Abstract: An electronic device with an airflow guiding duct includes a chassis, an airflow guiding duct, and a top cover. The chassis includes a bottom wall and a sidewall perpendicular to the bottom wall. A circuit board is mounted on the bottom wall. A pair of securing members protrudes from a top of the sidewall. The airflow guiding duct includes a top wall and a plurality of securing slots defined in the top wall corresponding to the securing members, for the securing members being lockingly engaging in the securing slots, thereby limiting movement of the airflow guiding duct in directions parallel to the circuit board. The cover is mounted on the chassis and abuts against the top wall of the airflow guiding duct, for limiting movement of the airflow guiding duct in a direction perpendicular to the circuit board.

Abstract: A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate includes at least a first portion that is adapted to couple to the thermal management apparatus, and at least a second portion that is adapted to couple to the thermal management apparatus. The first portion and the second portion may be symmetrically arranged relative to each other. The first portion and the second portion are adapted to thermally couple the thermal management apparatus to the heat generating component with a first spring bias. The first portion and the second portion are further adapted to maintain the thermal management apparatus thermally coupled to the heat generating component with a second spring bias.

Abstract: A heat dissipation assembly for dissipating heat generated by an electronic component includes a heat sink contacting the electronic component, a pair of retaining members fixed on two lateral sides of a top portion of the heat sink, a pair of arms pivotably secured to the retaining members, and an operating member pivotably attached to the retaining members. The operating member has two cams for interacting with the retaining member and the heat sink. When the operating member is rotated from a vertical orientation to a horizontal orientation, the arms are driven by the operating member to rotate towards the heat sink to engage with barbs of a retention module. Furthermore, the arms are also activated to move upwardly so they can tightly engage with the barbs, thereby securing the heat sink to the electronic component.

Abstract: In a method for mounting a plurality of multishaft servo-amplifier modules, each of which has an identical shape and an identical function to each other and carries semiconductor power elements, on a multishaft servo-amplifier for driving motors, a plurality of multishaft servo-amplifier modules (1) through (6) are mounted on both the surfaces of a multishaft interface substrate (7) as a base plate in parallel with the surfaces of the substrate (7) to constitute a multishaft servo-amplifier function unit for a host controller.

Abstract: A power switching device is provided that includes a housing, a printed circuit board disposed within the housing, and a plurality of electrical components mounted to the printed circuit board, including at least one relay. At least one pair of load terminals is connected to the printed circuit board on opposite sides of the relay, and a plurality of heat transfer elements are formed through and in the printed circuit board and are dispersed proximate the relay, around the load terminals, and extending to the peripheral portion.

Abstract: An apparatus and system are disclosed for securing a heat sink against a central processing unit. The present invention teaches a heat sink securement device having a vertical retention arm that substantially encompasses a heat sink in a vertical direction, a horizontal retention arm that substantially encompasses a heat sink in a horizontal direction, and a tension arm coupled to the vertical and horizontal retention arms and pivotally coupled to the frame, the tension arm simultaneously adjusts a tension on the vertical retention arm and the horizontal retention arm in response to moving the tension arm. In certain embodiments, the retention arms are coupled to the tension arm via coupling member that is offset from pivot point of the tension arm. In other embodiments, the coupling member may include a different coupling member for the vertical and horizontal retention arms, both coupling members offset from the pivot point.

Abstract: An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surface of the solid-state heat pump. Also included may be a stop in contact with the thermally-conductive unit, disposed at least partially over the first end of a cavity defined by the thermally-conductive unit, and defining an opening, and a fastener passing through the cavity, in contact with the core, and to bias the core toward the stop.

