Convertible Shape (e.g., Flexible) Or Circuit (e.g., Breadboard) Patents (Class 174/254)
  • Patent number: 11326030
    Abstract: Disclosed herein are a polyamide-imide film which is transparent and exhibits superior mechanical properties such as surface hardness, etc. and a method of preparing the same. The polyamide-imide film a copolymer of an aromatic diamine, an aromatic dianhydride, and an aromatic dicarbonyl compound, wherein the aromatic diamine and the aromatic dianhydride forms an imide unit; the aromatic diamine and the aromatic dicarbonyl compound forms an amide unit; and the amide unit accounts for 50-70 mol % of 100 mol % of the units of the copolymer, thereby exhibiting transparency and superior mechanical properties including surface hardness.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: May 10, 2022
    Assignee: SKC CO., LTD.
    Inventors: Jin Woo Lee, Dong Jin Lim, Jae In Ahn, Jong Ho Lee, Sang Il Kim, Sun Hwan Kim, Dae Sung Oh, Dawoo Jeong
  • Patent number: 11329007
    Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: May 10, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen Hung Huang, Yan Wen Chung, Huei-Shyong Cho
  • Patent number: 11330699
    Abstract: Embodiments described herein are directed to methods and apparatus for power distribution. The apparatus can include a power distribution network for a plurality of integrated circuits (IC). According to embodiments, the power distribution network includes a plurality of overlapping power/ground (PG) plane segments and one or more non-overlapping PG (no-PG) plane segments. Each overlapping-PG plane segment is separated from another overlapping-PG plane segment by at least one no-PG plane segment. The no-PG plane segments can include at least one of a multilayered power (P) plane segment with no ground reference of any PG plane and a multilayered ground (G) plane segment with no power reference of any PG plane.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: May 10, 2022
    Assignees: San Diego State University Research Foundation, Kyocera International, Inc., Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Arif Ege Engin, Gerardo Aguirre, Klaus-Dieter Lang, Ivan Ndip
  • Patent number: 11326025
    Abstract: The present invention relates to a polyamideimide copolymer and a colorless and transparent polyamideimide copolymer film. The polyamideimide copolymer according to the present invention enables to provide a polyamideimide film having improved UV shielding function while exhibiting excellent scratch resistance and mechanical properties.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: May 10, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Bi Oh Ryu, Soon Yong Park, Young Ji Tae, Young Seok Park, Kwan Yeol Paek
  • Patent number: 11320952
    Abstract: A touch panel includes a substrate having an operation face, a sensor part provided at a sensor face of the substrate, and a wire led out from the sensor part to the sensor face to be connected to an external connection part. The sensor part and the wire are covered by an insulation layer. A cutout is provided to the insulation layer to expose a part of the wire to which the external connection part is connected. An insulation part is provided to cover the external connection part, the insulation layer and the wire located at the cutout. The touch panel can reliably prevent static electricity generated at the operation face during panel operation from entering the sensor part via the wire and the external connection part and causing electrostatic destruction of a bridge and such of the sensor part.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: May 3, 2022
    Assignee: Futaba Corporation
    Inventors: Takao Kato, Shigeharu Shirahama
  • Patent number: 11324126
    Abstract: A component carrier with a rigid portion, a flexible portion, a cavity defining the flexible portion next to the rigid portion, and at least one step in a transition portion between the rigid portion and the flexible portion in the cavity is disclosed.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: May 3, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Roland Bund
  • Patent number: 11315705
    Abstract: A cable includes an insulating part and one or more conducting parts disposed inside the insulating part. The insulating part includes a polymer resin layer with a product of shrinkage ratios CMD*TD, which is expressed as a product of a longitudinal shrinkage ratio and a transverse shrinkage ratio, of less than 0.24.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: April 26, 2022
    Assignee: SKC Co., Ltd
    Inventors: Sechul Lee, Young Min Heo, Jung Hee Ki, Sang Min Choi
  • Patent number: 11316286
    Abstract: The present disclosure provides an electrical connector comprising an electrical connector body, a conductive adhesive layer, and a connecting cable. The electrical connector body comprises a plurality of electrical connecting conductors. The conductive adhesive layer covers the plurality of electrical connecting conductors. The connecting cable comprises a plurality of cables. One end of each of the cables comprises a conductive pin. The conductive pin of each of the cables is disposed on the conductive adhesive layer. The conductive pin of each of the cables forms an electrical connection path with the corresponding electrical connecting conductor. The plurality of electrical connection paths is individually separated.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: April 26, 2022
    Assignee: DONGGUAN LUXSHARE PRECISION INDUSTRY CO. LTD.
