Abstract: An electronic appliance includes a circuit board mounted with an electronic-circuit component. The circuit board is covered with a shield, and a metallic heat-dissipating member is arranged on the electronic-circuit component. The shield is grounded on the circuit board, and arranged such that at least one of the surfaces is in the vicinity of the heat-dissipating member. The heat-dissipating member is grounded on the circuit board by a ground member, and at the periphery of the ground member, magnetic members are arranged.

Abstract: A heat dissipation arrangement for communication chassis includes a chassis body defining an inner receiving space and being divided into at least one heat receiving portion and at least one heat dissipation portion; a first heat pipe set arranged in the receiving space to connect the heat receiving portion to the heat dissipation portion, so that heat absorbed by the heat receiving portion can be quickly transferred via the first heat pipe set to the heat dissipation portion; and at least one thermal module including a plurality of radiating fins and at least one second heat pipe, which is connected to the heat dissipation portion and extended through the radiating fins, allowing part of the heat transferred to the heat dissipation portion to be transferred to the radiating fins. The thermal module provides additional heat dissipating area, so that the communication chassis can provide excellent heat dissipation effect.

Abstract: A heat dissipation device comprises a heat spreader and heat pipe soldered thereon via a heat conducting material. The heat spreader defines a plurality of cavities in an inner side surface thereof, the heat conducting material is received in the cavities, and the heat pipe contacts and is soldered to the inner side surface of the heat spreader.

Abstract: An electronic apparatus includes a PCB with a heat generating electronic component disposed thereon, a heat sink, and a mounting device for mounting the heat sink onto the heat generating electronic component. The mounting device includes a mounting frame and a wire clip. The mounting frame surrounds the heat sink, and includes two first mounting arms and two second mounting arms disposed above the first mounting arms. The first mounting arms abut on the PCB. A pair of engaging wings are formed on the second mounting arms. The wire clip includes a pivot axle pivotably attached to the mounting frame and two resilient arms at opposite sides of the mounting frame. The resilient arms abut against the heat sink and engage with the engaging wings, thereby exerting a resilient force on the heat sink toward the heat generating electronic component.

Abstract: A blind (10) for a projector includes a bracket (20) mounted to the projector, and a folded fin (30) fixed on the bracket and covering a hot air vent of the projector. The folded fin includes a plurality of parallel fins (32) and a plurality of upper and lower tabs (34, 36) interconnecting the fins. Each of the fins defines an angle of 135 degrees with a plane defined by the lower tabs. Furthermore, a projection of each of the fins on the plane defined by the lower tabs overlaps a part of a corresponding adjacent fin. Thus, the blind can prevent a light leakage from the projector, while allow a heated airflow to be expelled out of the projector simultaneously.

Abstract: A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.

Abstract: A heat sink for cooling a component is disclosed. A medium flows around the heat sink by at least sectional guidance of a main flow and a secondary flow of the medium, the main flow being separated from the secondary flow up to a constriction. After the constriction the secondary flow merges with the main flow.

Abstract: A heat dissipation device includes a base, a first heat pipe, a first heat sink, a second heat pipe, a thermoelectric cooler and a second heat sink. The first heat pipe includes a first end and a second end. The first end of the first heat pipe is connected to the base. The second end of the first heat pipe is connected to a bottom of the first heat sink. The second heat pipe includes a first end and a second end. The first end of the second heat pipe is connected to the base. The second end of the second heat pipe is connected to a top end of the thermoelectric cooler. The second heat sink is mounted on a bottom of the thermoelectric cooler and located at a side of the first heat sink. The thermoelectric cooler spaces apart from the heat generating member. As such, the water generated by the thermoelectric cooler during a cooling process won't spread to the heat generating member and a short circuit of the heat generating member can be avoided.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: A heat spreader is provided for use with a memory module. The memory module has at least a first side with a first plurality of integrated circuits thereon. The heat spreader includes a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side, and to be substantially thermally isolated from at least one integrated circuit on the first side. The heat spreader further includes a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment.

Abstract: A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is polyurethane foam.

Abstract: A baffle has a slot, with the slot positioned between first and second adjacent components when the baffle is installed above the components. A pair of heatsinks are inserted into the slot, with at least one heatsink having a heat dissipating portion that remains above the slot after insertion into the slot. A spring is inserted into the slot between the pair of heatsinks.

