Abstract: A semiconductor package includes: a substrate having a first surface and a second surface opposing the first surface, the first surface having a fan placement zone, a hole and a ventilation hole penetrating the substrate formed at the fan placement zone of the substrate; an electronic component disposed on the first surface surrounding the fan placement zone, the electronic component electrically connected to the substrate; an encapsulant formed on the electronic component and the first surface of the substrate, the encapsulant having an encapsulant opening exposing the fan placement zone; and a fan unit disposed in the encapsulant opening and electrically connected to the substrate. Since the electronic component is disposed on the substrate outside the fan placement zone, heat generated by the electronic component can efficiently dissipate while damage problems of over heat will not occur, and the overall height of the fan unit can thus be decreased.

Abstract: An exemplary heat dissipation device includes a fan having fixing cylinders, a heat sink having a supporting board, and fasteners fixing the fan to the heat sink. Each fastener includes a screwing pole, a first elastic member and a second elastic member encircling the screwing pole, and a fastening cylinder engaging with the screwing pole. Each screwing pole includes a head, a shaft extending coaxially downwardly from the head, and a post extending coaxially downwardly from the shaft. For each fastener, the screwing pole extends through a corresponding fixing cylinder of the fan, the first elastic member is compressed between the head and the corresponding fixing cylinder, the second elastic member is compressed between the corresponding fixing cylinder and the fastening cylinder, and the post protrudes from the fastening cylinder and is engaged with the supporting board.

Abstract: A disk drive test slot thermal control system includes a test slot. The test slot includes a housing and an air mover (e.g., a blower or a fan). The housing includes an outer surface, and an internal cavity. The internal cavity includes a test compartment for receiving a disk drive for testing. The housing also includes an inlet aperture extending from the outer surface of the housing to the internal cavity. The air mover can be disposed outside of the internal cavity to provide an air flow towards the test compartment through the inlet aperture.

Abstract: Provided is a small and low-cost resin-sealed electronic control device including a first electronic board and a second electronic board respectively bonded onto an upper surface and a lower surface of a support plate, each of the first electronic board and the second electronic board having an increased mounting area on which circuit components are mounted. A first electronic board (30A) and a second electronic board (40A) respectively bonded onto an upper surface and a lower surface of a support plate (20A) include outer circuit components (31, 41) and inner circuit components (33, 43) respectively mounted on outer surfaces and inner surfaces thereof. The inner circuit components (33, 43) are fitted into a window hole portion (21) of the support plate (20A) and are sealed with a filler (25).

Abstract: An image displaying apparatus, which is excellent in heat radiation efficiency and has an excellent back design, includes a display panel for displaying an image; a heat generating member provided on a back side of the display panel; and a cabinet for covering the display panel and the heat generating member at least from the back side of the display panel. In the cabinet, an aperture is provided at a position facing the heat generating member, and an opening/closing unit enables switching between closing and opening of the aperture. In a state that the aperture is opened by the opening/closing unit and one part of a heat-transfer member is positioned on a side of the cabinet opposite to the display panel, the other part of the heat-transfer member extends through the aperture so that the heat-transfer member can thermally be connected to the heat generating member.

Abstract: A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13).

Abstract: In accordance with the present disclosure, a system and method for a modular fluid handling system with modes in a modular data center is presented. According to the present application, a modular data center may include a modular primary structure. The modular primary structure may include a plurality of information handling systems arranged in racks within it. The modular data center may also include a modular fluid handling system that circulates fluid through the modular primary structure according, at least in part, to a plurality of modes. The modular fluid handling system may be designed to accommodate environmental conditions in which the modular data center will operate as well as the usage requirements of the modular primary structure.

Abstract: An electronic device includes a bottom plate, a circuit board, a fan, and an airflow guide member. The circuit board is fixed to the bottom plate. The fan is arranged at the front of the circuit board. The airflow guide member is arranged between the fan and the circuit board. The airflow guide member includes an airflow guide wall for guiding most of airflow upwards to the top of the circuit board. A number of slots is defined in the airflow guide wall, for allowing only a minimum portion of the airflow to flow underneath the circuit board.

Abstract: A computer system includes a display, a computer case securing the display, a fan assembly and a cover. A motherboard is attached to the computer case. A chip, a heat dissipating device, and a system fan are located on the motherboard. The fan assembly includes a securing plate and a fan attached to the securing plate. The securing plate covers the plurality of the memory cards. The cover defines a plurality of air intakes and a plurality of air outlets. The plurality of air intakes, the fan, the heat dissipating device, the chip, the system fan and the plurality of air outlets together form an air path for moving air therethrough.