Abstract: A heatsink assembly structure combined with a heat-generating element disposed on a circuit board is provided. The heatsink assembly structure includes a heat conducting plate and at least one spring plate. The heat conducting plate includes a pressing surface and an abutment surface. The spring plate includes at least one fixing section and a plurality of pressing sections extending from the fixing section. When the fixing section of the spring plate is fixed to the circuit board, each of the pressing sections applies a force to press the heat conducting plate towards the heat-generating element, so as to attach the abutment surface on the heat-generating element, and conduct heat generated by the heat-generating element to the heat conducting plate. Thus, a plurality of forces pressing the heat conducting plate downward is provided with a simple structure.

Abstract: The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the heat conductor extending through the opening to promote heat-dissipation efficiency.

Abstract: An electronic module. The electronic module includes a chassis, a plurality of capacitors, a plurality of bus bars, and a heat sink. The chassis includes a first end and a second end. The first end is opposite the second end. The capacitors are positioned within the chassis, and at least one of the capacitors is proximate the first end. The bus bars are positioned within the chassis proximate the second end. The heat sink is positioned between the capacitors and the bus bars. The capacitors, the heat sink and the bus bars are positioned such that when an airflow enters the chassis at the first end, a portion of the airflow sequentially comes in contact with the capacitors, the heat sink, and the bus bars before exiting at the second end.

Abstract: A cooling mechanism for a circuit board includes a board having electronic components disposed thereon, one or more heat radiation plates disposed on the board, a cooling fan for cooling the board and the electronic components disposed on the board by blowing air to at least one of the heat radiation plates, and a metal plate attached to one end of the board to ground the board, thereby preventing the leakage of electromagnetic radiation noises from the electronic components. Further, the metal plate includes a bent portion bent in L-shape along a lateral side of the board, and the cooling fan is so disposed at the inner side of the bent portion as to be perpendicular to the board. Furthermore, an air receiving surface of the heat radiation plate is so arranged as to be oblique to an axial blowing direction of the cooling fan.

Abstract: A heat dissipation apparatus includes a retention module (10), a heat sink (20) disposed on the retention module, a fastening cover (23) covering the heat sink, and a plurality of fasteners (30) connected with the retention module and the fastening cover for mounting the heat sink onto a heat generating electronic component (50). The fastener includes a fastening member (31) and an operating member (32). The fastening member has a first end (313) engaged with the retention module and a second end (311) opposed to the first end. The operating member includes a resilient pressing portion (321) pivotably connected with the second end of the fastening member and contacting with the fastening cover, and an operation portion (322) connected with the pressing portion.

Abstract: A computer device heat dissipation system comprising a heat exchanger having a plurality of fins connected to a heat pipe, at least one of the plurality of fins comprises at least one aperture to enable an airflow to pass therethrough.

Abstract: A computer device cooling system comprising a heat exchanger comprising an airflow face and a plurality of cooling fans disposed to form an airflow face, the cooling fan airflow face sized to correspond to a size of the heat exchanger airflow face.

Abstract: One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. The hybrid heat transport module and the fansink may be used alone or in combination to dissipate heat from the processor.

Abstract: An apparatus for transferring heat from a heat spreader is provided. The apparatus includes a heat dissipating member and a heat spreading member adjacent the heat dissipating member, the heat spreading member configured to spread heat laterally across the heat dissipating member, the heat spreading member defining a heat conduction plane. The apparatus also includes a base adjacent to the heat spreading member, wherein the heat spreading member is between the base and the heat dissipating member, and at least one thermal via within the heat conduction plane, the thermal via thermally coupled to the heat spreading member, the at least one thermal via thermally coupled to the heat dissipating member and the base through surface-to-surface contact.

Abstract: An airflow-guiding device (40) is secured at one side of a row of fans (20) in a computer chassis (10) and is capable of allowing air to flow therethrough in one direction only. The airflow-guiding device includes a bracket (42) and a plurality of shielding plates (44). The bracket is secured in the chassis and defines a plurality of guideways (428) therein. The shielding plates are pivotably secured in the guideways with shafts (442) thereof, respectively. The shaft of each of the shielding plates separates the corresponding plate into two portions. One of the two portions is larger and weightier than the other of the two portions.

