Abstract: A circuit carrier and a manufacturing method thereof are provided. The circuit carrier for coupling an electronic device includes a flexible structure and a circuit structure. The flexible structure includes a conductive pattern disposed on a surface of a first dielectric layer. The circuit structure includes a second dielectric layer overlying the surface of the first dielectric layer and a circuit layer disposed on the second dielectric layer and connected to the conductive pattern. The flexible structure is embedded in and electrically connected to the circuit structure, and a portion of the flexible structure extends out from an edge of the circuit structure to be plugged into the electronic device.

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.

Abstract: A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.

Abstract: A flexible array substrate includes an active area and a bending area. The bending area is adjacent to the active area. The bending area includes a protection layer and at least one signal line disposed on the base substrate. The protection layer is located on the at least one signal line at a side away from the base substrate. An orthographic projection of the protection layer on the base substrate has an overlapping region with an orthographic projection of the at least one signal line on the base substrate, the Young modulus of the protection layer is larger than or equal to the Young modulus of the at least one signal line.

Abstract: A differential transmission line cable includes a notch filter to manage common-mode energy. The cable includes a narrow portion with two adjacent electrical conductors each having a narrow cross-sectional area and spaced at a narrow spacing. The cable also includes a wide portion longitudinally adjacent to the narrow portion. The wide portion includes the two adjacent electrical conductors each having a wide cross-sectional area greater than the narrow cross-sectional area and spaced at a wide spacing greater than the narrow spacing. The wide and narrow cross-sectional areas and spacings are specified so that the differential-mode impedance of the differential transmission line cable is uniform throughout both the narrow and wide portions and so that differences in the common-mode impedances of the narrow and wide portions create a notch filter to manage common-mode energy in the differential transmission line cable.

Abstract: A computing system is provided. The computing system includes a semi-flexible printed circuit board assembly (PCBA) with a first element and a second element. The first element is configured to move in a non-planar direction with respect to the second element. The computing system also includes an internal trace connecting the first element and the second element of the semi-flexible PCBA. The computing system also includes a support mechanism, which is configured to constrain relative movements between the first element with respect to the second element of the semi-flexible PCBA.

Abstract: A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: a band-shaped main strip to be located to extend in a stacking direction of cells; a band-shaped first branch strip branched from the main strip and extending toward a corresponding busbar; and a second branch strip branched from the main strip and extending toward an external device. The first branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a busbar connection portion disposed closer to an end of the first branch strip than the bent portion and connected to the corresponding busbar. The second branch strip has a device connection portion to be connected to the external device.

Abstract: An OLED device includes a substrate including a display region including a pixel region and a peripheral region surrounding the pixel region. A pad region is spaced apart from the display region, and a bending region is disposed between the display region and the pad region. A plurality of pixel structures are disposed in the pixel region on the substrate. A touch screen structure is disposed on the pixel structures. A plurality of touch screen wirings are disposed in the bending region on the substrate. The touch screen wirings are electrically connected the touch screen structure. A connection structure is in the pad region. The connection structure electrically connects touch screen wirings to each other. A same touch sensing signal is applied to touch screen wirings that are connected to each other.

Abstract: An imaging unit includes: an imaging element including a light receiver and a connection terminal formed on a back surface of the imaging element; a flexible printed circuit board including a connection electrode forming region, a cable connection electrode forming region, and a bent portion provided between the connection electrode forming region and the cable connection electrode forming region; and sealing resin filled around a junction between the imaging element and the flexible printed circuit board. The bent portion includes: a first bent portion that is bent toward the imaging element from the connection electrode forming region located parallelly to the light receiver of the imaging element; and a second bent portion that is provided continuously with the first bent portion and lets the cable connection electrode forming region extend in a direction opposite to a direction toward the imaging element.

Abstract: A display device including: a display panel configured to display an image; and a winder configured to fix a first end portion of the display panel thereinto, wherein the winder includes a first fixing portion including a first external surface which is curved, and a second fixing portion that includes a second external surface which is curved and that faces the first external surface, wherein the first end portion of the display panel may be interposed between the first external surface and the second external surface.

Abstract: Various designs are provided to mitigate or solve limitation on the bendability of an active matrix backplanes: including breaking large rigid silicon chips (ICs) into smaller rigid ICs, changing the orientation of rigid ICs, changing the placement of the ICs on the array, thinning the ICs to the point where the Si is flexible, and replacing the ICs with high quality TFT processing which can be done on flexible substrates.

Abstract: A direct current to direct current (DC-DC) converter can include a chip embedded integrated circuit (IC), one or more switches, and an inductor. The IC can be embedded in a PCB. The IC can include driver, switches, and PWM controller. The IC and/or switches can include eGaN. The inductor can be stacked above the IC and/or switches, reducing an overall footprint. One or more capacitors can also be stacked above the IC and/or switches. Vias can couple the inductor and/or capacitors to the IC (e.g., to the switches). The DC-DC converter can offer better transient performance, have lower ripples, or use fewer capacitors. Parasitic effects that prevent efficient, higher switching speeds are reduced. The inductor size and overall footprint can be reduced. Multiple inductor arrangements can improve performance. Various feedback systems can be used, such as a ripple generator in a constant on or off time modulation circuit.

Abstract: A flexible substrate includes a plurality of unit wiring structures. Each of the unit wiring structures includes: a central section; and at least four curved strips disposed at an outer side of the central section, each of the curved strips having a first end connected to the central section. The central section includes: an insulation layer; interlayer connection via that passes through the insulation layer; first wiring section connected to the interlayer connection via; and second wiring section electrically connected to the first wiring section by way of the interlayer connection via. The first wiring section, insulation layer and second wiring section are disposed in this order, and two of the at least four curved strips extending in a first direction are connected to the first wiring section, other two of the at least four curved strips extending in a second direction are connected to the second wiring section.

Abstract: The present disclosure provides a circuit board structure and a display panel, the circuit board structure includes mounting substrates and a flexible conductive substrate, and the flexible conductive substrate is connected between two adjacent mounting substrates to connect the two mounting substrates together.

Abstract: A liquid composition comprising (a) a solvent or solvent mixture containing at least 50% by weight, based on the total amount of solvents, of a dioxabicycloalkane derivative, (b) an aromatic tricarboxylic acid anhydride, and (c) an aromatic diisocyanate, can be used as coating composition for metal surfaces.

Abstract: A contact unit for electrically contacting an electronic segment of an electronic module is provided. The contact unit generally includes a flexible substrate with a contact side. The contact side includes a module connector and a segment connector. The module connector includes a first unit terminal connected to a second unit terminal by a terminal conductor extending along a longitudinal axis thereof. The segment connector includes a first contact connected to the terminal conductor by a first contact conductor and a first fold of the flexible substrate.

Abstract: A housing for accommodating an electronic component of an electronic assembly includes a base and a cover, wherein the base and the cover are connected to one another by a hinge element and the base and the cover of the housing can be folded together by means of the hinge element. At least one leadframe has conductor tracks arranged in the housing, wherein at least one conductor track of the leadframe is arranged in the base of the housing and at least one further conductor track is arranged in the cover of the housing, and wherein the at least one further conductor track extends starting from the base of the housing, via the hinge element, to the cover of the housing.

Abstract: A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

Abstract: A thermally expandable material includes microcapsules and a binder having a conducting property, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have an insulating state with the other capsule.

Abstract: The present invention provides a fabric having a multiple layered circuit thereon integrating with electronic devices. The fabric comprises: a base layer; a plurality of conductive circuit layers; at least one connecting layer having electrically-conductive via-hole(s) and electrically-insulated area covering the area without the via-hole(s) and electrically connecting two conductive circuit layers through the via-hole(s) but electrically insulating the rest of the two conductive circuit layers; one or more than one electrical devices mounted to the conductive circuit layer and connected to circuits on the conductive circuit layer through anisotropic conductive film (ACF); and a water-proof layer disposed on the conductive circuit layer which is the farthest away from the base layer and covering the electrical device(s).

Abstract: Provided is a graphene synthesis apparatus including a chamber; a heating unit provided in the chamber; a heat conversion unit provided closer to a central portion of the chamber than the heating unit; and a catalyst provided on the heat conversion unit, wherein the catalyst is formed of thin and long metal.

Abstract: The invention relates to a method for transferring structures on a host substrate, the method comprising the following steps in sequence: a) supply a temporary substrate comprising two main faces, the temporary substrate being stretchable, the structures being assembled with their front face on the first face; b) stretch the temporary substrate along at least one direction so as to increase the space between the structures along at least one direction, c) a step for transferring the plurality of structures on a host face of a host substrate, The temporary substrate comprises a matrix made of a stretchable material, and a plurality of inserts on which the structures are assembled, the inserts comprising a material with a Young's Modulus higher than that of the stretchable material.

Abstract: A display panel includes a display area, a border area, a touch layer, and a touch trace. The border area includes a first trace area on opposite sides of the display area, a second trace area on another side of the display area, and a trace reserved area disposed inside an intersection of the first trace area and the second trace area. The touch layer includes a first electrode chain and a second electrode chain that are mutually intersected and insulated. The touch trace connecting the first electrode chain is arranged in the first trace area and the trace reserved area, and the second trace area only arranges the touch trace connecting the second electrode chain.

Abstract: A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.

Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, a conductive pattern that is stacked on at least one surface side of the base film and that includes a plurality of wiring portions arranged adjacent to one another, and an insulating layer that covers outer surfaces of the base film and the conductive pattern. The plurality of wiring portions have an average spacing of 1 ?m or more and 20 ?m or less and an average height of 30 ?m or more and 120 ?m or less. A filling area ratio of the insulating layer between the plurality of wiring portions adjacent to one another in sectional view is 95% or more.

Abstract: A fuel cell includes a catalyst coated membrane with a proton exchange membrane, a cathode layer disposed on a first surface of the proton exchange membrane, and an anode layer disposed on an oppositely disposed second surface of the proton exchange membrane. At least one gas diffusion layer is bonded to at least one of the cathode and anode layers of the catalyst coated membrane. At least one bonding layer substantially surrounds at least one of the catalyst coated membrane and the at least one gas diffusion layer. The at least one bonding layer is bonded to a portion of the proton exchange membrane. At least one circuit is bonded to a portion of the gas diffusion layer and a portion of the at least one bonding layer.

Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, a lower encapsulant and an intermediate layer. The upper conductive structure includes at least one upper dielectric layer and at least one upper circuit layer in contact with the upper dielectric layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The lower encapsulant surrounds a lateral peripheral surface of the lower conductive structure. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure to bond the upper conductive structure and the lower conductive structure together. The upper conductive structure is electrically connected to the lower conductive structure.

Abstract: A transmission line includes an insulator as a base member, a transmission conductor, and a ground layer. A connector is provided at a wiring substrate to fix the transmission line. The transmission line includes a signal columnar conductor having a solid columnar shape integrated with the transmission conductor, and ground columnar conductors having solid columnar shapes integrated with the ground layer. The connector has a through hole corresponding to the signal columnar conductor, and through holes corresponding to the ground columnar conductors. Conductive films are respectively provided on the inner peripheral surfaces of the through holes. The signal columnar conductor is inserted into the through hole, and the ground columnar conductors are respectively inserted into the through holes.

Abstract: A method for manufacturing a stretchable electronic device, which includes manufacturing and connecting a stretchable board and a stretchable conductive connecting body constituting the stretchable electronic device; and attaching one or more electric parts to the stretchable conductive connecting body. The stretchable board has a surface for mounting one or more electric parts. The stretchable conductive connecting body is provided on the stretchable board, extended in a three-dimensional stereoscopic structure in a direction away from the surface, and has stretchability. The stretchable conductive connecting body includes a conductive connecting part for attaching an upper surface of the stretchable conductive connecting body to the electric part so as to be electrically connected to an electrode of the electric part.

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

Abstract: A light emitting device includes a first substrate including a flexible first base member and a first wiring pattern provided on the first base member; a second substrate including a second base member and a second wiring pattern provided on the second base member; and a plurality of light emitting elements mounted on the first wiring pattern. The first substrate includes: a joining end portion that is located at a first, joining end of the first substrate, and that overlaps a portion of the second substrate, and a second end, other than the joining end, that does not overlap the second substrate. The first wiring pattern and the second wiring pattern do not face each other. An electrically conductive joining member is disposed across the first wiring pattern and the second wiring pattern, while partially covering the joining end portion of the first substrate.