Abstract: A heat dissipating apparatus includes a heat sink, a blower, and a fan. The blower and the fan can be mounted together via a connection element. The heat sink defines an accommodating space. The blower and the fan can be positioned to the heat sink via the connection element, with the blower being accommodated in the accommodating space. The heat dissipating apparatus can achieve an optimal heat dissipating effect.

Abstract: An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris.

Abstract: A heat sink assembly includes an air duct, a heat sink and a fan. The air duct defines an air guiding channel therein. The heat sink is configured to contact a heat source to dissipate heat from a heat source. The heat sink includes a plurality of heat pipes. The heat sink is placed on one side of the air guiding channel, and the heat pipes contacts the air duct to transmit heat to the air duct. The fan is placed on the other side of the air guiding channel to communicate with the heat sink via the air duct. The fan forces air to flow through the air guiding channel to the heat sink to dissipate heat on the air duct and the heat sink.

Abstract: An electrical enclosure system for transferring heat from a closed environment, includes an electrical device having a heat-generating part, and a polymer-based ventless housing for protecting the electrical device from environmental contaminants. The ventless housing fully encloses the electrical device and includes a base layer forming an impact-resistant portion of the ventless housing. The base layer includes one or more open areas in close proximity to the heat-generating part. The ventless housing further includes an integrated thermally conductive layer that forms a heat-flow path for conducting heat away from the heat-generating part towards an exterior environment. The integrated thermally conductive layer is molded around the base layer such that portions of the integrated thermally conductive layer cover the open areas of the base layer.

Abstract: Disclosed is a design for a computer enclosure. Heat is passed from the heat-generating components directly to a non-conductive liquid coolant. Some of the heat is expelled directly to the environment via a heatsink “chimney”, and some is expelled with the help of a thermoelectric heat pump.

Abstract: The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat sink positioned in thermal contact with the heat sink and a circuit board component on a wiring board, the auxiliary heat sink having a plurality of slots located in a central portion of the auxiliary heat sink, wherein the auxiliary heat sink is both mechanically compliant and thermally conductive with both the heat sink and the circuit board component.

Abstract: An improved system for cooling a power supply of a welding or plasma cutting system, and an improved configuration of a power supply. The system cools achieves the improvement in configuration and cooling by mounting electrical components to a circuit board and then to a heat sink. Electrical components are also mounted to a common panel that improves the circulation of air. A central panel supporting the power supply heat sink and components allows a smaller and more compact design while maintaining proper temperatures. Electromagnet cooling is improved by modifying electromagnetic cores to conduct heat to the heat sink, and by the use of thermally conducting polymers.

Abstract: A heat dissipation apparatus includes a heat sink and a fan. The heat sink defines a recessed space at a center of a top end thereof, and an engaging groove in an inner circumference of the top end of the heat sink surrounding and communicating with the space. The fan includes a frame and an impeller assembled to the frame. A plurality of legs extends downwardly from the frame. Each of the legs includes a hook at a free end thereof. The hooks of the legs engage in the engaging groove of the heat sink for securely mounting the fan in the recessed space of the heat sink. Heat pipes extend through the heat sink and connect with a base.

Abstract: An electronic control apparatus can be reduced in size and cost by eliminating certain parts such as a power board, etc. The apparatus includes a housing, a heat sink attached to one end of the housing, semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements. The heat sink is composed of a heat sink main body, and an anodized aluminum film formed at least on a surface of the heat sink main body at a side at which the power device is mounted thereon, and the heat sink main body has outer peripheral end faces arranged in opposition to inner wall surfaces of an opening portion of the housing.

Abstract: Systems and methods for printed board assembly isolated heat exchange are provided. In one embodiment, a printed board assembly comprises: at least one electrical power layer; at least one electrical ground layer; a first signal layer having a first signal routing area providing electrical trace connections for signals and a first heat exchange chassis fill conductor area located adjacent to a periphery of the first signal routing area; at least one thermal interface coupled to a chassis for conducting heat from the printed board assembly to the chassis; and at least one via conductively coupling the first heat exchange chassis fill conductor area to the at least one thermal interface.

