Abstract: A stretchable display module is disclosed. The stretchable display module includes a plurality of islands and a plurality of bridges. Each of the bridges includes a first connection part, a second connection part, and a plurality of bending parts, the first connection part is connected to a first side of one of the islands, and the second connection part is connected to a second side of another adjacent island. The first side includes a first endpoint and a second endpoint, and the second side includes a third endpoint on a same side as the first endpoint and a fourth endpoint on a same side as the second endpoint. The bending parts do not protrude from a connecting line between the first endpoint and the third endpoint.

Abstract: Novel tools and techniques are provided for implementing flexible printed circuit board (“PCB”)-based mobile sensor platform. In various embodiments, a flexible PCB-based mobile sensor platform includes a body portion(s) and at least one of a microcontroller, a locomotion system, sensors, a transceiver(s), and/or the like, each disposed on the body portion(s). The locomotion system includes one or more flexible PCB portions and corresponding actuators. Based on instructions from the microcontroller, at least one actuator may cause bending and unbending of a corresponding flexible PCB portion(s) that causes the flexible PCB-based mobile sensor platform to move toward a target location within a first environment. Upon arrival, the sensors may collect sensor data regarding at least one of the target location, an object located at the target location, or a portion of the object, and the microcontroller may send the collected sensor data to an external device via the transceiver.

Abstract: A display panel and a manufacturing method thereof are provided. The display panel includes a non-display area which is provided with a bending area. The bending area includes a substrate layer, a metal wiring layer, and a first planarization layer sequentially disposed. A groove is defined on a surface of the substrate layer away from the metal wiring layer, where a groove wall of the groove extends along a curved surface or a flat surface to a groove bottom of the groove to let an orthographic projection of the groove bottom of the groove on the substrate layer fall within an orthographic projection of an opening of the groove on the substrate layer, so that the metal wiring layer is located in a neutral layer or close to the neutral layer.

Abstract: A support structure for a flexible panel. The flexible panel includes a non-bending area, a bending area and a pad area arranged in sequence along a first direction. The pad area is located at a backlight side of the non-bending area. The support structure includes a support plate, and the support plate includes a planar support area attached to the non-bending area and a patterned area at least attached to the bending area. The present disclosure further provides a method for assembling a flexible module, and a display device.

Abstract: A display panel includes a base substrate, pixels, signal lines, a power line, signal pads, power pads, and a conductive portion electrically connected to the power pads and extending from an area overlapping the power pads to an edge of the base substrate. An opening is defined in conductive portion by a removed portion thereof.

Abstract: A printing system includes: a printer for outputting a printed product; and a device for providing a marking arranged or arrangeable in a closed circumferential manner around a prolate object. The device includes a mechanical interface and the printer includes a mechanical interface, which are positively and/or by force-locking connected in a mounted state and which release the positive and/or force-locked connection by a planar motion, a partial rotation, and/or a current change to a released state. The device further includes: a material interface for receiving printed material output by the printer in the mounted state of the device, and at least one actuator for arranging the marking on the prolate object in a circumferentially closed manner by the printed product output by the printer or for providing the marking for circumferentially closed arrangement in the mounted state of the device.

Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.

Abstract: Disclosed herein are devices, methods, and methods of making devices for facilitating condition monitoring of machinery allowing improve efficiencies and increased lifetime of the machinery while also reducing maintenance. In one embodiment, a device includes an enclosure assembly and a printed circuit board (PCB) assembly. The enclosure assembly includes a cap, a base mechanically coupled with the cap, and a support bracket mechanically coupled with the base. The PCB assembly includes a processor, a memory coupled with the processor, a first sensor electrically coupled with the processor, a second sensor electrically coupled with the processor, and a communication interface electrically coupled with the processor. The device, when installed, may generally form a shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.

Abstract: A display apparatus includes a display panel, a touch layer, and a flexible printed circuit (FPC) including a main FPC and a bridge FPC. A third soldering region and a fourth soldering region of the bridge FPC are respectively soldered to a first soldering region and a second soldering region of the main FPC. Ends of each first touch connection line are electrically connected to a touch chip and a first touch lead. Ends of each second touch connection line are electrically connected to a pad on the second soldering region and a second touch lead. Ends of each third touch connection line are electrically connected to a pad on the first soldering region and the touch chip. Ends of each touch transfer line are electrically connected to a pad on the third soldering region and a pad on the fourth soldering region.