Abstract: Provided herein are embodiments of a PWB circuit construction material, and its use in flexible PWB circuits. The PWB circuit construction material is made up of temperature resistant fabric bonded to a metal substrate using a bonding agent. The temperature resistant material may include synthetic aromatic polyamide fibers. The fabric may be used as a reinforcement for the standard PWB construction materials for flexible PWB circuits and as a standalone piece that is bonded as a hinge at rigid portions of a rigid or rigid-flexible PWB circuit to reduce the thermal effects.

Abstract: A display device includes a display panel, a functional unit, a first flexible substrate, a display driving component, and a second flexible substrate. The display panel includes a first substrate and a second substrate. The second substrate includes a portion overlapping the first substrate and a non-overlapping portion not overlapping the first substrate. The first flexible substrate is connected to the non-overlapping portion. The first flexible substrate includes an insulator base with flexibility and an insulating coating portion disposed between the display driving component and the second flexible substrate. The display driving component is mounted on the non-overlapping portion to process a signal from the first flexible substrate and to supply the processed signal to the display panel. The second flexible substrate is connected to the first substrate to transmit a signal for driving the functional unit. The second flexible substrate is disposed to overlap the non-overlapping portion.

Abstract: A display device includes a first circuit substrate and an overlapping second circuit. At least one connection pin is disposed in an opening in a base substrate which is disposed between the first circuit substrate and the second circuit substrate and the at least one connection pin is configured to connect the first circuit substrate to the second circuit substrate through the opening in the base substrate.

Abstract: A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 ?m or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10?6/% RH or less.

Abstract: Embodiments of the present disclosure relate to a display substrate, a display panel, a display device, and a fabrication method of the display substrate. The display substrate includes a flexible substrate having a plurality of pixel regions, and at least one groove positioned in the flexible substrate and surrounding each of the pixel regions. At least a portion of the at least one groove is curved.

Abstract: Apparatus and methods are provided for flexible and stretchable circuits. In an example, a method can include forming a first flexible conductor on a substrate, the first flexible conductor including a first conductive trace surrounded on three sides by a first dielectric, and forming a second flexible conductor on top of the first flexible conductor, the first flexible conductor located between the second flexible conductor and the substrate, the second flexible conductor including a second conductive trace surrounded by a second dielectric.

Abstract: A method of manufacturing a wiring board according to one embodiment of the present disclosure includes: providing at least one first conductive member that serves as part of a wiring; covering the at least one first conductive member with an insulating member that has at least one opening; disposing at least one second conductive member on the opening of the insulating member, the second conductive member serving as part of the wiring; electrically joining the at least one first conductive member and the at least one second conductive member to each other at the opening; and cutting a region including the at least one first conductive member, the insulating member, and the at least one second conductive member, to form an element mounting surface.

Abstract: An electronic device includes a circuit board, and first and second elements. The first element includes a first connection portion including a recess portion, and first connection portion side electrodes exposed to the first connection portion. The second element includes a second connection portion and second connection portion side electrodes exposed to the second connection portion. The circuit board includes first and second board side electrodes respectively disposed at positions opposed to each other in plan view. The first connection portion side electrode and the second connection portion side electrode are joined to the first board side electrode and the second connection portion side electrode connected to each other. The first connection portion side electrode and the first board side electrode are disposed along the recess portion in plan view of the circuit board.

Abstract: A flexible hybrid electronic (FHE) system includes a carrier, a first redistribution structure on the carrier, a first device on the first redistribution structure, and an encapsulation layer encapsulating the first device. The carrier has a first Young's modulus Y1. The first redistribution structure has a second Young's modulus Y2. The first device and a portion of the encapsulation layer form a top surface of the first redistribution structure to a top surface of the first device is a first portion having a third Young's modulus Y3. The other portion of the encapsulation layer from the top surface of the first device to a top surface of the encapsulation layer is a second portion having a fourth Young's modulus Y4. A ratio of Y3/Y4 is between 1.62 and 1.98; a ratio of Y3/Y2 is between 0.18 and 0.22; and a ratio of Y3/Y1 is between 280.62 and 342.98.

Abstract: A resin multilayer substrate includes a substrate main body including first, second, and third wiring portions connected to one another by a connecting portion. First, second and third external connection terminals are respectively included in the first, second and third wiring portions. The first external connection terminal includes a conductor exposed at a surface of the substrate main body. The second and third external connection terminals include connectors mounted on conductors on the surface of the substrate main body. An auxiliary mounting conductor is disposed between the first external connection terminal and the second and third external connection terminals on the surface of the substrate main body.

Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

Abstract: A display panel is provided, including: a display area, where an edge of the display area is formed with a notch; a hole formed in an area surrounded by an outline of the notch; a non-display area disposed between the display area and the hole; and a first trace and a second trace disposed on the non-display area, where the second trace is adjacent to and electrically isolated from the first trace. The first trace and the second trace extend from one side of the non-display area to an opposite side, and include serpentine bending sections around the hole. The first trace and the second trace are located on different layers.

Abstract: Embodiments include a junction box for an electric vehicle. The junction box includes a charging port to receive power from an external power source, and a plurality of switching elements to control electrical connections between the charging port, a first battery, and a second battery. On/off states of the plurality of switching elements control whether the charging port, the first battery and the second battery are connected in a first configuration or a second configuration.

Abstract: In accordance with at least one aspect of this disclosure, an ultraviolet radiation (UV) sensor includes a UV sensitive material and a first electrode and a second electrode connected in series through the UV sensitive material such that UV radiation can reach the UV sensitive material. The UV sensitive material can include at least one of zinc tin oxide, magnesium oxide, magnesium zinc oxide, or zinc oxide. The electrodes can be interdigitated comb electrodes.

Abstract: Disclosed is a stretchable electronic device, including: a stretchable board having a surface for mounting one or more electric parts; and a stretchable conductive connecting body provided on the stretchable board, extended in a three-dimensional stereoscopic structure in the direction away from the surface, and having stretchability. The stretchable conductive connecting body comprises a conductive connecting part for attaching the upper surface of the stretchable conductive connecting body to the electric part so as to be electrically connected to an electrode of the electric part.

Abstract: An electronic device includes a foldable touch screen having first and second portions and a bendable intermediate portion connecting the first portion to the second portion. The foldable touch screen has a capacitive touch matrix therein. A touch screen controller acquires touch data from the capacitive touch matrix, calculates strength values of nodes of the capacitive touch matrix based upon the acquired touch data, calculates a first value, the first value being an average strength of nodes of the capacitive touch matrix located in the first portion of the foldable touch screen, calculates a second value, the second value being an average strength of nodes of the capacitive touch matrix located in the second portion of the foldable touch screen, and determines that the foldable touch screen is in a closed position based upon the first value and the second value both being greater than a first given strength value.

Abstract: A flexible printed circuit board (PCB) includes a flexible first layer proximate to a flexible second layer. Conductive traces are arranged in the flexible first layer and coupled to a first circuit block at a first end of the flexible PCB and coupled to a second circuit block at a second end of the flexible PCB such that the first circuit block is coupled to the second circuit block through the conductive traces. Companion traces re arranged in the flexible second layer to provide a reference plane coupled to the first and second circuit blocks. The companion traces are arranged in the flexible second layer to be replicas of the conductive traces such that each one of the conductive traces is proximate to and aligned with a corresponding one of the companion traces along an entire length between the first and second circuit blocks.

Abstract: The present disclosure relates to a touch substrate and a method of producing the same, and a touch panel and a method of producing the same, and a display device. In an embodiment, a method of producing a touch substrate comprises steps of: forming a flexible film sheet with a metal wiring pattern, the metal wiring pattern comprising metal wirings and metal bonding electrodes connected to the metal wirings respectively; forming a glass substrate on which a touch electrode structure and touch bonding electrodes in an electrical connection with the touch electrode structure are formed, both a sheet resistance of the touch electrode structure and a sheet resistance of the touch bonding electrodes ranging from 12 ?/? to 70 ?/?; and aligning and bonding the flexible film sheet with the glass substrate.

Abstract: An interconnection system includes a first support surface positionable against a respective first surface of a first printed circuit board (PCB) and a second support surface positionable against a respective first surface of a second PCB. The first PCB has a respective second surface spaced apart from the respective first surface by a first thickness. The second PCB has a respective second surface spaced apart from the respective first surface by a second thickness. A separator extends from the first support surface and from the second support surface. A contact pin extends through the separator. A portion of the contact pin extending in first direction from the separator is spaced apart from the first support surface by a distance corresponding to the first thickness. A portion of the contact pin extending in a second direction from the separator is spaced apart from the second support surface by the second thickness.