Abstract: An electrode for intravascular medical applications for neuromodulation and/or nerve stimulation and/or neurological signal detection, wherein the electrode can be compressed and expanded in order to insert same into a hollow organ of a body and is or can be coupled to a current supply. A compressible and expandable lattice structure is provided, which has cells formed from lattice webs and is or can be coupled to the current supply, the lattice structure being obtained at least partially by physical vapor deposition.

Abstract: Certain example embodiments of this invention relate to the use of graphene as a transparent conductive coating (TCC). In certain example embodiments, graphene thin films grown on large areas hetero-epitaxially, e.g., on a catalyst thin film, from a hydrocarbon gas (such as, for example, C2H2, CH4, or the like). The graphene thin films of certain example embodiments may be doped or undoped. In certain example embodiments, graphene thin films, once formed, may be lifted off of their carrier substrates and transferred to receiving substrates, e.g., for inclusion in an intermediate or final product. Graphene grown, lifted, and transferred in this way may exhibit low sheet resistances (e.g., less than 150 ohms/square and lower when doped) and high transmission values (e.g., at least in the visible and infrared spectra).

Abstract: Methods for forming a flexible, permeable, electrically conductive and substantially transparent textile utilizing vapor phase deposition are described. A number of applications of the electrically conductive textile are discussed.

Abstract: A power cord (14) for an electronic product (10) such as a set-top box or the like provides a reduced thermal resistance path from a heat generating portion of the set-top to the ambient air to improve heat dissipation. In a preferred embodiment, the power cord includes a ground wire having a size in excess of that necessary to carry ground current to as to increase heat conduction from the ground plane of the set-top box circuit board.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: The present invention relates to an electrode comprising an auxiliary electrode comprising a conductive pattern and a main electrode provided on at least a portion of the auxiliary electrode to be electrically connected to the auxiliary electrode, and a manufacturing method thereof.

Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

Abstract: A spring contact for a sliding contact is provided having a terminal region and at least one contact region including an elongated spring element and a precious metal. The spring contact includes a conductive spring support and at least one contact piece. The spring support has essentially symmetrical rigidity in some regions in a plane perpendicular to the elongated extension of the spring support, and is made of a conductive material essentially free of precious metal. The contact piece(s) is/are conductively connected to the spring support, and has at least one surface to form the sliding contact. A surface of the contact piece(s) is made of a precious metal or a precious metal alloy. A slip ring transmitter for a motor or dynamo is also provided having a spring contact of this type, wherein the surface of the contact piece(s) touch(es) against the slip ring(s) in a conductive manner.

Abstract: An improved substrate is disclosed for an electrode of an electrochemical cell. The improved substrate includes a core material surrounded by a coating. The coating is amorphous such that the coating includes substantially no grain boundaries. The core material may be one of lead, fiber glass, and titanium. The coating may be one of lead, lead-dioxide, titanium nitride, and titanium dioxide. Further, an intermediate adhesion promoter surrounds the core material to enhance adhesion between the coating and the core material.

Abstract: The CP555 Super Integrated Circuit Chip has a ceramic package casing made from (B4-C) Boron Carbide: a non-conducting ceramic material. The IC is connected to connector pins by microcircuits and a custom formulated bond wire. The CP555 Integrated Circuit's ceramic Boron Carbide (B4-C) outer package casing, Heterodiamond substrates and dielectric components allows these integrated circuits to reduce electro-migration to a minimum, produce superior radiation hardness, heat resistance, electromagnetic shielding, and resistance to damage from harsh elements and environments. The CP555 Integrated Circuit can be used as a CMOS, PIC or DIE microcontroller circuit or computer processor (CPU). FIG. 1, shows the integrated circuit package 50, the outer package casing 138 also in FIG. 1, top left.

Abstract: The present invention provides a method and so on for manufacturing an electrode collector which enables rapid charge and discharge and can be used in battery or capacitor electrodes. The invention is directed to an electrode collector that has fine titanium oxide particles having a large specific surface and surface-modified by means of an organic liquid metal such as vanadium, and to a method for manufacturing the same. This electrode collector can implement a collector with excellent rapid charge and discharge for use in batteries and capacitors. The fine titanium oxide particles may have an anatase-type crystal structure. These electrode collectors can be used as electrodes, lithium-ion batteries and capacitors.