    Inventors: Yun Feng, ZhiYong Li, ZhongYuan Lai
  • Patent number: 11309238
    Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate, the circuit area surrounds the chip mounting area. The chip is mounted on the chip mounting area of the top surface and includes a bump. The circuit layer is disposed on the top surface. A connection portion of the circuit layer extends across a first side of the chip mounting area and into the chip mounting area. A transmission portion of the circuit layer is located on the circuit area and electrically connected to the connection portion. A stress release portion of the circuit layer is located between the transmission portion and a second side of the chip mounting area and is a comb-shaped structure.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: April 19, 2022
    Assignee: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Yu-Chen Ma, Hsin-Hao Huang, Wen-Fu Chou, Gwo-Shyan Sheu
  • Patent number: 11310917
    Abstract: Provided is a method for manufacturing a substrate for flexible printed wiring board, comprising a laminated body forming step and an integration step, wherein in the laminated body forming step, on an upper surface and a lower surface of a fluororesin layer having a modified surface, a first and second reinforcing resin layers having a coefficient of thermal expansion smaller than that of the fluororesin layer are respectively stacked through a first thermosetting adhesive, on the first reinforcing resin layer and/or the second reinforcing resin layer, a conductor layer is stacked through a second thermosetting adhesive, to form a laminated body, and in the integration step, the laminated body is heated and integrated at a temperature not lower than a curing temperature of the first and second thermosetting adhesives and lower than a melting point of the fluororesin layer.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 19, 2022
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Toshihiro Higashira, Fuki Hatano
  • Patent number: 11307685
    Abstract: A display device includes: a display module including a display area and a non-display area; a protective layer on a lower surface of the display module and including an opening area overlapping with the display area; a sensor unit overlapping with the display area, covering the opening area, and arranged on the protective layer; and an adhesive member adhering the sensor unit and the protective layer.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: April 19, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kyungho Jung, Jin Hyun, Jaeho Lee
  • Patent number: 11291119
    Abstract: A semi-flex component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion, and a component embedded in the at least one rigid portion. The at least one electrically insulating layer structure of the stack has a mechanical buffer structure surrounding at least part of the component and has a lower value of the Young modulus than other electrically insulating material of the stack.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: March 29, 2022
    Assignee: AT&S (China) Co. Ltd.
    Inventors: Mikael Tuominen, Nick Xin, Seok Kim Tay
  • Patent number: 11277924
    Abstract: A method for manufacturing a multilayer printed wiring board includes: preparing a first wiring board that includes a circuit region formed with one or more signal lines on a main surface of a first insulating substrate; preparing a second wiring board that includes an electrically conductive layer on a main surface of a second insulating substrate; disposing a spacer at a position spaced apart from an outer edge of the circuit region by a predetermined distance along at least a part of the outer edge; disposing an adhesive layer on the circuit region so that a space is provided between the adhesive layer and the spacer; and laminating the first wiring board and the second wiring board for thermocompression bonding.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: March 15, 2022
    Assignee: FUJIKURA LTD.
