Abstract: Aspects extend to devices that facilitate positioning components in a rack to permit base plane access. In one aspect, a drive carrier rail is configured to have variable widths to facilitate positioning a drive carrier in a fixed position within a slot (of a rack) where a drive is disengaged from the base plane printed circuit board (PCB). In another aspect, at least one slot rail of a slot includes a (e.g., sheet metal) spring. The spring allows a drive carrier to rest on the spring in a fixed position where the hard drive is disengaged from the base plane printed circuit board.

Abstract: An electronic device includes a support and a component in the form of an integrated circuit chip having a rear face mounted above a front face of the support and a front face opposite its rear face. A block is provided for at least partially encapsulating the component above the front face of the support. The device also includes at least one thermal dissipation member having a flexible sheet having at least two portions folded onto one another while forming at least one fold between them, these portions facing one another at least partly.

Abstract: An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.

Abstract: Disclosed herein is a power supply apparatus that includes a main board, a power unit, a control unit, pads and a pin. The control unit and the power unit are stacked on the main board and at a position in adjacent to a load; the plurality of pads are distributed along the lateral side of the power unit and the lateral side of the control unit; the plurality of pins and pads are electrically coupled and electrically coupled with the main board, the control unit and the power unit; the control unit is configured to control the power unit, so that the power unit supplies electricity to the adjacent load.

Abstract: A mounting device includes an enclosure, a mounting frame, and a pivoting member. The enclosure includes a mounting wall with a hook extending therefrom. The mounting frame is configured for receiving a plurality of fans. The pivoting member is pivotably mounted to the mounting wall. The pivoting member is pivotable relative to the mounting wall to engage in or disengage from the hook. When the pivoting member is engaged in the hook, the pivoting member secures the mounting frame to the mounting wall. When the pivoting member is disengaged from the hook, the mounting frame is removable from the mounting wall. A fan assembly with the mounting device is further disclosed.

Abstract: An electrical device may include a housing, a printed circuit board arranged in the housing, an electrical component arranged in electrical contact with the printed circuit board, and a clamp. The clamp may be configured to bias the electrical component against a cooling structure disposed in the housing and hold the printed circuit board in the housing relative to the housing. The clamp may include a clamp snap-in structure forming at least part of a snap-in connection with the housing.

Abstract: A method implemented in a computer infrastructure having computer executable code embodied on a computer readable medium being operable to perform a thermal analysis of a data center and overlay the thermal analysis on a map of the data center to provide an overlaid thermal analysis. Additionally, the computer executable code is operable to dynamically control at least one partition in the data center based on the overlaid thermal analysis.

Abstract: A power converter for a railroad vehicle includes an air guide duct that takes air from a lateral side of one of a first heat radiating fin and a second heat radiating fin, guides the taken air to a region between the first heat radiating fin and the second heat radiating fin, and then guides the taken air to an end of the other of the first heat radiating fin and the second heat radiating fin in a running direction when the railroad vehicle is running.

Abstract: Methods and apparatus for efficiently directing communications are disclosed. On example entails receiving, from a mobile terminal, a communication directed to a cellular communication network, the communication being received in an alternative channel that differs from a channel of the cellular communication network. The communication is then converted for a relayed communication to the cellular communication network on behalf of the mobile terminal, the relayed communication being made through the cellular communication network.

Abstract: An example apparatus is provided and may comprise a housing, an electronic blade system, and a plurality of airflow management components. The housing may have an upper chamber and a lower chamber. The electronic blade system may be located between the upper chamber and the lower chamber. The plurality of airflow management components may be configured to be removable and to manage airflow in the housing.

Abstract: A method, system and computer program product for implementing thermal air flow control management of a computer system. A temperature profile of the server system is identified. One or more dual in-line memory-modules (DIMMs) are used to pivot on an axis to direct air flow to cool identified hot spots based upon the temperature profile of the server system.

Abstract: An electronic unit includes a heat sink, a substrate, a heating component, a temperature sensor, a first interconnection, and a second interconnection. The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The heating component is mounted on the substrate to generate heat upon energization of the heating component. The temperature sensor is mounted on the substrate to detect temperature. The first interconnection is provided in a high-temperature region in which the heating component is mounted on the substrate, and is connected to the strut of the heat sink. The second interconnection is provided in a detection region in which the temperature sensor is mounted on the substrate, and is provided separately from the first interconnection. The second interconnection is connected to the strut of the heat sink and the temperature sensor.

Abstract: A method, system and computer program product for implementing thermal air flow control management of a computer system. A temperature profile of the server system is identified. One or more dual in-line memory-modules (DIMMs) are used to pivot on an axis to direct air flow to cool identified hot spots based upon the temperature profile of the server system.

