Abstract: An electronic device comprises a detecting unit and a processing unit, comprising. The method of adjusting execution state of electronic device comprises: a current environmental condition is detected through the detecting unit to generate a current environmental signal and the current environmental signal is transmitted to the processing unit. A current execution state of the electronic device is read through the processing unit. A step of comparing with a state look-up table of the electronic device is performed to allow the current environmental signal to correspond to a predetermined environmental condition in the state look-up table of the electronic device. It determines whether the current execution state of the electronic device conforms to a predetermined execution state of the predetermined environmental condition. If not, the current execution state of the electronic device is adjusted to allow the current execution state to be the same with the predetermined execution state.

Abstract: A heat dissipating fan includes a housing having a base and a sidewall coupled to the base. The sidewall defines a compartment. The housing further includes an air inlet, an air outlet, and a dust channel. The air inlet, the air outlet, and the dust channel are in communication with the compartment. A stator is coupled to the base of the housing. An impeller is rotatably coupled to the stator. A control element includes a driving circuit electrically connected to the stator and a rotating direction control circuit electrically connected to the driving circuit. In another embodiment, the heat dissipating fan includes a housing having a base and a lateral wall coupled to the base. The lateral wall defines a compartment. The lateral wall includes an air inlet and an air outlet both in communication with the compartment. The air inlet also acts as a dust channel.

Abstract: Arrangement of a portable display System for radiation detection, includes an adaptation board (3) with minicomputer (4) including a processor (43), while the adaptation board (3) is connected via the earth connector (31) and signal connector (33) with at least one radiation detector (1) arranged on the stack board (2) and connected via signal connector (33) by pins to the interconnection (5), while the adaptation board (3) itself is connected with the mini computer (4) by pins of the interconnection (5).

Abstract: A system for storing data includes a rack, one or more data storage modules coupled to the rack, and one or more data control modules coupled to the rack. The data storage modules may include a chassis, two or more backplanes coupled to the chassis, and one or more mass storage devices (for example, hard disk drives) coupled to the backplanes. The data control modules may access the mass storage devices in the data storage modules.

Abstract: An electrical connector assembly is disclosed having a connector housing and a radiator securing member. The connector housing has at least one first protrusion formed with a locking tab receiving recess on a first stopping surface thereof. The radiator securing member has at least one first fastener engaged with the locking tab receiving recess of the first protrusion to connect the connector housing with the radiator securing member.

Abstract: An apparatus to cool a computing device is provided and includes a structure. The structure includes a coolant moving device and a heat generating component. The structure is formed such that the coolant moving device is configured to generate a first flow of coolant into a plenum in a first direction and a second flow of coolant from the plenum in a second direction, which is transverse to the first direction, such that the coolant thermally interacts with the heat generating component. The structure further includes a plate interposed between the plenum and the heat generating component. The plate includes aerodynamic elements disposed to extend into the plenum.

Abstract: A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermally conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.

Abstract: Manufacturing a product, wherein the product includes a first part and a second part, wherein the first part includes solder pins and the second part includes solder pads, wherein each of the solder pins has the matching solder pad, wherein each of the solder pads is covered by a matching solder paste bead. Aligning the solder pins against the solder pads in a way that each pair of the solder pin and the matching solder pad is thermally and electrically connected by the matching solder paste bead. Connecting a mating connector to the first part, wherein the mating connector is operable for providing a part of an electrical conducting path. Heating at least one of the solder paste beads by an electrical resistive heating, wherein the electrical resistive heating is generated by an electrical current flowing through the electrical conducting path.

Abstract: An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.

Abstract: A semiconductor structure includes a heat sink. The heat sink having a first major surface, a second major surface, a first sidewall surface, and a through-opening extending from one of the first sidewall surface or the first major surface of the heat sink to the second surface of the heat sink, and wherein the through-opening has an inflow region, a restrictive region, and an outflow region. The restrictive region is located between the inflow region and the outflow region, wherein the inflow region has an inflow surface opening at the one of the first sidewall or the first major surface, and the outflow region has an outflow surface opening at the second major surface. A cross-sectional area of the restrictive region is less than an area of the inflow surface opening and less than an area of the outflow surface opening.

Abstract: An adjustable heat sink which allows factory, service, or customers to adjust the width of the heat sink to take advantage of some or all available unpopulated DIMM space to optimize cooling and performance. Such an adjustable heat sink addresses many of the limitations of other heat sinks and is advantageous for reducing part numbers within a platform and across platforms. Such an adjustable heat sink also simplifies field upgrades when either adding or removing populated DIMMs to an information handling system thus enhancing performance without a need to change CPU Heat sinks.