Abstract: Electronic devices to be integrated are formed on individual boards, the boards are laid to overlap each other in a predetermined relationship, and then through vias are formed at predetermined positions. With this, the electronic devices are electrically connected to each other, and function as an integrated device.

Abstract: A multilayer resin substrate includes a base material including stacked resin layers including an opening resin layer, a conductor pattern, and an interlayer connection conductor. A concave portion is provided in the base material. The opening resin layer is closer to a first main surface than other resin layers. The concave portion includes a first opening portion provided by a cutting process from one surface of the opening resin layer, and another resin layer. The interlayer connection conductor is provided by filling a conductor in a second opening portion provided by a cutting process from an opposite surface of the opening resin layer. The end portion of the one surface of the first opening portion is not in contact with the conductor pattern.

Abstract: This disclosure provides a flexible circuit board and a manufacturing method therefor, and a display device. The flexible circuit board includes a main body sub-circuit board and a bridge sub-circuit board. The main body sub-circuit board includes a first substrate, as well as a first bridge connection end, a second bridge connection end, a first wiring portion, and a second wiring portion disposed on the first substrate. The bridge sub-circuit board includes a second substrate, as well as a third bridge connection end, a fourth bridge connection end, and a third wiring portion used for a first functional wiring, all disposed on the second substrate.

Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).

Abstract: An optical module is provided, including a movable portion, a fixed portion, and a circuit assembly. The movable portion is configured to connect an optical member, and is movable relative to the fixed portion. Moreover, the movable portion is movably connected to the fixed portion via the circuit assembly.

Abstract: A flexible printed circuit board includes a base film having an insulating property, and one or more interconnects laminated to at least one surface side of the base film. At least one of the one or more interconnects includes, in a longitudinal direction, a first portion and a second portion that is a portion other than the first portion, an average thickness of the second portion being greater than an average thickness of the first portion. A ratio of the average thickness of the second portion to the average thickness of the first portion is greater than or equal to 1.5 and less than or equal to 50.

Abstract: One embodiment of a camera module may comprise: a lens barrel provided with at least one lens; a holder to which the lens barrel is coupled; a printed circuit board coupled on the bottom of the holder to face the lens; an adhering portion coupling the holder and the printed circuit board; an opening portion opening a portion of a first space formed through the coupling of the printed circuit board and the holder; and a housing coupled with the holder, wherein a second space separated from the first space may be formed through the coupling of the holder and the housing, and the opening portion may communicate the first space with the second space.

Abstract: Embodiments of the present disclosure disclose a display panel and a display device. In the display panel, an array base plate is located on a light exit side of the display panel and includes a binding part. The binding part includes a plurality of binding terminals. A circuit board assembly is bound to the plurality of binding terminals and includes a plurality of electronic components. The circuit board assembly is bent to a side of a color film base plate that is away from the array base plate. Each of the electronic components is located on a side of the circuit board assembly that is away from the color film base plate.

Abstract: An electrical element includes a pair of conducting elements spaced from one another, a recess receiving an electrical component, and a trough extending from a first conducting element of the pair of conducting elements to a second conducting element of the pair of conducting elements. The conducting elements are at least partially exposed in the recess.

Abstract: A flexible arm that is configured to be located between and physically and electrically connect an acoustic module of an open-ear headphone to a battery housing of the open-ear headphone. The flexible arm defines an original resting length and position between the acoustic module and the battery housing. The flexible arm includes a flexible printed circuit that extends through the entire original resting length of the flexible arm and comprises a conductor that is configured to carry electrical energy between the acoustic module and the battery housing, and a flexible material that encases at least some of the flexible printed circuit. The length of the flexible printed circuit within the flexible arm is greater than the original resting length of the flexible arm. The flexible printed circuit can thus better accommodate tension or compression on the flexible arm as the flexible arm is bent from its original resting position.