Abstract: A heat dissipating device that includes a first heat spreader layer, a second heat spreader layer, a first spacer, a second spacer, a first phase change material (PCM), and a second phase change material (PCM). The first heat spreader layer includes a first spreader surface and a second spreader surface. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The first spacer is coupled to the first heat spreader layer and the second heat spreader layer. The second spacer is coupled to the first heat spreader layer and the second heat spreader layer. The first PCM is located between the first heat spreader layer and the second heat spreader layer. The first PCM is surrounded by the first spacer. The second PCM is between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer.

Abstract: In accordance with embodiments of the present disclosure, an apparatus for minimizing heat transfer may include a first member substantially planar in shape, a second member substantially planar in shape and substantially perpendicular to the first member, and a gasket mechanically coupling the first member to the second member. The apparatus may be formed such that the first member, second member, and the gasket define a plenum wherein the first member, the second member, and the gasket prevent transfer of fluid between an interior and exterior of the plenum.

Abstract: A system of thermally managing network equipment including a rack housing a network equipment element, an intake coupling including one or more vanes and an exhaust port, a duct, and a rack coupling mechanism configured to adjustably position the intake coupling relative to the rack. The intake coupling is configured to: receive an airflow from the hot air exhaust vent at a first direction; deflect the airflow in a second direction via the one or more vanes; and exhaust the airflow through an opening in the exhaust port.

Abstract: An information handling system includes a hard disk drive, a handle in physical communication with the hard disk drive, and a first flexible heat sink component. The first flexible heat sink component includes a first surface contact portion, a first main portion, and a first plurality of fins. The first surface contact portion is in physical communication with the hard disk drive. The first main portion is in physical communication with the handle. The first fins extend away from the first main portion. The first fins flex downward toward the hard disk drive when the first fins are placed in physical communication with a cover of a storage sled, and the first fins fit within a space between the cover and the hard disk.

Abstract: A display device for a vehicle and an automobile including the same are disclosed. In one aspect, the display device includes a display unit that includes a first surface and a second surface located on an opposite side of the first surface. The first surface includes an active area having opposing sides and configured to generate an image and a plurality of inactive areas located on the opposing sides of the active area and bent with respect to the active area. The display device also includes a heat radiation member adjacent to the second surface of the display unit.

Abstract: A graphene oxide-coated graphitic foil, composed of a graphitic substrate or core layer having two opposed primary surfaces and at least a graphene oxide coating layer deposited on at least one of the two primary surfaces, wherein the graphitic substrate layer has a thickness preferably from 0.34 nm to 1 mm, and the graphene oxide coating layer has a thickness preferably from 0.5 nm to 1 mm and an oxygen content of 0.01%-40% by weight based on the total graphene oxide weight. The graphitic substrate layer may be preferably selected from flexible graphite foil, graphene film, graphene paper, graphite particle paper, carbon-carbon composite film, carbon nano-fiber paper, or carbon nano-tube paper. This graphene oxide-coated laminate exhibits a combination of exceptional thermal conductivity, electrical conductivity, mechanical strength, surface smoothness, surface hardness, and scratch resistance unmatched by any thin-film material of comparable thickness range.

Abstract: A swaged heat includes a fin base having an outer periphery, and formed with a first fin insert groove and a second fin insert groove interposing a swage portion of a bi-forked shape in between, a first fin fixed to the first fin insert groove of the fin base using the swage portion, a second fin fixed to the second fin insert groove of the fin base using the swage portion, a panel having an opening portion, and placed on the outer periphery of the fin base. The thickness of the outer periphery is smaller than that of the fin base.

Abstract: An apparatus is provided which includes a changeable cover assembly sized to cover, at least in part, an air outlet side of an electronics rack. The cover assembly, when positioned at the air outlet side of the rack, redirects and vents airflow egressing from the air outlet side. The cover assembly includes a frame and at least one vent cover. The frame has at least one opening through which air egressing from the electronics rack passes, and the vent cover(s) is coupled to the frame and overlies, at least in part, the opening(s) in the frame to facilitate redirecting and venting the air passing through the frame. The at least one vent cover is changeable to change a direction of the vented air. For instance, the vent cover(s) may be reversible, or otherwise adjustable or changeable, to change the direction of vented air egressing from the cover assembly.

