Abstract: A semiconductor module according to one embodiment of the present invention includes: a first circuit board having thermal conductivity; a second circuit board having thermal conductivity and disposed opposing the first circuit board; a first semiconductor element joined to an opposing surface of the first circuit board opposing the second circuit board; a second semiconductor element joined to an opposing surface of the second circuit board opposing the first circuit board; and a connector electrically connecting the first semiconductor element and the second semiconductor element. The connector includes a portion which is sandwiched between the first semiconductor element and the second circuit board without through the second semiconductor element, and which is in contact with the first semiconductor element and the second circuit board.

Abstract: A latch device for heat dissipation unit is applied to and mounted on a motherboard in tight contact with at least one heat source. The latch device includes a heat sink, a first elastic abutment member having a first protrusion block and a second elastic abutment member having a second protrusion block. A first latch member and a second latch member are disposed on two opposite sides of the heat sink. The first and second latch members are freely latchable with the corresponding first and second protrusion blocks or unlatchable from the corresponding first and second protrusion blocks. Accordingly, along with the latching or unlatching, the first and second elastic abutment members are elastically deformed into abutment against or out of abutment with the other face of the heat sink. Therefore, the heat sink can be easily and securely fixed on or detached from the motherboard.

Abstract: An electronic device is disclosed. The electronic device includes a first body, a second body and a connector. The first body includes at least a first surface and a second surface opposite to the first surface, and an output unit is provided at least on the second surface. The second body includes at least a third surface and a fourth surface opposite to the third surface, and an input unit is provided at least on the third surface. The connector connects the first body to the second body. At least one surface of the first surface, the second surface, the third surface and the fourth surface is a curved surface.

Abstract: Technology is provided for a storage device storage tray for use with one or more storage devices. The storage device storage tray includes a chassis having at least one storage region and a storage frame positioned in the storage region that is pivotably coupled to the chassis. The storage frame is pivotable between a storage position and an access position whereby a plurality of drive bays can be accessed. The storage frame includes first and second substantially parallel panels and a backplane extending between the first and second substantially parallel panels. A plurality of dividers are positioned between the first and second substantially parallel panels to define a plurality of stack regions, wherein each divider includes a ledge member dividing each stack region into a pair of the drive bays configured to receive a storage device.

Abstract: An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.

Abstract: A cooling module is used to cool an electronic component, the cooling module includes a shell and a radiator which is received in the shell. The shell includes a receiving portion which is used to receive the radiator. Two sides of the receiving include two latch pieces, the latch piece defines a latch hole. Two sides of the radiator include two protrusive blocks, the latch piece can be elastically deformed to let the protrusive block be inserted into the latch hole to fix the radiator in the shell.

Abstract: A system for mounting liquid cooled electrical components includes a plastic chassis having a plurality of mounting sites. The plastic chassis defines at least one fluid circuit that extends through at least a portion of a length of the plastic chassis. The at least one fluid circuit includes an inlet configured to receive a cooling fluid from a fluid source, an outlet configured to return the cooling fluid to the fluid source, and at least one fluid channel extending between the inlet and the outlet. The system also includes a plurality of electrical components. Each of the plurality of electrical components is coupled with one of the plurality of mounting sites. Each of the plurality of mounting sites is in contact with the at least one fluid channel.

Abstract: A thermal bridge includes a frame and an array of multiple plates. The frame defines a bridge opening, and the array of plates is held in the bridge opening. The plates are stacked side-by-side along a stack axis. The array extends between a top end defined by top edges of the plates and a bottom end defined by bottom edges of the plates. Each plate is independently vertically compressible between the respective top and bottom edges of the plate relative to other plates in the array. The top end of the array is configured to engage and conform to a contour of a first external surface. The bottom end of the array is configured to engage and conform to a contour of a second external surface. The plates are thermally conductive to transfer heat between the first and second external surfaces.

