Abstract: A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink.

Abstract: A heat-dissipating apparatus is installed on a circuit board which includes a board body formed with a plurality of apertures, a heat-generating element, and a lock member having an engaging hole. The heat-dissipating apparatus includes a base plate and a plurality of fastening elements. The base plate is abutted against the heat-generating element, and includes an engaging hook for engaging the engaging hole, and a plurality of through holes corresponding in position to the apertures. A plurality of connecting elements are disposed below the board body and correspond in position to the apertures. Each fastening element extends through a respective through hole, and is engaged to a respective connecting element after extending through a respective aperture. A plurality of spring members are respectively sleeved on and bias the fastening elements to move away from the base plate.

Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

Abstract: A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.

Abstract: An exemplary heat sink mounting frame is for mounting a heat sink onto a circuit board. The heat sink mounting frame includes a circular guide rail, and mounting arms movably connected with and extending radially and outwardly from the guide rail. Each mounting arm includes a fixing bracket connected to the guide rail and a sliding bar slidably connected with the fixing bracket. An engaging post is formed on the sliding bar. The sliding bar is slidable along the fixing bracket, such that a total length of each of the mounting arms is variable to adjust the locations of the engaging posts of the mounting arms.

Abstract: An exemplary heat dissipation device includes a base plate, a bracket engaged with the base plate, and a heat radiator mounted on the base plate and the bracket. The bracket includes two parallel arms. The bracket defines an opening between the arms. Each of the arms extends downwardly two clasps. Each clasp of each arm comprises a blocking part and a connecting part connecting the blocking part. The base plate is received into the opening of the bracket and sandwiched and secured by the blocking parts of the clasps and the arms of the bracket.

Abstract: A device case for a portable electronic device is provided and includes mechanical protection for the device, an active thermal element incorporated within the mechanical protection and a controller to control an operation of the active thermal element, the controller being configured to limit power consumption of the active thermal element and to maintain a predefined internal device temperature.

Abstract: There is provided a heat dissipating device. An exemplary heat dissipating device comprises a thermally conductive plate that is adapted to be disposed adjacent to at least one heat generating device. The thermally conductive plate has surface features configured to promote turbulent airflow over the thermally conductive plate, the thickness of the surface features being approximately equal to or less than the thickness of the plate.

Abstract: A system for cooling electronic equipment includes first and second heat exchangers and a condenser. The first exchanger is disposed in an airflow in thermal communication with electronic equipment and is configured to receive a cooling fluid at a first temperature. The first exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a second temperature. The second exchanger is disposed in the airflow between the first exchanger and the electronic equipment and is configured to receive the cooling fluid at the second temperature. The second exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a third temperature. The condenser is configured to receive the cooling fluid at the third temperature and is configured to enable heat transfer from the cooling fluid to a cooling source to cool the cooling fluid to the first temperature.

Abstract: An apparatus comprising a rack having one or more shelves, a plurality of electronics circuit boards and heat conduits and a cooler. Each board is held by one of the one or more shelves, some of the boards having a localized heat source thereon. Each heat conduit forms a heat conducting path over and adjacent to a particular one of the boards from a region adjacent to the heat source thereon to a connection zone, the zone being remote from the heat source. The cooler is located on a side of the rack and coupled to the zones such that heat is transferable from the paths to the cooler. The cooler is configured to flow a cooling fluid therein to cool localized thermal interfaces at the cooler, each interface being adjacent to and at a corresponding one of the zones.

Abstract: An air duct defines a first air vent and a second air vent at opposite ends thereof, respectively. The air duct includes a duct body and a movable plate. The duct body defines a through opening in a side thereof. The through hole intercommunicates an interior and an exterior of the air duct. The movable plate is mounted on the side of the duct body adjacent to the through opening. By moving the movable plate, the through opening can be changed between an open state and a closed state freely. An electronic device incorporating the air duct is also provided.

Abstract: A structure of heat dissipation of an electronic device includes at least one heat pipe and a cooler. The heat pipe has a condensation end and an evaporation end opposite to each other, and the evaporation end is disposed on a heat generating element of the electronic device. The cooler is disposed on a rack and has a chamber therein, and the chamber has an inner shell having a cooling fluid therein. When the electronic device is mounted in the rack, the condensation end of the heat pipe is inserted into the cooler and positioned into the inner shell. The evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end, such that the cooling fluid dissipates the heat energy of the condensation end.

Abstract: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.

Abstract: A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second heat dissipating portions. Each of the first heat dissipating portion, second heat dissipating portion, and third heat dissipating portion includes a number of fins and passages formed between each two adjacent fins. The passages of the first heat dissipating portion face toward the air intake. A space is maintained between the first heat dissipating portion and the second heat dissipating portion, and the electronic element is mounted in the space.