Abstract: Provided is a method of mounting a chip. The method includes: forming a bump at one surface of a cavity formed concavely in an inner direction of a substrate; performing a coining process to flatten a surface of the bump; coating a solder material on the bump subjected to the coining process; and bonding a chip and the bump by melting the solder material, wherein an electrode portion or a metal portion is formed on a bottom of the chip. For a metal substrate according to the present invention, wherein a vertical insulating layer is included, since the electrode portion of the chip and the electrode portion of the substrate have to be electrically connected, the metal substrate is bonded to the electrode portion of the chip using the bump additionally formed on the metal substrate, so the heat generated in the chip can be rapidly transferred to the substrate, and the junction temperature of the chip can be decreased, thereby enhancing the light efficiency and the.

Abstract: According to one embodiment of the present invention, a system is provided having a foundation that is modular in design. Each module has transport structures. Floor sections can be provided. A bearing plate can be provided on top of isolators supported on a foundation. A skeleton can also be constructed, which can support a heat exchanger assembly, which includes a plenum, a heat exchanger and air movers. A ducting assembly with boxes is supported by the skeleton. An equipment rack, such as a server rack, can be supported on the bearing plate. Any number of systems can be attached end to end, back to back, and/or vertically to form a system of a desired dimension. The entire system, once assembled and wired, can easily be moved with a transport assembly. The system can also be expanded in size and capacity as the operational needs increase.

Abstract: A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path.

Abstract: An interconnect assembly includes a housing, multiple signal connectors provided on the housing, a power bus having one or more bus elements, and a combination connector. The multiple signal connectors include a first signal connector and a second signal connector, and each signal connector includes a plurality of signal elements. The combination connector is provided on the housing and includes a plurality of connection elements, including a first set of connection elements which route within the housing to the plurality of signal elements of the first signal connector, a second set of connection elements which route within the housing to the plurality of signal elements of the second signal connector, and a third set of connection elements which route within the housing to the one or more bus elements of the power bus.

Abstract: A carrier for a display module, in particular for an LED display module, having an arrangement for accommodating and/or fastening a display module, and having an air inlet opening and at least one air outlet opening, connected to one another by air ducts through which cooling air can flow to cool the display module, the carrier having a central air inlet opening that is connected via air ducts to at least two air outlet openings situated at different locations of the carrier, and the air ducts being fashioned between ribs provided on the carrier. Also described is a display device having such a carrier, and a display module carried thereby.

Abstract: An inkjet printer records an image on a recording medium by ejecting ink onto the recording medium from a recording head mounted on a carriage. A housing suction fan is arranged on a rear surface of the housing for sucking a gas from an outside into an inside of the housing. A carriage suction fan is arranged on the rear surface of the housing opposite to the housing suction fan for sucking into the carriage the gas sucked by the housing suction fan. A rear surface exhaust fan and a side surface exhaust fan are arranged on the rear surface and a side surface, respectively, of the housing for exhausting the gas inside the housing to the outside. The gas sucked by the housing suction fan is sucked into the carriage by the carriage suction fan and flows into the housing without being sucked by the carriage suction fan.

Abstract: The present invention provides a banknote processing device that, even when banknotes are being processed based on commands from plural users, the banknotes that each user is responsible for handling may be easily identified. Namely, banknote processing device according to the present invention is connected with plural operation devices respectively operated by plural users and processes banknotes based on commands from the users inputted via the operation devices. The banknote processing device includes a conveyance section that conveys the banknotes and plural banknote storage sections that store the banknotes conveyed by the conveyance section. The plural banknote storage sections include: a first dedicated storage section that stores only banknotes processed based on commands from a first user among the plural users; and a second dedicated storage section that stores only banknotes processed based on commands from a second user among the plural users.

Abstract: The invention relates to a heating device for installation in a switchgear cabinet, having a support and a heating body, wherein the support replaceably accommodates the heating body in a holder. Simple and secure mounting of the heating body on the support is achieved in that the holder has a contact surface to which limiting elements are attached, in that the limiting elements immobilize the heating body in a form-fitting manner transversely to the contact surface plane, and in that one or a plurality of locking elements are provided in the region of the holder, which immobilize the heating body in a form-fitting manner perpendicularly to the contact surface.

Abstract: A method for forming a wafer level heat spreader includes providing a mesh wafer, the mesh wafer having a plurality of openings and mesh regions between the openings, bonding the mesh wafer to a backside of an integrated circuit (IC) wafer, the IC wafer comprising a plurality of circuits; and electroplating a heat sink material through the plurality of openings and onto to the backside of the IC wafer.