    Inventor: Akimi Yamazaki
  • Patent number: 11272611
    Abstract: A flexible circuit board with improved bending reliability and a manufacturing method thereof are disclosed, the flexible circuit board comprising: a first dielectric formed to be elongated in a horizontal direction; a second dielectric positioned above the first dielectric; a third dielectric spaced apart from the second dielectric in the horizontal direction and positioned above the first dielectric; a first cover layer positioned on the first dielectric and covering an upper portion of the first dielectric between the second dielectric and the third dielectric; a first bonding sheet positioned between the first dielectric and the second dielectric and covering an upper portion of one end of the first cover layer; and a second bonding sheet positioned between the first dielectric and the third dielectric and covering an upper portion of the other end of the first cover layer.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: March 8, 2022
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Byung Yeol Kim, Ik Soo Kim, Hee Seok Jung
  • Patent number: 11271145
    Abstract: A light emitting device includes: a substrate including: a flexible base member, a first wiring pattern located on the upper surface of the base member, the first wiring pattern including: a first component-side conductive portion, and a second component-side conductive portion, and a plurality of reinforcing lands located on the upper surface of the base member, the plurality of reinforcing lands including: a first reinforcing land, and a second reinforcing land; and a plurality of light emitting elements mounted on the substrate, each light emitting element being electrically connected to the first component-side conductive portion and the second component-side conductive portion.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: March 8, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Yasuo Fujikawa, Takuya Wasa, Yosuke Nakayama
  • Patent number: 11259407
    Abstract: According to certain embodiments, an electronic device comprises a first electrical structure disposed in an internal space of the electronic device; and a flexible printed circuit board (FPCB) comprising a first fastening area and an extension area extended from the first fastening area, the first fastening area electrically connected to the first electrical structure, wherein the FPCB further comprises: a dielectric substrate comprising a first surface and a second surface facing in a direction opposite to that of the first surface and facing the first electrical structure; a first conductive layer disposed on the first surface of the dielectric substrate; and a first protective layer stacked on the first conductive layer, in the extension area and terminating in the first fastening area; wherein the first fastening area comprises a screw through hole for screw fastening, and at least one conductive via disposed at a periphery of the screw through hole extending from the dielectric substrate to the first co
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: February 22, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jongwan Shim, Bumhee Bae, Younho Kim
  • Patent number: 11259404
    Abstract: A printed circuit board includes a first rigid region and a flexible region, connected to the first rigid region and adjacent thereto in a first direction. The first rigid region has a thickness greater than a thickness of the flexible region, and the flexible region has a plurality of curved portions.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: February 22, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Oh Hwang, Jae Ho Shin, Yun Je Ji
  • Patent number: 11247059
    Abstract: A biostimulator, such as a leadless cardiac pacemaker, having a flexible circuit assembly, is described. The flexible circuit assembly is contained within an electronics compartment between a battery, a housing, and a header assembly of the biostimulator. The flexible circuit assembly includes a flexible substrate that folds into a stacked configuration in which an electrical connector and an electronic component of the flexible circuit assembly are enfolded by the flexible substrate. An aperture is located in a fold region of the flexible substrate to allow a feedthrough pin of the header assembly to pass through the folded structure into electrical contact with the electrical connector. The electronic component can be a processor to control delivery of a pacing impulse through the feedthrough pin to a pacing tip. Other embodiments are also described and claimed.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: February 15, 2022
    Assignee: PACESETTER, INC.
    Inventors: Wade Keller, Thomas B. Eby, Sean McKenna, Brett C. Villavicencio
  • Patent number: 11246216
    Abstract: The present disclosure relates to a printed circuit board including a first insulating layer; and a plurality of connection pads disposed on one surface of the first insulating layer, wherein the first insulating layer has a groove portion penetrating a portion of the first insulating layer in respective regions between the plurality of connection pads, and a display module including the same.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: February 8, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Myeong Hui Jung
  • Patent number: 11246219
    Abstract: A flexible printed circuit board including: a base film; an electrode pad disposed on one side of the base film; a circuit pattern connected with the electrode pad; a coverlay that overlaps at least a part of the circuit pattern; and a cover resin that overlaps the circuit pattern and at least a part of the coverlay. The coverlay includes a body portion and a protrusion protruded from the body portion.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: February 8, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: John Park, Seung-Woo Kang, Soon-Sung Park, Jun Ho Park, Yong Uk Song, Su Chang Ryu, Jung Soo Youn
  • Patent number: 11214709
    Abstract: A polyamideimide resin having isocyanate groups at the terminals, wherein at least a portion of the isocyanate groups are blocked with an ether group-containing cyclic amine.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: January 4, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yasuyuki Saito, Atsushi Takahashi, Yuta Harada
  • Patent number: 11206730
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: December 21, 2021
    Assignee: CelLink Corporation
    Inventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
  • Patent number: 11200020
    Abstract: An intelligent wearable device includes a housing (1) and a display unit (2) mounted on the housing (1). The display unit (2) includes a first display screen (21) and a second display screen (22). The first display screen (21) is a flexible display screen, and the first display screen (21) includes a first display area (211), a bendable area (212) and a second display area (213) which are sequentially connected, wherein the first display area (211) and the second display area (213) are foldably connected to each other by means of the bendable area (212), and a back face of the first display area (211) is connected to the housing (1). The second display screen (22) is an electronic ink screen, and a back face of the second display screen (22) is connected to a back face of the second display area (213) in a laminated manner.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: December 14, 2021
    Assignee: JRD COMMUNICATION (SHENZHEN) LTD
    Inventor: Lin Zhu
  • Patent number: 11197368
    Abstract: A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: December 7, 2021
    Assignees: Avary Holding (Shenzhen) Co., Limited, QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Fu-Yun Shen, Xian-Qin Hu
  • Patent number: 11196234
    Abstract: In various embodiments, laser apparatuses include thermal bonding layers between various components and creep-mitigation systems for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: December 7, 2021
    Assignee: TERADIODE, INC.
