Abstract: An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one protruding element including a connection portion partly extending in contact with the free surface and partly protruding beyond a boundary of the free surface (the connection portion having a free end being distal from the insulating body), and a mounting portion extending from the free end at least up to a plane of the mounting surface. The heatsink is further electrically connected to a terminal of the integrated circuit chip. The protruding element is placed in correspondence of the at least one pin.

Abstract: A computing device includes a chassis having a width that is equal to or less than half of the width of a standard slot of a rack. A circuit board assembly with at least one processor is coupled to the chassis in a primarily horizontal orientation. One or more rows of mass storage devices (such as hard disk drives) are coupled to the chassis. At least one of the rows of mass storage devices includes a stack of mass storage devices.

Abstract: A plenum for guiding a flow of cooling air through the interior of a computer is designed to maximize the airflow over those electrical components within the computer which are most sensitive to temperature, and/or which require the greatest amount of cooling. The plenum is designed to be mounted over top of a computer motherboard which includes a plurality of electrical components mounted thereon. One or more apertures are formed in the lower wall of the plenum so that electrical components mounted on the computer motherboard can protrude through the apertures and into the interior of the plenum. The lower surface of the plenum is designed to prevent the flow of cooling air passing through the plenum from escaping through the apertures on the lower wall. Also, upper and lower protrusions on the plenum can extend into the interior of the plenum to concentrate the flow of cooling air onto the electrical components which are protruding through the apertures and into plenum.

Abstract: A safety anchor includes a coiled spring (5) and a stud (1) extending substantially centrally within the spring. The stud (1) is formed with a portion (3) of reduced strength. Means (7, 9) is provided for securing ends of the spring (5) to the stud (1) at each side of the portion (3) of reduced strength.

Abstract: A heat exchanger system having a container having an inner chamber containing the media from which heat is to be pulled, and further having an outer surface to which is attached corrugated columns of thermally conducting material, cooling fluid conduits through the corrugated columns supplied with cooling water, at least the outer surface of the container and the corrugated columns is composed of metal and the outer surface of the container is separated from the inner surface by insulator material. It also contains a temperature monitor and controller for controlling the cooling system based upon the environment temperature to save energy.

Abstract: Disclosed is a radiant heat plate and a battery cell module having the same. The radiant heat plate is interposed between battery cells. The radiant heat plate includes a high-thermal conductivity plate with excellent thermal conductivity and a composite sheet fixedly laminated on both surfaces of the high-thermal conductivity plate. Here, the composite sheet is formed of a thermoplastic elastomer composite filled with a high-thermal conductivity filler.

Abstract: A power module is disclosed that includes a semiconductor element, a first cooling member and a second cooling member configured to sandwich the semiconductor element therebetween, a frame member configured to support the semiconductor element between the first cooling member and the second cooling member and molded resin disposed between the first cooling member and the second cooling member, wherein the frame member includes an adjusting member which adjusts a distance between the first cooling member and the second cooling member.

Abstract: The cooling device comprises a base with a recessed part in a first surface, a plurality of heat radiating fins standing erect on a second surface on the reverse side of the first surface, and a flat, plate-like thermal diffusion part housed inside the recessed part. The upper surface of the thermal diffusion part makes thermal contact with the upper surface of the recessed part, the side surface of the thermal diffusion part makes thermal contact with the side surface of the recessed part, and the thermal diffusion part diffuses in the planar and orthogonal directions heat from the heat generating element arranged on the bottom surface of the thermal diffusion part by vaporizing and condensing coolant sealed inside.

Abstract: A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a silicon-based base portion having a first primary surface and a silicon-based support structure. The silicon-based support structure includes a mounting end and a distal end opposite the mounting end with the mounting end received by the base portion such that the support structure extends from the first primary surface of the base portion. The support structure includes a recess defined therein to receive the edge-emitting laser diode. The support structure further includes a slit connecting the distal end and the recess to expose at least a portion of a light-emitting edge of the edge-emitting laser diode when the edge-emitting laser diode is received in the support structure.

Abstract: A semiconductor substrate for use in an integrated circuit, the semiconductor substrate including a channel defined on a surface of the substrate. The channel includes a first wall, a second wall, and a third wall. The first wall is recessed from the surface. The second wall extends from the surface to the first wall. The third wall extends from the surface to the first wall and faces the second wall across the channel. At least one of the second wall and the third wall includes a plurality of structures projecting into the channel from the second wall or the third wall.