Abstract: A method for milling flex foil includes providing a web of flex foil including a substrate; a first conductive layer arranged on one surface of the substrate; a second conductive layer arranged on an opposite surface of the substrate; a first insulating layer arranged adjacent to the first conductive layer; and a second insulating layer arranged adjacent to the second conductive layer. The method includes dry milling one side of the web using a first cliché pattern including raised portions and non-raised portions to selectively remove at least one of the first conductive layer and the first insulating layer. The method includes dry milling an opposite side of the web using a second cliché pattern including upper raised portions, lower raised portions and non-raised portions to selectively remove the second insulating layer.

Abstract: Disclosed is an electronic device. The electronic device includes: a housing including at least a part of a lateral surface of the electronic device; a printed circuit board (PCB) disposed in the housing; at least one wireless communication circuit disposed on the PCB; a first antenna module including at least one antenna disposed in a first region inside the housing; a second antenna module including at least one antenna disposed in a second region inside the housing; a third antenna module including at least one antenna disposed in a third region inside the housing; a first flexible printed circuit board (FPCB) connecting the first antenna module to the at least one wireless communication circuit; and a second FPCB connecting the second antenna module and the third antenna module to the at least one wireless communication circuit.

Abstract: A microelectronic device can include a polymer, a semiconductor, and a matching layer. The polymer can include a first coefficient of thermal expansion. The semiconductor can be coupled to the polymer layer. The matching layer can be adjacent the semiconductor, and the matching layer can include a second coefficient of thermal expansion that is about the same as the first coefficient of thermal expansion.

Abstract: An electronic panel including a display panel and an input sensor which includes a base layer, a first sensing electrode, a first signal line electrically connected to the first sensing electrode, a first insulating layer overlapping the first sensing electrode, a second sensing electrode, a second signal line electrically connected to the second sensing electrode, and a second insulating layer overlapping the second sensing electrode, in which the first insulating layer includes an open edge that defines an open area, the open area exposes a portion of a first surface of the base layer and a portion of the first signal line in a plan view, and the first insulating layer has a first thickness at a first point spaced apart from the open edge and a second thickness greater than the first thickness at a second point disposed farther away from the open edge than the first point.

Abstract: A flexible circuit board includes a main board, a first connecting plate, and a second connecting plate; a side surface of the first connecting plate is connected to a first side surface of the main board, and an included angle between the main board and the first connecting plate is a first preset angle; a side surface of the second connecting plate is connected to the first side surface of the main board, and an included angle between the main board and the second connecting plate is a second preset angle; and the first preset angle and the second preset angle are both greater than 0 degree and less than 180 degrees.

Abstract: Circuit board assembly, Display apparatus, Terminal, and Signal processing system. The circuit board assembly comprises a first circuit board, a second circuit board, a third circuit board, and multiple differential signal lines; the first circuit board comprises a first connector which comprises a first lead group comprising N first leads and a second lead group comprising N second lead; the second circuit board comprises a second connector which comprises a third lead group comprising N third leads and a fourth lead group comprising N fourth leads; multiple i-th leads and multiple (i+2)-th leads are in one-to-one correspondence, and the i-th leads and the corresponding (i+2)-th leads are arranged along a first direction; a first differential line of a j-th differential signal line is connected to the (2j?1)-th i-th lead and the (2j?1)-th (i+2)-th lead, its second differential line is connected to the 2j-th i-th lead and the 2j-th (i+2)-th lead.

Abstract: A display device is provided, including: a housing body, a first shaft, a first roller, a flexible display screen, a main board, and a flexible circuit board. When the display device is in use, the entire flexible display screen is stretched to an exterior of the housing body. When the display device is idle, the flexible display screen is rolled up to be spirally sleeved on the roller. Therefore, a size of the display device can be reduced, and portability of the display device is improved.

Abstract: A pin-aligned magnetic device is provided, which includes a first magnetic core body, a second magnetic core body, and a plurality of conductors. The first magnetic core body is internally disposed with a magnetic element, and the magnetic element is joined to the plurality of conductors. The second magnetic core body covers the plurality of conductors on the first magnetic core body, so that the plurality of conductors is mounted inside the magnetic device and pins thereof are exposed from two lateral sides of the magnetic device, to form a plurality of pins. The foregoing design makes room at the bottom of the magnetic device, thus facilitating space saving and utilization on a PCB board. Moreover, each pin can be in good electrical contact with the board, effectively enhancing product yield on a production line.

