Abstract: A thermally expandable material includes microcapsules and a binder having a conducting property, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have an insulating state with the other capsule.

Abstract: The present invention provides a fabric having a multiple layered circuit thereon integrating with electronic devices. The fabric comprises: a base layer; a plurality of conductive circuit layers; at least one connecting layer having electrically-conductive via-hole(s) and electrically-insulated area covering the area without the via-hole(s) and electrically connecting two conductive circuit layers through the via-hole(s) but electrically insulating the rest of the two conductive circuit layers; one or more than one electrical devices mounted to the conductive circuit layer and connected to circuits on the conductive circuit layer through anisotropic conductive film (ACF); and a water-proof layer disposed on the conductive circuit layer which is the farthest away from the base layer and covering the electrical device(s).

Abstract: Provided is a graphene synthesis apparatus including a chamber; a heating unit provided in the chamber; a heat conversion unit provided closer to a central portion of the chamber than the heating unit; and a catalyst provided on the heat conversion unit, wherein the catalyst is formed of thin and long metal.

Abstract: A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.

Abstract: A display panel includes a display area, a border area, a touch layer, and a touch trace. The border area includes a first trace area on opposite sides of the display area, a second trace area on another side of the display area, and a trace reserved area disposed inside an intersection of the first trace area and the second trace area. The touch layer includes a first electrode chain and a second electrode chain that are mutually intersected and insulated. The touch trace connecting the first electrode chain is arranged in the first trace area and the trace reserved area, and the second trace area only arranges the touch trace connecting the second electrode chain.

Abstract: The invention relates to a method for transferring structures on a host substrate, the method comprising the following steps in sequence: a) supply a temporary substrate comprising two main faces, the temporary substrate being stretchable, the structures being assembled with their front face on the first face; b) stretch the temporary substrate along at least one direction so as to increase the space between the structures along at least one direction, c) a step for transferring the plurality of structures on a host face of a host substrate, The temporary substrate comprises a matrix made of a stretchable material, and a plurality of inserts on which the structures are assembled, the inserts comprising a material with a Young's Modulus higher than that of the stretchable material.

Abstract: A fuel cell includes a catalyst coated membrane with a proton exchange membrane, a cathode layer disposed on a first surface of the proton exchange membrane, and an anode layer disposed on an oppositely disposed second surface of the proton exchange membrane. At least one gas diffusion layer is bonded to at least one of the cathode and anode layers of the catalyst coated membrane. At least one bonding layer substantially surrounds at least one of the catalyst coated membrane and the at least one gas diffusion layer. The at least one bonding layer is bonded to a portion of the proton exchange membrane. At least one circuit is bonded to a portion of the gas diffusion layer and a portion of the at least one bonding layer.

Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, a conductive pattern that is stacked on at least one surface side of the base film and that includes a plurality of wiring portions arranged adjacent to one another, and an insulating layer that covers outer surfaces of the base film and the conductive pattern. The plurality of wiring portions have an average spacing of 1 ?m or more and 20 ?m or less and an average height of 30 ?m or more and 120 ?m or less. A filling area ratio of the insulating layer between the plurality of wiring portions adjacent to one another in sectional view is 95% or more.

Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, a lower encapsulant and an intermediate layer. The upper conductive structure includes at least one upper dielectric layer and at least one upper circuit layer in contact with the upper dielectric layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The lower encapsulant surrounds a lateral peripheral surface of the lower conductive structure. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure to bond the upper conductive structure and the lower conductive structure together. The upper conductive structure is electrically connected to the lower conductive structure.

Abstract: A transmission line includes an insulator as a base member, a transmission conductor, and a ground layer. A connector is provided at a wiring substrate to fix the transmission line. The transmission line includes a signal columnar conductor having a solid columnar shape integrated with the transmission conductor, and ground columnar conductors having solid columnar shapes integrated with the ground layer. The connector has a through hole corresponding to the signal columnar conductor, and through holes corresponding to the ground columnar conductors. Conductive films are respectively provided on the inner peripheral surfaces of the through holes. The signal columnar conductor is inserted into the through hole, and the ground columnar conductors are respectively inserted into the through holes.

Abstract: A method for manufacturing a stretchable electronic device, which includes manufacturing and connecting a stretchable board and a stretchable conductive connecting body constituting the stretchable electronic device; and attaching one or more electric parts to the stretchable conductive connecting body. The stretchable board has a surface for mounting one or more electric parts. The stretchable conductive connecting body is provided on the stretchable board, extended in a three-dimensional stereoscopic structure in a direction away from the surface, and has stretchability. The stretchable conductive connecting body includes a conductive connecting part for attaching an upper surface of the stretchable conductive connecting body to the electric part so as to be electrically connected to an electrode of the electric part.