Abstract: Disclosed herein are various systems and methods relating to communication devices that include modular transceivers, such as small form pluggable transceivers. According to one embodiment, a communication device may include a chassis defining an interior and an exterior of the communication device. The chassis includes a top, a bottom, and a plurality of sides that together with the top and the bottom form an enclosure. One of the sides may include a first segment disposed in a first plane and a second segment disposed in a second plane. The second segment includes an outwardly extending communication transceiver housing configured to receive a communication transceiver. The communication transceiver may extend through an aperture in the second segment and into interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device.

Abstract: A heat dissipating assembly including a layered stack of materials with a highly thermally conductive path for cooling a circuit, the stack including a structurally isolated material having a high coefficient of thermal expansion connected between materials having low coefficients of thermal expansion.

Abstract: A cooling element includes a first surface for receiving an electric component, and a second surface which is provided with fins for forwarding a heat load received from the electric component via the first surface to surroundings. One or more of the fins are provided with a respective flow channel for passing a fluid within each respective fin, to provide efficient cooling.

Abstract: An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.

Abstract: An electronic device includes a case having an exhaust vent, an electronic component, a radiation component including radiation fins adjacent to the exhaust vent and formed of first plates disposed parallel to one another to form first air channels, the radiation component radiating the heat received from the electronic component to air passing through the first air channels, a fan disposed at a position having a space from the radiation fins to send air toward the radiation fins, a dust filter including second plates disposed parallel to one another to form second air channels and disposed in the space between the radiation fins and the fan to transfer the air to the radiation fins while capturing dust. The dust filter is removable and the second plates have a shape to be inserted in the first air channels so as to push the dust out of the first air channels.

Abstract: The heat exchanger having a heat exchanging channel (11, 21, 31) comprises an inlet (9) and an outlet (33) for a medium flowing through the heat exchanging channel. The heat exchanger has at least two stages (10, 20, 30) being arranged one after the other in view to the flowing direction of the medium, each stage having a heat exchanging channel (11, 21, 31). The first stage has at least one guiding channel (12) arranged parallel to the heat exchanging channel (11). The heat exchanging channel (11, 21, 31) has at the end of the respective stage (10, 20, 30) at least one outlet (13, 23, 33) and the guiding channel (12, 22) of the respective stage is connected with the heat exchanging channel (21, 31) of the next following stage (20, 30). By this unused heat transfer medium is fed to each stage, said heat transfer medium having a higher temperature difference with respect to the respective heat exchanging channel. By this a good heat transfer efficiency is realized even with relatively long flow pathes.

Abstract: A rack server system includes a container, an electrically conductive component, a power supply, a signal connecting base, a server, and an RMC. The electrically conductive component and the signal connecting base are fixed in the container. The power supply is electrically connected to the electrically conductive component for supplying a direct current power. The signal connecting base includes multiple connectors. The server, disposed in the container removably, includes a power input port and a connecting element. The power input port is electrically connected to the electrically conductive component removably. The connecting element is connected to the connector removably. When the connecting element is electrically connected to the connector, the RMC communicates with the server via the connecting element and the one of the connectors and determines the position of the server in the container according to another position of the connector which is electrically connected to the server.

Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.

Abstract: The disclosure provides a fluid-cooled heat sink having a heat transfer base and a plurality of heat transfer fins in thermal communication with the heat transfer base, where the heat transfer base and the heat transfer fins form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.

Abstract: A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A heat-generating component of the electronic device is disposed adjacent to the rear surface. The plurality of fins extend from the front surface of the base. The heat pipe is disposed on the front surface of the base and in a cutout portion of the plurality of fins. The heat dissipation device, which removes heat from the heat-generating component, has a low profile and improved heat dissipation capability.

Abstract: A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract: There is provided an electric device configured to cool a plurality of plug-in units, the electric device including a plurality of slots, each slot configured to install a plug-in unit, a first fan configured to create a current of air for cooling the plug-in units, a first plug-in unit installed into a first slot, and a second plug-in unit including a second fan configured to create a current of air for cooling the first plug-in unit, the second plug-in unit being installed into a second slot adjacent to the first slot, arranged to a side of mounting component of the first plug-in unit.

Abstract: An electronic device includes an enclosure, a circuit board arranged in the enclosure, a heat dissipation module set on the circuit board, and a fan arranged in the enclosure and aligned with the heat dissipation module. The heat dissipation module includes a base and a number of fins. A number of parallel receiving portions are formed on the base. A slot is defined in each retaining portion. Each fin includes a main plate and a pivoting portion formed at a bottom the main plate. The pivoting portions are respectively and pivotably received in the slots of the base.