Abstract: In one embodiment an ionic airflow system comprises an anode, a cathode platform having an elongated surface, and a first ultrasonic transducer to direct ultrasonic waves into the cathode platform. Other embodiments may be described.

Abstract: An encasement for coating a bone plate with a substrate includes a sidewall structure having an upper edge and a cover disposed on the upper edge of the sidewall structure. The encasement includes a base from which the sidewall structure rises such that the sidewall structure, the cover and the base combine to create an open interior space of the encasement. An aperture in the sidewall structure provides access to the open interior space of the encasement and a plurality of cover protrusions extend from the cover into the open interior space. The encasement further includes a plurality of base protrusions extending from the base directly opposing the plurality of cover protrusions. A combined height of an individual cover protrusion and an opposing base protrusion is less than or equal to a height of the sidewall structure.

Abstract: A heat sink assembly and a method of utilizing a heat sink assembly where the heat sink assembly is configured to dissipate air from the bottom of the heat sink assembly to the top of the heat sink assembly utilizing a plurality of vents to cool a desired electrical component.

Abstract: A communication module-cooling structure includes a main body section to be cooled by a cooling mechanism, and a heat sink including a cooling receiving section including partition walls and slit-shaped receiving spaces defined by the partition walls. The receiving spaces of the cooling receiving section receive communication modules, and each of the communication modules includes a substrate mounted with a communication circuit component thereon and first and second sidewalls which sandwich the substrate therebetween in a thickness direction of the substrate. At least one of the first and second sidewalls of each of the communication modules is in surface contact with an inner surface of each of the receiving spaces.

Abstract: An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.

Abstract: A heatsink includes a rigid plate and a plurality of pin fins. The plate has a two dimensional array of holes through the rigid plate from a first face to a second face. Each pin fin is received in one of the holes and has a proximal end extending beyond the first face of the plate for conductively receiving heat, a distal end extending beyond the second face of the plate for convective heat exchange with air, a biasing member biasing the pin fin in a proximal direction, and a shoulder limiting the proximal extension of the pin fin through the hole. An apparatus may include the pin fin heatsink secured to a printed circuit board having at least two components that have different heights. Accordingly, each component is contacted by the proximal end of one or more self-adjusting pin fins that are aligned with the component.

Abstract: A heat dissipation device for a heat-generating component includes at least one helically-shaped air tube having a length. The at least one air tube is thermally coupled to the heat-generating component to dissipate heat from the heat-generating component. Other embodiments of the heat dissipation device and methods for dissipating heat from a heat-generating component are further disclosed.

Abstract: A power supply having detachable fan includes a power supply main body and a fan module. The power supply main body includes a shell. Walls of the shell define at least one compartment, and the walls have at least one fastening portion. The fan module includes a case, a fan and a handle. The case has an outlet and an inlet. The case is movably disposed in the compartment, and the inlet faces an interior of the shell. The fan is disposed in between the outlet and the inlet. The handle is pivotally connected to two sides of the outlet of the case, and two ends of the handle respectively have a mating portion. The mating portion and the fastening portion of the immediately adjacent wall of the shell are engaged.

Abstract: According to one embodiment, an electronic apparatus includes a first housing and a second housing. The first housing includes a first wall, a second wall opposite to the first wall, and a third wall between the first wall and the second wall. The third wall faces the second housing when the second housing is raised from the first housing. The third wall includes an outmost portion of the third wall in a direction from a fan toward the third wall, a first area obliquely extending between the outmost portion and the first wall and including a first opening, and the second area obliquely extending between the outmost portion and the second wall and including a second opening.

Abstract: A hard disk drive with a multiple disk stack normally utilizes disk separator plates near the disk surfaces to reduce wind induced vibrations in the disks and the read/write heads. The manufacturing methods currently used to make these separator plates, metal casting and machining, or injection molded plastic, or extruding and machining, or cold forging tends to be expensive and creates unwanted weight and bulk without the desired precision. Stamping disk separator plates from metal provides exceptional dimensional control at reduced cost, but cannot readily provide the thicknesses required. Stamping and extruding the offsets, or stamping and folding the offsets, is a manufacturing process that provides the required dimensions for the offsets, and dimensional control and reduced cost.

Abstract: According to one embodiment, electronic device includes first board, second board, first component, and second component. The first board includes first and second faces and to which opening and cutout portion is provided. The opening penetrates through the first board. The cutout portion extends to side separating from center of the opening at edge of the opening. The second board includes third and fourth faces. The second board overlaps the first board and is electrically connected to the first board in state in which the fourth face and the first face face each other. The second board covers the opening. The first electronic component is provided to the third face, and electrically connected to the second board. The second component is provided to the fourth face and electrically connected to the second board in state in which at least portion of the second component is held in the opening.