Abstract: A centrifugal fan includes an impeller and a motor which rotates the impeller. The impeller includes an upper shroud, a lower shroud, and blades arranged therebetween. A rotor of the motor is attached to an attachment part of the lower shroud. In a section passing a rotary shaft of the impeller, the rotor and the attachment part are provided at a more outer side than a circle having a center on a line passing an upper end portion of an inlet opening at an inner side and parallel to the rotary shaft of the impeller, having a radius of 80% of a distance from the upper end portion of the inlet opening to a surface of the lower shroud below the upper end portion, and being tangent to the surface of the lower shroud or passing an end edge portion of the lower shroud.

Abstract: An enclosure with hybrid thermal management for a heat-generating electronic device comprises a passive heat sink for conducting heat away from the electronic device, a cold skin adapted to slide over the top of the passive heat sink and having a front wall forming a plurality of air intake ports, and a plurality of blowers mounted inside the cold skin for drawing air into the cold skin though the air intake ports and then directing the air through the passive heat sink. In one implementation, the passive heat exchanger includes multiple thermally conductive fins adjacent to the electronic device and extending rearwardly from the intake ports, the fins being spaced apart from each other for conducting heat away from the electronic device. The blowers preferably direct air rearwardly from the intake ports in the front wall into the spaces between the thermally conductive fins.

Abstract: A semiconductor module arrangement is provided having a first subassembly, a second subassembly and a third subassembly. The third subassembly has a quantity of adjustment pins which are fixedly connected to one another. The first subassembly has a number N1 of first adjustment openings, and the second subassembly has a number N2 of second adjustment openings. Each of the adjustment pins engages into a different one of the first adjustment openings and/or into one of the second adjustment openings. A corresponding method of producing the semiconductor module arrangement is also provided.

Abstract: A circuit board system according to the invention comprises a circuit board (101), at least one element (102) mechanically supported with respect to the circuit board, and a spring-fastener (106) arranged to mechanically support the at least one element with respect to the circuit board. The spring-fastener comprises a pressing portion (107) pressing the at least one element and a latching portion (108) extending from an end of the pressing portion and being shape-locked in one or more apertures (109-110) of the circuit board. The latching portion and the one or more apertures of the circuit board are shaped to provide shape-locking whose opening requires at least a first movement of the latching portion in a first direction against the spring-force of the spring fastener and, subsequently, a second movement of the latching portion in a second direction against the spring-force of the spring fastener.

Abstract: The disclosed technology provides systems and methods for an enclosure system with optimized internal dynamically controllable airflow distribution. The systems include a computing system enclosure, comprising a plurality of baffles or airflow redirection modules, and a controller configured to control an orientation of one or more of the plurality of baffles or airflow redirection modules for redirection of airflow distribution within the computing system enclosure based on a determined computing system enclosure profile. In another implementation, a method includes monitoring airflow distribution within a computing system enclosure with a plurality of sensors, and controlling an orientation of one or more baffles or airflow redirection modules in the computing system based on results of the monitoring operation for redirection of airflow distribution.

Abstract: A module can be configured to mate with a receptacle. The module includes a body with a thermal surface that is coupled to thermally active circuitry supported by the body. The receptacle is configured to allow air to flow over the thermal surface so as to dissipate thermal energy from the circuitry.

Abstract: Heat dissipaters 120a, 120b are thermally coupled to a memory 220 and a CPU 230 (heat generating components) disposed on a top surface (a first surface) of a substrate 210. A frame 130 is thermally conductive and is attached above the top surface of the substrate 210. Openings 131 are formed in locations corresponding to locations in the frame 130 where the heat dissipaters 120a, 120b are provided. Elastic rubber elements 150 are thermally conductive and flexible, and thermally couple the heat dissipaters 120a, 120b to the frame 130. This configuration is capable of dissipating heat generated by the heat generating components even when the heat generating components generate amounts of heat that exceed the heat dissipation ability of the heat dissipaters thermally coupled to the heat generating components.

Abstract: A system to aid in cooling an in-line memory module may include a heat spreader including a channel to accommodate the in-line memory module, thermal interface material, and a liquid-cooler block including a heat-conducting cold plate and an internal liquid channel filled with circulating cooling liquid. Also disclosed are systems employing tubes to convey cooling fluid.

Abstract: An image forming apparatus comprises a sensor, a base, a clamping section and a limiting section. The sensor includes a hook having a claw section. The sensor is held on the base. The clamping section and the limiting section are arranged on the base. The claw section is clamped with the clamping section. The limiting section is elastically deformable when the sensor is mounted on the base. When the claw section is clamped with the clamping section, the limiting section faces the hook from the opposite side of the clamping section so as to limit the position of the hook.

Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body having multiple main body connection sections and multiple radiating fins each having a connection section. The main body has a first end and a second end. The first and second ends define a longitudinal direction. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the connection sections of the radiating fins placed in the mold are high-speed thrust into the main body connection sections and moved in the longitudinal direction to the second end of the main body to tightly integrally connect with the main body.

Abstract: A portable furniture power outlet includes a power module having one or more AC receptacles and DC connector ports. A transformer supplies DC power to the DC connector ports at different voltages and provides wireless device charging. An elongated fin member extends downward from the power module and includes a shape and size for being positioned between two cushions in either a vertical or horizontal orientation. The fin member is secured to the power module by a two axis hinge that allows the power module to spin and pivot with respect to the fin member.

Abstract: A clip for fixing a heat sink on a retaining bracket includes an elastic supporter, an operating member, a movable fastener and a fixing bar. Two ends of the elastic supporter have a connecting portion and a first buckle portion, respectively. The operating member has a resisting portion, a pivot portion and an operating bar. The pivot portion pivots to the connecting portion. The movable fastener installs on the resisting portion and the connecting portion, and includes two sliding slots, a resisting surface and a second buckle portion. The resisting portion has an arc surface for resisting against the resisting surface. The distance between the apex of the arc surface and the pivot portion is the largest distance between the arc surface and the pivot portion. When the clip is locked, the junction of the resisting portion and the resisting surface excludes the apex of the arc surface.

Abstract: In one embodiment an ionic airflow system comprises an anode, a cathode platform having an elongated surface, and a first ultrasonic transducer to direct ultrasonic waves into the cathode platform. Other embodiments may be described.

Abstract: A structure for cooling a semiconductor element includes an element body and a lead terminal extending from one surface of the element body in a direction intersecting the one surface. The semiconductor element cooling structure includes a heat sink. The heat sink includes a contact surface that is in contact with the one surface of the element body, a through-hole which is formed in the contact surface and through which the lead terminal passes, and a space portion that communicates with the through-hole and that is configured to house a substrate connected to the lead terminal.

Abstract: Enclosure assembly includes a clipping member for being secured to an electronic device and an air guiding duct coupled to the clipping member. The clipping member includes a coupling panel. The air guiding duct is used to engage with a fan of the electronic device and includes a securing panel extending from the coupling panel and an air guiding panel extending from the securing panel. The air guiding panel includes a first air guiding portion and a second air guiding portion obliquely extending from the first air guiding portion.

Abstract: Electronics cooling assemblies are provided which include an air-cooled heat sink, an auxiliary air-moving device, and an airflow-blocking mechanism. The heat sink couples to one or more heat-generating electronic components, and dissipates heat from the electronic component(s) to a cooling airflow passing across the heat sink. The auxiliary air-moving device provides, when active, an increased flow rate of the cooling airflow across the heat sink. The airflow-blocking mechanism toggles between a passive airflow position and an active airflow position. In the passive airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the heat sink without passing through the air-moving device, and in the active airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the auxiliary air-moving device.

Abstract: A receptacle connector defines a port. The port is provided with spring fingers that are configured to engage a mating module. The spring fingers are thermally coupled to a heat transfer plate that can be configured to provide part of a cage that defines the port. Fins can be mounted on or integrated into the heat transfer plate. In operation, thermal energy from an inserted module is transferred from the module to spring fingers and then to the heat transfer plate and then to a thermal dissipation system.

Abstract: Methods, systems, and apparatus, including a housing defining a top surface, a bottom surface, and first and second side surfaces. Also included is a first rail extending from the first side surface and a second rail extending from the second surface such that when the first and second rails are slidably engaged with a third surface. A blower device is included that is axially disposed between the top and bottom surface, wherein a first end of the housing defines a first plenum outlet, the top surface defines a plenum inlet, the bottom surface defines a second plenum outlet that is positioned on a second side of the blower device and that fluidly couples the first plenum chamber to the second plenum chamber. Further, the second plenum chamber is formed by the first and second rails, the bottom surface and the third surface has a third plenum outlet.

Abstract: The disclosure provides a fluid-cooled heat sink having a heat transfer base, a shroud, and a plurality of heat transfer fins in thermal communication with the heat transfer base and the shroud, where the heat transfer base, heat transfer fins, and the shroud form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.

Abstract: An electronic device includes a circuit board having heat generating components thereon. A heat sink with air current generating electric device assembly lies over the circuit board, through which heat from the circuit board and the components thereon is dispersed. The assembly includes a heat sink having a solid central core and a plurality of fins protruding from the core. An air current generating electric device is disposed over the heat sink and having an air intake facing a top of the heat sink and an exhaust opening directed parallel to a plane of the circuit board. An air duct extends from the exhaust opening of the air current generating electric device to exhaust apertures on at least one side wall of the electronic device.