Abstract: An aluminum electric wire includes an annealing conductor that is made up of elemental wires made of an aluminum alloy containing 0.90-1.20 mass % Fe, 0.10-0.25 mass % Mg, 0.01-0.05 mass % Ti, 0.0005-0.0025 mass % B, and the balance being Al and has a tensile strength of 110 MPa or more, a breaking elongation of 15% or more, and an electric conductivity of 58% IACS or more, and an insulating material covering the conductor. The wire is produced by casting an aluminum alloy prepared by rapidly solidifying a molten aluminum alloy having the above composition, producing the wires by subjecting the alloy to plasticity processing, producing the conductor by bunching the wires, subjecting the wires or the conductor to annealing at 250° C. or higher, and then covering the conductor with the insulator.

Abstract: A junction box for connecting a solar cell, having a housing; a diode; and a conductive foil strip electrical contact. The housing includes a base plate with a receiving passageway that extends along a slide direction. The receiving passageway opens along an upper side of the base plate through a receiving slot.

Abstract: The present invention provides a method for fabricating a carbon nanotube-loaded electrode enabling that hybrid carbon nanotubes comprising dendrimer-encapsulated metal nanoparticles covalently immobilized on carbon nanotubes via a first covalent bond are made and such hybrid carbon nanotubes are then covalently immobilized on a metal electrode coated with a self-assembled monolayer via a second covalent bond. Also provided is a carbon nanotube-loaded electrode made by the method. The electrode thus made possesses high durability, reactivity and stability.

Abstract: Provided is an electroconductive polymer composition with a good film forming property. Also, provided is an clectroconductive polymer material with a high electroconductivity and a high transparency as well as an electroconductive substrate having the electroconductive polymer material on a substrate, and an electrode. Further, provided is an electronic device having the electrode as well as a solid electrolytic capacitor with a high capacitance and a low ESR. Disclosed is an electroconductive polymer composition, containing an electroconductive polymer in which a dopant is doped, a water-soluble polymer resin, and a solvent which contains water and an organic solvent whose dielectric constant is higher than that of water.

Abstract: A transparent conductor includes a film of a conductive ceramic. Additives are at least partially incorporated into the film. The additives are at least one of electrically conductive and semiconducting, and at least one of the additives has an aspect ratio of at least 3.

Abstract: A busbar of the present invention increases yield per metal material in comparison to plate-shaped bus bars, enables provision of protrusions on a member located inside relative to a conductor, and enables formation of the busbar in a bent shape. The busbar of the present invention is provided with a busbar insulator (22), a busbar conductor (23), a busbar insulator (24), a busbar conductor (25), and a busbar insulator (26) formed outside of a busbar center conductor (21). These conductors and insulators are arranged alternately from the inner side towards the outer side in a radial direction (R) that intersects at right angles with the axial direction (A) of the bus bar. The busbar conductors (23, 25) are provided with openings (23o, 25o) along the whole length in the axial direction (A) thereof.

Abstract: A method of making carbon nanotube contact structures on an electronic device includes growing a plurality of carbon nanotube columns on a mandrel. Electrically-conductive adhesive is applied to ends of the columns distal from the mandrel, and the columns are transferred to the electronic device. An electrically-conductive material is deposited onto some or all of the columns. The mandrel can be reused to grow a second plurality of carbon nanotube columns.

Abstract: A component includes a component body and a contact-connection element composed of sheet metal having a contact region, which has an outer contour line and at least one hole. The contact region is arranged on a side of the component body having a side edge and the outer contour line has straight regions running along straight regions of the side edge. The straight regions of the outer contour line are connected by rounded corners.

Abstract: The switch includes a printed circuit, of generally plane shape, and comprising a first face bearing a first contact pad, a second face, opposite the first, bearing a second contact pad, and a through-orifice allowing access between the first face and the second face. The switch also includes a conductor, having a first part, which cooperates with the first contact pad, and a second part, which extends between a first end, fixed to the first part, and a free second end, passing through the orifice. The second part is elastically deformable between a rest position, in which its second end cooperates with the second contact pad, and a stressed position, in which its second end is moved away from the second contact pad.