Abstract: A channel diversion device includes a supporting structure, a piercing hole structure, a guiding baffle and a collecting mask. An electronic component can be accommodated inside the supporting structure. The supporting structure includes a first structural layer and a second structural layer. An opening is formed on the second structural layer. The piercing structure is formed on a lateral wall of the first structural layer, and the guiding baffle is disposed by a side of the opening on the second structural layer. The collecting mask is disposed by the first structural layer to cover the piercing hole structure, and a direction of an outlet of the collecting mask is substantially different from a direction of the opening on the second structural layer.

Abstract: A series fan structure with multistage frame body includes a first main body, a second main body, a first frame and a second frame. The first main body has a first fan frame having a first opening and a second opening. The second main body is correspondingly serially connected to the first main body. The second main body has a second fan frame having a third opening and a fourth opening. The third opening corresponds to the second opening. The first frame is correspondingly serially connected to one side of the first fan frame with the first opening. The first frame and the first fan frame together define a first flow passage. The second frame is correspondingly serially connected to one side of the second fan frame with the fourth opening. The second frame and the second fan frame together define a second flow passage.

Abstract: An array of electrical components may be mounted in openings in an electronic device housing. Gaskets may be used to seal the electrical components to a housing wall. The housing wall may be planar or may have a cylindrical shape or other curved shape. A support structure such as a hollow tube may be mounted within the interior of a cavity region defined by the housing wall. The electrical components may be radially deployed into the openings. Mating ramped structures may be translated with respect to each other to push elongated strips of components outward or each electrical component may be pushed outward using a threaded nut that engages threads on the electrical component.

Abstract: An electric heater for an automobile vehicle, having at least one heating element and at least one circuit board, with the circuit board being connected to a control unit and/or to a power supply and having at least one contact area through which an electrical connection between a heating element and a control unit and/or a power supply can be realized, the heating element possessing at least one PTC-heating element, with the heating element being connected to the circuit board with at least one connecting element, whereby the first connecting element features at least one protruding element and the contact area offering at least one through hole, with the at least one protruding element being insertable into the at least one through hole of the contact area.

Abstract: An electronic assembly comprises a first circuit board with a first substrate having an inner side and an outer side opposite the inner side. A plurality of primary components are mounted on the inner side of the first circuit board. A frame (e.g., or heat-sinking spacer) is secured to the first circuit board. A second circuit board comprises a second substrate having an inner side and an outer side opposite the first side. The second circuit board is secured to the frame and separated from the first circuit board in at least one spatial dimension. At least one secondary component is mounted on the second circuit board. A first housing section is adapted for mating with a second housing section. The first housing section and the second housing section collectively enclose the first circuit board and the second circuit board.

Abstract: A protective case for an electronic device contains a first covering part and a second covering part which are connected together to define a hollow accommodation chamber for housing an electronic device. The second covering part couples with a back face of the electronic device and includes a heat removal groove for accommodating a heat dissipation plate, and when the electronic device is housed in the accommodation chamber, it contacts with the heat dissipation plate. The first covering part connects with a front face of the electronic device by using its internal face and includes a transparent visible window aligning with a touch screen of the front face of the electronic device. The accommodation chamber includes at least one receiving interface corresponding to at least one peripheral port of the electronic device and includes at least one button port for extending at least one button of the electronic device outwardly.

Abstract: Disclosed herein are computing devices, and methods of manufacturing computing devices, that have a cooling fan and integrated thermal transfer unit. A centrifugal fan unit includes a rotatable hub, a plurality of blades disposed on the rotatable hub, and a motor coupled to the rotatable hub. The motor causes the rotatable hub to rotate about an axis such that airflow proceeds outward from the centrifugal fan unit along trajectories that are perpendicular to the axis. One or more thermal transfer units have first portions that are coupled to the one or more heat sources and second portions that collectively at least partially surround the centrifugal fan unit.