Abstract: A production method and a power electronic connecting device for a power semiconductor module, wherein the connecting device is designed as a flexible film stack of a first and a second electrically conductive film and an electrically insulating film arranged therebetween, wherein at least one of the electrically conductive films is structured in itself and thus forms a plurality of film conductor tracks, wherein a first one of these film conductor tracks has, in a first section, a first average thickness and, in a second section, a second average thickness which is at least 10%, preferably at least 20%, smaller than the first average thickness.

Abstract: The present disclosure relates to a battery connection module and a battery device. The battery connection module includes a carrying tray, a plurality of busbars and a flexible circuit board. The plurality of busbars are provided to the carrying tray.

Abstract: In one aspect, an ultrasound transducer system comprises a two-dimensional array of transducer elements, the transducer elements having a first side comprising individual first electrodes in electrical communication with control circuitry of the ultrasound transducer system. A matching layer is coupled to a second side of the transducer elements via an electrically conductive face, wherein the electrically conductive face serves as a common electrical contact for the transducer elements. The matching layer also comprises kerfs extending to a depth less than the electrically conductive face.

Abstract: Provided is a voltage monitoring module which includes: a land; and a metal plate arranged on the land and soldered to the land, in which a through-hole is partially formed at a location of the metal plate corresponding to the land, a non-formation area is formed at a location of the land corresponding to part of the through-hole, and no conductor is formed in the non-formation area.

Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.

Abstract: A semiconductor storage device includes a housing, a first substrate disposed in the housing and on which one or more first electronic components are mounted, a plurality of heat radiating plates arranged in the housing above the first substrate along a thickness direction of the first substrate, and one or more connectors that connect the first substrate and the plurality of heat radiating plates.

Abstract: A conductive laminated structure includes a conductive layer and a thickening layer. The conductive layer extends in a first direction. The thickening layer is disposed over or under the conductive layer. The conductive laminated structure can withstand more than 40,000 folding times without breakage when a radius of curvature R is equal to 3 mm, a folding direction is perpendicular or parallel to the first direction, and a folding angle is 180°. A foldable electronic device is also provided herein.

Abstract: A wiring substrate includes a core substrate, and a build-up part formed on the core substrate and including insulating layers and conductor layers. The conductor layers include one or more conductor layers each having a first wiring and a second wiring such that the second wiring has a conductor thickness smaller than a conductor thickness of the first wiring and that a minimum value of a line width of a wiring pattern of the second wiring is smaller than a minimum value of a line width of a wiring pattern of the first wiring.

Abstract: A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.

Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.

Abstract: A conductive bump electrode structure includes a substrate, an elastic circuit layer, at least two conductive bumps, and an insulating layer. The elastic circuit layer is mounted on the substrate, and includes at least one elastic circuit. The at least two conductive bumps are mounted on the elastic circuit layer, and are electrically connected to each other through the at least one elastic circuit. The insulating layer is mounted on the elastic circuit layer, and includes at least two holes. Since there is a gap between the conductive bumps, the conductive bump electrode structure is easy to be bent and fit body curves of various parts of a user. The elastic circuit can stretch or compress along with the user's movement due to its elasticity, thereby increasing suitability of the conductive bump electrode structure to the human body.

Abstract: A foldable display apparatus, a method of manufacturing the same, and a controlling method of the same are disclosed. The foldable display apparatus includes a substrate including a metal thin film and an insulating layer provided on the metal thin film, an organic light-emitting unit formed on the substrate and emitting light in an direction away from the substrate, and a thin film encapsulating layer for encapsulating the organic light-emitting unit. The foldable display apparatus may be folded in a direction such that the metal thin film is exposed.