Abstract: A printed circuit board employing a heat sink retaining apparatus and method of use is disclosed. In one form of the disclosure, a heat sink apparatus can include a heat sink operable to be coupled to a first portion of a printed circuit board having an integrated circuit, and a retaining mechanism operably coupled along a first surface of the heat sink. The retaining mechanism can be coupled to a second portion of the printed circuit board to produce a tension between the first surface of the heat sink and the second portion of the printed circuit board.

Abstract: A cooling mechanism to dissipate thermal energy generated by the heat generating components of a graphics card assembly. An apparatus includes a circuit board having at least one heat generating component affixed thereto. The apparatus also includes a fan and carrier therefor including a heat sink plate having a portion thermally coupled to the heat generating component. The heat sink plate includes a means for forming at least one slot proximate the portion. The fan is adapted to direct airflow cross the portion. The thermal energy generated by the heat generating component is transferred to the fan carrier and ultimately removed from the fan carrier by the airflow. The airflow inducts a secondary airflow drawn through the slot during operation thereby to enhance transfer of the thermal energy from the heat generating component.

Abstract: A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported.

Abstract: A heat dissipation device for dissipating heat generated by an electronic device on a printed circuit board includes a heat sink and a plurality of mounting devices. A plurality of retaining pillars are secured on the printed circuit board at positions around the electronic device. Each of the mounting devices includes a fixing portion connecting with the heat sink, a mounting portion extending from the fixing portion and a locating portion extending from the mounting portion to a position below the mounting portion. The retaining pillars on the printed circuit board extend through the locating portions and abut against bottoms of the mounting portions to accurately position the heat dissipation device on the electronic device on the circuit board before fasteners are brought to extend through the mounting portions to screw in the retaining pillars.

Abstract: A circuit module includes: a thermally conductive board forming a part of a housing; a circuit board disposed above the thermally conductive board; a semiconductor chip connected to a plurality of electrode pads on a upper surface of the circuit board through solder; a heat sink connected to a upper surface of the semiconductor chip; a thermally conductive member thermally connecting the thermally conductive board to the semiconductor chip; and a plurality of fasteners passing through the thickness of the circuit board in an area surrounding the semiconductor chip to attach the heat sink to the thermally conductive board.

Abstract: A semiconductor device comprises: a semiconductor element; a mounting substrate with the semiconductor element mounted thereon; a first high thermal conductivity member formed on a surface of the mounting substrate; and a first cooling member thermally connected to at least a part of the first high thermal conductivity member. The first high thermal conductivity member is thermally connected to the semiconductor element, and the first high thermal conductivity member has an outer edge which is located outside an outer edge of the semiconductor element.

Abstract: A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink.

Abstract: A personal computer has a central air plenum straddled by opposed drive bays, and memory modules in the plenum are covered by a shroud that increases the air flow over the memory modules. The plenum establishes a first pathway for air flow and parallel to the plenum is a second pathway for air flow past cards such as graphics and network cards.

Abstract: A securing device includes a securing member defining a securing hole, and a fastener. The fastener includes a spring, and a bolt having a main portion, a bottom fixing portion, and a top head portion. The securing hole includes an inner portion and an outer portion extending horizontally from the inner portion to an outside. A width of the outer portion is smaller than the fixing portion and larger than the main portion. The main portion enters into the inner portion through the outer portion. The fixing portion abuts against a bottom of the securing member. The spring is compressed between a top of the securing member and the head portion. A concave is depressed from the securing member and surrounds the inner portion. A lower portion of the spring is fittingly received in the concave.

Abstract: An electronic device including a base and a pluggable unit is provided. The base includes a first heat sink having a first heat-transfer contacting surface. The pluggable unit includes a second heat sink and a heat source. The second heat sink has a second heat-transfer contacting surface. When the pluggable unit is plugged in the base, the first heat-transfer contacting surface gets in contact with the second heat-transfer contacting surface.

Abstract: A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink having a bottom for in contact with the electronic component and a plurality of fasteners securing the heat sink onto the printed circuit board. Each fastener includes a first latching member, a second latching member rotatably connected to the first latching member and an operating member rotatably connected to the first latching member and having a pressing part engaging a curved portion defined on a top of the second latching member. The heat sink and the printed circuit board are located between the first and second latching members of each fastener. The operating member is rotated to force the first and the second latching members to rotate toward each other to closely clip the heat sink and printed circuit board together.