Abstract: A cooling apparatus is used for cooling an electronic element. The cooling apparatus includes a fan and a fan duct. The fan is for generating airflow. The fan duct including an inlet, an outlet, and a first metal net fixed in one of the inlet and the outlet, is for guiding the airflow. The inlet is for allowing air to enter the fan duct. The outlet is for allowing air to flow out from the fan duct. The first metal net defines a plurality of guiding holes for the airflow to pass through, and a maximum distance in a traverse direction of each of the guiding holes is smaller than one twentieth of a wavelength of an electromagnetic wave emitted from the electronic element. An electronic device using the cooling apparatus is also disclosed.

Abstract: The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board (26), and a cooling device that acts by means of a coolant, on a second side of the printed circuit board (26), opposite the first side, the cooling device comprising a plurality of cells through which the coolant is guided. The aim of the invention is to minimise the risk of failure of one such power semiconductor module. To this end, a non-cooled region (d, e, f) is arranged between at least two cells.

Abstract: An apparatus, system, and method are disclosed for efficient heat dissipation. The apparatus for efficient heat dissipation is provided with a compliant heat pipe configured to conform to adjacent surfaces under a compressive load, a compression member configured to apply the compressive load to the compliant heat pipe, and wherein the compliant heat pipe conforms to the surface of the compression member and the surface of a heat source under the compressive load. Beneficially, such an apparatus, system, and method would provide efficient heat dissipation through effective thermo-coupling between the heat source and the heat pipe. Additionally, the apparatus, system, and method would facilitate the application of a load to thermal grease for further improvements on thermo-coupling between the heat source and the heat pipe.

Abstract: A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink.

Abstract: A package structure for a semiconductor device comprises a substrate having a main surface and a back surface, a semiconductor chip formed on the main surface of the substrate, a package covering the semiconductor chip, radiation protrude electrodes and connection protrude electrodes. The radiation protrude electrodes are formed on the back surface of the substrate in a chip area where said semiconductor chip is located. Each of the radiation protrude electrodes are formed with a first pitch so that the radiation protrude electrodes make one body joining layer when the package structure is subjected to a heat treatment. The connection protrude electrodes are formed on the back surface of the substrate in a peripheral area of the chip area. Each of the connection protrude electrodes formed with a second pitch which is larger than the first pitch so that the connection protrude electrodes stay individual when the package structure is subjected to a heat treatment.

Abstract: A system is provided for heat sinking and environmental dissipation of heat generated by one or more ICs mounted to a printed circuit board. The system includes a primary thermally conductive plate and one or more thermally conductive discs attached to the primary plate. The one or more thermally conductive discs make intimate contact with the one or more ICs mounted to the printed circuit board such that the heat generated by the one or more ICs in operation transfers through the one or more discs and onto the plate, whereupon the heat laterally distributes across the primary plate and dissipates into the environment.

Abstract: An active heat-dissipating type of power supply apparatus includes a casing, a first airflow channel, a second airflow channel, plural electronic components, an airflow driving device and a power input device. The casing includes at least one first airflow opening. The first airflow opening is communicated with the second airflow channel. The electronic components are disposed in the first airflow channel. The airflow driving device includes an airflow gate. The power input device is disposed on the first side of the casing and in the second airflow channel. A cooling air is pumped by the airflow driving device to be introduced into the second airflow channel through one of the first airflow opening and the airflow gate, so that the heat generated from the power input device is exhausted through the other one of the first airflow opening and the airflow gate.

Abstract: A heat sink assembly comprises a heat sink (20) and a locking device assembly (30) for mounting the heat sink to an electronic component (44) of a printed circuit board (40). A channel (25) is defined in the heat sink. The locking device assembly comprises a pressing member (31) and a pair of wire clips (33) pivotably engaging with opposite ends of the pressing member. The pressing member spans across the channel in a manner such that the pressing member resiliently abuts against the heat sink. The wire clips are located at opposite lateral sides of the heat sink and engage with clasps (42) on the printed circuit board. Use of the locking device assembly can prevent the heat sink from being held at a slant relative to the electronic component.