    Inventors: Parviz Tayebati, Bien Chann, Robin Huang, Michael Deutsch
  • Patent number: 11197371
    Abstract: Provided is an FPC, including a first row of gold fingers and a second row of gold fingers disposed on a same layer, and multiple first connection lines. The first row of gold fingers includes multiple first gold fingers extending in a first direction and arranged in a second direction. The second row of gold fingers includes multiple second gold fingers extending in the first direction and arranged in the second direction. The multiple first connection lines are disposed in a different layer from the second row of gold fingers, electrically connected to the multiple first gold fingers, and insulated from the multiple second gold fingers and extend to an area where the second row of gold fingers is located. The first connection line includes a first wire and a second wire. The first wire includes a first portion, a second portion and a third portion connected in sequence.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: December 7, 2021
    Assignee: Wuhan Tianma Micro-Electronics Co., Ltd.
    Inventor: Xiang Huang
  • Patent number: 11195638
    Abstract: A resin composition that includes a maleimide compound, an alkenyl-substituted nadimide, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: December 7, 2021
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Yoichi Takano, Meguru Ito, Eisuke Shiga
  • Patent number: 11191163
    Abstract: A flexible printed circuit board with improved ground efficiency is disclosed, and a flexible display module and an electronic device comprising the same is disclosed, wherein the flexible printed circuit board comprises a flexible circuit film having a circuit layer disposed on one surface of a base film, and a ground pad portion disposed on another surface of the base film; and a conductive cover member configured to cover the other surface of the base film and electrically connected with the ground pad portion, wherein the conductive cover member includes a cutting portion overlapped with the ground pad portion.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: November 30, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: TaeWoo Lee, HeeSeok Noh, Sungwook Park
  • Patent number: 11183467
    Abstract: A flexible circuit board, a display device and a method for mounting a flexible circuit board are disclosed. The flexible circuit board includes: a bendable portion, the flexible circuit board being bendable at the bendable portion to go into a bent state so as to be connected to a workpiece; and at least one opening in the bendable portion. In response to the bent state, a gap is formed between the bendable portion and the workpiece, and the at least one opening is in communication with the gap.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: November 23, 2021
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
    Inventors: Chunghao Cheng, Bo Zhang, Bin Zhao
  • Patent number: 11145583
    Abstract: Embodiments include packages substrates and a method of forming the package substrate. A package substrate includes a first dielectric comprising a first conductive layer, and a second dielectric comprising a second conductive layer and a third conductive layer. The second and third conductive layers are embedded in the second dielectric, where a top surface of the third conductive layer is above a top surface of the second conductive layer. The package substrate has a fourth conductive layer on the second dielectric. The first dielectric has a first dielectric thickness between the first and third conductive layers. The first dielectric also has a second dielectric thickness between the first and second conductive layers. The package substrate includes the second dielectric thickness that is greater than the first dielectric thickness. The second dielectric may have a z-height of a first bottom surface greater than a z-height of a second bottom surface.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: October 12, 2021
    Assignee: Intel Corporation
    Inventors: Digvijay Raorane, Yidnekachew Mekonnen
  • Patent number: 11141567
    Abstract: A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: October 12, 2021
    Assignee: Boston Scientific Scimed Inc.