Abstract: A heat dissipating device for dissipating the heat produced by a heating element is disclosed. The heat dissipating device includes a fixing assembly, two moving assemblies and an elastic assembly. The fixing assembly has a thermal conductive member. Each moving assembly has a mass body and is relatively moveable with respect to the fixing assembly. The two moving assemblies are disposed on two opposite sides of the fixing assembly, respectively, and each moving assembly forms a moving space with respect to the fixing assembly. The elastic assembly connects the fixing assembly to the two moving assemblies.

Abstract: Disclosed is a connector module comprising an insulation main body including a slot and groups of connection terminals fixed to the insulation main body, with each group of connection terminals including a first contact piece and a second contact piece. The first contact piece provides an external first contact and internal second and third contacts, arranged along a first direction in the slot. The second contact piece provides an external fourth contact and internal fifth and sixth contacts, arranged along the first direction in the slot and in resilient contact with the second and third contacts, respectively. When an external object enters into the slot in the first direction, contact between the second and fifth contacts or the third and sixth contacts is released.

Abstract: A bracket for cooling a peripheral component interconnect card is disclosed. The bracket includes a plurality of heat transfer surfaces, mounting systems for a blower fan, fan shroud and liquid cooling system for cooling the peripheral component interconnect card.

Abstract: Various embodiments of microelectronic package cooling assemblies are described. Those embodiments include a cooling assembly comprising an array of vertically separated micro channels coupled to a heat spreader, wherein the heat spreader is finless, and wherein each inlet micro channel has two adjacent outlet micro channels. A distance between individual vertically separated micro channels comprises less than about 20 microns, and a heat pipe is embedded in the heat spreader.

Abstract: In order to prevent poor operability caused by entanglement of the fins in the heat sink during assembly without a drop in the cooling efficiency of the cooling flow along a rotation shaft, a plurality of fins 23c of the heat sink in a vehicle AC generator 1 is constituted by fin groups 123 in which fins are aligned in parallel in one direction, and an entanglement preventing portion 23d is disposed only on the respective outer side surfaces of a pair of outermost fins.

Abstract: A thermal interface material provides thermal conduction or thermal dissipation across an interface, using a three-dimensional interconnected porous graphene (3D-IPG) foam structure. The 3D-IPG foam structure is constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers, and having an flexible interconnection architecture. The flexible interconnection architectures allow the 3D-IPG to maintain a high interfacial thermal conductance by the 3D-IPG filling a gap between a heat source and a heat sink across the interface, and by capping small features up to nanoscale roughened surfaces.

Abstract: A system of thermally managing network equipment including a rack housing a network equipment element, an intake coupling including one or more vanes and an exhaust port, a duct, and a rack coupling mechanism configured to adjustably position the intake coupling relative to the rack. The intake coupling is configured to: receive an airflow from the hot air exhaust vent at a first direction; deflect the airflow in a second direction via the one or more vanes; and exhaust the airflow through an opening in the exhaust port.

Abstract: An electronic device is provided. The electronic device includes a circuit board having heat generating components thereon. The electronic device further includes a heat sink with air current generating electric device assembly, disposed over the circuit board, through which heat from the circuit board and the components thereon is released. The heat sink with air current generating electric device assembly includes a heat sink having a solid central core and a plurality of fins protruding from the core. The heat sink with air current generating electric device assembly further includes an air current generating electric device disposed over the heat sink and having an air intake facing a top of the heat sink and an exhaust opening directed parallel to a plane of the circuit board.

Abstract: The present disclosure is directed to a light emitting diode (LED) light module. In one embodiment, the LED light module includes a plurality of light sections and a plurality of open sections formed by a plurality of heat sink fins between the plurality of light sections, wherein each one of the plurality of light sections is adjacent to two different light sections of the plurality of light sections.

Abstract: An air-cooled case enabling automatic setting of a flow of cooling air during natural cooling and during forced cooling contains a heating element and a cooling fan in a space surrounded by multiple surfaces that include a top surface and mutually facing side surfaces. The air-cooled case is provided with a top surface ventilation opening formed in the top surface, side surface ventilation openings formed in the side surfaces, and a shutter that is provided in the top surface ventilation opening and opens/closes the top surface ventilation opening.