Abstract: A heat sink assembly including a first member having a heat transfer surface adapted to directly contact a device to be cooled; a second member including coolant channels and a separate fluid channel; and a connection which at least partially mechanically connects the first member to the second member. The connection includes three bellows forming three conduits between the channels in the second member and the first member. A second one of the bellows and a third one of the bellows are located inside a first one of the bellows.

Abstract: A heat radiation structure of an electric apparatus provided herein is capable of readily releasing heat of electronic components to the outside and suppressing heat conduction to a rotational position sensor. A metal electromagnetic wave shielding member is fixed to a casing body of a casing. The electromagnetic wave shielding member includes a first portion that is connected to an opposed wall portion of the casing body to face a circuit substrate and a cylindrical second portion that is extending from a peripheral end of the first portion and along a peripheral wall portion of the casing body without being in contact with a housing. A heat conductive member having electrical insulating and heat conductivity properties as well as flexibility is disposed between the circuit substrate and the electromagnetic wave shielding member to closely contact both of the plurality of electronic components and the first portion of the electromagnetic wave shielding member.

Abstract: A building system for housing electronic equipment is described. The building system includes a building stack that includes an instrumentation modular building unit, with an internal configuration of space in the instrumentation modular building unit configured to house electronics equipment, a power modular building unit, with an internal configuration of space in the power modular building unit storing power distribution equipment, power filtering equipment and uninterruptable power supplies and further configured to deliver electronic power to the instrumentation modular building unit; and a cooling modular unit comprising an air conditioner unit and a water chiller unit, with the instrumentation modular building unit, the power unit modular building unit and the cooling modular unit stacked together.

Abstract: This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate.

Abstract: A cover is provided on one surface of a rack of an electronic device provided with an outlet, and includes a sheet that guides exhaust air exhausted from the outlet in one direction along the one surface. An electronic device rack and an air conditioning system are also disclosed.

Abstract: A heat dissipation device includes a base and a fin group placed on the base and a plurality of heat pipes thermally connecting the base and the fin group together. The base includes a substrate and a conducting plate attached to a bottom of the substrate. The heat pipes include evaporating sections and condensing sections extending upwardly from the evaporating sections and through the fin group. The evaporating sections are wholly accommodated in the substrate and in contact with the conducting plate.

Abstract: A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.

Abstract: A fan is enclosed in the enclosure of an electronic apparatus. The fan discharges air out of a ventilation opening of the fan. Heat radiating fins are located in an air passage extending from the ventilation opening. A dust catcher is removably mounted on an outside surface of the enclosure into an opening of the enclosure. The dust catcher is located in the air passage between the heat radiating fins and the ventilation opening. The dust catcher serves to catch the dust in the air passage. The dust catcher is removed from the enclosure along with the dust.

Abstract: A mounting device includes a mounting body for mounting thereon a target object to be subjected to a predetermined process; and a cooling mechanism for cooling the target object via the mounting table. The cooling mechanism includes a heat exchanger provided at a bottom surface of the mounting table, and a cooling unit having a heat absorbing unit for absorbing heat from a heat transfer medium of the heat exchanger. Further, the cooling unit is fixed to the heat exchanger through the heat absorbing unit.

Abstract: A heat-transfer mechanism which transfers heat of a heat-generating component mounted on a board to a housing includes a heat-transfer plate having a bottom face portion which has contact with the heat-generating component, a first heat-transfer portion which is screwed near one end portion of the housing and a second heat-transfer portion which is screwed near the other end portion of the housing.

Abstract: A modular cooling system includes a positive displacement compressor and a microchannel heat exchanger for cooling a heat generating device such as a semiconductor.

Abstract: A cooler and a display device including the cooler. The cooler includes: a housing; an air blowing unit disposed inside the housing and sucking external air and blowing the external air in the housing, wherein the air blowing unit includes a plurality of groups each including two air blowers; a guide vane disposed above the air blowing unit and to guide air flowed out from the air blowing unit to flow in different directions; and a plurality of auxiliary guide vanes disposed between the air blowing unit and the guide vane, and each disposed in each of the groups each including two air blowers, so as to guide air flowing below the air blowing unit to flow toward the guide vane.

Abstract: An electronic circuit device includes a bus bar, a base component and an electronic component. The bus bar has an external connector terminal capable of receiving electric power from an external power source. The base component has a metallic heat radiation portion and is disposed to oppose the bus bar. The electronic component is held between the bus bar and heat the radiation portion of the base component. The bus bar further includes fixing terminals extending toward the base component. The fixing terminals are fixed to the base component to constitute fixing portions. The fixing portions are configured to have elasticity and exert a restoring force such that a distance between the bus bar and the base component reduces. The electronic component is in pressure contact with the bus bar and the base component by the restoration force of the elasticity of the fixing portions.

