Abstract: A packaged semiconductor device is made by forming a conductive pad on an external surface of an integrated circuit device, forming a passivation layer over the conductive pad, removing a portion of the passivation layer over a bond area on the conductive pad, forming a sacrificial anode around a majority of a periphery surrounding the bond area, forming a conductive bond in the bond area, and forming an encapsulating material around the conductive bond and an exposed portion of the sacrificial anode.

Abstract: Provided are a method of producing an electrically conductive metal composite yarn applicable to a smart textile in which electrical, electronic and IT technologies are combined with an electronic circuit technology using fiber, an electrically conductive metal composite yarn produced by the method, and an embroidered circuit produced using the electrically conductive metal composite yarn, the method including: a first process of producing a covered yarn by wrapping a conductive yarn around a surface of a yarn; a second process of producing a twisted covered-yarn by additionally twisting the covered yarn produced through the first process; and a third process of producing a reinforced plied-yarn by wrapping a yarn around a surface of multiple strands of the twisted covered-yarn in a covered state to increase yield strength of the conductive yarn.

Abstract: An electrical connector comprises a first single-piece contact bracket, a second single-piece contact bracket and a flat, flexible, electrically conductive strip. The first contact bracket and the second contact bracket are secured to the strip with spacing.

Abstract: A transparent electrode sheet includes a transparent support having thereon patterned electrodes, and an absolute value of a difference between a reflection chromaticity of a surface of the electrode of far side from the transparent support and a reflection chromaticity of a surface of the electrode of near side to the transparent support is not more than 2.

Abstract: An apparatus, system, and/or method are described to enable optically transparent reconfigurable integrated electrical components, such as antennas and RF circuits to be integrated into an optically transparent host platform, such as glass. In one embodiment, an Ag NW film may be configured as a transparent conductor for antennas and/or as interconnects for passive circuit components, such as capacitors or resistors. Ag NW may also be used as transmission lines and/or interconnect overlays for devices. A graphene film may also be configured as active channel material for making active RF devices, such as amplifiers and switches.

Abstract: The present invention describes a method for the preparation of graphene or graphenic material films by the carbonization of biopolymers. The method comprises the following stages: preparation of an aqueous solution of a non-crystallizable water-soluble biopolymer or a derivative of said biopolymer at the suitable pH, coating of the substrate with the aqueous solution of the biopolymer prepared in the previous stage by immersion of the substrate in said solution or by using the spin coating technique, conditioning of the aqueous solution of the biopolymer by means of a hydrothermal process consisting of subjecting the coated surface to a flow of nitrogen saturated with water vapor at the temperature of between 100 and 250° C. for a time between 30 minutes and several hours, thermal decomposition of the biopolymer deposited on the substrate in the absence of oxygen at temperatures below 1200° C.

Abstract: A method transfers a graphene layer from a donor substrate onto a final substrate. The method includes: providing a metal layer on the donor substrate; and growing a graphene layer on the metal layer. The method also includes: laminating a dry film photo-resist on the graphene layer; laminating a tape on the dry film photo-resist; chemically. etching the metal layer, obtaining an initial structure that includes the tape, the dry film photo-resist and the graphene layer; laminating the initial structure on the final substrate; thermally realizing the tape, so as to obtain an intermediate structure that includes the dry film photo-resist, the graphene layer and the final substrate; removing the dry film photo-resist; and obtaining a final structure that includes the final substrate with a transferred graphene layer.

Abstract: An electrically conductive material includes a liquid gallium alloy mixed with multiple solid particles, so as to form an electrically conductive material in which solid and liquid coexist. The electrically conductive material is disposed between and electrically connecting a first conductor and a second conductor. The first conductor is disposed on a first electronic element, and the second conductor is disposed on a second electronic element.

Abstract: A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and soldering the first buttoned soldering pad to the soldering pad. The method includes introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. The method includes introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad; introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; and forming spaces between the first and second solder that electronically insulate the first solder from the second solder.

Abstract: An electro-conductive multifilament yarn for an electro-conductive brush that includes an electro-conductive fiber containing a synthetic fiber and a carbon nanotube covering a surface of the fiber. The synthetic fiber may have a single-filament fineness of not more than 30 dtex. The synthetic fiber may have 3 to 6 elongated recesses or grooves extending in a longitudinal direction thereof and have a multi-leaves or cross-section.