Abstract: A hard disk drive (HDD) assembly includes an HDD rack and a dummy HDD. The rack includes a front wall and two sidewalls perpendicularly extending from opposite ends of the front wall. A number of spaced fixing holes are respectively defined in each of the sidewalls. A number of protrusions extend from opposite ends of the dummy HDD and engage with the corresponding fixing holes of the rack.

Abstract: An exemplary heat dissipation device includes a fin assembly, a heat pipe, and a protective member. The fin assembly includes stacked fins and air passages between fins. Each fin includes a main body, an extending hole defined in the main body, and a flange extending from the main body around the extending hole. The heat pipe is received in the extending holes of the fins and abuts the flanges of the fins. The protective member includes a plurality pairs of elastic arms. Each pair of elastic arms is sandwiched between a free end of the flange of a corresponding fin and the main body of a corresponding adjacent fin to prevent solder associated with the heat pipe from flowing into the corresponding air passage.

Abstract: A heat dissipating structure and a portable device are provided, which enable that heat is dissipated from a heat generating part without causing a user to feel discomfort. A heat transfer member is configured to transfer heat generated in a heat generating body and a thermal storrage unit is thermally connected to the heat transfer member. The thermal storrage unit includes a pack with stretching property and a thermal storrage medium which is filled in the pack and a volume of which changes with a change in temperature. The pack is arranged such that there is a gap between the pack and a first heat dissipating portion at normal temperature and the pack contacts the first heat dissipating portion when the thermal storrage medium expands with a change in temperature.

Abstract: A chassis includes two opposite sidewalls, a first vent wall connected between corresponding ends of the sidewalls, and a second vent wall connected between the sidewalls and close to an inner surface of the first vent wall. The first vent wall defines a number of first vents extending along a first direction. The second vent wall defines a number of second vents extending along a second direction different from the first direction.

Abstract: An electronic apparatus includes a heat sink for mounting a heating element, a cooling fan for supplying an airstream to the heat sink, and a housing for storing the heat sink and the cooling fan. The housing and the heat sink are equipped with a projection engaged with a hole of a flange of the cooling fan, and the cooling fan is sandwiched by the housing and the heat sink.

Abstract: A multi-rack assembly is provided which includes adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.

Abstract: A multi-rack assembly is provided which includes first and second electronics racks. The first electronics rack includes one or more cooling units disposed within the first electronics rack, which are coupled in fluid communication with a primary coolant loop of the first electronics rack to, at least in part, provide cooled coolant to the primary coolant loop and facilitate cooling one or more first rack electronic components. The second electronics rack includes a secondary coolant loop coupled in fluid communication with the cooling unit(s) disposed within the first electronics rack. The multi-rack assembly further includes a controller to automatically provide cooled coolant to the secondary coolant loop, and wherein the controller controls flow of cooled coolant from the cooling unit(s) to the secondary coolant loop depending, at least in part, on cooling requirements of the first electronics rack.

Abstract: A heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions.

Abstract: A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with one of a plurality of heat-generating electronic components on the circuit board. The cooling system also includes a plurality of heat exchangers that are configured to dissipate heat from the liquid coolant to air. Each heat exchanger of the plurality of heat exchangers is fluidly coupled between two cooling modules of the plurality of cooling modules in a flow path of the liquid. The cooling system also includes a plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers.

Abstract: A cooling unit is provided to facilitate cooling of coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Abstract: Apparatuses are provided for compressing a thermal interface material between a heat generating electrical component and a cooling electrical component. Embodiments include a draw rod coupled at one end to the cooling electrical component, the draw rod passing through the heat generating electrical component; wherein the draw rod includes a pin on the end opposite the end coupled to the cooling electrical component; and a rotatable latch coupled to the heat generating electrical component, the rotatable latch including a hook at one end; wherein when the rotatable latch is in an engaged position, the hook of the rotatable latch engages the pin of the draw rod such that the thermal interface material adhered to the heat generating component is coupled to the cooling electrical component; wherein when the rotatable latch is in an unengaged position, the hook of the rotatable latch is not engaged with the pin of the draw rod.