Abstract: An electronic device having a heat radiating body, a metal substrate, a heat generating component, and a non-heat-generating component is disclosed. The metal substrate is fixed to the heat radiating body with heat conductive oil arranged between the metal substrate and the heat radiating body. The heat generating component and the non-heat-generating component are mounted on the metal substrate. A gap that permits the heat conductive oil to enter the gap is defined between the metal substrate and the heat radiating body. The gap is arranged at a position corresponding to the non-heat-generating component or a position corresponding to a portion between the heat generating component and the non-heat-generating component.

Abstract: A computer enclosure includes an airflow guide (10), a chassis (20) for mounting the airflow guide therein, a fan 30 mounted in the airflow guide, and a side panel (27) for covering the chassis. The chassis includes a rear panel (25) and a motherboard (21) mounted therein, a heat sink (23) is mounted on the motherboard, a plurality of openings (253) for dissipating heat and a fixing slot (251) are defined in the rear panel. The fan aligns with an area of the openings of the rear panel. The airflow guide encases the heat sink therein and includes a catch (1371) engaging in the fixing slot of the chassis. The side panel covers the chassis and abuts against the airflow guide for preventing the catch disengaging from the fixing slot.

Abstract: According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section; a heat dissipation member thermally connected to the heat-sinking section; and a fan that blows air to the heat dissipation member. The heat transfer unit includes: a first plate member, in which a groove corresponding to the passage is formed; and a second plate member, which covers the groove. The heat-receiving section and the heat-sinking section are provided on one of the first and second plate members. The fan is provided on one side of the first or second plate member that is provided with the heat-receiving section and the heat-sinking section.

Abstract: This invention relates to arrangements for attaching a heat sink to an integrated circuit package. The heat sink comprises magnetic material, magnetized in one polarity, and the circuit package comprises magnetic material either unmagnetized or magnetized in the opposite polarity. When the heat sink and circuit package are placed in contact with one another, they are attracted magnetically. This forms a bond for attaching the heat sink to the integrated circuit package. Advantageously, this arrangement for attracting a heat sink avoids distorting or otherwise damaging the circuit package and speeds assembly time.

Abstract: In a semiconductor module 10 in which a semiconductor device 17 is mounted on both surfaces of a circuit board 11 and heat radiation plates 12a, 12b are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates 12a, 12b are fitted is formed in the circuit board 11, and a housing recess portion 18 in which the semiconductor devices 11 are housed is provided to both heat radiation plates 12a, 12b fitted to both surfaces of the circuit board 11 respectively and a fitting edge portion 25 is provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing means 20 for fixing both heat radiation plates 12a, 12b to the circuit board 11 by caulking to align with the fitting hole is provided to fitting edge portions 25 integrally with the heat radiation plates 12a, 12b.

Abstract: A cooling assembly includes a housing supporting a nozzle for directing cooling air over an electronic component. A casing rotatably supports a shaft, which in turn, supports a compressor, an expander, and an electric motor, for circulating air and delivering the cooling air to the nozzle. The assembly is distinguished by air bearings supporting the shaft in the casing on a thin film of air, thereby maintaining a contaminate free housing.

Abstract: A heat spreading member is received on a predetermined surface of an electronic component. The heat spreading member extends larger than the predetermined surface. A contact piece is contacted with the heat spreading member over a contact area smaller than the predetermined surface. The contact piece serves to realize concentration of an urging force applied to the heat spreading member. The heat spreading member is thus reliably urged against the electronic component. The concentration of the urging force serves to prevent the heat spreading member and the electronic component from camber even if heat is applied to the heat spreading member and the electronic component. Separation is thus avoided between the heat spreading member and the electronic component. The heat spreading member reliably keeps contacting with the electronic component, so that the electronic component package is allowed to enjoy improvement in heat radiation.