Abstract: An object is to provide a fixture for a component to be mounted on a circuit board which is easily manufactured and can exhibit good solderability and high whisker resistance. In a fixture which includes a solder joint plate part 11 that can be fixed on a surface of a circuit board by soldering using solder cream, and a component fixing part 12 that can be fixed to a component configured to be mounted on the circuit board, and in which Sn plating is performed at least on a solder joint surface of the solder joint plate part, the solder joint plate part 11 is divided into a plurality of long-plate-like solder joint pieces 13, and on both sides of each of the long-plate-like solder joint pieces 13, wing-like joint feet are provided to protrude through bent flexible parts 16, and the lower surface of each of the joint feet 15 becomes a solder joint surface 18 to be joined with the surface of the circuit board by solder cream.

Abstract: A conductive wire includes a metallic wire substrate having a diameter and a surface, and a coating material having a plurality of carbon nanotubes dispersed therein. The coating material is operable to adhere a portion of the carbon nanotubes to the surface of the wire. The coating material has higher specific conductivity than the metallic wire substrate and also has a low contact resistance with the metallic wire substrate.

Abstract: A sputtering target which is composed of a sintered body of an oxide which contains at least indium, tin, and zinc and includes a spinel structure compound of Zn2SnO4 and a bixbyite structure compound of In2O3. A sputtering target includes indium, tin, zinc, and oxygen with only a peak ascribed to a bixbyite structure compound being substantially observed by X-ray diffraction (XRD).

Abstract: According to one embodiment, a lead frame includes a die pad having a mounting surface on which a semiconductor chip is mounted, plural leads having inner leads and outer leads, and a connecting member that extends from the die pad to both ends of a plurality of leads and connects the die pad and the plurality leads so that the ends of the inner leads are positioned above of the mounting surface.

Abstract: An electrode lead connection body includes a first member that includes a same material as the positive electrode lead and is configured to be connected the positive electrode lead, a second member that includes a same material as the negative electrode lead and is configured to be connected the negative electrode lead, the first and second members being joined to each other at a portion excluding a positive electrode joint as a portion to be joined to the positive electrode lead and a negative electrode joint as a portion to be joined to the negative electrode lead, and an insulating material at a position between the first and second members and near a joint portion to join the first and second members so as to prevent a contact between the first and second members.

Abstract: An Au bonding wire for semiconductor device, comprising a wire-shaped Au alloy material consisting of: 3-15 mass ppm of Be, 3-40 mass ppm of Ca, 3-20 mass ppm of La, 3-20 mass ppm of at least one functional element selected from the group of Ce, Eu, Mg, and Si, and the remainder of Au, wherein the diameter of said Au alloy bonding wire is less than 23 microns, wherein said bonding wire has improved roundness of compressed bonded ball and improved fracture stress.

Abstract: A method is provided for creating an electrode node array device. First and second conductors are stamped from a stock sheet. Each of the conductors has a plurality of raised protrusions. The protrusions are interleaved in a manner in which in both directions of the array, a raised protrusion of one conductor alternates with a raised protrusion of the other conductor. The method includes assembling the device in stages on a vacuum apparatus having guide pins that interact with guide holes on laminate sheets that are applied to both sides of the first and second conductors.

Abstract: Provided is an electrical part, a nonaqueous electrolyte cell, and a lead wire and a sealable container for use therein, with which the adhesive property and sealing performance in an initial state and in an electrolyte-contacting state are enhanced. An electrical part includes a sealable container that includes a metal layer and a lead conductor that extends from inside of the sealable container to outside of the sealable container, the sealable container and the lead conductor being heat-sealed in a seal part. At least in part of the seal part, a thermal adhesive layer containing aluminum polyphosphate is provided in a portion between the metal layer and the lead conductor so as to be in contact with the lead conductor.

Abstract: A current lead with a configuration to reduce heat load transfer in an alternating electrical current (AC) environment is disclosed. The current lead may comprise a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the current lead. A temperature gradient a may be exhibited along a length of the current lead.