Abstract: A cooling liquid can be circulated in a liquid cooling system, so that a light source unit and a control unit can be forcedly cooled by the cooling liquid. Thus, a temperature increase in these components can be suppressed, thereby achieving an increase in the output power of a liquid-cooled LED lighting device. The liquid-cooled LED lighting device can include a housing, a light source unit having LEDs as light sources, a liquid cooling system, and a control unit to control the light source unit to be turned on. The liquid cooling system can include a heat receiving jacket, a radiator, a circulation pump and a fan. The light source unit and the control unit can be disposed with the heat receiving jacket of the liquid cooling system interposed therebetween. Further, one surface of the control unit can be brought in close contact with the heat receiving jacket while a heat radiation portion (e.g., fins or pins) can be provided at an other surface of the control unit.

Abstract: A cooling device has a large number of closely spaced impinging jets, adjacent an impingement gap, with parallel return paths for supplying coolant flow for the impinging jets with the least possible pressure drop using an interdigitated, branched hierarchical manifold. Surface enhancement features spanning the impingement gap form U-shaped microchannels between single impinging jets and single outlets.

Abstract: Environment conditioning system of the inner space of a data centre (2) is provided with electronic equipment (3). The system (1) includes a passive air-to-air heat exchanger (4), configured to enable heat exchange, without air cross-contamination, between an outer air flow (5) and a recirculation air flow (6). The recirculation air flow (6) comes from the inner space of a data centre (2) and it is intended to condition it after passing through the air-to-air heat exchanger (4).

Abstract: A system for cooling an integrated circuit of an electronic device includes a cooling body and a shelf that is positioned relative to the cooling body for the device to be reversibly inserted onto the shelf so that the cooling body is in thermal contact with the integrated circuit. The cooling body is cooled by introducing a fluid therein via an input conduit. The hot fluid is received from the cooling body by an output conduit and is cooled for recycling. The housing of the electronic device includes a rearward gap that admits the cooling body into the housing of the electronic device. Preferably, further cooling is provided by forcing a gas to flow past the output conduit.

Abstract: According to one embodiment, an electronic apparatus includes an enclosure, printed wiring board, electronic component, fan, duct, fin assembly, and heat pipe. The enclosure has an exhaust port in a sidewall thereof. The electronic component is mounted on the printed wiring board. The fan is placed in the vicinity of the exhaust port. The duct guides an airflow generated by the fan to the exhaust port. The fin assembly constituted of a plurality of fins, is arranged between an exit of the duct and the exhaust port, and includes an extension portion. A part of the extension portion extends to a range configured to overhang the printed wiring board.

Abstract: An apparatus is disclosed that may include a printed circuit board (PCB) and an electronics package may be disposed about the first surface of the PCB. The PCB may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core. The metal layer may be disposed on a core first surface. The metal layer may comprise metal or other conductive material suitable to define traces, which may be circuit paths for electronic components affixed to the PCB. In some aspects, the core may be electrically non-conducting, and may be thermally insulating, and, accordingly, inhibit the transfer of heat from the electronics package through the PCB. However, pins may be configured to pass through the PCB including the core from the core first surface to the core second surface to conduct heat generated by the electronics package away for dispersion.

Abstract: A method is provided for containing cold air in a corridor created on the side of a computer cabinet. The method includes providing a base mountable on the computer cabinet, and providing a panel fastened to the base and moveable with respect to the base, the panel being suitable for separating the cold air in the corridor below the panel from the hot air above the panel.

Abstract: Various technologies for cooling a computer system are described. In accordance with one described embodiment, a fan assembly system for a computer comprises a fan operable for cooling the computer and a fan duct coupled with the fan. The fan duct comprises a number of attaching features. The fan is suspended at least one component of the computer. Moreover, the suspended fan enables air to flow between the fan and the component (e.g., a heatsink) to facilitate cooling of the component.

Abstract: A portable electronic device comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing. The heat-conduction structure is disposed in the housing and contacts the circuit board. The heat-dissipation structure is disposed outside the housing and connected to the heat-conduction structure, wherein heat is transmitted from the circuit board, passing the heat-conduction structure and the heat-dissipation structure to be dissipated out of the housing.