Abstract: A device for manufacturing a stretchable substrate structure according to an embodiment includes a carrier substrate receiving portion configured to receive a carrier substrate therein, a stretchable substrate receiving portion configured to receive a stretchable substrate in a direction facing the carrier substrate, and a diaphragm configured to be deformed by air pressure provided on one surface, wherein the diaphragm comes in contact with an entire surface of the stretchable substrate in a plane direction when deformed, such that the stretchable substrate is combined to the carrier substrate by deforming according to the deformed shape of the diaphragm.

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

Abstract: An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of the plurality of conductive particles comprising a plurality of needle-shaped protrusions having a conical shape, and wherein the first resin insulating layer and the second resin insulating layer comprise a same material and have different thicknesses.

Abstract: A resin substrate includes an insulating base material including opposing first and second main surfaces, at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction. The insulating base material is divided into first and second sections arranged in the X-axis direction. The first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region. A degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.

Abstract: A printed circuit board includes a first transmission line provided on an insulating base, a first ground conductor, a notch portion that exposes a part of the first ground conductor, a conductor provided in the notch portion and electrically connected to the first ground conductor, and a first electrode exposed on a main surface of the insulating base facing a flexible board and electrically connected to the first transmission line. The flexible board includes a second transmission line provided on an insulating sheet, a second ground conductor, a second electrode exposed on a main surface of the insulating sheet facing the printed circuit board and connected to the second transmission line, and a third electrode exposed on the main surface of the insulating sheet and connected to the second ground conductor. The conductor and the third electrode are connected by solder.

Abstract: A flexible circuit board and display device including the same are disclosed. In one aspect, the flexible circuit board includes a base film including a bending area and a plurality of signal wires formed over the bending area of the base film. At least one through-hole is defined in the base film.

Abstract: An integrated device package sized and shaped to fit in a small space, such as within a body lumen or cavity of a human patient, is disclosed. The integrated device package includes a package substrate and integrated device dies. The first and second integrated device dies are angled relative to one another about the longitudinal axis by a fixed non-parallel angle.

Abstract: The present application describes a waveform processor for control of quantum mechanical systems. The waveform processor may be used to control quantum systems used in quantum computation, such as qubits. According to some embodiments, a waveform processor includes a first sequencer configured to sequentially execute master instructions according to a defined order and output digital values in response to the executed master instructions, and a second sequencer coupled to the first sequencer and configured to generate analog waveforms at least in part by transforming digital waveforms according to digital values received from the first sequencer. The analog waveforms are applied to a quantum system. In some embodiments, the waveform processor further includes a waveform analyzer configured to integrate analog waveforms received from a quantum system and output results of said integration to the first sequencer.

Abstract: An OLED device includes a substrate including a display region including a pixel region and a peripheral region surrounding the pixel region. A pad region is spaced apart from the display region, and a bending region is disposed between the display region and the pad region. A plurality of pixel structures are disposed in the pixel region on the substrate. A touch screen structure is disposed on the pixel structures. A plurality of touch screen wirings are disposed in the bending region on the substrate. The touch screen wirings are electrically connected the touch screen structure. A connection structure is in the pad region. The connection structure electrically connects touch screen wirings to each other. A same touch sensing signal is applied to touch screen wirings that are connected to each other.

Abstract: A stress sensing assembly includes: a stretchable substrate and at least one stress sensing line. The stress sensing line is disposed over the stretchable substrate and includes: rigid segments and flexible conductive segments. The rigid segments are separated from each other. Each of the flexible conductive segments is disposed between two adjacent rigid segments of the rigid segments and directly contacts the sidewalls of the two adjacent rigid segments of the rigid segments, and the Young's modulus of one of the flexible conductive segments is smaller than the Young's modulus of one of the rigid segments. A display device including stress sensing assembly is also disclosed herein.

Abstract: A flexible printed circuit board includes: a proximal end portion; a left strip portion and a right strip portion that extend in the rear direction from the proximal end portion; and conductive paths, a portion of which is provided spanning from the proximal end portion to the left strip portion, and another portion of which is provided spanning from the proximal end portion to the right strip portion. In portions of the conductive path in the left strip portion and the right strip portion, strip side connecting portions that are electrically connected to electrode terminals of electricity storage devices are provided. In the left strip portion, a deformation portion that deforms to increase the distance between the left strip portion and the right strip portion is provided.