Abstract: A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a base portion and a support portion. The base portion is made of silicon and includes a first primary surface. The first primary surface includes at least first and second V-notch grooves thereon. The support portion is made of silicon and includes at least first and second edges that are interlockingly received in the first and second V-notch grooves when the support portion is mounted on the base portion.

Abstract: A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall.

Abstract: A detection device for cooling apparatuses of a container data center (CDC) includes a processor, a card reader, and a radio frequency identification (RFID) label. The RFID label includes a detection unit received inside the CDC, and wirelessly communicates with the card reader through the detection unit. The detecting unit detects statuses of the cooling apparatuses and environmental parameters of the CDC, and in response to the status of at least one of the cooling apparatuses and at least one of the environmental parameters of the CDC changing, the detection unit electrically isolates the RFID chip from the antenna.

Abstract: A new mounting structure is provided in which, when a heat sink is mounted (fixed) on a circuit board using a spring member, an anchor for fixing the spring member is formed in a very small size in plan view. In the present invention, at least one anchor for mounting a heat sink body on a circuit board is set in a projected state on the heat sink body side and both ends of a spring member are each directly or indirectly attached to an anchor, whereby the heat sink body is mounted on the circuit board. In the anchor, a main body section projecting on the circuit board is formed in a substantially circular shape or a polygonal shape. When the spring member is attached to the anchor, the spring member is attached to an attaching section in an externally fit state.

Abstract: A radiating fin and a method of manufacturing the same are disclosed. The radiating fin includes a main body having a first side and an opposite second side, and being provided with at least one through hole to extend between the first and the second side for a heat pipe to extend therethrough; and at least one extension being formed on at least one of the first and the second side of the main body to locate around the at least one through hole and axially project from the main body. The extension is crimped to form a plurality of circumferentially alternate ridge portions and valley portions for tightly pressing against an outer surface of the heat pipe, so as to firmly bind the radiating fin to the heat pipe. A thermal module can be formed by sequentially binding a plurality of the radiating fins to the heat pipe.

Abstract: A heat dissipating device for dissipating heat from a heat radiation element includes a base, a fixing frame, a fan, and a securing arm. The fixing frame is fixedly attached to the base, and the fixing frame has two coaxially aligned receiving holes defined therein. The fan includes two coaxially aligned shafts. The aligned shafts are fittingly received in the respective receiving holes, such that the fan is detachably attached to the fixing frame and rotatable about the aligned shafts. The securing arm is rotatably attached to the base, and the securing arm is configured for holding the fan against the base.

Abstract: A system for thermal energy storage is disclosed herein. The system includes an electronic device and a docking station to receive the electronic device. The electronic device contains a device thermal-energy storage material to absorb thermal energy from the electronic device. The electronic device is to thermally couple to the docking station. The docking station contains a dock thermal-energy storage material. The state transition temperature of the dock thermal-energy storage material is lower than the state transition temperature of the device thermal-energy storage material such that thermal energy is transferred from the device thermal-energy storage material to the dock thermal-energy storage material.

Abstract: A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.

Abstract: According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.

Abstract: A synthetic jet equipment is provided, including a base, a frame fixed to the base, a first member, a pump diaphragm, a second member, and a valve diaphragm. The pump diaphragm connects the first member to the frame, and the valve diaphragm connects the second member to the frame. The base, the frame, the first member, the pump diaphragm, the second member, and the valve diaphragm define a chamber forming an intake and an outlet. When the first member moves in a first direction, the second member moves in a second direction opposite to the first direction and the external air flows into the chamber through the inlet. When the first member moves in the second direction, the second member moves in the first direction, such that the air is exhausted from the chamber through the outlet.

Abstract: The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.

Abstract: An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array.

Abstract: A supporting apparatus, configured to support a heat dissipating device, includes a bracket, two adjusting structures, and two mounting portions. Each of the two mounting portions defines a mounting hole. Each of the two adjusting structures is engaged in each of the mounting holes and includes an adjusting member and an installation member engaged with the adjusting member. Each of the adjusting members defines a through hole. The two adjusting members are rotatable relative to the two mounting portions from a first position to a second position. When the adjusting members are in the first position, a first line is running through the two through holes. When the adjusting members are in the second position, a second line is running through the two through holes, and a length of the first line is less than a length of the second line.