Abstract: An apparatus for dissipating heat in a computer system includes a heat sink, at least one fastener which secures the heat sink to at least one first support member, and at least one cup. The first support member has a top side and a bottom side. The at least one cup includes a cylindrical cavity, an upper protruding lip, and a lower base having a hole through which the at least one fastener passes. A method for dissipating heat in a computer system includes, mounting a heat emitting component onto a printed circuit board, pressing a heat sink into thermal contact with a heat emitting component, inserting a cup into an aperture of the heat sink, and supporting a heat sink.

Abstract: A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot allowing thermal dissipation from the card due to air flow over the heat sink. For one embodiment of the invention, heat producing components of the PC card are identified and a thermally conductive path is provided from the components to the extension portion of the PC card.

Abstract: A mobile terminal is provided that may conduct heat generated from a print circuit board when a mobile terminal is in operation to a wider area by use of a heat releasing member having excellent conductivity. This may release unpleasantness that a user feels when using the terminal by lowering a temperature of a key pad. The mobile terminal may include a main body including a plurality of key pads for receiving information from a user; a print circuit board mounted in the main body; a battery provided at the main body; a folder coupled to the main body; a display provided at the folder for displaying a text and other image information; a speaker unit provided at the folder; a microphone unit provided at the main body; and a heat releasing member for releasing heat generated from the print circuit board.

Abstract: An auxiliary cooling device includes two side boards with a space defined therebetween and the existed memory chips and the cooling plates on two sides of the memory chips are received in the space. A cooling fan is connected between the two side boards and sends air flows toward the memory chips and the cooling plates to remove heat via air paths defined in the inside of each side board.

Abstract: In some embodiments, a heatsink includes a thermally conductive core and at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length, and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular cross sectional form factor. Other embodiments are disclosed and claimed.

Abstract: A plasma display device that diversifies heat dissipating paths of integrated circuit modules in a circuit board assembly, thereby enhancing heat dissipation of the integrated circuit modules. The plasma display device includes a plasma display panel, a chassis base on which the plasma display panel is attached and supported, integrated circuit modules that are mounted on the circuit board assembly on an opposite side of the chassis base to the plasma display panel, and heat sinks, each being attached to one side of each of the integrated circuit modules to dissipate heat therefrom. The heat sink is formed such that one end thereof extends to come in contact with the chassis base.

Abstract: A heatsink assembly structure is provided. The heatsink assembly structure includes a heat conducting board attached to a heat-generating element, pressing members fixed to the heat conducting board, and spring plates penetrating through the heat conducting board. A plurality of through holes symmetric about the heat-generating element is formed in the heat conducting board in pairs. Two ends of the spring plates penetrate through the through holes, and are fixed to the pressing members between the through holes. When the spring plates are fixed to the circuit board, the spring plates apply forces that pull the heat conducting board towards the circuit board at positions of the pressing members, so as to push the heat conducting board against the heat-generating element to conduct heat to the heat conducting board. Thus, a plurality of forces pressing the heat conducting board downward is provided with a simple structure.

Abstract: A cooling device having a heat receiving portion, a heat radiating portion, a heat pipe, and a fan. The heat receiving portion is held on a wiring board and thermally connected to a heat-generating component. The heat radiating portion radiates the heat generated by the heat-generating component, at a position remote from the heat receiving portion. The heat pipe transfers the heat generated by the heat-generating component, from the heat receiving portion to the heat radiating portion. The heat pipe couples the heat receiving portion and the heat radiating portion. The fan applies cooling air to the heat radiating portion. The fan is coupled to the heat radiating portion.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: An electronic apparatus includes a housing, a first heat-generating member provided in the housing, a heat-radiating member thermally connected to the first heat-generating member, a first fan module guiding air to the heat-radiating member, a second heat-generating member provided in the housing, a second fan module discharging air out of the housing, and a wall section provided in the housing, located between the first fan module and the second fan module.