    Inventors: Steven J. Meyer, James E. Blood, David A. Chizek, Matthew Hein, Daniel J. Foster
  • Patent number: 11140776
    Abstract: Manufacturing a rigid-flex circuit board includes providing an inner flexible circuit board and a first flexible metal clad laminate, laminating the first flexible metal clad laminate on a surface of the inner flexible circuit board through a first adhesive film, causing the first copper layer to form a third conductive circuit layer, partially covering the metal protective layer exposed by the third conductive circuit layer, removing the metal protective layer exposed by the third conductive circuit layer and the covered area, providing a second copper foil, laminating the second copper foil on a surface of the third conductive circuit layer through a second adhesive film, removing the metal protective layer at the opening area, and causing the second copper foil to form a fifth conductive circuit layer. The first flexible metal clad laminate includes a second base material layer, a metal protective layer, and a first copper layer.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: October 5, 2021
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Ning Hou, Wei-Xiang Li
  • Patent number: 11127585
    Abstract: An out-of-plane deformable semiconductor substrate includes a plurality of rigid portions having a first thickness and an out-of-plane deformable portion having a second thickness and connecting the plurality of rigid portions to each other. The second thickness is smaller than the first thickness. The out-of-plane deformable semiconductor substrate is monolithic.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: September 21, 2021
    Assignee: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Adrián César Cavazos Sepulveda, Muhammad Mustafa Hussain
  • Patent number: 11121515
    Abstract: A textile interconnection system for a textile substrate. The textile substrate may include at least one conductive fibre configured to transmit at least one of a power or data signal. The textile interconnection system includes a textile receptacle projecting from the textile substrate to define a cavity for receiving a controller device. The textile interconnection system includes a textile docking device received within the textile receptacle and coupled to the at least one conductive fibre of the textile substrate to electrically interconnect the received controller device and the textile substrate. The textile interconnection system includes a housing coupled to the textile docking device and received within the textile receptacle to mechanically interconnect the received controller device and the textile substrate.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: September 14, 2021
    Assignee: MYANT INC.
    Inventors: Tony Chahine, Michelle Zheng, Adrian Straka, Milad Alizadeh-Meghrazi
  • Patent number: 11116964
    Abstract: An electrode array system includes a unitary body forming a plurality of apertures, and a plurality of continuous conductive elements at least partially encapsulated within the unitary body. The continuous conductive elements include/form a plurality of contacts, a plurality of electrode sites configured to couple with neural tissue (e.g., a spinal nerve or peripheral nerve), and a plurality of interconnects extending between the plurality of contacts and the plurality of electrode sites. The plurality of electrode sites are aligned with the plurality of apertures, and the plurality of apertures expose the plurality of electrodes.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: September 14, 2021
    Assignee: Micro-Leads, Inc.
    Inventors: Bryan L. McLaughlin, Girish Chitnis, John Ogren
  • Patent number: 11114782
    Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: September 7, 2021
    Assignee: Unimicron Technology Corp.
    Inventors: Tzyy-Jang Tseng, Pei-Wei Wang, Ching-Ho Hsieh, Shao-Chien Lee, Kuo-Wei Li
  • Patent number: 11109478
    Abstract: According to one or more embodiments described herein, an electronic power steering system includes a motor, and a semi-flexible ridged printed circuit board (PCB) assembly that is coupled with the motor. The semi-flexible ridged PCB assembly includes a first portion, a second portion, and a bendable member that couples the first portion and the second portion. The first portion is bendable with respect to the second portion using the bendable member.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: August 31, 2021
    Assignee: Steering Solutions IP Holding Corporation
    Inventors: Daniel J. Klenk, Delynn Streng, Ryan D. Yaklin, John I. Chu, Neal R. Roller
  • Patent number: 11109479
    Abstract: A substrate that is stretchable and that at least has a wiring region; wiring at least positioned in the wiring region on a first surface side of the substrate, the wiring having a meandering shape section that includes peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The stretching control mechanism at least includes stretching control parts that are positioned in the wiring region of the substrate and that are aligned along the first direction.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: August 31, 2021
    Assignees: DAI NIPPON PRINTING CO., LTD., THE UNIVERSITY OF TOKYO
    Inventors: Naoko Okimoto, Kenichi Ogawa, Takao Someya
  • Patent number: 11098171
    Abstract: A transparent polyimide film manufacturing method includes following steps: producing a polyimide film having a tensile modulus of elasticity greater than 5.4 GPa ((N/m2)×109), a light transmittance greater than 85%, and a chromaticity b* less than 2; providing an ether-free dianhydride and a diamine to form an ether-free polyamic acid; reacting the ether-free polyamic acid with an aromatic cyclic dianhydride to form a copolymerized polyamic acid; and chemically cyclizing the copolymerized polyamic acid to form a transparent polyimide film.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: August 24, 2021
    Assignee: TAIMIDE TECH. INC.
    Inventors: Yi-Hsueh Ho, Yi-Ting Liu
  • Patent number: 11096273
    Abstract: Disclosed are a printed circuit board manufactured by filling a via hole formed in a flexible board and a via hole formed in a cured base substrate and then laminating the flexible board and the cured base substrate and a method of manufacturing same. The method includes preparing a flexible board including a flexible region and a rigid region, preparing a cured base substrate, and laminating the cured base substrate on the rigid region of the flexible board, in which during the laminating, via holes respectively formed in the flexible board and the cured base substrate are first filled with a conductive material and then the flexible board and the cured base substrate are laminated.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: August 17, 2021
    Assignee: AMOSENSE CO., LTD.
    Inventor: Sung-Baek Dan
  • Patent number: 11096276
    Abstract: The present application relates to a circuit board for use in electronic components. Specifically, the present application relates to a stretchable circuit board including a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material.
    Type: Grant
    Filed: September 3, 2018
    Date of Patent: August 17, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi Abe, Tomoaki Sawada, Tomohiro Fukao
  • Patent number: 11084062
    Abstract: An ultrasound transducer array is provided that comprises a plurality of CMUT (capacitive micromachined ultrasound transducer) cells (100), each CMUT cell comprising a substrate (300) carrying a first electrode (110) of a first electrode arrangement, the substrate being spatially separated from a flexible membrane including a second electrode (120) of a second electrode arrangement by a gap (130), at least one of the first electrode and the second electrode being electrically insulated from said gap by at least one dielectric layer (311, 313), wherein at least one of the first electrode arrangement and the second electrode arrangement is partitioned into a plurality of sections interconnected by respective fuse portions (112, 122). An ultrasound probe and an ultrasound system comprising such an ultrasound transducer array are also disclosed.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: August 10, 2021
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Hans-Peter Loebl, Alfons Wouter Groenland
  • Patent number: 11089683
    Abstract: An insulation film has a first surface and a second surface opposite to each other and has a first portion and a second portion extending in a direction opposite to each other from a central portion. The optical subassembly is connected to the flexible printed circuit board at the central portion with the stem opposed to the second surface. The flexible printed circuit board curves with the second surface at least the central portion facing outward. The printed circuit board intervenes between edges of the first portion and the second portion and is connected to the flexible printed circuit board. The first portion and the second portion of the flexible printed circuit board curves in a shape to avoid mutual contact and three-dimensionally intersect with each other, and the first portion and the second portion on the second surface are opposed to the printed circuit board.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: August 10, 2021
    Assignee: CIG PHOTONICS JAPAN LIMITED
    Inventors: Daisuke Noguchi, Hiroshi Yamamoto
  • Patent number: 11083084
    Abstract: A method for forming a stretchable platform according to one embodiment comprises: (a) a step of forming an adhesive layer on one surface of a rigid member; (b) a step of modifying one surface of a stretchable substrate and an adhesive layer surface to form an incomplete bond; and (c) a step of bonding so as to form a covalent bond between the one surface of a modified stretchable substrate and the adhesive layer surface.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: August 3, 2021
    Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Yongtaek Hong, Yunsik Joo, Jae-Young Yoon
  • Patent number: 11076482
    Abstract: A printed circuit board includes an internal insulating layer, an internal conductive pattern layer disposed on the internal insulating layer and including a line portion and a bonding pad portion, and an external insulating layer disposed on the internal conductive pattern layer and the internal insulating layer and having an accommodation groove extending therethrough to expose the bonding pad portion. The bonding pad portion includes a connection pattern extending from the line portion of the internal conductive pattern layer embedded in the external insulating layer, and exposed to the accommodation groove; a land pattern disposed closer to a center portion of the accommodation groove than the connection pattern; and a dam pattern connecting the connection pattern and the land pattern, in which a line width of the dam pattern is narrower than a line width of the land pattern.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: July 27, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Soo Kim, Ha Il Kim, Seok Jun Ahn, Soo Ah Lee
  • Patent number: 11075092
    Abstract: A multi-layer substrate includes a first base material layer made of an insulating material, a first interlayer connection conductor provided in the first base material layer, an insulating layer, a second base material layer made of an insulating material and facing the first base material layer across the insulating layer, and a second interlayer connection conductor provided in the second base material layer and joined with the first interlayer connection conductor. The insulating layer is made of an insulation sheet on which no conductor pattern is provided. The insulation sheet includes an opening around a joining surface between the first interlayer connection conductor and the second interlayer connection conductor. The first interlayer connection conductor and the second interlayer connection conductor are joined with each other through the opening.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: July 27, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kuniaki Yosui
  • Patent number: 11076481
    Abstract: A stretchable substrate according to an embodiment of the present invention comprises a first modulus region which has a first modulus, a second modulus region which is located in a plane direction with respect to the first modulus region and has a second modulus higher than the first modulus, and a third modulus region which is located between the first modulus region and the second modulus region and has an interface modulus which gradually changes between the first modulus and the second modulus, wherein the interface modulus of the third modulus region may be constant in the thickness direction thereof.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: July 27, 2021
    Assignee: Korea University Research and Business Foundation, Sejong Campus
    Inventors: Sang Il Kim, Mun Pyo Hong, Bo Sung Kim, Ho Won Yoon, Kyung Uk Ha, Yun O Im
  • Patent number: 11071197
    Abstract: An electronic package including modulated mesh planes can reduce crosstalk between adjacent signal wires. Modulated mesh planes above and below a wiring plane include sets of adjacent wires arranged parallel to signal wires within the wiring plane, and sets of adjacent wires arranged perpendicular to the signal wires. The wires in each of the mesh planes are electrically interconnected and insulated from the signal wires by a dielectric layer. The electronic package also includes a region of the mesh planes having the adjacent wires that are perpendicular to the signal wires separated by a first distance, and another region of the mesh planes having adjacent wires perpendicular to the signal wires separated by a distance greater than the first distance. A set of rectangular mesh areas of the mesh planes can be populated with supplemental wires and via interconnect structures which can further reduce crosstalk.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: July 20, 2021
    Assignee: International Business Machines Corporation
    Inventors: Jinwoo Choi, Daniel M. Dreps, Yanyan Zhang
  • Patent number: 11058321
    Abstract: A tracking system that includes a sensor and a current driver. The sensor includes a substrate and magnetic sensor components configured to sense one or more magnetic fields and provide signals corresponding to the one or more magnetic fields. The magnetic sensor components are on the substrate and the substrate includes one or more conductive paths connected to one or more of the magnetic sensor components and intersecting one or more footprints of the magnetic sensor components. The current driver is configured to provide a regulated current to the one or more conductive paths intersecting the one or more footprints of the magnetic sensor components.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: July 13, 2021
    Assignee: Boston Scientific Scimed Inc.
    Inventor: Matthew Hein
  • Patent number: 11064606
    Abstract: A multilayer substrate includes a stacked body including a plurality of insulating base material layers stacked on each other and a plurality of conductor patterns provided in contact with the plurality of insulating base material layers. The stacked body includes a first surface, and the plurality of conductor patterns include a plurality of mounting electrodes. The plurality of mounting electrodes include first openings. The first openings, in a plan view of a mounting surface, are provided over a mounting region and a non-mounting region of the mounting electrodes. The mounting region, when a mounted component is mounted, overlaps with the mounted component, and the non-mounting region does not overlap with the mounted component.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: July 13, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takako Sato