Abstract: A cooling device comprises a circulation passage through which a liquid coolant flows, and a pump provided in the circulation passage configured to circulate the liquid coolant along the circulation passage. The pump includes, (1) a pump casing including a pump chamber into which the liquid coolant flows, (2) an impeller mounted in the pump chamber to push out the liquid coolant from the pump chamber to the circulation passage, and (3) an injection portion provided in the pump casing configured to inject the liquid coolant to the pump chamber.

Abstract: According to one embodiment, an electronic apparatus includes: a casing having a bottom portion; a circuit board housed in the casing, the circuit board having first and second areas; a heating element mounted on the first area of the circuit board; an elastically-deformable partition member interposed between the circuit board and the bottom portion and surrounding the first area; and a fan having an air take-in port through which air in the first area is taken in.

Abstract: A air shroud for dissipating heat from an electronic component is composed of a air shroud of a roughly U-shaped cross section, whose left and right sides are formed into a first and a second opening, respectively. A passage is formed between the first and second openings, enabling air to flow along a specific direction. A flexible thin piece is fixed inside the air shroud which covers a specific electronic component on a circuit board, and the flexible thin piece is touched with a surface of the electronic component. The fast-flowing air flows quickly along the passage, so as to effectively cool down a working temperature of the specific electronic component, thereby increasing a lifetime of usage of the specific electronic component.

Abstract: An electrical assembly comprising plurality of heat producing devices in direct thermal contact with perforated heat pipe film. Direct benefits of this invention for circuit board packages are weight reduction, volume reduction, increase of allowable heat dissipation.

Abstract: A modularized redundant heat sink for dissipating heat generated from chips includes an independent rectangular fin whose sides are provided with at least more than two elastic pins, and which is provided with a bottom surface for conducting temperature; a circuit board on which are welded with at least more than two chips having upper surfaces. A bottom surface of the fin is attached to the upper surfaces of at least more than two chips through a heat conducting glue, so as to provide a temperature conducting and heat dissipating to at least more than two chips by one fin.

Abstract: This disclosure presents a heat dissipation mechanism, which conducts generated heat of a thermal device to the housing of an electronic apparatus by a metal piece fastened between the thermal device and electronic apparatus, and then dissipates heat into the air through multiple holes opened over an apparatus shell. Besides, the presented mechanism is also suitable to mini-size, portable electronic apparatus to solve the thermal dissipation technique thereof.

Abstract: A heat sink includes a plurality of fins parallel to each other, and one heat pipe extending through these fins. A flow channel is formed between each pair of neighboring fins for channeling an airflow generated by an electric fan. A guiding member having a curved shape is arranged around the through hole for guiding the airflow flowing to the heat pipe. A space formed and surrounded by the guiding member is a tapered space, which narrows gradually along the direction of the airflow so as to guide the airflow flowing to the heat pipe.

Abstract: A heat dissipating device is used to be sandwiched between a motherboard and a chassis for transferring heat from the motherboard to the chassis. The heat dissipating device includes a body for contacting with a bottom side of the motherboard, and a plurality of wings extending from the body. Each wing includes a connecting section extending from the body and a contacting section extending further from the connecting section for contacting with the chassis. The body engages with the bottom side of the motherboard at a position corresponding to that a heat-generating electronic component is mounted to a top side of the motherboard. Heat generated by the electronic component is transferred to the chassis through the motherboard and the heat dissipating device. The heat dissipating device is formed by stamping a metal sheet with high heat conductivity.

Abstract: A heat sink assembly includes a heat sink (10), a fan holder (20) mounted on the heat sink and a fan (30) carried by the fan holder. The heat sink defines a slot (148) in a top thereof. The fan holder comprises flap (260) downwardly extending to engage in the slot, and a fastening lug (28) secured to a recessed portion (122) of a top surface of a base (12) of the heat sink. The fastening lug extending from a baffle (24) which fittingly engages with a raised portion (124) of the top surface of the base adjacent to the recessed portion.

Abstract: A heat sink is disclosed to include a plurality of metal plate members arranged in a stack, each metal plate member having a rectangular body, a first sidewall and a second sidewall at two sides of the rectangular body, a T-shaped mounting hole in the rectangular body adjacent to the first sidewall, and a lug downwardly extending from the first sidewall, the lug having a head and a neck connected between the head and the first sidewall. By inserting the lug of one first plate member into the T-shaped mounting hole of one second plate member and then deforming the first sidewall of the second plate member, the plate members are firmly secured together, forming the desired heat sink.