Abstract: Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.

Abstract: A system and method are provided for directly coupling a chassis and a heat sink. A circuit board is provided with at least one processor mounted thereon. Additionally, a heat sink is provided, the heat sink being mechanically coupled to at least one of the circuit board and the processor for providing thermal communication between the heat sink and the circuit board. Furthermore, a mount is provided, the mount being coupled to the heat sink for providing a direct mechanical coupling with a chassis.

Abstract: A computer case including at least one radiator having two ends and at least one serpentine coiled tube for flowing a cooling liquid therethrough to cool a computer disposed within the case. The radiator may be made of a nonferrous metal.

Abstract: An electronic component unit includes: a substrate; an electronic component mounted on the surface of the substrate; a heat dissipating member received on the electronic component; a cylinder member having one end coupled to the substrate, the cylinder member having the other end defining an opening opposed to the heat dissipating member; and a piston member having one end coupled to the heat dissipating member, the piston member having the other end inserted in the cylinder member through the opening to establish a closed decompressed space inside the cylinder member.

Abstract: A modular solid-state lamp has a plurality of replaceable and rearrangeable modules. The modular lamp uses active cooling and passive cooling for thermal management. One cooling system for the modular lamp includes at least one active cooling device and a graphite heat sink in thermal contact with the at least one active cooling device to further enhance the efficiency of the cooling system. The modular solid-state lamp includes at least two modules, a power supply module and a light source module. The power supply module includes a power supply and LED driver that are able to power one or more light source modules. The power supply module further includes sensors that further improve the energy-efficiency of the lamp.

Abstract: An electronic device cooling apparatus includes a cooling unit that is thermally connected to an electronic device and is configured to induce heat generated from the electronic device to be conducted to a cooling medium that is channeled into the cooling unit; and a heat dissipating unit including a cooling chamber configured to cool the cooling medium that is heated by the heat conducted from the electronic device. The cooling unit and the heat dissipating unit are integrated.

Abstract: An electronic module is employed with at least one interiorly positioned fastener that at least partially secures a central region of the electronic module to an object to prevent bowing or warping. The module contains a base, at least two peripheral fasteners at opposed ends of the module, and the at least one interiorly positioned fastener, wherein the base is capable of accepting electronic components and further includes at least one layer, and wherein the at least one interiorly positioned fastener is interposed between the at least two peripheral fasteners.

Abstract: The present invention generally provides a cluster tool for processing a substrate. In one embodiment, the cluster tool comprises at least one processing rack, which comprises a first plurality of substrate processing chambers that are positioned adjacent to each other and aligned in a first direction, a second plurality of substrate processing chambers that are positioned adjacent to each other and adjacent to at least one of the first plurality of substrate processing chambers, the second plurality of substrate processing chambers being positioned in a second direction relative to the first direction, a first shuttle robot movable in the first direction for moving substrates between each of the first plurality of substrate processing chambers, and a second shuttle robot movable in the second direction for moving substrates between each of the second plurality of substrate processing chambers.

Abstract: Cooling systems for providing cooled air to electronic devices are described. The systems can include large storage tanks or waste treatment systems to improve the efficiency of the plant and reduce impact on the environment.

Abstract: According to one embodiment, a heat radiation block is pressed in contact with a heat receiving plate of an apparatus body, a heat receiving block receives its reaction force via a heat pipe and thus moves. A drawer section and the heat radiation block are fixed and held in the apparatus body after the movement of the heat receiving block.

Abstract: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured to receive a coolant, C-shaped inlet manifolds configured to receive the coolant from the tapered inlet distribution chamber, inverted C-shaped outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and disposed in a circular arrangement. The outlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the inlet chamber. The body further defines a tapered outlet chamber configured to receive the coolant from the outlet manifolds, where the inlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the tapered outlet chamber.

Abstract: An apparatus includes a supporting member, a cooling stage and a translating member. The cooling stage has a surface for contacting an electronic device. The cooling stage is translatably coupled to the supporting member. The translating member is coupled to the supporting member and attached to the cooling stage. The translating member is operable to translate the cooling stage relative to the supporting member to urge the cooling stage surface against the electronic device.

Abstract: The present invention relates to a cage for thermal management and for housing an electronic module. The cage includes top, bottom and side walls joined to form an interior cavity. The side walls form an enclosure having a first panel. A thermally conductive pathway is disposed on the first panel. The enclosure receives an electronic device such as a transceiver module and a heat sink mounted on the first panel. The thermally conductive pathway is disposed between the electronic device and the heat sink so that heat from the electronic device is transmitted via the thermally conductive pathway to the heat sink.