Abstract: Provided herein are embodiments of a PWB circuit construction material, and its use in flexible PWB circuits. The PWB circuit construction material is made up of temperature resistant fabric bonded to a metal substrate using a bonding agent. The temperature resistant material may include synthetic aromatic polyamide fibers. The fabric may be used as a reinforcement for the standard PWB construction materials for flexible PWB circuits and as a standalone piece that is bonded as a hinge at rigid portions of a rigid or rigid-flexible PWB circuit to reduce the thermal effects.

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

Abstract: A light emitting device includes a first substrate including a flexible first base member and a first wiring pattern provided on the first base member; a second substrate including a second base member and a second wiring pattern provided on the second base member; and a plurality of light emitting elements mounted on the first wiring pattern. The first substrate includes: a joining end portion that is located at a first, joining end of the first substrate, and that overlaps a portion of the second substrate, and a second end, other than the joining end, that does not overlap the second substrate. The first wiring pattern and the second wiring pattern do not face each other. An electrically conductive joining member is disposed across the first wiring pattern and the second wiring pattern, while partially covering the joining end portion of the first substrate.

Abstract: A display device includes a display panel, a functional unit, a first flexible substrate, a display driving component, and a second flexible substrate. The display panel includes a first substrate and a second substrate. The second substrate includes a portion overlapping the first substrate and a non-overlapping portion not overlapping the first substrate. The first flexible substrate is connected to the non-overlapping portion. The first flexible substrate includes an insulator base with flexibility and an insulating coating portion disposed between the display driving component and the second flexible substrate. The display driving component is mounted on the non-overlapping portion to process a signal from the first flexible substrate and to supply the processed signal to the display panel. The second flexible substrate is connected to the first substrate to transmit a signal for driving the functional unit. The second flexible substrate is disposed to overlap the non-overlapping portion.

Abstract: A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 ?m or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10?6/% RH or less.

Abstract: A display device includes a first circuit substrate and an overlapping second circuit. At least one connection pin is disposed in an opening in a base substrate which is disposed between the first circuit substrate and the second circuit substrate and the at least one connection pin is configured to connect the first circuit substrate to the second circuit substrate through the opening in the base substrate.

Abstract: A method of manufacturing a wiring board according to one embodiment of the present disclosure includes: providing at least one first conductive member that serves as part of a wiring; covering the at least one first conductive member with an insulating member that has at least one opening; disposing at least one second conductive member on the opening of the insulating member, the second conductive member serving as part of the wiring; electrically joining the at least one first conductive member and the at least one second conductive member to each other at the opening; and cutting a region including the at least one first conductive member, the insulating member, and the at least one second conductive member, to form an element mounting surface.

Abstract: Embodiments of the present disclosure relate to a display substrate, a display panel, a display device, and a fabrication method of the display substrate. The display substrate includes a flexible substrate having a plurality of pixel regions, and at least one groove positioned in the flexible substrate and surrounding each of the pixel regions. At least a portion of the at least one groove is curved.

Abstract: Apparatus and methods are provided for flexible and stretchable circuits. In an example, a method can include forming a first flexible conductor on a substrate, the first flexible conductor including a first conductive trace surrounded on three sides by a first dielectric, and forming a second flexible conductor on top of the first flexible conductor, the first flexible conductor located between the second flexible conductor and the substrate, the second flexible conductor including a second conductive trace surrounded by a second dielectric.

Abstract: An electronic device includes a circuit board, and first and second elements. The first element includes a first connection portion including a recess portion, and first connection portion side electrodes exposed to the first connection portion. The second element includes a second connection portion and second connection portion side electrodes exposed to the second connection portion. The circuit board includes first and second board side electrodes respectively disposed at positions opposed to each other in plan view. The first connection portion side electrode and the second connection portion side electrode are joined to the first board side electrode and the second connection portion side electrode connected to each other. The first connection portion side electrode and the first board side electrode are disposed along the recess portion in plan view of the circuit board.