Abstract: A heat dissipation device includes a heat sink, a fan producing an airflow flowing towards the heat sink, an air-guiding member positioned between the fan and the heat sink and a cover enclosing the fan and the heat sink. The air-guiding member includes an air deflector dividing the airflow produced by the fan into two airstreams. The air deflector guides the airstreams of the airflow flowing towards different portions of the heat sink. By the air deflector, the portion of the heat sink, which is hotter than the other portion of the heat sink, has more air flowing therethrough.

Abstract: A heat dissipation device is to be mounted in a computer enclosure for dissipating heat generated by a VGA card (10). The heat dissipation device includes a heat sink (90), a fan (60) and a fan duct (50) connecting the heat sink (90) and the fan (60). The heat sink (90) contacts a heat-generating device (12) of the VGA card. The fan (60) has an inlet port (62) and an outlet port (63). The outlet port (63) communicates with an ambient air outside the computer enclosure. The fan duct (50) has two open ends (55,52). One open end (55) engages with the heat sink (90) and the other open end (52) engages with the inlet port (62) of the fan (60).

Abstract: A heat dissipator of a signal transmission member for a display apparatus can sufficiently dissipate heat from devices of the signal transmission member and protect the devices, and includes a thermal conductive supporter for dissipating heat generated by a signal transmission member, which transmits electrical signals between a chassis member supporting a panel displaying image and including at least one device and a circuit unit separated from the chassis member to drive the panel. The thermal conductive supporter includes: a base portion formed of a thermal conductive material, and having a side surface contacting the chassis member and another side surface contacting the signal transmission member; and a recess portion oriented on the base portion toward the chassis member so that the at least one device does not contact the base portion.

Abstract: A novel flexible circuit board with heat dissipation ability is provided. The flexible circuit board includes a heat sink and a heat spreader having at least one circuit substrate mounted thereon. The heat spreader has a first lower surface and a first upper surface which has a plurality of first grooves formed thereon. At least one platform is formed between two adjacent ones of the first grooves for mounting the at least one circuit substrate. The heat sink has a second lower surface and a second upper surface which has a plurality of second grooves formed thereon and is connected to the first lower surface.

Abstract: A retention module (10) for securing a heat sink (20) to a printed circuit board (30) includes a pair of carriage arms (12) separated by a space and a connecting wall (14) interconnecting opposite rear free ends of the carriage arms. Each of the carriage arms integrally forms a lock catch (122) thereon to clasp the heat sink. A pair of opposite positioning ears (15) extend upwardly from corners where the carriage arms are connected with the connecting wall. The retention module and the heat sink are preassembled together via the lock catches clasping the heat sink before the retention module is mounted on the printed circuit board.

Abstract: An apparatus for cooling electronics is disclosed. The apparatus generally relates to heat sinks that are operatively connected to electronics enclosures. The heat sinks may be part of the electronics enclosure, or alternately they may be operatively connected to the electronics enclosure. An enclosure preferably prevents solar radiation from striking the surface of the heat sink. At the same time, the enclosure allows air to flow over the heat sink, allowing heat to be dissipated.

Abstract: A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive material to which the multiple heat sources are coupled, preferably at evaporation points that are placed on opposite sides of a fluid reservoir for the liquid phase of the working fluid that feeds the evaporation points via capillary flow through a picking material.

Abstract: Apparatus and methods for mounting of a cooling device coupled to a circuit board include use of a clip that is rotated to mate with and engage the cooling device. Rotation of the clip occurs during installation of the cooling device and slides slots in the clip into interconnection with respective protrusions of the cooling device extending through the circuit board to where the clip is disposed. In an assembled configuration, the clip biases the cooling device to a processing unit coupled to the circuit board on an opposite side from the clip.