Abstract: A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed.

Abstract: A cooling system for cooling a temperature-dependent power device includes an active cooling device and a controller to generate and transmit a drive signal thereto to selectively activate the device. The controller receives an input from sensors regarding the cooling device power consumption and measured operational parameters of the power equipment—including the power device output power if the device is a power producing device or the power device input power if the device is a power consuming device. The controller generates and transmits a drive signal to the cooling device based on the cooling device power consumption and the measured power device input or output power in order to cause the active cooling device to selectively cool the heat producing power device. A net system power output or total system power input can be maximized/minimized by controlling an amount of convection cooling provided by the cooling device.

Abstract: A display apparatus includes a display panel, a light source part which generates and provides a light to the display panel, and a receiving container. The receiving container includes a bottom portion under the light source part, and a sidewall extending from the bottom portion. The bottom portion includes a first strength portion and a second strength portion. The first strength portion and the second strength portion have different strengths from each other and are continuously connected to each other.

Abstract: In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.

Abstract: A heat sink embodiment has at least one anti-rocking tab that extends outwardly and downwardly from an edge of the body portion of the heat sink. A leading lower edge of the anti-rocking tab is above a top surface of the motherboard when the heat sink is being affixed to the motherboard over a flip chip. During installation of the heat sink to the motherboard, a travel distance limit is imposed by the leading lower edge of the anti-rocking tab, thereby limiting a force that is applied to the die of the flip chip so that an edge and/or a corner of the die of the flip chip is not crushed, or such that the die of the flip chip is not cracked.

Abstract: The system for redirecting airflow includes multiple electronic assemblies arranged adjacent to one another. Each electronic assembly includes a substrate having a substantially flat first surface and an opposing substantially flat second surface. Electronic devices are coupled to each of the first and second surfaces. Each surface also has one or more tabs coupled thereto, where each tab is configured to redirect the airflow over a least one electronic device.

Abstract: An electrical connector (100) for positioning a heat sink assembled on the electrical connector and for soldering to a substrate includes an insulating housing (1) with a plurality of electrical contacts (4) received therein and a position member assembled to the insulating housing (1), the position member includes an interlock member (2) and a soldering member (3) assembled together, the interlock member (2) includes an assembling portion (21) and an extending portion (22) extending upwardly from the assembling portion (21) for hooking with the heat sink, the soldering member (3) includes a body portion (31) and a pair of soldering portions (32) extending downwardly from the body portion (31) for soldering to the substrate.

Abstract: A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.

Abstract: A battery includes an essentially airtight housing having an air-permeable opening for pressure compensation. The battery also includes a plurality of battery cells arranged in the housing. The battery also includes an active cooling device configured to cool the battery cells in the housing. The cooling device includes a coolant and a distributor block configured to distribute the coolant. The battery also includes an air duct integrated in the distributor block. The air duct is configured and arranged such that the air-permeable opening of the housing is connected to ambient air via the air duct.

Abstract: Provided is a datacenter chamber having racks configured to hold arrays of rack-mounted computing devices. The datacenter chamber comprises three or more racks, each rack having a plurality of receptacles configured to hold a computing device; a chassis configured to secure each of the racks in spaced relation relative to one another, wherein the chassis is configured to secure the racks facing outward from an interior chamber defined by a back-side of the racks, and wherein the chassis is configured to position the racks facing at least three different directions; and an integrated cooling system configured to drive a cooling fluid along computing devices mounted in the racks and through the interior chamber.

Abstract: A power conversion device capable of reducing a temperature variation between a plurality of semiconductor modules is provided. The power conversion device comprises condensers 121, 122, a plurality of semiconductor modules 101, 102, heat dissipation units 103 to 109, a bus bar 140 connecting the condensers 121, 122 with the plurality of the semiconductor modules 101, 102, and a ventilation unit having cool wind blow. The power conversion module has features that the plurality of semiconductor modules 101, 102 are arranged apart from the condensers 121, 122 and in a line in a longitudinal direction of the bus bar 140 and that the cool wind 150 blows in a direction from the condensers 121, 122 toward the plurality of semiconductor modules 101, 102 that are mounted.