Abstract: A thermal transfer component, a thermal transfer apparatus and a method for cooling a heat generating component located upon a substrate each include a thermally conductive frame having an aperture formed completely through the thermally conductive frame within which aperture is located a thermally conductive plug. The thermally conductive plug aligns with and contacts the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled. A spring may further compress the thermally conductive plug against the heat generating component when the thermally conductive frame and the substrate are mutually aligned and assembled. The thermally conductive plug comprises an isotropic thermal transfer material and the thermally conductive frame comprises an anisotropic thermal conductive material to provide for enhanced thermal transfer from the heat generating component to a chassis.

Abstract: A combination heat sink form of a stack of radiation fins is disclosed. Each radiation fin has retaining flanges at two opposite lateral sides for securing another radiation fin. Each retaining flange has a bottom neck perpendicularly extending from the respective radiation fin, two pairs of vertically spaced retaining fingers respectively extending from two opposite lateral sides of the bottom neck in a parallel manner relative to the respective radiation fin for securing another radiation fin, a top retaining notch defined between the two pairs of vertically spaced retaining fingers above the bottom neck for accommodating the bottom neck of another radiation fin, and a retaining gap defined between each two vertically spaced retaining fingers for receiving another radiation fin.

Abstract: A method, system, and apparatus are disclosed. In one embodiment method includes causing a cooling medium to flow through a hollow cable. The cable couples an external cooling station to a heat exchanging unit. The heat exchanging unit is located within a mobile computing device. The method then transfers heat from within the mobile computing device to the cooling medium at the heat exchanging unit. Then the cooling medium contained the transferred heat is expelled out of the mobile computing device.

Abstract: The present invention provides a power saving method and apparatus for powering a lower voltage device from a higher voltage power source. The apparatus includes a switch having an input coupled to an output of the higher voltage power source. The apparatus further includes a high-to-low voltage converter having an input coupled to an output of the switch. The apparatus also includes a power plug having an input coupled to an output of the high-to-low voltage power converter, and an output configured to receive a power socket of the low voltage device. Finally, the apparatus includes a switch actuator coupled to the power plug and the switch. When the power plug is operatively engaged within the power socket of the lower voltage device, the switch actuator closes the switch. When the power plug is operatively disengaged from the power plug, the switch actuator opens the switch.

Abstract: A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader.

Abstract: An electronic equipment includes: an attachment plate; attachments disposed on the attachment plate and each provided with a female screw; a printed circuit board placed on the attachments; electronic parts mounted on the surface of the printed circuit board opposite to the attachments, and whose surfaces opposite to the surface of the printed circuit board serves as heat release surfaces; and a heat sink having a thermal-conduction surface and screw insertion holes. The thermal-conduction surface is abutted in common against the heat release surfaces with a heat release grease between them, male screws inserted into the screw insertion holes are penetrated through the printed circuit board, and meshed with the female screws threaded in the attachments, the heat sink is attached together with the printed circuit board to the attachments, and at least one of the attachments can be displaced in the thickness direction of the printed circuit board.

Abstract: A heat dissipation device is used to dissipate heat generated by a number of memory chips of a motherboard. The heat dissipation device includes two brackets attached to the motherboard and at opposite sides of the memory chips, are a support, and a fan. The support includes a fixing plate and two clamping plates extending from opposite ends of the fixing plate. The clamping plates are rotatably mounted to the brackets, and are positioned above the memory chips. The fan is sandwiched between the clamping plates or mounted to the fixing plate.

Abstract: A board coolant jacket jig system includes a main frame that includes a board installation stand on which a board is installed, and a coolant jacket separation unit that is coupled to the main frame and selectively coupled to the coolant jacket coupled to the board, to separate the coolant jacket.

Abstract: A composite cover for a portion of a motor vehicle transmission has an integral, internal heat sink to which an electronic controller is attached. The cover, which may be fabricated of any temperature appropriate plastic or composite, closes off and protects that portion of a motor vehicle transmission having electrical and electronic components such as valves, solenoids, motors and sensors. Spaced from the inside surface of the cover where it is subjected on both sides to flow of transmission fluid is a plate or heat sink. An electronic controller is disposed on the outside of the cover and attached by heat transferring mechanical fasteners such as studs or bolts to the plate inside the cover. Preferably, the housing of the controller also includes a heat sink.

Abstract: A modular equipment testing apparatus is suitable for use in severe environments. The testing apparatus comprises a base computing unit, an interchangeable test instrument board, and an interchangeable equipment interface pod. The base computing unit and the interchangeable test instrument board are sealed within a computing case. A bottom panel of the computing case is formed of a heat conducting material and acts as a heat sink for removing heat from inside the computing case. The computing case and the equipment interface pod interface to form a hermetically sealed case, which can withstand a drop of 1 meter to a solid surface and immersion to a depth of 0.5 meters in water without damage to components located within the sealed case.