Abstract: A cooling coolant pipe of a server cabinet includes multiple tube bodies interconnected in series and at least one adjustable valve. In each of the tube bodies a first chamber and a second chamber that are adjacent to and separated from each other, the second chambers of the two adjacent tube bodies are in communication with each other, and a wall surface of each of the tube bodies has at least one connection port in communication with the first chamber. The adjustable valve is disposed in one of the tube bodies. The first chamber in each of the tube bodies is in communication with the second chamber in the tube body through the adjustable valve. In this way, the adjustable valve adjusts the flow rate of a cooling fluid flowing from the second chamber to the first chamber.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a cooling unit includes a radiator unit on the circuit board, and a cooling fan connected to the radiator unit and supported outside the circuit board in a floating state, a keyboard on a top wall of the housing, opposed to the circuit board and the cooling fan, a first supporting member disposed between the cooling fan and the keyboard and configured to support the keyboard when a key is depressed, and a second supporting member disposed between the cooling fan and a bottom wall of the housing and configured to support the cooling fan when a key is depressed. At least one of the first and second supporting members is formed of an elastic material.

Abstract: A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.

Abstract: One aspect of the disclosure is directed to a heat sink assembly for dissipating heat from an electronic component. The heat sink assembly includes a heat sink having a base and at least one fin extending from the base. The at least one fin has an opening formed therein that is configured to receive a fastener. The heat sink assembly also includes a clip. The clip has a first portion configured to receive the fastener and at least one second portion flexibly coupled to the first portion. The at least one second portion is configured to secure the heat sink to the electronic component proximate to the base in response to a force being applied to the first portion by the fastener.

Abstract: A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.

Abstract: An exemplary container data center includes a container, servers received in the container; and a ventilating system for cooling the servers. The ventilating system includes a filter, an exhaust pipe and a blower. The filter includes a chamber and filtering fluid received in the chamber for dissolving dust in ambient air. The chamber defines an air inlet for entering the ambient air and an air outlet. The exhaust pipe has one end coupled to the air outlet of the filter and another end communicating an interior of the container. The blower drives the ambient air out of the filter to flow along the exhaust pipe to the container to cool the servers.

Abstract: A power switch and connector that are conventionally included in a body are formed in spaces created at the outer ends of the shafts of hinges other than the body and a display, whereby the body is thinned. Electronic device comprises a body, a display, and a hinge that joins the body and display so that they can be freely opened or closed. A power switch is formed at an end of the shaft of the hinge. Furthermore, the electronic device comprises the body, the display, and another hinge that joins the body and display so that they can be freely opened or closed. A port of a connector opens at an end of the shaft of the hinge.

Abstract: Apparatuses are provided for compressing a thermal interface material between a heat generating electronic component and a cooling electrical component. Embodiments include a rotatable latch fastened to the heat generating electrical component, the rotatable latch including a hook; wherein when the rotatable latch is in an engaged position, the hook of the rotatable latch engages a pin extending from the cooling electrical component such that the thermal interface material adhered to the heat generating electrical component is coupled to the cooling component; when the rotatable latch is in an unengaged position, the hook of the rotatable latch is not engaged with the pin of the cooling electrical component; a load screw; wherein when the rotatable latch is in the engaged position, threading the load screw into the rotatable latch moves the rotatable latch into a locked state; and a spring leaf that is coupled to the heat generating electrical component.

Abstract: As a result of a lower arm side having a small thermal resistance being positioned downstream of the coolant flow, cooling efficiency of the lower arm positioned on the downstream side of the coolant flow becomes higher than that of an upper arm positioned on an upstream side. Hence, rise in coolant temperature on the upstream side can be suppressed, and the first and second semiconductor chips disposed upstream and downstream can be effectively cooled. Alternatively, even when the coolant temperature rises on the upstream side, the first and second semiconductor chips disposed upstream and downstream can be effectively cooled by sufficient cooling being performed on the downstream side based on the high cooling efficiency. Therefore, the rise in semiconductor chip temperature on the downstream side to a temperature higher than that on the upstream side can be suppressed.

Abstract: A heat dissipation device and a heat dissipation method are provided. The device is disposed in a case having a first opening and a fan for generating a first cooling air flow. The device includes a heat dissipation element and an air-guiding plate. The heat dissipation element has a first region and a second region, and the first cooling air flow flows from the first region towards the second region. The air-guiding plate is disposed in the first region of the heat dissipation element and used for reducing a cross-sectional area of the first cooling air flow flowing in the first region along a flow direction of the first cooling air flow, so as to draw air outside the case into the second region via the first opening to generate a second cooling air flow, thereby lowering a temperature of the case located below the heat dissipation element.

Abstract: A mainframe structure includes a housing having a detachable front cover, and a circuit module accommodated in the housing. The circuit module includes a main circuit board affixed to the back side of the detachable front cover in vertical and carrying first and second electrical connectors, a chip (or chips) and memory devices, a functional circuit board horizontally mounted in the housing at the bottom side and having a first connection port connected to the first electrical connector of the main circuit board, and a display circuit board vertically mounted in the housing at the top side and having a second connection port connected to the second electrical connector of the main circuit board. The detachable design of the circuit module minimizes the sizes of the main circuit board and facilitates maintenance of the main circuit board.