Abstract: A resin multilayer substrate includes a substrate main body including first, second, and third wiring portions connected to one another by a connecting portion. First, second and third external connection terminals are respectively included in the first, second and third wiring portions. The first external connection terminal includes a conductor exposed at a surface of the substrate main body. The second and third external connection terminals include connectors mounted on conductors on the surface of the substrate main body. An auxiliary mounting conductor is disposed between the first external connection terminal and the second and third external connection terminals on the surface of the substrate main body.

Abstract: A flexible hybrid electronic (FHE) system includes a carrier, a first redistribution structure on the carrier, a first device on the first redistribution structure, and an encapsulation layer encapsulating the first device. The carrier has a first Young's modulus Y1. The first redistribution structure has a second Young's modulus Y2. The first device and a portion of the encapsulation layer form a top surface of the first redistribution structure to a top surface of the first device is a first portion having a third Young's modulus Y3. The other portion of the encapsulation layer from the top surface of the first device to a top surface of the encapsulation layer is a second portion having a fourth Young's modulus Y4. A ratio of Y3/Y4 is between 1.62 and 1.98; a ratio of Y3/Y2 is between 0.18 and 0.22; and a ratio of Y3/Y1 is between 280.62 and 342.98.

Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

Abstract: Embodiments include a junction box for an electric vehicle. The junction box includes a charging port to receive power from an external power source, and a plurality of switching elements to control electrical connections between the charging port, a first battery, and a second battery. On/off states of the plurality of switching elements control whether the charging port, the first battery and the second battery are connected in a first configuration or a second configuration.

Abstract: A display panel is provided, including: a display area, where an edge of the display area is formed with a notch; a hole formed in an area surrounded by an outline of the notch; a non-display area disposed between the display area and the hole; and a first trace and a second trace disposed on the non-display area, where the second trace is adjacent to and electrically isolated from the first trace. The first trace and the second trace extend from one side of the non-display area to an opposite side, and include serpentine bending sections around the hole. The first trace and the second trace are located on different layers.

Abstract: Disclosed is a stretchable electronic device, including: a stretchable board having a surface for mounting one or more electric parts; and a stretchable conductive connecting body provided on the stretchable board, extended in a three-dimensional stereoscopic structure in the direction away from the surface, and having stretchability. The stretchable conductive connecting body comprises a conductive connecting part for attaching the upper surface of the stretchable conductive connecting body to the electric part so as to be electrically connected to an electrode of the electric part.

Abstract: In accordance with at least one aspect of this disclosure, an ultraviolet radiation (UV) sensor includes a UV sensitive material and a first electrode and a second electrode connected in series through the UV sensitive material such that UV radiation can reach the UV sensitive material. The UV sensitive material can include at least one of zinc tin oxide, magnesium oxide, magnesium zinc oxide, or zinc oxide. The electrodes can be interdigitated comb electrodes.

Abstract: The present disclosure relates to a touch substrate and a method of producing the same, and a touch panel and a method of producing the same, and a display device. In an embodiment, a method of producing a touch substrate comprises steps of: forming a flexible film sheet with a metal wiring pattern, the metal wiring pattern comprising metal wirings and metal bonding electrodes connected to the metal wirings respectively; forming a glass substrate on which a touch electrode structure and touch bonding electrodes in an electrical connection with the touch electrode structure are formed, both a sheet resistance of the touch electrode structure and a sheet resistance of the touch bonding electrodes ranging from 12 ?/? to 70 ?/?; and aligning and bonding the flexible film sheet with the glass substrate.

Abstract: A flexible printed circuit board (PCB) includes a flexible first layer proximate to a flexible second layer. Conductive traces are arranged in the flexible first layer and coupled to a first circuit block at a first end of the flexible PCB and coupled to a second circuit block at a second end of the flexible PCB such that the first circuit block is coupled to the second circuit block through the conductive traces. Companion traces re arranged in the flexible second layer to provide a reference plane coupled to the first and second circuit blocks. The companion traces are arranged in the flexible second layer to be replicas of the conductive traces such that each one of the conductive traces is proximate to and aligned with a corresponding one of the companion traces along an entire length between the first and second circuit blocks.

Abstract: An electronic device includes a foldable touch screen having first and second portions and a bendable intermediate portion connecting the first portion to the second portion. The foldable touch screen has a capacitive touch matrix therein. A touch screen controller acquires touch data from the capacitive touch matrix, calculates strength values of nodes of the capacitive touch matrix based upon the acquired touch data, calculates a first value, the first value being an average strength of nodes of the capacitive touch matrix located in the first portion of the foldable touch screen, calculates a second value, the second value being an average strength of nodes of the capacitive touch matrix located in the second portion of the foldable touch screen, and determines that the foldable touch screen is in a closed position based upon the first value and the second value both being greater than a first given strength value.