Abstract: According to one embodiment, an electronic apparatus includes a heating component, a housing, and a heat pipe. The housing accommodates the heating component and includes a wall. The wall includes a first region configured to receive heat from the component and a second region configured to have a lower temperature than a temperature of the first region. At least a portion of the heat pipe is buried in the wall from the first region to the second region.

Abstract: Example embodiments of the present invention provide a method of manufacture and an apparatus for optimized server design using dense DIMM spacing, wide heatsink, improved routing channels, and improved air delivery to rear devices. The method of manufacture comprise providing a plurality of compliant pin memory sockets on a first side of a circuit board at a pitch less than that specified in a reference layout requiring solder tail memory sockets and providing a plurality of surface mount capacitors on the second side of the circuit board enabling at least one pair of the plurality of compliant pin memory sockets to be provided at the pitch less than that specified in the reference layout.

Abstract: A server and a heat dissipating assembly thereof includes an airflow generating device, a central processing unit, several memory slots, a first cooling fin set, a second cooling fin set and a heat conductive member. The airflow generating device generates an airflow flowing along an airflow direction and is located at a front side of the central processing unit. The several memory slots are used to plug of memories, and they are located at a lateral side of a central processing unit. The first cooling fin set is correspondingly located over the central processing unit and at a lateral side of the memory slots. The second cooling fin set is located at a front side of the memory slots and between the airflow generating device and the memory slots. The first cooling fin set is thermally connected with the second cooling fin set via the heat conductive member.

Abstract: A servo amplifier includes a housing, a heat source arranged in the housing, and a heat dissipating structure including a heat sink arranged in the housing and thermally connected to the heat source. The heat sink has heat dissipating fins extending from at least a portion of a surface of the heat sink, other than a connecting face thermally connected to the heat source. The at least a portion of the surface of the heat sink, other than the connecting face, is thermally connected to a surface of the housing.

Abstract: An electronic component casing includes: an inclined portion that projects from an upper surface so as to increase in height gradually from one side; a step portion that descends as a continuation of an upper end of the inclined portion or descends via a plane connected to the upper end; and a planar portion connected to a lower end of the step portion.

Abstract: An example embodiment includes a retention spring. The retention spring includes a central portion, a coupling feature, and a spring arm. The central portion includes a heat sink contact surface configured to contact a detachable heat sink. The coupling feature is configured to mechanically couple the retention spring to an optical component. The spring arm connects the central portion to the coupling feature. The spring arm is configured to elastically deform to allow insertion of the detachable heat sink between the heat sink contact surface and a heat dissipation surface of the optical component and to at least partially retain the detachable heat sink against the heat dissipation surface.

Abstract: Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.

Abstract: Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first side of the circuit component a, a back plate having an initial curvature and positioned at a second side of the circuit component opposite to the heat sink, and one or more screws through the back plate and the circuit component and partially through the heat sink. A method further includes placing and flattening a curved back plate on a second side of a circuit board opposite to the first side, and fastening the back plate, the circuit board, and the heat sink together by inserting a plurality of screws through the back plate, the circuit board, and a partial depth on a single side of the heat sink.

Abstract: An air cooled motor controller includes a substrate and at least one inductor assembly arranged on the substrate. The at least one inductor assembly includes a outer cylindrical housing, a wound inductor core arranged within the outer cylindrical housing, and a inner cylindrical housing arranged within the wound inductor core, wherein the inner cylindrical housing defines an inner cylindrical cavity configured to transmit air, and wherein the outer cylindrical housing and the inner cylindrical housing define at least one cylindrical gap in fluid communication with the inner cylindrical cavity and configured to transmit air. The motor controller also includes at least one air source in fluid communication with the at least one cylindrical gap.

Abstract: A heat dissipation structure is provided and includes a plurality of heat conduction bases and at least one flexible fin. Each of the heat conduction bases includes a first surface and a second surface. A positioning groove is formed in the first surface of each of the heat conduction bases, and the second surface of each of the heat conduction bases is assembled to a backlight surface of a solar module. The fin is coupled to the positioning grooves and connected between the heat conduction bases.

Abstract: A system for managing heat generated by electronic equipment in an electronic equipment enclosure is provided. The system includes a duct adapted to receive a first portion of the electronic equipment. The first portion of the electronic equipment includes an air intake opening. The duct forms a barrier between the first portion of the electronic equipment and a second portion of the electronic equipment. The second portion of the electronic equipment includes an air exhaust opening. The barrier separates cooled air entering the air intake opening and heated air exiting the air exhaust opening.