Abstract: The invention relates to an electrical wire and an electrical wire with a terminal capable of diminishing the adjustment of a crimping height. There is provided an electrical wire 1 including a conductor part 11 that is made of a precipitation strengthened copper alloy having a cross-sectional area of 0.13 sq in the ISO 6722 standard and is compressed, wherein the conductor part 11 has a rate of elongation of 7% or more, and a tensile strength of 500 MPa or more. In addition, the electrical conductivity of the conductor part is 70% IACS or more.

Abstract: A foil conductor for flat cells includes a contact zone for contact with further cells or busbars, an adhesion zone for adhesive bonding with a packaging foil of a cell, and a connection zone for connection to an electrode foil within the cell. At least two of the zones have a surface composition differing from each other.

Abstract: Metal nanowires with high linearity can be produced using metal salts at a relatively low temperature. A transparent conductive film can be formed using the metal nanowires. Particularly, the transparent conductive film has high transmittance, low sheet resistance, and good thermal, chemical and mechanical stability. The transparent conductive film has a high electrical conductivity due to the high linearity of the metal nanowires. The metal nanowires take up 5% or less of the volume of the transparent conductive film, ensuring high transmittance of the transparent conductive film. Furthermore, the metal nanowires are useful as replacements for existing conductive materials, such as ITO, conductive polymers, carbon nanotubes and graphene. The metal nanowires can be applied to flexible substrates and other various substrates due to their good adhesion and high applicability to the substrates. Moreover, the metal nanowires can find application in various fields, such as displays and solar cell devices.

Abstract: An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering.

Abstract: A composite material includes a metal matrix of a metal and a reducing agent. The reducing agent is dispersed in the metal matrix and is capable of reducing an oxide of the metal at room temperature.

Abstract: A method for making a conductive film includes: providing a carbon nanotube film defining a plurality of holes therein; attaching the carbon nanotube film on a substrate; adjusting a temperature of the carbon nanotube film in a range from about 7° C. to about 9° C.; dropping and rubbing a nanoparticle aqueous solution in the carbon nanotube film, the nanoparticles aqueous solution containing a plurality of nanoparticles; and adjusting the temperature of the carbon nanotube film in a range from about 24° C. to about 26° C. and drying the carbon nanotube film to obtain the conductive film on the substrate.

Abstract: A metal oxide bilayer second electrode for a MIM DRAM capacitor is formed wherein the layer of the electrode that is in contact with the dielectric layer (i.e. bottom layer) has a desired composition and crystal structure. An example is crystalline MoO2 if the dielectric layer is TiO2 in the rutile phase. The other component of the bilayer (i.e. top layer) is a sub-oxide of the same material as the bottom layer. The top layer serves to protect the bottom layer from oxidation during subsequent PMA or other DRAM fabrication steps by reacting with any oxygen species before they can reach the bottom layer of the bilayer second electrode.

Abstract: An electrode active material including a first layer formed on a surface of activated carbon and having a porous structure, and a second layer formed on the first layer and having polar groups, a method for preparing the same, and an electrochemical capacitor including an electrode using the same. There can be provided an electrode active material for an electrochemical capacitor having improved performances in which capacitance per unit weight is large, inner resistance is small, and performance is not largely deteriorated even at high current. Furthermore, high-priced activated carbon mainly dependent on imports can be substituted with low-priced activated carbon prepared by double surface treatment, and thus superior economical effects can be obtained.

Abstract: In some embodiments, the present invention provides transparent electrodes that comprise: (1) a grid structure; and (2) a graphene film associated with the grid structure. In additional embodiments, the transparent electrodes of the present invention further comprise a substrate, such as glass. Additional embodiments of the present invention pertain to methods of making the above-described transparent electrodes. Such methods generally comprise: (1) providing a grid structure; (2) providing a graphene film; and (3) associating the graphene film with the grid structure. In further embodiments, the methods of the present invention also comprise associating the transparent electrode with a substrate.

Abstract: A three-dimensional crossbar array may include a metal layer, and an insulator layer disposed adjacent the metal layer. A trench may be formed in the metal layer to create sections in the metal layer, and a portion of the trench may include an insulator. A hole may be formed in the trench and contact a section of the metal layer. The hole may define a via. A contact region between the via and the section of the metal layer may define a crossbar array.