Abstract: The present invention provides a flexible printed circuit, wherein the flexible printed circuit includes a substrate, a plurality of first terminals on the substrate, a plurality of second terminals on the substrate and a plurality of traces on the substrate. The plurality of traces is arranged for electrically connecting the plurality of first terminals to the plurality of second terminals, wherein the plurality of traces include at least one specific trace, the specific trace electrically connects a specific first terminal of the first terminals to two specific second terminals of the second terminals, the specific trace divides into two sub-traces at an increasing point, and a distance between the increasing point and the two specific second terminals are less than 5 mm.

Abstract: An interconnection system includes a first support surface positionable against a respective first surface of a first printed circuit board (PCB) and a second support surface positionable against a respective first surface of a second PCB. The first PCB has a respective second surface spaced apart from the respective first surface by a first thickness. The second PCB has a respective second surface spaced apart from the respective first surface by a second thickness. A separator extends from the first support surface and from the second support surface. A contact pin extends through the separator. A portion of the contact pin extending in first direction from the separator is spaced apart from the first support surface by a distance corresponding to the first thickness. A portion of the contact pin extending in a second direction from the separator is spaced apart from the second support surface by the second thickness.

Abstract: A semiconductor package includes first through third memory chips. The first memory chip is arranged on a package substrate, the second memory chip is arranged on the first memory chip, and the third memory chip is arranged between the first memory chip and the second memory chip. Each of the first through third memory chips includes a memory cell array storing data, stress detectors, a stress index generator, and a control circuit. The stress detectors are formed and distributed in a substrate, and detect stacking stress in response to an external voltage to output a plurality of sensing currents. The stress index generator converts the plurality of sensing currents into stress index codes. The control circuit adjusts a value of a feature parameter associated with an operating voltage of a corresponding memory chip, based on at least a portion of the stress index codes.

Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

Abstract: Exemplary embodiments are directed to thermally driven actuator systems including a thermally driven element and one or more heating elements coupled to and in thermal contact with the thermally driven element. The thermally driven element can be capable of being selectively reconfigured in shape based on a thermal strain or temperature driven phase change. The one or more heating elements can be configured to selectively and independently apply heat to one or more of a plurality of different regions of the thermally driven element to selectively raise a temperature or temperatures of the selected region or regions of the thermally driven element to selectively reconfigure the shape of the thermally driven element.

Abstract: A display panel includes a base having a first surface and a second surface disposed oppositely; a flexible printed circuit board disposed on a first surface of the base and bent toward a second surface of the base; and a mechanical strengthening element disposed on a second surface of the base and at least positioned at regions of the second surface corresponding to two side edges of the flexible printed circuit board.

Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Abstract: A display device includes a display panel, a conductive layer disposed under the display panel, a first flexible printed circuit board including a first substrate portion having a side connected to the display panel, a bending portion extending from the first substrate portion, and a second substrate portion extending from the bending portion and disposed under the conductive layer. The second substrate portion includes a first sensing pattern. The display device further includes a coupling portion disposed between the second substrate portion and the conductive layer and coupling the second substrate portion and the conductive layer. The display device further includes a driver chip electrically connected to the first sensing pattern and configured to detect whether the coupling portion has been separated from either the second substrate portion or the conductive layer based on a capacitance that depends on a distance between the conductive layer and the first sensing pattern.

Abstract: An electrical device is provided. The electrical device includes a case, a first electrical part, a second electrical part, and a connecting portion. The case includes a first case and a second case coupled to the first case. The first electrical part is fixed to the first case. The second electrical part is fixed to the second case. The connecting portion is configured to connect a first conductor extending from the first electrical part and a second conductor extending from the second electrical part each other. Either one of the first case and the second case includes a through hole. The connecting portion is disposed so as to be entirely visible from the through hole as viewed from an outside of the case.

Abstract: An organic light emitting diode display includes a stretchable substrate, a plurality of pixel forming plates, first and second pixels, and a cut-out groove. The pixel forming plates are on the substrate and spaced apart from each other. The first and second pixels are on respective first and second pixel forming plates of the plurality of the pixel forming plates adjacent in a first direction. The first and second pixel forming plates are connected by a first bridge. The cut-out groove are in the first and second pixel forming plates and adjacent to an area connected to the first bridge.