Abstract: An electrical connector structure includes a heat transfer enclosure; a base having an upper and a lower insertion slot and disposed in the enclosure; a horizontal intermediate heat transfer member separating the enclosure into an upper and a lower insertion channel, and having an upper and a lower opening formed thereon; a heat transfer element disposed in the horizontal intermediate heat transfer member, and having an upper and a lower heat transfer surface with a first air passage located therebetween; an upper heat transfer sheet having upper heat transfer spring fingers and disposed in the upper opening and connected to the upper heat transfer surface; and a lower heat transfer sheet having lower heat transfer spring fingers and disposed in the lower opening and connected to the lower heat transfer surface. With these arrangements, the lower insertion channel of the electrical connector structure can have a reduced temperature.

Abstract: A seal for a heat exchanger of a machine includes a pad and a sealing lip. The pad includes a perimeter, a core face, and a tank face. The core face is in opposing relationship to the tank face. The pad defines a pad plane and an opening which extends between the core face and the tank face. The scaling lip circumscribes the perimeter of the pad and includes a base end, which is connected to the perimeter of the pad, and a terminal end. The sealing lip extends outwardly along the pad plane from the pad perimeter and projects from the core face. The sealing lip including an outer lip wall which extends from the base end to the terminal end along a tip axis disposed at an oblique lip pitch angle relative to the pad plane.

Abstract: The electronic portable device of the invention includes a housing, a lifting mechanism, a controlling unit, and a heat dissipation fan. The housing includes an opening. The lifting mechanism is movably disposed in the housing and corresponds to the opening. The lifting mechanism is configured to move toward or away from the opening. The control unit is coupled to the lifting mechanism and configured to control the lifting mechanism to move toward or away from the opening. The heat dissipation fan is disposed on the lifting mechanism and corresponds to the opening. When the lifting mechanism moves towards the opening, the heat dissipation fan is lifted toward the opening by the lifting mechanism, and is protruded from an outer surface of the housing through the opening.

Abstract: An integrated heat sink array is introduced in SOI power devices having multiple unit cells, which can be used to reduce the temperature rise in obtaining more uniform temperature peaks for all the unit cells across the device area, so that the hot spot which is prone to breakdown can be avoided, thus the safe operating area of the device can be improved. Also the array sacrifice less area of the device, therefore results in low Rdson.

Abstract: A coolant distribution structure for an MMIC having: an input/output layer with an input port for receiving a coolant for transmission to coolant channels in the MMIC and an output port for exiting the coolant after such coolant has cooled active devices in the MMIC, a coolant pass-through layer to receive the coolant from the input port and having structure to inhibit such received coolant from passing directly to the output port, a coolant distribution layer for receiving coolant passing from the coolant pass-through layer and distributing such received coolant to the cooling channels to absorb heat generated by the active devices and then directing heated coolant to the coolant distribution layer and out of the porting layer via the pass-through layer. The coolant pass-through layer has a structure configured to inhibit such heated coolant from passing directly to the input port prior to such heated absorbed coolant being transmitted to the output port.

Abstract: Various embodiments described herein disclose systems, methods and/or devices used to dissipate heat generated by electronic components of an electronic assembly that further includes a first assembly rail, a top circuit board and a bottom circuit board. The first assembly rail includes a first card guide structure and a second card guide structure that are arranged on a first side of the first assembly rail near two opposite ends of the assembly rail. The top and the bottom circuit boards are mechanically coupled to the first and second card guide structures of the first assembly rail, respectively. The top circuit board is parallel to the bottom circuit board, and separated from the bottom circuit board by a predefined distance. The first assembly rail, the top circuit board and the bottom circuit board together form a channel there between for receiving a heat dissipating airflow.

