuck on the adhesive sheet S, and peeling off the adhesive sheet S in a state in which a turned-back portion c is formed by turning back a peeled end side of the adhesive sheet S.

Abstract: An apparatus and a method for the removal of pellicles from masks which can be used for photolithographic purposes. The pellicles are removed from masks in a universal manner without them being further contaminated or damaged. In an apparatus, at least one grip is present for the manipulation of masks provided with pellicles which has at least two fixing elements which engage at the edge of a mask with exerted pressure force. There are moreover present in this connection at least one detector for the contactless determination of the position of mounts formed at the radially outer edge of pellicles, and a heating device for the heating of an adhesive with which pellicles are fastened to a mask with material continuity, and a removal apparatus of the pellicles from a mask having a mask fixing unit and a pellicle removal unit.

Abstract: A film peeling device for peeling a film (11) adhered to a front surface of a wafer (20), on the back surface of which a dicing tape (3) is adhered, the wafer is integrated with a mount frame (36) into one body, comprises: a movable table (31), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means (80) for covering an adhesive face (3a) of the dicing tape, which is exposed between the mount frame and the wafer at one end (28) of the wafer; and a adhering means (46) for adhering a peeling tape (4) to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end (29) of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.

Abstract: To provide a mounting apparatus for uniting a semiconductor wafer with a ring frame, the wafer having an adhesive sheet stuck on one surface thereof. In the mounting apparatus, a portion of the adhesive sheet is preliminarily peeled off through a preliminary peeling means, the wafer is disposed inside the ring frame after a preliminarily peeled portion is formed, and a mounting tape is stuck to the ring frame and the wafer through a sticking means. The mounted wafer is fully peeled off by holding the preliminarily peeled portion.

Abstract: A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.

Abstract: Apparatus, devices, systems and methods for removing automatically removing fixed carpeting such as glued down carpeting from spaces. The apparatus can include a motor powered winch having a hook end that can grip about a raised edge of the carpet. The winch can be anchored to a doorway by clamping ends of a telescopic bar to doorjamb members about the doorway opening. An operator can operate the winch by remote control and be spaced outside the room that the carpet is being removed from. Another version can include a U-shaped telescopic clamp arrangement so that the winch is also spaced outside the room from which the carpet is being removed.

Abstract: A method and system referred to as PALM (Patterning by Adhesive of Large Relief Three-Dimensional Microstructures) with large reliefs exceeding 1 ?m and being as large as 100 ?m. The microstructures can be either deterministic (such as microprisms), or random (such as diffusers), the first obtained by copying an original supermaster, and latter obtained by copying a laser speckle pattern. The master process entails copying a supermaster into the form of the microstructure constituting a pattern on the patterning cylinder (called a drum), to be then continuously multiplied in the PALM system, in a continuous roll-to-roll web process. The latter method, together with the related system, is the subject of this invention. The rolls continuously repeat the master pattern, copying by adhesive with large viscosity on acrylic (hybrid) as well as by a monolithic process. The monolithic process can be accomplished using temperature and pressure, or by UV-cured polymerization.

Abstract: During detachment of a die from an adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.

Abstract: The aim of the invention is to improve the supply of transfer foil in a coating module in which the image-forming layers of a transfer foil are transferred to a printing material. To achieve this, a partial pressing surface is located in the coating module for transferring the layers of the transfer foil. This permits targeted control of the foil feed. The transfer foil can be fed past a pressure cylinder in an approximately tangential manner and with a limited width.

Abstract: An automatic mask peeling apparatus 10 includes: a brushing apparatus 30 for removing solidified plugging slurry attached to the mask 24; an air injection apparatus 36 for injecting, after the removal of the solidified plugging slurry, air from the opposite end face-side of the one end face to raise a folded surplus part of the mask from the one end face; a mask peeling apparatus 50 for holding the part raised by the air injection apparatus 36 to peel the mask 24; and a carrying apparatus 55 for carrying a masked plugging honeycomb structure 200 from the brushing apparatus 30 to the mask peeling apparatus 50. This apparatus can be used to peel a mask 24 which has been used for plugging only the predetermined cells of a masked plugging honeycomb structure 200; the mask 24 having an area larger than the area of the end face of the structure.

Abstract: Laser-based methods of stripping different types of fiber optic cables (100) are disclosed. The method includes directing a focused laser beam (202) onto the cable's protective cover (114). The method also includes moving the fiber optic cable relative to the focused laser beam in a direction substantially along a central axis (AC) to form a substantially axially oriented groove (250) in the protective cover, wherein the groove does not reach one or more optical fibers (110) carried by the cable. The method can further include opening the protective cover at the groove to form a split protective cover portion (114S), and removing the split protective cover portion from the fiber optic cable. Methods of stripping a cable by forming two grooves in the protective cover using two focused laser beams are also disclosed.

Abstract: A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded.

Abstract: Apparatus, devices, systems and methods for removing automatically removing fixed carpeting such as glued down carpeting from spaces. The apparatus can include a motor powered winch having a hook end that can grip about a raised edge of the carpet. The winch can be anchored to a doorway by clamping ends of a telescopic bar to doorjamb members about the doorway opening. An operator can operate the winch by remote control and be spaced outside the room that the carpet is being removed from. Another version can include a U-shaped telescopic clamp arrangement so that the winch is also spaced outside the room from which the carpet is being removed. Another version includes a carpet grabbing plate adapter having hooks on a top side and carpet grabbing teeth extending below. The clamp ends of the telescopic bar can be locked to the upper hooks on the carpet grabbing plate. Another version has a double jawed carpet grabber with a pair of handles and teeth with channel members for enhanced carpet edge grabbing.