Abstract: A heat dissipating structure associated with light emitting diodes includes a circuit substrate, a guide heat component, a heat dissipating device. The circuit substrate is attached with light emitting diodes. The guide heat component has a first end contacting the circuit substrate and a second end contacting with fins, which are provided with the heat dissipating device. The heat generated by the light emitting diodes is transmitted to the heat dissipating device via the guide heat pipe and then dissipated outward via the heat dissipating device.

Abstract: An electronic control apparatus can be reduced in size and cost by eliminating certain component parts such as a power board, etc. The apparatus includes a housing, a heat sink, semiconductor switching elements having terminals and mounted on the heat sink, a circuit board arranged in opposition to the heat sink, conductive plates connecting between the circuit board and the semiconductor switching elements, and a cover receiving the semiconductor switching elements and the circuit board in cooperation with the heat sink. The conductive plates have the press-fit terminal portions press-fitted into the through holes in the circuit board, and the individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, and are bonded to the individual terminals.

Abstract: A heat sink assembly includes a heat sink and a clip assembly. The clip assembly includes a clip and a pair of movable fasteners pivotally connected to the clip. The clip includes a main body, two pressing portions extending from two opposite ends of the main body and two locking arms extending oppositely from the two pressing portions, respectively. The movable fasteners each include a main body, a pair of receiving portions curved upwardly from the main body and receiving a corresponding locking arm therein and a hook extending downwardly from the main body and engaging with a clasp on a printed circuit board. A distance from each of the hooks of the movable fasteners to a corresponding clasp can be adjustable via rotation of the movable fasteners around the locking arms of the clip.

Abstract: According to one embodiment, a housing for a pedestal canister includes a first side plate and a fan. The first side plate includes a plurality of fins disposed on an exterior portion of the first side plate. The fan is coupled to the exterior portion of the first side plate. The pedestal canister is configured to be disposed within a pedestal aperture of a pedestal mounting block.

Abstract: There is described an arrangement for cooling electrical components disposed on a board-shaped mounting substrate, particularly SMD power components on a printed circuit board, wherein at least one heat sink assigned to a component is present which is disposed on the same side as the components and which is connected in a thermally conductive manner to the assigned component by means of a thermally conductive layer implemented on the mounting substrate. The heat sink is implemented as a bent sheet-metal part and is connected to the thermally conductive layer by means of a solder joint, wherein the bent sheet-metal part has at least one heat sink element which extends in a longitudinal direction and said longitudinal direction is oriented obliquely to the plane of the board-shaped substrate.

Abstract: A securing device (30) is used for securing a heat sink (10) to a printed circuit board (40) with a heat-generating electronic component (41) mounted thereon. The securing device includes a V-shaped elongated main body (31), a first locking leg (34), a second locking leg (332) and a resilient member (32). The first locking leg and second locking leg are connected to two opposite ends of the main body respectively for engaging with a retention frame (20) on the printed circuit board. The resilient member includes a planar-shaped supporting plate (321) engaging with a bottom portion of the main body and at least one resilient foot (322) extending downwardly from the supporting plate. The resilient foot deforms to exert a resilient force on the heat sink when the heat sink is assembled to the electronic component by the securing device.

Abstract: The present invention relates to a cooling module retentioner, which includes a fixing base and a flexible frame. The fixing base surrounds a heat-generating electronic component at a center and allows the placement of a cooling module therein, and a rising corner column is disposed at each of four corners thereof and each corner column has a snap hole; the flexible frame is composed of two M-like retention brackets whose bottom sides are mounted with a retention hook respectively for the corresponding snap hole, a lever is pivotally disposed at a lower center location thereof and pertains to a metal rod whose one end is integrally bent to form a protruded portion. The production process requires no mold so as to simplify the production process and reduce the production cost.

Abstract: A modular heat-radiation structure includes a module for generating heat, including a first main unit having a heat-radiation fin, fixed to the top face of the first main unit for radiating heat generated in the module and a resin-made and insulating heat shield inserted between the printed circuit board and the first main unit.