Abstract: A conductor connection structure for a plurality of plate-like routing members includes the plurality of plate-like routing members, a plurality of terminal members, and a circuit board. Each of the plurality of plate-like routing members has a conductor exposed part in which a strip flat conductor is exposed, at a part of an insulating coating member coating an outer circumferential surface of the strip flat conductor. Each of the plurality of terminal members has a board connecting part connected to the conductor exposed part so as to be conducted to the strip flat conductor. The circuit board includes a plurality of circuit conductors, and terminal connecting parts on the plurality of circuit conductors are respectively electrically connected to the board connecting parts.

Abstract: A touch sensor of this disclosure includes: a printed circuit board having a connection terminal; a substrate portion having a mounting portion on which the printed circuit board is mounted; a conductive layer disposed on the mounting portion of the substrate portion; and an adhesive agent connecting the connection terminal and the conductive layer to each other. A plurality of linear projections arranged in a first direction and extending in a second direction intersecting with the first direction are disposed on a surface of the substrate portion at the mounting portion, and the conductive layer is disposed on a groove portion positioned between the linear projections disposed adjacently to each other out of the plurality of linear projections.

Abstract: A flexible display assembly, a manufacturing method thereof, and a display panel are provided. The flexible display assembly comprises a display layer, a first thin film layer, and a second thin film layer. The display layer comprises a non-bending region and a bending region. The first thin film layer comprises at least a first inorganic layer and organic layer formed sequentially in the bending region. The second thin film layer comprises and a second inorganic layer and organic layer formed sequentially in the non-bending region. A modulus difference between the first inorganic layer and the display layer is less than that between the second inorganic layer and the display layer, and/or a thickness of the first inorganic layer is less than that of the second inorganic layer; a thickness of the first thin film layer is equal to that of the second thin film layer.

Abstract: Semiconductor packages are provided. A semiconductor package includes a substrate including a first bonding region, a chip region, and a second bonding region. Moreover, the substrate includes first and second surfaces that are opposite to each other. The semiconductor package includes a pad group including a pad on the first surface in the chip region. The semiconductor package includes a semiconductor chip on the pad group. The semiconductor package includes a wire connecting the pad and the second bonding region. The wire includes a portion that extends along the second surface of the substrate. Related display devices are also provided.

Abstract: Methods, systems, and apparatus, for shielding a bending portion of a flexible display that can be incorporated in electronic devices. One of the apparatus includes a cover glass element; a driver integrated circuit (D-IC); a mandrel portion; a shaft portion; a panel, positioned between the cover glass element and the D-IC, and comprising an inner panel layer that wraps around at least a portion of the mandrel portion to form a bending portion of the panel, the panel attached on either side on the shaft portion; and a shielding layer positioned around the inner panel layer and configured to inhibit electromagnetic signals through the bending portion.

Abstract: A display device includes a display panel having a display area and a non-display area, the non-display area being disposed at a peripheral portion of the display area and having a bending area; an integrated circuit (IC) disposed in the non-display area to drive the display panel; a first layer formed between the display area and the IC and covering the bending area; and a first member covering the IC and the first layer and overlapping with the bending area.

Abstract: A mid-plane assembly includes a main circuit board portion including a plurality of electrical connectors configured to releasably engage a plurality of devices, a first circuit board portion, and a first electrical coupling assembly configured to electrically couple the first circuit board portion to the main circuit board portion and position the first circuit board portion essentially orthogonal to the main circuit board portion.

Abstract: Provided is a stretchable circuit board including: a stretchable base material having stretchability; a film base material overlapping with part of a one-surface-side surface of the stretchable base material and having lower stretchability than that of the stretchable base material; a stretchable wiring line formed on the one-surface-side surface of the stretchable base material; and an adhesive layer formed on one surface side or the other surface side of the stretchable base material. The adhesive layer is formed on both of an overlapping region where the stretchable base material overlaps with the film base material and a non-overlapping region where the stretchable base material does not overlap with the film base material.

Abstract: A connector, a display screen and a method for manufacturing the display screen are provided. The connector includes a substrate, and a conductor structure arranged on the substrate. One end of the conductor structure is connected to a data signal line on a display panel, and the other end of the conductor structure is connected to a driver integrated circuit IC arranged on a non-display side of the display panel. A target surface, away from the substrate, of the conductor structure is uneven. The connector reduces the probability of the conductor structure breaking under the stress of the substrate, thereby guaranteeing the good display effect of the display screen.