Abstract: The invention relates to an electro-optical or electromechanical structural component, in particular, an LED, connector or stamped grid, or sliding element, made of a rolled metal substrate of a metal strip, or a sheet produced therefrom, made of Cu or a Cu alloy strip, Al or an Al alloy strip, Fe or a Fe alloy strip, Ti or a Ti alloy strip, Ni or a Ni alloy strip or a stainless steel strip, which has a specially structured surface. The structure of the surface allows joining using optical methods, even in the case of highly reflective surface coatings, and simultaneously improves the functional properties of the components used.

Abstract: Lightweight sewer cable that may include an elongate central resilient non-metallic core member, an elongate metallic helical coil spring surrounding the core member, and an elongate non-metallic spacer between the core member and the coil spring are disclosed.

Abstract: A electric wire includes a central conductor 1 made of aluminum or an aluminum alloy, a cover layer 2 made of copper and covering the central conductor 1, and a ferromagnetic layer 3 covering the cover layer 2 and blocking the external magnetic field. The thickness of the ferromagnetic layer 3 is in a range from 0.04 ?m to 14 ?m, the total diameter of the central conductor 1 and the cover layer 2 is in a range from 0.05 mm to 0.4 mm, and the cross-sectional area of the central conductor 1 is in a range from 85% to 95% of the total cross-sectional area of the central conductor 1 and the cover layer 2.

Abstract: A semiconductor device component includes a mounting substrate, a first connection terminal disposed on the mounting substrate, having a shape extending in a first direction, and including a first U-shaped portion having a U-shaped cross-sectional shape cut along a plane perpendicular to the first direction, and a second connection terminal, disposed on the mounting substrate, adjacent to the first connection terminal, having a shape extending in a second direction not parallel with the first direction, and including a second U-shaped portion having a U-shaped cross-sectional shape cut along a plane perpendicular to the second direction. Further, the first connection terminal is disposed in such a position that the U-shaped base of the first U-shaped portion is located on a second connection terminal side. The second connection terminal is disposed in such a position that the U-shaped base of the second U-shaped portion is located on a first connection terminal side.

Abstract: A method of increasing a work function of an electrode is provided. The method comprises obtaining an electronegative species from a precursor using electromagnetic radiation and reacting a surface of the electrode with the electronegative species. An electrode comprising a functionalized substrate is also provided.

Abstract: A battery module including a plurality of rechargeable batteries each having terminals; and a connection member electrically connecting terminals of neighboring ones of the rechargeable batteries, wherein the connection member includes a terminal hole into which one of the terminals is inserted, and a mounting portion that protrudes inwardly at the terminal hole, and wherein each terminal includes a support portion contacting the mounting portion and supporting the mounting portion.

Abstract: An electrode structure of a capacitive touch panel is provided, which includes a plurality of receiving electrodes and a plurality of driving electrodes. Each of the receiving electrodes has a hexagonal electrode structure. Each of the driving electrodes includes a main region. Each of the main regions has a quadrilateral electrode structure. The area of each driving electrode is larger than that of each receiving electrode. By using the foregoing electrode structure, the capacitive touch panel can not only provide sensing signals with less noise but also increase the intensity of input signals to enhance the signal to noise ratio.

Abstract: Disclosed are a wire and a method for manufacturing the same. The method includes heating a solvent, adding a capping agent to the solvent, and forming a metallic wire by adding a metallic compound to the solvent. The solvent includes a first solvent having a first reduction power and a second solvent having a second reduction power greater than the first reduction power. The capping agent includes a first capping agent containing a polymer having a first molecular weight, and a second capping agent containing a polymer having a second molecular weight greater than the first molecular weight.

Abstract: According to one embodiment, a lead frame includes a die pad having a mounting surface on which a semiconductor chip is mounted, plural leads having inner leads and outer leads, and a connecting member that extends from the die pad to both ends of a plurality of leads and connects the die pad and the plurality leads so that the ends of the inner leads are positioned above of the mounting surface.

Abstract: An electrical connector includes a base member and first and second legs extending outwardly from the base member. A first recess is defined by the first and second legs for receiving a support. Second recesses extend inwardly from second sides of the first and second legs. A plurality of pairs of oppositely disposed grooves are formed in the second recesses. At least two pairs of the oppositely disposed grooves have different sizes for receiving various conductor sizes.

Abstract: A presoldered prefluxed electrical component or connector, which can protect the flux from wearing off the surface of solder during shipping and handling. The electrical component can include a terminal pad. A layer of solder can be on the terminal pad. The layer of solder can have a surface with a series of generally equally spaced apart flux wells formed in the surface of the solder for protectively storing and retaining flux therein. The flux wells can have a lateral dimension of at least 0.05 mm and a depth of at least 0.023 mm that is deep enough for retaining a quantity of flux therein when flux on the surface of the layer of solder wears off during shipping and/or handling.