Abstract: A radiation device for computer or electric appliances includes a heat inhalant block under a CPU of a computer, a heat transmission block positioned next to the heat inhalant block, a bridge block, a peltier device and a cooling source block sequentially disposed on the top of the heat transmission block with a bridge block engaged therebetween, a transparent cover covering the top of the cooling source block to form a left and a right flow canals therein, an upper heat radiation module superimposed a lower heat radiation module positioned next to the heat transmission block, a fan on the top of the upper heat radiation module, a set of the heat pipes extended from the heat inhalant block to the lower heat radiation module through the heat transmission block, a pair of lateral pipes connected between the bridge block and the lower heat radiation module and a set of the cold pipes connected between the cooling source block and the upper heat radiation module.

Abstract: A heat sink assembly includes a heat sink having a first shoulder and a second shoulder, and a locking device having a retention module, a first clip and a second clip. The first clip has two extension portions engaging with the retention module and a pressing portion between the two extension portions. The second clip comprises a pressing portion located on the second shoulder, an axle connecting with the pressing portion and pivotably engaging with the retention module and a locking portion connecting with the pressing portion. The second clip can rotate around the axle thereof when the heat sink assembly is in an unlocked position; the locking portion engages with the retention module and the pressing portion presses the second shoulder of the heat sink toward the retention module when the heat sink assembly is in a locked position.

Abstract: A computer includes a chassis, a motherboard, an air guiding member, and a fan. The chassis includes a rear wall at a rear side thereof and a sidewall at a lateral side thereof. The rear wall defines a plurality of inlet holes therein, and the sidewall defines a plurality of outlet holes therein. The motherboard is received in the chassis opposite to the sidewall, a heat sink is installed on the motherboard for dissipating heat generated by a processor mounted on the motherboard. The air guiding member is received in the chassis at a front side, for guiding air drawn into the chassis through the inlet holes toward the outlet holes. The fan is used for drawing air from outside of the chassis through the inlet holes, and blowing the air out of the chassis through the outlet holes.

Abstract: A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body.

Abstract: A heat sink unit includes: a cooling member including a metal plate having a plurality of attachment holes on edges thereof, a first surface of the metal plate adjoining a heat-producing electronic component, and a second surface of the metal plate having a plurality of cooling fins erected on an area other than the attachment holes. The heat sink unit further includes: an attachment member including an opening in which the cooling fins are disposed when the cooling member is installed and a plurality of threaded bosses protruding from the first surface to be inserted into each of the attachment holes; and coil springs into which the bosses are respectively inserted. The coil springs are interposed between the attachment member and the metal plate, and the bosses are inserted into the attachment holes to fix the cooling member by screws.

Abstract: A heat sink apparatus for dissipating heat generated from a heat generating component includes a first heat dissipating assembly attached to one side of the heat generating component, a second heat dissipating assembly attached to another side of the heat generating component; and a connecting device connecting between the first heat dissipating assembly and the second heat dissipating assembly thereby forming a continuous heat dissipation passage between the first heat dissipating assembly and the second heat dissipating assembly.

Abstract: In one embodiment a thermal dissipation heat slug sandwich includes a circuit board, a circuit package having an integrated heat slug mounted to an obverse side of the circuit board, and a lower heat sink plate on a reverse side of the circuit board thermally coupled to the heat slug and a housing enclosing the circuit board An upper heat sink plate may be mounted to the obverse side of the circuit board to cover the circuit package. The upper heat sink plate thermally coupled to the lower heat sink plate through the circuit board. An insulating cover may also be provided to redirect radiant heat from the circuit package to the housing.

Abstract: A heat sink (100) includes a plurality of metal fins (10) interlocked with each other by interlocking units (11) formed between them. The interlocking units each include a protruding finger (122), a hole (114) and a controlling member (116, 117). The protruding finger, the hole and the controlling member are aligned with each other. The protruding finger includes a connecting tab (112a) which extends from a flange (14) of the metal fin and a locking tab (112b) which is curved inwardly from the connecting tab towards a main plate (12) of the metal fin. The locking tab of a rear metal fin extends into the hole of a front metal fin and fittingly abuts with the controlling member of the front metal fin so as to firmly interlock the rear and front metal fins together.

Abstract: An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while the circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks.