Abstract: An electronic assembly includes a first wafer including a stack of alternating first dielectric layers and first circuit layers, a flexible structure including a second dielectric layer and a second circuit layer covered by the second dielectric layer, and a second wafer stacked upon the first wafer and including chip packages arranged in an array. The flexible structure includes a first region embedded in the first wafer and a second region connected to the first region and extending out from an edge of the first wafer. The chip packages are electrically coupled to the second circuit layer of the flexible structure through the first circuit layers of the first wafer.

Abstract: Disclosed herein is a method of manufacturing an auxetic stretchable substrate with a flexible joint structure according to various embodiments of the present invention. The method includes preparing a substrate made of an elastic material, and forming an auxetic to form a plurality of first regions on the substrate, each of the plurality of first regions is a region in which a material constituting the auxetic is not printed, and at least some of the plurality of first regions have different lengths.

Abstract: An actuator assembly comprising: a support structure; an image sensor assembly comprising an image sensor having a light-sensitive region, the image sensor assembly being suspended on the support structure in a manner allowing movement of the image sensor assembly relative to the support structure; and at least two flexible printed circuits, each electrically connected at one end to the image sensor assembly, wherein the flexible printed circuits fold around the image sensor assembly such that their other ends are at the same side of the image sensor assembly.

Abstract: A device comprises a first circuit member, a second circuit member and a third circuit member. The first circuit member comprises a first body for performing the function of the first circuit member and a first flexible board formed with a first integrated-electrode portion including first electrodes. The second circuit member comprises a second body for performing the function of the second circuit member and a second flexible board formed with a second integrated-electrode portion including second electrodes. The third circuit member comprises a third body for performing the function of the third circuit member and a third flexible board formed with a third integrated-electrode portion including third electrodes. The first integrated-electrode portion, the second integrated-electrode portion and the third integrated-electrode portion lie over each other in an upper-lower direction. The first body, second body and the third body are apart from each other when seen along the upper-lower direction.

Abstract: A stretchable pixel array substrate includes a base, pixel structures, and a wiring. The base has first regions and a second region. The pixel structures are respectively disposed on the first regions of the base. The wiring is disposed on the second region of the base. Curved segments of the wiring include a first curved segment and a second curved segment. One of the pixel structures is disposed on one of the first regions. The first curved segment is disposed between the one of the pixel structures and the second curved segment. A distance A exists between a first curved portion and a second curved portion of the first curved segment in a first direction, a distance B exists between a first curved portion and a second curved portion of the second curved segment in the first direction, and A>B.

Abstract: A release film includes a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board. The first release film comprises a fixing portion having a shape extending in one direction. A second release film is disposed under the printed circuit board. The second release film includes an incision portion. The fixing portion extends into the incision portion.

Abstract: An antenna device and an electronic device including the same are provided. The antenna device includes a housing that includes a first plate, a second plate facing a direction opposite to the first plate, and a side member surrounding a space between the first plate and the second plate, a display viewable through at least a portion of the first plate, an antenna assembly disposed within the housing wherein the antenna assembly includes a first printed circuit board, a second printed circuit board, at least one structure interconnecting the first printed circuit board and the second printed circuit board and including conductive paths, a plurality of conductive patterns, and a wireless communication circuit, a flexible printed circuit board, and a third printed circuit board.

Abstract: The device for evaporating volatile substances comprises a heater (1) which heats a wick (2) impregnated in said volatile substances and characterised in that said heater (1) is formed from a printed circuit board (10) provided with at least one resistor (11). It allows a device for evaporating volatile substances to be provided which comprises a heater with a very low thermal mass which allows a rapid increase in the temperature and variation of the working cycles.

Abstract: A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 ?m to 2.0 ?m. The wiring lines have an average height of 40 ?m to 120 ?m. The wiring lines have an average spacing of 1 ?m to 30 ?m.

Abstract: A display device, and the display device includes a display panel is provided. The display panel includes a planar area, a first bending area, and a second bending area. The planar area includes a main display area and a peripheral area. The peripheral area includes a first peripheral area. The first peripheral area is located at a corner of the main display area, and the first peripheral area is located between the first bending area and the second bending area. A first alignment mark is provided in the first peripheral area.

Abstract: A flexible display apparatus including: a first film including a first surface and a second surface that are opposite each other, and a first groove formed in the first surface, the first film having a first rigidity; a third film on the second surface of the first film; a fourth film facing the third film; an emission display unit between and encapsulated by the third film and the fourth film; and a second film on the fourth film and facing the first film, the second film having a second rigidity that is less than the first rigidity.

Abstract: A foldable display apparatus, a method of manufacturing the same, and a controlling method of the same are disclosed. The foldable display apparatus includes a substrate including a metal thin film and an insulating layer provided on the metal thin film, an organic light-emitting unit formed on the substrate and emitting light in an direction away from the substrate, and a thin film encapsulating layer for encapsulating the organic light-emitting unit. The foldable display apparatus may be folded in a direction such that the metal thin film is exposed.

Abstract: According to one embodiment, a flexible substrate includes a support plate including a first surface, a line portion including a flexible insulating base located on the first surface and a wiring layer disposed on the insulating base, and a protective member covering the line portion, and the wiring layer includes a first metal layer and a second metal layer stacked on the first metal layer, the second metal layer has a first film thickness in a first area and a second film thickness in a second area, and the second film thickness is greater than the first film thickness.

Abstract: Methods and systems for an electronic package for a vehicle are provided. In one example, the electronic package includes a chassis having a plurality of bent tabs forming a plurality of respective vent openings in the chassis, and a circuit board coupled to the chassis, wherein the bent tabs directly contact the circuit board.

Abstract: A method of making an assembly or package comprising 3D blocks may include forming a conductive element horizontally oriented over a first carrier, forming support material around the conductive element, and singulating the conductive element and the support material to form a plurality of 3D blocks. The method may further include rotating each of the plurality of 3D blocks and mounting the plurality of 3D blocks over a second carrier with the conductive traces of the 3D blocks vertically oriented to form a vertically oriented conductive element. A plurality of components may be disposed laterally offset from each of the plurality of 3D blocks, an encapsulant may be disposed thereover s to form a reconstituted panel that may be singulated to form a plurality of individual assemblies.

Abstract: An embedded smart module including a twistable substrate, an electrode layer, a circuit layer, an insulating layer, an electronic component and a sensing component is provided. The electrode layer is disposed on the twistable substrate. The circuit layer is disposed in the electrode layer and exposed at the surface of the electrode layer. The insulating layer is disposed between the electrode layer and the circuit layer. The electronic component is disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer. The sensing component is disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer.

Abstract: An electronic device includes a first electric element a second electric element, and a circuit board. The circuit board is configured to deliver a signal between the first electric element and the second electric element. The circuit board includes a first portion, a second portion, and a third portion. The second and third portions extend from the first portion with the first portion therebetween. The circuit board also includes at least one signal line extending from the second portion to the third portion, a plurality of ground patterns extending from the second portion to the third portion, a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of ground patterns, and a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of ground patterns. The plurality of ground patterns include a meander form at the first portion.

Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

Abstract: A flexible circuit board including: a body area including a plurality of wirings; a bonding area combined with a first side of the body area; and an extension area combined with a second side of the body area opposite to the first side. The body area includes a first sub-body area and a second sub-body area located on a side of the first sub-body area close to the extension area; the plurality of wirings at least include a first wiring, a second wiring and a third wiring all extend in the first sub-body area, and the first wiring and the second wiring extend in the second sub-body area. The first sub-body area includes a multi-layer board structure, the second sub-body area includes a single-layer board structure or a double-layer board structure, and a thickness of the second sub-body area is smaller than a thickness of the first sub-body area.

Abstract: A semi-flex component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion. A component is embedded in the at least one rigid portion. A transition region between the at least one semi-flexible portion and the at least one rigid portion of the component carrier has a slanted sidewall.

Abstract: The present invention provides a differential paired cable with compensation functions, including: a first wire; a second wire; a first insulating layer; a second insulating layer; a ground wire; and a shielding layer. By controlling at least one of a length difference between the first insulating layer and the second insulating layer exposed outside of the shielding layer to be greater than 0.1 mm, a diameter difference between the first wire and the second wire to be greater than 0.005 mm, and a length difference between a welding portion of the first wire and a welding portion of the second wire to be greater than 0.05 mm, a signal transmission rate of one of the first wire and the second wire is compensated, so as to reduce an intra pair skew of the differential paired cable.

Abstract: An electronic device includes first and second circuit boards. The second circuit board includes a first portion facing a first main surface of the first circuit board, a second portion facing a second main surface opposite to the first main surface, and a bent portion connecting the first portion and the second portion to each other. The second circuit board includes an element, signal conductors, and a first opening. The first opening is between the signal conductors when viewed in a thickness direction of the element. The first opening extends from the first portion to the second portion through the bent portion. The first portion and the second portion each include a portion not including the first opening between the signal conductors.

Abstract: The disclosure provides an OLED display substrate, a manufacturing method thereof, and a display device, wherein the OLED display substrate is provided with a display area and an edge area surrounding the display area, the OLED display substrate includes a back plate and a pixel-defining layer on the back plate, and a protrusion is provided on the back plate at the edge area of the OLED display substrate.

Abstract: A welding structure and a display module. The welding structure includes: an output carrier, arranged with a first welding area on a side edge of the output carrier; an input carrier. A first end of the input carrier is arranged with a second welding area, the second welding area being electrically connected to the first welding area; an orthographic projection of the first end of the input carrier on the output carrier is disposed beyond the first welding area; and at least one set of a first support member and a second support member. The first support member is disposed on the input carrier and at a position of the first end beyond the first welding area; the second support member is disposed on the output carrier and opposite to the first support member.

Abstract: A part made of composite material, in particular for an aircraft turbine engine, includes a body produced from fibers woven in three dimensions and immersed in a resin, in particular an organic or polymer resin. The part has at least one crack sensor capable of detecting a crack in the part, at least one link element connected to the sensor and configured to transmit a signal(S), in particular to a member outside of the part, when a crack in the part is detected. The crack sensor has at least one conductive wire woven with the fibers of the body, and the link element is configured to measure the resistance of the conductive wire and to wirelessly transmit the signal.

Abstract: A display device includes: a display panel having a first side and a second side facing the first side in a first direction, the display panel including a recessed portion having a recessed shape from the first side of the display panel toward the second side in the first direction, the recessed portion including a side extended from the first side of the display panel; a pad portion disposed on a front surface of the display panel, the pad portion being adjacent to at least one side of the recessed portion; and a flexible printed circuit (FPC) connected to the pad portion, the FPC being bent to a rear surface of the display panel around the at least one side of the recessed portion, the rear surface opposing the front surface.

Abstract: An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.

Abstract: A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.

Abstract: An ultrasonic sensor comprises a substrate, a piezoelectric member disposed at the substrate and an upper electrode disposed on the piezoelectric member. The upper electrode includes a silver paste.

Abstract: Flexible packages and electronic devices with integrated flexible packages are described. In an embodiment, a flexibly package includes a first die and a second die encapsulated in a molding compound layer. A compliant redistribution layer (RDL) spans the molding compound layer and both dies, and includes electrical routing formed directly on landing pads of the dies. A notch is formed in the molding compound layer between the dies to facilitate flexure of the compliant RDL.

Abstract: A wiring substrate includes a bendable portion including one or more wiring layers and insulation layers that are alternately stacked. The insulation layers of the bendable portion include a first insulation layer and a second insulation layer. The first insulation layer is located at an inner bent position of the bendable portion when the bendable portion is bent. The second insulation layer is located at an outer bent position of the bendable portion relative to the first insulation layer when the bendable portion is bent. The first insulation layer has a higher elastic modulus than the second insulation layer.

Abstract: An embodiment of the present application discloses a stretchable display module and a stretchable display device. The stretchable display module comprises a display panel and a touch layer embedded in the display panel. The display panel includes island regions, bridge connection regions, and aperture regions. A pixel island is disposed in each of the island regions. Each of the connection bridges is connected to adjacent two of the pixel islands. The touch layer comprises touch modules. One touch module is disposed in each of the pixel islands, adjacent two of at least some of the touch modules are connected to each other through the connection bridge.

Abstract: A flexible circuit substrate that includes a conductive line on a flexible substrate and at least one slot in the conductive line on the flex substrate, where at one slot is in an area of the flexible circuit substrate that will be bent to prevent an open in the conductive line on the flexible substrate.

Abstract: A stretchable display module is disclosed. The stretchable display module includes a plurality of islands and a plurality of bridges. Each of the bridges includes a first connection part, a second connection part, and a plurality of bending parts, the first connection part is connected to a first side of one of the islands, and the second connection part is connected to a second side of another adjacent island. The first side includes a first endpoint and a second endpoint, and the second side includes a third endpoint on a same side as the first endpoint and a fourth endpoint on a same side as the second endpoint. The bending parts do not protrude from a connecting line between the first endpoint and the third endpoint.

Abstract: Novel tools and techniques are provided for implementing flexible printed circuit board (“PCB”)-based mobile sensor platform. In various embodiments, a flexible PCB-based mobile sensor platform includes a body portion(s) and at least one of a microcontroller, a locomotion system, sensors, a transceiver(s), and/or the like, each disposed on the body portion(s). The locomotion system includes one or more flexible PCB portions and corresponding actuators. Based on instructions from the microcontroller, at least one actuator may cause bending and unbending of a corresponding flexible PCB portion(s) that causes the flexible PCB-based mobile sensor platform to move toward a target location within a first environment. Upon arrival, the sensors may collect sensor data regarding at least one of the target location, an object located at the target location, or a portion of the object, and the microcontroller may send the collected sensor data to an external device via the transceiver.

Abstract: A display panel and a manufacturing method thereof are provided. The display panel includes a non-display area which is provided with a bending area. The bending area includes a substrate layer, a metal wiring layer, and a first planarization layer sequentially disposed. A groove is defined on a surface of the substrate layer away from the metal wiring layer, where a groove wall of the groove extends along a curved surface or a flat surface to a groove bottom of the groove to let an orthographic projection of the groove bottom of the groove on the substrate layer fall within an orthographic projection of an opening of the groove on the substrate layer, so that the metal wiring layer is located in a neutral layer or close to the neutral layer.

Abstract: A support structure for a flexible panel. The flexible panel includes a non-bending area, a bending area and a pad area arranged in sequence along a first direction. The pad area is located at a backlight side of the non-bending area. The support structure includes a support plate, and the support plate includes a planar support area attached to the non-bending area and a patterned area at least attached to the bending area. The present disclosure further provides a method for assembling a flexible module, and a display device.

Abstract: A display panel includes a base substrate, pixels, signal lines, a power line, signal pads, power pads, and a conductive portion electrically connected to the power pads and extending from an area overlapping the power pads to an edge of the base substrate. An opening is defined in conductive portion by a removed portion thereof.

Abstract: A printing system includes: a printer for outputting a printed product; and a device for providing a marking arranged or arrangeable in a closed circumferential manner around a prolate object. The device includes a mechanical interface and the printer includes a mechanical interface, which are positively and/or by force-locking connected in a mounted state and which release the positive and/or force-locked connection by a planar motion, a partial rotation, and/or a current change to a released state. The device further includes: a material interface for receiving printed material output by the printer in the mounted state of the device, and at least one actuator for arranging the marking on the prolate object in a circumferentially closed manner by the printed product output by the printer or for providing the marking for circumferentially closed arrangement in the mounted state of the device.

Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.

Abstract: Disclosed herein are devices, methods, and methods of making devices for facilitating condition monitoring of machinery allowing improve efficiencies and increased lifetime of the machinery while also reducing maintenance. In one embodiment, a device includes an enclosure assembly and a printed circuit board (PCB) assembly. The enclosure assembly includes a cap, a base mechanically coupled with the cap, and a support bracket mechanically coupled with the base. The PCB assembly includes a processor, a memory coupled with the processor, a first sensor electrically coupled with the processor, a second sensor electrically coupled with the processor, and a communication interface electrically coupled with the processor. The device, when installed, may generally form a shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.

Abstract: A display apparatus includes a display panel, a touch layer, and a flexible printed circuit (FPC) including a main FPC and a bridge FPC. A third soldering region and a fourth soldering region of the bridge FPC are respectively soldered to a first soldering region and a second soldering region of the main FPC. Ends of each first touch connection line are electrically connected to a touch chip and a first touch lead. Ends of each second touch connection line are electrically connected to a pad on the second soldering region and a second touch lead. Ends of each third touch connection line are electrically connected to a pad on the first soldering region and the touch chip. Ends of each touch transfer line are electrically connected to a pad on the third soldering region and a pad on the fourth soldering region.

Abstract: Electronic devices to be integrated are formed on individual boards, the boards are laid to overlap each other in a predetermined relationship, and then through vias are formed at predetermined positions. With this, the electronic devices are electrically connected to each other, and function as an integrated device.

Abstract: A multilayer resin substrate includes a base material including stacked resin layers including an opening resin layer, a conductor pattern, and an interlayer connection conductor. A concave portion is provided in the base material. The opening resin layer is closer to a first main surface than other resin layers. The concave portion includes a first opening portion provided by a cutting process from one surface of the opening resin layer, and another resin layer. The interlayer connection conductor is provided by filling a conductor in a second opening portion provided by a cutting process from an opposite surface of the opening resin layer. The end portion of the one surface of the first opening portion is not in contact with the conductor pattern.

Abstract: This disclosure provides a flexible circuit board and a manufacturing method therefor, and a display device. The flexible circuit board includes a main body sub-circuit board and a bridge sub-circuit board. The main body sub-circuit board includes a first substrate, as well as a first bridge connection end, a second bridge connection end, a first wiring portion, and a second wiring portion disposed on the first substrate. The bridge sub-circuit board includes a second substrate, as well as a third bridge connection end, a fourth bridge connection end, and a third wiring portion used for a first functional wiring, all disposed on the second substrate.

Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).

Abstract: An optical module is provided, including a movable portion, a fixed portion, and a circuit assembly. The movable portion is configured to connect an optical member, and is movable relative to the fixed portion. Moreover, the movable portion is movably connected to the fixed portion via the circuit assembly.

Abstract: A flexible printed circuit board includes a base film having an insulating property, and one or more interconnects laminated to at least one surface side of the base film. At least one of the one or more interconnects includes, in a longitudinal direction, a first portion and a second portion that is a portion other than the first portion, an average thickness of the second portion being greater than an average thickness of the first portion. A ratio of the average thickness of the second portion to the average thickness of the first portion is greater than or equal to 1.5 and less than or equal to 50.

Abstract: One embodiment of a camera module may comprise: a lens barrel provided with at least one lens; a holder to which the lens barrel is coupled; a printed circuit board coupled on the bottom of the holder to face the lens; an adhering portion coupling the holder and the printed circuit board; an opening portion opening a portion of a first space formed through the coupling of the printed circuit board and the holder; and a housing coupled with the holder, wherein a second space separated from the first space may be formed through the coupling of the holder and the housing, and the opening portion may communicate the first space with the second space.

Abstract: Embodiments of the present disclosure disclose a display panel and a display device. In the display panel, an array base plate is located on a light exit side of the display panel and includes a binding part. The binding part includes a plurality of binding terminals. A circuit board assembly is bound to the plurality of binding terminals and includes a plurality of electronic components. The circuit board assembly is bent to a side of a color film base plate that is away from the array base plate. Each of the electronic components is located on a side of the circuit board assembly that is away from the color film base plate.