Abstract: A electric wire includes a central conductor 1 made of aluminum or an aluminum alloy, a cover layer 2 made of copper and covering the central conductor 1, and a ferromagnetic layer 3 covering the cover layer 2 and blocking the external magnetic field. The thickness of the ferromagnetic layer 3 is in a range from 0.04 ?m to 14 ?m, the total diameter of the central conductor 1 and the cover layer 2 is in a range from 0.05 mm to 0.4 mm, and the cross-sectional area of the central conductor 1 is in a range from 85% to 95% of the total cross-sectional area of the central conductor 1 and the cover layer 2.

Abstract: A conductive paste includes a conductive powder, a metallic glass, and an organic vehicle. The metallic glass includes a first element, a second element having a higher absolute value of Gibbs free energy of oxide formation than the first element, and a third element having an absolute value of Gibbs free energy of oxide formation of about 1000 kJ/mol or less at a baking temperature and a eutectic temperature with the conductive powder of less than about 1000° C. An electronic device and a solar cell may include an electrode formed using the conductive paste.

Abstract: Provided is a conductive structure and a device with the conductive structure as an electrode. The conductive structure includes a reduced metal layer and an overlapping structure formed by nano metal wires. The overlapping structure has at least one connecting portion, and the reduced metal layer covers the nano metal wires at the connecting portions.

Abstract: A current lead with a configuration to reduce heat load transfer in an alternating electrical current (AC) environment is disclosed. The current lead may comprise a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the current lead. A temperature gradient a may be exhibited along a length of the current lead.

Abstract: A coating having a layered structure including a palladium layer is provided to a conductor. The highly stable palladium layer is amorphous and contains phosphorus in a concentration ranging from 7.3% by mass to 11.0% by mass. An electronic component may include the conductor coated with the coating. The conductor coated with the coating has superior corrosion resistance and superior reliability in electrical connection with external apparatuses.

Abstract: An apparatus and method for forming a single strand wire with improved flexibility and a stranded cable from a single strand wire. In one embodiment, the flexible single strand wire has a solid, single strand wire body and at least one helical groove formed on an outer circumferential surface of the wire body. The stranded cable includes a plurality of strands. In one embodiment, one of the strands has a planar surface that extends along a longitudinal axis of the cable body.

Abstract: A method of making an electrical stimulation lead method includes attaching a pre-electrode to a lead body. The pre-electrode is a single, unitary, undifferentiated construct with a ring-shaped exterior. The method further includes attaching a plurality of conductor wires to the pre-electrode; and, after coupling to the lead body, removing an outer portion of the pre-electrode to separate remaining portions of the pre-electrode into a plurality of segmented electrodes spaced around the circumference of the lead body. When separated, each of the segmented electrodes includes a body and at least one leg extending inwardly from the body. The body defines an external stimulating surface and each of the at least one leg has an outer surface. For at least one of the at least one leg, the outer surface of the leg forms a non-perpendicular angle with the external stimulating surface of the body.

Abstract: A solder joint is disposed on an electrical conductor which comprises silver. The solder joint comprises bismuth and tin. The solder joint has a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone. The bismuth-rich solder bulk is disposed adjacent to the silver-solder reaction zone. The solder joint comprises a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least the bismuth-rich solder bulk of the solder joint. A window pane comprising the solder joint is also disclosed.

Abstract: A metal wiring suitable for a substrate of large size is provided. The present invention is characterized in that at least one layer of conductive film is formed on an insulating surface, a resist pattern is formed on the conductive film, and the conductive film having the resist pattern is etched to form a metal wiring while controlling its taper angle ? in accordance with the bias power density, the ICP power density, the temperature of lower electrode, the pressure, the total flow rate of etching gas, or the ratio of oxygen or chlorine in etching gas. The thus formed metal wiring has less fluctuation in width or length and can satisfactorily deal with an increase in size of substrate.

Abstract: A circuit assembly that includes a planar lead frame formed of electrically conductive material having a first thickness. The lead frame is configured to define a routing plane and a plurality of coplanar sections in the routing plane. The circuit assembly also includes a top-side terminal formed of electrically conductive material having a second thickness independent of the first thickness. The top-side terminal is configured to be inserted into a hole defined in a section and form an electrical connection to the section, wherein the top-side terminal protrudes from the routing plane.