Abstract: First and the second heat dissipation sections 120a and 120b are thermally coupled with a memory 220 and a CPU 230 mounted on a surface of a substrate 210, respectively. A frame 130 is arranged above the surface of the substrate. First and second openings 131a and 131b are formed at the positions corresponding to the positions at which the first and second heat dissipation sections 120a are provided in the frame 130. First and second elastic rubbers 150a and 150b (first and second connecting sections) are provided at periphery of the first and second openings. The first and second elastic rubbers connect the first and second heat dissipation sections and the frame, respectively. With this configuration, each of a plurality of heat-generating components is thermally coupled with each of a plurality of heat dissipation sections stably, even when the plurality of heat-generating components have different heights.

Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.

Abstract: A solar energy receiver can include a heat sink configured to cool or otherwise dissipate heat. The heat sink can include a plurality of fin members, each having bases that are generally aligned with each other. The bases of the fin members can be connected to one another with connection devices that are spaced away from the bases, so as to improve thermal conductivity performance characteristics.

Abstract: An electric compressor includes a motor, a scroll compression mechanism, a housing, a circuit unit, a circuit housing housing the circuit unit and integrated with the housing. The electric compressor includes a heat sink provided on a circuit unit side of a partition wall so as to project to be brought into contact with a semiconductor element of a power substrate, facing the partition wall that erects along a vertical direction to separate the inside of the housing from the circuit housing. The heat sink has a lower surface and an upper surface formed into a cylindrical shape so that width of an upper end portion and a lower end portion of the heat sink gradually decreases to reach a tip portion.

Abstract: The present invention relates to a device for thermal cycling of biological samples, a heat sink used in such a device and a method. The heat sink comprises a base plate designed to fit in a good thermal contact against a generally planar thermoelectric element included in the device, and a plurality of heat transfer elements projecting away from the base plate. According to the invention, the heat transfer elements of the heat sink and arranged in a non-parallel configuration with respect to each other for keeping the temperature of the base plate of the heat sink spatially uniform during thermal cycling.

Abstract: An electronic control unit mounted in an object includes: a rewritable memory of control and reprogramming software; a not-always-on power supply system micro-computer operating in control and reprogramming modes and connected/disconnected with a power source; and an always-on power supply system micro-computer operating in the control and reprogramming modes and constantly connected with the power source. Each micro-computer includes: a first mode determination device determining whether to operate in an on-board mode when the power source starts to supply the electric power; and a second mode determination device determining whether to operate in the reprogramming mode. The always-on power supply system micro-computer includes a first transition device that detects a change in a power supply state of the not-always-on power supply system micro-computer.

Abstract: Heat dissipation component includes a fan unit, a first housing, and an airflow-guiding plate. The fan unit includes a fan blade portion, and a fan housing including a first air-guided cap and a second air-guided cap. The second air-guided cap, having a fan inlet, is disposed on the first air-guided cap. The fan blade portion is disposed between the first air-guided cap and the second air-guided cap, and pivotally-connected to the fan housing at the second air-guided cap. The first housing is disposed on a side of the second air-guided cap away from the first air-guided cap. An inlet airway is formed between the first housing and the fan unit. The airflow-guiding plate is disposed between the first housing and the second air-guided cap, and extended from outline of the main fan inlet toward outline of the inlet airway and away from the main fan inlet.

Abstract: A heat dissipating system including a casing body, a heat source and a piezoelectric fan is provided. The casing body includes an upper casing and a bottom case, wherein at least one of the upper casing and the bottom casing includes at least one air inlet. The heat source and the piezoelectric fan are both disposed in the casing body. The piezoelectric fan has an opening facing the heat source while the air inlet is adjacent to the opening. Air is adsorbed into the opening through the air inlet and is exhausted out towards a direction of the heat source by the piezoelectric fan.

Abstract: An electronic component mounting structure, manufacturing method and an electronic component product are provided. The electronic component mounting structure comprises a printed circuit board, a metal flange, and a plurality of electronic components provided on the metal flange; a groove is provided on the printed circuit board, a metal layer is coated on a wall of the groove, the metal flange is restricted to the metal layer on the wall and is fixed in the groove, the one or more electronic components are connected to each other through a plurality of wires based on a circuit requirement, an input electrode and an output electrode are provided on the printed circuit board in a portion adjacent to the metal flange, and the input electrode and the output electrode are connected to the one or more electronic components mounted on the metal flange through wires respectively.