Abstract: A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: A fan holder (1) includes a base (12) for supporting a fan (3) thereon and a pair of locking members (14) pivotally connected to the base. Each of the locking members includes a pivot shaft (142) and a handle (144) extending perpendicularly from the pivot shaft. The pivot shaft includes a pivot section (1422) and a pressing section (1426) offsetting from the pivot section and spaced from the base, wherein the handle is capable of rotating about an axis of the pivot shaft to lock with the base and to cause the pressing section to exert a force against the fan toward the base to securely attach the fan to the base.

Abstract: A heat-receiving plate of a pump has a heat-receiving surface and a guide. The heat-receiving surface is thermally connected to a heat-generating body. The guide is provided on the heat-receiving surface. The guide is opposed to the heat-generating body.

Abstract: A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.

Abstract: In electronic and/or electrical equipment, a cable management assembly is configured for usage in an electronic and/or electrical equipment rack assembly. The cable management assembly comprises at least two arm members, at least one flexible coupling configured to attach two of the at least two arm members, and connectors configured to flexibly attach an electronic and/or electrical equipment component to an electronic and/or electrical equipment rack. The at least two arm members, the at least one flexible coupling, and the connectors are constructed from a material that removes heat from interior to the rack and is connected in a configuration that draws the removed heat to a heat sink element.

Abstract: A power supply housing (12) is mounted inside of a computer housing (10). Housing (12). It includes components (34) that generate heat when the computer is being used. The power supply housing (12) is sealed in order to make it leak proof. A radiator is positioned outside of the power supply housing (12). It includes a coil assembly having an inlet and an outlet. The inlet is connected to an outlet leading out from the power supply housing (12). The outlet is connected to the inlet of the power supply housing (12). During use of the computer, a cooling fluid is circulated through the coil assembly of the radiator and the power supply housing (12). A fan is positioned outwardly of the radiator and is used to cool the cooling fluid when it is in the coil assembly of the radiator.

Abstract: An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's housing. Unlike conventional heat exchangers that may be used to dissipate heat from power-dissipating components that are housed typically in sheet metal housings, the ICPC described herein provides a cold plate integral to the housing of power electronics, thereby allowing the rapid and efficient removal of heat from the components into the cold plate carrier fluid and out of the system.

Abstract: A heat sink clip and an assembly incorporating such clip are provide. The heat sink clip comprises: a body, an actuating member and a movable fastener. The body has a securing portion formed at one end thereof. The actuating member has a hinge portion thereof. The movable fastener is secured to the hinge portion of the actuating member. The actuating member is pivotably mounted to the securing portion of the body in a direction substantially perpendicular to the body, and the actuating member is turnable relative to the body between a locked position and an unlocked position.

Abstract: A heat sink mounting assembly includes a retention module having a bottom and a pair of posts extending from the bottom. A heat sink is located on the bottom of the retention module. A clip spans across the heat sink and includes a clamping member having first and second legs releasably engaging with the posts of the retention module, and a pressing member having a first end thereof pivotably engaging with a first end of the clamping member. The pressing member has a pressing portion pressing the heat sink toward the retention module when a second end of the pressing member is depressed to engage with a pair of ears formed at a second end of the clamping member.

Abstract: A back plate assembly (100) for a board (200) comprises a back plate (110) abutting against a side of the board and a plurality of posts (120). Each post comprises at least one latching portion (1206) formed thereon. After the latching portions have passed through the back plate and the board, the latching portions are blocked by one of the board and the back plate to secure the back plate to the board. Screws (330) are used to extend through a heat sink (300) to threadedly engage with the posts thereby mounting the heat sink to the board. Thus, the heat sink can have an intimate contact with an electronic component (210) mounted on the board.

Abstract: A heat sink assembly (100) includes a heat sink (10) having a plurality of fins (14), a fan handle (24) buckled with the fins and a fan (30) mounted on the heat sink (10) via the fan handle. The fan handle includes a retaining body (26) clasping two adjacent fins having a space therebetween. A screw (22) is extended through the fan and into the space of the two adjacent fins. The retaining body includes a pair of opposite lateral walls (260) clamping opposite sides of the two adjacent fins, for preventing the two adjacent fins from being over expanded outwardly during the insertion of the screw into the space.

Abstract: A heat sink includes a fin assembly (20) including a plurality of fin plates (22) and a fan (30) mounted on the fin assembly. Each fin plate includes a plurality of cutouts (226) defined on one edge thereof, and the cutouts of the fin plates cooperatively form a scraggy surface when the fin plates are assembled together. Airflow produced by the fan directly impinges on the scraggy surface thereby enhancing heat transferring between the fin plates and the airflow.

Abstract: A surface mountable resistor chip assembly, containing an integral heat sink, convective cooling provision exhibits higher continuous-mode power ratings than prior art surface mount resistors having comparable printed circuit board footprints. The preferred embodiments are also configured so as to reduce transient thermal impedance in a manner to exhibit increased power rating under short duration overload conditions. The assembly includes a housing with passages, holes or slotted openings, for the chip assembly and for air flow therethrough, and electrically conductive paths to bring the chip electrical connections out to pads on the housing arranged to make electrical connections to a printed circuit board.

Abstract: The invention relates to an electronic substrate suitable for being included in a stack containing said electronic substrate and at least one other electronic substrate and suitable for being connected to the other electronic substrate and optionally to an input-output interface, wherein it comprises a frame consisting of a material with a high thermal conductivity comprising a plurality of sides, a first side of which is intended to be in contact with the corresponding side of the frame of another neighboring substrate so as to provide thermal dissipation of the electronic substrates and a second side of which comprises an interconnection element intended to provide electrical interconnection between said electronic substrate and the other electronic substrate(s) by means of a routing circuit between said electronic substrate and the input-output interface.

Abstract: A heat dissipating apparatus includes a retention module (20) forming clipping portions (26) thereon, a heat sink (10) mounted to the retention module, and a clip (30) engaged with the retention module and the heat sink. The clip includes a resilient clipping member (32) clasped with the clipping portions, and an operating member (34) pivotally mounted to the clipping member. The operating member includes a longitudinal pole (340) rotating about an axis thereof. The longitudinal pole forms a supporting portion (341) to support the clipping member away from the retention module in the process of its rotation from unlock to lock position. At the lock position, the clipping member securely engages with the clipping portions of the retention module, and the heat sink is downwardly pressed by the longitudinal pole to have an intimate contact with a heat generating component (8).

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules supply power to the second PCB and are separated and redundant power supplies such that upon failure of the first power module, the second power module can provide power for both power modules to the second PCB.

Abstract: Provided is a computer. The computer includes: a plurality of parts including heat-generating components that generate heat during operation; a case in which the parts are installed; and one or more heat-dissipating plates separated from the case by a predetermined distance and facing the case; wherein the heat-generating components include a central processing unit and a power supply, and the central processing unit and the power supply are each thermally connected to the heat-dissipating plates so that heat generated by the central processing unit and the power supply can be dissipated to the outside of the case via the heat-dissipating plates. Accordingly, the heat-generating components installed in the case can be noiselessly and efficiently cooled without using cooling fans.

Abstract: A method according to one embodiment may include providing a heatsink having a base having a first region with a thickness greater than a second region. The heatsink may further include a plurality of fins extending from the base with at least one fin oriented at an angle to at least another fin. The method of this embodiment may also include thermally coupling the heatsink to the heat generating component. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A power conversion device is downsized by integrally constructing a power conversion module and a control circuit board. The power conversion device includes a power conversion module 11, a control circuit board 21, and a heat sink 12. A case is divided into a module case 13 and a control circuit case 23. In a power conversion module section 10, the power conversion module 11 is thermally coupled to the heat sink 12 and contained in the module case 13 with a radiator fin 12a exposed to outside, one side of the case 13 being open. In a control circuit section 20, the control circuit board 21 is contained in the control circuit case 23, one side of the case 23 being open. Opening sides of the module section 10 and the circuit section 20 are opposite each other, and between which a heat insulating partition wall 30 is inserted.

Abstract: A supporting plate includes a metal plate and is utilized to support a heat sink module in an electronic device. The heat sink module has a thermal pad, and the electronic device has a first heat generating element and a second heat generating element. In addition, the heat sink module is contacted to the first heat generating element for conducting heat generated by the first heat generating element to the thermal pad. Moreover, the metal plate has a first concave portion and a second concave portion. The first concave portion is contacted to the thermal pad, and the second concave portion is contacted to the second heat generating element for conducting heat generated by the second heat generating element to the heat sink.

Abstract: A frequency converter includes a circuit substrate, a housing that covers at least the circuit substrate, a radiating section in which gases at an intake face are exhausted from an exhaust face so as to radiate heat, a fan provided on the exhaust face of the radiating section, and a guide provided on the housing to direct gases around the circuit substrate toward the intake face.

Abstract: A multi-heatsink integrated cooling device comprises a crossflow cooler and a primary heatsink thermally connected by heat-spreading means. The crossflow cooler comprises a casing with an inlet and an outlet, and a radial impeller and heat-exchanging means located inside of the casing. The casing comprises side parts, a cover and a lower plates contacted with the heat-exchanging means and first of the electronic components. The primary heatsink comprises housing and heat-exchanging members located inside of the housing. The housing comprises a base, sidewalls and a cover, thus forming inflow and outflow openings. The base contacted with the heat-exchanging members and second of the electronic components. The primary heatsink and the crossflow cooler located in such a way that the outflow opening is adjacent to the inlet, thus cooling air flows through the primary heatsink, the inlet, the heat-exchanging means, the radial impeller and the outlet in a series way.

Abstract: A heat sink and component support assembly that includes a core structure (110). The core structure (110) includes: a central member (112) having first (114, 116) and second opposing sides; at least one heat dissipating surface (124, 126, 128) extending from at least one of the first opposing sides (114, 116); and first and second extension members (118, 120) positioned adjacent to each of the second opposing sides. The assembly may also include an airflow facilitating arrangement, such as a fan (184), positioned adjacent to the core structure (110) for further enhanced heat dissipating capabilities.

Abstract: An apparatus includes a printed circuit board having a first space, a member movably coupled to the printed circuit board and a baffle carried by the member. The baffle is configured to move to an extended position, which is maintained in the absence of a component in the space, to a retracted position in response to engaging a component in the space.

Abstract: A system for delivering power to an integrated circuit (IC) component mounted on a circuit board includes a circuit board having a first side and an opposite second side. An IC component is mounted on the first side of the circuit board, and the IC component has a plurality of power contacts. A voltage regulator module (VRM) is coupled to the second side of the circuit board. The VRM reduces a voltage supplied to the IC component from a first voltage to a second voltage. An interface connector is mounted on the VRM. The interface connector is in mating engagement with the IC component, thereby delivering power at the second voltage directly to the IC component.

Abstract: An elastic seal member is formed at the surface of a metal plate included in a gasket, which faces toward a lid, and another elastic seal member is formed at the surface of the metal plate facing toward a side wall. At the metal plate, the seal member is disposed further inward relative to the other seal member fitted in a seal groove. As bolts are tightened, the seal members become compressed and deformed, causing the seal member to press the metal plate against an exposed portion of an inner wall portion and the other seal member to press the metal plate against the lid.

Abstract: An electronic assembly includes a PCB (20), a socket (22) mounted on the PCB, a CPU (24) connected with the socket, a heat sink (10) in thermal contact with the CPU, a foldable back plate (30) attached to an underside of the PCB and a base plane (40) forming four bridges (42). The back plate includes a first piece section (32) and a second piece section (34) pivotally joined together by a pivot (36). The first and the second piece sections each comprise two legs inserted into two corresponding bridges. Screws are used to extend through the heat sink, the PCB, the bridges to threadedly engage with the legs of the back plate, respectively. The pivot is located under a part of the PCB at which the CPU is mounted.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: A thermal assembly for cooling an electronics module is described. The assembly includes a compressible thermal pad, a thermal plate, and a clip. The thermal plate attaches to a heat sink. The clip urges the thermal pad against a surface of the thermal plate. Heat generated by electronics components in the pluggable electronics module is conducted to the heat sink through a thermal path defined by the thermal plate, the compressible thermal pad, and the clip.

Abstract: Various embodiments of a heat sink assembly are disclosed. In one embodiment, the heat sink assembly includes a processor mounted onto a circuit board; a heat sink located in thermal contact with the processor at the side of the processor opposite circuit board; and an electromagnetic shielding member located between the circuit board and the heat sink. The electromagnetic shielding member is releasably attached to the circuit board. Additionally, or in the alternative, the heat sink is biased toward the processor by a load spring and the electromagnetic shielding member is configured to provide a spring force between the circuit board and the heat sink, counter directional to the bias from the load spring.

Abstract: A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are resiliently connected to the press-on region. The snap-action hooks are latched into place, with pressure generation of the press-on region onto a rear side of a surface-mountable semiconductor device, into corresponding passage openings of the circuit board. A plastically deformable thermal composition is disposed between the rear side of the semiconductor device and the press-on region of the heat sink so as to form an intermediate layer therebetween to provide compensation for the thickness tolerances of the semiconductor device.

Abstract: A fan mounting apparatus includes a base, a fan mount which is operable to couple to the base, and a latch member pivotally coupled to the fan mount, the latch member operable to reduce vibration from a fan module and including a duct member operable to direct airflow from the fan module. The base may be mounted adjacent a heat sink to provide easy installation of a fan module adjacent the heat sink and for more efficient use of the airflow from the fan module to the heat sink.

Abstract: A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.

Abstract: A system is described for cooling a processor. In one embodiment, a heat sink assembly has a fan and air channels. In addition, a heat sink lid that is configured to cover only a region above the fan is coupled to the heat sink assembly.

Abstract: A retainer includes a retention module surrounding a heat sink and two clip members for cooperating with the retention module to retain the heat sink. Each clip member includes a strap resting on the heat sink and a pair of legs located at opposite ends of the strap and engagable with the retention module. The legs are pivotably attached to opposite ends of the strap. Friction between the legs and the strap is capable of holding the legs at any positions between released positions at which the legs are free from the retention module and engaged positions at which the legs are engaged with the retention module.

Abstract: A radiator structure includes a radiator frame, a radiator and a plurality of elastic latch members. The radiator frame is mounted onto a main board corresponding to an electronic element, and has a plurality of coupling sections and an opening corresponding to the electronic element and the surface of the electronic element exceeds its peripheral edges. The radiator is mounted on the radiator frame in contact with the surface of the electronic element, and has a plurality of latch sections corresponding to the coupling sections. The elastic latch member coupled on the latch section is bent to form a force applying section, a latch arm and a swinging arm. After the force applying section receives a force, the swinging arm coupled on the latch section is turned to enable the latch arm to latch on the coupling section thereby to anchor the radiator on the radiator frame to disperse heat.

Abstract: A heat sink assembly includes a heat sink (20) and a pair of clips (10) attached on opposite sides of the heat sink for securing the heat sink to an electronic component (40). The heat sink includes a base (22) and a plurality of fins (24). A pair of protrusions (28) is formed on bottom portions of adjacent two fins. A locking slot (29) is therefore formed between the base, the two adjacent fins, and the protrusions. The clip includes a pressing portion (12) squeenzedly received in the locking slot, a pair of extension portions (14) extending from opposite ends of the pressing portion, and a pair of hooks (16) formed on free ends of the extension portions. When the clips are deformed to cause the hooks to engage with the electronic component, the pressing portions of the clips press the heat sink toward the electronic component.

Abstract: A heat sink protecting retention module is described. The heat sink protecting retention module has a main frame, protective feet, hooks, and a positioning mechanism. The protective feet are disposed under the main frame to keep screws therein before the heat sink protecting retention module is installed on the motherboard so as to avoid scratching the motherboard or damaging electric components thereon. The hooks are disposed on the main frame for clamping the heat sink and the positioning mechanism are disposed around and under the main frame for aligning the heat sink protecting retention module to a central processing unit socket.

Abstract: The present invention is a method and an apparatus for side-type heat dissipation. According to the present invention, a heat dissipation unit is deposed on a CPU to absorb the heat it generates; a cover is covered on the unit, where two openings are at two opposite ends and one of the openings has an inclined plane as well as a fan, and one of the openings is corresponding to a fan on the computer case; and an air flow is guided by a fan to the heat dissipation unit and is directed to a fan of a power supplier to be blown out of the computer case. By doing so, no thermal cycling will occur in the computer case and better heat-dissipation efficiency can be obtained.