Abstract: A liquid cooling heat exchanger module filled with a cooling liquid includes a casing (10) and a cooling structure (11), and the interior of the casing (10) is hollow, and the casing (10) has an inlet (100) and an outlet (101) interconnected to the interior, and the cooling structure (11) is installed in the casing (10), and the cooling structure (11) has a vortex generating area (110) concavely formed at a position opposite to the inlet (100), such that a cooling liquid is filled from the inlet (100) into the casing (10) and impacted in the vortex generating area (110) to form a vortex, so as to achieve the effects of extending the time for the cooling liquid to stay in the heat exchanger module (1), maximizing the cooling effect of the cooling liquid, and improving the heat dissipating efficiency.

Abstract: A module that incorporates a chassis for enabling use of at least one smaller functional module in at least one slot of a chassis designed to mate with a larger functional module having a different standard than the smaller functional module. The module has a housing having electrical connections adapted to mate with electrical connections provided by the chassis for the larger functional module and dimensions that fit within at least one slot provided by the chassis for housing the larger functional module. The module includes at least one set of electrical connections adapted to mate with the electrical connections of the smaller functional module(s) and at least one air passage for conveying air from an opening of the chassis that provides air flow to cool the larger functional module to an area in which the smaller functional module(s) is/are situated when mated with the housing.

Abstract: A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.

Abstract: A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed wiring board corresponding to the heat transfer pattern, and thermally connected to the heat transfer pattern. The heat transfer pattern has a plurality of connecting lands exposed so as to be connectable to the heat sink of the electronic component by solder while being divided by a solder resist. The plurality of the connecting lands include lands adjacent to the through holes, and lands not adjacent to the through holes. The heat dissipation of the electronic component is enhanced while enhancing the connectability of the heat transfer pattern with the heat sink of the electronic component, at being mounted.

Abstract: A header assembly for a power distribution assembly in which the power distribution assembly includes a mounting portion and a plurality of current carrying components. The header assembly includes a first header segment made from a first material and a second header segment disposed on the first header segment and being made from a second different material. The first header segment and the second header segment together form a composite header assembly structured to be mechanically coupled to the mounting portion and electrically connected to at least some of the current carrying components. At least one of the first material and the second material is thermally conductive and electrically insulative.

Abstract: An LED lighting device includes an LED light engine and a heat sink including a heat dissipation structure. The heat dissipation structure includes: a plurality of heat conductive rod rows including a plurality of vertical heat conductive rods; a plurality of horizontal heat conductive rods including a plurality of surfaces and attached onto one end of the vertical heat conductive rods; another end of the vertical heat conductive rods vertically attached to a back side of the LED light engine; and a plurality of fin modules attached to any one of the surfaces of the horizontal heat conductive rods. Accordingly, the heat dissipation area is increased and the heat sink is separated from the LED light engine such that heat dose not accumulate thereon and the shortcoming of airflow on the heat sink can be overcome with improvements.

Abstract: A switchgear includes a housing having first and second side walls and at least one shelf member. The at least one shelf member includes a guide element. A withdrawable switchgear unit is slidingly supported on the at least one shelf member. A blocking mechanism is mounted to the withdrawable switchgear unit. The blocking mechanism includes a guide pin arranged in the guide element and a blocking pin operatively connected to the guide pin. The blocking pin selectively restricts movement of the withdrawable switchgear unit between at least two operational positions.

Abstract: An object is to provide a switching unit or switching gear which enhances heat radiation performance and eliminates the need for an increase in unit size. In order to solve this problem the switching unit includes a switch and insulating resin located in a way to cover the periphery of the switch, in which the switch includes a fixed electrode, a movable electrode facing the fixed electrode and moving in an axial direction to contact or leave the fixed electrode, a bus side conductor connected to one of the electrodes and connected to a bus, and a load side conductor connected to the other electrode and connected to the load. The insulating resin has fins formed in a circumferential direction on the outer surface of the insulating resin and the distance between the periphery of the switch and the bottoms of the fins is almost constant in the circumferential direction.