Abstract: An electric wire includes a conductive portion 11 made of a material having a volume resistivity higher than that of copper, wherein the volume resistivity of the conductive portion is specified so that, in a frequency range in which the electric wire is used, a ratio of AC resistance of the conductive portion 11 to AC resistance of reference copper wire is less than 1.

Abstract: The invention relates to a contact pin, comprising an angular end section, which is in particular designed for connecting to a wire or plug, wherein the angular end section has an angular cross-section. According to the invention, the contact pin has a round end section that is opposite the angular end section and that is designed for soldering to a circuit board. The round end section has a cross-section that is round at least in some sections of the circumference.

Abstract: The present invention relates to a conductive layer of a touch screen, the conductive layer is a mesh composed of metal wires, the mesh comprises a plurality of mesh cells, the mesh cell comprises a plurality of mesh edges and nodes formed by connecting two adjacent edges, the conductive layer comprises a sensing region and a wire region which is electrically connected to the sensing region, the sensing region comprises a plurality of first sensing patterns and a plurality of second sensing patterns, the first sensing pattern and the second sensing pattern is adjacent and electrically insulated from each other, the mesh cells in each first sensing pattern are electrically connected with each other, the mesh cells in each second sensing pattern are electrically connected with each other. The present invention further relates to a touch screen.

Abstract: A high voltage high current transmission line for transmitting high voltage high current energy in the 10 kV and 200,000 A range from a power source to an end item to which the power is delivered. The high voltage high current transmission line includes two generally parallel configured conductive plates with an overlapping dielectric layering configuration. Each of the conductive plates are encompassed by a first dielectric material, both of the conductive plates encompassed by a second dielectric material, and the conductive plates are encompassed by an outer dielectric sheathing. The dielectric layering configuration may also include a dielectric material applied to the edges of the conductive plates. At one or both ends of the high voltage high current transmission line, a plug assembly may be provided for connecting to the power source and/or the discharge device.

Abstract: An interconnector is discussed, which includes a conductive metal of a band shape including a first surface and a second surface opposite the first surface; and a solder coated on the first surface, wherein the first surface of the conductive metal includes at least a flattened peak extending in a length direction of the conductive metal, the flattened peak including an inclined portion and a flat portion extending in a width direction of the conductive metal, and wherein a length of the inclined portion is less than a length of the flat portion in the width direction of the conductive metal.

Abstract: According to one embodiment, a line is provided. The line includes a center conductor and a covering portion. The covering portion covers the center conductor. The covering portion includes at least one layer that is made of a soft magnetic material and is thinner than a skin depth at a frequency where supply of a signal or power is performed.

Abstract: A nano electrode according to the present invention includes a main body having a protruded probe, a nano wire attached to the probe, and an insulating film including an opening unit which surrounds the nano wire and makes an upper surface of the nano wire to be visible.

Abstract: Disclosed herein are an equal distribution type connecting member for connecting two or more devices to an external circuit, the connection member including a first connection circuit connected to a connection point of the external circuit, and second connection circuits sequentially connected to the first connection circuit, the second connection circuits being constructed in a structure in which the sectional areas of the second connection circuits are increased and/or the lengths of the second connection circuits are decreased with the increase of the connection distance between the connection point of the external circuit and connection points of the devices, thereby equalizing internal resistances between the connection point of the external circuit and the connection points of the devices, and a middle- or large-sized battery pack including the same.

Abstract: The present invention relates to freestanding carbon nanotube paper comprising purified carbon nanotubes, where the purified carbon nanotubes form the freestanding carbon nanotube paper and carbon microparticles embedded in and/or present on a surface of the carbon nanotube paper. The invention also relates to a lithium ion battery, capacitor, supercapacitor, battery/capacitor, and fuel cell containing the freestanding carbon nanotube paper as an electrode. Also disclosed is a method of making a freestanding carbon nanotube paper. This method involves providing purified carbon nanotubes, contacting the purified carbon nanotubes with an organic solvent under conditions effective to form a dispersion comprising the purified carbon nanotubes. The dispersion is formed into a carbon nanotube paper and carbon microparticles are incorporated with the purified carbon nanotubes.

Abstract: A low resistance pathway includes a flexible member, a surface interfacing the flexible member, a sealing feature, and a fastener. The sealing feature forms an interior edge of at least one of the flexible member and the surface. The fastener compresses the flexible member to contact the surface.