Abstract: It is an object of the present invention to provide a probe card capable of controlling generation of a scratch or an indentation in a connection pad and capable of controlling generation of heat in a connection pad and its vicinity having contacted a contact probe at low cost and in a simple way. A probe card includes a probe substrate, at least one contact probe electrically connected to a signal line provided to an insulating base of the probe substrate and fixed to the insulating base, and at least one engagement member installed on the contact probe at a position near a tip end portion of the contact probe. The engagement member has at least one engagement portion that makes abutting contact with another predetermined member during operation to restrain the operation of the contact probe.

Abstract: A test socket for connecting a device under test (DUT) electrically to a high-frequency power source comprises a plurality of pogo pins each having an electrode, an electron-to-heat conversion plate supporting bottoms of the pogo pins, the electron-to-heat conversion plate configured to convert kinetic energy of free electrons emitted from the pogo pins to thermal energy, and a heat sink wall formed on the electron-to-heat conversion plate, the heat sink wall having a predetermined height and isolating the plurality of pogo pins from one another.

Abstract: An exemplary method for manufacturing a heat sink includes steps: providing a base with a plurality of spaced protrusions formed thereon; providing a plurality of fins and bending a distal end of each fin to form a connecting end; fitting each fin between two adjacent protrusions correspondingly and attaching the connecting end of each fin to the base; and deforming each protrusion to press the connecting ends of two adjacent fins.

Abstract: An electrical contactor assembly is provided including an electrical contactor, an electrical bus bar, and a panel formed from an electrically insulating material. At least one post protrudes through the panel and is in contact with the electrical bus bar. The at least one post is constructed from an electrically and thermally conductive material. A first end of the at least one post is configured to electrically and thermally connect to the electrical contactor. A heat sink is removably coupled to a second end of the at least one post. The heat sink includes a body having a plurality of fins extending radially outward. A first portion of the plurality of fins extends around a circumference of the body. A second portion of the plurality of fins extends around only a portion of the circumference of the body.

Abstract: A system and method for cooling heat-producing devices using synthetic jet embedded heat sinks is disclosed. The cooling system includes a heat sink comprising a base portion and a plurality of fins disposed on the base portion and extending vertically out therefrom, the plurality of fins spaced to define a channel between adjacent fins. The cooling system also includes at least one synthetic jet actuator attached to the heat sink, with each of the at least one synthetic jet actuators comprising a plurality of orifices therein and being configured to generate and project a series of fluid vortices out from the plurality of orifices and toward at least a portion of the channels of the heat sink.

Abstract: A radiator including: a plurality of radiation fins; and a radiation fin support base having a heater element mounted to one surface thereof and a plurality of parallel fin grooves to which the radiation fins are installed and a projection configured to fix the radiation fin formed to the other surface thereof, wherein a top of the projection pushes one side surface of the radiation fin to push the other side surface of the radiation fin toward a side surface of the fin groove, and wherein the fin groove and the projection are each divided in a plurality of pieces in a longitudinal direction of the fin groove, and each of the divided fin grooves and each of the divided projections have a same length in the longitudinal direction of the fin groove and are paired with each other.

Abstract: In a centrifugal fan, a casing includes: a top plate; a motor base configured to serve as a bottom plate; and a plurality of support members provided between the top plate and the motor base, wherein an opening functioning as an air outlet opening is formed at each side of the casing so as to be surrounded by adjacent support members, the top plate and the motor base, and an impeller, which is housed between the top plate and the motor base of the casing, includes: an annular shroud; and a plurality of blades arranged in the circumferential direction and provided under the shroud, wherein at least one part of each blade opposes directly the motor base of the casing, and wherein the motor base opposes the lower parts of the blades in the direction of a rotary shaft of the impeller with a predetermined air gap provided therebetween.

Abstract: A heat dissipation device assembly structure includes a heat dissipation unit and at least one fastening member. The heat dissipation unit has a bottom face and a locating section. The locating section is formed with at least one channel in communication with the bottom face. The fastening member is assembled on the bottom face. The fastening member has at least one latch section correspondingly inserted in the locating section. The fastening member further has at least one locking section on one side of the fastening member, which side is distal from the bottom face. The fastening member can be quickly assembled with the heat dissipation unit by means of inserting the latch section into the locating section of the heat dissipation unit. The heat dissipation device assembly structure has higher heat dissipation efficiency and is free from welding process so that the welding cost is saved.