Abstract: A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.

Abstract: The present invention provides a display device comprising a display panel, a driving chip and a heatsink. The driving chip is used to drive the display panel. The heatsink is thermally connected with the driving chip to dissipate the heat generated by the driving chip. Through the said method, the display device according to the present invention is provided with the heatsink connected with the driving chip to dissipate the heat generated by the driving chip, which improves the stability and reliability of the driving chip.

Abstract: A heat sink module includes a base block having opposing top wall and bottom wall, insertion grooves located at the top wall, heat pipe grooves located at the bottom wall and rows of equally spaced holes cut through the top and bottom walls in communication between the insertion grooves and the heat pipe grooves and matching the insertion grooves, heat pipes mounted in the heat pipe grooves of the base block, and radiation fins respectively mounted in the insertion grooves of the base block, each radiation fin having heat pipe mating edges respectively inserted into the holes and stopped against the heat pipes for dissipating heat from the heat pipes.

Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.

Abstract: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.

Abstract: An electronic control unit for a motor of an electric fan, has a support casing including a metal body adapted to act as a heat dissipator, a shell of an electrically insulating material coupled with the metal body, and a circuit board, mounted in contact with the dissipator body. The circuit board has a conductive connection member in the form of a flexible metal blade, electrically connected to the dissipator body, to provide an earth connection for the circuit board. The blade has a portion that projects beyond the edge of the board. The insulating shell has an internal formation which, upon coupling the shell with the dissipator body, interacts with the projecting portion of the blade, deforming it so as to bring it and thereafter maintain it in contact with the dissipator body in a resiliently loaded manner.

Abstract: A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic shielding. The device can also include a removable foot, a heat producing element, a fan, an air processing manifold having a plurality of angled fins, and a heat exchanger.

Abstract: A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted. The case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other. The plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening. The circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space.

Abstract: A light fixture includes a heat dissipating structure, an electronics assembly, and a bolt for attaching the heat dissipating structure to an external panel. The heat dissipating structure includes a first side having multiple outwardly extending projection regions and a socket, for receiving a light source, is formed in an apex of each projection region. A second side of the heat dissipating structure includes a heat sink formed in an internal cavity of each projection region. The heat sink includes fins in contact with and radially arranged about an outer surface of the socket. The electronics assembly is located at the first side of the heat dissipating structure. The bolt includes a passage through which wiring from an external source is routed to the electronics assembly. The electronics assembly includes wires routed through channels in each of the projection regions that electrically interconnect the light sources to the electronics assembly.

Abstract: A housing (1) for at least one electronic card (2), designed for the aeronautics field, of the type having a standardized width and including two lateral guides designed to work together with slides provided on the inner surfaces of an electronics bay, includes two half-shells, upper (4) and lower (5), pressed together at the lateral guides; the lower half-shell includes at least one bearing area (10) forming the housing for electronic cards; elements (19) for pressing each electronic card (2) in each corresponding housing and for pressing at least one heat sink (16) against the upper surface of at least one electronic card; the function of the body (5) is to take into account the mechanical stresses linked to the electronic cards hosted within the housing, and the function of the cover (4) is to ensure adequate thermal conductivity to allow heat produced by an electronic card in operation to be dissipated.

Abstract: A cold plate is manufactured by obtaining a base plate with a top surface, a bottom surface, and an edge. An inlet trough and an outlet trough are machined in the top surface. Fins are cut into the base plate with a tool that contacts the base plate in either the inlet trough and the outlet trough and then exits the base plate in the other of the inlet trough and the outlet trough. An inlet nozzle indent is machined from the inlet trough to the edge of the base plate, and an outlet nozzle indent is machined from the outlet trough to the edge of the base plate. A cover covers the inlet and outlet nozzle indents, and an inlet nozzle and outlet nozzle are secured to the inlet and outlet nozzle indents.

Abstract: Flow diversion apparatuses and methods are provided. A flow diversion apparatus can include a vent configured to permit the flow of a fluid therethrough. The apparatus can also include an electronic device capable of a range of motion across at least a portion of the vent disposed proximate at least a portion of the vent. The apparatus can include a shutter disposed proximate at least a portion of the vent opposite the electronic device. The shutter can be capable of a range of motion across at least a portion of the vent in conjunction with the electronic device. The shutter can prevent at least a portion of the fluid flowing through the vent from impinging on the electronic device.

Abstract: In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.