Abstract: Certain example embodiments of this invention relate to the use of graphene as a transparent conductive coating (TCC). A substrate having a surface to be coated is provided. A self-assembled monolayer (SAM) template is disposed on the surface to be coated. A precursor comprising a precursor molecule is provided, with the precursor molecule being a polycyclic aromatic hydrocarbon (PAH) and discotic molecule. The precursor is dissolved to form a solution. The solution is applied to the substrate having the SAM template disposed thereon. The precursor molecule is photochemically attached to the SAM template. The substrate is heated to at least 450 degrees C. to form a graphene-inclusive film. Advantageously, the graphene-inclusive film may be provided directly on the substrate, e.g., without the need for a liftoff process.

Abstract: An aluminium-based conductive material used in a driving part of robots or various devices and used, for example, in a wiring that is loaded with cyclic bending, as well as an electric wire and a cable using the same, contains 0.1 to 1.0 mass % of scandium and further contains, as a rest part, aluminium and unavoidable impure substances and is formed of a metal texture 10 having crystal grains 11 with an average grain size of 2 ?m or less and aluminium-scandium series nanoprecipitates generated in a grain boundary 12 of the crystal grains 11. Further, it is preferable that the metal texture 10 contains the crystal grains 11 of 1 ?m or less at a cross sectional ratio of 15% or more.

Abstract: The conductive material according to the present invention includes a binder resin and conductive particles each having a solder at a conductive surface, the binder resin includes a curable compound capable of being cured by heating, and a thermal curing agent, and when the binder resin and the solder in the conductive particle are each heated at a temperature rising rate of 10° C./minute to perform differential scanning calorimetry, an exothermic peak top temperature in curing of the binder resin is lower than an endothermic peak top temperature in melting of the solder.

Abstract: A pattern of electrically connected micro-wires comprises a plurality of micro-wires arranged in an intersecting pattern forming intersection corners. A portion of a first micro-wire is coincident with a portion of a second micro-wire to form a coincident portion such that the coincident portion is non-visually resolvable by the human visual system and the coincident portion has a length greater than the sum of the widths of the first and second micro-wires or has at least one rounded intersection corner.

Abstract: Disclosed herein are a lead pin for a printed circuit board and a printed circuit board using the same. The lead pin for a printed circuit board includes: a connection pin; and a pin head part formed at one end portion of the connection pin and including a protrusion, the diameter thereof being formed to be increasingly small based on a surface contacting the connection pin and the outer peripheral surface thereof being provided with a protrusion-shaped or depression-shaped band, whereby it forms a protrusion-shaped band or a depression-shaped band on the pin head part of the lead pin to increase a contacting area with the solder, thereby improving an adhesion between the lead pin and the printed circuit board.

Abstract: A plate-like electric conductor for a busbar having excellent electric conductivity, strength and bendability, and a busbar formed therefrom. The electric conductor formed from an aluminum alloy plate having a thickness of 0.5-12 mm is obtained by subjecting an aluminum alloy consisting essentially of Fe: 0.05-2.0%; Si: 0.05-0.6%; Cu: 0.01-0.35%; by mass, and the balance comprising Al and inevitable impurities to a hot rolling process. The electric conductor has the electric conductivity of 55-60% IACS, tensile strength not lower than 170 MPa and yield strength not lower than 155 MPa, in the as-rolled state at the room temperature, and does not suffer from cracking upon bending by 90° with an inner bending radius equal to its thickness, while having the electric conductivity of 55-60% IACS, tensile strength not lower than 160 MPa, and yield strength not lower than 145 MPa, after a heat treatment at 140-160° C. for not longer than 1,000 hours.

Abstract: A method of manufacturing a non-firing type electrode comprising steps of: (A) applying a conductive paste on a substrate; (B) heating the applied conductive paste at 50 to 350° C. to form an electrode; and (C) pressing the electrode at 10 to 1000 kN/m2 of plane surface pressure or at 5 to 300 kN/m of linear pressure.

Abstract: Provided are a transparent conductive film, a method of manufacturing the same, and a touch panel having the same, the transparent conductive film including: a transparent film; and a conductive layer formed on one surface of the transparent film, wherein the conductive layer includes a linear interconnecting structure layer and a PEDOT(poly-3,4-ethylene dioxythiophene)-PSS(polystyrenesulfonate) layer. In accordance with the present invention, it can be provided with the conductive film, which has improved haze and non-resistant properties, excellent flexibility, and low costs by economic processes, even without a structural change of the transparent conductive film, and the touch panel and the display using the same.

Abstract: Provided are conducting polymer nanofibers, methods of making conducting polymer nanofibers, and uses thereof. The conducting polymer nanofibers can be formed by, for example, electrospinning, force spinning, and centrifugal spinning using a spinning dope. The conducting polymer nanofibers can be used in devices, such as a radiation detecting device.