Abstract: A mainframe structure includes a housing having a front opening, flanges on one same plane around the front opening and stop members suspending on the inside corresponding to the flanges, a circuit module accommodated in the housing, and a cover detachably mounted in the front opening of the housing and stopped against the flanges and the stop member. The cover has two slots symmetrically disposed at two opposite lateral sides, two lugs respectively disposed adjacent to the slots and two handles respectively mounted in the slots and pivoted to the lugs in reversed directions. By means of biasing the two handles to stop against respective stop members, the user can detach the cover from the housing conveniently with the hands without any hand tools.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a heat sink, and a fixing portion. The circuit board includes a heating component. The heat sink has a plate shape and faces the heating component. The fixing portion is attached to the heat sink and fixed to the circuit board at least at two points.

Abstract: A heat dissipation device includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing and an impeller comprising a driving member received in the housing, an annular magnet accommodated in the hub and an axle coaxially connecting the driving member and the annular magnet together. The fan includes a plurality of windings fixed on an inner side thereof. When the working fluid is heated and vaporized to move through the driving member, the driving member is driven by the vaporized working fluid to rotate, whereby the annular magnet rotates within the windings to cause the windings to generate a current.

Abstract: Data processing modules including a housing and optical interfaces associated with the exterior of the housing, and systems including the same.

Abstract: A heat sink assembly is provided for a pluggable module. The heat sink assembly includes a heat sink having a module side and an end surface that intersects the module side. The module side is configured to thermally communicate with the pluggable module. A holder extends from the end surface of the heat sink. A thermal interface material (TIM) layer extends on the module side of the heat sink. The TIM layer is configured to engage the pluggable module. The TIM layer includes an end that is engaged between the end surface and the holder of the heat sink.

Abstract: A guide system is provided for an electronic device having a card module mated with a header. The guide system includes a guide rail configured to guide the card module for mating with the header of the electronic device. The guide rail includes a main wall extending along a longitudinal axis between a front end and a rear end positioned proximate to the header. The guide rail also includes board guides extending from the main wall along the longitudinal axis that are configured to engage a card module circuit board or board guide of the card module to guide the card module to the header. The guide rail also includes heat sink flanges extending from the main wall along the longitudinal axis that are configured to engage a heat sink of the card module to dissipate heat from the heat sink to the main wall.

Abstract: The invention relates to a method for heating/cooling and coating a substrate in a vacuum chamber, comprising the following steps: (1) arranging the lower face of the substrate on a substrate holder, (2) lifting the substrate by a predefined distance relative to the substrate holder, and (3) heating the lifted substrate via its upper face by means of a heating device such as a radiant heating device, (4) coating the hot substrate, for example by moving it in or through a coating zone, (5) cooling the substrate by lowering it onto the chuck and (6) optionally further coating the cold substrate. The method according to the invention further enables process sequences to be executed, wherein various defined temperatures can be set on the substrate during each step, and optionally one or more coating processes can be executed immediately subsequently at said substrate temperature.

Abstract: A thermoelectric energy harvesting system may include a thermoelectric generator and an electronics module. The thermoelectric generator may produce a voltage in response to a temperature difference across the thermoelectric generator and generate power when coupled to a load. The system may include a housing mounted on top of the thermoelectric generator. The housing may include a cavity containing the electronics module. The electronics module may condition the power generated by the thermoelectric generator. The cavity may be enclosed by an inner surface of the housing. A radiation shield may cover at least a portion of the inner surface and may block radiative heating of the cavity from the housing.

Abstract: A semiconductor element cooling apparatus includes: a first member whose first surface on which a semiconductor element is mounted, and whose second surface has fins that define coolant flow paths, and that extend in a first direction, and that stand from the second surface to a predetermined height, and that are spaced from each other by predetermined intervals; and a second member that defines the coolant flow paths that extend in the first direction. The fins have grooves which extend in a second direction that intersects the first direction, and which have a depth that extends from the distal end side of the fins toward the second surface. The depth of the grooves is smaller than the height of the fins. A protrusion-forming member is disposed in the grooves, and extends across adjacent fins, and forms protrusions in the coolant flow paths defined by the adjacent fins.

Abstract: A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.