Abstract: An electrically conductive spring having first and second coils defining first and second electrical pathways for completing an electric circuit between two components which may move relative to each other. In one embodiment, the spring is a double start helical spring with first and second coils extending between respective, electrically insulated ends with the coils extending in alternating, spaced relation to each other.

Abstract: A multilayer elastic tube having electric property, the multilayer elastic tube including: an elastic core having a tube shape; and an elastic rubber coating layer adhering to an inner surface of the core, the elastic rubber coating layer having at least one electric property of electric conductivity, piezoelectricity, and electric wave absorptiveness. The elastic rubber coating layer is formed by curing liquid elastic rubber having the electric property and adhering to the inner surface of the core, and has a closed loop shape to improve the electric property.

Abstract: In an electrode according to the present invention including a three-dimensional network aluminum porous body as a base material, the electrode is a sheet-shaped electrode, and a cell of the three-dimensional network aluminum porous body has an elliptic shape having a minor axis in the thickness direction of the electrode in a cross section parallel to the longitudinal direction and thickness direction of the electrode, and a cell of the three-dimensional network aluminum porous body has an elliptic shape having a minor axis in the thickness direction of the electrode in a cross section parallel to the width direction and thickness direction of the electrode. The electrode is preferably obtained by subjecting the three-dimensional network aluminum porous body to at least a current collecting lead welding step, an active material filling step and a compressing step.

Abstract: A trackable guidewire is presented. The guidewire includes a plurality of wires arranged in a predetermined pattern to form a body of the guidewire, where the plurality of wires is configured to simultaneously provide electrical conductivity of signals and mechanical strength. A guidewire assembly is also presented, where the guidewire assembly includes a guidewire, where the guidewire includes a plurality of wires arranged in a predetermined pattern to form a body of the guidewire, and the plurality of wires is configured to simultaneously provide electrical conductivity of signals and mechanical strength, and one or more sensing devices, where the one or more sensing devices are operatively coupled to the guidewire. Methods of making the guidewire and the guidewire assembly are also contemplated in conjunction with the present technique.

Abstract: A lead frame for attaching leads to a hermetic feedthrough includes a cross-member and a plurality of leads. Each of the leads has an elongate body extending from the cross-member in a direction substantially parallel with one another, and each lead includes at least one of a notch on an end thereof opposite to the cross-member or a hole proximate to the end.

Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

Abstract: A magnetic element including: a first magnetic core including a coil which is wound by a predetermined number of turns; a second magnetic core which includes the coil in the inside thereof and which is combined along the outer circumference of the first magnetic core; and a metal terminal which connects the coil and a mounting substrate, wherein the metal terminal includes a fixing portion for fixing the second magnetic core in a state of combining the first magnetic core and the second magnetic core.

Abstract: A thermal and electrical conducting apparatus includes a few-layer graphene film having a thickness D where D?1.5 nm and a plurality of carbon nanotubes crystallographically aligned with the few-layer graphene film.

Abstract: An apparatus, such as an electrical distribution system, is provided. The apparatus can include a first conductor and a second conductor. Multiple conduction paths can form parallel electrical connections along a connection span between the first and second conductors, with each of the conduction paths having a respectively similar nominal electrical resistance. The first and second conductors can have respective cross-sectional areas that decrease in opposing directions along said connection span.

Abstract: A high frequency cable includes: a central conductor made from aluminum or an aluminum alloy; a covering layer made from copper covering the central conductor, and having a fiber-like structure in a longitudinal direction; and an intermetallic compound layer formed between the central conductor and the covering layer and having greater volume resistivity than the covering layer, wherein a cross-sectional area of the covering layer is 15% or less of an entire cross-sectional area including the central conductor, the intermetallic compound layer and the covering layer.

Abstract: This invention relates to methods of generating NP gallium nitride (GaN) across large areas (>1 cm2) with controlled pore diameters, pore density, and porosity. Also disclosed are methods of generating novel optoelectronic devices based on porous GaN. Additionally a layer transfer scheme to separate and create free-standing crystalline GaN thin layers is disclosed that enables a new device manufacturing paradigm involving substrate recycling. Other disclosed embodiments of this invention relate to fabrication of GaN based nanocrystals and the use of NP GaN electrodes for electrolysis, water splitting, or photosynthetic process applications.